FusionServer X6000 V6 サーバーテクニカルホワイトペーパー

FusionServer X6000 V6 Server
Technical White Paper
Issue 06
Date 2023-03-31
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
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Notice
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xFusion Digital Technologies Co., Ltd.

Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. i

Technical White Paper About This Document
About This Document
Purpose
This document describes the FusionServer X6000 V6 servers in terms of
appearance, system architecture, and component hardware and software
compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not

avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if

not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not

avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not

avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.

NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. ii

Technical White Paper About This Document
Change History
Issue Date Description
06 2023-03-31 ● Updated 4 Physical Structure.

● Updated 10 Certifications.
05 2023-02-10 Updated:
● 1 Product Overview
● 3.3 Management System
● 4 Physical Structure
04 2022-11-03 Updated 8.1 Security.
03 2022-09-10 Updated:
● 6.2 Environmental Specifications
● 6.3 Physical Specifications
● A.3 Operating Temperature Limitations
02 2022-03-18 Updated 6.3 Physical Specifications.
01 2021-07-16 This issue is the first official release.
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. iii

Technical White Paper Contents
Contents
About This Document.........................................................................................................ii

1 Product Overview ........................................................................................................... 1
2 Features............................................................................................................................ 2
3 System Architecture........................................................................................................ 4
3.1 Heat Dissipation System..............................................................................................................................4
3.2 Power Supply System..................................................................................................................................5
3.3 Management System...................................................................................................................................9
4 Physical Structure......................................................................................................... 12
5 Hardware Description....................................................................................................13
5.1 Front Panel................................................................................................................................................ 13
5.1.1 Appearance.............................................................................................................................................13
5.1.2 Indicators and Buttons............................................................................................................................ 14
5.1.3 Ports........................................................................................................................................................17
5.2 Rear Panel.................................................................................................................................................18
5.3 Storage...................................................................................................................................................... 19
5.3.1 Drive Configurations............................................................................................................................... 19
5.3.2 Drive Indicators.......................................................................................................................................22
5.4 Fan Modules.............................................................................................................................................. 24
5.5 Middle Modules..........................................................................................................................................25
5.6 Server Node...............................................................................................................................................28
5.7 PSUs..........................................................................................................................................................29
6 Product Specifications.................................................................................................. 30
6.1 Technical Specifications.............................................................................................................................30
6.2 Environmental Specifications.....................................................................................................................31
6.3 Physical Specifications.............................................................................................................................. 34
7 Software and Hardware Compatibility......................................................................... 36

8 Safety Instructions.........................................................................................................37
8.1 Security......................................................................................................................................................37
8.2 Maintenance and Warranty........................................................................................................................40
9 System Management .................................................................................................... 41
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. iv

Technical White Paper Contents
9.1 iBMC.......................................................................................................................................................... 41
9.2 Server Management System..................................................................................................................... 42
10 Certifications................................................................................................................ 44
A Appendix........................................................................................................................ 47
A.1 Chassis Label............................................................................................................................................47
A.1.1 Chassis Head Label............................................................................................................................... 47
A.1.1.1 Nameplate........................................................................................................................................... 48
A.1.1.2 Certificate............................................................................................................................................ 48
A.1.1.3 Quick Access Tag................................................................................................................................50
A.1.2 Chassis Tail Label...................................................................................................................................51
A.2 Product SN................................................................................................................................................ 51
A.3 Operating Temperature Limitations........................................................................................................... 52
A.4 Nameplate................................................................................................................................................. 56
A.5 RAS Features............................................................................................................................................56
A.6 Sensor List.................................................................................................................................................56
B Glossary......................................................................................................................... 57
B.1 A-E.............................................................................................................................................................57
B.2 F-J............................................................................................................................................................. 58
B.3 K-O............................................................................................................................................................ 58
B.4 P-T.............................................................................................................................................................58
B.5 U-Z.............................................................................................................................................................59
C Acronyms and Abbreviations...................................................................................... 60

C.1 A-E............................................................................................................................................................ 60
C.2 F-J............................................................................................................................................................. 61
C.3 K-O............................................................................................................................................................62
C.4 P-T.............................................................................................................................................................63
C.5 U-Z............................................................................................................................................................ 65
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. v

Technical White Paper 1 Product Overview
1 Product Overview
The FusionServer X6000 V6 server (X6000 V6) is a next-generation 2 U high-density

server designed for ISPs, Internet, high-performance computing (HPC), cloud
computing, and data center applications. Built on an architecture optimized for
software-defined storage (SDS), big data, and software-defined infrastructure (SDI), it
is ideal for large-scale server deployment.
X6000 V6 servers feature flexible expansion, high density, reliability, energy

efficiency, and easy O&M.
● For Internet and data center applications, X6000 V6 servers provide customized
solutions that offer rapid deployment, easy maintenance, and low power
consumption.
● For HPC, cloud computing, and ISP applications, X6000 V6 servers provide a
hardware platform to meet requirements for high reliability and virtualization
performance.
The X6000 V6 supports only XH321 V6 air-cooled server nodes or XH321C V6

liquid-cooled server nodes. A chassis supports only PSUs of the same model and
hardware configuration.
NO TE
For details about the X6000 V6 nameplate information, see A.4 Nameplate.
Figure 1-1 X6000 V6 server with 24 x 2.5" drives (example)
Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 1

Technical White Paper 2 Features
2 Features
Ultra-High Density and Small Footprint

X6000 V6 servers provide higher density than conventional rack servers, reducing
the footprint in equipment rooms.
● The X6000 V6 server provides computing density twice that of a conventional 1
U rack server and four times that of a conventional 2 U rack server in the same
cabinet space, which greatly improves space utilization in equipment rooms.
● The X6000 V6 server is 2 U high and supports a maximum of four server nodes
in two configurations:
– 8 x 2.5" front SAS/SATA drives: Each server node supports 2 x 2.5" SAS/
SATA drives. The ventilation rate is optimized to meet heat dissipation
requirements of higher specifications.
– 24 x 2.5" front SAS/SATA/NVMe drives: Each server node supports 6 x 2.5"
SAS/SATA/NVMe drives in any mixed configuration ratio.
Unified Management and Easy Maintenance

X6000 V6 servers use high-density system architecture, and support maintenance in
the cold air area.
● Server node management network port supports aggregated management, so
that iBMCs of each server node can work collaboratively to manage fans, PSUs,
and other system assets, combining the benefits of blade and rack servers. You
can have out-of-band management for the entire system by connecting to the
management network port on any server node.
NO TE
If only one management network cable is connected to a node, restarting the node will
interrupt the management network of the server. The management network will be
restored after the iBMC of the node is restarted. If two or more management network
cables are connected to any two nodes, this problem can be avoided.
● Server nodes are installed in the rear area and cables are connected to the rear
panel, facilitating maintenance.
● X6000 V6 servers adopt the modular design. Drives, fan modules, server nodes,
PSUs, and OCP 3.0 network adapters are hot-swappable, greatly improving
O&M efficiency.

Technical White Paper 2 Features
Shared Architecture and High Energy Efficiency

All server nodes share the system power supply and heat dissipation, improving the
power conversion efficiency and reducing energy consumption of heat dissipation.
This maximizes the energy efficiency.
● Server nodes share four PSUs in 1+1 or 2+2 redundancy mode based on power
consumption, improving power supply capability.
● Server nodes share four counter-rotating fan modules with high wind pressure,
which simplifies deployment, improves fan utilization, and enhances the heat
dissipation capability of the entire system.
● X6000 V6 servers use Dynamic Energy Management Technology (DEMT) to
minimize system energy consumption.
● X6000 V6 servers do not have drive backplanes or system backplanes. This
allows ideal system ventilation for processors with the highest specifications.
Redundancy and Reliability

X6000 V6 servers use reliable system architecture that ensures stable and long-term
service running.
● Supports four PSUs in 1+1 or 2+2 redundancy based on different power
consumption configurations.
Supports four fan modules in N+1 redundancy mode to improve system
reliability.
● Provides RAID controller cards and supercapacitors for power-off protection,
ensuring zero service interruption and data loss.
● Carrier-class components and manufacturing processes provide higher stability
and longer lifecycle.

Technical White Paper 3 System Architecture
3 System Architecture
3.1 Heat Dissipation System

3.2 Power Supply System
3.3 Management System
3.1 Heat Dissipation System

● Air is drawn from the front panel and exhausts from the rear panel. Cool air
enters the front panel and passes through the drives, fan modules, middle
modules, four server nodes, processors, and DIMMs, and then exits from the
rear panel. Air vents are provided on the top, bottom, and side of the server to
help heat dissipation.
Figure 3-1 Top view of the X6000 V6 air flow

Figure 3-2 Side view of the X6000 V6 air flow
NO TICE
● Ensure that heat is dissipated from the cabinet in time. Heat accumulation
and air reflow affect the heat dissipation of the server.
● To prevent device damage due to insufficient heat dissipation, do not block air
vents.
● The server uses four 8080/8080+ counter-rotating fans with high wind pressure
to improve the heat dissipation capability of X6000 V6 servers, achieving the
maximum configuration, power consumption density, and temperature
specifications in the industry.
● System energy efficiency optimization: DTS 2.0 intelligently adjusts the fan
speed to save energy and achieve optimal energy efficiency.
● With speed adjustment, shock absorption, and noise isolation design, X6000 V6
servers can minimize noise while dissipating heat efficiently.
● Optimized heat dissipation design:
– Counter-rotating fans with high wind pressure: 20% higher capability of
8080+ fans compared with the last-generation 8080 fans.
– The refined ventilation channel design concentrates the heat dissipation on
heat-sensitive components, improving the heat dissipation efficiency.
– Reasonable layout of temperature sensors, full coverage of hot spots, and
precise speed adjustment.
– The cellular board increases the porosity by 10% compared with the square
hole design.
– The fan modules use the proportional–integral–derivative (PID) algorithm to
ensure that the system can run stably at 35°C (95°F) for a long time.
3.2 Power Supply System

The X6000 V6 server supports two or four hot-swappable PSUs. Based on the
relationship between the rated power of the PSUs and that of the server, there are
different redundancy modes to ensure that the system performance is not affected

and the system does not break down when a power supply or PSU fault occurs. For
details, see Table 3-1.
You can use the Power Calculator to estimate the configured load power to
determine whether the PSUs meet service requirements and the required PSU
working mode.
Table 3-1 PSU and power supply redundancy

Number of PSU Rated Power PSU Power Supply
PSUs and Server Rated Redundancy Redundancy
Power
2 Server < Single PSU 1+1 1+1
Single PSU ≤ Server MSPP is used to enable redundancy.
4 Server < 2 PSUs 2+2 1+1
2 PSUs ≤ Server < 3 3+1 MSPP is used to

PSUs enable redundancy.
3 PSUs ≤ Server MSPP is used to enable redundancy.
● MSPP is a multi-node power capping function. If the power supply or a PSU

fails, MSPP is triggered (see Table 3-2) to lower the power consumption upper
limit of the server, ensuring that the system's power does not exceed the total
rated power of the remaining normal PSUs. In this case, the upper limit of the
system performance is affected.
● "+N" redundancy of PSUs indicates that the server performance is not affected
when N PSUs fail.
● "+N" redundancy of power supply indicates that the server performance is not
affected when N power supplies fail.
● In typical configuration, the power of an X6000 V6 PSU is 2000 W. The total
rated server power is rarely greater than the total rated power of three PSUs.
Power Capping Mode

The X6000 V6 server supports the following power capping modes:
● MSPP
The system automatically enables or disables MSPP based on the relationship
between the rated power of the server and that of PSUs as described in Table
3-2.
If MSPP is enabled, when a system power supply or PSU fault occurs, MSPP is
triggered (see Table 3-2). After MSPP is triggered, the system sets the power
consumption upper limit for the server node based on the total rated power of
the remaining normal PSUs to ensure that the power of the entire system does
not exceed the total rated power. In this case, the upper limit of the system
performance is affected.

NO TE
● After MSPP is enabled, the server performance will deteriorate. The performance
deteriorates more as the gap between the server rated power and the capped power
becomes larger.
● MSPP cannot eliminate server breakdowns in some extreme scenarios:
● Improper maintenance operations, such as removing a PSU without removing
the cable first, will cause system power failure because MSPP cannot be
triggered before other PSUs are overloaded. To prevent this problem, remove
the cable before removing a PSU.
● If a PSU short circuit fault occurs, the power supply cannot remain for 10 ms for
MSPP to be triggered and a system breakdown will occur. According to historical
statistics, the failure rate of PSU short circuits is less than 0.0002%.
● User-defined power capping mode
This mode enables you to set a power capping value for the server or a server
node to adjust the power distribution of the cabinet or equipment room. User
configuration modes are classified into the following types:
– User-defined server power capping:
You can enable the power capping function for a server using the iBMC CLI
and set the power capping value as required. After the configuration is
successful, the power of the server does not exceed the configured power.
– User-defined server node power capping:
You can enable the power capping function for a server node on the iBMC
WebUI and set the power capping value as required. After the configuration
is successful, the power of the server node does not exceed the configured
power.
NO TE
● MSPP and user-defined power capping cannot be enabled together.

● Before using the MSPP or user-defined power capping mode, enable EIST on the BIOS.
For details, see the FusionServer X6000 Server iBMC User Guide.
● For details about how to configure the power capping mode, see the FusionServer X6000
Server iBMC User Guide.
When different number of PSUs are configured, the system automatically enables the
MSPP or user-defined power capping mode based on the rated power of the server
and that of the PSUs. For details, see Table 3-2.
Table 3-2 Status of the MSPP or user-defined power capping mode
Number of PSU Rated Power Power Capping Mode Status (Set by

PSUs and Server Rated the System)
Power
2 Server < Single PSU ● MSPP disabled

● User-defined power capping disabled
Single PSU ≤ Server ● MSPP enabled (triggered by a single

PSU failure)

Number of PSU Rated Power Power Capping Mode Status (Set by

PSUs and Server Rated the System)
Power
4 Server < 2 PSUs ● MSPP disabled

2 PSUs ≤ Server < 3 ● MSPP enabled (triggered by failure

PSUs of two PSUs)
3 PSUs ≤ Server ● MSPP enabled (triggered by a single

PSU failure)
NO TE
After modifying the configuration or adding optional components, you need to recalculate the
total power of the server to check whether the current PSUs meet the requirements of the new
system.
PSU Working Mode

The X6000 V6 server supports the following PSU working modes:
● Active/Standby mode:
– 1+1 active/standby mode: This mode is supported when the X6000 V6
server is configured with two PSUs and the real-time power of the server is
less than the rated power of a single PSU. In this mode, the active PSU
bears the system load, and the standby PSU works in the hot standby state.
– 2+2 active/standby mode: This mode is supported when the X6000 V6
server is configured with four PSUs and the real-time power of the server is
less than the total rated power of two PSUs. In this mode, two active PSUs
bear the system load, and the two standby PSUs work in hot standby state.
NO TE
After a PSU enters the hot standby state, the output current decreases and the power
indicator is steady green, which is the same as the normal state. You can query the PSU
status by running the ipmcget -d psuinfo command on the iBMC CLI. For details, see
the FusionServer X6000 Server iBMC User Guide.
In active/standby mode:
– If the real-time power of the server exceeds the total rated power of active
PSUs, the standby PSUs are woken up and the system enters the load
balancing mode.
– If any PSU is removed or the input is lost, the standby PSU is woken up and
enters the normal output state to ensure that the entire system is not
powered off.
● Load balancing mode: In this mode, each PSU evenly bears the system load,
and their output power is similar.

PSUs work in load balancing mode by default. To set the PSUs to work in active/
standby mode, log in to the iBMC WebUI, choose System > Power > Power Supply
Info > Power Supply Settings to set the Work Mode to Active/Standby. Table 3-3
describes PSU working modes based on the relationship between the real-time
power of the server and that of PSUs when different number of PSUs are configured.
Table 3-3 Active/Standby and load balancing modes
Number MSP Total PSU Rated PSU Working Mode

of PSUs P Power and Real-
Statu Time Server
s Note Power
2 Trigg - Load balancing mode

ered
Not Server < Single By default, the load balancing mode is

trigge PSU used. You can change it to 1+1 active/
red standby mode. When the real-time
power of the server exceeds the rated
power of a single PSU, the system
automatically switches to the load
balancing mode.
Single PSU ≤ Load balancing mode

Server
4 Trigg - Load balancing mode

ered
Not Server < 2 PSUs By default, the load balancing mode is

trigge used. You can change it to 2+2 active/
red standby mode. When the real-time
power of the server exceeds the total
rated power of two PSUs, the system
automatically switches to the load
balancing mode.
2 PSUs ≤ Server < Load balancing mode

3 PSUs
3 PSUs ≤ Server Load balancing mode
Note: For details about the MSPP triggering conditions, see Table 3-2.
3.3 Management System

The X6000 V6 server management system uses the iBMC collaborative
management architecture. Customers can manage server nodes and the chassis
through the management network port of any server node.
● Each server node iBMC manages the server node through the IPMI, KVM, or
virtual CD-ROM drive.

● The iBMCs of server nodes collaboratively manage the chassis, including the fan
modules, power supplies, and chassis assets.
NO TE
● To avoid the switch loop problem, when the multi-node management system is running
through cables, only the node with the smallest slot number functions as the master node
for server node and chassis access management, and other node connections cannot be
used for management as backup connections.
● If the management system of the active node stops running or the connection fails, the
system automatically selects the new node with the smallest slot number from the nodes
that have been connected as the active node for the access management of server nodes
and the chassis.
Figure 3-3 X6000 V6 monitoring and management design
Server Node
The iBMC of each X6000 V6 server node provides an independent IP address for
external access. You can access the iBMC of any server node to manage an X6000
V6 server.
You can access the iBMC of a server node in the following ways:
● Access the iBMC through the management network port of a server node. (You
can access iBMCs of the four server nodes through the management network
port of any server node.)
● Access the iBMC of a server node through the direct connection management
port.

● Access the iBMC in NC-SI mode through the service network port of the NIC that
supports NC-SI.
The out-of-band management network cables are connected to a server node
(the default configuration on the BIOS menu). For details, see Figure 3-4.
Figure 3-4 Point-to-point cabling
NO TE
In NC-SI mode, the management network cable can be used as a service network cable
and connected to a service network port.
Fan Module
The server node iBMCs and fan management board work together to monitor and
manage fan modules.
● The server node iBMC determines a proper speed based on speed adjustment
algorithms and delivers the speed to the fan management board in the middle
module to control the fan speed. The fan management board detects the
operating status of the fan modules through the rotation speed feedback signals,
and reports to server node iBMCs for the fan module health management.
● The fan management board of the middle module provides four independent
pulse-width modulation (PWM) control signals for controlling the fan speed and
eight TACH signals for detecting the fan speed.
PSU
The server node iBMCs and fan management board work together to monitor and
manage PSUs.
● Each server node provides an I2C bus to manage all PSUs. The iBMC of each
server node supports input power queries, installation status detection, and PSU
alarm reporting.
● The iBMC of each server node and the CPLD of the fan management board in
the middle module provide the GPIO to detect the presence and PWROK of
PSUs.

Technical White Paper 4 Physical Structure
4 Physical Structure
Figure 4-1 Physical structure of an X6000 V6 server with 24 x 2.5" drives (example)
1 Server nodes 2 Chassis module (chassis +

middle module)
3 Fan module bracket 4 Fan modules
5 Right mounting ear plate 6 Drives
7 Left mounting ear plate - -

Technical White Paper 5 Hardware Description
5 Hardware Description
5.1 Front Panel

5.2 Rear Panel
5.3 Storage
5.4 Fan Modules
5.5 Middle Modules
5.6 Server Node
5.7 PSUs
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive configuration
Figure 5-1 Front panel of a server with 8 x 2.5" drives
1 Drives 2 Slide-out label plate (with

an SN label)

Figure 5-2 Front panel of a server with 24 x 2.5" drives
1 Drives 2 Slide-out label plate (with

an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions

Figure 5-3 Indicators and buttons on the front panel
1 Indicators of server node 1 2 Indicators of server node 2
3 Indicators of server node 3 4 Power button/indicators
5 Indicators of server node 4 6 Unit Identification Light (UID)

button
7 Server node switchover 8 Server node health indicator

button
9 Server node UID indicators 10 Server node indicators

Figure 5-4 Indicators and buttons on the front panel
1 Indicators of server node 1 2 Indicators of server node 2
3 Indicators of server node 3 4 Power button/indicators
5 Indicators of server node 4 6 Unit Identification Light (UID)

button
7 Server node switchover 8 Server node health indicator

button
9 Server node UID indicators 10 Server node indicators

Indicator and Button Description
Table 5-1 Description of indicators and buttons on the front panel

Silks Name Description
creen
Power button/ Indicates the power status of the selected server node.
Indicator For details, see the server node indicator descriptions.
● Off: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The power
button is locked and cannot be pressed. The iBMC is
started in about 1 minute, and then the power
indicator is steady yellow.
● Steady yellow: The device is standby.
Power button description:
● When the device is powered on, you can press this
button to gracefully shut down the OS.
NOTE
For different OSs, you may need to shut down the OS as
prompted.
● When the device is powered on, you can hold down
this button for 6 seconds to forcibly power off the
device.
● When the power indicator is steady yellow, you can
press this button to power on the device.
UID button The UID button is used to locate the server node to be
operated.
UID button:
● You can press the UID button or use the iBMC
remote control to turn on or off the UID indicator of a
server node.
● You can press the UID button to turn on or off the UID
indicator of a server node.
● You can press and hold down the UID button for 4 to
6 seconds to reset the iBMC of the server node.
Server node The UID indicator is used to locate the server node to be
UID indicator operated.
● Off: The device is not being located.
● Blinking or steady blue: The device is being located.

Silks Name Description

creen
Server node Press the server node switchover button to switch to the
switchover selected server node. When a server node is selected,
button its indicator is steady white.
NOTE
If the server is not fully configured with server nodes, the
system automatically skips vacant server node positions after
you press the node switchover button, and switches among
detected server nodes. If there are only three server nodes
(server node 1, server node 2, and server node 4), server node
3 is skipped automatically when a switchover is initiated.
Server node Indicates the health status of each server node.

health indicator ● Off: There is no power supply, or the server node is
faulty.
● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating properly.
Server node Indicates whether a server node is selected.

indicator ● Off: The server node is not selected.
● Steady white: The server node is selected.
NOTE
● Press the server node switchover button to switch to the
selected server node.
● When a server node is selected, connection to the server
node is switched to the power button/indicator and UID
button on the left mounting ear as well as the VGA and USB
ports on the right mounting ear.
5.1.3 Ports
Port Positions
Figure 5-5 Ports on the front panel

1 USB 2.0 port 2 VGA Port
Figure 5-6 Ports on the front panel
1 USB 2.0 port 2 VGA Port
Port Description
Table 5-2 Description of ports on the front panel

Name Type Quantity Description
USB ports USB 2.0 2 Used to connect to a USB 2.0

device.
NOTICE
● A connected external USB
device supports a maximum
current of 1.2 A.
● Before connecting an external
USB device, ensure that the
USB device functions properly;
otherwise, it may adversely
impact the server.
VGA ports DB15 1 Used to connect a display

terminal, such as a monitor or
KVM.
5.2 Rear Panel

● Air-cooled server node configuration
Figure 5-7 Rear panel of a server with four XH321 V6 server nodes

1 Air-cooled server node 1 2 Air-cooled server node 2
3 Air-cooled server node 3 4 Air-cooled server node 4
● Liquid-cooled server node configuration
Figure 5-8 Rear panel of a server with four XH321C V6 server nodes
1 Liquid-cooled server 2 Liquid-cooled server

node 1 node 2
3 Liquid-cooled server 4 Liquid-cooled server

node 3 node 4
5.3 Storage
5.3.1 Drive Configurations

Drive Configuration
Table 5-3 Drive Configuration

Configuration Front Drive Drive Management
Mode
8 x 2.5" drive ● Front drive: 8 x 2.5" ● PCH pass-through

configuration 1 – Slots 1-0 to 4-1
support only SATA
drives.
– Each node
supports a
maximum of two
drives.

Configuration Front Drive Drive Management

Mode
8 x 2.5" drive ● Front drive: 8 x 2.5" ● Screw-in RAID

configuration 2 – Slots 1-0 to 4-1 controller card
support SAS/SATA
drives.
– Each node
supports a
maximum of two
drives.
24 x 2.5" drive ● Front drive: 24 x 2.5" ● SATA drive: PCH

configuration 1 – Slots 1-0 to 4-5 ● NVMe drive: CPU
support SATA/
NVMe drives.
– Each node
supports a
maximum of six
drives.
24 x 2.5" drive ● Front drive: 24 x 2.5" ● SAS/SATA drive:

configuration 2 – Slots 1-0 to 4-5 screw-in RAID
support SAS/SATA/ controller card
NVMe drives. ● NVMe drive: CPU
– Each node
supports a
maximum of six
drives.
Contact your local sales representative or see "Search Parts" in the Compatibility
Checker to determine the components to be used.
Slot numbers
● Table 5-3 shows drive slot numbers of 8 x 2.5" drive configuration 1 and 8 x 2.5"
drive configuration 2
Figure 5-9 Slot numbers
Each server node manages two drives. Drives from left to right are managed by
server node 1, server node 2, server node 3, and server node 4 in sequence.

Table 5-4 Slot numbers
Server Node Drive No. Drive Number

Displayed on the iBMC
WebUI
Server node 1 1-0 0
1-1 1
Server node 2 2-0 0
2-1 1
Server node 3 3-0 0
3-1 1
Server node 4 4-0 0
4-1 1
● Table 5-3 shows drive slot numbers of 24 x 2.5" drive configuration 1 and 24 x
2.5" drive configuration 2
Figure 5-10 Slot numbers
Each server node manages six drives. Drives from left to right are managed by
server node 1, server node 2, server node 3, and server node 4 in sequence.
Table 5-5 Slot numbers

WebUI
Server node 1 1-0 0
1-1 1
1-2 2
1-3 3
1-4 4
1-5 5
Server node 2 2-0 0


WebUI
2-1 1
2-2 2
2-3 3
2-4 4
2-5 5
Server node 3 3-0 0
3-1 1
3-2 2
3-3 3
3-4 4
3-5 5
Server node 4 4-0 0
4-1 1
4-2 2
4-3 3
4-4 4
4-5 5
5.3.2 Drive Indicators

SAS/SATA Drive Indicators
Figure 5-11 SAS/SATA drive indicators

Table 5-6 SAS/SATA drive indicators
Activity Indicator Fault Indicator Description

(Green) (Yellow)
Steady on Off The drive is detected.
Blinking at 4 Hz Off Data is being read or written properly, or

data on the primary drive is being
rebuilt.
Steady on Blinking at 1 Hz The drive is being located.
Blinking at 1 Hz Blinking at 1 Hz Data on the secondary drive is being

rebuilt.
Off Steady on A drive in a RAID array is removed.
Steady on Steady on The drive is faulty.
NVMe Drive Indicators
Figure 5-12 NVMe drive indicators
● If the VMD function is enabled and the latest VMD driver is installed, the NVMe
drives support surprise hot swap.
Table 5-7 NVMe drive indicators (VMD enabled)
Activity Fault Indicator Description

Indicator (Yellow)
(Green)
Off Off The NVMe drive is not detected.
Steady on Off The NVMe drive is detected and

operating properly.
Blinking at 2 Hz Off Data is being read from or written to

the NVMe drive.
Off Blinking at 2 Hz The NVMe drive is being located.
Off Blinking at 8 Hz The data on the secondary NVMe

drive is being rebuilt.


Indicator (Yellow)
(Green)
Steady on/Off Steady on The NVMe drive is faulty.
● If the VMD function is disabled, the NVMe drives support only orderly hot swap.
Table 5-8 NVMe drive indicators (VMD disabled)

Indicator (Yellow)
(Green)
Off Off The NVMe drive is not detected.
Steady on Off The NVMe drive is detected and

operating properly.
Blinking at 2 Hz Off Data is being read from or written to

the NVMe drive.
Off Blinking at 2 Hz The NVMe drive is being located or

hot-swapped.
Off Blinking at 0.5 Hz The NVMe drive has completed the

hot swap process and is removable.
Steady on/Off Steady on The NVMe drive is faulty.
NO TE
Hot swap refers to inserting or removing a component without cutting off the power supply to
the device.
● Surprise hot swap: inserting or removing a component directly without any notice.
● Orderly hot swap: inserting or removing a component after sending a notice.
5.4 Fan Modules

● Supports four 8080/8080+ counter-rotating fan modules with high wind pressure.
● The fan modules are hot-swappable.
● N+1 redundancy is supported. That is, the server can work properly when a
single fan rotor fails.
NO TE
When one fan fails, the supported maximum operating temperature is reduced by 5°C
(9°F).
● The fan speed can be adjusted.
● Fan modules of the same part number (P/N code) must be used in a server.

Figure 5-13 Positions of fan modules
5.5 Middle Modules

The middle module consists of the drive cable module, fan management board, and
middle column.
● Drive cable module supplies power to drives and provides data transmission
channels.
● Fan management board supplies power to fans and drives fans.
● Middle column secures high-speed cable terminals.

Figure 5-14 Middle module (8 x 2.5" drive configuration)
Figure 5-15 Middle module (24 x 2.5" drive configuration)

Figure 5-16 Fan management board
1 Drive cable module 2 Drive cable module

connector (J46) connector (J43)

5 Fan module connector 4 6 Drive cable module

(FAN_4/J42) connector (J44)









25 Drive cable module 26 Server node 1 connector

connector (J23) (J12)
27 Left mounting ear connector 28 Server node 2 connector

(J9) (J13)

29 Fan module connector 1 30 Power connector (J9)

(FAN_1/J62)
31 Fan module connector 2 32 Server node 3 connector

(FAN_2/J61) (J21)
33 JTAG connector (J17) 34 Server node 4 connector

(J22)
35 Fan module connector 3 36 Power connector (J10)

(FAN_3/J60)
37 Right mounting ear - -

connector (J48)
5.6 Server Node

The X6000 V6 supports a maximum of four server nodes (XH321 V6 or XH321C V6).
● For details about the XH321 V6 server node, see the FusionServer XH321 V6
Server Node User Guide.
● For details about the XH321C V6 server node, see the FusionServer XH321C
V6 Liquid-cooled Server Node User Guide.
Figure 5-17 Appearance of the XH321 V6

Figure 5-18 Appearance of the XH321C V6
5.7 PSUs
● PSUs are installed in server nodes, so the power consumption of a server varies
depending on the server configuration:
– When two server nodes are configured, the PSUs work in 1+1 redundancy
mode.
– When four server nodes are configured, the PSUs work in 2+2 redundancy
mode.
● PSUs of the same part number (P/N code) must be used in a server.
● The PSUs are protected against short circuit. Double-pole fuse is provided for
the PSUs with dual input live wires.
● If the DC power supply is used, purchase the DC power supply that meets the
requirements of the corresponding safety standards or the DC power supply that
has passed the CCC certification.
● Contact your local sales representative or see "Search Parts" in the
Compatibility Checker to determine the components to be used.
Figure 5-19 PSU positions

Technical White Paper 6 Product Specifications
6 Product Specifications
6.1 Technical Specifications

6.2 Environmental Specifications
6.3 Physical Specifications
6.1 Technical Specifications

Table 6-1 Technical specifications
Component Description
Form factor 2 U 4-node high-density server
Server nodes Supports a maximum of four server nodes, including XH321

V6 and XH321C V6 server nodes.
NOTE
All server nodes in a chassis must have the same model and the
same hardware configuration.
Storage Supports a variety of drive configurations. For details, see

5.3.1 Drive Configurations.
● Supports hot swap of SAS/SATA/NVMe U.2 drives.
NOTE
The NVMe drives support:
● Before using the VMD function, contact technical support
engineers of the OS vendor to check whether the OS
supports the VMD function. If yes, check whether the VMD
driver needs to be manually installed and check the
installation method.
● Surprise hot swap if the VMD function is enabled and the
latest Intel VMD driver is installed.
● Orderly hot swap if the VMD function is disabled.
● If OS is installed on an NVMe SSD, BIOS can only be set to
the UEFI mode.

Component Description
Fan modules ● Provides four fan modules.

● Supports N + 1 redundancy.
● Supports hot swap (in non-stacking installation
scenarios).
Middle modules Provides a maximum of 24-drive cable module connectors,

four fan module connectors, and two mounting ear cable
connectors.
Ports Supports a variety of ports.

● Ports on the front panel:
– Two USB 2.0 ports
– One DB15 VGA port
● Ports on the rear panel:
– For details about the XH321 V6, see FusionServer
XH321 V6 Server Node User Guide.
– For details about the XH321C V6, see FusionServer
XH321C V6 Liquid-cooled Server Node User
Guide.
6.2 Environmental Specifications

Table 6-2 Environmental specifications
Item Description
Temperature ● Operating temperature: 5°C to 45°C (41°F to 113°F)

(ASHRAE Classes A1 to A4 compliant)
● Storage temperature (within three months): –30°C to +60°C
(–22°F to +140°F)
● Storage temperature (within six months): –15°C to +45°C
(5°F to 113°F)
● Storage temperature (within one year): –10°C to +35°C
(14°F to 95°F)
● Maximum rate of temperature change: 20°C (36°F) per
hour, 5°C (9°F) per 15 minutes
NOTE
The highest operating temperature varies depending on the server
configuration. For details, see A.3 Operating Temperature
Limitations.

Item Description
Relative Humidity ● Operating humidity: 8% to 90%

(RH, Non- ● Storage humidity (within three months): 8% to 85%
Condensing)
● Storage humidity (within six months): 8% to 80%
● Storage humidity (within one year): 20% to 75%
● Maximum humidity change rate: 20%/h
Air volume ≥350 CFM
Operating ≤ 3050 m (10006.44 ft)

altitude ● If the server complies with ASHRAE Classes A1 and A2,
the maximum operating temperature decreases by 1°C
(1.8°F) for every increase of 300 m (984.25 ft) in altitude
above 900 m (2952.76 ft).
● When the server configuration complies with ASHRAE
Class A3 and the altitude is above 900 m (2952.76 ft), the
highest operating temperature decreases by 1°C (1.8°F) for
every increase of 175 m (574.14 ft).
● When the server configuration complies with ASHRAE
Class A4 and the altitude is above 900 m (2952.76 ft), the
highest operating temperature decreases by 1°C (1.8°F) for
every increase of 125 m (410.1 ft).
● HDDs cannot be used at an altitude of over 3,050 m
(10,006.44 ft).
Corrosive air Maximum corrosion product thickness growth rate:

pollutant ● Copper corrosion rate test: 300 Å/month (meeting level G1
requirements of the ANSI/ISA-71.04-2013 standard on
gaseous corrosion)
● Silver corrosion rate test: 200 Å/month
Particle pollutant ● The equipment room environment meets the requirements

of ISO 14664-1 Class 8.
● There is no explosive, conductive, magnetic, or corrosive
dust in the equipment room.
NOTE
It is recommended that the particulate pollutants in the equipment room
be monitored by a professional organization.

Item Description
Acoustic noise The data listed in the following is the declared A-weighted
sound power level (LWAd) and declared average bystander
position A-weighted sound pressure level (LpAm) when the
server is operating in a 23°C (73.4°F) ambient environment.
Noise emissions are measured in accordance with ISO 7999
(ECMA 74) and declared in accordance with ISO 9296 (ECMA
109).
Idle:
● LWAd: 6.55 Bels
● LpAm: 51.2 dBA
Operating:
● LWAd: 7.24 Bels
● LpAm: 58.1 dBA
NOTE
Actual sound levels generated during server operation vary depending
on server configuration, load, and ambient temperature.

6.3 Physical Specifications

Table 6-3 Physical specifications
Indicator Description
Dimensions (H x W x ● 86.1 mm x 447 mm x 900 mm (3.39 in. x 17.60 in. x

D) 35.43 in.)
NOTE
The chassis depth refers to the horizontal distance from the
front panel of the chassis to the I/O board of the server node.
Figure 6-1 Physical dimensions (example: 24 x 2.5" drive

chassis)
NOTE
● Figure 6-1 shows how to measure the physical dimensions
of the chassis.
● The measuring method for chassis with 8 x 2.5" drives and
that for chassis with 24 x 2.5" drives are the same. The
chassis with 24 x 2.5" drives is used as an example.

Indicator Description
Installation space ● Requirements for cabinet installation:

19-inch standard cabinet compliant with the
International Electrotechnical Commission (IEC) 297
standard.
– Cabinet width: 482.6 mm (19.00 in.)
– Cabinet depth ≥ 1100 mm (43.31 in.)
● Requirements for liquid-cooled cabinet installation:
Use X6000 V6 1225 mm (48.23 in.) liquid-cooled
cabinet. A liquid-cooled door is optional. The total
depth of the cabinet with a liquid-cooled door is 1375
mm (54.13 in.).
● Requirements for guide rail installation:
– L-shaped guide rails: For details about the
installation requirements, contact technical
support.
– Adjustable L-shaped guide rails: apply to cabinets
with a distance of 590 mm to 900 mm (23.22 in. to
35.43 in.) between the front and rear mounting
bars.
NOTE
For a 1100 mm deep cabinet, a distance of 70 mm to 110 mm
(2.75 in. to 4.33 in.) between the front mounting bar and the front
cabinet door is recommended.
Weight in full ● 8 x 2.5" drive configuration:

configuration – Net weight of a fully configured XH321 V6: 40.5 kg
(89.28 lb)
– Net weight of a fully configured XH321C V6: 50.5
kg (111.33 lb)
● 24 x 2.5" drive configuration:
– Net weight of a fully configured XH321 V6: 43.7 kg
(96.34 lb)
– Net weight of a fully configured XH321C V6: 53.7
kg (118.39 lb)
● Packing material weight: 13.5 kg (29.76 lb)
Power consumption The power consumption parameters vary with server

configurations, including the configurations complying
with energy-related products (ErP) requirements. Use the
Power Calculator to obtain specific information.

Technical White Paper 7 Software and Hardware Compatibility
7 Software and Hardware Compatibility
Use the Compatibility Checker to obtain information about the supported OS and
hardware types.
NO TICE
● If incompatible components are used, the device may be abnormal. This fault is
beyond the scope of technical support and warranty.
● The performance of servers is closely related to application software, basic
middleware software, and hardware. The slight differences of the application
software, middleware basic software, and hardware may cause performance
inconsistency between the application layer and test software layer.
● If the customer has requirements on the performance of specific application
software, contact technical support to apply for POC tests in the pre-sales
phase to determine detailed software and hardware configurations.
● If the customer has requirements on hardware performance consistency,
specify the specific configuration requirements (for example, specific drive
models, RAID controller cards, or firmware versions) in the pre-sales phase.

Technical White Paper 8 Safety Instructions
8 Safety Instructions
8.1 Security
8.2 Maintenance and Warranty
8.1 Security
General Statement
● Comply with local laws and regulations when installing devices. These Safety
Instructions are only a supplement.
● The "DANGER", "WARNING", and "CAUTION" information in this document
does not represent all the safety instructions, but supplements to the safety
instructions.
● Observe all safety instructions provided on device labels.
● Only qualified personnel are allowed to perform special tasks, such as high-
voltage operations and driving a forklift.
WARNING
If this device works in a residential environment, the wireless interference may be

generated.
Personal Safety
● This equipment is not suitable for use in places where children may be present.
● Only personnel certified or authorized are allowed to install equipment.
● Discontinue any dangerous operations and take protective measures. Report
anything that could cause personal injury or device damage to a project
supervisor.
● Do not move devices or install racks and power cables in hazardous weather
conditions.

● For lifting or carrying hardware, ensure load limits and manpower provisions
conform to legal specifications. Check the maximum device weight and arrange
required personnel.
● Wear clean protective gloves, ESD clothing, a protective hat, and protective
shoes, as shown in Figure 8-1.
Figure 8-1 Safety work wear
● Before touching a device, wear ESD clothing and gloves (or wrist strap), and
remove any conductive objects (such as watches and jewelry). Figure 8-2
shows conductive objects that must be removed before you touch a device.
Figure 8-2 Removing conductive objects
Figure 8-3 shows how to wear an ESD wrist strap.

a. Put your hands into the ESD wrist strap.
b. Tighten the strap buckle and ensure that the ESD wrist strap is in contact
with your skin.
c. Insert the ground terminal attached to the ESD wrist strap into the jack on
the grounded rack or chassis.

Figure 8-3 Wearing an ESD Wrist Strap
● Exercise caution when using tools.

● If the installation position of a device is higher than the shoulders of the
installation personnel, use a vehicle such as a lift to facilitate installation. Prevent
the device from falling down and causing personal injury or damage to the
device.
● The equipment is powered by high-voltage power sources. Direct or indirect
contact (especially through damp objects) with high-voltage power sources may
result in serious injury or death.
● Ground the equipment before powering it on. Otherwise, personal injury may be
caused by high electricity leakage.
● Do not use the ladder unsupervised. Have someone else hold the ladder steady
to prevent accidents.
● Do not look into optical ports without eye protection.
Device Security
● Use the recommended power cables at all times.
● Power cables are used only for dedicated servers. Do not use them for other
devices.
● Before operating equipment, wear ESD clothes and gloves to prevent
electrostatic-sensitive devices from being damaged by ESD.
● When moving a device, hold the bottom of the device. Do not hold the handles of
the installed modules, such as the PSUs, fan modules, drives, and the
mainboard. Handle devices with care.
● Exercise caution when using tools.
● Connect the primary and secondary power cables to different power distribution
units (PDUs) to ensure reliable system operation.
● Ground a device before powering it on. Otherwise, high leakage current may
cause device damage.
Transportation Precautions
Contact the manufacturer for precautions before attempting transportation.
Transportation precautions include but are not limited to:
● The logistics company engaged to transport the device must be reliable and
comply with international standards for transporting electronics. Ensure that the
device being transported is always kept upright. Take necessary precautions to
prevent collisions, corrosion, package damage, damp conditions and pollution.

● Transport each device in its original packaging.

● If the original packaging is unavailable, package heavy, bulky parts (such as
chassis and blades) and fragile parts (such as PCIe cards and optical modules)
separately.
NO TE
For details about the components supported by the server, see "Compatibility" in the
Compatibility Checker.
● Power off all devices before transportation.
Maximum Weight Carried by a Person
CAUTION
Comply with local regulations for the maximum load per person.
Table 8-1 lists the maximum weight one person is permitted to carry as stipulated by
a number of organizations.
Table 8-1 Maximum weight carried by per person

Organization Name Weight (kg/lb)
European Committee for 25/55.13

Standardization (CEN)
International Organization for 25/55.13

Standardization (ISO)
National Institute for Occupational 23/50.72

Safety and Health (NIOSH)
Health and Safety Executive (HSE) 25/55.13
For more information about safety instructions, see the Server Safety Information.
8.2 Maintenance and Warranty

For details about the maintenance policy, visit Customer Support Service.
For details about the warranty policy, visit Warranty.

Technical White Paper 9 System Management
9 System Management
9.1 iBMC
9.2 Server Management System
9.1 iBMC
The intelligent Baseboard Management Controller (iBMC) provides various
management functions.
● Various management interfaces

The iBMC provides the following standard interfaces to meet various system
integration requirements:
– DCMI 1.5 interface
– IPMI 1.5/IPMI 2.0 interface
– CLI
– Redfish interface
– HTTPS
– SNMP
● Fault detection and alarm management
Faults can be detected and rectified in advance to ensure 24/7 stable running of
the device.
– The iBMC allows screenshots and videos to be created when the system
breaks down, facilitating cause analysis of the system breakdown.
– The iBMC offers screen snapshots and videos, simplifying routine
preventive maintenance, recording, and auditing.
– The Fault Diagnose Management (FDM) function supports component-
based precise fault diagnosis, facilitating component fault locating and
replacement.
– The iBMC supports the reporting of alarms through syslog packets, trap
packets, and emails, helping the upper-layer NMS to collect the fault
information about the server.
● Security management

– Software image backup improves system security. Even if the running

software breaks down, the system can be started from the backup image.
– Diversified user security control interfaces are provided to ensure user login
security.
– Multiple types of certificates can be imported and replaced to ensure data
transmission security.
● System maintenance interface
– The virtual KVM and virtual media functions facilitate remote maintenance.
– Out-of-band RAID monitoring and configuration are supported to improve
RAID configuration efficiency and management capability.
– Smart Provisioning provides a convenient operation interface for installing
the OS, configuring RAID, and performing the upgrade without a CD-ROM.
● Various network protocols
– The NTP synchronizes network time to optimize time configuration.
– The iBMC supports domain name system (DNS) and Lightweight Directory
Application Protocol (LDAP) to implement domain management and
directory service.
● Intelligent power management
– The power capping technology helps you easily improve deployment
density.
– The iBMC uses dynamic power saving to reduce operational expenditure
(OPEX).
● License management
By managing licenses, you can use the features of the iBMC advanced edition in
authorization mode.
Compared with the standard edition, the iBMC advanced edition provides more
advanced features, such as:
– Redfish-enabled OS deployment
– Redfish-enabled original data collection for intelligent diagnosis
9.2 Server Management System

The entire server management system consists of iBMCs on each server node.
Table 9-1 lists main features of the server management system.
Table 9-1 Features of the management system
Feature Description
Management port Supports the following management ports integrated with

any standard management system:
● IPMI
● CLI
● WebUI

Feature Description
Fault detection Detects and accurately locates faults in server and node
components.
Alarm management Supports alarm management and reports alarms in

various ways, such as the syslog service, to ensure
uninterrupted 24/7 system operation.
Asset management Supports intelligent asset management.
Intelligent power Uses the power capping technology to increase

management deployment density and uses the dynamic energy saving
technology to lower the operation and maintenance
costs.
Aggregation port The management port of each server node is an

aggregation port, which can be connected to the iBMC of
another node. This reduces the cabling of the
management network and shortens the system
maintenance time.

Technical White Paper 10 Certifications
10 Certifications
NO TE
The following table lists the certifications that the server (chassis and node) has passed.
● If the XH321 V6 air-cooled node is configured, the passed certifications are as
follows.
Country/Region Certification Standards
Europe WEEE 2012/19/EU
Europe REACH EC NO. 1907/2006
Europe CE Safety:
EN 62368-1:2014+A11:2017
EMC:
EN 55032:2015+A11:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-3:2013+A1:2019
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
ETSI EN 300 386 V1.6.1:2012
ETSI EN 300 386 V2.1.1:2016
RoHS:
EN IEC 63000:2018
ErP:
Commission Regulation(EU)
424/2019

Country/Region Certification Standards
UK UKCA Safety:
EN 62368-1:2014+A11:2017
EMC:
EN 55032:2015+A11:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-3:2013+A1:2019
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
ETSI EN 300 386 V1.6.1:2012
ETSI EN 300 386 V2.1.1:2016
RoHS:
BS EN IEC 63000:2018
ErP:
Commission Regulation(EU)
424/2019
China CCC GB 17625.1-2012

GB 4943.1-2011
GB/T 9254.1-2021
China RoHS SJ/T-11364

GB/T 26572
North America NRTL UL 62368-1:2014

CAN/CSA-C22.2 NO.62368-1-14
US FCC FCC PART 15
Canada IC ICES-003
Japan VCCI VCCI 32-1
Global CB IEC 62368-1:2014
● If the XH321C V6 liquid-cooled node is configured, the passed certifications are

as follows:
Country/Region Certification Standard
Europe WEEE 2012/19/EU
Europe REACH EC NO. 1907/2006

Country/Region Certification Standard
China CCC GB 17625.1-2012

GB 4943.1-2011
GB/T 9254.1-2021
China RoHS SJ/T-11364

GB/T 26572
US FCC FCC PART 15
Canada IC ICES-003
Japan VCCI VCCI 32-1

Technical White Paper A Appendix
A Appendix
A.1 Chassis Label

NO TE
The information on labels and label positions are for reference only. For details, see the actual
product.
A.1.1 Chassis Head Label
Figure A-1 Chassis head label
1 Nameplate 2 Certificate

3 Quick access tag 4 Pressure-proof label

NOTE
This label warns users not place
any objects on top of a rack-
mounted device.
5 Reserved space for custom 6 SN

label NOTE
For details, see A.2 Product SN.
A.1.1.1 Nameplate
Figure A-2 Nameplate example
Table A-1 Nameplate description

No. Description
1 Server Model
For details, see A.4 Nameplate.
2 Device names
3 Power Supply Requirements
4 Vendor Information
5 Authentication ID
A.1.1.2 Certificate
Figure A-3 Sample certificate

Table A-2 Certificate description

No. Description
1 Order
2 No.
NOTE
For details, see Figure A-4 and Table A-3.
3 QC inspector
4 Production date
5 No. barcode
Figure A-4 Sample certificate No.
Table A-3 Certificate No. description

No. Description
1 P: a fixed value for this digit
2 Z: a fixed value for this digit
3 ● Y: a server
● B: a semi-finished server
● N: a spare part
4 0: a value for the reserved digit
5 Year (two characters)
6 Month (one character)

● Digits 1 to 9 indicate January to September respectively.
● Letters A to C indicate October to December respectively.
7 Day (one character)

● Digits 1 to 9 indicate the 1st to 9th.
● Letters A to H indicate the 10th to 17th.
● Letters J to N indicate the 18th to 22nd.
● Letters P to Y indicate the 23rd to 31st

No. Description
8 Hour (one character)

● Digits 0 to 9 indicate 0:00 to 9:00.
● Letters A to H indicate 10:00 to 17:00.
● Letters J to N indicate 18:00 to 22:00.
● Letters P to Q indicate 23:00 to 24:00.
9 Serial number (two characters)
10 Manufacturing serial number (five characters)
A.1.1.3 Quick Access Tag
Figure A-5 Sample quick access tag
Table A-4 Quick access tag description

No. Description
1 Server node name
2 IP address of the iBMC management network port
3 Subnet mask of the iBMC management network port
4 Default iBMC user name
5 Default iBMC and BIOS password
6 Technical support website
7 P/N code
8 QR code
NOTE
Scan the QR code to obtain technical support resources.

A.1.2 Chassis Tail Label

Figure A-6 Chassis tail label
NO TE
For details about the warning labels, see the Server Safety Information.
A.2 Product SN
The serial number (SN) on the slide-out label plate uniquely identifies a device. The
SN is required when you contact technical support.
Figure A-7 SN example
Table A-5 SN description

SN Description
1 ESN ID (two digits), which can only be 21.
2 Material ID (eight characters), that is, the processing code.
3 Vendor code (two digits), that is, the code of the processing place.

SN Description
4 Year and month (two characters).

● The first character indicates the year.
– Digits 1 to 9 indicate years 2001 to 2009, respectively.
– Letters A to H indicate years 2010 to 2017, respectively.
– Letters J to N indicate years 2018 to 2022, respectively.
– Letters P to Y indicate years 2023 to 2032, respectively.
NOTE
The years from 2010 are represented by upper-case letters excluding
I, O, and Z because the three letters are similar to the digits 1, 0, and
2.
● The second character indicates the month.
– Digits 1 to 9 indicate January to September, respectively.
– Letters A to C indicate October to December, respectively.
5 Serial number (six digits).
6 RoHS compliance (one character). Y indicates RoHS compliant.
7 Board model, that is, product name.
A.3 Operating Temperature Limitations

Table A-6 Operating temperature limitations (server with 8 x 2.5" SAS/SATA drives)
Drive Number Number Number Fan CPU Maximum
Configu of of OCP of RAID Configu Configurati Temperat
ration Standar 3.0 Controll ration on ure
d PCIe Networ er Cards
Cards k
Adapter
s
0< 2 0 0 8080+ 205 W < P ≤ 35°C

drives ≤ 270 W
8
P ≤ 205 W 35°C
2 0 1 8080+ 205 W < P ≤ 35°C

270 W
P ≤ 205 W 35°C
2 1 1 8080+ 205 W < P ≤ 32°C

270 W
P ≤ 205 W 35°C


Cards k
Adapter
s
1 1 0 8080+ 120W < P ≤ 45°C

150 W
1 1 1 8080+ P ≤ 120 W 45°C
0< 2 0 0 8080 205 W < P ≤ 32°C

drives ≤ 270 W
8
P ≤ 205 W 35°C
2 0 1 8080 205 W < P ≤ 30°C

270 W
P ≤ 205 W 35°C
2 1 1 8080 205 W < P ≤ 29°C

270 W
P ≤ 205 W 35°C
● By default, all configurations include optical modules.

● XH321 V6 does not support the 8368Q processor.
● When the server is configured with high-frequency, less-core processors such
as 6346 and 6354, the supported operating temperature decreases. For details,
consult the local sales representatives.
● For configurations not listed in the table, the operating temperature range is 5°C
(41°F) to 35°C (95°F). For special configuration and temperature requirements,
contact technical support.
Table A-7 Operating temperature limitations (server with 24 x 2.5" SAS/SATA drives)
Cards k
Adapter
s
16 ≤ 2 0 0 8080+ 185 W < P ≤ 35°C

drives ≤ 205 W
24
P ≤ 185 W 35°C


Cards k
Adapter
s
2 0 1 8080+ 185 W < P ≤ 35°C

205 W
P ≤ 185 W 35°C
2 1 1 8080+ 185 W < P ≤ 35°C

205 W
P ≤ 185 W 35°C
2 0 0 8080 185 W < P ≤ 35°C

205 W
P ≤ 185 W 35°C
2 0 1 8080 185 W < P ≤ 33°C

205 W
P ≤ 185 W 35°C
2 1 1 8080 185 W < P ≤ 32°C

205 W
P ≤ 185 W 35°C


Table A-8 Operating temperature limitations (server with 24 x 2.5" SAS/SATA/NVMe

drives)
Cards k
Adapter
s
16 ≤ 2 0 0a 8080+ 185 W < P ≤ 35°C

drives ≤ 205 W
24
P ≤ 185 W 35°C
2 1 0a 8080+ 185 W < P ≤ 34°C

205 W
P ≤ 185 W 35°C
2 0 0a 8080 185 W < P ≤ 32°C

205 W
P ≤ 185 W 35°C
2 1 0a 8080 185 W < P ≤ 31°C

205 W
P ≤ 185 W 35°C
● a: When NVMe drives are used, and the RAID controller card is configured for
SAS/SATA drives, the supported operating temperature may decrease.
Table A-9 X6000 V6 server heat dissipation and air volume requirements
X6000 V6 Power Environment and Air Volume Requirement of a
Single-Chassis Server
3000 W-4000 W ● Air inlet temperature: ≤ 35°C (95°F)

● Air volume supplied in the equipment room for a
single device: ≥ 350 CFM
● Cooling capacity supplied in the equipment room
for a single device: ≥ 4000 W

X6000 V6 Power Environment and Air Volume Requirement of a

Single-Chassis Server
Lower than 3000 W ● Air inlet temperature: ≤ 35°C (95°F)

● Air volume supplied in the equipment room for a
single device:
– 8080 fans: ≥ 270 CFM
– 8080+ fans: ≥ 300 CFM
● Cooling capacity supplied in the equipment room
for a single device:: ≥ 3000 W
A.4 Nameplate
Certified Model Description
X6000 Global
A.5 RAS Features

The server supports a variety of Reliability, Availability, and Serviceability (RAS)
features. You can configure these features for better performance.
For details about the RAS features, see the FusionServer Ice Lake Platform RAS
Technical White Paper.
A.6 Sensor List

● For details about the XH321 V6, see the FusionServer XH321 V6 Server Node
User Guide.
● For details about the XH321C V6, see the FusionServer XH321C V6 Liquid-
cooled Server Node User Guide.

Technical White Paper B Glossary
B Glossary
B.1 A-E
B
BMC The baseboard management controller (BMC) complies
with the Intelligent Platform Management Interface
(IPMI). It collects, processes, and stores sensor signals,
and monitors the operating status of components. The
BMC provides the hardware status and alarm information
about the managed objects to the upper-level
management system, so that the management system
can manage the objects.
E
ejector lever A part on the panel of a device used to facilitate
installation or removal of the device.
Ethernet A baseband local area network (LAN) architecture

developed by Xerox Corporation by partnering with Intel
and DEC. Ethernet uses the Carrier Sense Multiple
Access/Collision Detection (CSMA/CD) access method
and allows data transfer over various cables at 10 Mbit/s.
The Ethernet specification is the basis for the IEEE 802.3
standard.

B.2 F-J
G
Gigabit Ethernet (GE) An extension and enhancement of traditional shared
media Ethernet standards. It is compatible with 10 Mbit/s
and 100 Mbit/s Ethernet and complies with IEEE 802.3z
standards.
H
hot swap Replacing or adding components without stopping or
shutting down the system.
B.3 K-O
K
KVM A hardware device that provides public video, keyboard
and mouse (KVM).
B.4 P-T
P
panel An external component (including but not limited to
ejector levers, indicators, and ports) on the front or rear
of the server. It seals the front and rear of the chassis to
ensure optimal ventilation and electromagnetic
compatibility (EMC).
Peripheral A computer bus PCI, which uses the existing PCI

Component programming concepts and communication standards,
Interconnect Express but builds a faster serial communication system. Intel is
(PCIe) the main sponsor for PCIe. PCIe is used only for internal
interconnection. A PCI system can be transformed to a
PCIe system by modifying the physical layer instead of
software. PCIe delivers a faster speed and can replace
almost all AGP and PCI buses.

Proportional– Proportional-integral-derivative (PID) algorithm is the

integral–derivative most common control algorithm in industry. In PID
control, the algorithm calculates the proportion, integral,
derivative response, and the sum of the three, thus to
calculate the actual output.
R
redundancy A mechanism that allows a backup device to
automatically take over services from a faulty device to
ensure uninterrupted running of the system.
redundant array of A storage technology that combines multiple physical

independent disks drives into a logical unit for the purposes of data
(RAID) redundancy and performance improvement.
S
server A special computer that provides services for clients over
a network.
system event log Event records stored in the system used for subsequent
(SEL) fault diagnosis and system recovery.
B.5 U-Z
U
U A unit defined in International Electrotechnical
Commission (IEC) 60297-1 to measure the height of a
cabinet, chassis, or subrack. 1 U = 44.45 mm
UltraPath A point-to-point processor interconnect developed by

Interconnect (UPI) Intel.

Technical White Paper C Acronyms and Abbreviations
C Acronyms and Abbreviations
C.1 A-E
A
AC alternating current
AES Advanced Encryption Standard New Instruction Set
ARP Address Resolution Protocol
AVX Advanced Vector Extensions
B
BBU backup battery unit
BIOS Basic Input/Output System
BMC baseboard management controller
C
CD calendar day
CE Conformite Europeenne
CIM Common Information Model
CLI command-line interface

D
DC direct current
DDR4 Double Data Rate 4
DDDC double device data correction
DEMT Dynamic Energy Management Technology
DIMM dual in-line memory module
DRAM dynamic random-access memory
DVD digital video disc
E
ECC error checking and correcting
ECMA European Computer Manufacturer Association
EDB Execute Disable Bit
EN European Efficiency
ERP enterprise resource planning
ETS European Telecommunication Standards
C.2 F-J
F
FB-DIMM Fully Buffered DIMM
FC Fiber Channel
FCC Federal Communications Commission
FCoE Fibre Channel over Ethernet
FTP File Transfer Protocol
G
GE Gigabit Ethernet
GPIO General Purpose Input/Output

GPU graphics processing unit
H
HA high availability
HDD hard disk drive
HPC high-performance computing
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure
I
iBMC intelligent baseboard management controller
IC Industry Canada
ICMP Internet Control Message Protocol
IDC Internet Data Center
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electronics Engineers
IGMP Internet Group Message Protocol
IOPS input/output operations per second
IP Internet Protocol
IPC Intelligent Power Capability
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface
C.3 K-O
K
KVM keyboard, video, and mouse

L
LC Lucent Connector
LRDIMM load-reduced dual in-line memory module
LED light emitting diode
LOM LAN on motherboard
M
MAC media access control
MMC module management controller
N
NBD next business day
NC-SI Network Controller Sideband Interface
O
OCP Open Compute Project
C.4 P-T
P
PCIe Peripheral Component Interconnect Express
PDU power distribution unit
PHY physical layer
PID Proportional-integral-derivative
PMBUS power management bus
POK Power OK
PWM pulse-width modulation
PXE Preboot Execution Environment

R
RAID redundant array of independent disks
RAS reliability, availability and serviceability
RDIMM registered dual in-line memory module
REACH Registration Evaluation and Authorization of Chemicals
RJ45 registered jack 45
RoHS Restriction of the Use of Certain Hazardous Substances

in Electrical and Electronic Equipment
S
SAS Serial Attached Small Computer System Interface
SATA Serial Advanced Technology Attachment
SCM supply chain management
SDDC single device data correction
SERDES serializer/deserializer
SGMII serial gigabit media independent interface
SMI serial management interface
SMTP Simple Mail Transfer Protocol
SNMP Simple Network Management Protocol
SOL serial over LAN
SONCAP Standards Organization of Nigeria-Conformity

Assessment Program
SSD solid-state drive
SSE Streaming SIMD Extension
T
TACH tachometer signal
TBT Turbo Boost Technology
TCG Trusted Computing Group
TCM trusted cryptography module
TCO total cost of ownership

TDP thermal design power
TELNET Telecommunication Network Protocol
TET Trusted Execution Technology
TFM TransFlash module
TFTP Trivial File Transfer Protocol
TOE TCP offload engine
TPM trusted platform module
C.5 U-Z
U
UDIMM unbuffered dual in-line memory module
UEFI Unified Extensible Firmware Interface
UID unit identification light
UL Underwriter Laboratories Inc.
UPI UltraPath Interconnect
USB Universal Serial Bus
V
VCCI Voluntary Control Council for Interference by Information
Technology Equipment
VGA Video Graphics Array
VLAN virtual local area network
VRD voltage regulator-down
W
WEEE waste electrical and electronic equipment
WSMAN Web Service Management

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Technical White Paper

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Trademarks and Permissions

xFusion Digital Technologies Co., Ltd.

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document

Indicates a hazard with a high level of risk which, if not

Indicates a hazard with a medium level of risk which, if

Indicates a hazard with a low level of risk which, if not

Indicates a potentially hazardous situation which, if not

Supplements the important information in the main text.

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. ii

06 2023-03-31 ● Updated 4 Physical Structure.

04 2022-11-03 Updated 8.1 Security.

02 2022-03-18 Updated 6.3 Physical Specifications.

01 2021-07-16 This issue is the first official release.

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. iii

About This Document.........................................................................................................ii

7 Software and Hardware Compatibility......................................................................... 36

9 System Management .................................................................................................... 41

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. iv

C Acronyms and Abbreviations...................................................................................... 60

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. v

The FusionServer X6000 V6 server (X6000 V6) is a next-generation 2 U high-density

X6000 V6 servers feature flexible expansion, high density, reliability, energy

The X6000 V6 supports only XH321 V6 air-cooled server nodes or XH321C V6

Figure 1-1 X6000 V6 server with 24 x 2.5" drives (example)

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 1

Ultra-High Density and Small Footprint

Unified Management and Easy Maintenance

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 2

Shared Architecture and High Energy Efficiency

Redundancy and Reliability

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 3

3.1 Heat Dissipation System

3.1 Heat Dissipation System

Figure 3-1 Top view of the X6000 V6 air flow

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 4

Figure 3-2 Side view of the X6000 V6 air flow

3.2 Power Supply System

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 5

Table 3-1 PSU and power supply redundancy

2 Server < Single PSU 1+1 1+1

Single PSU ≤ Server MSPP is used to enable redundancy.

4 Server < 2 PSUs 2+2 1+1

2 PSUs ≤ Server < 3 3+1 MSPP is used to

3 PSUs ≤ Server MSPP is used to enable redundancy.

● MSPP is a multi-node power capping function. If the power supply or a PSU

Power Capping Mode

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 6

● MSPP and user-defined power capping cannot be enabled together.

Table 3-2 Status of the MSPP or user-defined power capping mode

Number of PSU Rated Power Power Capping Mode Status (Set by

2 Server < Single PSU ● MSPP disabled

Single PSU ≤ Server ● MSPP enabled (triggered by a single

Issue 06 (2023-03-31) Copyright © xFusion Digital Technologies Co., Ltd. 7