Graphene Film Development On Flexible
Graphene Film Development On Flexible
Graphene Film Development On Flexible
Graphene film development on flexible substrate using a new technique: temperature dependency of gauge
factor for graphene-based strain sensors
SahourSayed, MohammedGamil, AhmedFath El-Bab, KoichiNakamura, ToshiyukiTsuchiya, OsamuTabata, AhmedAbd El-
Moneim,
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SahourSayed, MohammedGamil, AhmedFath El-Bab, KoichiNakamura, ToshiyukiTsuchiya, OsamuTabata, AhmedAbd
El-Moneim, (2016) "Graphene film development on flexible substrate using a new technique: temperature dependency of
gauge factor for graphene-based strain sensors", Sensor Review, Vol. 36 Issue: 2, pp.140-147, https://doi.org/10.1108/
SR-07-2015-0114
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reduction of chemically exfoliated graphene oxide (GO) using analyzed. Finally, the strain sensing mechanism was discussed
reducing agents like hydrazine, etc. (Chang et al., 2012; Hummers in terms of LRGO film microstructure.
and Offeman, 1958; Li et al., 2009; Stankovich et al., 2007; Yu et al.,
2008a, 2008b; Zhao et al., 2010). 2. Experiment
So far, many researchers have developed graphene-based
strain gauges and reported their GFs. Zheng et al. (2013) stated 2.1 Graphene oxide synthesis
that the GF of mechanically exfoliated graphene on Si/SiO2 Graphite oxide was prepared using the modified Hummer’s
substrate ranges from 10 to 15, depending on its number of method from graphite powder by oxidation with NaNO3, H2SO4
layers, but their production method was time-consuming and and KMnO4 in an ice bath (Hummers and Offeman, 1958; Zhao
produced graphene at low yields. Lee et al. (2010) reported that et al., 2010). A suspension of graphene oxide (GO) sheets was
obtained by sonication of the prepared graphite oxide powder in
the GF of graphene grown by chemical vapor deposition (CVD)
distilled water (5 mg/mL) for 2 h, followed by mild centrifugation
on a copper film deposited on Si/SiO2 substrate is 6.1. On the
at 5,000 rpm for 30 min to remove non-exfoliated materials,
other hand, Fu et al. (2011) measured a GF of 151 for monolayer
leading to a brownish color solution of exfoliated GO sheets with
graphene prepared by CVD and then transferred to
a final concentration of 3.7 mg/mL, as determined from the
polydimethylsiloxane (PDMS) substrate. In a similar research
residual weight of the dried aliquot.
(Gamil et al., 2014a, 2014b), a higher GF of 255 was measured
for monolayer graphene film grown by CVD on a copper foil and
then transferred to Si/SiO2 substrate. Furthermore, many 2.2 Device fabrication
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investigations have been conducted to increase the sensitivity of The graphene-based strain sensor fabrication process consists of
graphene-based strain sensors using various techniques which four main stages as shown in Figures 1(a-d). First (Figure 1(a)),
the GO precursor solution was drop casted at 20°C on the
depend on different structures and mechanisms such as structure
flexible PET square substrate with 10-cm edge length and 100
deformation (Jin et al., 2009; Yu et al., 2008a, 2008b),
overlapped graphene sheets (Hempel et al., 2012; Kim et al.,
2011) and tunneling effect between neighboring graphene Figure 1 Fabrication processes of the flexible LRGO/PET strain sensor
islands (Zhao et al., 2012).
Despite the fact that CVD technique provides monolayer
graphene film with high GF, but the subsequent complicated
transferring and pattering techniques of this film make the
batch fabrication of graphene-based devices not feasible.
Therefore, there is a need for simple fabrication technology
which avoids the use of harsh chemicals, high synthesis
temperature and well suites the batch fabrication of
graphene-based strain sensors.
On the other hand, merging the flexibility with devices has
recently become a great challenge for researchers trying to
develop flexible micro-devices. In this regard, the excellent
flexibility of graphene comes in handy when aiming to produce a (a)
whole new class of state-of-the-art devices for many industrial
Laser beam
applications. As a result, some attempts have been made to
achieve that goal. Strong et al. (2012) used laser source of DVD
drive to reduce graphene oxide deposited on a polyethylene
terephthalate (PET) substrate to fabricate flexible sensors. (b)
Although this process is quite simple, but the produced graphene
Connecting pads
has insufficient quality due to incomplete reduction, as a
consequence of the small laser power of the DVD drive. Also, Gamil
et al. (2014a, 2014b) have recently synthesized a reduced graphene
oxide film on PET substrate using high-power CO2 laser and used
it as a strain sensor. The fabricated sensor showed a GF of 61.5 at (c)
applied strains up to 0.05 per cent at room temperature. Copper wires
In the present study, a universal laser system was utilized to
pattern and reduce a drop-casted GO film on a flexible PET
substrate into laser reduced graphene oxide (LRGO) film. By
utilizing this technique, any special preparations or
adjustments for the samples were avoided, thus allowing the (d)
fabrication of a flexible and sensitive strain sensor with a
simple and low-cost technique. The sensitivity and stability of Notes: (a) Drop-casting of GO solution on
the developed LRGO/PET strain sensor were tested at applied PET substrate; (b) simultaneous reduction
strains up to 0.25 per cent and under operating temperatures and patterning for GO film by Laser beam;
up to 80°C. Furthermore, the effectiveness of laser reduction (c) deposition of silver connecting pads by
technique on the properties of the synthesized graphene was thermal evaporation; (d)wire bonding process
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Sahour Sayed et al. Volume 36 · Number 2 · 2016 · 140 –147
m in thickness (Figure 1(a)). The spreaded GO solution was in a full Wheatstone bridge circuit. These strain gauges were
left to dry for 48 h in air at room temperature. Then in the second glued on the cantilever beam to measure the axial strain at
step (Figure 1(b)), the dried GO film was simultaneously different applied loads. Power screw with 1.25-mm pitch was
reduced and patterned into graphene rectangular strips (5 ⫻ 10 used to apply different loads on a cantilever beam with 1-mm
mm) using a CO2 laser beam, with wavelength of 10.6 m and thickness. The trapezoidal beam was used to have a uniform
diameter of 70 m, generated from a universal laser printing uniaxial stress distribution inside the beam (Chen et al.,
machine (model: Universal Laser Systems VLS2.30) with a focal 2011). Finally, the LRGO/PET sensor was fixed on the top
length of 50 mm. The desired shape was reduced and patterned surface of the cantilever beam at the same distance from the
with a resolution of 1,000 pulses per inch and speed of 25.4 fixed end and the commercial strain gauges to ensure receiving
mm/s. The used laser power for this process was 2 W with an the same axial strain as the strain gauges. The change in the
average reduction time of 30 s. The laser processing parameters electrical resistance because of the different applied strains
were optimized after several experimental trials to give the best was recorded to determine the GF.
results concerning graphene film quality and properties. For The effect of operating temperature on the stability of GF
instance, the higher power damages the GO film and the PET was studied up to 80°C. The test rig was placed inside a
substrate, while lower values only produce a partially reduced furnace, while the connecting wires (terminals) were kept
graphene film with undesired properties. In the third step (Figure outside it, as shown in Figure 2.
1(c)), silver connecting pads were deposited through a stencil
mask onto the LRGO strip ends by thermal evaporation 3. Results and discussion
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Figure 4 SEM images of LRGO film at various magnifications: (a) Figure 5 XRD patterns for graphite (Curve a), GO (Curve b) and
border line between LRGO and dark GO films; (b) overlapped LRGO LRGO (Curve c)
flakes structure; (c) integrated network of multilayer LRGO flakes
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Figure 7 Raman spectra for GO (Curve a) and LRGO (Curve b) films Table I shows that the laser treatment of the GO film renders
higher values of I(2D)/I(G) and I(G)/I(D) ratios for LRGO
film than those for GO film. Besides, it confirms the
multilayer, disorder and defective nature of LRGO film. In
correlation with the previous facts, the GO film shows a very
low electrical conductivity (9 ⫻ 10⫺2 S/m), while the
application of suitable laser power makes the film electrically
active by increasing its conductivity in five orders of
magnitude to reach 1.33 ⫻ 103 S/m. This likely means that the
removal of oxygen-containing functional groups from the GO
film with the laser reduction process leads to an efficient
recovery of the sp2 network structure, which subsequently
enhances the conductivity among the graphitic domains. On
the other hand, Vallés et al. (2012) reported that the I(2D)/
I(G), I(G)/I(D) and the electrical conductivity values obtained
for hydrazine reduced GO film were 0.183, 1.4 and 1.75 ⫻
102 S/m, respectively. These values are much lower than those
measured for the LRGO film presented in this study, as
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resistances were 124.8, 118.2, 112.9 and 108 ⍀ at 20, 40, 60 GF is decreased to 71.1 with standard error of the mean of
and 80°C, respectively. The plots of the resistance vs strain at approximately ⫾1.05 (Figure 9(d)). The reason for this
different operating temperatures up to 60°C show strong instability and inconsistency of the GF measurement at 80°C is
linear trends with very good fits which reflects the structural the softening and properties change of the PET substrate,
integrity and continuity of the graphene film network under wherein the average glass transition temperature of the PET is
the applied mechanical strain during the test. On the other about 70°C and that subsequently affects the adhesion between
hand, a clear deviation from linearity in strain-resistance curve the LRGO film and its PET substrate.
is observed at temperature of 80°C. The measured temperature dependency of the
The GF of the LRGO-based sensor can be calculated from the LRGO-based sensor GF is smaller than that of doped silicon
following equation equation (1), which relates it to the relation strain sensors, wherein doped silicon shows significant
between electrical resistance change and the applied strain: decrease in GF with temperature increase. Although the
temperature dependency of doped silicon GF can be
⌬R/R decreased by heavily doping with concentration of 1020 cm⫺3
GF ⫽ (1)
but on the expense of the GF approximately 65, which is
comparable with that of LRGO-based strain sensor (Kulite
where R is the resistance of strain-free LRGO and ⌬R is the Semiconductor Products, 2004).
change in its electrical resistance owing to an applied strain å.
Based on GF calculations; the relation between the applied axial
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strain and GF at 20 (a), 40 (b), 60 (c) and 80°C (d) are shown 3.3 Strain sensing mechanism
in Figures 9(a-d). Figures 9(a-c) show that the LRGO-based Flexible LRGO-based strain sensor has shown in the present
sensor has a stable GF with an average values of 77.8, 77.74 and investigation a potential application as a highly sensitive strain
77.7 at 20, 40 and 60°C, respectively, with a standard error of the sensor. Therefore, the underlying mechanism should be
mean of approximately ⫾0.2. On contrary, the GF measurement clearly investigated to achieve better sensitivity and stability of
at 80°C shows a large error bars where the average value of the our novel LRGO-based strain sensor in the future.
Figure 9 Relation between GF of LRGO-based sensor and axial strain at 20 (a), 40 (b), 60 (c) and 80°C (d)
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Figure 10 Schematic illustration of resistance change mechanism due to change in contact area between the overlapped flakes
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Pimenta, M., Dresselhaus, G., Dresselhaus, M.S., Corresponding author
Cancado, L., Jorio, A. and Saito, R. (2007), “Studying Ahmed Abd El-Moneim can be contacted at:
disorder in graphite-based systems by Raman ahmed.abdelmoneim@ejust.edu.eg
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