Technical Data Sheet

DOWSIL™ Q1-9226 Thermally Conductive Adhesive

FEATURES & BENEFITS Two-part, semi-flowable thermally conductive adhesive

• Mix ratio: 1 to 1
• Accelerated heat cure APPLICATIONS
• Self priming adhesion to many • DOWSIL™ Q1-9226 Thermally Conductive Adhesive typical applications
substrates include bonding organic and ceramic substrates to heat sinks for control
• Long pot life for ease of use modules in automotive applications

COMPOSITION TYPICAL PROPERTIES

• Thermally conductive filler Specification Writers: These values are not intended for use in preparing
specifications.
• Two part silicone adhesive
Property Unit Result
One Part or Two Part Two
Color Gray
Viscosity (Part A) cP 48,000
Pa-sec 48
mPa-sec 48,000
Viscosity (Part B) cP 43,000
Pa-sec 43
mPa-sec 43,000
Viscosity (Mixed) cP 59,000
Pa-sec 59
mPa-sec 59,000
Specific Gravity (Cured) 2.14
Durometer Shore A 67
Tensile Strength psi 600
MPa 4.15
kg/cm2 42
Elongation % 124
Unprimed Adhesion - Lap Shear (Al) psi 375
MPa 2.6
N/cm2 260
Dielectric Strength volts/mil 630
kV/mm 25
Thermal Conductivity (hot disk) btu/hr-ft-°F 0.46
W/mK 0.8

DESCRIPTION are continually designed to deliver

The heat-cure, thermally conductive higher performance. Especially in the
adhesives produce no by-products in area of consumer devices, there is also
the cure process, allowing their use in a continual trend towards smaller,
deep section and complete more compact designs. In combination
confinement. These adhesives will these factors typically mean that more
develop good, primerless adhesion to a heat is generated in the device.
variety of common substrates Thermal management of PCB system
including metals, ceramics, epoxy assemblies is a primary concern of
laminate boards, reactive materials and design engineers. A cooler device
filled plastics. PCB system assemblies allows for more efficient operation and
better
reliability over the life of the device. PROCESSING/CURING off after application. After
As such, thermally conductive Addition-cure silicones should be application, primers should be
compounds play an integral role cured at 100°C (212°F) or above. thoroughly air dried prior to
here. Thermally conductive materials The cure rate is rapidly accelerated application of the silicone elastomer.
act as a thermal “bridge” to remove with heat (see heat-cure times in Alternatively, use a low-viscosity
heat from a heat source (device) to Typical Properties table). For thicker primerless adhesive to pot your
the ambient via a heat transfer media sections, a pre-cure at 70°C (158°F) components. Poor adhesion can be
(i.e. heat sink). These materials have may be necessary to reduce voids in experienced on plastic or rubber
properties such as low thermal the elastomer. Length of pre-cure substrates that are highly plasticized,
resistance, high thermal will depend on section thickness and since the mobile plasticizers act as
conductivity, and can achieve thin confinement of adhesive. It is release agents. Small-scale
Bond Line Thicknesses (BLTs) recommended that 30 minutes at laboratory evaluation of all
which can help to improve the 70°C (158°F) be used as a starting substrates is recommended before
transfer of heat away from the point for determining necessary pre- production trials are made. In
device. cure time. Addition-curing materials general, increasing the cure
contain all the ingredients needed for temperature and/or cure time will
APPLICATION METHODS cure with no by-products from the improve the ultimate adhesion.
• Automated or manual dispensing cure mechanism. Deep-section or
confined cures are possible. Cure USEFUL TEMPERATURE
SUBSTRATE TESTING progresses evenly throughout the RANGES
To ensure maximum bond strength material. These products generally For most uses, silicone adhesives
for adhesives on a particular have long working times. should be operational over a
substrate, 100 percent cohesive temperature range of -45 to 200°C
failure of the adhesive in a lap shear POT LIFE AND CURE (-49 to 392°F) for long periods of
or similar adhesive strength test is RATE time. However, at both the low and
needed. This ensures compatibility Cure reaction begins with the mixing high temperature ends of the
of the adhesive with the substrate process. Initially, cure is evidenced spectrum, behavior of the materials
being considered. Also, this test can by a gradual increase in viscosity, and performance in particular
be used to determine minimum cure followed by gelation and conversion applications can become more
time or to detect the presence of to its final state. Pot life is defined as complex and require additional
surface contaminants such as mold the time required for viscosity to considerations. For low-temperature
release agents, oils, greases and double after Parts A and B (base and performance, thermal cycling to
oxide films. curing agent) are mixed. conditions such as -55°C (-67°F)
may be possible for most products,
MIXING AND DE-AIRING ADHESION but performance should be verified
Upon standing, some filler may for your parts or assemblies. Factors
Dow silicone adhesives are specially
settle to the bottom of the liquid after that may influence performance are
formulated to provide unprimed
several weeks. To ensure a uniform configuration and stress sensitivity
adhesion to many reactive metals,
product mix, the material in each of components, cooling rates and
ceramics and glass, as well as to
container should be thoroughly hold times, and prior temperature
selected laminates, resins and
mixed prior to use. Two-part history. At the high-temperature end,
plastics. However, good adhesion
materials should be mixed in the the durability of the cured silicone
cannot be expected on non-reactive
proper ratio either by weight or elastomer is time and temperature
metal substrates or non-reactive
dependent. As expected, the higher
volume. The presence of light- plastic surfaces such as Teflon®,
colored streaks or marbling indicates polyethylene or polypropylene. the temperature, the shorter the time
inadequate mixing. Automated Special surface treatments such as the material will remain useable.
airless dispense equipment can be chemical etching or plasma
used to reduce or avoid the need to treatment can sometimes provide a SOLVENT EXPOSURE
de-air. If de-airing is required to reactive surface and promote In general, the product is resistance
reduce voids in the cured elastomer, adhesion to these types of substrates. to minimal or intermittent solvent
consider a vacuum de-air schedule of Dow primers can be used to increase exposure, however best practice is to
> 8 inches Hg (or a residual pressure the chemical activity on difficult avoid solvent exposure altogether.
of 10–0 mm of Hg) for 10 minutes or substrates. For best results, the
until bubbling subsides. primer should be applied in a very
thin, uniform coating and then wiped

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Teflon is a registered trademarks of E. I. du Pont de Nemours and Company or its affiliates.
DOWSIL™ Q1-9226 Thermally Conductive Adhesive
© 2017 The Dow Chemical Company. All rights reserved. Form No. 11-3059-01 A
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