TECHNICAL BULLETIN

ALPHA® SnCX Plus 07, SnCX Plus 00

Silver Free Alloy for Wave and Selective Soldering

DESCRIPTION

ALPHA SnCX Plus 07 is a no-silver, lead-free alloy suitable for use as a replacement for SnPb,
SAC305, and other low-silver SAC alloys in wave solder, selective soldering, lead tinning and
rework processes. ALPHA SnCX Plus 07 has been engineered to minimize copper dissolution
as compared to silver-bearing alloys and to improve total cost of ownership. The ALPHA SnCX
Plus 00 variant is used as a replenishment alloy in solder baths with elevated copper levels. As
with all Alpha bar solder, Alpha’s proprietary Vaculoy® manufacturing process is used to remove
certain impurities, particularly oxides. The product is enhanced with the addition of other
elements designed to further improve alloy physical and mechanical properties, reduce
drossing, increase wetting speed and force, and improve joint reliability.

READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT

FEATURES AND BENEFITS

Features:
• RELIABILITY - Comparable to silver-bearing alloys (i.e., SAC305) and other enhanced
Sn99.3Cu0.7 alloys in thermal fatigue resistance, lap shear, and pin pull performance
• YIELD - Excellent production yields; outperforms Sn99.3Cu0.7 based materials
• COPPER EROSION - Low erosion in long, hot exposure soldering process
• DROSS GENERATION - Lowest in class due to the Vaculoy process in conjunction with the
addition of a dross reducing agent
• SOLDER FILLET SURFACE - Smooth and bright with no surface crack

Benefits:
• Lowers Total Cost of Ownership due to the lower material cost, high yields, and low dross
generation
• Excellent mechanical reliability
• Provides very good solderability due to the fast wetting speed
• Reduces erosion of copper plating during rework which improves reliability
• Friendlier and less aggressive to solder pot material as compared to silver-bearing alloys
• Delivers good performance across different soldering processes

The proprietary Vaculoy process is a highly effective method for removing included oxides from
the solder. This is extremely important because included oxides generate excessive drossing

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and increases the viscosity of the solder. Solder with higher viscosity can result in increased
soldering defects (i.e., solder bridging).

APPLICATION GUIDELINES

ALPHA SnCX Plus 07 is suitable for wave soldering, selective soldering, lead tinning and
reworking both through hole and surface mount components in a lead-free process. It is suited
to single side and relatively complex, dual-sided, mixed technology boards. A solder pot
temperature of 255 to 270 °C (491 to 518 °F) is recommended with a contact time 2.3 to 3.5
seconds. For suitable wave solder fluxes, contact your local sales representative. Solder
debris reclaim services including dedicated lead-free containers is also available. Please
consult your local Alpha sales office.

TECHNICAL DATA

Complies with all requirements of RoHS Directive (Article 4.1 of the European Directive
2015/863/EU). Alloy specification for Maximum Lead (Pb) Content = 0.05%.

Material Property Units ALPHA SnCX Plus 07

Melting Temperature °C ~ 227
Hardness HV 9.4
Density g/cc 7.30
Specific Heat Capacity (@ 100 °C) J/g/°C 0.198
(30 to 100 °C) µm/m °C 23.8
Thermal Expansion Coefficient
(100 to 180 °C) µm/m °C 24.3
Toughness J 51.2
Tensile Stress MPa 42.0
Tensile Strain % 7.6
Yield Stress MPa 33.4
Elongation % 33.1

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RECOMMENDED WAVE SOLDER PROCESS SETTINGS

Wave Configuration Process Parameter Suggested Process Settings

Pot Temperature 255 to 270 °C (491 to 518 °F)
Conveyor Speed 1.0 to 1.5 m/min (3.3 to 5 ft/min)
Contact Time 2.3 to 3.5 seconds
Single Wave
Wave Height 1/2 to 2/3 of board thickness
Dross Removal Once per 8 hour run time
Copper Check Every 8,000 boards until 40,000
Pot Temperature 255 to 270 °C (491 to 518 °F)
Conveyor Speed 1.0 to 1.5 m/min (3.3 to 5 ft/min)
Dual Wave Contact Time 3.0 to 4.5 seconds
Wave Height 1/2 to 2/3 of board thickness
Dross Removal Once per 8 hour run time

MANAGEMENT OF COPPER LEVELS IN THE SOLDER BATH

Copper should be controlled in the solder bath between 0.7% and 1.0%
Management of the copper level in the wave solder bath is critical to ensure low defects in the
soldering process. There is a tendency for the copper levels within a high tin-bearing alloy wave
solder bath to increase due to copper dissolution from the PCB. This effect increases based on
the level of exposed copper on the assembly, as in the case of boards using OSP pad finishes.

Studies have shown a typical leaching rate of 0.01% Cu per 1000 boards. As each process is
unique, this rate should be viewed as a guideline only.

It is recommended that the copper is controlled at between 0.7% and max 1.0% for ALPHA
SnCX Plus 07 alloy. If the copper levels are higher than 1.0% then this will increase the liquidus
temperature which in turn may mean that the solder bath temperature must be increased to
maintain the process yields.

The copper levels in the bath can be controlled by means of adding ALPHA SnCX Plus 00 to
the wave solder pot. It may be the case that equilibrium can be attained by continuing with
ALPHA SnCX Plus 00 additions as the only means of solder top up. However, each process is
unique, and we recommend regular analysis of the solder bath to maintain good control of
copper levels. This analysis service is available from Alpha. Contact your local sales office for
details.

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RECOMMENDED ACTION LEVELS FOR WAVE SOLDER IMPURITIES

Please find below a list of recommended action levels for wave solder bath impurities. For
information of specific action plans to bring your solder bath back to an acceptable condition,
please contact your local sales office.

Element Action Levels Notes

Sn BAL No Action level.
Pb 0.07 RoHS Directive 2015/863/EU states a maximum lead content of 0.1%.
As 0.03 Levels greater than 0.03% can cause de-wetting.
ALPHA SnCX Plus 07 is tolerant to copper levels up to 1.0%. Copper-free
Cu 1.00 ALPHA SnCX Plus 00 should be added to maintain copper levels. Levels above
1.0% may cause more bridging.
Lead-free alloys are tolerant to Bi up to 1.0%. However, if levels above 0.20%
Bi 0.20 are detected, this indicates possible contamination issues that should be
investigated.
Levels greater than 0.003% may cause higher levels of bridging and icicling, as
Zn 0.003 well as a greater level of surface oxidation in the solder bath.
Greater than 0.02% iron can be an indicator of pot erosion and may cause gritty
Fe 0.02 joint formation and the formation of FeSn2 IMC needles that can cause bridging.
Silver levels of 4% are used in some SAC alloys. However, if the levels in
Ag 0.50 ALPHA SnCX Plus 07 rise above 0.5%, then an investigation should be held to
establish the cause. Solderability should not be affected.
Lead-free alloys are tolerant to Sb up to 1.0%. However, if levels above 0.20%
Sb 0.20 are detected, this indicates probable contamination issues that should be
investigated.
Levels greater than 0.04% may start to slow the wetting speed and could affect
Ni 0.05 the hole fill performance. If process performance is acceptable then levels up to
0.05% are OK.
RoHS Directive 2015/863/EU states a maximum cadmium content of 0.01%.
Cd 0.003 Levels of 0.003% may cause higher levels of bridging and icicling.
Levels greater than 0.002% may cause higher levels of bridging and icicling, as
Al 0.002 well as a greater level of surface oxidation in the solder bath.
Au 0.10 At levels above 0.1%, there may be some problems with joint strength.

AVAILABILITY

ALPHA SnCX Plus 07 is available in 1kg (2.2lb) bar, chunks, feeder ingots and Autofeed wire.

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RECYCLING SERVICES

We provide safe and efficient recycling services to help companies

meet their environmental and legislative requirements and at the
same time, maximize the value of their waste streams. Our service
collects solder dross, solder scrap, and various forms of solder
paste waste. Please contact your local sales representative for
recycling capabilities in your area or link here.

SAFETY & WARNING

It is recommended that the company/operator read and review the Safety Data Sheets for the
appropriate health and safety warnings before use. Safety Data Sheets are available at
MacdermidAlpha.com/assembly-solutions/knowledge-base.

STORAGE

Store the solder bar in a cool, dry and non-corrosive environment. Wrap up the solder bar when
not in use to reduce exposure to the environment.

CONTACT INFORMATION

To confirm this document is the most recent version, please contact

Assembly@MacDermidAlpha.com
www.macdermidalpha.com

North America Europe Asia

109 Corporate Blvd. Unit 2, Genesis Business Park 8/F., Paul Y. Centre
South Plainfield, NJ 07080, USA Albert Drive 51 Hung To Road
1.800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
44.01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE. Emergency directory assistance: Chemtrec 1 - 800 - 424 - 9300.

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF
MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all
other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer
under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct,
indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies
operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product
failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold
harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to use any product in a
manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.

© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks or trademarks of MacDermid, Inc.
and its group of companies in the United States and/or other countries.

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