Wah Wang Data Sheet for 5mm Super Bright Green LED

5A3 Series
Angle: 15°
Class: Q

Part No: WW05A3SGQ4-N

UKAI BILBAO UKAI BARCELONA UKAI MADRID

Ribera Elorrieta 7C C/ Orient 78-84 1º 7ª (Ed. Inbisa) Avda Andalucía 2, 2ª planta local 211
48015 Bilbao 08011 St. Cugat del Vallés 28702 San Sebastián de los Reyes
Teléfono: 94 474 5252 Teléfono: 93 284 0898 Teléfono: 91 659 0328
Fax: 94 475 9710 Fax: 93 210 6765 Fax: 91 659 0558
e-mail: ukai@ukai.com e-mail: ukaibcn@ukai.com e-mail: ukaimad@ukai.com

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Data Sheet For 5mm Super Bright Green LED – 5A3 Series Angle 15° Class: Q

Features
• Standard T-1 Diameter Type Package.
• General Purpose Leads
• Reliable and Rugged

Absolute Maximum Ratings at Ta=25℃

Parameter MAX. Unit Package Dimensions
Power Dissipation 100 mW
5.0(.197)
Peak Forward Current 5.8(.228)
100 mA
(≦1/10 Duty Cycle, 0.1ms Pulse Wide) 4.98(.196)

Continuous Forward Current 20 mA

8.7(.343)
Derating Linear From 50°C 0.4 mA/°C 0.6
(.024)
1.0(.04)
Reverse Voltage 5 V 25.4(1.0) 0.5(.02)
MIN.
Operating Temperature Range -40°C to +80°C 0.5(.02)

Storage Temperature Range -40°C to +80°C

Lead Soldering Temperature 2.54(.10)
260°C for 3 Seconds 1.5(.06)MIN
[ 4mm(.157”) From Body] NOM.

Electrical Optical Characteristics at Ta=25°C

Dominant Wavelength
Luminous Intensity Forward Voltage / Viewing
λd/ nm
Source Iv / mcd V Angle /
Part Number Lens color IF = 20mA
Color IF = 20mA (Note 5) IF = 20mA Deg
(Note8)
(Note 6)
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
WW05A3SGQ4-N Water Clear Green 515 --- 525 13800 18000 --- --- 3.2 4.0 15∘
Reverse Voltage = 5V Reverse Current = 50µA

Notes:
1. All dimensions are in millimeter.
2. Tolerance of measurement is ±0.25mm(.01”) unless others otherwise noted.
3. Protruded resin under flanges is 1.0mm(0.4”) max.
4. Lead spacing is measured where the leads emerge from the package.
5. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
Tolerance of measurement of luminous intensity is ±15%
6. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
It use many parameters that correspond to the CIE 1931 2°
Tolerance of measurement of angle is ±5 degree
7. Caution in ESD: Static Electricity and surge damages the LED. lt is recommended to use a wrist band or anti-electrostatic
glove when handling the LED.All devices, equipment and machinery must be properly grounded.
8. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which
defines the color of the device.
9. Specifications are subject to change without notice.

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 Typical Characteristic for Super Bright Green LED
Forward Current vs. Dominant Wavelength
Chromaticity Coordinate (λD)

Dominant Wavelength λD (nm)

0.90
555
Ta = 25 C
0.80 545
20mA 5mA (536nm)
(525nm) 535
0.70
50mA 1mA (544nm)
y (514nm) 525
0.60
515
100mA (506nm)
0.50 505

0.40 495
0 0.10 0.20 0.30 0.40 0.50 1 5 10 20 50 100
x Forward Current IFP (mA)

Ambient Temperature vs.

Spectrum Dominant Wavelength Directivity (Angle : 15 )
Relative Emission Intensity (a.u.)

Dominant Wavelength λD (nm)

1.2 531
0 10
1 20
1.0 529 Ta = 25 C 30

Relative Luminosity (a.u.)

IF = 20mA 40
0.8 527
50
0.6 525
0.5 60
0.4 523
70
0.2 521
80
0 519 0
400 450 500 550 600 650 700 -40 -20 0 20 40 60 80 100 90 60 30 0 0.5 1
90
Wavelength λ(nm)
Ambient Temperature Ta ( C) Radiation Angle

Forward Voltage vs. Ambient Temperature vs. Ambient Temperature vs.

Forward Current Forward Voltage Relative Luminosity
200 5.4
Ta = 25 C IFP=20mA 2.0
5.0
Relative Luminosity (a.u.)

100 IFP = 20mA

Forward Current IFP (mA)

50 4.6
Forward Voltage VF (V)

1.0
20 4.2

10 3.8 0.5

5 3.4

3.0
1 2.6 0.2
2.5 3.0 3.5 4.0 4.5 5.0 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward Voltage ( V )
Ambient Temperature Ta ( C )
Ambient Temperature Ta ( C )

Duty Ratio vs. Forward Current vs. Ambient Temperature vs.

Allowable Forward Current Relative Lumiinosity Allowable Forward Current
200 3.5 40
Allowable Forward Current IFP (mA)

Ta = 25 C Ta = 25 C
Allowable Forward Current IFP (mA)

3.0
Relative Luminosity (a.u.)

100
2.5 30

50 2.0
20
1.5
30

20 1.0
10
0.5

10 0
1 5 10 20 50 100 0 20 40 60 80 100 120 0
0 20 40 60 80 100
Duty Ratio ( % ) Forward Current IFP (mA)
Ambient Temperature ( C )

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 CAUTIONS- Super Bright LED
(1) Lead Forming
a. At least 3mm from the base of the epoxy bulb should be keep when forming leads.
b. Do not use the base of the leadframe as a fulcrum during lead forming.
Lead forming should be done before soldering.
c. Because the stress to the base may damage the characteristics or it may break the LEDs, do not apply any bending stress to the base of the lead
d. When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly aligned with the leads of the LEDs. Stress at the leads should be avoid when the LEDs are mounted on the PCB,
because it causes damage to the epoxy resin and this will degrade the LEDs.

(2) Storage
a. The LEDs should be stored at stored at 30 C or less and 70%RH or less after being shipped and the storage life limits are 3 months.
b. If the LEDs are stored more then 3 months, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
c. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.

(3) Static Electricity

a. Static electricity or surge voltage damages the LEDs.
b. It is recommended that a wristband or an anti-electrostatic glove be used when handling the LEDs.
c. All devices, equipment and machinery must be properly grounded.
d. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
e. Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V at IF=0.5mA)

(4) Heat Generation

a. Thermal design of the end product was most importance. Please consider the heat generation of the LED when making the system design.
b. The thermal resistance of the circuit board and density of LED placement on the board, as well as other components was the important factor affecting the coefficient of temperature increase per input
electric power. It must be avoid intense heat generation and operate within the maximum ratings given in the specification.
c. The operating current should be decided after considering the ambient maximum temperature of LEDs.

(5) Cleaning
a. It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
b. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs would occur.

(6) Safety Guideline for Human Eyes

a. In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety (IEC 825-1).Since then, this standard has been applied for diffused light sources (LEDs) as well as
lasers.In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source.
b. In 2001 IC 60825-1 Amendment 2 converted the laser class into 7 classes for end products.
c. Components are excluded from this system. Products which contain visible LEDs are now classified as class 1. Products containing UV LEDs can be classified as class 2 in cases where viewing angles
are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. For these systems it is recommended to avoid long term exposure. It is also recommended to follow the ICE
regulations regarding safety and labeling of products.

(7) Soldering Condition for LED Lamps

a Careful attention should be paid during soldering.
b. Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommender.
c. Recommender soldering conditions
Dip Soldering Soldering
Pre-Heat 120°C Max Temperature 350°C Max
Pre-Heat Time 60 seconds Max Soldering 3 seconds Max
Solder Bath 260°C Max Time No closer than 3 mm from the
Temperature Position base of the epoxy bulb.
Dipping Time 10 seconds Max
Dipping Position No lower than 3 mm from the base of
the epoxy bulb.
d. Do not apply any stress to the lead particularly when heated.
The LEDs must not be repositioned after soldering.
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.
Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may
be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur.
LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.

When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.

(8) Others
a. Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. Keeping the Normal Forward to 20 mA.
b. The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household
appliances). Consult manufacturer’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support
systems and safety devices).
IF
Rx
IF = V - VF
VF Rx

V
c. User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from manufacturer. When defective LEDs are found, the User shall inform manufacturer
directly before disassembling or analysis.
d. The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
e. The appearance and specifications of the product may be modified for improvement without notice.

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