Cla1 Batch1 Key-1

College of Engineering and Technology
B.Tech - Mechanical Engineering
Academic Year: IIIrd year Semester: V Max Mark:25 Subject Code: 18MEO122J
Title: ELECTRONICS THERMAL MANAGEMENT Duration: 1 hour
Type of Test: CLA-1
Key Set A
Part A (Answer all)

1. (a) Thermal runaway (1 mark) 2. (b) Electrical Overstress (1 mark) 3. (a) Electronic
Bonding Energy (1 mark) 4. (a) Energy balance equation (1 mark) 5. (a) Translational
Energy (1 mark)
Part B (Answer any two)

6. Explain semiconductor technology trends
gies and Applications
Change is hardly something new within the semiconductor industry. In line with
Gordon Moore’s 1965 observation (now known as Moore’s law), the number of
transistors on an integrated circuit has doubled roughly every two years for more than
fifty years. This constant technological development has facilitated the creation of a
seemingly endless stream of new devices that have become central to daily life in the
twenty-first century. While it may be easy to take change in the field of technology for
granted, recent industry transformations tied to new semiconductor technologies and
applications deserve recognition. (4 mark)
7. Discus one-dimensional heat conduction equation for a plane wall The

one-dimensional heat conduction equation for a plane wall describes how heat is
conducted through a solid material along a single direction. It is a fundamental
equation in heat transfer and is used to analyze temperature distribution within a solid
wall over time. The equation is based on Fourier's Law of Heat Conduction, which
states that the rate of heat transfer through a material is directly proportional to the
temperature gradient and the cross-sectional area and inversely proportional to the
material's thermal conductivity. (2 mark) The one-dimensional heat conduction
equation for a plane wall is typically expressed as:
�� (��
��
��) + �� = 0
Where:
T is the temperature as a function of position x within the wall.
k is the thermal conductivity of the material.
Q represents any internal heat generation within the material (e.g., due to chemical
reactions or electrical resistance). (2 mark)
8. Discus general heat conduction equation

The general heat conduction equation describes how heat is transferred within a
material in three-dimensional space over time. It accounts for variations in
temperature with respect to both spatial coordinates (x, y, z) and time (t). This
equation is fundamental in the field of heat transfer and plays a crucial role in
understanding how heat is conducted through solids, liquids, and gases. The general
heat conduction equation is derived from the principles of conservation of energy and
Fourier's Law of Heat Conduction. (2 mark)
The general heat conduction equation is typically written as:

��
�� = ∇(��∇��) + ��
Where:
ρ is the material's density.
c is the material's specific heat capacity.
T is the temperature as a function of spatial coordinates (x, y, z) and time (t). ∇
represents the gradient operator, which acts on spatial coordinates. k is the
thermal conductivity of the material. It measures how well the material
conducts heat.
Q represents any internal heat generation within the material, often expressed
in terms of heat sources or sinks per unit volume. (2 mark)
9. Explain how the fins enhance heat transfer from a surface

Fins, also known as heat sinks or radiators, are commonly used in various
engineering applications to enhance heat transfer from a surface. They are typically
attached to a surface that needs to dissipate heat, such as electronic components,
engines, or heat exchangers. Fins are designed to increase the rate of heat transfer by
providing additional surface area for convection and radiation, thus improving the
cooling efficiency. Here's how fins enhance heat transfer: (2 mark)
Increased Surface Area: Fins extend outward from the base surface,
effectively increasing the available surface area for heat transfer. More surface area
means more opportunities for heat to be conducted, convected, or radiated away from
the object. This increased area allows for a higher heat transfer rate. (2 mark)
Conduction: Fins are typically made of materials with good thermal

conductivity, such as metals like aluminum or copper. Heat is conducted from the hot
surface into the fins, spreading it over a larger area. This spreading effect reduces the
temperature gradient between the base surface and the surrounding fluid. (1 mark)
Convection: As heat is conducted into the fins, it heats up the surrounding air
or fluid. The heated air or fluid near the fins rises due to its lower density, creating a
convective flow. This flow carries heat away from the fins, allowing fresh, cooler air
or fluid to take its place. Fins provide a larger contact area with the surrounding
medium, enhancing convective heat transfer. (1 mark)
Increased Heat Transfer Coefficient: Fins disrupt the boundary layer of air or
fluid near the surface. This disruption reduces the thickness of the boundary layer and
increases the heat transfer coefficient (h) for convection. The higher heat transfer
coefficient results in more efficient heat transfer from the surface to the surrounding
medium. (2 mark)
Radiation: In addition to conduction and convection, fins can also enhance

radiation heat transfer. Fins are usually designed with thin, extended surfaces, which
emit and absorb thermal radiation more effectively than a flat surface. This is
particularly important at high temperatures, where radiation becomes a significant
mode of heat transfer. (1 mark)
Thermal Resistance Reduction: By adding fins, the thermal resistance of the

system is reduced. The overall thermal resistance of a structure or component is
inversely proportional to its ability to dissipate heat. Fins act as a pathway for heat to
flow away from the source, reducing the overall thermal resistance of the system.
(1 mark)
Efficiency: Fins can significantly improve the efficiency of cooling systems.

They allow for the removal of more heat without the need for larger and more
complex cooling systems. This is particularly crucial in applications where space and
weight constraints are important, such as in electronics. (2 mark)
10. Explain thermal resistance concept

Thermal resistance is a concept used in heat transfer and thermal engineering
to describe the resistance that a material or a system offers to the flow of heat. It is
analogous to electrical resistance in electrical circuits and helps engineers and
scientists understand how effectively heat can flow through a material or a
combination of materials. Thermal resistance is particularly useful in analyzing and
designing heat transfer systems, such as those used in electronic devices, building
insulation, and heat exchangers. (2 mark)
Thermal resistance is typically denoted by the symbol "R" and is measured in
units of degrees Celsius per watt (°C/W). It quantifies how much temperature
difference (ΔT) is generated across a material or a system when a unit of heat power
(P) is applied. Mathematically, it can be expressed as:
∆��
�� = ��
Where:
R is the thermal resistance in °C/W.
ΔT is the temperature difference across the material or system in degrees Celsius (°C).
P is the heat power being transferred through the material or system in watts (W). (1
mark)
There are two common types of thermal resistance:
1. Conduction Thermal Resistance (Rconduction): This type of thermal resistance
relates to the resistance to heat flow through a solid material via conduction. It is
calculated using the formula:
��
�� = ��
Where:
L is the thickness of the material through which heat is
conducted. k is the thermal conductivity of the material.
A is the cross-sectional area through which heat is conducted. (1 mark)
This type of resistance describes how effectively heat is conducted through a

material. Materials with high thermal conductivity have lower conduction thermal
resistance. (1 mark)
2. Convection Thermal Resistance (R_convection): This type of thermal resistance

relates to the resistance to heat transfer between a solid surface and a fluid (liquid or
gas) due to convection. It is calculated using the formula:
1
�� = ℎ��
Where:
h is the convective heat transfer coefficient, which depends on the properties
of the fluid and the geometry of the surface.
A is the surface area over which convection occurs. (2 mark)
This type of resistance describes how effectively heat is exchanged between a
surface and the surrounding fluid. Higher convective heat transfer coefficients result
in lower convection thermal resistance. (1 mark)
Thermal resistance can also be additive in systems consisting of multiple
layers or components. In such cases, the total thermal resistance of the system can be
calculated by summing the individual thermal resistances of each component. This is
useful in designing systems like building walls, where different materials and layers
are involved. (2 mark)
Understanding and calculating thermal resistance is crucial for designing and
optimizing thermal systems to ensure efficient heat transfer and temperature
management in various applications. (2 mark)
If there is no internal heat generation, Q is zero.
This equation can be further simplified in steady-state conditions (when temperature

does not change with time) as:
�� (��
�� + �� =
0
��)
In this simplified form, the equation tells us that the heat flux (��
��) within the wall is
constant along the x-direction, meaning the rate of heat transfer remains constant as
you move through the wall. (2 mark)
The boundary conditions and material properties (thermal conductivity, internal heat
generation) will determine the specific temperature distribution within the wall.
Solving this equation allows engineers and scientists to predict how heat will flow
through a solid material, which is crucial for designing and analyzing various
engineering systems involving heat transfer, such as the design of building insulation,
electronic devices, and more. (4 mark)

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College of Engineering and Technology

B.Tech - Mechanical Engineering

Title: ELECTRONICS THERMAL MANAGEMENT Duration: 1 hour

Type of Test: CLA-1

Part A (Answer all)

Part B (Answer any two)

7. Discus one-dimensional heat conduction equation for a plane wall The

8. Discus general heat conduction equation

The general heat conduction equation is typically written as:

9. Explain how the fins enhance heat transfer from a surface

Conduction: Fins are typically made of materials with good thermal

Radiation: In addition to conduction and convection, fins can also enhance

Thermal Resistance Reduction: By adding fins, the thermal resistance of the

Efficiency: Fins can significantly improve the efficiency of cooling systems.

10. Explain thermal resistance concept

This type of resistance describes how effectively heat is conducted through a

2. Convection Thermal Resistance (R_convection): This type of thermal resistance

This equation can be further simplified in steady-state conditions (when temperature

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