HP 295 G6 Microtower PC

QuickSpecs HP 295 G6 Microtower PC
Overview
HP 295 G6 Microtower PC
Front Not Shown

1. Slim-height Bay - supporting an optical disk drive (1) PCI Express x16
(optional) (1) PCI x1
2. Power Button (1) PCI Express x1
3. Combo jack, Headphone/ Microphone (1) M.2 for WLAN
4. (2) USB 2.0 (1) M.2 2280 storage
5. (2) SuperSpeed USB 5 Gbps port1 (1) 3.5" or 2.5” internal HDD bay
6. (2) SuperSpeed USB 10 Gbps port1 (1) 3.5” or 2.5” internal HDD bay (share bay with caddy)
(1) 9.5mm internal optical drive bay
1. SuperSpeed USB 5Gbps signaling rate = USB 3.2 Gen1. SuperSpeed USB 10 Gbps signaling rate = USB 3.2 Gen2.
c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 1

Overview
Rear
1. Audio Line out 7. Serial Port
2. Audio Line in 8. Connector (2) SuperSpeed USB 5 Gbps
3. Standard lock slot 9. RJ-45 Network Connector
4 HDMI Port 10. 2nd Serial Port (Optional)
5. VGA Port 11. Integrated accessories cable lock
6. Connector (2) USB 2.0 port (Optional) 12. Power Cord Connector
13. Padlock Loop
Not Shown
(1) Parallel Port (Optional via PCIex1 slot) (1) 4 Serial Port PCIe Card (Optional via PCIex1 slot)*
(1) PS/2 Ports (Optional) (1) Internal Speaker (Optional)
(1) Intrusion Sensor (Optional)
*NOTE: Only available on selected models.

Standard Features and Configurable Modules
AT A GLANCE
• Windows 10 Pro, Windows 10 Home or FreeDos 2.0
• AMD PRO565 Chipset, latest AMD® Ryzen™ PRO, AMD® Ryzen™, and Athlon PRO processors with AMD Integrated
RadeonTM Vega Graphics
• Supports an optional discrete graphics card
• Integrated 10/100/1000 Ethernet Controller or Realtek ac 1x1+BT 4.2 LE with 1 Antenna
• Up to 64GB DDR4- 3200 Unbuffered Memory (UDIMM)1
• Independent monitor support via VGA/HDMI interfaces
• Supports both Hard Disk Drives and / M.2 PCIe NVMe Solid State Drives
• Up to 10 USB ports (including native 2 USB 2.0, 2 SuperSpeed USB 5Gbps ports and 2 SuperSpeed USB 10Gbps at front,
and native 2 SuperSpeed USB 5Gbps at rear and optional 2 USB 2.0 at rear) 2
• 180W/310W 90% HE power supply
• Security cable lock supported (sold separately)
• Integrated accessory cable lock helps secure cabled mouse, keyboard and accessories
• Intrusion sensor supported (Optional)
• Optional HP Care Service available; terms and conditions vary by country; certain restrictions and exclusions apply 3
• TPM 2.0 support (fTPM)4
1. Memory modules support data transfer rates up to 3200 MT/s; actual data rate is determined by the system’s configured processor. See
processor specifications for supported memory data rate.
2. SuperSpeed USB 10Gbps signaling rate = USB 3.2 Gen2. SuperSpeed USB 5Gbps signaling rate= USB 3.2 Gen1
3. HP Care Services are optional. Service levels and response times for HP Care Services may vary depending on your geographic location.
Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit http://www.hp.com/go/cpc. HP services are
governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have
additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of
service or the HP Limited Warranty provided with your HP Product.
4. TPM feature will be supported on machine pre-configured with FreeDOS, and will be default set as enabled in BIOS setup menu if the machine
is dTPM, but will be default set as disabled in BIOS setup menu if the machine is fTPM.
NOTE: See important legal disclosures for all listed specs in their respective features sections.

PRODUCT NAME
OPERATING SYSTEM
Preinstalled Windows 10 Pro 641
Windows 10 Home 641
Pre-installed (other) FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always
enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com/
PROCESSORS2
AMD® Ryzen™ 4000 Series Processors
AMD® Ryzen™ 7 PRO 4750G

65W, 8 Cores, 16 threads, 3.6 GHz base frequency, up to 4.4 GHz max 3.
384 KB L1 cache, 4 MB L2 cache, 8 MB L3 cache
Integrated RadeonTM Vega 8 Graphics
Supports DDR4 memory up to 3200 MT/s data rate

65W, 6 Cores, 12 threads, 3.7 GHz base frequency, up to 4.2 GHz max3.
384 KB L1 cache, 3 MB L2 cache,8 MB L3 cache
Integrated Radeon™ Vega 7 Graphics

65W, 4 Cores, 8 threads, 3.8 GHz base frequency, up to 4.0 GHz max3.
AMD® Ryzen™ 7 4700G

Integrated RadeonTM Vega 8 Graphics

384 KB L1 cache, 3 MB L2 cache,8 MB L3 cache


AMD® Ryzen™ 3000 Series Processors
APU AMD Ryzen™ 5 PRO 3400G



AMD® Athlon™ 3000 Series Processors
APU AMD Athlon™ Gold PRO 3150G

Integrated RadeonTM Graphics
2. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily
benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and
software configurations. AMD’s numbering is not a measurement of clock speed.
3. AMD Max Boost frequency performance varies depending on hardware, software and overall system configuration.
CHIPSET
AMD PRO565

GRAPHICS4
Integrated
AMD Integrated Radeon™ Vega Graphics
Discrete Graphics5
AMD Radeon™ RX550X 4GB DP+HDMI GFX
AMD Radeon™ R7 430 2GB DP+VGA GFX
AMD Radeon™ 520 1GB DP+VGA GFX
4. HD content required to view HD images.

5. Sold separately or as an optional feature.
MEMORY6
Form Factor
Microtower
Type
DDR4 2666 (Transfer rates up to 2666 MT/s)
DDR4 3200 (Transfer rates up to 3200 MT/s)
Maximum
64GB capacity
# of Slots
2 DIMM
4GB DDR4-2666 UDIMM NECC (1x4GB)
6. Running at 3200 MT/s when configure w/ Renoir 4000 -series APU.

STORAGE7
SATA3 - 3.5" or 2.5” HDDs
2TB 7200 RPM SATA Hard Disk Drive
1TB 7200 RPM SATA Hard Disk Drive
500GB 7200 RPM SATA Hard Disk Drive
M.2 Solid State Drives

128 GB M.2 2280 PCIe NVMe SSD
7. For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10)
of system disk is reserved for the system recovery software. Storage DriveLock does not work with Self Encrypting or Optane based storage.
OPTICAL DISK DRIVES 8

DVD-ROM 9.5mm
DVD-Writer 9.5mm
8. Optical drives are optional or add on features. Duplication of copyrighted material is strictly prohibited. Actual speeds may vary. Double Layer
media compatibility will widely vary with some home DVD players and DVD-ROM drives.
NETWORKING/COMMUNICATIONS 9
Networking
Integrated 10/100/1000M GbE LAN
Wi-Fi® and Bluetooth®

802.11 ac (1x1) Wi-Fi® and Bluetooth® 4.2 Combo
9. Wireless cards are optional or add-on features and requires separately purchased wireless access point and internet service. Availability of
public wireless access points limited.
AUDIO/MULTIMEDIA
Realtek ALC3601
Combo Jack, Headphone/ Microphone
Line-in/Line-out (3.5mm)
Support 2W Internal speaker

KEYBOARDS/POINTING DEVICES 10
Keyboards
USB Business Slim Wired Keyboard
HP USB Keyboard
Business Slim USB Antimicrobial Wired Keyboard (China)
Business Slim PS/2 Wired Keyboard
No KB Option
Mouse
Antimicrobial USB Mouse (China)
HP Optical USB Mouse
Universal Wired Mouse USB
USB Hardened Mouse (India)
HP PS/2 Mouse (for machine configured with PS/2 port)
No Mouse Option
10. Keyboards and mouse are optional or add-on features.
PORTS/SLOTS
Front
(1) Combo jack (Headphone/Microphone)
(2) USB 2.0
(2) SuperSpeed USB 5Gbps
(2) SuperSpeed USB 10Gbps
Not Shown
(2) DIMM
(1) PCIEX16
(1) PCIEX1
(1) PCI
(1) SATA-ODD
(2) SATA-HDD (2*3.5“, could support dual 2.5 drive caddy)
(1) M.2- PCIE SSD
(1) M.2 –WLAN
Rear
(1) Audio Line out
(1) Audio Line in
(1) HDMI Port
(1) VGA Port
(1) Serial Port
(2) USB 2.0 Port(optional)
(1) RJ-45
(2) USB 3.2 Gen1
Not Shown
(2) PS/2 Port (Optional)
(1) Parallel Port (Optional via PCIex1 slot)
(1) 4x Serial port (Optional via PCIex1 slot)
(1) Internal Speaker (Optional)
(1) Intrusion Sensor (Optional)

BAYS
(1) 9.5mm external slimline ODD bay
(1)3.5" internal HDD bay
(1)3.5 or 2.5” internal HDD bay (share bay)

SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS

Security and Protection
McAfee* LiveSafe™12
Productivity
Buy Office (sold separately)
Dropbox13
Xerox® DocuShare® (30 day free trial offer)14
ODD Playback
sMedio True DVD for HP
Movies
Netflix
App Stores and Content Purchasing

Amazon15
HP Utilities and Support

HP Documentation
HP JumpStart
HP Audio Switch16
HP Support Assistant
BTB
HP Setup Integrated OOBE
Hardware Enabling Drivers or software utility

HP System Event Utility
12. Free 1-year subscription of McAfee LiveSafe service included. Internet access required and not included. Subscription required after
expiration.
13. New Dropbox users are eligible to get 25 GB of Dropbox space free for 12 months from date of registration. For complete details and terms
of use, including cancellation policies, visit the Dropbox website at https://www.dropbox.com/help/space/hp-promotion. Internet service
required and not included.
14. Simply sign up and start using Xerox® DocuShare® Go. No credit card. No obligation. Data will become unavailable unless a subscription is
entered before the end of the 30 day free trial period. See visit http://www.xerox.com/docusharego for details.
15. Internet access required and not included. Apps sold separately.
16. Easily switch between speaker and microphone sources with intuitive controls and a consistent app experience.
*NOTE: Available for LA region only.

POWER
Power Supply
180 W
EStar Libra2 EPA90 (Gold) Full range 115V/230V
310 W
310W MT Sirius2 ENTL EPA90 (Gold) Full range 115V/230V
DIMENSIONS & WEIGHT

(configured with 1 HDD and 1 ODD)
Chassis (H x W x D)
13.3 x 6.12 x 11.7 in (337.4 x 155.4 x 297.2 mm)
System Weight
12.17 lbs / 5.52 kg
Packaging dimensions and weight Dimensions 11.30 x 15.75 x 19.65 in
287 x400 x499 mm
Weight 20.06 lb / 9.10 kg
Security Features
TPM 2.0 support (fTPM)17
Security cable slot
17.TPM feature will not be supported on machines pre-configured with FreeDOS. In selected countries, machines pre-configured with Windows
OS will be shipped with TPM disabled.
UNIT ENVIRONMENTAL AND OPERATING CONDITIONS

General Unit Operating Guidelines
Environmental and Industry • Keep the computer away from excessive moisture, direct moisture and the extremes of
heat and cold, to ensure that unit is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the
required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that
they are subject to each other's re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the
computer. Lint, dust and other foreign matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust
ventilation must be provided on the enclosure, and the same operating guidelines listed
above will still apply.
Temperature Range Operating: 5° to 35° C18
Non-operating: -30° to 60°18
Relative Humidity Operating: 5% to 90% (non-condensing at ambient)
Non-operating: 5% to 90% (non-condensing at ambient)
Maximum Altitude Operating: 5,000 m
(unpressurized) Non-operating: 50,000 ft (15240 m)
18. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum
rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and
declarations may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country. Search keyword generator on HP’s 3rd
party option store for solar generator accessories at http://www.hp.com/go/options.
*Based on EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption
(in accordance with US 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
ENERGY STAR® test method)
Normal Operation (Short idle) 35.98W 36.76W 36.52W
Normal Operation (Long idle) 33.27W 33.03W 33.26W
Sleep 1.08W 1.1W 1.27W
Off 0.27W 0.3W 0.26
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does
not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically
configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows®
operating system. Search keyword generator on HP’s 3rd party option store for solar generator accessories
at www.hp.com/go/options.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Short idle) 122.69 BTU/hr 125.35 BTU/hr 124.53 BTU/hr
Normal Operation (Long idle) 113.45 BTU/hr 112.63 BTU/hr 113.42 BTU/hr
Sleep 3.68 BTU/hr 3.75 BTU/hr 4.33 BTU/hr
Off 0.92 BTU/hr 1.02 BTU/hr 0.89 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for
one hour.
Declared Noise Emissions

Sound Power Sound Pressure
(in accordance with
(LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured – Idle 3.8 25.4

Fixed Disk – Random writes 4 27.9
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “3” years after the end
of production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking
Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the <Silver> level, see
http://www.epeat.net.
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product contains 28.2% post-consumer recycled plastic (by wt.)
• This product is 91.7% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Paperboard 1220 g
Internal: PAPER/Molded Pulp 520 g
PLASTIC/Polyethylene low density - LDPE 53 g
Material Usage This product does not contain any of the following substances in excess of regulatory limits
(refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances

• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information

for each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP
OEM customers who integrate and re-sell HP equipment.
Global Citizenship Report

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_1
4K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

SERVICE AND SUPPORT

On-site Warranty: One-year (1-1-1) limited warranty delivers, next business day service for parts and labor and includes free
support 24 x 7. One-year onsite and labor are not available in all countries. Service offers terms up to 3 years by choosing an
optional HP Care Pack. To choose the right level of service for your HP product, visit HP Care Pack Central:
http://www.hp.com/go/cpc.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in
your region.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not
available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical support applies only to HP-configured and third-party HP qualified hardware and software. 24 x 7 support may not be
available in some countries.
NOTE 4: HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your geographic
location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP
Services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase.
Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP
terms and conditions of service or the HP Limited Warranty provided with your HP Product.

Technical Specifications - Storage
GRAPHICS
AMD Radeon™ Vega Graphics (integrated)
Graphics Controller Integrated
DisplayPort™ Multimode capable; supports HDCP, DisplayPort™ Audio (2 streams), HBR2 link rates and Multi-
Stream Technology for a maximum of 3 displays connected to any output controlled by AMD®
Graphics
HDMI Supports HDMI 2.0a features
Supports HDCP 2.3
Supports audio over HDMI
VGA VGA output
Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated for
graphics as needed, to provide an optimal balance between graphics and system memory use.
Maximum Color Depth up to 10 bits/color
Graphics/Video API Support VP9 10b Dec HW
HDR
Rec. 2020
DX12
Max. Resolution (VGA) 2048 x 1536@60Hz
Max. Resolution (HDMI) 4096 x 2160@60Hz
Max. Resolution (DP) 4096 x 2160@60Hz
AMD® Radeon™ RX 550X 4 GB FH 2DP+HDMI

Engine Clock 1183MHz
Memory Clock 6 Gbps
Memory Size (width) 4 GB (128-bit)
Memory Type GDDR5
Max. Resolution (HDMI) 4096x2160 @ 60Hz
Max. Resolution (DP) 5120x2880 @ 60Hz
Multi Display Support 2 displays
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMI, DP
Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W) <50W
PCB form-factor with bracket LP (low profile) PCB with FH/LP bracket
AMD® Radeon™ R7 430 2GB VGA+DP 64bit Graphics Card

Engine Clock 780 MHz
Memory Clock 1100 MHz
Memory Type 256M x 32 GDDR5
Max. Resolution (HDMI) 2048x1536
Max. Resolution (DP) 4096x2160@60Hz
HDCP Compliance Yes
Rear I/O connectors (bracket) VGA+DP

PCB form-factor with bracket LP PCB with FH/LP bracket
AMD® Radeon™ R7 430 2GB GDDR5 2DP 64 bit Graphics Card

Engine Clock 780 MHz
Memory Clock 1100 MHz
Memory Type 256M x 32 GDDR5
Max. Resolution (DP) 4096x2160@60Hz
HDCP Compliance yes
Rear I/O connectors (bracket) DPx2
PCB form-factor with bracket LP PCB with FH/LP bracket

STORAGE1
2 TB 7.2K rpm SATA 6.0Gb/s 3.5” Capacity 2 TB
Hard Disk Drive Rotational Speed 7,200 rpm
Interface SATA 6.0 Gb/s
Cache, Multi-segmented 64 MB
(MB)
Height 1.028 in/26.11 mm
Width 4.0 in/101.6 mm
Depth 5.787 in/146.99 mm
Weight 1.38 lb/626 g
Operating Temperature 41° to 131° F (5° to 55° C)
1 TB 7.2K rpm SATA 6.0Gb/s 3.5” Capacity 1 TB

Hard Disk Drive Rotational Speed 7,200 rpm
Interface SATA 6.0 Gb/s
Buffer Size 32 MB
Logical Blocks 1,953,525,168
Seek Time (typical reads, Single Track: 2.0 ms
includes controller Average: 11 ms
overhead, including Full-Stroke: 21 ms
settling)
Height 1 in/2.54 cm
Width (nominal) Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
500 GB 7.2K rpm SATA 6.0Gb/s Capacity 500 GB

3.5” Hard Disk Drive Rotational Speed 7,200 rpm
Drive Type Serial ATA 3.0 (6.0 Gb/s)
Interface 32 MB
Buffer Size 976,773,168
Seek Time Single Track: 2.0 ms
Average: 11 ms
Full-Stroke: 21 ms
Height (nominal) 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm

128 GB M.2 2280 PCIe NVMe Drive Weight < 10g
Three Layer Cell SSD Capacity 128GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3x4
Maximum Sequential Read Up to 2800MB/s
Maximum Sequential Write Up to 600MB/s
Logical Blocks 250,069,680
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features APST; ASPM L1.2; NVME spec 1.2

Height 2.38mm
Length 80mm
Width 22mm

Height 2.38mm
Length 80mm
Width 22mm
256 GB M.2 2280 PCIe NVMe SSD Drive Weight < 10g
Capacity 256 GB
Height 2.38mm
Length 80mm

Width 22mm
Interface PCIE Gen3
512 GB M.2 2280 PCIe NVMe SSD Drive Weight < 10g
Capacity 512 GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3
500 GB 7200RPM 2.5in SATA HDD Capacity 500 GB

Rotational Speed 7,200 rpm
Interface SATA 6 Gb/s
Buffer Size 32 MB
Seek Time 12 ms (Average)
Height 0.267 in/6.8 mm (nominal)
Width (nominal) 2.75 in/70 mm (nominal)
1TB 7200RPM 2.5in SATA HDD Capacity 1 TB

Rotational Speed 7,200 rpm
Interface SATA 6 Gb/s
Buffer Size 32 MB
Seek Time 12 ms (Average)
Height 0.374 in/9.5 mm (nominal)
Width (nominal) 2.75 in/70 mm (nominal)

HP 9.5mm Desktop G2 Slim DVD Height 9.5 mm height
Writer Drive Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
DVD-RW, DVD+RW - Up to 8X
DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
Power DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non- Relative Humidity 10% to 80%
condensing) Maximum Wet Bulb Temperature 84° F (29° C)
HP 9.5mm Desktop G2 Slim DVD- Height 9.5 mm height

ROM Drive Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) Up to 0.31 lb (140g) without bezel
Read Speeds DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
DVD-RW, DVD+RW - Up to 8X
DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X

Access time Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non- Relative Humidity 10% to 80%
condensing) Maximum Wet Bulb Temperature 84° F (29° C)
For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of
system disk is reserved for the system recovery software. Storage DriveLock does not work with Self Encrypting or Optane based storage.

Technical Specifications - Audio
HIGH DEFINITION AUDIO
Type Integrated
HD Stereo Codec Realtek ALC3601
Audio I/O Ports Front

Combo jack, Headphone/ Microphone (Headphone-out 0.5 Ohm Output Impedance, expects
at least a 32 ohm load, Microphone-in 150-K ohm Input Impedance)
Rear
Line-out (190 ohms Output Impedance, expects at least a 10-K ohm load).
Mic-in (150-K ohm Input Impedance)
Line-in (Input the audio signal to system via the loopback cable)
When plug in all rear side jacks, can switch the function to 5.1 ch via audio GUI.
Internal Speaker Amplifier Codec embeded amp for supportting 2W mono speaker.
Multi-streaming Capable Multi-streaming can be enabled in the Realtek control panel to allow independent audio
streams to be sent to/from the front and rear jacks.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit,
44.1K/ 48 K/96K / 192K Hz for DAC and16 bit, 44.1K/ 48K/ 96K/ 192K Hz for ADC
Wavetable Syntheses Yes
Analog Audio Yes
# of Channels on Line-Out Stereo (Left channel / Right channel)
Internal Speaker Yes
External Speaker Jack 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally.

Technical Specifications - Networking
NETWORKING
Integrated Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-
10/100/1000 NIC 14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3
clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE
8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full
Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Performance Features TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB
(802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Interface PCIe + SMBus
NIC Device Driver Name PCIe GBE Ethernet Family Controller
Realtek 802.11ac (1x1) WiFi and Bluetooth® 4.2 Combo*

Wireless LAN Standards1 IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
1. Wireless access point and Internet service required and not included. Availability of public wireless access points limited.
Interoperability Wi-Fi® certified
Frequency Bands 802.11b/g/n • 2.402 – 2.482 GHz

NOTE: The FCC has declared products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 & 15.249 or otherwise disable those channels.
802.11a/n • 4.9 – 4.95 GHz (Japan)

• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps

• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)

Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and WiFi compliant 64/128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
2. Check latest software/driver release for updates on supported security features.
Network Architecture Ad-hoc (Peer to Peer)

Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b: +14dBm minimum

• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT40(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11n HT40(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
3. Maximum output power may vary by country according to local regulations.
Power Consumption • Transmit mode2.0 W

• Receive mode1.6 W
• Idle mode (PSP)180 mW (WLAN Associated)
• Idle mode50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled8 mW
Power Management ACPI and PCI Express compliant power management

802.11 compliant power saving mode
Receiver Sensitivity4 02.11b, 1Mbps: -93.5dBm maximum

802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g
(OFDM modulation).
Antenna type High efficiency antenna.

One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN
communications and Bluetooth communications
Form Factors PCI-Express M.2 MiniCard

Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight Type 2230 : 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)

Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)

Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)

Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology

Bluetooth® Specification 4.0/4.1/4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)

Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864
kbps symmetric (3-EV5)
Transmit Power The Bluetooth® component shall operate as a Class II Bluetooth® device with a maximum transmit
power of + 4 dBm for BR and EDR.
Receiver Sensitivity Legacy
Power Consumption Peak (Tx) 330 mW

Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Legacy : 0~79 (1 MHz/CH)

BLE : 0~39 (2 MHz/CH)
Electrical Interface USB 2.0 compliant
Bluetooth® Software Microsoft Windows Bluetooth® Software

Supported
Link Topology
Power Management ETS 300 328, ETS 300 826

Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth® Profiles FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Supported
Power Management Microsoft Windows ACPI, and USB Bus Support

Certifications

Certifications BT4.1-ESR 5/6/7 Compliance
Bluetooth® Profiles LE Link Layer Ping
Supported LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Technical Specifications - Power
POWER SUPPLY
Operating Voltage 90 – 264 VAC
Range
Rated Voltage Range 100-240V AC
Rated Line Frequency 50/60 HZ
Operating Line 47 – 63 Hz
Frequency
Rated Input Current 180W: <2.3A;
310W: <4A
Rated Input Current 180W active PFC
with Energy Efficient* 87/90/87% efficient at 20/50/100% load (115V)
Power Supply 88/91/88% efficient at 20/50/100% load (230V);
310W active PFC
87/90/87% efficient at 20/50/100% load (115V)
88/91/88% efficient at 20/50/100% load (230V)
DC Output +12.1V
Current Leakage Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as
(NFPA 99: 2102) required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that
contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal
polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care
facility or that contact patients in normal use. Per section 10.3.5.1.
Power Supply Fan 70*25mm (linear type)

Technical Specifications – Dimensions and weight
DIMENSIONS & WEIGHT
Chassis (H x W x D) 13.3 x 6.12 x 11.7 in (337.4 x 155.4 x 297.2 mm)
System Volume 15.1 L
System Weight* 12.17 lbs / 5.52 kg
Tower Stand N/A
(H x W x D)
Packaged 11.3 x 15.75 x 19.65 in
(H x W x D) 287 x 400 x 499 mm
Shipping Weight 20.06 lb / 9.10 kg
Palletization 6 units per layer
Profile 7 layer max
42 per pallet
Footprint
-85.31x39.37x47.24 in (2167 x 1000 x1200 mm)

Options and Accessories (sold separately and availability may vary by country)
AFTER MARKET OPTIONS
Type Description Part #
Memory HP 4GB DDR4-2666 DIMM 3TK85AA
HP 8GB DDR4-2666 DIMM 3TK87AA
HP 16GB DDR4-2666 DIMM 3TK83AA
HP 4GB DDR4-3200 DIMM 13L78AA
Storage HP 500GB 7200rpm 3.5 SATA 6.0Gb/s Smart IV Hard Drive QK554AA
HP 1TB 7200rpm SATA 6Gbps Hard Drive QK555AA
Graphics AMD Radeon R7 430 Card 1MX32AA
Security HP Keyed Cable Lock 10mm kit T1A62AA
Adapters HP HDMI Standard Cable Kit T6F94AA
Input HP USB Mouse QY777AA

HP Wired Desktop 320M Mouse 9VA80AA
HP USB Keyboard QY776AA
HP PS/2 Business Slim Keyboard N3R86AA
HP USB Business Slim Keyboard N3R87AA
HP Wired Desktop 320K Keyboard 9SR37AA
Others HP Business Headset v2 T4E61AA

Summary of Changes
Date of change: Version History: Description of change:
March 2, 2021 V1 to V2 Update Xerox specs and disclaimer updated in Software section
June 23, 2021 V2 to V3 Addition 64GB (2x32GB) DDR4 2666 and 64GB (2x32GB) DDR4 3200 to Memory section
July 23, 2021 V3 to V4 Correction 64GB in a ta a glance section and 64GB (2x32GB) DDR4 3200 10 Memory section
September 23, 2021 V4 to V5 Addition Environmental section
October 11, 2021 V5 to V6 Removal USB Type-C® DP Alt Mode Row removed from AMD Radeon™ Vega Graphics
(integrated) table in graphics section
V6 to V7
V7 to V8
V8 to V9
V9 to V10
Copyright © 2021 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein.
AMD and Radeon are trademarks of Advanced Micro Devices, Inc. Bluetooth is a trademark of its proprietor and used by HP Inc.
under license. USB-C® are trademarks of USB Implementers Forum. ENERGY STAR is a registered trademark of the U.S.
Environmental Protection Agency. Microsoft and Windows are either registered trademarks or trademarks of Microsoft
Corporation in the United States and/or other countries.

HP 295 G6 Microtower PC

Uploaded by

Copyright:

Available Formats

HP 295 G6 Microtower PC

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

HP 295 G6 Microtower PC

Uploaded by

Copyright:

Available Formats

QuickSpecs HP 295 G6 Microtower PC

Front Not Shown

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 1

*NOTE: Only available on selected models.

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 2

Standard Features and Configurable Modules

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 3

Standard Features and Configurable Modules

AMD® Ryzen™ 7 PRO 4750G

AMD® Ryzen™ 5 PRO 4650G

AMD® Ryzen™ 3 PRO 4350G

AMD® Ryzen™ 7 4700G

AMD® Ryzen™ 5 4600G

AMD® Ryzen™ 3 4300G

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 4

Standard Features and Configurable Modules

AMD® Ryzen™ 3000 Series Processors

APU AMD Ryzen™ 5 PRO 3400G

APU AMD Ryzen™ 5 PRO 3350G

APU AMD Ryzen™ 3 PRO 3200G

AMD® Athlon™ 3000 Series Processors

APU AMD Athlon™ Gold PRO 3150G

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 5

Standard Features and Configurable Modules

4. HD content required to view HD images.

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 6

Standard Features and Configurable Modules

M.2 Solid State Drives

OPTICAL DISK DRIVES 8

Wi-Fi® and Bluetooth®

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 7

Standard Features and Configurable Modules

10. Keyboards and mouse are optional or add-on features.

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 8

Standard Features and Configurable Modules

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 9

Standard Features and Configurable Modules

SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS

App Stores and Content Purchasing

HP Utilities and Support

Hardware Enabling Drivers or software utility

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 10

Standard Features and Configurable Modules

DIMENSIONS & WEIGHT

UNIT ENVIRONMENTAL AND OPERATING CONDITIONS

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 11

Standard Features and Configurable Modules

Normal Operation (Short idle) 35.98W 36.76W 36.52W

Normal Operation (Long idle) 33.27W 33.03W 33.26W

Sleep 1.08W 1.1W 1.27W

Off 0.27W 0.3W 0.26

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Sleep 3.68 BTU/hr 3.75 BTU/hr 4.33 BTU/hr

Off 0.92 BTU/hr 1.02 BTU/hr 0.89 BTU/hr

Declared Noise Emissions

Typically Configured – Idle 3.8 25.4

c06953032 — DA 16786 — EMEA — Version 6 — October 11, 2021 Page 12

Standard Features and Configurable Modules

Fixed Disk – Random writes 4 27.9

Batteries used in the product do not contain: