Standing Waves - L=n/2

F=v/n = V/2L/n = Vn/2L = Vn/2n/2 = 2Vn/2n = V/

Light E=hf K=mv
2
/2 = hf-u p=h/
DeBroglie f=E/h =h/mv Bonding Solids Fn=Fa+Fr
Bohr Coulomb F =Centripetal F
MV
2
/2=KZe
2
/r
2
K= 1/4H c0
Materials
Stress - o=F/A Elastic Mod E=o/c E= S/r0 (atomic spacing)
Strain - c=AL/L
Beam deflection - o=FL
3
/3EI F=Force L=Length
E=elastic mod I= wt
3
/12 w=width t=thickness
Fibre Composite
Ec=EmVm + EF(1-Vm) Ec=Elastic Mod(composite)
Em=E(matrix) Ef =E(Fibre) Vm=Volume(Matrix)
3D structure 3D repetition, No pattern =Amorphous
Physical and chemical properties relate to structure
FCC (4R)
2
=2a
2
a=2R\2 Co num = 12
Aluminium, Copper, Gold, Lead, Silver
BCC a=4R/\3 R=a\3/4 Co num = 8 apf=0.68
Chromium, Molydenum, Tungsten
HCP Co num = 12 apf =0.74
Cadmium, Zinc, Magnesium
Density Pc =nA/NaVc
Pc = Density n=Num of atoms/unit cell A=atomic weight
Na =6.022x10
23
atoms/mol Vc = Volume of Cell
Polymorphism Ability to mutate structure to suit
environment (Temp, pressure)
Crystalographic DirectionsR=2a+b = [2 1] for - add line
Miller Indicies - [2x 3y 2z]=[2 3 2]=[ ]=[3 2 3] yay
Crystal Defects Can have vacancies and substituents
Nv=Ne
(-Qv/kt)

Nv= num vacancies N=total atoms
Qv= Energy required for vacancy formation
t=Temp (K) k=1.38x10
-23
J/K
Solid Mixture- Solute = lowest concentration
Solvent = highest concentration
Substitutional- Replacement of atoms
Interstitial- Fill voids in structure
Atomic Radii must be different for good substitution
Crystal structure must be same for both
less electronegative difference, more likely substitutional
weight % = weight of element/total alloy weight
C1=(m1/m1+m2)x100
Engineering Stress - o=F/A0 (A0=area original)
Engineering Strain - c=AL/L0
True Stress - oT=F/A
True Strain - cT =ln(L/L0)
Total elongation to failure - cF=(Lf-L0)/L0
Total reduction in area =(A0 AF)/A0
Fracture Stress = oT at fracture = FF/AF
Fracture Toughness K1c=(o/E)ta or K1c=o \(ta) a=crack size
Ceramics Thermal Shock Resistance=oFK/Ea
K=thermal conductivity (K)
Grain Size Hardening - oGS=oA-o0=k/\d d= diameter
Obstacle Hardening - o=bsinu/L |=shear mod b=burgers
Work Hardening - oWH=oA-o0=ab\p |p=dislocation density
a= Force to cut on dislocation with another
Solid Solution Hardening - oSS=oA-o0= af(cm)\C
C=solute concentration |f cm extent and type of difference
Precipitation Hardening - oP=oA-o0 = f(Vf , S , FOBST)
Dispersion Hardening - oD=oA-o0=b/L |L=Particle spacing
Line Tension - T=b
2
/2


Stress = Force on object in tension, compression
or shear
Strain=objects response to stress via deformation
Yielding onset of plastic (permanent)
deformation, where the strain does NOT recover
on unloading. First point of departure from truly
elastic behaviour.
Yield strength stress at which yielding or
plastic deformation begins. Used for stress-
strain curves that show a sharp transition from
elastic to plastic behaviour.
Proof strength stress after a measurable
amount of plastic deformation eg 0.1% proof
stress. Used for materials that show a gradual
transition from elastic to plastic behaviour.
Work hardening region of plastic deformation
where the material gets harder (ie.
stronger) with increasing plastic strain.
Tensile strength Also called ultimate tensile
strength (UTS). Maximum engineering
stress (maximum applied load) achieved during
the test. Coincides with the transition from
uniform to non-uniform plastic deformation.
Total elongation to failure nominal strain to
failure, after correcting for any elastic
component of the strain. Also known as the
tensile ductility.
Fatigue - Fatigue is the failure of a material under
conditions of fluctuating load
Fatigue failure can be prevented, or its
consequences reduced by:
a) Lowering the applied stress
b) Eliminating stress concentrations, including
polishing the surface
c) Hardening the surface carburising, nitriding,
shot peening, etc.
d) Changing from a non-ferrous alloy to a ferrous
alloy
e) Rigorous quality control via non-destructive
testing for flaws
f) Providing component redundancy.
Creep - Creep is the time-dependent plastic strain
of a material under load at high temperatures
(relative to the melting temperature of the
material ie above 0.4Tm).
Toughness - is a measure of the work
done in fracturing the specimen it
is the area under the stress strain
Ductility - is a measure of how much
the material deforms before fracture
and is given by the total elongation
to failure (eF) or the total
reduction in area.








I=AQ/At Q=

Charge t=time I=Current
V=Va-Vb=EL E=Electric field L= length V=Volts
V=IR R=Resistance
o=1/p o= Conductivity p= Resistivity
I/A=E/p=oE A=Area
eE=Vd e=Electron mobility Vd =Vacancy density
o=n|e|e n=no. of conducting e
-
|e| is charge of e-
J=n|e|Vd
Ptotal=PT+Pi+Pd P=resistivity PT=thermal vibrations Pi=impurities
Pd=plastic deformation
PT=P0+oT T=temperature
o=(1/p)dp/dT
Pi=ACi(1-Ci) Ci=concentration of impurities
H=AQ/At H=Rate of thermal conductivity
H=(kA/L)AQ k=thermal conduct (material)
Intrinsic (Pure)
o=n|e|e+p|e|h p=No. holes/volume h=hole mobility
Extrinsic (doped)
N-Type - o=n|e|e Increase in valence carriers
P-Type - o=p|e|h Decrease in valence carriers
Dipole
E=P1/r
3
E=dipole E field r=distance p=dipole
P=ql q=charge l=distance p=dipole
P=-dU/dR
Attractiveness of Van Der Waal = -A/r
6
F0=(\k/m0)/2t
Diffusion
Nv/NA=e
(-Qv/kT)
Nv=No. Vacancies NA=No. Atoms
K=Boltzman constant Qv=required energy to form vacancy
J=(-D)dC/dX D= Diffusion coefficient
D=D0 e
(-Qv/kT)
X=\Dt t=time x=distance transfer
Polymers
Er(t)=o(t)/c0 Er(t)=relaxation modulus o(t)=stress at time t
o=(n)dc/dt n=viscosity
Optics E is perpendicular to B
E=cB B=magnetic field c=speed of light
Pr=I/c Pr=Radiation pressure I=amplitude
2
E=E0sin(kx-et+o) E0=Amplitude e=angular frequency
k=wave number o=phase factor
T=1/f T=period f=frequency
Ax==2t/k Ax=wavelength
=c/f
Superimposed wave
Et
2
=E01
2
+E02
2
+2E01E02cos(kx1-kx2)
Slits
Double
kdsinu -k(x1-x2)=A|
Max=> dsinu=m
Min=> dsinu=(m+1/2)
Ax=L/d d=slit width L=distance from source
Single
Min=>dsinu=m
Max=>dsinu=(m+1/2)
Thin film
Min=>dsinu=m
D=/4n1
FIBRE OPTICS
Sinuc=n2/n1
N1sinu1=M2sinu2
Numerical Aperture=\n1
2
-n2
2
Step distance L=d/tanu
Forms of corrosion
- uniform attack, galvanic corrosion, crevice corrosion
- pitting corrosion, intergranular corrosion,
- selective leaching, erosion corrosion, stress corrosion
Natural Passivity Al and Ni
Degredation of polymers
- Chemical attack, dissolution, swelling, radiation
- Thermal degradation, bio degradation
Rydberg
1/=R(1/n1
2
- 1/n2
2
)
Galvanic Series
Higher one is anode/oxidised (gets smaller)
Lower one is cathode/reduced (gets bigger)
UTS
oA=UTS
Critical angle
uc=1.22/D
FCC or BCC?
(#atoms/unit cell*density)/(Avagadro*a)
the lower value is correct
a= a for FCC or BCC depends on which one ur testing