<High Voltage Analog Switch series> P.

1/17

16-ch High Voltage Analog Switching IC

ECN3297TF
ECN3297 is 16-channel High Voltage analog switching IC with bleed resistors on which
latch-up free is realized by dielectric isolation technology.
High voltage and low ON-resistance MOS switches are used as output devices controlled
by a 3.3V or 5V signal. The ECN3297 is most suited to Ultrasound Imaging applications.

Functions
* High voltage and low on-resistance MOS switches integrated.
* 16bit shift resister integrated.
* Integrated bleed resistors on the outputs.
* Integrated clamping diodes for overvoltage protection positive overshoot.
Features
* Switch on-resistance: 19  typ. (VPP=100V,VNN=-100V,ISIG=5mA, 25oC)
* Switch breakdown voltage: 220V
* Latch-up free CMOS and High-Voltage drive circuit.
* Power up/down sequence of power supply is free.
* 48-pin TQFP Package (RoHS compliant)
VPP
LEVEL OUTPUT
L A T CHE SWITCHE
SHIFTER
SW0A
D VPP
LE
DIN CL
VNN
SW0B

CLK
VNN

16 BIT
SHIFT
REGISTE

VPP

Dout
SW15A
D
LE VPP
CL
VNN
SW15B

VNN
VDD LE CL VNN VPP RGND

Fig.1 Block diagram

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 2/17

ECN3297TF
1. General
This Specification shall be applied to the following semiconductor integrated circuit.

1) Parts name : ECN3297TF

2) Application : Ultrasound imaging scanner and others
3) Structure : Monolithic IC
4) Package : TQFP48

2. Absolute Maximum Ratings

Table 1 Absolute Maximum Ratings
No. Items Symbol Terminal Values Unit Note
o
1 Logic power supply voltage VDD VDD -0.5 to +7.0 V Ta＝25 C
o
2 VPP-VNN supply voltage - VPP，VNN 220 V Ta＝25 C
o
3 VPP Positive high voltage supply VPP VPP -0.5 to VNN+200 V Ta＝25 C
o
4 VNN negative high voltage supply VNN VNN -200 to +0.5 V Ta＝25 C
DIN, CLK, o
5 Logic input voltages VDD -0.5 to VDD+0.3 V Ta＝25 C
CL, LE
o
6 Analog signal range - SW0 to SW15 VNN to VPP V Ta＝25 C
o
7 Operating junction temperature Tjop - -20 to +125 C
o
8 Storage temperature Tstg - -55 to +150 C
TQFP48
9 Power dissipation Pw - 1.0 W o
Ta＝70 C

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 3/17

ECN3297TF
3. Electrical Characteristics
3.1 DC Characteristics
o
Table 2 DC Characteristics Ta=25 C VDD=5V
Spec
No. Items Symbol Unit Test conditions
Min Typ Max
 24 38 I SIG=5mA VPP=40V,
 17 27 I SIG=200mA VNN=-160V
Small signal switch on  19 27 I SIG=5mA VPP=100V,
1 RONS 
resistance  15 24 I SIG=200mA VNN=-100V
 19 25 I SIG=5mA VPP=160V,
 15 25 I SIG=200mA VNN=-40V
Small signal switch on VPP=100V, VNN=-100V
2 ΔRONS  5 20 %
resistance matching ISW=5mA
Large signal switch on VPP=100V I SIG=1A
3 RONL  16 － 
resistance VNN=-100V
Value of output bleed Output switch to RGND
4 RINT 20 35 50 k
resistance IRINT=0.5mA
Switch off leakage per VSIG=VPP-10V,
5 ISOL  1.0 10 A
switch or VNN+10V
6 DC offset switch (off) DCOFF  10 100 mV No load
7 DC offset switch (on) DCON  10 100 mV No load
8 Positive HV supply current IPPQ1  10 50 A All SWs off
Negative HV supply
9 INNQ1  -10 -50 A All SWs off
current
10 Positive HV supply current IPPQ2  10 50 A All SWs on, ISW=5mA
Negative HV supply
11 INNQ2  -10 -50 A All SWs on, ISW=5mA
current
VPP=40V
  7.0 50kHz
VNN=-160V
output
VPP=100V
12 IPP Supply current IPP   7.0 mA switching
VNN=-100V
frequency
VPP=160V
  7.0 without load
VNN=-40V
VPP=40V
  7.0 50kHz
VNN=-160V
output
VPP=100V
13 INN Supply current INN   7.0 mA switching
VNN=-100V
frequency
VPP=160V
  7.0 without load
VNN=-40V
14 Logic supply average current IDD   4.0 mA fCLK=5MHz,VDD=5.0V
Logic supply quiescent
15 IDDQ   10 A
current
16 Data out source current ISOR 0.45 0.70  mA VOUT=ＶDD-0.7V
17 Data out sink current ISINK 0.45 0.70  mA VOUT=0.7V

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 4/17

ECN3297TF
3.2 AC Characteristics
o
Table 3 AC Characteristics Ta=25 C VDD=5V
Spec
No. Items Symbol Unit Test conditions
Min Typ Max
1 SW Turn on time tON   5.0 s VSIG=VPP-10V, RL=10kΩ
2 SW Turn off time tOFF   5.0 s VSIG=VPP-10V, RL=10kΩ
50% duty cycle, fData=fCLK/2
  30 MHz
VDD=5.0V
3 Clock frequency fCLK
50% duty cycle, fData=fCLK/2
  20 MHz
VDD=3.3V
Clock delay time to
4 tDO 16  55 ns DOUT terminal,VDD=3.3V
data out
12  42 ns DOUT terminal,VDD=5.0V
+VSPK   150 VPP=40V, VNN=-160V,
-VSPK   -150 RL=50
+VSPK   150 VPP=100V, VNN=-100V,
5 Output voltage spike mV
-VSPK   -150 RL=50
+VSPK   150 VPP=160V, VNN=-40V,
-VSPK   -150 RL=50

o
Table 4 AC Characteristics (for reference purpose only) Ta=25 C VDD=5V
Spec
No. Items Symbol Unit Condition
Min Typ Max
Off capacitance SW
1 CSG (off)  6  pF 0V, 1MHz
to GND
On Capacitance SW
2 CSG (on)  15  pF 0V, 1MHz
to GND
-30 -33  dB f=5MHz, 1k//15pF load
3 SW off isolation KO
-54 -60  dB f=5MHz, 50 load
4 SW Crosstalk KCR -54 -60  dB f=5MHz, 50 load

Note: These items are not tested when shipped.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 5/17

ECN3297TF
4. Recommended Operating Conditions
Please operate in use within the limit of recommended operating conditions detailed in Table 5.

Table 5 Recommended Operating Conditions

No Items Symbol Recommended Value
1 Logic power supply voltage VDD 3.0V to 5.5V
2 Positive high voltage supply VPP 40V to 160V
3 Negative high voltage supply VNN -160V to 0V
4 VPP-VNN supply voltage - 40V to 200V
5 High-level input voltage VIH 0.9VDD to VDD
6 Low-level input voltage VIL 0V to 0.1VDD
7 Analog signal voltage peak to peak VSIG VNN to VPP
8 Operating free air-temperature Ta 0oC to 70oC
9 Switching frequency Fsw 50kHz max, Duty Cycle=50%
10 Set up time for LE TSD Min.60ns
11 Pulse width of LE TWLE Min.40ns
12 Time width of CL TWCL Min.40ns
13 Set up time DATA to Clock TSU Min.10ns
14 Hold time DATA from Clock Th Min.10ns
15 Maximum VSIG Slew Rate dV/dt Max.30V/ns

Attention ;
1) Power up/down sequence of power supply is arbitrary except GND terminal of IC must be powered-up
first and powered-down last.
2) It is indispensable to make there are not to exceed a maximum rated voltage by the occurrence of the
excessive voltage in case of investing and cutting of the power supply.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 6/17

ECN3297TF
5. Test Circuit

ＶPP-10V
ＩＣ ＩＣ ＩＣ
ＲL
10KΩ
ＶPP-10V ＩSOL
ＶOUT ＶOUT

OPEN

RGND
OPEN RGND RGND
ＶDD ＶDD 5V ＶDD
ＶPP ＶPP 5V ＶPP ＶPP ＶPP ＶPP
GND GND GND GND
ＶNN ＶNN GND ＶNN ＶNN ＶNN ＶNN

a) Switch OFF Leakage b) DC Offset ON/OFF c) ＴON/TOFF

ＩＣ ＩＣ ＩＣ
ＶIN=10Vp-p ＶIN=10Vp-p
@5MHz @5MHz ＶOUT +Ｖspk
ＶOUT
～ ～
50Ω
-Ｖspk
50Ω
ＶOUT
NC
ＲL
ＲL
1KΩ
RGND RGND
RGND
ＶDD 5V ＶDD 5V ＶDD 5V
ＶPP ＶPP ＶPP ＶPP
ＶPP ＶPP
GND GND GND GND GND GND
ＶNN ＶNN ＶNN ＶNN ＶNN ＶNN
Ｋo=20log(ＶOUT/ＶIN) Ｋcr=20log(ＶOUT/ＶIN)

d) Off Isolation e) Crosstalk f) Output Voltage Spike

Fig. 2 Test Circuit

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 7/17

ECN3297TF
6. Timing Waveforms
DN-1 DN DN+1
DATA
IN 50% 50%

＿
LE
50% 50%

tWLE
tSD
CLOCK
50%
50%
tSU th
tDO
DATA
OUT 50% 50%

tOFF tON
VOUT OFF 90%
(Typ.) 50%

ON 10%

50% 50%
CLR
tWCL

Fig. 3 Timing Waveforms

Note
1. Serial data is clocked in on the rising edge of CLK.
2. The switches go to a state retaining their present condition on the rising edge of LE.

t WLE

LE
t SD

CLK

t SU tW

D15 D14 D13 D1 D0

DIN
MSB LSB

t DO

D15 D14 D13 D1 D0 D15

DOUT

Data from previous data byte ( power up : unknown )

Fig. 4 LATCH ENABLE Timing waveform

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 8/17

ECN3297TF
7. Truth Table
Table 6 Truth table
D0 D1 D2 D3 D4 D5 D6 D7 LE CL SW0 SW1 SW2 SW3 SW4 SW5 SW6 SW7
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
X X X X X X X X H L HOLD PREVIOUS STATE
X X X X X X X X X H OFF OFF OFF OFF OFF OFF OFF OFF

D8 D9 D10 D11 D12 D13 D14 D15 LE CL SW8 SW9 SW10 SW11 SW12 SW13 SW14 SW15
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
X X X X X X X X H L HOLD PREVIOUS STATE
X X X X X X X X X H OFF OFF OFF OFF OFF OFF OFF OFF

X = Don’t care

Note
1. The 16 Switches operate independently.
2. When LE is low, the shift register data flows through the latch.
3. Shift register clocking has no effect on the switch states if LE is high.
4. When switch 15 is ON, DOUT is high.
5. The clear input overrides all other inputs.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 9/17

ECN3297TF
8. Pin Configuration
ECN3297TF TQFP48（48Pin TQFP）
Table7．Pin Configuration
Pin Name Functions Note
1 N/C No connection. *1
2 N/C No connection. *1
3 SW4B Analog Switch 4
4 SW4A Analog Switch 4
5 SW3B Analog Switch 3
6 SW3A Analog Switch 3
7 SW2B Analog Switch 2
8 SW2A Analog Switch 2
9 SW1B Analog Switch 1
10 SW1A Analog Switch 1
11 SW0B Analog Switch 0
12 SW0A Analog Switch 0
13 VNN Negative High Voltage Supply. *2
14 N/C No connection. *1
15 VPP Positive High Voltage Supply. *2
16 N/C No connection. *1
17 GND Ground
18 VDD Logic Supply Voltage
19 DIN Serial Data Input
20 CLK Serial Clock Input
21 LE Latch-Enable Input
22 CLR Latch-Clear Input
23 DOUT Serial Data Output
24 RGND Ground. Connect to Bleed Resister. *3
25 SW15B Analog Switch 15
26 SW15A Analog Switch 15
27 SW14B Analog Switch 14
28 SW14A Analog Switch 14
29 SW13B Analog Switch 13
30 SW13A Analog Switch 13
31 SW12B Analog Switch 12
32 SW12A Analog Switch 12
33 SW11B Analog Switch 11
34 SW11A Analog Switch 11
35 N/C No connection. *1
36 N/C No connection. *1
37 SW10B Analog Switch 10
38 SW10A Analog Switch 10
39 SW9B Analog Switch 9
40 SW9A Analog Switch 9
41 SW8B Analog Switch 8
42 SW8A Analog Switch 8
43 SW7B Analog Switch 7
44 SW7A Analog Switch 7
45 SW6B Analog Switch 6
46 SW6A Analog Switch 6
47 SW5B Analog Switch 5
48 SW5A Analog Switch 5
Note 1. NOT connected on chip internal.
2. High voltage supply.
3. Connected all analog switches with bleed resistor on chip internal.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 10/17

ECN3297TF
36 35 34 33 32 31 30 29 28 27 26 25

37 24
38 23
39 22
40 21
41 20
42 19
43
ECN3297TF 18
44 17
45 16
46 15
47 14
48 13

1 2 3 4 5 6 7 8 9 10 11 12
48pin Package

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 11/17

ECN3297TF
9. Package Outline

９．００±０．２０ Units：mm
７．００TYP

０．５０
９．００±０．２０
７．００TYP

１．７０Ｍａｘ
０．１９±０．０５
０．１７±０．０５

１．００TYP ０．１０±０．０７

０．５０±０．１０
０．１０

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 12/17

ECN3297TF
10. Marking spec

(a) (b) (c) (d) (e)

E C N 3 2
Blank
9 7 T F

INDEX pin

Lot numbering rule

(a) :Year code (Least significant digit of Assembled year (A.D.))

(b) :Month code (Refer to following table.)

Month 1 2 3 4 5 6 7 8 9 10 11 12
Month
A B C D E K L M N X Y Z
code

(c),(d),(e) :Serial number within year/month code

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 13/17

ECN3297TF
11 Packing Form
Packaging details are as shown below.
Label Carton tape
1.Outer and IC type No. and Label Dry pack.
inner Quantity IC type No. and
packing (max 2500 IC/box) Quantity

Inner
Outer box (cardboard box)

2.Tray Tray Specifications

Orientation of IC

Enlargement

IC Index
Tray dimension Tray Index

(322.6)
3.8 315 3.8 Unit: mm
11.1 292.8
11.25

12.2
31.1
ＴＱＦＰ７×７ｍｍ［Ａ２＝１．４］
9×12.6=(113.4)
Mark

* * *
135.9

* * * *
92.1

* * * *
12.6

* * *
１０×２５＝２５０

１５０℃ＭＡＸ

C3
12.7
11.25

14 positions without holes (*)

7.62
1.27

34.3 25.4 25.4

255.3

(1) Material of tray is PPE containing carbon and static proof.

(2) Packing quantity is max 250 IC/Tray.
(3) Maximum heat resistant temperature is 150oC

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 14/17

ECN3297TF
12 Inspection
Hundred percent inspections shall be conducted on electric characteristics.

13. Important Notice

13.1 Hitachi warrants performance of its power semiconductor products (hereinafter called “products”)
to the specifications applicable at the time of sale in accordance with the Product Specification.
Testing and other quality control techniques are utilized to the extent Hitachi needs to meet
specifications described in the Product Specification. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by related laws and/or regulations.
13.2 Should any claim be made within one month of product delivery about products’ failure to meet
performance described in the Product Specification, all the products in relevant lot(s) shall be re-
tested and re-delivered. Products delivered more than one month before of such claim shall not
be counted for such response.
13.3 Hitachi assumes no obligation or any way of compensation should any fault about customer’s
goods using products be found in marketplace. Only in such a case fault of Hitachi is evident and
products concerned do not meet the Product Specification, compensation shall be conducted if
claimed within one year of product delivery up to in the way of product replacement or payment of
equivalent amount.

13.4 Hitachi reserves the right to make changes in the Product Specification and to discontinue mass
production of the relevant products without notice. Customers are advised before purchasing to
confirm specification of the product of inquiry is the latest version and that the relevant product is
on mass production status in such a case purchasing is suspended for one year or more.
13.5 In no event shall Hitachi be liable for any damage that may result from an accident or any other
cause during operation of the user’s units according to this Product Specification. Hitachi
assumes no responsibility for any intellectual property claims or any other problems that may
result from applications of information, products or circuits described in this Product Specification.
13.6 No license is granted by this Product Specification under any patents or other rights of any third
party or Hitachi Power Semiconductor Device, Ltd.
13.7 This Product Specification may not be reproduced or duplicated, in any form, in whole or in part,
without the expressed written permission of Hitachi Power Semiconductor Device, Ltd.
13.8 The products (technologies) described in this Product Specification are not to be provided to any
party whose purpose in their application will hinder maintenance of international peace and safety
nor are they to be applied to that purpose by their direct purchasers or any third party. When
exporting these products (technologies), the necessary procedures are to be taken in accordance
with related laws and regulations.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 15/17

ECN3297TF
13 Cautions
14.1 Customers are advised to follow the below cautions to protect semiconductor from electrical static
discharge (ESD).

a) IC needs to be dealt with caution to protect from damage by ESD. Material of container or any
device to carry semiconductor devices should be free from ESD which may be caused by
vibration while transportation. To use electric-conductive container or aluminum sheet is
recommended as an effective countermeasure.
b) Those what touch semiconductor devices such as work platform, machine and measuring and
test equipment should be grounded.
c) Workers should be grounded connecting with high impedance around 100kΩ to 1MΩ while
dealing with semiconductor to avoid damaging IC by electric static discharge.
d) Friction with other materials such as a high polymer should not be caused.
e) Attention is needed so that electric potential will be kept on the same level by short circuit
terminals when PC board with mounted IC is carried and that vibration or friction might not occur.
f) Air conditioningis needed so that humidity should not drop.

14.2 Refer to the latest version of “Instructions for Use of Hitachi High-Voltage Monolithic ICs” for the
other precautions and instructions on how to deal with products.

14.3 Regardless of changes in external conditions during use, “absolute maximum ratings” should
never be exceeded in designing electronic circuits that employ products. In a case absolute
maximum ratings are exceeded, products may be damaged or destroyed. In no event shall Hitachi
be liable for any failure in products or any secondary damage resulting from use at a value
exceeding the absolute maximum ratings.

14.4 Products may experience failures due to accident or unexpected surge voltages. Accordingly,
adopt safe design features, such as redundancy or prevention of erroneous action, to avoid
extensive damage in the event of a failure.

14.5 Products are not designed, manufactured, or warranted to be suitable for use where extremely
high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic
equipment, life-support-related medical equipment, fuel control equipment and various kinds of
safety equipment).
Inclusion of products in such application shall be fully at the risk of customers. Hitachi Power
Semiconductor Device, Ltd. assumes no liability for applications assistance, customer product
design, or performance.
In such cases it is advised customers ensure circuit and/or product safety by using
semiconductor devices that assures high reliability or by means of user’s fail-safe precautions
or other arrangement.
(If a semiconductor device fails, there may be cases in which the semiconductor device, wiring
or wiring pattern will emit smoke or cause a fire or in which the semiconductor device will burst.)

14.6 Lead-free solder is used for coating pins and the tab of this IC. Refer to the latest version of
“Instructions for Use of Hitachi High-Voltage Monolithic ICs” for soldering conditions.

PDE-3297-1
Ref. No. IC-SP-12006 R4
<High Voltage Analog Switch series> P. 16/17

ECN3297TF
◆Appendix-Supplementary Data

Please read follows contents before using this product.

Function Discription

1. Bleed resistor
ECN3297TF feature integrated 35kΩ bleed resistor to discharge capacitive Loads such as
piezoelectric transducers. Each analog switch terminal is coneccted RGND with a bleed
resistor.

2. Overvoltage Protection
ECN3297TF feature clamping diodes to protect circuit against the overvoltage exceed VPP
or VNN. ALL analog switches connect VPP and VNN terminals with clamping diode.
Normaly, switch input voltage must not exceed VNN and VPP, and maximum current flows
through the clamping diode should be less than 1A.

3. Power supply seaquence

ECN3297TF doesn’t require special sequencing of the VPP, VNN, and VDD supply
voltages.However, logic state is unsettled when power-up. After power-up, please refer to the
truth table (Page.8 Table.7) and set the data of shift register.

PDE-3297-1
Ref. No. IC-SP-12006 R4
 P. 17/17

Precautions for Safe Use and Notices

If semiconductor devices are handled inappropriate manner, failures may result. For this reason,
be sure to read the latest version of “Instructions for Use of Hitachi High-Voltage Monolithic ICs”
before use.

! This mark indicates an item about which caution is required.

This mark indicates a potentially hazardous situation

! CAUTION which, if not avoided, may result in minor or moderate
injury and damage to property.

! CAUTION
(1) Regardless of changes in external conditions during use “absolute maximum ratings”
should never be exceed in designing electronic circuits that employ semiconductors.
In the case of pulse use, furthermore,safe operating area (SOA)”precautions should be
observed.

(2) Semiconductor devices may experience failures due to accident or unexpected surge
voltages. Accordingly, adopt safe design features, such as redundancy or prevention of
erroneous action, to avoid extensive damage in the event of a failure.

(3) In cases where extremely high reliability is required (such as use in nuclear power
control, aerospace and aviation, traffic equipment, life-support-related medical
equipment, fuel control equipment and various kinds of safety equipment), safety should
be ensured by using semiconductor devices that feature assured safety or by means of
user’s fail-safe precautions or other arrangement. Or consult Hitachi’s sales department
staff.

(If a semiconductor devices fails, there may be cases in which the semiconductor device,
wiring or wiring pattern will emit smoke or cause a fire or in which the semiconductor
device will burst)

NOTICES
1. This Data Sheet contains the specifications, characteristics (in figures and tables), dimensions
and handling notes concerning power semiconductor products (hereinafter called “products”) to
aid in the selection of suitable products.
2. The specifications and dimensions, etc. stated in this Data Sheet are subject to change without
prior notice to improve products characteristics. Before ordering, purchasers are advised to
contact Hitachi’s sales department for the latest version of this Data Sheet and specifications.
3. In no event shall Hitachi be liable for any damage that may result from an accident or any other
cause during operation of the user’s units according to this Data Sheet. Hitachi assumes to
responsibility for any intellectual property claims or any other problems that may result from
applications of information, products or circuits described in this Data Sheet.
4. In no event shall Hitachi be liable for any failure in a semiconductor device or any secondary
damage resulting from use at a value exceeding the absolute maximum rating.
5. No license is granted by this Data Sheet under any patents or other rights of any third party or
Hitachi Power Semiconductor Device, Ltd.
6. This Data Sheet may not be reproduced or duplicated, in any form, in whole or in part, without
the expressed written permission of Hitachi Power Semiconductor Device, Ltd.
7. The products (technologies) described in this Data Sheet are not to be provided to any party
whose purpose in their application will hinder maintenance of international peace and safety
nor are they to be applied to that purpose by their direct purchasers or any third party. When
exporting these products (technologies), the necessary procedures are to be taken in accordance
with related laws and regulations.

Refer to the following website for the latest information. Consult Hitachi’s sales
department staff if you have any questions.
http://www.hitachi-power-semiconductor-device.co.jp/en/