B1545G MBRB1545CTG Schottky 2x 15A 45V

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MBRB1545CTG,

SBRB1545CTG

SWITCHMODE
Power Rectifier
D2PAK Surface Mount Power Package
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The D2PAK Power Rectifier employs the Schottky Barrier principle
with a platinum barrier metal. These state-of-the-art devices have the SCHOTTKY BARRIER
following features: RECTIFIER
Features 15 AMPERES
• Center−Tap Configuration 45 VOLTS
• Guardring for Stress Protection
• Low Forward Voltage
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94, V−0 @ 0.125 in
• Short Heatsink Tab Manufactured − Not Sheared D2PAK
• Similar in Size to the Industry Standard TO220 Package CASE 418B
STYLE 3
• SBRB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
1
Qualified and PPAP Capable
4
• These Devices are Pb−Free and are RoHS Compliant*
3
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 MARKING DIAGRAM
• Weight: 1.7 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal B1545 = Device Code
AY WW A = Assembly Location
Leads are Readily Solderable B1545G Y = Year
• Lead and Mounting Surface Temperature for Soldering Purposes: AKA WW = Work Week
260°C Max. for 10 Seconds G = Pb−Free Package
AKA = Diode Polarity
• Device Meets MSL1 Requirements
• ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V) ORDERING INFORMATION

Device Package Shipping†


MBRB1545CTG D2PAK 50 Units/Rail
(Pb−Free)
SBRB1545CTG D2PAK 50 Units/Rail
(Pb−Free)
MBRB1545CTT4G D2PAK 800/Tape & Reel
(Pb−Free)
SBRB1545CTT4G D2PAK 800/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
*For additional information on our Pb−Free strategy and soldering details, please refer to our Tape and Reel Packaging Specifications
download the ON Semiconductor Soldering and Mounting Techniques Brochure, BRD8011/D.
Reference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:


November, 2012 − Rev. 13 MBRB1545CT/D
MBRB1545CTG, SBRB1545CTG

MAXIMUM RATINGS (Per Leg)


Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 45 V
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IF(AV) 7.5 A
(Rated VR, TC = 167°C) Total Device 15

Peak Repetitive Forward Current IFRM A


(Rated VR, Square Wave, 20 kHz, TC = 166°C) 15

Non−Repetitive Peak Surge Current IFSM A


(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 150

Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 1.0 A
Storage Temperature Range Tstg −65 to +175 °C
Operating Junction Temperature (Note 1) TJ −65 to +175 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS (Per Leg)


Characteristic Symbol Value Unit
Thermal Resistance °C/W
Junction to Case RqJC 2.0
Junction to Ambient (Note 2) RqJA 50
2. When mounted using minimum recommended pad size on FR−4 board.

ELECTRICAL CHARACTERISTICS (Per Leg)


Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3) VF V
(iF = 7.5 Amps, TJ = 125°C) 0.57
(iF = 15 Amps, TJ = 125°C) 0.72
(iF = 15 Amps, TJ = 25°C) 0.84
Maximum Instantaneous Reverse Current (Note 3) iR mA
(Rated dc Voltage, TJ = 125°C) 15
(Rated dc Voltage, TJ = 25°C) 0.1
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.

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MBRB1545CTG, SBRB1545CTG

i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 50

I R, REVERSE LEAKAGE CURRENT (mA)


30
20 10

10 125°C
1

3 85°C
2
0.1
1
0.5 25°C
125°C 85°C 25°C 0.01

0.001
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 10 20 30 40 50
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)

IF(AV), AVERAGE FORWARD CURRENT (A)


16 14
TJ = 125°C IPK
=
12 DC
14 IAV
p
IPK
12 IPK =5 10
= 10 IAV
10 IPK IAV SQUARE
= 20 8
IAV
8
DC 6
6
SQUARE 4
4
WAVE
2
2

0 0
0 2 4 6 8 10 12 14 16 155 160 165 170 175
IF(AV), AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE (°C)
Figure 3. Typical Forward Power Dissipation Figure 4. Current Derating, Case, Per Leg

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3
MBRB1545CTG, SBRB1545CTG

PACKAGE DIMENSIONS

D2PAK
CASE 418B−04
ISSUE K

−B− C NOTES:
1. DIMENSIONING AND TOLERANCING
4 E PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V 3. 418B−01 THRU 418B−03 OBSOLETE,
W NEW STANDARD 418B−04.

INCHES MILLIMETERS
S DIM MIN MAX MIN MAX
1 2 3
A 0.340 0.380 8.64 9.65
A B 0.380 0.405 9.65 10.29
C 0.160 0.190 4.06 4.83
−T− D 0.020 0.035 0.51 0.89
SEATING E 0.045 0.055 1.14 1.40
PLANE F 0.310 0.350 7.87 8.89
G G 0.100 BSC 2.54 BSC
K H 0.080 0.110 2.03 2.79
W J 0.018 0.025 0.46 0.64
D 3 PL J K 0.090 0.110 2.29 2.79
0.13 (0.005) M T B M L 0.052 0.072 1.32 1.83
H M 0.280 0.320 7.11 8.13
N 0.197 REF 5.00 REF
VARIABLE P 0.079 REF 2.00 REF
CONFIGURATION R 0.039 REF 0.99 REF
S 0.575 0.625 14.60 15.88
ZONE N P V 0.045 0.055 1.14 1.40
R U
STYLE 3:
L L L PIN 1. ANODE
2. CATHODE
3. ANODE
M M M 4. CATHODE

F F F

VIEW W−W VIEW W−W VIEW W−W


1 2 3

SOLDERING FOOTPRINT*

10.49

8.38

16.155

2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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4
MBRB1545CTG, SBRB1545CTG

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION


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