Rockchip RK3566 Datasheet V1.1
Rockchip RK3566 Datasheet V1.1
Rockchip RK3566 Datasheet V1.1
Rockchip
RK3566
Datasheet
Revision 1.1
March. 2021
Revision History
Date Revision Description
Table of Content
Table of Content ...................................................................................................... 3
Figure Index ........................................................................................................... 4
Table Index............................................................................................................. 5
Warranty Disclaimer ................................................................................................. 6
Chapter 1 Introduction ..................................................................................... 7
1.1 Overview ............................................................................................... 7
1.2 Features ................................................................................................ 7
1.3 Block Diagram ...................................................................................... 19
Chapter 2 Package Information.........................................................................20
2.1 Order Information ................................................................................. 20
2.2 Top Marking ......................................................................................... 20
2.3 FCCSP565L Dimension ........................................................................... 21
2.4 Ball Map .............................................................................................. 23
2.5 Pin Number List .................................................................................... 23
2.6 Power/Ground IO Description .................................................................. 29
2.7 Function IO Description .......................................................................... 32
2.8 IO Pin Name Description ........................................................................ 41
Chapter 3 Electrical Specification ......................................................................51
3.1 Absolute Ratings ................................................................................... 51
3.2 Recommended Operating Condition ......................................................... 52
3.3 DC Characteristics ................................................................................. 53
3.4 Electrical Characteristics for General IO .................................................... 54
3.5 Electrical Characteristics for PLL .............................................................. 55
3.6 Electrical Characteristics for USB 2.0 Interface .......................................... 55
3.7 Electrical Characteristics for DDR IO......................................................... 56
3.8 Electrical Characteristics for TSADC.......................................................... 57
3.9 Electrical Characteristics for MIPI DSI....................................................... 57
3.10 Electrical Characteristics for MIPI CSI ..................................................... 57
3.11 Electrical Characteristics for HDMI.......................................................... 57
3.12 Electrical Characteristics for multi-PHY.................................................... 58
Chapter 4 Thermal Management .......................................................................59
4.1 Overview ............................................................................................. 59
4.2 Package Thermal Characteristics ............................................................. 59
Figure Index
Fig.1-1 Block Diagram ......................................................................................... 19
Fig.2-1 Package definition .................................................................................... 20
Fig.2-2 Package Top View .................................................................................... 21
Fig.2-3 Package bottom view................................................................................ 21
Fig.2-4 Package side view .................................................................................... 22
Fig.2-5 Package dimension................................................................................... 22
Fig.2-6 Ball Map ................................................................................................. 23
Table Index
Table 2-1 Pin Number List Information ................................................................... 23
Table 2-2 Power/Ground IO information ................................................................. 29
Table 2-3 Function IO description .......................................................................... 40
Table 2-4 IO function description list ..................................................................... 41
Table 3-1 Absolute ratings.................................................................................... 51
Table 3-2 Recommended operating condition .......................................................... 52
Table 3-3 DC Characteristics................................................................................. 53
Table 3-4 Electrical Characteristics for Digital General IO .......................................... 54
Table 3-5 Electrical Characteristics for Frac PLL ....................................................... 55
Table 3-6 Electrical Characteristics for Int-PLL ......................................................... 55
Table 3-7 Electrical Characteristics for USB 2.0 Interface .......................................... 55
Table 3-8 Electrical Characteristics for DDR IO ........................................................ 56
Table 3-9 Electrical Characteristics for TSADC ......................................................... 57
Table 3-10 Electrical Characteristics for MIPI DSI .................................................... 57
Table 3-11 Electrical Characteristics for MIPI CSI ..................................................... 57
Table 3-12 Electrical Characteristics for HDMI ......................................................... 57
Table 3-13 Electrical Characteristics for PCIe PHY .................................................... 58
Table 4-1 Thermal Resistance Characteristics .......................................................... 59
Warranty Disclaimer
Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise)
by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement,
merchantability or fitness for a particular purpose or for any indirect, special or consequential damages.
Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no
responsibility for the consequences of use of such information or for any infringement of patents or other rights of third
parties that may result from its use.
Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other
application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or
death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or
unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees
arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended
or unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the design or
manufacture of the part.
Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the
rights of others.
All copyright and patent rights referenced in this document belong to their respective owners
and shall be subject to corresponding copyright and patent licensing requirements.
Trademarks
Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip
Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their
products use trademarks owned by the respective companies and are for reference purpose only.
Confidentiality
The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the
confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party.
Chapter 1 Introduction
1.1 Overview
RK3566 is a high-performance and low power quad-core application processor designed for
personal mobile internet device and AIoT equipment.
Many embedded powerful hardware engines are provided to optimize performance for high-
end application. RK3566 supports almost full-format H.264 decoder by 4K@60fps, H.265
decoder by 4K@60fps, also support H.264/H.265 encoder by 1080p@60fps, high-quality
JPEG encoder/decoder.
1.2 Features
The features listed below which may or may not be present in actual product, may be
subject to the third party licensing requirements. Please contact Rockchip for actual product
feature configurations and licensing requirements.
1.2.1 Microprocessor
Quad-core ARM Cortex-A55 CPU
ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated
media and signal processing computation
Include VFP hardware to support single and double-precision operations
ARMv8 Cryptography Extensions
Integrated 32KB L1 instruction cache, 32KB L1 data cache
512KB unified system L3 cache
TrustZone technology support
Separate power domains for CPU core system to support internal power switch and
externally turn on/off based on different application scenario
PD_A55_0: 1st Cortex-A55 + Neon + FPU + L1 I/D Cache
PD_A55_1: 2nd Cortex-A55 + Neon + FPU + L1 I/D Cache
PD_A55_2: 3rd Cortex-A55 + Neon + FPU + L1 I/D Cache
PD_A55_3: 4th Cortex-A55 + Neon + FPU + L1 I/D Cache
One isolated voltage domain
SYSTEM_SRAM
Size: 64KB
PMU_SRAM
Size: 8KB
eMMC Interface
Compatible with standard iNAND interface
Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1
Support three data bus width: 1bit, 4bits or 8bits
Support HS200;
Support CMD Queue
SD/MMC Interface
Compatible with SD3.0, MMC ver4.51
Data bus width is 4bits
MCU
32bits microcontroller core
Harvard architecture separate Instruction and Data memories
Integrated Programmable Interrupt Controller (IPIC)
Integrated Debug Controller with JTAG interface
Watchdog
32bits watchdog counter
Counter counts down from a preset value to 0 to indicate the occurrence of a
timeout
WDT can perform two types of operations when timeout occurs:
Generate a system reset
First generate an interrupt and if this is not cleared by the service routine by
the time a second timeout occurs then generate a system reset
Programmable reset pulse length
Totally 16 defined-ranges of main timeout period
One Watchdog for non-secure application
One Watchdog for secure application
Interrupt Controller
Support 3 PPI interrupt sources and 256 SPI interrupt sources input from different
components
Support 16 software-triggered interrupts
Two interrupt outputs (nFIQ and nIRQ) separately for each Cortex-A55, both are
low-level sensitive
Support different interrupt priority for each interrupt source, and they are always
Mailbox
One Mailbox in SoC to service Cortex-A55 and MCU communication
Support four mailbox elements per mailbox, each element includes one data word,
one command word register and one flag bit that can represent one interrupt
Provide 32 lock registers for software to use to indicate whether mailbox is
occupied
DMAC
Two identical DMAC blocks supported(DMAC0/DMAC1)
Micro-code programming based DMA
The specific instruction set provides flexibility for programming DMA transfers
Linked list DMA function is supported to complete scatter-gather transfer
Support internal instruction cache
Embedded DMA manager thread
Support data transfer types with memory-to-memory, memory-to-peripheral,
peripheral-to-memory
Signals the occurrence of various DMA events using the interrupt output signals
Mapping relationship between each channel and different interrupt outputs is
software-programmable
One embedded DMA controller for system
DMAC features:
8 channels totally
23 hardware request from peripherals
2 interrupt outputs
Video Encoder
H.264/AVC BP/MP/HP@level4.2,up to 1920x1080@100fps
H.265/HEVC MP@level4.1, up to 1920x1080@100fps (4096x4096@10fps with
TILE)
Support YUV/RGB video source with rotation and mirror
JPEG encoder
Baseline Non-progressive
up to 8192x8192
up to 90 million pixels per second
De-interlace
I5O2: Input 5 Fields Output 2 frames mode
I5O1T: Input 5 Fields Output 1 Top frame mode
I5O1B: Input 5 Fields Output 1 Bottom frame mode
I2O2: Input 2 Fields Output 2 frames mode
I1O1T: Input 1 Field Output 1 Top frame mode
I1O1B: Input 1 Field Output 1 Bottom frame mode
PULLDOWN_REC: Pull down Recovery mode
DETECT_ONLY: Detect Only mode
MVHIST: De-interlace MV Histogram
MD: Motion Detection
ME: Motion Estimate
MC: Motion Compensation
EEDI: Enhanced Edge based Interpolation
OSD DETECT: On-Screen Display Detection
FF DETECT: Frame Field Detection
FO DETECT: Field Order Detection
PD DETECT: Pull down Detection
CC: Combining Check
2D Graphics Engine:
Data format
Support input of
ARGB/RGB888/RGB565/RGB4444/RGB5551/YUV420/YUV422/YUYV;
Support input of YUV422SP10bit/YUV420SP10bit(YUV-8bits out)
Support output of
ARGB/RGB888/RGB565/RGB4444/RGB5551/YUV420/YUV422/YUYV;
Pixel Format conversion, BT.601/BT.709
Dither operation, Y dither update;
Max resolution: 8192x8192 source, 4096x4096 destination
Scaling
Down-scaling: Average filter
Up-scaling: Bi-cubic filter(source>2048 would use Bi-linear)
Arbitrary non-integer scaling ratio,from 1/16 to 16
Rotation
0, 90, 180, 270 degree rotation
x-mirror, y-mirror& rotation operation
BitBLT
Block transfer
Color palette/Color fill, support with alpha
Transparency mode (color keying/stencil test, specified value/value range)
Two source BitBLT:
A+B=B only BitBLT, A support rotate&scale when B fixed
A+B=C second source (B) has same attribute with (C) plus rotation function
Alpha Blending
New comprehensive per-pixel alpha(color/alpha channel separately)
Fading
SRC1(R2Y)&&SRC0(YUV)—alpha->DST(YUV)
DVP Interface
Support 8bits/10bits/12bits/16bits input
Support up to 150MHz input data
VICAP
Support BT601 YCbCr 422 8bits input、RAW 8/10/12bits input
Support BT656 YCbCr 422 8bits input
Support BT1120 YCbCr 422 8/10/12/16bits input, single/dual-edge sampling
Support 2/4 mixed BT656/BT1120 YCbCr 422 8bit input
Support YUYV sequence configurable
Support the polarity of pixel_clk, hsync and vsync configurable
Support receiving CSI2 protocol data(up to four IDs)
Support receiving DSI protocol data(Video mode/Command mode)
Support window cropping
Support virtual stride when write to DDR
Support NV16/NV12 output for YUV data
Support compact/ non-compact output for RAW data
ISP
DVP input: ITU-R BT601/656/1120 with raw8/raw10/raw12/raw16, YUV422
MIPI input: RX data lane x1/x2/x4, raw8/raw10/raw12, YUV422
3A: include AE/Histogram, AF, AWB statistics output
FPN: Fixed Pattern Noise removal
BLC: Black Level Correction
DPCC: Static/Dynamic defect pixel cluster correction
LSC: Lens shading correction
Bayer-2DNR: Bayer-raw De-noising, 2DNR
Bayer-3DNR: Bayer-raw De-noising, 3DNR
DRC: 2-Frame Merge Video Tone mapping
Debayer: Advanced Adaptive Demosaic with Chromatic Aberration Correction
CCM/CSM: Color correction matrix; RGB2YUV etc.
Gamma: Gamma out correction
Dehaze/Enhance: Automatic Dehaze and edge enhancement
3DLUT: 3D-Lut Color Palette for Customer
LDCH: Lens-distortion in the horizontal direction
2DNR: Advanced Spatial Noise reduce in YUV
Sharp: Picture Sharpening & Edge Enhance in YUV
CGC: Color Gamut Compression, YUV full range/limit range convert
Output Scale*2
Maximum resolution is 4096x2304
PDM
Up to 8 channels
Audio resolution from 16bits to 24bits
Sample rate up to 192KHz
Support PDM master receive mode
TDM
supports up to 8 channels for TX and 8 channels RX path
Audio resolution from 16bits to 32bits
Sample rate up to 192KHz
Provides master and slave work mode, software configurable
Support 3 I2S formats (normal, left-justified, right-justified)
Support 4 PCM formats (early, late1, late2, late3)
Multi-PHY Interface
Support three multi-PHYs with PCIe2.1/SATA3.0/USB3.0
Up to one USB3 Host controller
Up to one PCIe2.1 controller
Up to two SATA controller
Multi-PHY1 support one of the following interfaces
USB3.0 Host
SATA1
Multi-PHY2 support one of the following interfaces
PCIe2.1
SATA2
USB 3.0 xHCI Host Controller
Support 1 USB2.0 port and 1 Super-Speed port
Concurrent USB3.0/USB2.0 traffic, up to 8.48Gbps bandwidth
Support standard or open-source xHCI and class driver
PCIe2.1 interface
Compatible with PCI Express Base Specification Revision 3.0
Support Root Complex(RC) mode
SPI interface
Support four SPI Controller
Support one chip-select output and the other support two chip-select output
Support serial-master and serial-slave mode, software-configurable
I2C interface
Support six I2C interface
Support 7bits and 10bits address mode
Software programmable clock frequency
Data on the I2C-bus can be transferred at rates of up to 100Kbit/s in the Standard-
mode, up to 400Kbit/s in the Fast-mode or up to 1 Mbit/s in Fast-mode Plus.
UART Controller
Support ten UART interfaces
Embedded two 64-byte FIFO for TX and RX operation respectively
Support 5bits,6bits,7bits,8bits serial data transmit or receive
Standard asynchronous communication bits such as start, stop and parity
Support different input clock for UART operation to get up to 4Mbps baud rate
Support auto flow control mode for UART0/UART1/UART3/UART4/UART5
PWM
Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation
Programmable pre-scaled operation to bus clock and then further scaled
Embedded 32bits timer/counter facility
Support capture mode
Support continuous mode or one-shot mode
Provides reference mode and output various duty-cycle waveform
Optimized for IR application for PWM3,PWM7,PWM11 and PWM15
Smart Card
Support ISO-7816
support card activation and deactivation
support cold/warm reset
support Answer to Reset(ATR) response reception
support T0 for asynchronous half-duplex character transmission
support T1 for asynchronous half-duplex block transmission
support automatic operating voltage class selection
support adjustable clock rate and bit (baud) rate
support configurable automatic byte repetition
1.2.16 Others
Multiple group of GPIO
All of GPIOs can be used to generate interrupt to CPU
Support level trigger and edge trigger interrupt
Support configurable polarity of level trigger interrupt
Support configurable rising edge, falling edge and both edge trigger interrupt
Temperature Sensor(TSADC)
OTP
Support 8K bits Size, 7K bits for secure application
Support Program/Read/Idle mode
Package Type
FCCSP565L (body: 15.5mm x 14.4mm; ball size: 0.3mm; ball pitch: 0.65&0.4mm)
Notes:
DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X are not used simultaneously
LVDS interface can not be used when dual-mipi mode enable
PCIe2.1/SATA3.0
WDT Cortex-A55 Quad-Core
USB3.0 HOST/SATA3.0
PLL x9 Core0 Core1
32KB L1 I-Cache 32KB L1 I-Cache USB2.0 HOST x2
Timer x6
32KB L1 D-Cache 32KB L1 D-Cache USB2.0 OTG
Secure Timer x2
NOEN/FPU/Crypto NOEN/FPU/Crypto I2S/TDM(8ch) x2, one
PMU for HDMI
Core2 Core3
Crypto 32KB L1 I-Cache 32KB L1 I-Cache I2S/PCM(2ch) x2
DDRPHY _VDDQ 1D5 1D6 1D7 1D8 1D9 1E4 1F4 1G4 DDR PHY Power
Power
PIN PIN Name Func1 Func2 Func3 Func4 Func5 Func6
Domain
AD37 XIN24M XIN24M
PMUIO
XOUT24M XOUT24M
0
1N19 GPIO0_D3_d GPIO0_D3_d
PMUIO0
1M19 GPIO0_D4_d GPIO0_D4_d
1N20 GPIO0_D5_d GPIO0_D5_d
1P20 GPIO0_D6_d GPIO0_D6_d
1M18 TVSS TVSS
AG38 nPOR_u nPOR_u
PMUIO
REFCLK_OUT/GPIO0_A0_d GPIO0_A0_d REFCLK_OUT
1
TSADC_SHUT_M
1R20 TSADC_SHUT_M0/TSADC_SHUT_ORG/GPIO0_A1_z GPIO0_A1_z TSADC_SHUT_ORG
0
1P19 PMIC_SLEEP/TSADC_SHUT_M1/GPIO0_A2_d GPIO0_A2_d PMIC_SLEEP TSADC_SHUT_M1
PMUIO1
1R19 GPIO0_A3_u GPIO0_A3_u
AF37 SDMMC0_DET/SATA_CP_DET/GPIO0_A4_u GPIO0_A4_u SDMMC0_DET SATA_CP_DET
SDMMC0_PWRE PCIE20_CLKREQn_
AG37 SDMMC0_PWREN/SATA_MP_SWITCH/PCIE20_CLKREQn_M0/GPIO0_A5_d GPIO0_A5_d SATA_MP_SWITCH
N M0
AJ38 GPU_PWREN/SATA_CP_POD/GPIO0_A6_d GPIO0_A6_d GPU_PWREN SATA_CP_POD
AF38 FLASH_VOL_SEL/GPIO0_A7_u GPIO0_A7_u FLASH_VOL_SEL
1T20 CLK32K_IN/CLK32K_OUT0/GPIO0_B0_u GPIO0_B0_u CLK32K_IN CLK32K_OUT0
PMUIO
I2C0_SCL/GPIO0_B1_u GPIO0_B1_u I2C0_SCL
2
AK38 I2C0_SDA/GPIO0_B2_u GPIO0_B2_u I2C0_SDA
AK37 I2C1_SCL/MCU_JTAG_TDO/GPIO0_B3_u GPIO0_B3_u I2C1_SCL MCU_JTAG_TDO
PCIE20_BUTTONRS
AM38 I2C1_SDA/PCIE20_BUTTONRSTn/MCU_JTAG_TCK/GPIO0_B4_u GPIO0_B4_u I2C1_SDA MCU_JTAG_TCK
Tn
PCIE20_WAKEn_M
1U20 I2C2_SCL_M0/SPI0_CLK_M0/PCIE20_WAKEn_M0/PWM1_M1/GPIO0_B5_u GPIO0_B5_u I2C2_SCL_M0 SPI0_CLK_M0 PWM1_M1
0
I2C2_SDA_M0/SPI0_MOSI_M0/PCIE20_PERSTn_M0/PWM2_M1/GPIO0_B6_ PCIE20_PERSTn_M
1R16 GPIO0_B6_u I2C2_SDA_M0 SPI0_MOSI_M0 PWM2_M1
u 0
1R17 PWM0_M0/CPUAVS/GPIO0_B7_d GPIO0_B7_d PWM0_M0 CPUAVS PMUIO2
1T19 PWM1_M0/GPUAVS/UART0_RX/GPIO0_C0_d GPIO0_C0_d PWM1_M0 GPUAVS UART0_RX
1R18 PWM2_M0/NPUAVS/UART0_TX/MCU_JTAG_TDI/GPIO0_C1_d GPIO0_C1_d PWM2_M0 NPUAVS UART0_TX MCU_JTAG_TDI
AM37 PWM3_IR/EDP_HPDIN_M1/MCU_JTAG_TMS/GPIO0_C2_d GPIO0_C2_d PWM3_IR EDP_HPDIN_M1 MCU_JTAG_TMS
AN38 PWM4/VOP_PWM_M0/MCU_JTAG_TRSTn/GPIO0_C3_d GPIO0_C3_d PWM4 VOP_PWM_M0 MCU_JTAG_TRSTn
AN37 PWM5/SPI0_CS1_M0/UART0_RTSn/GPIO0_C4_d GPIO0_C4_d PWM5 SPI0_CS1_M0 UART0_RTSn
1U19 PWM6/SPI0_MISO_M0/GPIO0_C5_d GPIO0_C5_d PWM6 SPI0_MISO_M0
1T18 PWM7_IR/SPI0_CS0_M0/GPIO0_C6_d GPIO0_C6_d PWM7_IR SPI0_CS0_M0
HDMITX_CEC_M
1V20 HDMITX_CEC_M1/PWM0_M1/UART0_CTSn/GPIO0_C7_d GPIO0_C7_d PWM0_M1 UART0_CTSn
1
1V19 UART2_RX_M0/GPIO0_D0_u GPIO0_D0_u UART2_RX_M0
1U18 UART2_TX_M0/GPIO0_D1_u GPIO0_D1_u UART2_TX_M0
AUDIOPWM_LOUT_
A22 I2C3_SDA_M0/UART3_RX_M0/AUDIOPWM_LOUT_P/GPIO1_A0_u GPIO1_A0_u I2C3_SDA_M0 UART3_RX_M0
P
VCCIO AUDIOPWM_LOUT_
I2C3_SCL_M0/UART3_TX_M0/AUDIOPWM_LOUT_N/GPIO1_A1_u GPIO1_A1_u I2C3_SCL_M0 UART3_TX_M0
1 N VCCIO1
A23 I2S1_MCLK_M0/UART3_RTSn_M0/SCR_CLK/GPIO1_A2_d GPIO1_A2_d I2S1_MCLK_M0 UART3_RTSn_M0 SCR_CLK
I2S1_SCLK_TX_
B23 I2S1_SCLK_TX_M0/UART3_CTSn_M0/SCR_IO/GPIO1_A3_d GPIO1_A3_d UART3_CTSn_M0 SCR_IO
M0
PCIE20_TXN
O PCIe differential data output signals
PCIE20_TXP
PCIE20_RXN
PCIe2 I PCIe differential data input signals
PCIE20_RXP
PCIE20_BUTTONRSTN I PCIe Reset request
USB3_HOST1_SSTXP
O USB 3.0 transmission signal DP/DM,
USB3_ HOST1_SSTXN
USB3_HOST1_SSRXP
I USB 3.0 receive signal DP/DM
USB3_HOST1_SSRXN
USB3 Host
LPDDR3 LPDDR3_DQ[i] (i=0~31) I/O BiDir.al data line to the memory device.
LPDDR4_DQ[i]_B
I/O BiDir.al data line to the memory device.
(i=0~15)
LPDDR4_DQS[i]P_B Active-high biDir.al data strobes to the memory
I/O
(i=0,1) device.
LPDDR4_DQS[i]N_B Active-low biDir.al data strobes to the memory
I/O
(i=0,1) device.
PMU_VDD_LOGIC_0V9
PMUPLL_AVDD_0V9
USB_AVDD2_0V9
USB_AVDD1_0V9
MULTI_PHY_AVDD_0V9
0.9V supply voltage -0.3 1.1 V
MIPI_CSI_RX_AVDD_0V9
MIPI_DSI_TX0/LVDS_TX0_AVDD_0V9
MIPI_DSI_TX1
EDP_TX_AVDD_0V9
HDMI_TX_AVDD_0V9
PMUPLL_AVDD_1V8
SYSPLL_AVDD_1V8
MULTI_PHY_AVDD_1V8
USB_AVDD2_1V8
USB_AVDD1_1V8
MULTI_PHY_AVDD_1V8
1.8V supply voltage -0.3 1.98 V
MIPI_CSI_RX_AVDD_1V8
MIPI_DSI_TX0/LVDS_TX0_AVDD_1V8
MIPI_DSI_TX1/LVDS_TX1_AVDD_1V8
EDP_TX_AVDD_1V8
HDMI_TX_AVDD_1V8
OTP_VCC_1V8
USB_AVDD2_3V3
3.3V supply voltage -0.3 3.63 V
USB_AVDD1_3V3
3.3 DC Characteristics
Table 3-3 DC Characteristics
Parameters Symbol Min Typ Max Unit
DDRPHY_VDD
Input High Voltage Vih_ddr Vref+0.1 NA V
DDR IO Q
DDRPHY_VDD
Input High Voltage Vih_ddr Vref+0.1 NA V
DDR IO Q
DDRPHY_VDD
Input High Voltage Vih_ddr Vref+0.1 NA V
Q
DDR IO
Input Low Voltage Vil_ddr VSSQ NA Vref-0.1 V
@DDR4 mode
output impedence Rtt 20 NA 60 Ohm
DDRPHY_VDD
Input High Voltage Vih_ddr Vref+0.1 NA V
DDR IO @ Q
Input Low Voltage Vil_ddr VSSQ NA Vref-0.1 V
LPDDR3 mode
output impedence Rtt 20 NA 60 Ohm
DDRPHY_VDD
DDR IO Input High Voltage Vih_ddr Vref+0.1 NA V
Q
@LPDDR4 mode Input Low Voltage Vil_ddr VSSQ NA Vref-0.1 V
DDR IO DDRPHY_VDD
Input High Voltage Vih_ddr Vref+0.1 NA V
@LPDDR4X QL
mode Input Low Voltage Vil_ddr VSSQ NA Vref-0.1 V
Fout = Fvco/POSTDIV
Output clock frequency Fout 19 NA 3800 MHz
@3.3V/0.99V
Input
@ 3.3V/0.99V,
Lock time Tlt NA 250 500 clock
FREF=24M,REFDIV=1
cycles
Input
@ 3.3V/0.99V,
Lock time Tlt NA 1000 1500 clock
FREF=24M,REFDIV=1
cycles
Notes:
① REFDIV is the input divider value;
② FBDIV is the feedback divider value;
③ POSTDIV is the output divider value
HS mode (disconnect
0.5 0.6 0.7 V
comparator)
Input capacitance (seen at D+ or
NA NA 3 pF
D-)
Squelch threshold 100 112 150 mV
DDR IO
Input leakage current @ 1.5V , 125℃ -80 NA 6 uA
@DDR3 mode
DDR IO
Input leakage current @ 1.35V , 125℃ -65 NA 5 uA
@DDR3L mode
DDR IO
Input leakage current @ 1.2V , 125℃ -50 NA 4 uA
@DDR4 mode
DDR IO
Input leakage current @ 1.2V , 125℃ -50 NA 4 uA
@LPDDR3 mode
DDR IO
Input leakage current @ 1.1V , 125℃ -45 NA 3.5 uA
@LPDDR4 mode
DDR IO
Input leakage current @ 0.6V , 125℃ -20 NA 1.5 uA
@LPDDR4X mode
Temperature Resolution NA ±5 NA ℃
20~80%
Differential output signal rise time tR_DATA 42.5 NA NA ps
RL=50Ω
20~80%
tR_CLOCK 75 NA NA ps
RL=50Ω
20~80%
tF 75 NA NA ps
RL=50Ω
20~80%
Differential output signal fall time tF_DATA 42.5 NA NA ps
RL=50Ω
20~80%
tF_CLOCK 75 NA NA ps
RL=50Ω
Transmitter
Detection
Output rising time for 20% to
Tr 25 NA NA ps
80%
Output falling time for 20% to
Tf 25 NA NA ps
80%
AC Coupling
CTX 75 NA 200 nF
Capacitor(USB3.0/PCIE2.1)
AC Coupling Capacitor(SATA3.0) CTX 6 NA 12 nF
4.1 Overview
For reliability and operability concerns, the absolute maximum junction temperature has to
be below 125℃.