PCIM Europe 2024 Preliminary Conference Program
PCIM Europe 2024 Preliminary Conference Program
PCIM Europe 2024 Preliminary Conference Program
Stage: Brüssel 1
09:00 Opening / Award Ceremony
Stage: Brüssel 1
09:45 Keynote
AI between Hype and Industrial-Grade - The Impact of AI on the Entire Power
Electronics Lifecycle
Rolf Hellinger, Siemens, DE
Chairperson: Leo Lorenz, ECPE, DE
Stage: Brüssel 1
GaN Ruggedness
Chairperson: Andreas Lindemann, Otto-von-Guericke-University Magdeburg, DE
11:20 The Performance of a GaN eMode HEMT in Surge Current Scenarios such as
the Active Short Circuit
Dominik Nehmer, University of Bayreuth, DE
Stage: Brüssel 2
Advanced Packaging Technologies
Chairperson: Peter Kanschat, Infineon Technologies, DE
11:40 High Thermal Durability of Thin Copper Die-attach Layers and Finite
Element Model Simulation
Takaaki Eyama, Kao, JP
Stage: München 1
Thermal Cycling Reliability
Chairperson: Uwe Scheuermann, Friedrich-Alexander-University Erlangen-Nuremberg, DE
11:40 Accelerated Power Cycling of GaN HEMTs using Switching Loss and Fast
Temperature Measurement
Wing Tai Leung, University of Bristol, UK
Stage: München 2
High Power Converters
Chairperson: Marc Hiller, Karlsruhe Institute of Technology, DE
11:40 A Novel LVDC Distribution Grid Substation Converter with High Thermal
Endurance to Pole-to-Pole Short Circuits
Frédéric Reymond-Laruina, EDF, FR
Tuesday, 11 June 2024 / Oral Presentation
Stage: Mailand
Gate Drivers
Chairperson: Mark M. Bakran, University of Bayreuth, DE
11:20 SiC MOSFET Short-Circuit Protection: A Faster Soft Shut Down Method for
Gate Drivers
Julien Weckbrodt, Safran, FR
Stage: Athen
Advanced Control Techniques on Electrical Drives I
Chairperson: Eric Favre, Consultant, CH
PP002 6.5 kV Innovative Silicon Power Device (i-Si) Module with High Power
Density and Low Loss by Stored Carrier Control
Takashi Hirao, Hitachi, J
PP003 High Current Density 4.5kV PressPack IGBTs Push SOA Limits
Hossein Davoodi, Littelfuse, D
PP004 2.5kV IGBT Module with High Reliability for Renewable Applications
Akiyoshi Masuda, Mitsubishi Electric, J
PP005 New Generation 4.5kV IGCT and Fast Recovery Diode for Railway Power
Supply Applications
Umamaheswara Reddy Vemulapati, Hitachi Energy, CH
PP006 Next Generation 4.5 kV IGBT-Only StakPak Module with Reduced Losses
and High Temperature Capability
Jeremy Jones, Hitachi Energy, CH
PP008 Maximum Junction Temperature Simulation and Validation for the Hot Spot
in Multi-Chip SiC Power Module
Wonjin Dylan Cho, onsemi, RK
PP011 PCB Only Thermal Management Techniques for eGAN FETs in a Half-Bridge
Configuration
Adolfo Herrera, Efficient Power Conversion, US
PP015 Holistic Approach to Maximize Lifetime and Power Density in High Power
Semiconductor Modules
Martin Schulz, Littelfuse, DE
PP017 Silicon Interposer as a Substrate for Power Modules with High Power
Density and Superior Thermal Performance
Ahmed Ammar, Lotus Microsystems, DK
PP021 Frequency Shift Keyed Dual Side Control of Inductive Power Transfer: An
Application of Talkative Power Conversion
Hamzeh Beiranvand, Kiel University, DE
PP028 AI-Enhanced Vacuum Reflow Oven: Precision Control for Reliable Large-
Area Soldering
Chih Hui Lee, Mustec, TW
Control Methods I
Chairperson: Ulrich Kirchenberger, STMicroelectronics, DE
PP035 Synthesis of a Field Oriented Control Algorithm by Using two Different Pole-
Zero Compensation Approaches
Marco Denk, University of Applied Sciences Coburg, DE
PP041 Design and Optimization of SiC-Based 11kW Motor Drive with High
Efficiency
Iris Liu, Wolfspeed, CN
PP044 A Novel Hybrid Two-Stage AC-DC Converter with Soft-Switched CCM PFC
Stage for EVs Charging Applications
Lei Wang, University of Sydney, AU
PP046 Low Cost High Density 300W/20V AC-DC Converter Enabled by GaN Power
ICs
Tom Ribarich, Navitas Semiconductor, US
E-Mobility Traction I
Chairperson: Robert Plikat, Volkswagen, DE
PP049 Next Generation Power Module with Parallel Connected SiC MOSFETs for
BEV Traction Inverters
Kohei Tanikawa, ROHM, JP
PP052 HybridPACK Drive Power Modules with SiC-MOSFET’s and Monolithic RC-
Snubber Chips for Optimized Power Density
Andre Uhlemann, Infineon Technologies, DE
PP053 Robust Auxiliary Power Supply for EVs Based on Innovative STi2GaN 650V
IC
Federica Cammarata, STMicroelectronics, IT
Control Techniques
Chairperson: Michael Hartmann, Graz University of Technology, AT
PP056 Optimized Half-Bridge Gate-Drive with Low Time-Skew for RC-IGBTs and
SiC-MOSFET Dead-Time Control
Jan Fuhrmann, University of Rostock, DE
PP062 Enhancing Safety and Efficiency for Isolated PLC I/O Designs with SPI Daisy
Chain
Travis Lenz, Skyworks Solutions, US
Power Quality
Chairperson: Jacques Laeuffer, Dtalents, F
PP065 Design Challenges and Considerations for Gate Drivers of SiC MOSFETS
and their Testing
Niranjan Hegde, Tektronix, IN
PP071 Parasitic Component and Gate Resistance Effects of Internal and External
Package Level on Switching Performance of SiC Power Module
Nguyen Nghia Do, PowerX Semiconductor, CN
Advanced Components
Chairperson: Thomas Ebel, University of Southern Denmark, DK
PP083 Galvanically Isolated Power Supply for Gate Drivers in High Voltage
Applications
Priyanka Ghosh, Helmut-Schmidt-University, DE
PP084 Fabrication Technique for Novel Nanocrystalline Cores with High Saturation
Polarization and Low Losses
Merlin Thamm, Fraunhofer Institute IFAM, DE
Stage: Brüssel 1
GaN Converters
Chairperson: Eckart Hoene, Fraunhofer IZM, DE
Stage:Brüssel 2
Advanced Materials and Technologies
Chairperson: Frank Osterwald, Gesellschaft für Energie und Klimaschutz Schleswig-Holstein, DE
14:30 Power Module Evaluation Using Ultra High Heat Dissipation and High Heat
Resistance Resin Sheet Containing Card House Type Boron Nitride Filler
Ayano Imai, Mitsubishi Chemical, JP
Stage: München 1
Charging Station Technology
Chairperson: Pavol Bauer, Delft University of Technology, NL
Stage: München 2
Modelling and Monitoring
Chairperson: Christina DiMarino, Virginia Tech, USA
14:30 Semiconductor Chip Models are the Key for Enabling Virtual Design and
Optimization Workflows of Power Electronic Systems
Stefan Haensel, Siemens, DE
15:10 Fast Simulator with Inverter Temperature Estimation for Traction eDrives in
Vehicles Subjected to Driving Cycles
Simone Giuffrida, Polytechnic University of Turin, IT
Stage: Mailand
Solid State Transformers
Chairperson: Peter Steimer, Hitachi Energy Switzerland, CH
14:50 Voltage Balancing of a Split-Capacitor IGCT 3L-NPC Leg for the Resonant
DC Transformer
Renan Pillon Barcelos, EPFL, CH
Stage: Athen
Advanced Control Techniques on Electrical Drives II
Chairperson: Manfred Schrödl, Vienna University of Technology, AT
PP094 Reaching Beyond 1200V: Lateral GaN HEMTs for High-Reliability EV and
Industrial Applications
Kamal Varadarajan, Power Integrations, US
PP095 SmartSiC 150 & 200mm Engineered Substrate: Increasing SiC Power Device
Current Density up to 30%
Eric Guiot, SOITEC, FR
PP096 Dynamic Transients and Reliability of High-Voltage Silicon & 4H-SiC Bipolar
Junction Transistors Under Avalanche and Short-Circuits
Mana Hosseinzadehlish, University of Bristol, UK
PP098 SiC MOSFET Die Sorting and Parallel for Optimal Module Design
Zhong Ye, Inventchip Technology, CH
Control Methods II
Francisco Javier Azcondo, University of Cantabria, ES
PP103 Educational Hardware Trainer for Teaching the Dual Active Bridge in a DC
Grid
Peter van Duijsen, The Hague University of Applied Sciences, NL
PP106 Pulse Sharing: Achieving High Efficiency and Excellent Regula-tion in Multi-
Output Flyback Power Supplies
Xingda Yan, Power Integrations, UK
PP110 SiC-IPM for Compact and Energy Efficient Low-Power Motor Drives
JongMu Lee, Alpha and Omega Semiconductor, RK
PP111 Concept for a GaN-Based Intelligent Motor Controller with Integrated Failure
Prediction for the Inverter and the Drive
Christoph Blechinger, Fraunhofer Institute IISB, DE
Tuesday, 11 June 2024, 15:30 – 17:00 hrs / Poster Presentation
PP112 Introducing the New 1200 V CIPOS Maxi IM817 Intelligent Power Module for
Motor Drive Applications
Kihyun Lee, Infineon Technologies, RK
PP113 Thermal Performance of Infineon’s New 600 V CIPOSTM Micro IM241 IPM for
Low Power Motor Drive Systems Without Heatsink
David Jo, Infineon Technologies, RK
PP114 An Adaptive Dead Time Control Based on Switch Node Voltage Derivative
Lukas Knappstein, Technical University of Dortmund, DE
PP115 Coupling Coil Design and Positioning Optimization on New High Power
Semiconductor Module for Fast Short Circuit Detection
Yannick Dumollard, Alstom, FR
PP116 Enabling Active Thermal Control via an Adaptive Multi-Voltage Gate Driver
Tianlong Albert, RWTH Aachen, D
PP118 A New Class of Solid State Isolators Enhances the Reliability of Solid State
Relays
Wolfgang Frank, Infineon Technologies, DE
PP119 A Self-Driving 3-Level Active Gate Driver Network to Control the Switching
Slew Rate for SiC MOSFETs
Vin Loong Choo, Technical University of Dortmund, DE
E-Mobility Traction II
Chairperson: Klaus F. Hoffmann, Helmut-Schmidt-University, DE
PP125 A Novel High Power Density Three Phase Traction Inverter Architecture for
Electric Vehicle (EV) Applications
Yiyang Yan, Huazhong University of Science and Technology, CN
PP126 A Modular DC-Link Capacitor Solution for the Main Powertrain Inverter of
xEV
David Olalla, TDK Electronics, DE
PP128 Short Circuit Robustness for Traction Inverters from an Application Point of
View
Karl Oberdieck, Robert Bosch, DE
Wednesday, 12 June 2024 / Oral Presentation
Stage: Brüssel 1
08:45 Keynote
Infrastructure Requirements for Electrified Heavy Goods Transport in Germany
and the EU
Martin Wietschel, Fraunhofer Institute ISI, DE
Chairperson: Marc Hiller, Karlsruhe Institute of Technology, D
Stage: Brüssel 1
Power Electronics for E-Mobility
Chairperson: Petar J. Grbovic, University of Innsbruck, AT
09:50 Investigation on Direct Liquid Cooling Design of Power Modules with Flat
Baseplate for Automotive Application
Nobuhide Arai, Fuji Electric, JP
10:10 A Novel Approach for Affordable Electric Vehicles Based on Dual 48V Battery
System with Multi-functional 3-Level Converter
Radovan Vuletic, Infineon Technologies, DE
Stage: Brüssel 2
Encapsulation Materials
Chairperson: Aylin Bicakci, University of Applied Sciences Kiel, DE
Stage: München 1
Power Quality
Chairperson: Martin März, Fraunhofer IISB, DE
10:30 High Frequency Active Filter for AC-DC High Power Converters
Sarah Sifoune, SATIE, FR
Stage: München 2
Grid Connected Converters
Chairperson: Hans-Günter Eckel, University of Rostock, D
10:10 Relaxed Robust Control with Pragmatic Shortage of Passivity for Wind,
Storage and PV Power Converters
Sergio de Lopez Diz, Gemesa Elelctric, ES
Stage: Mailand
Passive Components
Chairperson: Thomas Ebel, University of Southern Denmark, DK
11:10 Study on Sample Geometries for Ferrite Characterisation in the MHz Range
Till Piepenbrock, Paderborn University, DE
Stage: Athen
Drives for High Demanding Applications
Chairperson: Jose Mario Pacas, University of Siegen, D
10:10 A Novel Permanent Magnet Synchronous Motor Drive for Reaction Wheels in
Satellites
Baris Colak, TUBITAK UZAY Space Technologies Research Institute, TR
11:10 High Power Density System Design for GaN-based LV Motor Drives
Marco Cannone, Infineon Technologies, AT
11:30 Design of GaN Transistor based Variable Speed Drive Inverter with Output
Voltage Filtering
Kaspars Kroics, Riga Technical University, LV
PP129 The Impact of The Deadtime on The Stability of 1.2kV SiC MOSFET Body
Diode Under Hard Switching with Synchronous Rectification
Mohammed Amer Karout, University of Warwick, UK
PP130 RC-DC Snubber Implementation for Suppression of Diode Voltage Peak and
Ringing in a Full SiC Half-Bridge Power Module
Emanuela Alfonzetti, STMicroelectronics, IT
PP143 Advanced cooling of power electronics with copper cold sprayed aluminium
heatsinks & busbars
Michael Dasch, Impact Innovations, DE
PP144 Cold Plate Design for Cooling LV100 Silicon Carbide Power Module
Packaging
Wahid Cherief, Mersen, FR
Reliability Testing
Chairperson: Shiori Idaka, Mitsubishi Electric Europe, DE
PP146 Power Cycling of 1.7kV Multi-Chip Power Modules – SiC MOSFETs vs Silicon
IGBTs
Nick Baker, University of Alabama, US
PP147 Power Cycling Capability of Discrete SiC MOSFET Devices with Different
Designs
Luhong Xie, North China Electric Power University, CN
PP149 Influence of Transfer Molding on the Reliability of DCM SiC Pow-er Modules
Jacek Rudzki, Semikron Danfoss, DE
PP150 Damp Heat Behavior of High Heat Capacitors for Applications in Electric
Vehicles
Adel Bastawros, Sabic, US
PP151 Influence of the Gate Voltage During On-Time on the Power Cycling
Capability of SiC MOSFETs
Patrick Heimler, Chemnitz University of Technology, DE
PP156 New 2kV SiC-MOS Technology for Application Fields in the Industrial
Landscape
Igor Kasko, ROHM Semiconductor, DE
PP164 A New 2.3 kV Rated SiC MOSFET Module with Low-Inductance High-Power
Package HPnC for 1500 VDC Applications
Junya Kawabata, Fuji Electric, JP
DC-DC Converter I
Chairperson: Bernhard Strzalkowski, Analog Devices, DE
PP180 A SiC Based 60kW LLC Converter with Novel Transformer Design for
Improving Voltage Balance
Frank Wei, Wolfspeed, CN
PP183 3.6kW High Efficiency SiC-based HV/LV DC-DC Converter for EVs
Veera Bharath Chandra Reddy Gandluru, Wolfspeed, US
PP186 22kW IMS-based Bidirectional DC-DC Converter Using Surface Mount SiC
MOSFETs for OBCs
Hamlin Wang, Wolfspeed, CN
Smart-Grid Technologies
Chairperson: Thomas Brückner, Universität der Bundeswehr München, DE
PP189 Adaptive Fast Charging System with Second Life Batteries - an Overview of a
Research Project
Lukas Böhning, Fulda University of Applied Sciences, DE
PP192 21 kA Solid State DC Breaker for Supergrid Institute’s High Power Test
Facility
Christophe Conilh, GE Power Conversion, FR
PP193 Design and Analysis of a 50kW SiC-Based Active Front End with a Very Small
Line Choke for DC-Grids
Raphael Otte, University of Applied Sciences and Arts Ostwestfalen-Lippe, DE
PP194 Investigation of Load Transitions Between Loaded and Load Free Conductor
Segments in Industrial Conductor Systems
Jan-Niklas Koch, University of Applied Sciences and Arts Ostwestfalen-Lippe, DE
PP197 Studying Convertors for Voltage Equalization in Energy Storage System with
Active BMS
Dimitar Arnaudov, Technical University of Sofia, BG
PP198 Challenges of High Side Gate Driver and Disconnect MOSFET for Battery
Protection Unit during Start-up, Turn-off and Over Current Events
Niranjan Reddy Suravarapu, Infineon Technologies, AT
PP201 Battery Charger with Impedance Spectroscopy Capability for Li-Ion Cells
Christian Branas, University of Cantabria, ES
EMC
Chairperson: Andreas Lindemann, Otto-Guericke-University Magdeburg, DE
PP202 Efficiency, Volume and CO2 Emissions Impact in a PFC Converter with an
Active Filter Solution for OBC Application
Kelly Ribeiro, Valeo, FR
PP203 Analytical and Experimental Validation Common Mode Feedback Loop for a
Three-Phase_Level Vienna Rectifier
Daniel San Laureano Igartuburu, Indra, ES
Wednesday, 12 June 2024, 13:00 – 14:30 hrs / Poster Presentation
Advanced Design
Chairperson: Anton Z. Miric, Heraeus, DE
PP208 Applied Design Automation for Finding Feasible Designs for High-Frequency
Planar Transformers
Rando Raßmann, University of Applied Sciences of Kiel, DE
Inductors
Chairperson: Wolfram Teppan, LEM INTERNATIONAL, CH
PP215 2D Copper Loss Analytical Model for Planar Inductor Combining High and
Low Permeability Materials
Idriss Nachete, University of Lille, FR
Wednesday, 12 June 2024, 13:00 – 14:30 hrs / Poster Presentation
PP1218 Design and Performance Evaluation of Air Core Inductors for Very High
Frequency Power Conversion
Florentin Salomez, G2Elab, FR
Stage: Brüssel 1
IGBT
Chairperson: Thomas Basler, Chemnitz University of Technology, DE
14:30 The 8TH Generation LV100 IGBT Module with Higher Current Rating
Daichi Otori, Mitsubishi Electric, JP
14:50 New Planar 4.5 kV Split-gate (SG) Si-IGBT Device for Improved Switching
Characteristics and High Frequency Operation
Gaurav Gupta, Hitachi Energy, CH
Stage: Brüssel 2
Device Concepts
Chairperson: Katsuaki Saito, Nexperia, J
14:50 More than 1200 V Breakdown and Low Area-Specific On State Resistances by
Progress in Lateral GaN-on-Si and GaN-on-Insulator Technologies
Richard Reiner, Fraunhofer Institute IAF, DE
15:10 Novel 200 V MOSFET Technology Pushes Motor Drive Inverter Efficiency to an
Unprecedented Level
Mark Thomas, Infineon Technologies, AT
Stage: München 1
Degradation Mechanisms
Chairperson: Jürgen Schuderer, Hitachi Energy Switzerland, CH
14:30 Moisture Robust Chip Design - Improved Edge-Terminations for High Lifetime
under High Humid Conditions
Michael Hanf, University of Bremen, DE
14:50 Method for Measuring the Initial State of a Solder Joint Delamination in a 3D PCB
Integration Assembly of SiC MOSFETs
Souhila Bouzerd, University Gustave Eiffel, FR
15:10 Generic Lifetime Model for Wire Bonds Degradation in IGBT Modules Based on a
Fracture Mechanics Parameter
Merouane Ouhab, Mitsubishi Electric, FR
Wednesday, 12 June 2024 / Oral Presentation
Stage: München 2
Advanced Conversion Concepts
Chairperson: Ilknur Colak, Schneider Electric, FR
14:30 Modular Coaxial Power Converter for High-Density Integration into Medium-
Voltage Cables
Mark Cairnie, Virginia Polytechnic and State University, US
15:10 Influence of Varying Common Mode Choke Sizes on the Performance and
Stability of an Active EMI Filter
Patrick Körner, Vitesco Technologies, DE
Stage: Mailand
Photovoltaic Systems
Chairperson: Steffan Hansen, SMA, DE
14:30 A High Efficiency Battery Charger with Maximum Power Point Tracking for
Magnetic Energy Harvesters
Antonio Miguel Munoz Gomez, CIRCE Foundation, ES
Stage: Athen
Model Based System Analysis
Chairperson: Jens Schmenger, Siemens, DE
14:30 Optimising a Power Module for Electrical and Thermal Performance and
Symmetry Using EDA Tools
Wilfried Wessel, Siemens EDA, DE
E-Mobility Charging
Chairperson: Giuseppe Tomasso, University of Cassino and South Lazio, IT
PP227 Comparison of Two Bidirectional 11KW 400V CLLC and CLLLC Resonant
Converters for EV Applications
Hasan Mousavi Somarin, Valeo, FR
PP228 Dynamic Wireless Charging System Design for Extra-Urban Areas based on
Resonant Inductive Power Transfer
Irene Maria Torres Alfonso, CIRCE, FR
PP229 Bidirectional Isolated 400-12V DC-DC Converter with Improved Power Density
and Full-Range Operaion for EV Applications
Hector Sarnago, University of Zaragoza, ES
PP230 Gain Optimization Control Method for CLLLC Resonant Converters under
Phase Shift Mode
Sean Yu, Texas Instruments, US
PP231 Analysis of Common and Split DC-Bus Interleaved H-Bridge Converters for
High-Current Low-Ripple Applications
Bhavana Gudala, University of Bologna, IT
Wednesday, 12 June 2024, 15:30 – 17:00 hrs / Poster Presentation
PP232 Optimal Frequency Operating Points for Hybrid Switched Capacitor Converters
and Lossless Current Sense Method
Simone Mazzer, Infineon Technology, AT
PP234 30kW - 97% Efficiency Isolated DC-DC Converter with Large Input Voltage
Range Based on a Boost DAB Association
Jean-Jacques Huselstein, University of Montpellier, FR
DC-DC Converter II
Chairperson: Philip C. Kjaer, Vestas Wind Systems, DK
PP238 A Balancing Converter with Series Connected MOSFETs for +/-700V Bipolar DC
Grids
Sachin Yadav, Delft University of Technology, NL
PP240 Interleaved Boost Converter Efficiency and Power Density Model for Active and
Passive Component Design
Damien Lemaitre, CEA, FR
PP241 Evaluation of a Hybrid Power Switch Based on Trench Clustered IGBT and SiC
MOSFET
Alireza Sheikhan, University of Sheffield, UK
PP242 Contributions for Building Blocks for Normally-off 650V GaN-on-Si Power
Integrated Circuits
Thanh Hai Phung, Wise-Integration, FR
Wednesday, 12 June 2024, 15:30 – 17:00 hrs / Poster Presentation
PP244 ISO247: High Performance Ceramic based Advanced Isolated Discrete Package
to Fully Exploit the Advantages of SiC MOSFET
Sachin Shridhar Paradkar, Littelfuse, DE
Advanced Control
Chairperson: Gianmario Pellegrino, Polytechnic University of Turin, IT
SiC MOSFET
Chairperson: Marija Jankovic, ROHM Semiconductor GmbH, DE
PP255 Assessment of the Rds,on of SiC MOSFET Dies Through Kelvin Wire
Connection
Philipp Rehlaender, onsemi, DE
PP258 Characterizing the Switching Behavior of a 1.2 kV mixed SiC JFET and MOSFET
Half Bridge
Tim Ringelmann, University of Bayreuth, DE
PP259 Performance Evaluation of the Packaging of SiC Diodes in a 6.78 MHz Wireless
Power Transfer System
Ioannis Nikiforidis, Imperial College London, UK
PP261 Evaluation of SiC Devices for Over 500khz Application Based on Buck Circuit
Minli Jia, Navitas Semiconductor, CN
Stage: Brüssel 1
08:45 Keynote
Challenges and Solutions to Power Latest Processor Generations for Hyper
Scale Datacenters
Gerald Deboy, Infineon Technologies, AT
Chairperson: Johann Walter Kolar, ETH Zurich, CH
Stage: Brüssel 1
SiC Devices
Chairperson: Ulrich Kirchenberger, STMicroelectronics, DE
09:50 The New CoolSiC MOSFET 1200 V G2: Electrical Performance and Compact
Modelling
Andreas Huerner, Infineon Technologies, DE
10:50 Dead Time Optimization for High Power SiC MOSFET Module in Consideration of
Parasitic Components
Pham Ha Trieu To, University of Rostock, DE
Thursday, 13 June 2024 / Oral Presentation
Stage: München 1
WBG Reliability
Chairperson: Nando Kaminski, University of Bremen, DE
09:50 Performance Instability of 650 V p-GaN Gate HEMT Device under Temperature-
related Positive Gate Bias Stresses
Renze Yu, University of Bristol, UK
10:10 Gate Oxide Reliability of Current Generation 1.2 kV SiC MOSFETs under Step-
Wise Increased Gate Voltage
Roman Boldyrjew-Mast, Chemnitz University of Technology, DE
10:30 An Accelerated Dynamic Gate Switching Stress Test Concept of SiC MOSFETs at
High Drain-Source Voltage (HV-GSS)
Clemens Herrmann, Chemnitz University of Technology, DE
Stage: München 2
Power Electronics for E-Mobility/ Control
Chairperson: Bernd Eckardt, Fraunhofer IISB, DE
10:10 Evaluation of Active Gate Drivers with Switchable Gate Resistors and
Intermediate Voltage Levels for SiC MOSFETs in WLTC
Michael Frank, University of Bayreuth, DE
10:50 A Partial Load Three-Phase Triangular Current Mode Modulation Concept with
an Optimized Filter Inductor for High Efficiency Traction Drives
Bhaskar Chatterjee, Robert Bosch, DE
Thursday, 13 June 2024 / Oral Presentation
Stage: Mailand
DC-DC Converters I
Chairperson: Drazen Dujic, Power Electronics Laboratory, EPFL, CH
Stage: Athen
PFC Converters
Chairperson: Marija Jankovic, ROHM Semiconductor, DE
09:50 High-Density 3 kW GaN Rectifier for Server Applications Comprising a 130 kHz
Totem-Pole PFC and a 500 kHz LLC
Manuel Escudero Rodriguez, Infineon Technologies, AT
10:50 GaN Based Bi-Directional 6.6kW Interleaved Totem-Pole PFC with 13kW/L
Power Density and High Efficiency
Juncheng Lu, Infineon Technologies, CA
SiC Ruggedness
Chairperson: Ole Gerkensmeyer, Wolfspeed, DE
PP267 Rapid Short Circuit Protection Using didt Detection for SiC Power Modules
Koki Samura, Mitsubishi Electric, JP
PP271 Behavior Modelling the Short Circuit Characteristics of SiC MOSFETs Using
Compact Models
Qing Sun, Infineon, DE
Thermal Characterization
Chairperson: Stéphane Lefebvre, CNAM - SATIE, FR
PP273 Thermal Analysis and Modelling of Charging Stations for Electric Vehicles
Ruben Kopischke, University of Kassel, DE
PP281 Power Module Solutions with Improved Reliability for Elevator Drive
Applications
Tiago Jappe, Vincotech, DE
PP283 Thermal and Reliability Optimization of Clips in SiC MOSFET Power Modules
Zexiang Zheng, Huazhong University of Science and Technology, CN
PP285 A Simple and Low Cost Overcurrent Protection System Based on Commercial
Shunt for Wide-Bandgap Devices
Emanuele Martano, University of Cassino and Southern Lazio, IT
PP288 A Behavioral Transient Model for IGBT Device with Anti Parallel Freewheeling
Diode
Shiwu Zhu, Nexperia, UK
PP291 Next Level of Power Module Solution for PV C&I String Inverter with 1200V H7
Technology in Easy3B Package
Tilo Poller, Infineon Technologies, DE
PP296 Paris Law Applied to Wire Bonds Degradation Using Crack Growth
Measurement
Merouane Ouhab, Mitsubishi Electric, FR
PP300 GaN Cascode in High Speed Driven Air Compressors for Automotive Fuel Cells
Florian Lippold, Technical University of Braunschweig, DE
PP306 Evaluation of New Modulation Scheme for 3L-ANPC Using Both Current Paths
in Zero State
Felix Eichler, Technical University of Dresden, DE
PP309 High Resolution Mixed-Signal Pulse Width Modulator for High-Frequency DC-
DC Converters
Tim McRae, University of Southern Denmark, DK
PP310 Implementation and Control of Optimized Pulse Patterns for Salient Permanent
Magnet Synchronous Machines in Electric Vehicles
Maximilian Hepp, Mercedes-Benz, DE
PP311 A 3-Leg Interleaved TP PFC with a 90˚ Phase-Shifted Asymmetric Leg for
Reduced Magnetics
Serkan Dusmez, Wat Motor, TR
Thursday, 13 June 2024, 11:15 – 12:45 hrs / Poster Presentation
PP313 CCM Totem-pole PFC for Ultra-High Power Density USB-PD Chargers
Manuel Rodriguez Escudero, Infineon Technologies, AUT
PP314 Comparison of Hybrid Si/SiC and SiC Two-Level and Three-Level Converters
for Low-Voltage Low-Power Applications
Tim Augustin, Hitachi Energy Research, SW
PP315 Analysis of Analogue Current and Flux Balancing for the Dual-Active-Bridge
Converter
Christophe Basso, Future Electronics, FR
PP318 Analysis, Modeling, Design, and Limitations of Current Injection based UPF
Rectifier with Small DC-Link Capacitor
Ramkrishan Maheshwari, University of Southern Denmark, DK
PP319 High-Efficient Isolated AC-DC Converter with Circulating Current Reduction for
AC Adapters
Hiroki Watanabe, Nagaoka University of Technology, JP
PP320 A Phase-Locked Loop (PLL) based Strategy for Accurate Blanking Times in
Bridgeless Totem-Pole PFCs
Sandu Tigira Tigira, University of Cantabria, ES
PP322 Comparison of 4500V State-of-the-Art XHP3 IGBT and Conventional IHV IGBT
for 3300V 3-Level ANPC Medium Voltage Drives
Martin Knecht, Infineon Integrated Circuit, CN
Thursday, 13 June 2024, 11:15 – 12:45 hrs / Poster Presentation
PP326 Single-Stage LED Driver Based on Coupled Inductor Power Factor Correction
and LLC Converter
Alireza Ramezan Ghanbari, V-Research, AT
PP327 A Inverse Coupled DC-DC Boost Inductor with 2-kV SiC MOSFET Module for
1500V Solar Inverter MPPT
Yusi Liu, onsemi, US
PP329 Switching Performance Comparison of 3.3 kV SiC MOSFET and Si IGBT Power
Modules for Railway Traction Systems
Yue Zhao, University of Arkansas, US
PP341 Design of a High Power Density Inverter and FOC Implementation for UAVs
Matthias Neuner, MCI Internationale Bildung & Wissenschaft, AT
PP342 Highly-Integrated, Flexible Power Solution for Aerospace 5kVA – 20 kVA Motor
Drive Applications
Alain Calmels, Microchip Technology, IR
PP344 Design and Analysis of Gate-Driver for SiC-based Inverter for Megawatt Scale
All Electric Aircraft
Ankit Pal, DLR, DE
Thursday, 13 June 2024, 11:15 – 12:45 hrs / Poster Presentation
PP345 Addressing Testing Challenges for Power Modules and Three-Level Inverters
Oleg Fotteler, SPEA, IT
Transformers
Chairperson: Bernhard Strzalkowski, Analog Devices, DE
PP351 Core Loss Model for considering Anisotropy and Temperature Effects on
Electrical Steel under Power Electronic Conditions
Michael Owzareck, Block Transformatoren-Elektronik, DE
PP353 Circular Economy Oriented and Reconfigurable Planar Transformer Design for
Isolated DC-DC Converters
Fabian Groon, University of Kiel, DE
Stage: Brüssel 1
SiC Modules
Chairperson: Philippe Ladoux, University of Toulouse, FR
14:40 Extremely Compact SiC Power Module for EV Traction Inverters in the 250 kW
Class
Raffael Schnell, SwissEM Technologies, CH
15:00 Benefits of .XT Interconnection Technology for 3.3 kV XHP 2 Module with 3.3
kV CoolSiC MOSFET
Matthias Bürger, Infineon Technologies, DE
Stage: München 1
Advanced Cooling
Chairperson: Uwe Schilling, Semikron Danfoss, DE
15:00 Advanced Pumped Two-Phase Cold Plate for Cooling Power Electronics
Elisabeth Seber, Advanced Cooling Technologies, US
Thursday, 13 June 2024 / Oral Presentation
Stage: München 2
DC-DC Converters II
Chairperson: Thiago Batista Soeiro, University of Twente, NL
14:00 Feasibility Study of High-Power Density Isolated CLLC DC-DC Interface with
Wide Range of Voltage/Current Regulation
Oleksandr Husev, Tallinn University of Technology, EE
14:40 Optimized Current Sharing Technique for Interleaved CLLC Converters for
Minimal Output Current Distortion
Martin Gendrin, Fraunhofer Istitute ISE, DE
Stage: Mailand
Smart Grid
Chairperson: Klaus Rigbers, SMA Solar Technology, DE
14:00 Low Voltage DC-Grids with Galvanic Isolation: System Discussion, Efficiency
and Performance Comparison to AC-Feeding
Lukas Fräger, BLOCK Transformatoren-Elektronik, DE
Stage: Athen
Measurement Techniques and Methods
Chairperson: Wolfram Teppan, LEM INTERNATIONAL, CH
14:20 ‘Infinity Gate Sensor’: a Differential Magnetic Field Sensor for Measuring Gate
Current of SiC Power Transistors
Yushi Wang, University of Bristol, UK
14:40 Characterising Wide Bandgap Power Modules: Validating the M-Shunt Concept
for High-Power Applications in the Kiloampere Range
Hauke Lutzen, University of Bremen, DE