Electron Mobility Calculation in Gaas and The Effects of Fast Neutron Radiation On Its Crystal Structure
Electron Mobility Calculation in Gaas and The Effects of Fast Neutron Radiation On Its Crystal Structure
Electron Mobility Calculation in Gaas and The Effects of Fast Neutron Radiation On Its Crystal Structure
(1)
where D
ac
is the acoustic deformation potential, is the
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material density and o is the non-parabolicity coefficient. The formula clearly shows that the acoustic
scattering increases with temperature.
Piezoelectric scattering
The second type of electron scattering by acoustic modes occurs when the displacements of the
atoms create an electric field through the piezoelectric effect. This can occur in the compound
semiconductors such as the III-V and II-VI materials including GaAs, which in fact has a relatively
large piezoelectric constant. The piezoelectric scattering rate for an electron of energy E in an isotropic,
parabolic band has been discussed by Ridley [7] who included the modification of the Coulomb
potential due to free carrier screening. The screened Coulomb potential is written as
r
r q e
r V
s
) exp(
4
) (
0
0
2
=
c tc
(2)
where c
s
is the relative dielectric constant of the material and q
0
is the inverse screening length, which
under non-degenerate conditions is given by
T K
ne
q
B s
c c
0
2
2
0
= (3)
where n is the electron density. The expression for the scattering rate of an electron in a non-parabolic
band structure retaining only the important terms can be written as [6-7]
(
(
|
|
.
|
\
|
+
+
+
+
+ =
2
* 2
0
2 2
0
2
*
2 2 / 1
0
2
2 2 *
2 1
2
) ( 8 / 1
1 ) ( 8
1 ln(
) 2 1 )( (
2 4
) (
E
E
E m q q
E m
E E
T K K e m
k R
s
B av
pz
o
o
o
c c t
(4)
where K
av
is the dimensionless so called average electromechanical coupling constant.
Polar optical phonon scattering
The dipolar electric field arising from the opposite displacement of the negatively and positively
charged atoms provides a coupling between the electrons and the lattice which results in electron
scattering. This type of scattering is called polar optical phonon scattering and at room temperature is
generally the most important scattering mechanism for electrons in III-V semiconductors, and this is
also the case in GaAs despite the fact that the optical phonon energy is particularly high at ~ 93 meV
which suppresses the phonon population and also electrons must reach that energy before phonon
emission is possible. The scattering rate due to this process for an electron of energy E in an isotropic,
non-parabolic band is [6-7]
{ } 1 , ) ' , (
) (
' 2 1
)
1 1
(
8
2
) (
0
2 / 1
0
2 *
+
+
=
op op
s
op
po
N N E E F
E
E
e m
k R
o
c c tc
e
(5)
where
| |
| |
) ' 2 1 )( 2 1 )( ' 1 )( 1 ( 4
) ' ( ) ' 1 )( 1 ( 4 2
) ' ( ) ' 1 )( 1 ( 2
) ' ( ) (
) ' ( ) (
ln ) ' , (
2 / 1 ' 2 / 1
2
2 / 1 2 / 1
2 / 1 2 / 1
1
0
E E E E C
E E B
E E A
B
E E
E E
A C E E F
o o o o
o o o o
o o o
+ + + + =
+ + + + =
+ + + + =
)
`
+
=
where N
op
is the phonon occupation number and the upper and lower cases refer to absorption and
emission, respectively. For small electric fields, the phonon population will be very close to
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equilibrium so that the average number of phonons is given by the Bose-Einstein distribution
1 ) exp(
1
=
T K
N
B
op
op
e
(6)
where
op
e is the polar optical phonon energy.
Non-polar optical phonon scattering
Non-polar optical phonon scattering is similar to deformation potential scattering, in that the
deformation of the lattice produces a perturbing potential but in this case the deformation is carried by
optical vibrations. The non-polar optical phonon scattering rate in non-parabolic bands is given by [6-
7]
| | 1 , ) ( ) 2 1 (
2
) (
) (
2 / 1
3
2 / 1 * 2 * 2
+ + =
op op
op
l t od
npo
N N E E
m m D
k R o
e t
(7)
where D
od
is the optical deformation potential and
op
E E e = '
is the final state energy phonon
absorption (upper case) and emission (lower case).
Intravalley impurity scattering
This scattering process arises as a result of the presence of impurities in a semiconductor. The
substitution of an impurity atom on a lattice site will perturb the periodic crystal potential and result in
scattering of an electron. Since the mass of the impurity greatly exceeds that of an electron and the
impurity is bonded to neighboring atoms, this scattering is very close to being elastic. Ionized impurity
scattering is dominant at low temperatures because, as the thermal velocity of the electrons decreases,
the effect of long-range Coulombic interactions on their motion is increased. The electron scattering by
ionized impurity centres has been discussed by Brooks-Herring [9] who included the modification of
the Coulomb potential due to free carrier screening. The scattering rate for an isotropic, non-parabolic
band structure is given by [6-7]
0
6 / 1 * 2 *
2 / 1 2 / 1 * 2 *
0
2
4
/ ) )( ( 2 4 1
2 1
) ( ) (
8
) (
q m m E
E
E m m
q k
e n
k R
l t
l t
s
i
im
o
t
+
+
= (8)
where n
i
is the impurity concentration, q
0
is the screening length and k
s
is the dielectric constant of the
material.
3. Theory of atom displacement
A primary recoil atom is produced when an energetic incident particle such as fast neutron undergoes a
collision with a lattice atom. If the energy transferred to the primary knock-on atom (PKA)is large
enough, E >> Ed, (where Ed=30eV; the average energy for one displacement), the PKA can continue
the knock-on atom processes, producing secondary recoil atom displacements, which in turn can
displace additional atoms. Such an event will result in many collision and displacement events
occurring in near proximity of each other. The multiple displacement sequence of collision events is
commonly referred to as a collision or displacement cascade. Transferred energy to a PKA with atomic
mass number A, when occurred and that a neutron of energy E recoiled, is given by
( ) 2 ) 1 /( 4 cos 2 2 / 1
0 1
2
0
2
1
A AE v v v v T + = + + = u (9)
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where v
1
is the velocity of scattering atom after collision, and v
0
is the centre of mass velocity.
The original model for displacement damage, developed initially for simple metals, is due to
Kinchin and Pease [8], and the standard formulation of it by Norgett et al. [7], often referred to
as the NRT model. MCNP is a general-purpose Monte Carlo neutron, photon, and electron
transport code. It has continuous-energy physics and is time-dependent. The geometry is any
arbitrary configuration of three dimensional surfaces. It is used for radiation shielding,
criticality safety, nuclear design, aerospace, medical, nonproliferation, radiation dose and other
applications by several thousand users worldwide. This code is used to simulate one neutron at a
time and records its history. The neutron energy deposition in the crystal has been calculated by
tally F6:n for different neutron sources: mono-energy, Am-Be and
252
Cf sources.
4. Calculation results
We have performed a series of low-field electron mobility calculations in GaAs material. Low-field
mobility has been derived using iteration method.
Figure 1 shows the calculated electron drift mobility in bulk GaAs material as a function of
temperature with free electron concentration of 10
21
to 10
23
m
-3
and with the electric field applied along
one of the cubic axes. It can be seen from the figure that the electron drift mobility at room temperature
that we find for GaAs is 3000 cm
2
/V-s at 10
23
m
-3
donor concentration. The results plotted in figure 1
indicate that the electron drift mobility of GaAs is lower at donor concentration of 10
23
m
-3
at all
temperatures. This is largely due to the higher electron scattering rate. Also it can be seen that below
100 K, ionized impurity scattering is the dominant forms of lattice scattering.
100 200 300 400 500 600
10
2
10
3
10
4
10
5
10
6
E
l
e
c
t
r
o
n
M
o
b
i
l
i
t
y
(
c
m
2
/
V
.
S
)
Temperature ( K)
N
d
=10
21
m
-3
N
d
=10
22
m
-3
N
d
=10
23
m
-3
Fig 1. Electron drift mobility vs temperature of pure intrinsic GaAs with free electron concentration up
to10
23
m
-3
.
Figure 2 shows the calculated variation of the electron drift mobility as a function of free electron
concentration for all crystal structures at temperatures up to 600 K. The mobility does not vary
monotonically between free electron concentrations of 10
20
m
-3
and 10
24
m
-3
due to the dependence of
electron scattering on free electron concentration, but shows a maximum near 10
20
m
-3
for all
temperatures.
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Vol. 1, No.6, 2011
0.0
2.0x10
23
4.0x10
23
6.0x10
23
8.0x10
23
1.0x10
24
0
200
400
600
800
1000
1200
1400
1600
1800
2000
E
l
e
c
t
r
o
n
M
o
b
i
l
i
t
y
(
c
m
2
/
v
.
s
)
Electron Density ( m
-3
)
T=300 K
T=450 K
T=600 K
Fig 2. Calculated low-field electron drift mobility of GaAs as a
function of different free electron concentration at temperature up to 600 K.
We have also calculated neutron energy deposition on GaAs crystal using MCNP code. The GaAs
crystal is placed at different distances from point neutron sources with constant mono-energy and
continuous energy spectrum such as Am-Be and
252
Cf source. Then, the amount of deposition energy
per gram of crystal was calculated by F6:n tally of MCNP code. The amount of deposition energy per
gram for different GaAs crystal for Am-Be source as function of distance, per one neutron of source is
illustrated in figure 3a. By using this data and the NRT model, the atom displacements rate for GaAs
crystals have been evaluated. These results are shown in figure 3b.
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Vol. 1, No.6, 2011
0 1 2 3 4 5
0.000
0.001
0.002
0.003
0.004
0.005
0.006
(a)
D
e
p
o
s
i
t
i
o
n
e
n
e
r
g
y
p
e
r
n
e
u
t
r
o
n
(
M
e
V
/
g
)
Distance from source ( cm )
Crystal size=0.3*0.3 cm
2
Crystal size=0.8*0.8 cm
2
Crystal size=1.5*1.5 cm
2
Energy = 10 MeV
0 1 2 3 4 5
0.0
1.0x10
-4
2.0x10
-4
3.0x10
-4
4.0x10
-4
5.0x10
-4
(b)
D
e
p
o
s
i
t
i
o
n
e
n
e
r
g
y
p
e
r
n
e
u
t
r
o
n
(
M
e
V
/
g
)
Distance from source (cm )
Crystal size=0.3*0.3 cm
2
Crystal size=0.8*0.8 cm
2
Crystal size=1.5*1.5 cm
2
Energy = 1 MeV
Figure 3: (a) Energy deposition per gram in different GaAs crystal due to an Am-Be source; (b) the
atom displacements rate.
The amount of deposition energy per gram in different GaAs crystal size due to different mono energy
rate in figure 3b has been shown. A comparison of atom displacements rate due function of distance is
illustrated in figure 4a and 4b shows the atom displacements rate placed on a point 2 MeV neutron
source as a function of distance. The corresponding result for a
252
Cf source is shown figure 4a, and the
atom displacements atom displacements rate in figure 4b. Energy deposition and corresponding atom
displacements rate are decreases mostly by 1/r
2
as we expected.
A comparison of atom displacements rate due to different sources located in 5 cm far from the crystal
have been illustrated in figure 4. It can be seen that the neutron average energy of the source increases
as well as the corresponding damage growing up.
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Vol. 1, No.6, 2011
0 1 2 3 4 5
0.0
0.6
1.2
1.8
2.4
3.0
(a)
A
t
o
m
i
c
D
i
s
p
l
a
c
e
m
e
n
t
R
a
t
e
(
P
e
r
N
e
u
t
r
o
n
)
Distance from source (cm)
1.5*1.5
0.8*0.8
0.3*0.3
Energy = 1 MeV
0 1 2 3 4 5
0.5
1.0
1.5
2.0
(b)
A
t
o
m
i
c
D
i
s
p
l
a
c
e
m
e
n
t
R
a
t
e
(
P
e
r
N
e
u
t
r
o
n
)
Distance from source (cm)
1.5*1.5
0.8*0.8
0.3*0.3
Energy = 10 Mev
Figure 4: Comparison of atom displacements rate in GaAs crystals that placed on
5 cm of different sources at different energy.
5. Conclusion
Using an iteration method, it was shown that the electron-phonon scattering in the I valley
substantially affects the electron energy distribution function and transport properties in GaAs. It is
shown that the threshold electric field and maximum drift velocity increase by %30 and %17,
respectively, and Ohmic mobility drops by %15. This is caused by combined effects of effective
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Vol. 1, No.6, 2011
cooling of electron gas by electron-phonon scattering and predominantly forward peaked momentum
relaxation for all electron momenta. Our calculation results show also that the amount of deposition
energy per gram of GaAs crystals and total number of atom displacements are a function of crystal
sizes. Collision and displacement events occur more in larger crystal, because a neutron leaves crystal,
after more collision. As well as, atom displacements increase when the energy of the source accrues.
The amount of deposition energy per gram of crystal decreases if the distance between source and
crystal get larger. It is because the reaction surface reduces than reaction volume.
6. References
[1] Arabshahi H, Comparison of SiC and ZnO field effect transistors for high power applications,
Modern Phys. Lett. B, 23 (2009) 2533-2539.
[2] Arabshahi H, Potential performance of SiC and GaN based metal semiconductor field effect
transistors, Brazilian J. Phys. 39 (2009) 35-39.
[3] K. Bhattacharyya, S. M. Goodnick and J. F. Wager, J. Appl. Phys. 73 (1993) 3390-3398.
[4] J. Fogarty, W. Kong and R. Solanki, Solid State Electronics 38 (1995) 653-659.
[5] Farahmand M, Garetto C, Bellotti E, Brennan K F, Goano M, Ghillino E, Ghione G,
and Ruden P, Monte Carlo simulation of electron transport in the III-nitride wurtzite phase
materials system: binaries and ternaries, IEEE Transactions on Electron Devices, 48
(2001) 535-539.
[6] Jacoboni C and Lugli P, The Monte Carlo method for semiconductor and device
simulation, Springer- Verlag, (1989).
[7] Moglestue C, Monte Carlo simulation of semiconductor devices, Chapman & Hall, (1993).
[8] O'Leary S, Foutz B, Shur M S and Eastman L F, Steady-state and transient electron
transport within the III-V nitride semiconductors, GaN, AlN, and InN: A review, J. Mater.
Sci.: Mater. Electron. 17 (2006) 87-92.
Authors Profile
Hadi Arabshahi received the B. S degree in physics from the Ferdowsi University
of Mashhad,, Iran, in 1992 and the Ph. D. degree in computational physics from
Durham University, United Kingdom, in 2002. He has published over 145 peer-
reviewed journal papers and contributed to more than 80 conference papers and
presentations. His research activities include semiconductor device simulations, high
field transport properties in bulk and devices, transient relaxation in materials and
devices, simulation of optoelectronic devices, electronics properties of low-
dimensional and curved nanostructures and quantum information.
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