Process Support Products
Process Support Products
Process Support Products
ASMPT is the only equipment manufacturer in the world that is able to offer everything
you need for the stencil printing process: machines and software, consumables,
stencils and toolings, process expertise, and smart process solutions. Only our teams
of experts can adjust each component perfectly to provide you with the best solution
available. The bottom line: only ASMPT guarantees printing excellence.
Our printing solutions deliver maximum productivity, Stencils, toolings and consumables for optimized processes
extreme accuracy, and ease of operation.
Printing processes are complex. The only way to achieve
Excellent hardware with powerful yet easy-to-operate software optimal results is by employing the right stencils, toolings and
– the trademarks of our DEK printing solutions. Users benefit consumables. We are the only equipment manufacturer that can
from outstanding printing accuracy, high yields, and economic provide you with everything you need to optimize your printing
efficiency. Our DEK portfolio of printers features solutions for processes.
every type of production. With their modular design, DEK printers
can be configured for any requirement. State-of-the-art SPI solutions for total process control
Competent support from experienced process experts Optical systems and sensors in our machines ensure closed-loop
process controls and safeguard stable printing processes. As the
Stable, optimized printing processes require more than good industry’s technology leader, ASMPT also counts on innovative
machines and materials – they require process expertise. technologies that offer an entirely new set of possibilities for
The global ASMPT team has decades of experience in stencil process control and optimization.
printing. We gladly share this knowledge with your teams – in
training seminars, workshops, and joint projects. Our application With the WORKS Process Expert, we offer one of most precise
support is there when you need it – online, in our SMT Centers of and flexible SPI solutions on the market that raises your printing
Competence all over the world, or at your location. processes to an entirely new level.
3
Your partner for printing process
optimization
Printing processes are complex. As the world’s only manufacturer of printing
solutions, we are by your side at every point in the process chain.
■ Stencils
- All Materials
- All technologies
- Single-/multi-level
- Coated/uncoated
■ Stencil frame solutions
■ Smart Stencil lifecycle management
■ Stencil storage systems
■ Support solutions
■ Consumables
■ Squeegees
Smart processes
New technologies open up new possibilities.
As the industry’s technology leader, we are
always at the forefront of making your printing
processes future-proof.
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Stencils from Stencil storage systems 57
the global No. 1 9
DEK VectorGuard™ cabinet 60
Stencil network 13 DEK VectorGuard™ tower cabinet 61
DEK VectorGuard™ mobile cabinet 61
Stencils technologies DEK VectorGuard™ working station 62
DEK Fine Grain stencils 14 DEK Mesh-mounted stencils/
DEK Multi-level stencils 15 DEK Precision screens storage 62
DEK Electroform solutions 16
DEK Electroform 3D stencils 18 Consumables 65
DEK Electroform Variable Aperture
Height Technology (VAHT) 19 DEK Ultra-Fine Pitch (UFP)
DEK Electroform Mini LED Stencil 20 ECO understencil cleaning rolls 67
Dek Electroform Stencil – Eform-Eco 21
DEK PumpPrint™ / Adhesive stencils 22 DEK SMT high performance
understencil cleaning fabrics 69
Pre-saturated wipes
Smart Stencil 25
DEK Hand cleaner wipes 71
DEK IPA/DI wipes 71
DEK IPA/DI 96% wipes 71
Stencil frame solutions 29
DEK Stencil cleaner wipes 71
DEK Adhesive remover wipes 71
DEK VectorGuard™ frame solutions 32
DEK Mesh-mounted frame solution 35
Cleaning sprays
DEK SMT stencil cleaner 72
DEK Reflow oven cleaner 72
Substrat support solutions 37
Gloves
Singulated Substrates Support 40
DEK Latex gloves 73
DEK Multiple Alignment of Singulated
DEK Powder-free blue nitrile gloves 73
Substrates (MASS) 41
DEK Topside Reference System (TRS) 42
High-purity precision
DEK Virtual Panel Tooling (VPT) 43
cleaning dry wipes
DEK Non-woven material wipes 74
PCB Standard Support 44
DEK Polyester material wipes 74
Flex Support 44
Custom dedicated tooling 46
Precision swabs 75
DEK PCB pallet solutions 49
DEK Foam swabs 75
DEK Grid-Lok™ 50
DEK Grid-Lok™ Gold 51
DEK Spatulas 76
DEK Grid-Lok™ Silver 52
DEK Grid-Lok™ spare parts 54
DEK Solder paste nozzles 77
DEK Support bars 55
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Process Support Products
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Stencil network 13
Stencil technologies
DEK Fine Grain stencils 14
DEK Multi-level stencils 15
DEK Electroform solutions 16
DEK Electroform 3D stencils 18
DEK Electroform variable aperture
height technology (VAHT) 19
DEK Electroform Mini LED Stencil 20
Dek Electroform Stencil – Eform-Eco 21
DEK PumpPrint™ / Adhesive stencils 22
Smart Stencil 25
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Stencils from the global No. 1
ASMPT is the world’s largest manufacturer of stencils for industrial
printing applications as a result of the high quality and reliability of
our products and services. All of ASMPT’s factories and partners in
the global stencil network operate with the same materials, the same
equipment, and in accordance with strictly certified procedures. This
enables us to supply our customers quickly and with consistently high
quality – no matter where they may be located.
The worldwide network of ASMPT offices, service centers and You can place your orders the way your prefer – the classic way
partners guarantees close proximity, quick responses, and fast, via your local representative or electronically via the ASMPT
competent help on site. Web Shop that is open 24/7. Either way, we guarantee speedy
shipment – up to our Premium Rush Service with its 4-hour
delivery time.
Application support
Only ASMPT as the global SMT technology leader can offer DFM HealthCheck
printing process expertise with this depth and quality. In our five
SMT Centers of Competence (CoCs) spread around the world we With this pioneering process, state-of-the-art expert system
provide application support, check designs, offer improvement and big data technologies are used to run virtual prints in order
workshops, and simulate and test specific printing processes to analyze your stencil data, identify critical areas, and make
in a realistic environment. Our experts stand by you in person concrete proposals for optimized printing process settings. Based
or remotely, and always in close contact with your local ASMPT on this information, you can print right away, eliminating the need
partners. for time-wasting NPI test runs.
Real-life SMT lines in the SMT Centers of Competence are used Tests in labs featuring modern equipment confirm
to provide application support and run tests including SPI analysis. the high quality of ASMPT stencils.
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Stencil solutions – stencil
technical specification
LASER CUT STENCIL
Standard PHD Laser cut nickel Fine grain Standard Platinum Wide fine grain
stainless steel stainless steel E-form nickel E-form stencil stainless steel
Material type 304 PHD Nickel Fine grain SS Hard nickel Hard nickel Fine grain SS
Material hardness (HV) ≥370 >470+ ≥370 500 +/-50 500 +/-50 ≥370
Grain size (µm) 5-10 1 2-5 1 0.6 2-5
Thickness available (µm) 50-500 100-175 50-250 75- 200 20-230 80-200
Thickness tolerance 2% 7% 2% 10% <5% 4%
Area ratio window >0.66 >0.6 >0.55 >0.5 >0.5 >0.6
Sheet width max 690.9 mm 584 mm 610 mm 610 mm 584 mm 690.9 mm
Apertures size tolerance ±5 µm ±5 µm ±5 µm ±10 µm ±4 µm ±5 µm
DEK Fine Grain stencils can be used with the DEK Mesh-
mounted frames, DEK VectorGuardTM Classic and DEK
VectorGuardTM High Tension frame systems. Fine grain stainless
steel stencils provide smoother laser-cut aperture walls for
improved paste release and better material transfer efficiency.
A cost-effective alternative to nickel, fine grain stainless steel is
ideal for challenging dimensions and high-density assemblies.
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DEK Electroform solutions
Achieve ultimate material volume consistency control for standard
SMT, micro-SMT, semiconductor, solar and LED lighting applications
with DEK Electroform stencils.
To develop new manufacturing processes such as electroplating electroformed stencils are clearly superior to stencils produced
solutions for stencils, ASMPT operates a center of competence with traditional dispensing or spray coating techniques by
in Singapore with its own nickel electroplating facility. The local delivering more throughput per hour and improved performance.
team has many years of experience and deep expertise in the
production of electroformed stencils and parts for non-SMT Features and benefits:
components. The stencil designs are developed and tested in the
■ Min thickness: 12 µm to 200 µm
adjacent application center.
■ Min stencil size:
By providing maximum control over the thickness and evenness DEK VectorGuard™ 584 mm × 584 mm (23” × 23”)
of stencils, ASMPT’s electroforming technology ensures ultimate ■ Max stencil size:
consistency for many standard SMT, micro SMT, semiconductor, DEK VectorGuard™ 584 mm × 736 mm (23” × 29”)
solar and LED applications. With material thicknesses down to
DEK Mesh-mounted frame solution 736 mm × 736 mm
12 microns, the material can be adapted to meet any current and
future requirements. In addition, electroforming technology offers (29” × 29")
the possibility to manufacture specialized components in large ■ No additional costs for large quantities of apertures
volumes, thus reducing their unit cost. ■ No deformation of stencil like lasering of large quantities of
apertures like for wafer bumping
Made with an additive galvanic process, DEK Electroform
■ Test and development support for new projects
stencils can be produced with extremely complex designs to
enable the printing of exceptionally small deposits in recesses,
around components, or on multiple levels. In many applications,
■ Piece Parts
■ LED Printing
- Electrical test probes
- LED leadframe printing
- Electro-mechanical parts
- Flux printing for flip-chip mounting
- Multiple other parts such as foils and sieves
- Phosphor layer printing on wafer die or over flip chip die
- Piece parts
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DEK Electroform 3D stencils
DEK Electroform 3D stencils ensure highest print quality and throughput for jobs
that require printing with different height levels and into indentations.
VAHT is ideal for PCBs that incorporate both small and large
components that require varying amounts of solder material.
Aperture gasket height can be 1 to 2 mils higher than the base
stencil thickness.
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DEK Electroform
Mini LED Stencil
Miniaturization trend demands stencil with smaller apertures.
In recent years, miniLED has emerged as a new segment with In addition, miniLED products using RGB configurations typically
high growth potential and has drawn the interest of most major require more than 100,000 apertures in one stencil as well as a
LED companies. miniLED are used in the back-light units (BLUs) stencil thickness in the range of 23 – 40 µm. Laser cut stencils
of display screens and are very competitive both in terms of cost are not able to meet such requirements.
and function, offering excellent contrast though the use of local
dimming. However, miniLED products pose a real problem to Specifications:
the packaging industry which has not yet developed solutions
for handling such small dies with the accuracy and throughput ■ Aperture Size: 50 µm × 50 µm (minimum), ± 4 µm
required; a typical miniLED die is smaller than an 0201m ■ Thickness: 23 µm (minimum)
component. ■ Gap between apertures: 50 µm (minimum)
■ Frame Size: DEK VectorGuardTM 23” × 23”
The challenges related to stencil printing for miniLED products
involve printing paste deposits which are smaller than 100µm ■ Positional Accuracy: 0.1 µm/mm
in size and controlling the uniformity of the paste deposits to
avoid die tilt, bridging and other defects. Electroform is uniquely
positioned to address these challenges. Electroformed stencils
have better paste release capabilities, a result of the superior
smoothness of the aperture side wall and the surface energy of
nickel.
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DEK PumpPrint™ /
Adhesive stencils
DEK PumpPrintTM technology enables a wide range of adhesive patterns
to be successfully deposited using a screen printing platform.
Benefits:
■ Very long life cycle
■ Coating applied to the bottom surface of the
stencil and to the aperture walls for optimized print
performance
■ Significantly reduces understencil cleaning
frequency requirements, lowering costs and
improving throughput
■ Delivers superior print definition for area ratios
below 0.6
■ Increases transfer efficiency by 10% to 40%
depending on area ratio
■ Reduces solder paste bridging
■ Encourages more uniform solder paste deposits
■ Colored coating provides visual confirmation of
coverage, as opposed to clear wipe-on nano
coatings
■ Micron-thick coating lasts longer compared to
wipe-on nano solutions
■ Non-ionic, not conductive, and chemically inert
■ ECHA REACH, RoHS and RoHS 2 compliance
■ Recommended stencil materials: Fine Grain and
stainless steel
TECHNICAL SPECIFICATIONS
Properties Values
Appearance Gold
Thickness of coating 3 to 4 micron
Specific gravity @ 25C 1.02 g/cm3
Static contact angle, water 105°
Static contact angle, n-hexadecane 64°
Abrasion resistance, ASTM D2486, isopropyl alcohol > 2000 cycles
Abrasion resistance, ASTM D2486, IPA based flux > 2000 cycles
Pencil hardness >9H
Resistivity > 10 x 1012 ohm-M
Ionic residues (ROSE) 0 μg of NaCl / liter
Ionic species on board (as received) None detected
Ionic species on board (after reflow) None detected
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NanoClear® stencil coating
Self-applied fluxophobic stencil coating technology delivers high performance
stencils in a cost-effective wipe. Designed to overcome the challenges of smaller
aperture sizes, the NanoClear® coating offers a unique solution to improve cleaning
effectiveness and reduce cleaning frequency.
■ Reduces cost
- Less cleaning uses less USC fabric and solvent
- Less expensive than alternative wipe-on coatings
- Easy to apply to new or existing stencils
- Chemically inert when dry to ensure no possible
interaction with paste
- Forms a permanent bond and can be reapplied
as it only adheres to uncovered areas
- REACH compliant
- Compatible with stainless steel or nickel stencils
- One pouch will coat one stencil (measuring up to
29“ x 29”)
Functional
tail group
repels flux
5 nm max.
Phosphonate
head group
bonds to stencil
Declines in tension and surface quality, which are normal as Functions and benefits
stencils age, reduce the quality, yield and process stability of the
■ Process stability through seamless service life management
solder paste printing process. Smart Stencil is an RFID-based
solution that provides for the first time a simple, convenient, and ■ Smart Stencil RFID tags available for stencils from all
seamless solution for monitoring the service life of stencils. manufacturers
■ Customers can apply RFID tags themselves
Its core components are ASM-supplied RFID tags which are ■ Service life data can be stored on and recalled directly from
applied by the stencil manufacturer – or by the user – to each the stencil RFID
stencil to identify it and store basic data about it. DEK printers
■ Ability to store a stencil profile (technical data, manufacturer,
equipped with the Smart Stencil option record each printing cycle
reordering data, storage locations, etc.)
on the RFID tag even if the stencil is used on different lines.
■ DEK printer with the Smart Stencil option write to the tags with
The basic data and print cycles stored on the RFID tags can each print cycle
be read by DEK printers with the Smart Stencil option and by ■ Manual entries possible with the RFID handheld device
handheld devices. The ability to store warning thresholds and ■ Customer-definable warning and maximum thresholds
maximum values for the number of print cycles makes seamless
process control possible. For example, when the threshold level ■ Warning threshold optimize ordering processes and in-house
is reached, the system can use this information to order a new logistics
stencil. The necessary data can also be stored on the RFID ■ Reaching the maximum threshold stops the printing process;
tag. When the maximum value is reached, the printer stops the it can only be overwritten by authorized personnel
printing process. ■ Only available for the DEK NeoHorizon platform
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Smart Stencil – Application and positioning
Stencil with
Adhesive stencil
DEK VectorGuard™ framing solutions
y
x
x
y
18 mm 1 mm
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31
DEK VectorGuard™ frame solutions
ASMPT’s patented, award-winning DEK VectorGuardTM System is the industry
standard for high-performance stencil frame technology to facilitate fast
changeover, tension control and longer lifetime.
ASMPT invented the unique DEK VectorGuard™ single-frame The DEK VectorGuardTM frame system is available in both a
stencil system and replaced older industry mechanisms that classic version and a high tension version to address varying
were cumbersome, malfunction-prone and unsafe for operators manufacturing needs.
with a simple, air pressure-controlled frame design. Today,
DEK VectorGuard™ is the industry benchmark for high quality
stencil technologies, ideal for fast changeover and product DEK VectorGuardTM Classic frame
adaptability.
The proven, original DEK VectorGuardTM Classic frame system is
In addition to its changeover advantages, DEK VectorGuard TM
ideal for standard SMT processes that do not generally employ
delivers consistent tension over the life of the stencil. Traditional ultra-fine-pitch, highly miniaturized dimensions. Cost-effective
mesh-mounted stencils have initial high tension but, with use and and versatile, DEK VectorGuardTM Classic delivers the benefits
cleaning, the elasticity of the stencil mesh can weaken, resulting of quick changeover, simplified storage, operator safety and low
in areas of “sag” that can adversely affect stencil aperture to pad cost-of-ownership.
alignment and printing yields.
See also Stencils and screens storage on page 55 for DEK VectorGuardTM cabinets.
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DEK VectorGuard™ FRAME SOLUTIONS, SIZES
VG 260
VG 260 Centre adapted VG 260
23” P/N 430585 29” P/N 430585 Front adapted
(584 mm) (736 mm) with P/N 430585
P/N 430646 with
P/N 430646
VG 265
Adapted
29” VG 265 VG 265 wide
P/N 430586
(736 mm) P/N 430586 P/N 430587
with
P/N 430646
VG Asia VG Asia
550 mm 600 x 550 mm Adapted
650 x 550 mm
600 mm 650 mm
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Process Support Products
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39
Singulated Substrates Support
Singulated Substrates Support allows you to operate innovative process chains
where only substrates that have been singulated and tested as good are printed
to maximize your yield and productivity.
±12.5 μm
System (TRS)
±25 μm
±75 μm
Price
With DEK MASS, which sets new standards for printing Features and benefits:
processes with singulated substrates, ASMPT offers a perfect
■ Scalable design
solution for particularly demanding applications such as
smartphone panels, etc. ■ Maximum precision thanks to optical alignment
(up to 12.5 µm @ 2 Cp)
The printer’s vision system detects the fiducials on each sub- ■ Simultaneous alignment via movable tooling towers
strate before aligning it individually with an accuracy of up to guarantees short cycle times
12.5 µm @ 2 Cp via movable, application-specific tooling towers ■ Vacuum fixation
(X, Y, theta) and vacuum-holding it in place for the printing pro-
■ Surround plate for pressure optimization
cess. The alignment after the measurement happens simulta-
neously for all substrates while they are raised from the carrier. ■ Maximum efficiency for demanding applications
This minimizes cycle times and guarantees maximum efficiency. ■ Technological leadership
■ Retrofittable
DEK MASS is produced as an application-specific tooling.
DEK NeoHorizon printing platforms with the new table design
can be retrofitted with DEK MASS at any time.
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DEK Topside Reference System (TRS)
The DEK Topside Reference System (TRS) for up to 72 singulated substrates adapts
to tolerances in the substrate thickness and achieves more accuracy with its “active
surround” technology.
DEK Topside Referencing System (TRS) is advanced tooling Features and benefits:
engineered to handle and align singulated substrates from a
■ Enables imaging of singulated substrates in a single print
carrier to enable mass imaging. Leveraging the concepts of the
stroke for increased throughput
award-winning Virtual Panel Tooling technology, DEK TRS moves
singulated device processing to the next level. ■ Compatible with various carrier types: J-boats, JEDEC tray,
Flat Boat and custom carriers
Specifically designed to address assembly complexities as flip ■ Effectiveness confirmed on challenging components such as
chip manufacture moves to smaller pin pitch, thin-core and LGA, BGA, 01005 passives and 0.25 mm - 0.3 mm BGA pad
coreless technologies, DEK TRS provides edge alignment of size, 0.5 mm pad pitch
multiple substrates into a virtual panel to facilitate multi-part ■ Fast cycle time, typically less than 30 seconds
printing with a single stroke. DEK TRS has proven its success
■ Reliable alignment of substrates that have different thicknesses
with processor, SMT, ceramic and sensor applications, though its
or are warped thanks to the topside reference plate and the
relevance for mass imaging of challenging products is unlimited.
Z-Lock mechanism
■ Active surround plate for more accuracy
DEK Virtual Panel Tooling (VPT) allows the printer to process Features and benefits:
multiple individual substrates in a single print cycle. The
■ Parallel processing of singulated substrates for more
substrates are presented to the printer in a carrier and are then
throughput – eliminates delays caused by the sequential
lifted out, mechanically centered (aligned) and placed into a
printing/dispensing of individual substrates
surrounding plate to create a “virtual panel” prior to coming in
contact with the stencil and then mass imaged. ■ Scalable design for the simultaneous printing to 2 to 72
singulated substrates
In combination with a DEK printer, DEK VPT offers a high- ■ Highly efficient mechanical alignment
throughput, low-cost alternative to dispensing for many flip-chip ■ Surround plate for pressure optimization
packaging processes and other advanced applications, including
■ Retrofittable on existing DEK printer platforms
sensors, PCBs and thermal interface materials (TIMs).
43
PSP Standard Support
Custom
dedicated
tooling
DEK Grid-LokTM
DEK Support Bars
Magnetic pins
f ety
ghe r sa
r s, hi
eo ve
etup c han g
F aster s
This component is adapted to the respective printing platform Support plates suitable for the Support Flex Base Tower Systems
and remains in the printer. That way, the printer is always ready – optionally manufactured for specific applications. Plates can be
to support a wide range of applications. installed quickly without tools.
■ Also available for printing platforms from other manufacturers - With or without vacuum
45
Custom dedicated tooling
Tooling Type
1st pass – for a blank PCB with no components fitted typically Depending on the process required, it is often more cost-
means a flat support surface on the tool. 2nd pass – for a PCB effective to design a 2nd pass-capable tooling block that can
with components fitted to one side. This means the support also be used for the 1st pass requirement.
surface will have pockets to avoid the components on the PCB.
Vacuum capability can be added to either tooling design for the
most effective support surface.
TOWER OVERVIEW
Part number Description
SAP
03175938-01 Dedicated narrow tower with vacuum for DEK TQ printer (incl. 2 support pins)
03154262-01 Dedicated narrow tower with vacuum (incl. 2 support pins)
03154264-01 Dedicated narrow tower without vacuum (incl. 2 support pins)
03154263-01 Dedicated narrow tower dual lane (incl. 2 support pins)
03154261-01 Dedicated H-tower (incl. 2 support pins)
03154265-01 Dedicated narrow tower without vacuum 0.6 mm holes (incl. 2 support pins)
03154266-01 Dedicated flat leg support (2 pcs)
03154267-01 Support bar 400 x 25 x 81 mm
03154268-01 DEK Classic Support Plates (25.4 mm) - 1st pass non-vacuum
03154270-01 DEK Classic Support Plates (25.4 mm) - 1st pass with vacuum
03154269-01 DEK Classic Support Plates (25.4 mm) - 2nd pass non-vacuum
03154271-01 DEK Classic Support Plates (25.4 mm) - 2nd pass with vacuum
Stencil Board
Tooling
1st pass tooling support (flat plate) 2nd pass tooling support with routed component pockets
47
Support tower
Vacuum
Tooling tolerances
Advantages
■ Process safety and control
■ Increase stencil lifetime
■ Reduced cleaning schedule – improved PPH
■ Increased squeegee speed
■ Avoid / reduce short circuits
■ Avoid / reduce paste residue
■ Minimize line downtime
■ Improved print quality
Standard wafer pallet – A lightweight (approx. 4 kg) wafer pallet that uses
vacuum grooves to secure and hold the wafer.
Both the standard and precision pallets utilize a wafer shim to contain the
wafer. Wafer sizes of 100 mm to 300 mm with thicknesses of 150 um and
above can be accommodated. Both systems are fitted with wafer ejector pins
to release the wafer from the pallet, allowing a wafer handler to process the
wafer before and after the print.
Key benefits:
■ Consistent flatness, stable printing, process control
■ Pallet size: 400 mm x 400 mm
■ Wafer diameters: 4/5/6/8/12 inches (100 mm to 300 mm)
■ Wafer thickness: 150 µm to 600 µm
■ The wafer is vacuum-secured during transport; automatic and
manual operation
■ Custom solutions available
■ Data formats: Gerber, DXF, DWG
■ Material: Durastone, aluminum and sintered stainless steel.
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DEK Grid-Lok™ premium automatic
substrate PCB support for SMT processes
Unique, patented automatic pin array technology facilitates fast product
changeover and unmatched substrate support.
Recognizing the need for a flexible alternative to dedicated and System components:
more costly substrate support, ASMPT developed the multi-
■ Control box to provide module(s) – machine interface
award winning, patented DEK Grid-LokTM system which remains
the industry’s premier automatic tooling solution. ■ Hand controller to set operating mode
■ Up to 6 DEK Grid-LokTM modules
Designed to accommodate assemblies of all types – from basic ■ Field installation kit
SMT to high-density, highly miniaturized products – DEK Grid-
■ Manifold used to support up to 6 modules
LokTM is the best total process substrate support technology on
the market. ■ Machine-specific fitting tools
■ Machine-specific interface (sensor or pneumatic input
Key benefits: to start the pin raise and clamp cycle)
■ High versatility ■ All interconnecting hardware
■ Unparalleled flexibility
■ Minimal operator intervention
■ Reduced or zero changeover time
■ No risk of component damage
System requirements:
■ Air pressure: 80-102 PSI (0.55-0.7 Mpa)
■ Air quality: 2.3.3 where 2 (dirt) = 1 micron, 3 (water) = -20° C
pressure dew point and 3 (oil) = 1 mg/m3
■ 120-240 AC supply to provide 24 VDC to power control box
Module specifications:
Depending on the specific machine application, the modules
have the following specifications:
■ Available tooling heights 39 mm to 98 mm
■ Available module lengths: 305 mm, 457 mm
■ Component clearance: 13 mm to 40 mm
■ Pin count
- Module width: 32 mm
- 305 mm – 46 pins configured in 2 rows on a
12 mm x18 mm pitch
- 457 mm – 70 pins configured in 2 rows on a
12 mm x18 mm pitch
- Pin setting force – 5 grams per pin
- Pin cap – electrically conductive silicone rubber compound
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DEK Grid-Lok™ Silver
DEK Grid-LokTM Silver is ideal for placement processes, where substrate support
requires robustness and protection against vibration.
Module specifications:
Depending on the specific machine application, the modules
have the following specifications:
■ Available tooling heights: 53 mm to 135 mm
■ Module length: 355 mm and 254 mm (for few heights)
■ Module width: 32 mm
■ Pin count: 27 pins configured in 2 rows, on a
25 mm x 20 mm pitch
■ Component clearance: 16.5 mm
■ Pin cap – electrically conductive silicone rubber compound
System requirements:
■ Air pressure: 80-102 PSI (0.55-0.7 MPa)
■ Air quality: 2.3.3 where 2 (dirt) = 1 micron, 3 (water)
= -20° C pressure dew point and 3 (oil) = 1 mg/m3
■ 120-240 AC supply to provide 24 VDC to power control box
03140727 KIT_111 111_CTL – Single 1 each, 006_MAN, INC_FIK - Field Installation Kit, 002_CON
Table System manifold for 6 modules – Handheld controller/holder (only for single
table system), 6 each twin leashes per
03136308 KIT_211 211_CTL – Dual 2 each, 006_MAN, manifold, all necessary fittings, tubes and
Table System manifolds for 12 modules air pipes for kit installation
Note: 077_SBA – optical sensor which is not included in the kit, may be required if the host machine doesn’t have pneumatic activated board clamps. Please
consult your local ASMPT representative for more information.
Placement systems:
■ ASMPT
■ Assembleon
■ Fuji
■ I-pulse
■ Juki
■ Panasonic
■ Samsung
■ Universal
■ Yamaha
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DEK Grid-Lok™ spare parts
DEK support bars serve as a quick and universal support solution Module specifications:
for PCBs to be printed on one side only and other substrates.
■ Length: 400 mm
The operator places the DEK support bar manually on the
printing table between the conveyors. That way, a wide range of ■ Wide: 25 mm
PCBs and substrates can be printed after a short setup time. ■ Height: 81 mm
■ Weight: ~2kg
Features and benefits:
■ Cost-effective solution for PCBs to be printed on one side only
■ Average setup time
■ Placement by the operator
55
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59
Stencil storage systems
Stencils and screens are a large investment; storing them properly will protect
their value and prolong the usable life while providing organized, easy access.
ASMPT has designed a complete portfolio of storage solutions for stencils and
screens.
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DEK VectorGuard™ working station
■ Swift change of DEK VectorGuard™ stencils directly on the
production line
■ Lockable, anti-static ESD wheels
■ Frame brackets on both cabinet sides for DEK VectorGuard™
frames
■ Lockable drawers in three different sizes for organized
arrangement of printing tools, for example:
- Drawer 1: Spatulas, cleaning wipes and swabs, shift plan/
reports
- Drawer 2: Magnet pins, DEK Grid-Lok™, board clamps,
squeegee blades
- Drawer 3: Cleaning media, precision wipes, dedicated tooling
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Pre-saturated wipes
DEK Hand cleaner wipes 71
DEK IPA/DI wipes 71
DEK IPA/DI 96% wipes 71
DEK Stencil cleaner wipes 71
DEK Adhesive remover wipes 71
Cleaning sprays
DEK SMT stencil cleaner 72
DEK Reflow oven cleaner 72
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DEK Ultra-Fine Pitch (UFP)
ECO understencil cleaning rolls
DEK UFP ECO rolls are designed to boost productivity and yield,
reduce defects and decrease manufacturing costs.
The unique 3D architecture of DEK UFP ECO understencil cleaning rolls counters the
risk of contamination as the fabric traps solder paste and solders balls within its pockets.
This is a key differentiator from paper-based products that allow paste to remain on
the surface of the paper, creating the potential for contamination. Consequently, DEK
UFP ECO rolls not only ensure effective understencil cleaning, they also prevent
contamination-related defects.
Ideal for ultra-fine-pitch apertures inherent with today’s miniaturized devices, DEK UFP
ECO rolls ensure a quick and effective clean. The hydrophilic properties of the fibers
provide fast wicking, as solvent is delivered through the fabric to the bottom of stencil
instantaneously so that cleaning is more thorough and solvent consumption is reduced.
■ Effective cleaning
- Dry cycle in addition to Wet (Vac/Dry) cycle
- Delivers a superior clean for underside of the stencil
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DEK Pro and DEK Pro XF
advanced understencil cleaning chemistries
Designed specifically for understencil cleaning, DEK Pro and DEK Pro XF improve
process performance and reduce print defects. They are safer, cleaner and
more environmentally friendly than IPA and traditional solvent cleaners, and are
compliant with all industry standards and environmental regulations.
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Cleaning sprays
ASMPT’s maintenance cleaners have been designed to facilitate convenient cleaning of
electronics assembly applications for improved productivity at the lowest possible cost.
A powerful and versatile, non-corrosive and residue-free cleaner suitable for stencils,
webbing, frames and misprinted boards, DEK SMT stencil cleaner’s hybrid formulation
blends safe and non-flammable water-based ingredients with aggressive long-chain
alcohol solvents.
Applications:
■ Solder pastes, epoxies and inks
■ Manual cleaning
■ Automated understencil wipes
■ Unheated ultrasonic cleaning systems
■ Cold dip tanks
■ Safe on all metals, synthetics, plastics and elastomers
Applications:
■ Wave soldering machines
■ Relow ovens
■ Pick and place systems
■ Metal pallets
■ Heating elements
■ Bafles & clamps
■ Chains, pulleys, drive gears and housings
The affordable choice for consistency, performance and reliability, DEK nitrile gloves
are manufactured to ensure a tough, durable glove, free of chemical odors and harsh,
irritating deodorants. Stronger than either comparable latex or PVC/vinyl gloves, blue
nitrile gloves provide excellent splash and contact protection from a wide range of
chemicals. Textured palms and fingers offer exceptional wet or dry grip.
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High-purity precision
cleaning dry wipes
DEK wipes feature non-woven and polyester technologies to maximize
effectiveness and prevent contamination. They are designed, manufactured
and packaged with precision to serve various cleaning and maintenance
requirements.
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DEK Spatulas
DEK Spatulas are color-coded to ensure isolated use with appropriate materials and
are an essential tool on the line. Light and durable, the polypropylene spatulas are
shatterproof and flexible for long-lasting performance.
DEK SPATULAS
Part number Description Unit
SAP DEK
03128559 173788 Green spatula Bag of 5
03129776 173825 Black ESD spatula Bag of 5
DEK Solder paste nozzles easily snap into place, making the
cartridge immediately ready for use with on-board printer auto-
dispense technologies. These easy-to-use nozzles eliminate
clean-up of internal threads and solder paste drip, which are
common side effects of threaded dispense tip installation.
77
Process Support Products
Webshop
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Squeegee characteristics including blade material, flexibility, Steel squeegees are well-suited for applications that feature a
angle of attack and mounting mechanism have a significant mix of large, standard and fine-pitch components or in cases
effect on printing process control. Aligning the proper where PCB panel flatness cannot be confirmed. The wider
squeegee to the application is made more simple with pressure window of DEK Stainless Steel stencils provides
ASMPT's comprehensive range of polyurethane and stainless excellent consistency and minimal wear.
steel blades, bonded or clamped mounting options and
choice of 45° or 60° printing angle. DEK Stainless Steel metal squeegees are available with two
different angles and overhangs (free moving plate length
DEK Polyurethane squeegees without support of the squeegee holder) to enable different
aperture paste filling requirements. The standard recommended
Polyurethane squeegees satisfy single thickness or multi- angle is 60° for a normal paste filling of the apertures, while
level (step) stencil applications. The hardness of the an angle of 45° will add more pressure to fill the apertures for
squeegee is dependent on the stencil construction: choose paste-intensive applications such as pin-in-paste.
harder squeegees (97 durometer and above) for durable, low
abrasion performance with single thickness stencils and a Bonded / clamped mounting mechanisms
softer squeegee (70 to 94 durometer) for multi-level stencils.
Mounting options for DEK Squeegees include bonding
Available in hardness ranges up to 120 durometer, DEK or clamping. The mounting selection should take into
Polyurethane squeegees are manufactured of the highest- consideration the specific application, squeegee type and
quality material and can be re-ground to maintain a sharp printing operation. Clamping allows squeegees to be easily
edge throughout the squeegee lifetime. DEK Polyurethane interchanged and adjustments to blade flexibility and durometer
squeegees are also available for DEK PumpPrintTM / Adhesive to be made based on application requirements.This mounting
stencils, mesh and emulsion screen printing applications. method is particularly well-suited for stainless steel and
composite blades.
Stainless steel squeegees
Bonded squeegee assembly guarantees blade straightness for
The most widely used for SMT printing with metal stencils, high durometer polyurethane blades and allows exploitation of
particularly for heterogeneous assemblies, DEK Stainless the squeegee’s process advantages.
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DEK Metal squeegees
METAL CLAMPED SQUEEGEES 60° ~ 6 MM OVERHANG METAL CLAMPED SQUEEGEES 60° ~ 15 MM OVERHANG
Part number Part number
SAP DEK Size Unit SAP DEK Size Unit
88SQA310 SQA310 170 mm Pair 88SQA300 SQA300 170 mm Pair
88SQA311 SQA311 200 mm Pair 88SQA301 SQA301 200 mm Pair
88SQA312 SQA312 250 mm Pair 88SQA302 SQA302 250 mm Pair
88SQA313 SQA313 300 mm Pair 88SQA303 SQA303 300 mm Pair
88SQA314 SQA314 350 mm Pair 88SQA304 SQA304 350 mm Pair
88SQA315 SQA315 400 mm Pair 88SQA305 SQA305 400 mm Pair
88SQA316 SQA316 440 mm Pair 88SQA306 SQA306 440 mm Pair
88SQA317 SQA317 483 mm Pair 88SQA307 SQA307 483 mm Pair
88SQA318 SQA318 510 mm Pair 88SQA308 SQA308 510 mm Pair
88SQA319 SQA319 535 mm Pair 88SQA309 SQA309 535 mm Pair
03264271 - 560 mm Pair
03264296 - 570 mm Pair
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DEK Metal squeegees for lead free applictions
LEAD FREE REPLACEMENT BLADES (FIT BOTH 60° AND 45°) LEAD FREE METAL CLAMPED SQUEEGEES 60° ~ 6 MM OVERHANG
Part number Part number
SAP DEK Size Unit SAP DEK Size Unit
03130219 431001 200 mm Each 03130452 SQAG311 200 mm Pair
03128589 431002 250 mm Each 03130453 SQAG312 250 mm Pair
03130220 431003 300 mm Each 03130454 SQAG313 300 mm Pair
03128577 431004 350 mm Each 03128618 SQAG314 350 mm Pair
03130221 431005 400 mm Each 03130455 SQAG315 400 mm Pair
03130340 431006 440 mm Each 03130456 SQAG316 440 mm Pair
03143610 - 483 mm Each
■ Anodised Green
■ Chromium Blades (CrN) ~ 1.5 microns
■ Anodised Green
■ Chromium Blades (CrN) ~ 1.5 microns
SAPDs are ideal for solder paste printing on SMT boards with
pressure forces between 0 and 20 kg to improve the level of
process control and reduce solder paste waste. The profile and
structure of the deflectors ensure that the paste does not escape
outward during the printing process. This cuts down on wasted
paste (faster ROI) and drastically reduces printing problems
resulting from dried paste on the edges. The bottom line: more
performance from the first print to the last.
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DEK Polyurethane squeegees
POLYURETHANE BONDED SQUEEGEES
GREEN 70-75 SHORE HARDNESS ~ 45°
Part number
SAP DEK Size Unit
03136509 SQA248 100 mm Pair
03130492 SQA254 150 mm Pair
03130403 SQA161 170 mm Pair
03130488 SQA167 200 mm Pair
03130406 SQA174 250 mm Pair
03130398 SQA152 300 mm Pair
03130408 SQA185 350 mm Pair
03142810 SQA190 400 mm Pair
03138030 SQA201 440 mm Pair
03130490 SQA210 483 mm Pair
03142818 SQA219 510 mm Pair
03141708 SQA231 535 mm Pair
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POLYURETHANE BONDED SQUEEGEES
YELLOW 120 SHORE HARDNESS ~ 45°
Part number
SAP DEK Size Unit
03142821 SQA245 100 mm Pair
03136182 SQA251 150 mm Pair
03130401 SQA158 170 mm Pair
03142806 SQA141 200 mm Pair
03142877 SQA171 250 mm Pair
03142808 SQA178 300 mm Pair
03142228 SQA142 350 mm Pair
03142809 SQA188 400 mm Pair
03142257 SQA199 440 mm Pair
03142813 SQA207 483 mm Pair
03142816 SQA216 510 mm Pair
03142883 SQA228 535 mm Pair
■ Screen prinitng
■ Wafer coating
SPECIAL SQUEEGEES
Part number
SAP DEK Size Description Application Unit
3141152 208226 180 mm Diamond squeegee blade 9.5 mm Polyurethane, RED Screen printing Each
3141953 213699* 180 mm Diamond squeegee blade 9.5 mm Polyurethane, Blue Screen printing Each
3141511 SQA102 200 mm Diamond squeegee with Polyurethane Blade, Pink Screen printing Each
3141603 SQA104 350 mm Diamond squeegee with Polyurethane Blade, Pink Screen printing Each
3141062 FBA062 450 mm Flood bar squeegee incl. stainless steel blade Screen printing Each
3139877 FBA047 170 mm Flood bar squeegee incl. stainless steel blade Screen printing Each
3130445 SQA544 250 mm Half round squeegee assembly Semiconductor like Each
wafer coating
3130446 SQA545 330 mm Half round squeegee assembly Semiconductor like Each
wafer coating
3144432 S4922 350 mm Polyurethane replacement blade for Diamond Screen printing Each
squeegee, Green
3141668 163424 450 mm Replacement blade for flood squeegee assembly Screen printing Each
3161783 107805 535 mm Replacement blade for flood squeegee assembly Screen printing Each
* Only compatible for Eclipse printers
89
ASMPT Americas ASMPT Europe ASMPT Asia
Phone: +888 768 4357 (press 2) Phone: +40 722 692 108 Phone: +65 6750
6877 3188
3900
Email: smtparts.us@asmpt.com Email: asmpt-psp.eu@asmpt.com Email: SGstencils@asmpt.com
spares.sg@asmpt.com
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Products Website Products Webshop Website Website YouTube
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Edition 10/02-2024
11/07-2024 | All rights reserved. | Order No.: A22-ASMPT-A322-EN | Printed in Germany | © ASMPT GmbH & Co. KG
All information and illustrations in this brochure are provided “as is” and without any warranties of any kind, whether expressed or implied, including but not limited to,
implied warranties of satisfactory quality, fitness for a particular purpose and/or correctness.
The contents of this brochure are for general information purposes only, do not constitute advice, and are subject to change without notice. ASMPT therefore makes no
warranties or representations regarding the use of the content, details, specifications or information contained in this brochure in terms of their correctness, accuracy,
adequacy, usefulness, timeliness, reliability or otherwise, in each case to the fullest extent permitted by law. Please contact ASMPT for the most current information.
Any specific performance features and/or capabilities will only be binding if contractually agreed upon.
All product names are brands or trademarks of ASMPT or other suppliers. Unauthorised use by third parties may violate the rights of their owners.