Man1b040f0000r01 MM C40-J Dbe

Chapter 1
Hardware Overview
1.1 Features 1 Hardware Overview
Chapter 1 Contents
1.1 Syestem Feature ......................................................................................................... 1-1

1.2 System Unit Components ....................................................................................... 1-8
1.3 Solid State Drive (SSD).......................................................................................... 1-14
1.4 Power Supply ......................................................................................................... 1-15
1.5 Batteries ................................................................................................................. 1-16
1.51 Main Battery.............................................................................. 1-16
1.52 Battery Charging Control ........................................................... 1-17
Figures
Figure 1-1 ID Parts Description Placement .................................................................... 1-5

Figure 1-2 Computer Block Diagram ............................................................................ 1-6
Figure 1-3 System Board Configurations...................................................................... 1-7
Figure 1-4 System Unit Block Diagram ........................................................................ 1-8
Figure 1-5 Solid state driver ........................................................................................ 1-14
Tables
Table 1-1 SSD Specifications....................................................................................... 1-15
Table 1-2 Battery Specifications................................................................................... 1-16
Table 1-3 Quick/Normal Charging Time ...................................................................... 1-17
SATELLITE PRO C40-J Maintenance Manual 1-i

1 Hardware Overview 1.1 Features
1.1 System Features
Dynabook Satellite C40-J/ Satellite Pro C40-J is a Slim and Light entry notebook PC
based on the mobile Intel TGL & TGL-R series processor, providing high-speed
processing capabilities and advanced features. The computer employs a Lithium Ion
battery that allows it to be battery-operated for a longer period of time. The display uses
14-inch FHD and HD LED panel, at a resolution of 1920x1080 and 1366x768. The CPU
package is BGA type.
The computer has the following features:
� Processor
1. CPU is mobile Intel TGL & TGL-R series processor:
Intel TGL-R i7 CPU
i7-1195G7 (5 G) Hz
Intel TGL-R i5 CPU
i5-1155G7 (4.5 G) Hz
Intel TGL-R i3 CPU
i3-1115G4 (4.1 G) Hz
Intel TGL i7 CPU
i7-1165G7 (4.7 G) Hz
Intel TGL i5 CPU
I5-1135G7 (4.2G) Hz
Intel TGL i3 CPU
i3-1115G4 (4.1G) Hz
1-1 Maintenance Manual SATELLITE PRO C40-J

Intel TGL i3 CPU
i3-1125G4 (3.9G) Hz
� Host Bridge System Controller
System Controller: Intel integrated Host bridge system into CPU.
� Graphics
Internal: Intel® UHD Graphics for 11th Gen Intel® processors
� Memory
The computer has 2 SO-DIMM DDR4 memory particles which support double
channel. DDR4 is driven at 1.2V. It can incorporate up to 32GB of memory
configuration.
Using the following sizes of memory configuration:
� 4096 MB SO-DIMM DDR4-3200MHz
� Solid State Drive (SSD)

The computer accommodates SSD with following types:
� SSD M.2 128GB/256GB/512GB (PCIe)
� Display
LCD displays come in the following type at resolution 1920x1080 and
1366x768:
� 14” FHD 250nits eDP 1920x1080 LED display
SATELLITE PRO C40-J Maintenance Manual 1-2

� 14" HD 220nits eDP 1366x768 LED display
� On-Board LAN
The internal LAN supports 10/100/1Gbit Ethernet, enabling connection to a

LAN at up to 1Gbps. It supports Wake-up on LAN from S3/S4 and PXE boot
support. This internal LAN has RJ45 jack to directly accommodate a LAN
cable.
� Wireless LAN
The internal Mini Card slot supports Intel Jefferson Peak1 (802.11ac+BT5.0),
Intel Jefferson Peak2 (802.11ac+BT5.0), Non-Intel CM251(802.11ac+BT5.0),
and Intel Harrison Peak2, 802.11ax+BT5.1 Wireless LAN cards. The Antenna
has two wires dual band.
� Sound System
REALTEK ALC256&ALC256N integrated audio controller supports multimedia.

The sound system contains the following:
� Stereo speakers
� External microphone &Headphone combo jack
� Integrated microphone (with Webcam)
� Keyboard
many kinds’ countries keyboard, which is Non-backlight keyboardwith

UK/US/ JPkeyboard.
� Pointing Device
Click Pad pointing device support. Gesture support for precision function as
Tapping/Tap and Drag/Pinch zoom/Up to 4 fingers.
� USB Por

The computer has three USB ports, two for USB3.0 type A, Another One is
USB type C (USB3.1 Gen1/DP/PD). High-Speed USB3.0/3.1 allows data
transfers up to 5Gbps
� HDMI Out Port
A HDMI monitor can be connected to HDMI Out Port on the computer.
� Bridge Media Slot

This slot is for your memory card requirements like SD/Mini SD (need
adaptor)/Micro SD (need adaptor)/SDHC/SDXC and MMC Cards to provide
memory card read on your computer.
� Webcam with embedded internal microphone
The computer has an internal camera. It supports HD (0.9M) with Camera

shutter. It also supports Camera LED, LED is on when Camera working. The
internal microphone is embedded in this camera module.
� Battery
The computer has a 2 Cell (6000mAh) Lithium Ion battery pack.
� Figures 1-1/1-2/1-3 and 1-4 show the computer and its system unit
configuration, respectively.


Figure 1-1 ID Parts Description Placement
Figure 1-2 Computer Block Diagram

Figure 1-3 System Board Configurations

1.2 System Unit Components 1 Hardware Overview
1.2 System Unit Components
Figure 1-4 System Unit Block

Diagram

1 Hardware Overview 1.2 System Unit Components
The system unit of the computer consists of the following components:
� Processor: CPU is mobile Intel TGL&TGL-R Processor:
Intel TGL-R i7 CPU
i7-1195G7 (5 G) Hz
Intel TGL-R i5 CPU
i5-1155G7 (4.5 G) Hz
Intel TGL-R i3 CPU
i3-1115G4 (4.1 G) Hz
Intel TGL i7 CPU
i7-1165G7 (4.7 G) Hz
Intel TGL i5 CPU
I5-1135G7 (4.2G) Hz
Intel TGL i3 CPU
i3-1115G4 (4.1G) Hz
Intel TGL i3 CPU
i3-1125G4 (3.9G) Hz
� Memory: The computer has 2 SO-DIMM DDR4 memory particles which support
double channel. It can incorporate up to 16GB of memory configuration.
� PC4-3200(3200MHz) SO-DIMM DDR4 supported
� DDR4 1.2V operation

� Data transfer rates: PC4-3200
� BIOS ROM (Flash memory)

� Storage Size
Nv Storage size: 128K
� NVRAM_BACKUP size: 192k

� FV_MAIN_WRAPPER size: 4992k
� FV_MAIN_WRAPPER free space: 2609k
� FV_DATA size: 832k
� FV_DATA free space: 3k
� FV_NETWORK_WRAPPER size: 2240k
� FV_NETWORK_WRAPPER free space: 1648k
� FV_BB size: 448k
� FV_BB free space: 65k
� FV_BB_AFTER_MEMORY_WRAPPER size: 256k
� FV_BB_AFTER_MEMORY_WRAPPER free space: 62k
� FV_FSP_S size: 576k
� FV_FSP_S free space: 215k
� FV_FSP size :448K System Controller
� Mobile Intel integrated TGL&TGL-R into CPU.

� System Memory Interface
� Technology Enhancements of Intel Fast Memory Access
� System Memory Frequency
� DRAM Clock Generation
� DRAM Reference Voltage Generation
� Processor Graphics Controller(GT)
� Digital Display Interface(DDI)
� Platform Environmental Control Interface(PECI)
� Advanced Configuration and Power Interface
(ACPI) states supported
� Processor Core Power Management
� Integrated Memory Controller (IMC) Power Management
� Graphics Power Management
� Intel Turbo Boost Technology 2.0 Power Control
� Configurable TDP (cTDP) and Low Power Mode
� Adaptive Thermal Monitor
� Digital Thermal Sensor
� Intel Memory Thermal Management
� Scenario Design Power(SDP)

� Card Bus Controller
� REALTEK RTS5170
� Memory Card Reader Controller
� Audio Controller
REALTEK ALC256 integrated audio controller supports multimedia. The sound

system features contain the following:
� integrates a 4-channel DAC, 4-channel ADC, and a stereo Class-D Speaker
Amplifier with 2 watts per channel output power.
� 4-channel ADC that supports 16/20/24-bit PCM format for independent two
stereo channel audio inputs. All ADCs support 44.1K/48K/96/192KHz sample
rates.
� 4 GPIOs for customized applications (pin-shared with digital microphone
interface and SPDIF-OUT)
� Supports combo jack with stereo headphone output and mono microphone
input on a 4-pole jack
� Volume synchronization for PCBEEP in D0/D3 mode
� KBC/EC (Keyboard Controller/Embedded Controller)
A KBC IT5570E-128 chip is used to serve as KBC/EC and Super IO: � KBC
� Scan controller function

� Interface controller function
� EC
� Power Supply sequence control
� Overheat shutdown support
� LED control
� Beep control
� Cooling fan speed control
� Universal I/O port
� Battery capacity check
� Flash memory reprogramming function
1.2 System Unit Components 1 Hardware Overview
� EC access interface
� I2C communication control
� Clock Generator
� Mobile Intel TGL&TGL-R CPU integrated Clock Generator

� Generating the clock signal required for the system
� LAN Controller
� REALTEK _ RTL8111H-CG& RTL8125BG 10/100M/1000M bit

� Fully compliant with IEEE 802.3,
� Supports PCI Express 1.1
� Transmit/Receive on-chip buffer support
� Supports PCI MSI (Message Signaled Interrupt) and MSI-X
� Wake-On LAN and “RealWoW!” Technology
(remote wake-up) support
� Supports Microsoft Wake-up frame
� Wireless LAN Controller
� Support following M.2: CNVio2 wireless LAN cards

Intel Jefferson Peak1, 802.11ac+BT5.0
Intel Jefferson Peak2, 802.11ac+BT5.0
Non-Intel CM251, 802.11ac+BT5.0
Intel Harrison Peak2, 802.11ax+BT5.1
� Data Rate
Intel Jefferson Peak1
� IEEE 802.11b: 11Mbps
� IEEE 802.11a/g: 54Mbps
� IEEE 802.11n: 150Mbps
� IEEE 802.11ac: 433.3Mbps

� IEEE 802.11n: 258Mbps
� IEEE 802.11ac: 1366Mbps

1 Hardware Overview 1.2 System Unit Component
Non-Intel CM251
� IEEE 802.11n: 150Mbps
� IEEE 802.11ac: 433Mbps
Intel Harrison Peak2

� IEEE 802.11n: 300Mbps
� IEEE 802.11ac: 866.7Mbps
� IEEE 802.11ax: 2.4Gbps
� Frequency Channel
� IEEE802.11b/g: 2.4GHz
� IEEE802.11n: 2.4GHz/5GHz
� IEEE 802.11a: 2.4GHz
� IEEE802.11ac: 5GHz

� IEEE 802.11a/b/g: 2.4Ghz
� IEEE 802.11n: 2.4Ghz/5Ghz
� IEEE 802.11ac: 2.4Ghz/5Ghz
Non-Intel CM251
� IEEE802.11b/g :2.4GHz
� IEEE802.11n :2.4GHz/5GHz
� IEEE802.11a: 5GHz
� IEEE802.11ac: 5GHz
Intel Harrison Peak2

� IEEE802.11b/g :2.4GHz
� IEEE802.11n :2.4GHz/5GHz
� IEEE 802.11ax :2.4GHz/5GHz
� IEEE802.11a/ac: 5GHz

1.3 Solid State Drive(SSD) 1 Hardware Overview
1.3 Solid State Drive (SSD)
The M.2 PCIe SSD is fully consist of semiconductor device and using NAND flash
Memory which has a high reliability and a high technology in a small form factor
for using a SSD
The SSD is shown in Figure 1-5 and some of its specifications are listed in Table 1-1.
Figure 1-5 Solid state driver

1 Hardware Overview 1.4 Power supply
Table 1-1 SSD Specifications
Bytes per sector

Item Read Write
M.2 128G PCIe SSD 2250MB/s 600MB/s 512Byte
1.4 Power Supply
The power supply unit provides many different voltages for the system board and
performs the following functions:
1. Power input monitor
� Checks whether the DC power supply (AC adapter) is connected to the

computer.
� Checks whether the battery pack is connected to the computer.
� Monitors the DC power supply input (AC Adapter output).
2. Power supply's internal control
� Turns on and off the battery pack charging power supply.

� Issues a charging current instruction to the PWM control IC of the battery
pack charging power supply.
� Controls the supply of power to the system block (load/logic circuit side).
� Controls forced shutdown if the power supply malfunctions.
3. Logic circuit control

1.5 Batteries 1 Hardware Overview
� Instructs the gate array to enable/disable tuning the power on.

� Controls power-on/off operation.
4. Status display
� Turns on the Power.

� Battery indicator (in Blue or Amber or Amber Blink).
5. External interface
� Performs communication through the SMBUS (via the internal EC/KBC).

� Transfers the power supply operation mode.
6. Output monitor
� Monitors the voltage, over voltage, input/output current of the battery pack.
� Monitors the internal temperature of the battery pack.
1.5 Batteries
The computer has the following type of battery:
� Main Battery Pack
Table 1-2 list the specifications of battery.
Table 1-2 Battery Specifications
Battery Type Material Output voltage Capacity
Main Battery Pack 2 Cell Lithium Ion 7.6 V 6000 mAh
1.51 Main Battery

The main battery pack serves as the computer's main power source when the
1 Hardware Overview 1.5 Batteries
AC adapter is not attached. The main battery maintains the state of the computer
so that it can resume it.
1.52 Battery Charging Control

Battery charging is controlled by TI BQ24780S. When AC adapter and battery
pack are attached to the computer, BQ24780S controls the charge on/off state
and detects a full charge.
� Battery Charge
When the AC adapter is attached, the battery is charged by off-state charge when the system is
powered off or by on-state charge when it is powered on.
Table 1-3 Quick/Normal Charging Time
State Charge Time
Off-State Charge 2 Cell Less than 4 hours
On-State Charge 2 Cell over 4 hours
NOTE: The time required for normal charge depends on the power consumption by the
system. Using the fluorescent lamp and frequently accessing the disk consume much
power and lengthen the charge time.
Any of the following cases stops battery charge:
1. The battery becomes fully charged.
2. The AC adapter or battery pack is removed.
3. The battery or AC adapter voltage is abnormal.
� Detection of full charge

A full charge is detected only when the battery is being charged by quick or
normal charge. A full charge is detected when either of the following
conditions is met:
1.5 Batteries 1 Hardware Overview
1. The current in the battery charging circuit drops below

the predetermined value.
2. The charging time exceeds the fixed limit.

2 概要
Chapter 2
Troubleshooting
2 Troubleshooting
Chapter 2 Contents
2.1 Outline ................................................................................................................... 2-1

2.2 Basic Flowchart ....................................................................................................... 2-2
2.3 Power Supply .......................................................................................................... 2-6
Procedure 1 Power Icon Check ........................................................................ 2-6
Procedure 2 Connec�on Check ...................................................................... 2-7
Procedure 3 Replacement Check .................................................................... 2-7
2.4 System Board 2-8
Procedure 1 Message Check ........................................................................... 2-8
Procedure 2 Test Program Check .................................................................... 2-9
Procedure 3 Replacement Check .................................................................... 2-9
2.5 Keyboard............................................................................................................... 2-10
Procedure 1 Test Program Check .................................................................. 2-10
Procedure 2 Connector Check and Replacement Check............................... 2-10
2.6 Display .................................................................................................................. 2-11
Procedure 1 External Monitor Check ............................................................ 2-11
Procedure 3 Connector Check and Replacement Check............................... 2-11
2.7 Memory ................................................................................................................ 2-13
Procedure 1 Test Program Check ................................................................... 2-13
2.8 SSD (Solid-state Drive) or eMMC.......................................................................... 2-14
2.9 Audio Test ............................................................................................................. 2-15
Procedure 1 Windows Applica�on Test ......................................................... 2-15
Procedure 2 Connector Check and Replacement Check................................ 2-15
2.10 Touchpad .............................................................................................................. 2-16
Procedure 2 Connector Check and Replacement Check................................ 2-16
2-ii Maintenance Manual SATELLITE PRO C40-J/C50-J

2 Troubleshooting
2.11 USB Port................................................................................................................ 2-17

Procedure 2 Connector Check and Replacement Check ................................ 2-17
2.12 Headphone/Microphone Port ............................................................................. 2-18
2.13 HDMI Port............................................................................................................. 2-19
2.14 Micro SD card Port................................................................................................ 2-20
2.15 Camera ................................................................................................................ 2-21
Procedure 1 Windows Applica�on Test ........................................................ 2-21
Procedure 2 Connector Check and Replacement Check ............................... 2-21
2.16 Wireless LAN 2-22
Procedure 1 Windows Applica�on Test ....................................................... 2-22
Procedure 2 Connector Check and Replacement Check .............................. 2-22
2.17 Ba�ery Pack.......................................................................................................... 2-23
Procedure 1 Windows Applica�on discharge Test ......................................... 2-23
2.18 Finger Print 2-25
Procedure 1 Windows Applica�on ............................................................... 2-25
2.19 Bluetooth 2-26
2.20 LAN Port 2-27
SATELLITE PRO C40-J/C50-J Maintenance Manual 2-iii

2 Troubleshooting
Figures
Figure 2-1 Basic Flowchart (1/2)..................................................................................... 2-3
2-iv Maintenance Manual SATELLITE PRO C40-J/C50-J

2.1 Outline 2 Troubleshooting
2.1 Outline
This chapter describes the fault diagnos�c procedures for field replaceable units(FRUs) in
the computer.
The FRUs covered here are as follows:

1. System Board 2. Keyboard 3. Display
4. SSD 5. Audio 6. Touch pad
7. USB Port 8. Headphone / Microphone port 9. HDMI Port
10. SD Card Port 11. Camera 12. Wireless LAN
13. Battery Pack 14. Finger Print 15. Bluetooth
16. LAN(RJ45)
This Model support Intel Gemini lake with GPU. See Chapter 4 for the procedures to replace
FRU and Chapter 3 for the procedures to use test programs.
The following tools are required to perform the diagnos�c procedures:

1. USB Memory
2. Screwdrivers (2.0mm, 2.5mm)
3. Multi-meter
4. External monitor with HDMI In Port
5. Headphone
6. SD card
SATELLITE PRO C40-J/C50-J Maintenance Manual 2-1

2 Troubleshooting 2.2 Basic Flowchart
2.2 Basic Flowchart
The basic flowchart in Figure 2-1 serves as a guide for iden�fying a possibly faulty FRU.
Before going through the diagnos�c flowchart steps, verify the following:
� Ask the user if a password has been registered and, if so, ask him or her to enter the
password. If the user has forgotten the system password, please follow below erase
password process. The computer will override password protection and automatically
erases the current password.
1. press Power button to turn the computer power on
2. password will erase when computer booted
� Make sure Windows® 10 has been installed on the HDD. Any other operating system
can cause the computer to malfunction.
2-2 Maintenance SATELLITE PRO C40-J/C50-J

2.2 Basic Flowchart 2 Troubleshooting
Start
Connect the AC Adapter
No
Follow the power supply Diagnos�c
DC IN/Ba�ery Charge LED is on?
Procedure in Sec�on 2.3
Yes
Turn the power on.
Yes
Follow the system board diagnos�c
Any error message is displayed?
No
Message “dynabook” is No Follow the display diagnos�c

displayed? Procedure in Sec�on 2.6
Yes
Yes
See the previous page to
"Password=" is displayed??
Delete the password.
No
Follow the HDD diagnos�c

OS has started??
No
Yes
1
Figure 2-1 Basic Flowchart (1/2)

2 Troubleshooting 2.2 Basic Flowchart
No
Follow the keyboard diagnos�c
Keyboard works well??
Insert Bootable USB Memory into USB Port.
No
Diagnos�c Program Follow the USB port diagnos�c
is loaded? Procedure in Sec�on 2.11
Yes
Perform each test with the
diagnos�c program.
Yes Iden�fy the test resul�ng in the error

Any error is detected by the
diagnos�c program? And perform the appropriate
Diagnos�c procedures
No
Perform the con�nuous test to check if
the error is intermi�ent
Yes Iden�fy the test resul�ng in the

Any error is detected by the
diagnos�c program? Error and perform the appropriate
Diagnos�c procedures
No
The system is normal.
END
Figure 2-1 Basic Flowchart (2/2)

2.2 Basic Flowchart 2 Troubleshooting
If diagnos�c program cannot detect an error, the error may be intermi�ent. Run con�nuous
test program repeatedly to isolate problem. Check log u�lity func�on to confirm which
diagnos�c test detects error, and perform appropriate troubleshoo�ng procedures as below:
1. If an error is detected by CPU Test, follow the system board troubleshooting

procedures in Section 2.4.
2. If an error is detected by SSD Test, follow the SSD troubleshooting
procedures inSection 2.8.
3. If an error is detected by Keyboard Test, follow the keyboard
troubleshootingprocedures in Section 2.5.
4. If an error is detected by Display Test, follow the display troubleshooting
proceduresin Section 2.6.
5. If an error is detected by Memory Test, follow the memory
troubleshootingprocedures in Section 2.7
6. If Audio error is detected by Windows application, please follow the
audiotroubleshooting procedures in Section 2.9
7. If Touch pad error is detected by Windows application, please follow the
touchpad trouble shooting procedures in Section 2.10.
8. If USB error is detected by Windows application, please follow the USB port
troubleshooting procedures in Section 2.11.
9. If Headphone/Microphone error is detected by Windows application, please
follow the headphoneport troubleshooting procedures in Section 2.12.
10. If HDMI error is detected by Windows application, please follow the
HDMI porttroubleshooting procedures in Section 2.13
11. If Micro SD Card error is detected by Windows application, please follow the
SD Card Porttroubleshooting procedures in Section 2.14
12. If Camera error is detected by Windows application, please follow the
Cameratroubleshooting procedures in Section 2.15
13. If Wireless LAN error is detected by Windows application, please follow the
WirelessLAN troubleshooting procedures in Section 2.16
14. If Battery error is detected by Windows application, please follow the
Batterytroubleshooting procedures in Section 2.17
15. If Finger Print error is detected by Windows application, please follow the
FingerPrint troubleshooting procedures in Section 2.18
16. If Bluetooth error is detected by Windows application, please follow the
Bluetoothtroubleshooting procedures in section 2.19
17. If LAN Port error is detected by Windows application, follow the LAN Port
troubleshooting procedures in section 2.20.

2 Troubleshooting 2.3 Power Supply
2.3 Power Supply
The power supply in the computer controls many func�ons and components. To check if the
power supply is defec�ve or malfunc�oning, follow the troubleshoo�ng procedures below as
instructed.
Procedure 1 Power Icon Check

Procedure 2 Connection Check
Procedure 3 Replacement Check
Procedure 1: Power Icon Check

The following power LED indicates the power supply status:
� Power LED
The power supply controller displays the power supply status through the DC IN/Ba�ery
Charge LED as in the table below.
� DC IN/Battery Charge LED
DC IN/Battery Charge LED Power Supply Status

On in White Battery is fully Charged.
On in Amber Battery is been Charging from AC Adapter.
Blinking in Amber Pre-Charge mode (I2C no ack).
Battery not detected
All Off Discharge mode/Stop Charge
If the Power LED and DC IN/Ba�ery Charge LED are off, follow the steps below:
1. Shut down the computer. Remove the AC adapter to shut off power supply to the
computer. Then disassemble the computer and replace the ba�ery. Next, assemble to
check the ba�ery.
2. AC adapter back again.
If the Power LED on IO board is s�ll off, follow the steps below.
Check 1 Turn on your computer and make sure the Power LED color is white. If it does
not, go to Procedure 2.
If the DC IN/Ba�ery Charge LED on System board is s�ll off, follows the steps below:
Check 1 Make sure the M/B DC IN/Ba�ery Charge LED on System board goes on in
White or Amber. If it does not, go to Procedure 2.

2.3 Power Supply 2 Troubleshooting
Procedure 2: Connection Check

Power is supplied to the system board as illustrated below:
AC System boar IO
adapter board
AC power cord AC adapter cord
Ba�ery pack
Follow the steps below to check whether each connector has been connected correctly:
Check 1 Make sure the AC adaptor and AC power cord have been firmly plugged into
the DC IN socket and wall outlet, respec�vely. When they have been
connected correctly, perform Check 2.
Check 2 Connect a new AC adaptor and AC power cord.
Check 3 About the DC IN/Ba�ery Charge LED on System board: Make sure the AC
adapter cord is properly a�ached to your computer. If the LED does not light
when the AC adapter cord is properly installed, go to Procedure 3.
Check 4 About the I/O board Power LED: Make sure the System board and IO board are
firmly connected with the FFC cable. If the LED does not light even if the M/B
and IO board are properly connected with the FFC cable, go to Procedure 4.

The system board may be defec�ve. Disassemble the computer and replace the system
board with a new one according to Chapter 4.

The IO board or FFC cable may be defec�ve. Disassemble the computer and replace the IO
board or FFC cable with a new one according to Chapter 4.

2 Troubleshooting 2.4 System Board
2.4 System Board
To check if the system board is defec�ve or malfunc�oning, follow the troubleshoo�ng

procedures below as instructed.
Procedure 1: Message Check

Procedure 2: Test Program Check
Procedure 3: Replacement Check
Procedure 1: Message Check

When the power is turned on, the system performs the self-diagnos�c Power On Self Test
(POST) embedded in the BIOS ROM. The POST tests and ini�alizes each IC on the system
board.
� If an error message appears on the display, perform Procedure 3.
� If there is no error message, go to Procedure 2.
� If Window 10 is loaded normally, go to Procedure 3.

2.4 System Board 2 Troubleshooting

The maintenance test program contains several programs for diagnosing the system board
and CPU. Execute the following test programs using the procedures described in Chapter 3.
1. System Informa�on Test
2. KEYBOARD Test
3. TOUCH PAD Test
4. BATTERY CAPACITY Test
5. BATTERY OFF Test (Se�ng)
6. HDD PHYSICAL Test
7. HDD LOGICAL Test
8. MEMORY Test
9. USB STORAGE Test
10. SD STORAGE Test
11. WIRED LAN Test
12. CPU Test
13. GRAPHICAL DISPLAY Test
14. Timer Test
If an error is detected during these tests, go to Procedure 3.
Procedure 3: Replacement Check

The system board or memory may be defec�ve. Disassemble the computer following the
steps described in Chapter 4 and replace the system board, memory module with a new one.

2 Troubleshooting 2.5 Keyboard
2.5 Keyboard
To check if the computer’s keyboard is defec�ve or malfunc�oning, follow troubleshoo�ng


Procedure 2: Connector Check and Replacement Check
Execute the Keyboard test available as part of the maintenance test program.See Chapter 3
for informa�on on how to perform the test. Some Keyboard have support Illumina�on (Backlit)
func�on, check this func�on during Keyboard test when press any key.
If an error is detected in the test, go to Procedure 2. If no error is detected, the keyboard
itself is normal.
The keyboard or system board may be disconnected or faulty. Disassemble the computer
following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure the keyboard cable has been firmly connected to the system board.
Keyboard System board CPU
If the cable is loose or off, reconnect it firmly and return to Procedure 1. If

there is s�ll an error, perform Check 2.
Check 2 The keyboard may be faulty. Replace it with a new one following the
instruc�ons in Chapter 4. If the problem persists, perform Check 3.
Check 3 The System board may be faulty. Replace it with a new one following the
instruc�ons in Chapter 4. If the keyboard is s�ll not func�oning properly,
perform Procedure 1

2.6 Display 2 Troubleshooting
2.6 Display
To check if the computer’s display is defec�ve or malfunc�oning, follow the troubleshoo�ng

Procedure 1: External Monitor Check (Monitor with HDMI terminal)
Procedure 1: External Monitor Check

Connect an external monitor to the computer's external monitor port, then boot the
computer. The computer automa�cally detects the external monitor even if resume mode is
enabled.
If the external monitor works correctly, the internal LCD, or LCD cable may be faulty.Go to
Procedure 3.
If the external monitor appears to have the same problem as the internal monitor, the system
board may be faulty. Go to Procedure 2.

Insert the diagnos�cs USB Memory into the computer's USB Port, turn on the computer and
run the test. See Chapter 3 for informa�on on how to perform the test.
If an error is detected in the test, go to Procedure 3. If no error is detected, the display itself
is normal.

The display unit has an LCD module, LED Backlight module, panel close switch. Any of the
components or their connec�ons may be defec�ve. Disassemble the computer following
steps described in Chapter 4, and then perform the following checks:
(1) If the FL does not light, perform Check 1.
(2) If characters or graphics are not displayed normally, perform Check 5.
(3) If the FL remains lit when the display is closed, the panel close switch may be
defective. Perform Check 5.
Check 1 Make sure the following cables have been firmly connected to the system board.

2 Troubleshooting 2.6 Display
LCD System board
LCD cable
If any of the cables is loose or off, reconnect it firmly and return to Procedure
3. If there is s�ll an error, perform Check 2.
Check 2 The LCD cable may be faulty. Replace it with a new one and return to
Procedure 3. If there is s�ll an error, perform Check 3.
Check 3 Make sure the LCD cable has been firmly connected to the system board and
LCD module, if the cable is loose or off, reconnect it firmly and return to
Check 4 The LCD module may be faulty. Replace it with a new one and return to
Check 5 The System board may be faulty. Replace it with a new one. If there is s�ll an
error, perform Check 1.

2.7 Memory 2 Troubleshooting
2.7 Memory
To check if the computer’s Memory Module is defec�ve or malfunc�oning, follow the

troubleshoo�ng procedures below as instructed.


Execute Memory Test Program available as part of the maintenance test program. This test
program checks the memory module. Insert the diagnos�cs USB Memory into the computer's
USB Port, turn on the computer and run the test. See Chapter 3 for informa�on on how to
perform the test.

2 Troubleshooting 2.10 Touchpad
2.8 SSD (Solid-state Drive) or eMMC
To check if the SSD is defec�ve or malfunc�oning, follow the troubleshoo�ng procedures

below as instructed.
NOTE: The contents of the SSD or eMMC will be erased when the SSD or eMMC
diagnostic test or formatting is executed. Save the required contents of the SSD or
eMMC to other storage drive in advance.

Run the storage test program stored on the maintenance test program disk for all test items.
See Chapter 3 for details on how to use the test program.
If an error is detected during the SSD or eMMC test, go to Procedure 2.
Procedure 2: Connector Check and Replacement Check for SSD

The SSD or system board may be faulty. Disassemble the computer following the steps
described in Chapter 4 and perform the following checks s:
Check 1 Make sure the following connectors have been firmly connected to the SSD
and system board.
SSD System Board
If any connector is loose or off, reconnect it firmly and return to Procedure 1. If

Check 2 The SSD may be faulty. Replace it with a new one following the instruc�ons in
Chapter 4. If the problem persists, perform Check 3.
instruc�ons in Chapter 4.

2.9Audio Test 2 Troubleshooting
2.9 Audio Test
To check if the computer’s Speaker is defec�ve or malfunc�oning, follow troubleshoo�ng

Procedure 1: Windows Application Test

Speakers are connected to System Board through cable. Please power on the computer into
Windows. The computer will automa�cally detect these speakers.
If an error is detected in the test, go to Procedure 2. If no error is detected, the Audio itself
is normal.
The system board may be disconnected or faulty. Disassemble the computer following the
steps described in Chapter 4 and perform the following checks:
Check 1 Make sure the Speaker cable has been firmly connected to the system board.
Speaker System board
If the cable is loose or off, reconnect it firmly and return to Procedure 1. If

Check 2 The Speaker may be faulty. Replace it with a new one following the
instruc�ons in Chapter 4. If the problem persists, perform Check 3.
instruc�ons in Chapter 4. If the Audio is s�ll not func�oning properly, perform
Procedure 1.

2 Troubleshooting 2.10 Touchpad
2.10 Touchpad
This model has support two kind types Touch Pad. One is normal touch pad, another is
secure pad. To check if the computer’s Touchpad or Secure pad is defec�ve or
malfunc�oning, follow troubleshoo�ng procedures below as instructed.


Run the test program stored on the maintenance test program disk for test items. See
Chapter 3 for details on how to use the test program.
If an error is detected during the test, go to Procedure 2.

Touchpad or Secure Pad Module is connected to the system board through FFC Cable.
If Touchpad or Secure Pad Module malfunc�ons, there may be a bad connec�on between
Module and System Board, or either might be faulty. Disassemble the computer following the
steps described in Chapter 4 and perform the following checks:
Check 1 Make sure Touchpad or Secure Pad Module has been firmly connected to the
connector on System Board. Also make sure the tape is not stuck to any part of
Touchpad Module and Touchpad or Secure Pad Module is free of foreign
ma�ers.
Touchpad /
Secure Pad System Board
Module
And if connector is disconnected, connect it firmly to system board & return to

Procedure 1. If the tape is stuck to any part of Touchpad or Secure pad, s�ck it
back to the specified point and if a foreign ma�er is found on Touchpad or
Secure pad, remove it and then return to Procedure 1. If there is s�ll an error,
perform Check 2.
Check 2 Touchpad or Secure Pad Module may be faulty. Replace it with a new one
following the steps described in Chapter 4. If Touchpad or Secure Pad Module
replaced is s�ll not func�oning properly, perform Check 3.
Check 3 System Board may be defec�ve. Replace System Board with new one following
steps described in Chapter 4.

2.11 USB Port 2 Troubleshooting
2.11 USB Port
To determine if the computer’s USB Port is func�oning properly or malfunc�ons, perform

following procedures. Start with Procedure 1 and con�nue with the other procedure as
instruc�on below.


Chapter 3 for details on how to use the test program.
If an error is detected during the test, go to Procedure 2.

If USB Port on System or IO Board malfunc�ons, there may be a bad connec�on between
USB device and System or IO Board, or either of System or IO Board might be faulty.
Disassemble the computer following the steps described in Chapter 4 and perform the
following checks:
Check 1 Make sure USB device cable has been firmly connected to USB Port of System
Board. Also make sure USB Port on System Board is free of foreign ma�ers.
IO Board
USB Port
System Board
And if the connector is disconnected, connect it firmly to the system or IO

board and return to Procedure 1. If a foreign ma�er is found on USB Port of
System or IO Board, remove it and then return to Procedure 1. If the problem
persists, perform Check 2.
Check 2 System or IO Board may be faulty. Replace it with a new one following the
steps described in Chapter 4.

2 Troubleshooting 2.12 Headphone Port
2.12 Headphone/Microphone Port
To determine if the computer’s Headphone Port is func�oning properly or malfunc�ons,

perform following procedures. Start with Procedure 1 and con�nue with the other procedure
as instruc�on below.


Headphone/Microphone Port Connector is mounted on System Board. Connect external
Headphone/Microphone with Headphone Jack interface to the computer’s
Headphone/Microphone Port, then power on the computer into Windows. The computer
will automa�cally detect this Headphone device through Headphone/Microphone Port.
Execute Func�on Programs in Windows, if the Headphone device appears to have a certain
problem, go to Procedure 2. If an error is not located, Headphone/Microphone Port is
func�oning properly.

If Headphone/Microphone Port on System Board malfunc�ons, there may be a bad
connec�on between Headphone/Microphone device and System Board, or either of System
Board might be faulty. Disassemble the computer following the steps described in Chapter 4
and perform the following checks:
Check 1 Make sure Headphone/Microphone device cable has been firmly connected to
Headphone/Microphone Port of System Board. Also make sure Headphone/
Microphone Port on System Board is free of foreign ma�ers.
Headphone/Mic
rophone Port System Board
And if the connector is disconnected, connect it firmly to the system board

and return to Procedure 1. If a foreign ma�er is found on Headphone Port of
System Board, remove it and then return to Procedure 1. If the problem
persists, perform Check 2.
Check 2 System Board may be faulty. Replace it with a new one following the steps
described in Chapter 4.

2.13 HDMI Port 2 Troubleshooting
2.13 HDMI Port
To determine if the computer’s HDMI Port is func�oning properly or malfunc�ons, perform

instruc�on below


The HDMI Port Connector is mounted on System Board. Connect an external monitor with
HDMI interface to the computer’s HDMI port, then power on the computer into Windows.
The computer will automa�cally detect this external monitor through HDMI Port. If the
external monitor appears to have a certain problem, go to Procedure 2. If an error is not
located, HDMI Port is func�oning properly.

If HDMI Port on System Board malfunc�ons, there may be a bad connec�on between
External Monitor and System Board. Or System Board might be faulty. Disassemble the
computer following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure External Monitor HDMI Cable has been firmly connected to HDMI
Port on System Board. Also make sure HDMI Port on System Board is free of
foreign ma�ers.
HDMI Port System Board
And if the connector is disconnected, connect it firmly to the system board and
return to Procedure 1. If a foreign ma�er is found on HDMI Port of System
Board, remove it and then return to Procedure 1. If the problem persists,
perform Check 2.

2 Troubleshooting 2.14 Micro SD card Port
2.14 Micro SD card Port
IO Board or System Board may be the reason of Micro SD fault. Either of these two
components may be damaged. To determine if the computer’s IO Board is func�oning
properly, perform following procedures. Start with Procedure 1 and con�nue with the other
procedure as instruc�on below.


Chapter 3 for details on how to use the test program. If an
error is detected during the test, go to Procedure 2.

IO Board is connected to System Board through FFC Cable. If SD Card malfunc�ons, there
may be a bad connec�on between IO Board and System Board, or either of these two
components might be faulty. Disassemble the computer following the steps described in
Chapter 4 and perform the following checks:
Check 1 Make sure IO Board FFC Cable has been firmly connected to the connectoron
System Board. Also make sure IO Board is free of foreign ma�ers.
IO Board System Board

and return to Procedure 1. If a foreign ma�er is found on IO Board, remove
itand then return to Procedure 1. If the problem persists, perform Check 2.
Check 2 IO Board may be faulty. Replace it with a new one following the steps
described inChapter 4. If IO Board replaced is s�ll not func�oning properly,
perform Check 3.
Check 3 System Board may be defec�ve. Replace System Board with a new one
following steps described in Chapter 4.

2.15 Camera 2 Troubleshooting
2.15 Camera
Camera Module or System Board may be the reason of Camera fault. Either of these two
components may be damaged. To determine if the computer’s Camera is func�oning
procedure as instruc�on below.


Execute Func�on Programs in Windows, LED of Camera Module should be turned on when
Camera is working, if Camera Module is not func�oning properly, go to Procedure 2. If an error
is not located, Camera system is func�oning properly.

Camera Module is connected to System Board through FPC Cable. If Camera malfunc�ons,
there may be a bad connec�on between Camera Module and System Board, or either of these
two components might be faulty. Disassemble the computer following the steps described in
Chapter 4 and perform the following checks:
Check 1 Make sure Camera Module FPC Cable has been firmly connected to the
connector on System Board. Also make sure Camera Module is free of foreign
ma�ers.
Camera
System Board
Module

and return to Procedure 1. If a foreign ma�er is found on Camera Module,
remove it and then return to Procedure 1. If the problem persists, perform
Check 2.
Check 2 Camera Module may be faulty. Replace it with a new one following the steps
described in Chapter 4. If Camera Module replaced is s�ll not func�oning
properly, perform Check 3.
following the steps described in Chapter 4.

2 Troubleshooting 2.16 Wireless LAN
2.16 Wireless LAN
Wireless Module or system board may be the reason of Wireless LAN fault. Either of these two
components may be damaged. To determine if the computer’s Wireless LAN module is
func�oning properly, perform following procedures. Start with Procedure 1 and con�nue with
the other procedures as instruc�on below.


Place unit to loca�on near wifi hotspot. Execute wifi applica�ons in Windows, then ac�ve
wireless connec�on. Check whether unit can normally connect to wifi hotspot. If connec�on
is fail, go to Procedure 2. If error is not located, Wireless LAN system is func�oning properly.

Wireless LAN Module is connected to the system board. If Wireless LAN malfunc�ons, there
may be a bad connec�on between Wireless LAN Module and the system board, or either
might be faulty. Disassemble the computer following the steps described in Chapter 4 and
perform the following checks:
Check 1 Make sure Wireless LAN module has been firmly connected to the connector
on the system board. Also make sure Wireless LAN module is free of foreign
ma�ers.
Wireless LAN
System Board
Module
return to Procedure 1. If a foreign ma�er is found on Wireless LAN Module,
remove it and then return to Procedure 1. If there is s�ll an error,perform Check
2.
Check 2 Wireless LAN Module may be faulty. Replace it with a new one following the
steps described in Chapter 4. If Wireless LAN Module replaced is s�ll not
func�oning properly, perform Check 3.

2.1718 Finger Print 2 Troubleshooting
2.17 Battery Pack(RTC)
Ba�ery Pack or system board may be the reason of Ba�ery fault. Either of these two
components may be damaged. To determine if the computer’s Ba�ery Pack is func�oning
procedures as instruc�on below.
Procedure 1: Windows Application discharge Test

Procedure 1: Windows Application discharge Test

Boot up unit from Ba�ery only, make sure AC adaptor power cable doesn't connect to unit.
If unit can't boot up a�er pressing power bu�on, connect AC adaptor power cable to unit to
charge ba�ery.
A�er 10 minus, remove AC adaptor power cable then press power bu�on. If
unit can boot up a�er pressing power bu�on, go to Procedure 2.
If it cannot boot up, go to Procedure 3.

Chapter 3 for details on how to use the test program. If an
error is detected during the test, go to Procedure 2.

Ba�ery Pack is connected to the system board. If Ba�ery Pack malfunc�ons, there may be a
bad connec�on between Ba�ery Pack and the system board, or either might be faulty.
following checks:
Check 1 Make sure Ba�ery Pack has been firmly connected to the connector on the
system board. Also make sure Ba�ery Pack is free of foreign ma�ers.
Battery Pack System Board

2 Troubleshooting 2.17 Battery Pack(RTC)
return to Procedure 1 or 2. If a foreign ma�er is found on Ba�ery Pack, remove
it and then return to Procedure 1 or 2. If there is s�ll an error, perform Check 2.
Check 2 Ba�ery Pack may be faulty. Replace it with a new one following the steps
described in Chapter 4. If Ba�ery Pack replaced is s�ll not func�oning properly,
perform Check 3.
RTC Battery
If the system �me is delayed or stopped, the RTC ba�ery may be defec�ve.
Procedure 1: Check the System date and time
Procedure 1: Check the System date and time

If the system �me is delayed or stopped, go to Procedure 2.

The RTC ba�ery is connected to the system board. If the RTC ba�ery malfunc�ons, the
connec�on between the RTC ba�ery and the system board may be poor or the RTC ba�ery
may be defec�ve. Disassemble the computer following the steps described in Chapter 4 and
replace them.

2.1718 Finger Print 2 Troubleshooting
2.18 Finger Print
To check if the computer’s Finger Print is defec�ve or malfunc�oning, follow the

troubleshoo�ng procedures below as instructed.
Procedure 1: Windows Applica�on Test Procedure 2: Connector Check
Procedure 1: Windows Application

Execute Applica�ons in Windows, move finger above Finger Print Reader.
If it can detect finger print, Finger Print is func�oning properly.If
it cannot detect finger print, go to Procedure 2.

Finger Print is on Secure Pad, and is connected to System Board through FFC cable. If the
Finger Print malfunc�ons, the system board or Secure Pad might be faulty.
following checks:
Check 1 The Secure Pad may be faulty. Replace it with a new one following the
instruc�ons in Chapter 4. Then go through procedure 1 again. If the Finger
Print is s�ll not func�oning properly, perform Check 2.
Check 2 The system board may be defec�ve. Replace the system board with a new one
following the steps described in Chapter 4. Then go through procedure 1 again.

2 Troubleshooting 2.19 Bluetooth
2.19 Bluetooth
Bluetooth is combo module with Wireless LAN on this model. Bluetooth Module or system
board may be the reason of Bluetooth fault. Either of these two components may be damaged.
To determine if the computer’s Bluetooth module is func�oning properly, perform following
procedures. Start with Procedure 1 and con�nue with the other procedures as instruc�on
below.


Place unit to loca�on near Bluetooth device. Execute Bluetooth applica�ons in Windows,
then ac�ve Bluetooth connec�on. Check whether unit can normally connect to Bluetooth
device. If connec�on is fail, go to Procedure 2. If error is not located, Bluetooth is func�oning
properly.

Bluetooth Module is connected to the system board. If Bluetooth malfunc�ons, there may
be a bad connec�on between Bluetooth Module and the system board, or either might be
faulty. Disassemble the computer following the steps described in Chapter 4 and perform the
following checks:
Check 1 Make sure Bluetooth module has been firmly connected to the connector on
the system board. Also make sure Bluetooth module is free of foreign ma�ers.
Bluetooth
System Board
Module
return to Procedure 1. If a foreign ma�er is found on Bluetooth Module,
remove it and then return to Procedure 1. If there is s�ll an error, perform
Check 2.
Check 2 Bluetooth Module may be faulty. Replace it with a new one following the steps
described in Chapter 4. If Bluetooth Module replaced is s�ll not func�oning
properly, perform Check 3.

2.20 LAN Port 2 Troubleshooting
2.20 LAN Port
To determine if the computer’s LAN Port is func�oning properly or malfunc�ons, perform

instruc�on below.


The LAN Port Connector is mounted on System Board. Connect an LAN Cable with Internet
interface to the computer’s LAN port, then power on the computer into Windows. Execute
Func�on Programs in Windows, which will display the LAN Test Result. If the test and
diagnos�cs result is abnormal, go to Procedure 2. If an error is not located, LAN system is
func�oning properly.

If LAN Port on System Board malfunc�ons, there may be a bad connec�on between LAN
Cable and System Board. Or System Board might be faulty. Disassemble the computer
following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure LAN Cable has been firmly connected to LAN Port on System Board.
Also make sure LAN Port on System Board is free of foreign ma�ers.
LAN Port System Board
return to Procedure 1. If a foreign ma�er is found on LAN Port on System Board,
remove it and then return to Procedure 1. If the problem persists, perform
Check 2.

Chapter 3
Diagnostic Programs
3 Diagnostic Programs
Chapter 3 Contents
3.1
1. Outline ................................................................................................................................................................................ 3-3

1-1 Target Model......................................................................................................................................................................... 3-3
1-2 Target OS ............................................................................................................................................................................. 3-3
2. Preparation.......................................................................................................................................................................... 3-3
2-1 Creating WPETD USB memory ........................................................................................................................................ 3-3
2-2 Equipment Configuration for Tests..................................................................................................................................... 3-3
3. dynabook WPETD Operation .......................................................................................................................................... 3-4
3-1 Launch WPETD in Windows PE ....................................................................................................................................... 3-4
3-2 System Information Menu................................................................................................................................................... 3-4
3-2-1 Each item .................................................................................................................................................... 3-4
3-2-2 Details of the system information ............................................................................................................. 3-5
3-3 Diagnostics Test Item Menu ............................................................................................................................................... 3-7
3-3-1 Aging tests and Non-aging tests ............................................................................................................... 3-8
3-3-2 Each item for the operations .............................................................................................................. 3-8
3-3-3 Test setting and Result ............................................................................................................................... 3-9
3-3-4 Test Procedure .........................................................................................................................................3-10
3-3-5 Test Result ................................................................................................................................................3-11
3-3-6 Log Management Screen.........................................................................................................................3-11
4. Diagnostics Test Items ....................................................................................................................................................3-14
4-1 Non Aging Tests ............................................................................................................................................................... 3-14
4-1-1 KEYBOARD Test.......................................................................................................................................3-14
4-1-2 LEDTest ..................................................................................................................................................3-15
4-1-3 TOUCH PAD Test.....................................................................................................................................3-17
4-1-4 BATTERY CAPACITY Test ....................................................................................................................3-18
4-1-5 CPU FAN Test...........................................................................................................................................3-18
4-1-6 BATTERY OFF Test (Setting)..................................................................................................................3-21
4-2 Aging Tests ........................................................................................................................................................................ 3-21
4-2-1 HDD PHYSICAL Test ................................................................................................................................3-22
4-2-2 HDD LOGICAL Test ................................................................................................................................3-23
4-2-3 MEMORY Test..........................................................................................................................................3-25
4-2-4 USB STORAGETest.................................................................................................................................3-25
4-2-5 SD STORAGE Test...................................................................................................................................3-26
4-2-6 WIRED LAN Test .....................................................................................................................................3-27
4-2-7 CPU Test ...................................................................................................................................................3-28
4-2-8 GRAPHICAL DISPLAY Test .................................................................................................................. 3-29
4-2-9 Timer Test ..................................................................................................................................................3-38
5.Appendix .........................................................................................................................................................................3-39
5-1 Log file samples ................................................................................................................................................................3-39

5-1-1 Text log file sample...................................................................................................................................3-39
5-1-2 Html log file sample .................................................................................................................................3-42
5-2 Keybaord layouts .............................................................................................................................................................3-44
5-2-1 YangPass_14_UK....................................................................................................................................3-44
5-2-2 YangPass_14_US ...................................................................................................................................3-44
5-2-3 YangPass_15_UK....................................................................................................................................3-45
5-2-4 YangPass_15_US ...................................................................................................................................3-45
5-2-5 YangPass_15_JP ....................................................................................................................................3-46
6. Maintenance Functions ......................................................................................................................................................3-47
6-1 BIOS Ver. & DMI Info Display.............................................................................................................................. 3-47 6-1-1
Function Description .............................................................................................................................. 3-47
6-1-2 Display Items........................................................................................................................................... 3-47
6-1-3 Maintenance Tips for DMI Info............................................................................................................ 3-48
6-2 DMI Update.............................................................................................................................................................. 3-48 6-2-1
Function Description .............................................................................................................................. 3-48
6-2-2 Update Procedure ................................................................................................................................... 3-48
6-3 Others......................................................................................................................................................................... 3-52 6-3-1
Reboot into BIOS..................................................................................................................................... 3-52
6-3-2 Shutdown.................................................................................................................................................. 3-52
7. Appendix ...............................................................................................................................................................................3-53
7-1 How to create a bootable YangPass40 Maintenance Tool ................................................................................ 3-53 7-1-1
Create Procedure..................................................................................................................................... 3-53
7-2 How to startup the YangPass40 Maintenance Tool .......................................................................................... 3-55 7-2-1
Startup Procedure................................................................................................................................... 3-55
8. BIOS update...........................................................................................................................................................................3-56
8-1 Windows mode update ............................................................................................................................................. 3-56
8-2 Shell mode update (USB flash) ............................................................................................................................... 3-57
3-2 Maintenance Manual SATELLITE PRO C40-J/C50-J

1 Outline
This document describes the specifica�on of “Windows PE Test & Diagnos�cs” (Herea�er referred to as “WPETD”) for
YangPass40 series product.
1-1 Target Model
The target model(s) are as follows: 21A model(s): IP3 YangPass40
1-2 Target OS
WPETD can run on the Windows Pre-installa�on Environment as follows: Windows PE 10 19H1 X64
2 Prepara�on
2-1 Crea�ng WPETD USB memory
Get the ISO image of WPETD released from Dynabook Inc., usually by NEXTCloud system.
Burn the ISO image to USB memory. The USB memory will be Windows PE bootable media.
Regarding the USB, use a USB Memory the size of which is 1GB or more.
1) Format USB memory to FAT32 file system.

2) Copy all files of ISO image to USB memory.
2-2 Equipment Configura�on for Tests
The following table indicates the equipment configura�on necessary for WPETD’s test items.
Test Item Equipment required Remarks

USB PORT USB Memory Free space: More than 12MB
During the test WPETD creates a file in the USB Memory.
WIRED LAN Wired router, LAN cable The router must have the DHCP server func�on.
LAN router
LAN cable
(DHCP Server)
(Straight cable)
USB Flash Memory
Fig.1 Equipment Configuration

3 dynabook WPETD Opera�on

3-1 Launch WPETD in Windows PE
Boot up the target PC by WPETD USB memory created in “2-1 Crea�ng WPETD USB memory”. Windows PE starts then
dynabook WPETD will launch.
3-2 System Informa�on Menu
When you launch WPETD in Windows PE, you see “System Informa�on” menu first.
There are 2 tabs as “System Informa�on” and “Diagnos�cs”, you can switch each other by clicking the tab
name.
Version information
Menus
Information tree
Detail of system info
Refresh button
Shutdown button
Exit button
Task manager Launch button
3-2-1 Each item
� [Refresh] bu�on This obtains the system information again.

If you have some grayed-out test items by missing something for example “missing
test medium”, recover the situa�on then click this bu�on and check if it turns to
� [Shutdown] bu�on It shuts down Windows PE.
enable.
� [TaskManager] bu�on Launches Task Manager
� [EXIT] bu�on Terminates WPETD
� Version informa�on The version of WPETD
� Menus Tabs for the menus that WPETD supports.
� Informa�on tree You can select the device that you want to check its system informa�on
� Detail of system information Detailed informa�on of the item selected in Informa�on
tree. Refer the sec�on 3-2-2 below.
3-2-2 Details of the system informa�on
The following tables list the system informa�on items for each device of the “Informa�on tree” structure. If
the mul�ple components exist, index will be added a�er the Item like “CPU0”。
- BIOS
The following items show DMI and BIOS informa�on.
Item Descrip�on WMI
Manufacturer Manufacturer of the PC Win32_ComputerSystem
Product Name Product Name of the PC Win32_ComputerSystemProduct
Part Number Part Number of the PC Win32_ComputerSystemProduct
Serial Number Serial Number of the PC Win32_ComputerSystemProduct
UUID UUID of the PC Win32_ComputerSystemProduct
BIOS Version BIOS Version of the PC Win32_BIOS
BIOS OEMString OEMString of the PC Win32_ComputerSystem
BIOS GSWString GSWString (Baseboard ConfigOp�ons) of the PC Win32_BaseBoard
DPK Injected Yes/No (Whether DPK is injected into BIOS) N/A (it uses Win32 APIs)
- CPU
The following items show CPU informa�on.

CPU Name0 - 3 CPU’s name mounted on the PC Win32_Processor
CPU Clock0 - 3 Current Clock(MHz) and Max Clock(MHz) of the CPU Win32_Processor
CPU Socket0 - 3 Socket Name of the CPU Win32_Processor
CPU Descrip�on0 - 3 Processor Name of the CPU and CPUID(Family, Model, Stepping) Win32_Processor
L2 Cache0 - 3 The second cache (KB) of the CPU Win32_Processor
- MEMORY
The following item shows memory informa�on.
Physical Memory The size of the memory Win32_PhysicalMemory
Memory Device0 - 7 The memory device Win32_PhysicalMemory
- NETWORK
The following items show network card information.
Network0 - 7 The name of the LAN device connected to the PC Win32_NetworkAdapter
MAC Address0 - 7 MAC address of the LAN device Win32_NetworkAdapter

- STORAGE
The following items show IDE, SCSI, and USB memory storage informa�on.
IDE HDD/SSD0 - 1 The name and the capacity of IDE HDD/SSD connected to the PC. Win32_DiskDrive
SCSI HDD/SSD0 - 1 The name and the capacity of SCSI HDD/SSD connected to the PC. Win32_DiskDrive
USB Flash Disk0 The name and the capacity of USB Flash Disk connected to the PC. Win32_DiskDrive
-7
Other Disk0 The name and the capacity of the HDD other than the above Win32_DiskDrive
types which is connected to the PC
Note:
This tool does not check whether it is HDD disk or SSD/eMMC disk, “HDD/SSD” is common descrip�on for all
the fixed hard disk media including HDD, SSD and eMMC.
- ODD
The following item shows ODD informa�on.
ODD0 - 1 The name and the media type of the ODD connected to the PC. Win32_CDROMDrive
Media type is informa�on of the medium, such as CD-ROM, DVD-RW
and etc.
Note:
Please ignore this item for Taikan products, it will show nothing for Taikan since it does not have ODD device.
- DRIVE
The following item shows the informa�on on logical drives from A: to Z: on the PC.
Item Descrip�on
DRIVE The type, volume name, size of the free space and the used space for eachassigned logical
drive
- OTHER DEVICE
The following items show other device informa�on of the PC.

Key Board0 - 3 The name of the Keyboard connected to the PC. Win32_Keyboard
If more than one keyboard is connected, the informa�on of up to 4 keyboards are displayed.
Mouse0 - 3 The name of the mouse connected to the PC. Win32_Poin�ngDevice

3-3 Diagnos�cs Test Item Menu
This sec�on explains the Diagnos�cs screen.
Test setting and result Diagnostics time

(Non-Aging Tests)
Test setting and result

(Aging Tests)
All Item
LOG button
Check box
Pass Count
STOP button
Battery
CPU Multitask START button
All Detail Off check
stress check box box
Check box
Checkbox
On this dialog, you can select which tests you run and how you run them, then you can start the
tests. You can stop the tests during their running when you need.
You can also save log files for the tests in the external media such as a USB Memory.

3-3-1 Aging tests and Non-aging tests

The following items are grouped as Aging tests. If you like you can run them simultaneously, repeatedly and with “CPU Stress”.
Aging Tests: HDD PHYSICAL, HDD LOGICAL, MEMORY, USB STORAGE, SD STORAGE, WIRED LAN, CPU, GRAPHYCAL DISKPLAY,
TIMER.
Other than those, we call them “Non-Aging tests”. Each Non-Aging test is executed only once, and most of the tests require the
user’s interven�on.
When you start the test items on "Diagnos�c" by clicking [START] bu�on and [Mul�task] checkbox is checked, Non-Aging tests you
selected are executed first. Each Non-Aging test runs once in order. When all Non-Aging tests are done, Aging tests you selected will
start.
3-3-2 Each item for the opera�ons
� [All Items Check] check box Check this box, you can select or deselect all test items.
� [All Detail Check] check box Check this box, you can select or deselect all test items in detail.
� [Mul�task] check box Only for Aging tests.
If you check this box, the selected Aging-tests will run simultaneously.If
you uncheck it, the selected Aging tests are executed one by one.
� [Pass Count] edit box Only for Aging tests
Set the number of �mes for a test, which allows you to specify from 1 to 999.
Each Aging test runs un�l reaching "Pass Count" you set.
If you also set "Mul�task" op�on, all selected Aging tests will keep running un�l
when the last one reaches the "Pass Count".
However, if an Aging test gets error 10 �mes, the test item will be terminated.
� [CPU Stress] check box Only for Aging tests
Checking this box applies some stress to the CPU during the test.
� [Set Ba�ery Off At the End] check box if you check this box, it will run ba�ery off test/se�ng once at the end of all tests.
Default is checked. And it will be grayed out and unchecked if no ba�ery or the
running PC cannot be supported (Currently only YangPass40 model is supported)
by this item [Set Battery Off At the End].
� [START] bu�on Start the test.
� [LOG] button Shows the detailed test result or to save it.
� [STOP] bu�on Stops the test during the execu�on.
This bu�on is effec�ve for each Aging test and at the interval between two Non-
Aging tests.
� Diagnos�cs Time The elapsed �me for the test

3-3-3 Test se�ng and Result
Test item Status Test result
Pass Error
� TEST Item Select the check boxes for the items to be tested.
� Status The following table explains the status of each test item (test device).
Status Explana�on
-- Ready for the test prior to the start of it.
TESTING The test is running.
SKIP The test was skipped.
DONE The test finished
Grayed out.
*************** The test item cannot launch as the current environment is not suitable
for running the item. Refer to the table below for details.
Note: Grayed-out test items

A test item will be grayed out if the environment is not good enough for the
test. In that case, the “Status” will be shown as follows:
Status (when grayed out) Explana�on

Device is not equipped The PC does not equip the device for the test.

IP Address cannot be acquired The IP address is not able to be

obtained. The LAN cable may not be
No Intel PRO Set found connected.
For WIRELESS LAN test, Intel Pro Set u�lity is necessary to be
installed in the system.
No executable file The program file (executable file) for the test is missing.
Device not connected The device necessary for the test is not connected/existed
(YangPass40 will have this status for ODD, FDD and 1394 STORAGE test
item since this machine has no these devices).
Device has a problem Some failure occurred in the device driver.
This Device is disabled The device has been removed.
This Device is currently stopped The device is in the STOPPED state.
Space Size Error There is not enough space for test in the test device
No par��on or file There is no par��on in HDD (includes SSD/eMMC) or USB/SD
storage, or no file exists in HDD (includes SSD/eMMC) storage.
Item not support this device The test item not support this device.
� Test result … The test results to be shown on the screen are as follows:
Result Explana�on
-- This means that the test has not started yet or the test has been skipped.
OK The test was successful
NG The test failed
� PASS … Shows the current PASS count for the test.
3-3-4 Test Procedure

This sec�on describes the general procedure for execu�ng the test items.
1) Select the test items to run from Test Item and check it.
If you check or un-check “Check all Items”, you can select or deselect the all test items. 2)
Set the LOOP count, and check or un-check Mul�task and CPU Stress for the Aging tests. 4)
Click the [START] button and the test starts.
5) If Mul�task is checked, a�er all Non Aging tests are done, Aging tests you selected will run simultaneously.
6) If each test’s pass count reaches the “LOOP count” you set or if the [STOP] bu�on is clicked, the test will terminate.

3-3-5 Test Result
If the all tests you selected ends or the [STOP] bu�on is clicked, the following Result windows will come
up. A�er confirming the result, click the [CLOSE] bu�on to close the “Diagnos�cs Result” window.
Error
Testing time Test result
3-3-6 Log Management Screen
When you click the [LOG] bu�on on the “Diagnos�cs” dialog, the following “Log Management “screen will open.
Log file name Overall test result
Save button
1) To show a log file

If you click on a log file name, the file will be opened in the text format.
2) How to save log files
Note:
Currently log files are already saved under “\Logs” folder of WPETD tool’s USB storage root automa�cally,
so you don’t need to use this func�on any more unless you want to save them to another USB storage
(not the USB storage of WPETD tool).
2-1) Make sure that you have plugged an external storage device such as a USB Memory into the PC.

2-2) select the log file that you save.

For each log you select, Text and HTML format files will be saved.
By the [All Select] bu�on, you can select all log files. By
the [All Clear] bu�on, you can un-check all log files.
2-3) Click [Save] bu�on and “Browser Folder” dialog box will open.
Note: Only the drives that have “Removable” a�ribute will be shown such as USB Memory, etc.
When you click [Save] bu�on, if no log file is selected, the following warning message will be shown.
2-4) Select a folder for saving the logs, then click [OK] bu�on
When you click [OK] bu�on without selec�ng a des�na�on folder, the following warning message will be shown.
2-5) The confirma�on message will pop up as follows.

If the des�na�on folder is OK, click the [OK] bu�on.

2-6) If the log files are saved successfully, the following message will come.
Click the [OK] bu�on.
2-7) Click the [Close] bu�on on the “Log Management” screen.
3) The loca�on of Log files created

When you have run the diagnos�cs one cycle (*1) or even when you stop the diagnos�cs by [STOP] bu�on during they are
running, log files for the execu�on will be created at the following loca�on (under “¥Logs” folder of WPETD tool’s USB storage
root).
*1) “the diagnos�cs one cycle” means from selec�ng test items, click [START] bu�on to ge�ng the results.

4 Diagnos�cs Test Items

This chapter explains each test item you launch from the “Diagnos�cs” dialog.
4-1 Non Aging Tests

When you click [START] bu�on on the “Diagnos�cs” dialog, Non Aging Tests you selected run
first. They are executed one by one from the top to the bottom in the list.
4-1-1 KEYBOARD Test

1) Test contents
This test checks if each key on the keyboard works properly.
Note: To test Fn key, press Fn + F1 (It cannot only capture Fn key).
2) Test screen
2-1) - it is “YangPass40_UK”layoutasanexample
Drop-down list for keyboard layout selection
The keyboard layout is shown as above. This is the initial state.
Note:
1. This test supports different keyboard layouts, you can switch each layout at any �me using the
drop-down list. You need to select the one that matched the actual keyboard layout of current
running PC by yourself.
2. If you selected a wrong keyboard layout or you use the default keyboard layout that doesn’t
matched the running PC, you may not be able to test all the keys fully, so please select the right one.
3. When you switch a keyboard layout, the keyboard test is started over. Please refer to 5-2 Keyboard
2-2) - it is “YangPass40_UK”layoutasanexample
layouts for total 5 supported keyboard layouts.
4. Before you select the layout, the drop-down list already filtered out (only show) the layouts of 14-
inch for YangPass40M model, and filtered out (only show) the layouts of 15-inch for YangPass40L
models.

Check method:
Press all the keys to test the keyboard, and when you presses the Key board, it marks like below:
(Yellow: wai�ng for test; Green: Tested OK; Red: NG (Break code NOT paired with make code); Blue: Key Down)
3) Test result
If you want to end current test as a result of NG, you can click FAIL bu�on or just close (X) the KB Test module.
A�er clicking FAIL bu�on, it will be display like below:
(Click the “Cancel” bu�on to exit this KB test as a result of NG, or you can also click “Retry” to reset/start over the KB test)
If all the keys are tested OK, this module will automa�cally exit and has a result of OK.
■ In case of PASS
“OK” is shown in the “Result” field on the “Diagnos�cs” dialog.
■ In case of FAIL
“NG” is shown in the “Result” field on the “Diagnos�cs” dialog.
4) Test file
Keyboard.exe: Test program.
4-1-2 LED Test

1) Test contents
This test checks if all the LEDs (Two Charge LEDs at le� side, Power LED, Caps Lock and Num Lock on le� top of KB) works properly.

2) Test screen
The LED test starts like above, and some prompt message boxes will be popped-up.
When above message box appears, please confirm all the LEDs (Two Charge LEDs at le� side, Power LED, Caps Lock and Num
Lock on le� top of KB) are: On
When above message box appears, please confirm all the LEDs (Two Charge LEDs at le� side, Power LED, Caps Lock and Num
Lock on le� top of KB) are: Off
3) Test Result
As above message box appears, select [Yes] or [No] bu�on depending on your judgment based on the confirmed result previously.
If you click [Yes] here, the test will be “Pass”. If you click [No], the “LED Test” will be recognized as “NG”.
■ In case of PASS
■ In case of FAIL
4-1-3 TOUCH PAD Test

1) Test contents
This test checks if the touch pad works properly.
2) Test screen
Check method:
a. Le�-click all the circles with the touch pad.
b. Right-click to display an end window when you clicked all the circles.
c. Click OK or NG bu�on depending on your judgment. 3) Test Result
Select [OK] or [NG] bu�on depending on your judgment based on the result on the “TOUCH PAD Test”
window.If you click [OK] here, the test will be “Pass”. If you click [NG], the “TOUCH PAD Test” will be recognized
by “ERR”.
■ In case of PASS
■ In case of FAIL
4) Test file
TouchPad.exe: Test program.
4-1-4 BATTERY CAPACITY Test

1) Test contents
This test checks if the Ba�ery Capacity is OK or not.
2) Test screen

Check method:
a. If current ba�ery is charging, you can click refresh to get an updated capacity (currently charged capacity)
b. Click OK or NG bu�on depending on your judgment.
Note: About confirma�on of charge/discharge func�on

We can get the current capacity of the ba�ery by pressing the refresh bu�on. it means that we can check
the discharge/charge func�on of the ba�ery. If we want to check the discharge/charge func�on, we
need
to control the �me of DC in/out for tes�ng by ourselves.
a. To check the discharge func�on of the ba�ery: unplug the DC, wait some �mes and then click the
refresh bu�on to see if the ba�ery capacity reduced by 1%, wait and click again if it hasn’t reduced.
b. To check the charge func�on of the ba�ery: when above discharge func�on checked OK (ba�ery
capacity reduced), you can plug-in the DC back, wait some �mes and then click the refresh bu�on to
see if the ba�ery capacity increased by 1%, wait and click again if it hasn’t increased. Charge func�on
is OK if the ba�ery capacity can be increased.
3) Test Result
Select [OK] or [NG] bu�on depending on your judgment based on the result on the “Ba�ery Capacity Test”
window.If you click [OK] here, the test will be “Pass”. If you click [NG], the “Ba�ery Capacity Test” will be recognized
by “ERR”.
■ In case of PASS
■ In case of FAIL
4) Test file
BatteryCapacity.exe: Test program.
4-1-5 CPU FAN Test

1) Test contents
This test checks if the CPU fan works properly.
2) Test screen

The CPU fan test starts like above, it will test the full speed and half speed of the CPU fan.
You can hear the sound when the CPU fan running at full/half speed during the test.
This test will read out the CPU fan speed it reached, and checks if it meets the speed requirement, if the test is NG, it will show as
red and pause like above, you can press any key to exit and end this test as NG.
3) Test Result
As previously picture shown, if there is NG, it will pause and the result will be NG.
If the test finished OK, it will show as green and then quit the test a�er a while and the test result will be OK.
■ In case of PASS
■ In case of FAIL

4) Test file
CPUFan.exe: Test program.

4-1-6 BATTERY OFF Test (Se�ng)
1) Test contents
This test sets the battery off. And it run only once at the end of all other tests.
Note: A�er the test/se�ng, you can only turn on the PC a�er power adapter (AC) plugged-in,
and screen
2) Test this is what “Shipping Mode” for.
2) Test screen
Check method:
a. Check the [Set Ba�ery Off At the End] check box as introduced in “3-3-2 Each item for the opera�ons”.
b. The ba�ery off (Shipping Mode) test/se�ng starts as above at the end of all other tests, and it will exit automa�cally when
finished.
3) Test Result
If the test finished and exit automa�cally, then the test/se�ng result is OK.
If there is error, then the test/se�ng will pause and the result is NG.
■ In case of PASS
■ In case of FAIL
4) Test file
Ba�eryOff.exe: Test program.
4-2 Aging Tests
The following items are grouped as the Aging tests.

Aging Tests: HDD PHYSICAL, HDD LOGICAL, MEMORY, USB STORAGE, SD STORAGE, WIRED LAN, CPU, GRAPHICAL DISPLAY, Timer
These “Aging Tests” are integrated in WPETD (WinPETD.EXE) itself.

Aging Tests start when the all selected Non Aging Tests have finished.
You can run these Aging Tests more than once by se�ng the “LOOP COUNT”.
If you check “Mul�task” check box, all Aging Tests you select run simultaneously. The tests run repeatedly un�l the last one reaches
the “LOOP COUNT”.
If you un-check “Mul�task”, the Aging Tests you select run one by one from the top to the bo�om in the list.
Then the cycle will repeat the number of �mes you set in the “LOOP COUNT”.
Regardless the “LOOP COUNT” you set, if an aging test encounters total 10 errors during the execu�on, the aging test will terminate.
4-2-1 HDD PHYSICAL Test
1) Test contents

This test treats PC’s each HDD/SSD/eMMC as a physical unit, and reads the sectors on the disk to check if the device works
correctly. The test never writes any data on the HDD/SSD/eMMC.
The Test checks up to the first 16 built-in ATA/SATA/SCSI/iSCSI/NVMe/MMC/SD bus type’s HDD/SSD/eMMC.
The test reads a data chunk at a �me, which consists of consecu�ve sectors the size of which equals to 64K bytes. Herea�er, the
data chunk is called “64KB-Sectors”.
Depending on the test mode (Detail or Simple), the test defines “Division number” as follows:
■ In case of Simple mode: Division number = 1000
■ In case of Detail mode: Division number = 5000
The test divides the HDD/SSD/eMMC virtually to “Division counts” of the fragments. Then, it reads 64KB-Sectors in each fragment
of HDD/SSD/eMMC from low LBA (Logical Block Address of HDD/SSD/eMMC) to high. If the test reads the 64KB-Sectors from all
of the fragments successfully, it will get 1 Pass.
This is the one cycle of the test. If you set the pass count more than one, the test runs more than one cycle.
The test reads 64KB-Sectors (it is part of one fragment) at same LBA for each cycle.
M = Division number
Fragment1 Fragment 2 Fragment 3 Fragment M-1 Fragment M
………
Physical Disk
Lowest LBA Highest LBA
: 64KB-Sect
2) Test screen
Drive
information Test address
Progress status
▼ Test address …The LBA (Logical Block Address) of HDD/SSD/eMMC being tested now
▼ Drive informa�on … The drive number currently being tested
▼ Progress status … The test progress by the progress bar
3) Test result
If the test runs successfully with all equipped HDD/SSD/eMMC, it will get a pass count. However, if an error occurs with one of
the HDD/SSD/eMMC, the test is regarded as an error and it will get an error count.
■ In case of PASS
The pass count is shown in the “PASS” field.
■ In case of FAIL
The pass and error count are shown in the “pass” and” error” fields respec�vely.
The detail of the error is recorded in the log file as follows.

Message Explana�on Remarks
Read Hdd Create File Failed in opening of HDD/SSD/eMMC driver. The HDD/SSD/eMMC driver may not
Error.Address=XX XX is LAB value. be normal or installed.
Read Hdd Set File Pointer Failed in the HDD/SSD/eMMC file It indicates that a read error occurred
Error.Address=XX pointer se�ng command. at the specified LBA.
XX is LAB value.
Read Hdd Command Failed in the HDD/SSD/eMMC read
Error. Address=XX command.
XX is LAB value.
Read Hdd Check Size The size read by the HDD/SSD/eMMC read
Error. Address=XX command does not equal to the specified
size.
XX is LAB value.
4-2-2 HDD LOGICAL Test
1) Test contents
This test checks if it can read the files on the first built-in HDD/SSD/eMMC successfully.
Note: The test is only checking those files that have a file size greater than 0 Bytes and less than 1 MBytes.
■ In case of Simple mode

The simple test mode performs a read test on the first 400 files.
■ In case of Detail mode
The detailed test mode performs read test on the first 2000 files.
The status is updated sequen�ally (the file name being verified is displayed in “File Name” dynamically) during the test, the test finished
un�litreadslastfile(400th fileforSimplemode,2000th fileforDetailmode)successfully.Thisistheonecycleofthetest.Ifyousetthepass
count more than one, the test runs more than one cycle.
2) Test screen
Name of file being verified
▼ File Name … The name of the file being verified with full path
3) Test result
■ In case of PASS
■ In case of FAIL
The pass and error count are shown in the “pass” and “error” fields respec�vely.

(The following example indicates the case where an error was found in file-A.)

[HDDL]
ERROR0000=(2008/09/10, 12:00:00)C:¥file-A
4-2-3 MEMORY Test
1) Test contents
This test allocates a test area in the free space in the system memory and performs Write,Read and Compare opera�ons in the area.
1-1) Allocate the test area

First, MEMORY Test allocates the test area in the free memory space in the system memory.
MEMORY Test tries to allocate 50% of the free space as the test area.
If it succeeds in alloca�ng the test area, the test will go to MEMORY Test: Address Test, High/Low Test, and Burst Transfer Test.
If the test fails the memory alloca�on, it will try again decreasing of 1M bytes from the previous size.
The process will be repeated un�l it succeeds in the alloca�on.
However, if the alloca�on size comes down to 256M bytes before success, the test will recognize that it cannot acquire enough
memory for the test and the MEMORY Test will end without proceeding to the tests.
2) Test screen
Memory information
Test item
Progress status
▼Memory informa�on … The test area’s memory size/ The total free memory size (at most 2GB)
▼Test item … The test item being executed: Address Test(1), High/Low Test(2), Burst Transfer Test(3).
▼Progress status … The test progress
3) Test result
If the test cannot allocate the test area or if a compare error occurs, the test will get an error count.
■ In case of PASS

■ In case of FAIL
The pass and error count will be shown in the “pass” and “error” fields respec�vely.
The detail of the error will be recorded to the WPETD log file as below.
Message Explana�on
Memory compareerror( MEMORY Test 1) An error occurred during MEMORY Test 1.

Memory compareerror(MEMORY Test 2) An error occurred during MEMORY Test 2
Memory compareerror(MEMORY Test 3) An error occurred during MEMORY Test 3
4-2-4 USB STORAGE Test
This test checks if the connec�on of the USB Ports on the PC works by using a USB Memory.You need to prepare a USB Memory.
The test writes some data to the USB memory. The USB memory needs at least 12 MB free space.
Note:
The current version of the test does not check if the connec�on level is whether USB3.0 or
USB2.0/1.0. We recommend you to use a USB2.0 Memory for this test.
1) Test contents
The test detects a USB Memory plugged to one of the USB ports on your PC. Then the test copies some data to the USB Memory,
read the data back from the memory and compare it to the original data. If the comparison is OK, the test will say that the port is
passed.
Important Note:
Do not take WPETD USB Memory out during USB STORAGE Test trying to check the port that WPETD
USB Memory plugged in. Recognize that the USB port works fine as long as WPETD has launched.
Again, when you launch WPETD from WPETD USB Memory, you must not take the USB Memory out
of the USB port. If you do so, the WPETD’s behavior will be unstable and it will not be guaranteed.
2) Test screen
Test item
Drive information
Progress status
▼ Drive informa�on … The drive le�er of the USB being tested

▼ Test item … The test item being executed: File Access test.
▼ Progress status … The test progress
3) Test result
■ In case of PASS
■ In case of FAIL
File Access Error. xx:. Failed in accessing the file.
XX is the USB drive le�er.

Space Size Error. xx: There is no free space for crea�ng the
file. XX is the USB drive le�er.
Note:
If you need to test USB storage on different USB port, before the test, please prepare some USB storage and then
insert them into all the USB ports you want to test, or insert it into different USB port and start over the test if you have
only one USB storage.
4) Test file
WinPETD.exe: Test program.
4-2-5 SD STORAGE Test
This test checks if the connec�on of the SD Port on the PC works by using a SD storage card. You need to prepare a SD storage card.
The test writes some data to the SD storage card. The SD storage card needs at least 12 MB free space.
1) Test contents
The test detects a SD storage card plugged to the SD port on your PC. Then the test copies some data to the SD storage card, read the
data back from the SD storage card and compare it to the original data. If the comparison is OK, the test will say that the port is passed.
Important Note:
Do not take SD storage card out during SD STORAGE Test trying to check the port that SD storage card plugged in.
2) Test screen
Test item
Drive information
Progress status
▼ Drive informa�on … The drive le�er of the SD storage card being tested
▼Test item … The test item being executed: File Access test.
▼ Progress status … The test progress
3) Test result
■ In case of PASS
■ In case of FAIL
File Access Error. xx:. Failed in accessing the file.
XX is the SD storage card drive letter.
Space Size Error. xx: There is no free space for crea�ng the file. XX is the SD storage card drive letter.
4) Test file

WinPETD.exe: Test program.
4-2-6 WIRED LAN Test
1) Test content
This test checks if the data is sent and received without �meout between the built-in LAN device and DHCP server. The 32-packet sized
data is sent from the PC and will confirm to get the response from the server.
The check is executed 5 �mes for 1 Pass.
Note:
It is necessary that the IP Address has to be assigned to the Wired LAN adapter by a DHCP server
for execu�ng the test.
If you use an a�ached Wired LAN adapter such as a USB LAN adapter, remove it from the PC as
WPETD cannot detect the built-in adapter correctly.
2) Test Screen
LAN Card information
Progress status
▼LAN Card informa�on …IP address.

▼Progress status … Test progress by the progress bar.
3) Test result
■ In case of PASS
■ In case of FAIL
The pass and error count are shown in the “PASS” and “ERROR” fields respec�vely.

An IP address has not been assigned. IP address cannot be obtained. This error occurs when the test is
conducted with a LAN card to which IP is
not assigned.
WSAStartup failed: xx In-use API error This is a message that is caused by an
xx is the error code. error of Windows Socket API used in the
failed to set recv �meout: xx In-use API error test.
xx is the error code.
failed to set send �meout: xx In-use API error
Invalid in-address: xx In-use API error xx
it the IP address
sendto failed: xx In-use API error
Wrote xx bytes Communica�on data size
unmatched xx is the recep�on size

recvfrom failed: xx In-use API error

�med out. Time out occurred.
4-2-7 CPU Test
1) Test contents
1-1) The test gets how many CPU cores exist on the PC.
1-2) The test executes ALU (Arithme�c Logic Unit) test and FPU (Floa�ng Point Unit) test five �mes on the
process. 1-3) The executes ALU test and FPU test five �mes on the each CPU core.
WPETD supports to test up to 8 cores.
If there is no problem with test 1-2 and 1-3, the test will get 1 Pass.
2) Test screen
The current test
Progress status
▼The current test … ALU or FPU

▼Progress status … Test progress by the progress bar.
3) Test result
■ In case of PASS
■ In case of FAIL
The pass and error count are shown in the “pass” and ”error” fields respec�vely.

Message Explana�on
The ALU test made an error. An error occurred during ALU test.
The FPU test made an error. An error occurred during FPU test.
4-2-8 GRAPHICAL DISPLAY Test
1) Test contents
This test will go through a series of solid color screen test followed by H pa�ern test and circles/line-grada�on/ASCII-characters
test and as follows:

Note: During the test you can press “ESC” or “STOP” key if you need to stop the test. For example, in case
the test somehow takes too long �me.
3) Test file
“GRAPHICAL DISPLAY Test” is integrated in WPETD (WinPETD.EXE) itself.
4) Test Screens 4-1) Red screen
(1) The screen will turn all red “RGB(255, 0, 0)” color.
(2) The white text “RGB(255:0:0) <Screen width> x <Screen height>” will be shown at the upper le� corner of the screen
(3) It will pause for 3 seconds
4-2) Green Screen

(1) The screen will turn all green “RGB(0, 255, 0)”color.

4-3) Blue Screen
(1) The screen will turn all blue “RGB(0, 0, 255)”color.

4-4) White Screen
Note:
Any border lines of the white screen are not displayed during the
test. This rectangle is just for the explana�on here.
(1) The screen will turn all white “RGB(255,255,255)”color.

(2) The black text “RGB(255:255:255) <Screen width> x <Screen height>” will be shown at the upper le� corner of the screen

4-5) Black Screen
(1) The screen will turn all black “RGB(0, 0, 0)”color.

(2) The white text “RGB(0:0:0) <Screen width> x <Screen height>” will be shown at the upper le� corner of the
screen
(3) It will pause for 3 seconds 4-6) Ver�cal Lines Screen

(2) 1 pixel wide white ver�cal lines will be drawn with every 2 pixels.
(3) It pause for 3 seconds
4-7) Horizontal Lines Screen


(2) 1 pixel wide white horizontal lines will be drawn with every 2 pixels.
4-8) Cyan and Black Screen

(2) Alternate cyan1and black, 1 x 1 pixel dots will be drawn in a check pa�ern.
WPETD uses 1 x 1 pixel / 24bit color bitmap for “a cyan point” and “a black point”
here. Even line (including line 0 (the most upper line) ) : Cyan, Black, Cyan, Black, ….
Odd line: Black, Cyan, Black, Cyan, …..
4-9) H pa�erns Screen


(2) An “H” bitmap ( ; 9 x 11 pixel / 4 bit color) will uniformly fill the screen.
4-10) Circles/Line-grada�on/ASCII-characters Screen
Before describing how to display each element on the screen, how the interval of the ver�cal lines and the horizontal lines derived
will be explained.

As you see this figure, the ver�cal lines and horizontal lines are drawn with equal intervals.
Addi�onally, the ver�cal and horizontal intervals are iden�cal. It means that every grid made by two pair of the adjacent ver�cal
and
horizontal lines is a square.
The interval’s value or the grid side’s length, which is referred as “Z” in this sec�on 4-10, is calculated as follows.
“Z” is calculated based on the Greatest Common Measure (GCM) of the Full screen’s width and height.
Suppose that X = Full screen’s width, Y = Full screen’s height and “z" is the GCM of X and Y.
Hence,
z = GCM(X, Y); // z is calculated by Euclidean algorithm for GCM.
Usually, as “z” is a large integer value, it will be adjusted by the following logic to get a factor of “z” that is approximately equal to
X/40. The factor will be defined as “Z”.
z = GCM(X, Y); // X = Full screen’s width, Y = Full screen’s height. for (d = 2; d<= z; d++)
{
if (z % d == 0)
{ // “z” is dividable by “d” z = z / d;
if (X<= 1000) {if (z <= 25)break;}
else if (X<= 2000) {if (z <= 50)break; }
else if (X<= 3000) {if (z <= 75)break; }
else if (X<= 4000) {if (z <= 100)break;}
else if (X<= 5000) {if (z <= 125)break;}
else if (X<= 6000) {if (z <= 150)break; } else if (X<= 7000) {if (z <= 175)break;} else {if (z <= 200)break;}
d = 1; // to find the next factor of “z }

}
Z = z; // “Z” will be the interval for both of the ver�cal and horizontal lines
// In case that z=GCM(X, Y) is a prime number, Z = GCM(X, Y), too.
# Note for this logic

The logic to define “Z” above does not seem to be very good because “z” is always divided by the smallest factor.
Although the logic can be acceptable for a while as long as there is no problem with the target PCs for this �me, it is be�er to
modify the logic some�me in future as follows for example:
First, factorize “z” into prime factors:

z= S1^t1*S2^t2*….*Sn^tn where S1,S2,…,Snare prime numbers with S1<S2<….<Sn and 0 < t1, t2, … tn
Next, based on the factoriza�on, calculate all factors of “z” and choose the one that is the nearest to X/40.
The one will be defined as “Z”.
Addi�onally as commented in the logic above, it might be be�er to consider the case that z=GCM(X, Y) is a prime number.
Another Important Note: If a new PC is added as a target, check its screen resolu�on out.
Usually, the value “Z” derived from z = GCM(X, Y) is large enough. However,
if “z” itself is too small, we have no choice but to use “z” as “Z”.
For example, when the screen resolu�on is 1366 x 768, GCM (1366, 786) =2 that is too small.
If you draw the ver�cal and horizontal lines with the very small interval, no other graphics components can be
seen.
A�er checking the target PC’s screen resolu�ons, it was found that this happens only when the screen
resolu�on is 1366 x 768.
Therefore, the work around, in case of the resolu�on 1366x768, WPETD treats it as 1280x768 where GCM
# Drawing procedure
(1) Fill the full screen with black “RGB (0, 0, 0)”color.
(2) Draw texts as follows:
Draw 48 1byte-chracters a line as follows:
Font = Courier, standard (non-bold, non-italic), Fixed pitch, Width = 9, Height =

16, Character color = White RGB (255, 255, 255), Background color = Black RGB (0, 0,
0)
- 1st line: Posi�on (X/2-9*24, 4*Z), 48 characters

0x20 (Space), 0x21(‘!’), … up to 0x4F (‘O’)
- 2nd line: Posi�on (X/2-9*24, 4*Z + 15), 48 characters

0x4F (‘O’), 0x50 (‘P’), … up to 0x7E (‘~’);
- 3rd line: Posi�on (X/2-9*24, 4*Z + 30), 48 characters

0x7F, 0x7E (‘~’), … down to 0x50 (‘P’)
- 4th line: Posi�on (X/2-9*24, 4*Z + 45), 48 characters

0x50 (‘P’), 0x4F (‘O’), … down to 0x21(‘!’)

0x20 (Space), 0x21(‘!’), … up to 0x4F (‘O’)

0x4F (‘O’), 0x50 (‘P’), … up to 0x7E (‘~’)
(3) Ver�cal lines are drawn then Horizontal lines.

As described above, the intervals of ver�cal lines and horizontal lines are iden�cal
“Z”.All grids made by adjacent ver�cal lines and horizontal lines are congruent
squares.
(4) Grada�onal colored circles are drawn at each corner as the following order:
Blue circle at the upper le� corner
Green circle at the upper right corner
Red circle at the lower right corner
White circle at the lower le� corner
For the blue circle, it is drawn gradually smaller and less brightly as follows:
across = diagram of the circle = 5*Z;
(x1, y1) = (0, 0); , (x2, y2) = (across, across);
blue = 255; ….. (A)
for ( I = across/2; I > 1; I--)
{
Pen_Color = RGB (0, 0, blue--); ….(B)
Brush_Color = RGB (0, 0, blue--); ….(C) Ellipse(x1++, y1++, x2--, y2--);
}
(0, 0)
(across, across)
For other color circled circles, the followings are for “(A)”, “(B)” and “(C)” besides the
posi�ons: Green : green = 255; , Pen_Color = RGB(0, green--, 0); , Brush_Color = RGB(0,
green--, 0);
Red : red = 255; , Pen_Color = RGB(red--, 0, 0); , Brush_Color = RGB(red--, 0, 0);
White: red = green = blue = 255; ,
Pen_Color = RGB(red--, green--, blue--); , Brush_Color = RGB(red--, green--, blue--);

(5) White grada�onal rectangles are drown

4-level grada�onal rectangle is drawn first followed by 8-level, 16-level and 32-level rectangles.
(5*Z, 8*Z) (13*Z, 8*Z) (21*Z, 8*Z) (29*Z, 8*Z)
(5*Z, 14*Z) (13*Z, 14*Z) (21*Z, 14*Z) (29*Z,14*Z)
4-level grada�onal rectangle: 8-level grada�onal rectangle: 16-level gradational rectangle: 32-level gradational rectangle:
- Position: (5*Z, 8*Z) - Position: (13*Z, 8*Z) - Position: (21*Z, 8*Z) - Position: (29*Z, 8*Z)
- Width: 8*Z, Height: 6*Z - Co-rectangle width:
- Width:
2*Z
8Z,- Gradation:
Height: 6*Z4 levels - Width: 8*Z, Height: 6*Z - Width: 8*Z, Height: 6*Z
red=green=blue= 255-64*L - Co-rectangle width: Z - Co-rectangle width: Z/2 - Co-rectangle width: Z/4
where L = 0,1,2,3 - Gradation: 8 levels - Gradation: 16 levels - Gradation: 32 levels
0: RGB(255,255,255) red=green=blue= 255-32*L red=green=blue= 255-16*L red=green=blue= 255-8*L
where
1: RGB(191,191,191) 2: RGB(127,127,127) L = 0,1,2,…,
3: RGB(63, 7
63, 63) where L = 0,1,2,…, 15 where L = 0,1,2,…, 31
0: RGB(255,255,255) 0: RGB(255,255,255) 0: RGB(255,255,255)
1: RGB(223, 223, 223) 1: RGB(239, 239, 239) 1: RGB(247, 247, 247)
2: RGB(191, 191, 191) 2: RGB(223, 223, 223) 2: RGB(239, 239, 239)
3: RGB(159, 159, 159) 3: RGB(207, 207, 207) 3: RGB(231, 231, 231)
4: RGB(127, 127, 127) 4: RGB(191, 191, 191) 4: RGB(223, 223, 223)
5: RGB(95, 95, 95) : :
6: RGB(63, 63, 63) : -16, -16, -16 : -8, -8, -8
7: RGB(31, 31, 31) : :
14: RGB(31, 31, 31) 30: RGB(15, 15, 15)
15: RGB(15, 15, 15) 31: RGB(7, 7, 7)
4-2-9 Timer Test

1) Test contents
Adjust internal �me to verify �mer accuracy a�er a year.
In the simple test mode, the test is carried out at intervals of 5 seconds before and a�er 10 seconds in advanced test
mode. It verifies that there is no devia�on between the es�mated �me of calcula�on and the actual acquisi�on �me.
2) Test screen
Start time

End time
3) Test result
Testing item Error count
Detail of Test
Pass count
5 Appendix
5-1 Log file samples
Log files includes text log and html log, and they will be saved under “¥Logs” folder of WPETD tool’s USB storage
root. And the log file names will be format as:
<OK or NG>.<SN>.<date �me>petd.<html/log>
5-1-1 Text log file sample

[SystemInformation]Manufacturer=DynabookInc.
ProductName=SATELLITEPROC40-J
PartNumber=PYS48L-AAAA1SerialNumber=71076855H
UUID=03000200-0400-0500-0006-000700080009
BIOSVersion=TN16SV1.00BIOSOEMString=PYS48L-AAAA1,TIH05829ZVA#BBIOSGSWString=GSW:1000000000
DPKInjected=No
CPUName0=11thGenIntel(R)Core(TM)i3-1115G4@3.00GHz
CPUClock0=CurrentClock=2995MHzMaxClock=2995MHzCPUSocket0=U3E1
CPUDescription0=Intel64Family6Model140Stepping2L2Cache0=2560KB
PhysicalMemory=8192MB
MemoryDevice0=Locator=Controller1-ChannelA-DIMM0Size=8192MB

Network0=RealtekPCIe2.5GbEFamilyControllerMACAddress0=84:47:09:03:8D:26
USBFlashDisk0=SanDiskCruzerGlide3.0USBDeviceCapacity=31.20 GByte
SCSIHDD/SSD0=C-E80T256G4-P3D3B3E13Capacity=256.05 GByte
SDCardDisk0=SDXCCardCapacity=63.86 GByte
KeyBoard0=StandardPS/2Keyboard
Mouse0=HID-compliantmouse
C:¥=DriveType=HDD/SSDVolumeName=TIH0585300AFreeSize=180.38GBUseSize=57.79GB
D:¥=DriveType=USBFlashVolumeName=WINPEFreeSize=30.60GBUseSize=589.58MB
E:¥=DriveType=SDCardVolumeName=SDXC64FreeSize=63.75GBUseSize=96.12MB
X:¥=DriveType=OTHERVolumeName=BootFreeSize=500.02MBUseSize=2.55MB
[STATISTIC]
T&DVersion=1.00(forYangPass40)
StartTime=2021/09/2715:50:12
FinishTime=2021/09/2807:09:18
DiagnosticsTime=15:18:18
test mode=Multitask
limitpass=100
CPUstress=No
SetBatteryOffAtTheEnd=Yes
TestResult=Good
[HDDPHYSICAL]
passcount=4664
error count=0
testmode=Simple
[HDDLOGICAL]
passcount=11918
error count=0
testmode=Detail
[USBSTORAGE]
passcount=9
error count=0
testmode=Detail
[CPU]
passcount=9
error count=0
testmode=Detail
[GRAPHICALDISPLAY]
passcount=1
error count=0
testmode=Detail
[TIMER]
passcount=5
error count=0
testmode=Detail
[KEYBOARD]
passcount=1
error count=0
testmode=Detail
[TOUCHPAD]
passcount=1

error count=0
testmode=Detail
[BATTERYCAPACITY]
passcount=1
error count=0
testmode=Detail
[BATTERYOFF]
passcount=1
error count=0
testmode=Detail
Note: About Start Time, Finish Time and Diagnos�cs Time, please see below.
: [STATISTIC]
:
Start Time=2019/03/24 23:45:07
Finish Time=2019/03/24 23:46:55 Diagnos�cs Time=00:01:44
::
As you see in the example above, “Finish Time - Start Time” does not equal to “Diagnos�cs Time” usually.
Start Time: The �me when you push the [START] button.
Finish Time: The �me when all tests you selected finish
Diagnos�c Time: The �me shown at the top-right on the Diagnos�cs dialog.
Diagnos�c �me starts when the first test starts and ends when all selected tests finish. There is
some �me interval between being pushed the [START] bu�on and the first test starts. That is
why the value "End Time - Start Time" is usually bigger than "Diagnos�c Time".

5-1-2 Html log file sample


5-2 Keybaord layouts

5-2-1 YangPass_14_UK
5-2-2 YangPass_14_US

5-2-3 YangPass_15_UK
5-2-4 YangPass_15_US

5-2-5 YangPass_15_JP

6 Maintenance Functions
6-1 BIOS Ver. & DMI Info Display
6-1-1 Function Description
BIOS version & DMI info of the PC are displayed on the ini�al (WinPE booted up) screen like below, above the maintenance menu:
This PC’s info:

Name Information
------------------------- --------------------------------------------------
BIOS version “1.00”
System manufacture “Dynabook Inc.”
System product “SATELLITE PRO C40-J”
System version “PYS48L-AAAA1”
System Serial number “71076857H”
System UUID “00020003000400050006000700080009h”
System SKU number “PYS48L”
OEM String “PYS48L-AAAA1,TIH05829ZVA#B”
GSW String “GSW:1000000000”
System date & time 2021/05/10 03:37
********************************************************************************
* 1 – DMI Update *
* ---------------------------------------------------------------------------- *
* 40 – Reboot & Enter BIOS Setup *
6-1-2 Display Items

Name Informa�on
BIOS version BIOS version in Type 0
System manufacture System manufacture in Type 1
System product System product in Type 1
System version System version in Type 1
System Serial number System Serial number in Type 1
System UUID System UUID in Type 1
System SKU number System SKU number in Type 1
OEM string OEM string in Type 11
GSW string GSW string in Type 12
System date & �me The PC’s date �me

6-1-3 Maintenance Tips for DMI Info

When DMI info is not wri�en (in case of “Default string” or “To Be Filled”), the corresponding por�on will be displayed in red like
below:
This PC’s info:
Name Information
------------------------- --------------------------------------------------
System product “Default String”
System version “Default String”
System Serial number “Default String”
System UUID “00020003000400050006000700080009h”
System SKU number “Default String”
OEM String “Default String”
6-2 DMI Update

6-2-1 Function Description
When motherboard is replaced for maintenance parts, DMI info needs to be updated/restored. Please use this menu to update DMI
info.
Note:
6. This func�on will try to write Manufacture Name as “Dynabook Inc.” first directly in case of it is not (for
the first �me). And if current UUID is invalid (all 0 or 1), it will generate a System UUID automa�cally
and write it to the PC.
6-2-2 Update Procedure

1) Startup the YangPass40 Maintenance Tool, on the ini�al screen, input [1] and press the [Enter] key.
(The DMI update program will be executed.)
2) The program can update Product Name/Version Number/Serial Number/SKU Number/OEM String/GSW String as shown like
below.

dynabook DMI Information data maintenance program Ver. 1.0.1.0
Manufacturer Name : Dynabook Inc.

Product Name : SATELLITE PRO C40-J
Version Number : PYS48L-AAAA1
Serial Number : 71076857H
SKU Number : PYS48L
OEM String : PYS48L-AAAA1,TIH05829ZVA#B
GSW String : GSW:1000000000
----------------------------------------------------------------------
New Product Name : _

New Version Number :
New Serial Number :

3) Enter the new DMI data that you wish to update, it will show like below when updated successfully.

SKU Number : PYS48L
----------------------------------------------------------------------
5/11/2021 12:22:49 AM DMI Data SATELLITE PRO C40-J written successfully
New Product Name : SATELLITE PRO C40-J
New Version Number : _
New Serial Number :
4) And you can skip upda�ng current DMI data by pressing [Enter] directly like below:

SKU Number : PYS48L
---------------------------------------------------------------------
- 5/11/2021 12:24:33 AM Skip updating DMI Data
New Serial Number : _

5) If you enter a DMI data that does not match the pa�ern (regular expression), it will show prompt like below.

SKU Number : PYS48L
---------------------------------------------------------------------
- 5/11/2021 12:25:12 AM Not pattern ^[A-Z0-9]{9}$
New Serial Number : XX
6) The pa�erns (regular expressions) for the DMI data can be configured in below file (\bin\update_dmi_info.exe.config).

6-3 Others
6-3-1 Reboot into BIOS
On the ini�al screen, input [40] and press the [Enter] key to reboot & enter BIOS Setup.
(You can use this menu handily to reboot into BIOS & to do some confirma�on or BIOS se�ngs if you want.)
6-3-2 Shutdown
On the ini�al screen, input [50] and press the [Enter] key to shut down the system.

7 Appendix
7-1 How to create a bootable YangPass40 Maintenance Tool
7-1-1 Create Procedure
1) Prepare a USB flash media and insert it to a PC that running Windows 10/11.
2) Search cmd.exe (Command Prompt), right-click on it and select [Run as administrator].
3) Enter diskpart, and then enter below commands:
Note: Please make sure you format the correct drive (select a correct disk number of the USB media in
below step 2), because all the data of that drive will be lost!
1. List disk // Check the disk number for the USB media inserted.
2. Select disk 2 // Select the USB media (number 2 in this case as an
example).
3. Clean // Clean the par��on table of USB media
4. Convert gpt // Convert the disk to GPT format.
5. Create par��on primary // Create a primary par��on.
6. Format fs=fat32 label=BIOS_DMI_UP quick // Format it to a FAT32 file system par��on
7. Exit // Exit the diskpart program.
C:¥Windows¥system32>diskpart
Microsoft DiskPart version 10.0.17763.1
Copyright (C) Microsoft Corporation. On computer: SCD-LIZC-P01
DISKPART> list disk
Disk ### Status Size Free Dyn Gpt

-------- ------------- ------- ------- --- --
- Make sure here select the correct USB disk
Disk 0 Online 931number
GB (Below
0 B “clean”
* command will erase the
Disk 1 Online disk)
476 GB 5120 KB *
Disk 2 Online 7415 MB 7413 MB *
DISKPART> sel disk 2
Disk 2 is now the selected disk.
DISKPART> clean
DiskPart succeeded in cleaning the disk.
DISKPART> convert gpt
DiskPart successfully converted the selected disk to GPT format.
DISKPART> create partition primary
DiskPart succeeded in creating the specified partition.

4) Mount the YangPass40**_Maintenance_Tool_V*.**.iso image to a virtual drive.

(On windows 10/11, you can right-click it and select “Mount” menu. Here V*.** is the tool version.)
5) Copy all the image files from the mounted virtual drive to the USB flash media.
(You can press Ctrl +A to select all, right-click it and “Send to” the USB flash media.)
6) Right-click the drive of USB flash media, select “Eject” menu to get a bootable USB flash media of this tool.

7-2 How to startup the YangPass40 Maintenance Tool
7-2-1 Startup Procedure
1) Create a bootable USB flash media of the WinPE Maintenance Tool according to the Create Procedure in Appendix 3.1.
2) Insert the created USB flash media to the target PC that needs maintenance and then turn on the power.
3) A�er turning on the power, immediately press the [F12] key several �mes to show the boot device selec�on screen.
4) Select "UEFI: <USB flash media name>" and press the [Enter] key.
(Below “UEFI: ADATA USB Flash Drive 0.00, Par��on 1” is the created USB flash media as an example.)
5) The YangPass40 Maintenance Tool starts up.

6) A�er WinPE booted up, the ini�al screen (main menu) is shown like below:
This PC’s info:

Name Information
------------------------- --------------------------------------------------
System product “SATELLITE PRO C40-J”
System version “PYS48L-AAAA1”
System Serial number “71076857H”
System UUID “00020003000400050006000700080009h”
System SKU number “PYS48L”
OEM String “PYS48L-AAAA1,TIH05829ZVA#B”
GSW String “GSW:1000000000”
System date & time 2021/05/10 03:37
********************************************************************************
* ---------------------------------------------------------------------------- *
* 40 – Reboot & Enter BIOS Setup *

8 BIOS update
8-1 Windows mode update
1).Copybiosupdatepackagetodesktop,rightclickandrunasadministrator
2).Plug in AC adapter,and make sure battery capacity more than 15 percentage；
And press any key to continue;

3).The system will be reboot automatically，and the BIOS upgrade screen is displayed.
4). After flash finished,press “F2” hot key,check the BIOS version.
8-2 Shell mode update (USB flash)
1). Unzip EFIpackage&BIOSpackagetotherootpathoftheFAT32formatU-disk；
2)．InsertU-disk,PoweronandPressF2toenterBIOSsetup;

3).Check“SecureBoot”item,if securebootis enable,setit todisable;
4). PressF10tosavechange.
5).PressF12toenterBootMenuandselectu-disktoboot,systemwil boottoshell;EnterthedriveletterwheretheECresides.
6).EntertheUSBdrivepath;e.g. fs2istheUSBdrivepath,thentypefs2:andpressEnterkey

7). TypeFlash_BIOS.NSHandpressEnter
8). Press any key to continue
9).The system will be reboot automatically，and the BIOS upgrade screen is displayed.

10).After flash finished,press “F2” hot key,check the BIOS version.

Chapter 4
Replacement Procedures
4 概述
4 Replacement Procedures
Chapter 4 Contents
4.1 General ........................................................................................................................ 4-1

Before You Begin................................................................................................... 4-4
Disassembly Procedures .......................................................................................... 4-5
Assembly Procedures ............................................................................................ 4-5
Tools and Equipment .............................................................................................. 4-6
Screw Tightening Torque........................................................................................ 4-6
4.2 Base Enclosure............................................................................................................ 4-7
Removing Base Enclosure ....................................................................................... 4-7
Installing Base Enclosure ....................................................................................... 4-8
4.3 Battery Pack ................................................................................................................ 4-9
Removing Battery Pack.......................................................................................... 4-9
Installing Battery Pack ......................................................................................... 4-10
4.4 SSD ............................................................................................................................ 4-11
Remove SSD ........................................................................................................ 4-11
Installing SSD........................................................................................................ 4-12
4.5 SODIMM ................................................................................................................. 4-13
Removing SODIMM ............................................................................................ 4-13
Installing SODIMM ............................................................................................ 4-14
4.6 LCD Module Assembly ............................................................................................. 4-15
Remove LCD Module Assembly ......................................................................... 4-15
Installing LCD Module Assembly ....................................................................... 4-17
4.7 CPU Cooling Module and Fan.................................................................................. 4-18
Removing CPU Cooling Module and Fan ............................................................ 4-18
Installing CPU Cooling Module and Fan ............................................................ 4-19
4.8 System Board ........................................................................................................... 4-20
Remove System Board .......................................................................................... 4-20
Installing System Board ....................................................................................... 4-21
4.9 IO board .................................................................................................................... 4-22
Removing IO board .............................................................................................. 4-22
Installing IO board ................................................................................................. 4-23
4-i Maintenance Manual SATELLITE PRO C40-J/C50-J

4.10 Speaker ..................................................................................................................... 4-24

Removing Speaker .............................................................................................. 4-24
Installing Speaker ................................................................................................. 4-25
4.11 LCD Module Mask .................................................................................................... 4-26
Removing LCD Module Mask ............................................................................. 4-27
Installing LCD Module Mask.............................................................................. 4-28
4.12 LCD Panel.................................................................................................................. 4-29
Removing LCD Panel .......................................................................................... 4-29
Installing LCD Panel ............................................................................................ 4-31
4.13 CCD Module .............................................................................................................. 4-32
Removing CCD Module ....................................................................................... 4-32
Installing CCD Module ....................................................................................... 4-33
4.14 Touch pad Module..................................................................................................4-34
Removing Touch pad.......................................................................................4-34
Installing Touch pad.......................................................................................4-35
SATELLITE PRO C40-J/C50-J Maintenance Manual 4-ii

Figures
Figure 4.2 Removing Base Enclosure ...................................................................................... 4-7
Figure 4.3 Removing Battery Pack ........................................................................................ 4-9
Figure 4.4 Removing SSD ................................................................................................... 4-13
Figure 4.5 Removing SODIMM ........................................................................................... 4-14
Figure 4.6 Removing LCD Module Assembly ..................................................................... 4-17
Figure 4.7 Removing the CPU Cooling Module and Fan ..................................................... 4-19
Figure 4.7 Applying silicon grease (CPU)............................................................................. 4-20
Figure 4.8 Removing System Board ...................................................................................... 4-21
Figure 4.9 Removing IO Board ............................................................................................ 4-23
Figure 4.10 Removing Speaker .............................................................................................. 4-25
Figure 4.11 Removing the LCD Module Mask .................................................................... 4-27
Figure 4.12 Removing LCD Panel follow direction . ........................................................... 4-29
Figure 4.12 Removing the LCD cable .................................................................................. 4-32
Figure 4.12 LCD cable below the LCD module cover latch ................................................. 4-32
Figure 4.13 Removing the CCD Module .............................................................................. 4-33
Figure 4.14 Removing the Touch pad Module......................................................................4-35
4-iii Maintenance Manual SATELLITE PRO C40-J/C50-J

4.1 General
This chapter explains how to disassemble the computer and replace Field Replaceable
Units (FRUs). Some replacement procedures may not require you to remove all the
surrounding FRUs to replace only one FRU. The chart below shows the FRUs in the order in
which they should be removed in a top-down manner, irrespective of their physical locations.
The FRUs shown in the top area of the chart should normally be removed before removing
the FRUs shown in the bottom area. To replace the FRUs, first identify the suspect FRU for
the system failure. Next, according to this chart, determine the FRUs that need to be
removed before removing the suspect FRU. After you determine those FRUs, go to the
appropriate sections according to the section numbers shown in the boxes. Then start removal
and replacement.
How to use the chart (two examples):

� For removing the System Board:
First, remove Base Enclosure, Battery Pack and display assembly. Then, remove SSD, and
all cable, all of which are shown above the System Board.
� For removing the LCD Module:

First, remove the display mask, both of which are shown above the LCD module.

Safety Precautions
Before you begin to disassembly read the following safety precautions carefully. Be sure
to follow them while you are working.
DANGER:
1. Always use the genuine batteries or replacement batteries authorized by
Dynabook. Batteries other than those differ in specifications and are
incompatible with the computer. They may burst or explode. To avoid leakage of
alkaline solutions, never heat or disassemble the battery packs. Never throw the
battery packs into a fire. If this is violated, they will explode.
2. The components such as the power supply and FL inverter carry high voltages.
When you partially disassemble the computer and turn on the components, use
extreme care not to touch the connectors and components to avoid the risk of
electrical shock. Do not disassemble individual components during first-level
maintenance.
WARNING:
1. To avoid the risk of electrical shock, turn the computer off and remove the AC
adapter from the electrical outlet.
2. Because the battery in the computer is left charged, the risk of electrical shock
remains even after the AC adapter is removed from the electrical outlet. To avoid
the risk of electrical shock, be sure to remove any metal jewelry or accessories
such as necklaces, bracelets, and rings before starting work. Never work with
damp or wet hands.
3. To avoid personal injury, use care to avoid the sharp edges or corners of the
components.

CAUTION:
1. Before replacing a component, make sure that the replacement component
meets the required specifications. To avoid computer failures, never use
components that do not meet the specifications.
2. To avoid internal damage such as short circuits and fire, never drop metal
objects such as screws, pins, paper clips, etc. into the components. When a
screw is removed, be sure to replace a screw that is the same size as the original
screw. Make sure that all the screws are fastened securely. Loose screws can
cause short circuits, overheating, smoke, or fire.
3. Before raising a FRU or other component, make sure that all the component
cables have been disconnected to avoid the risk of electrical shock caused by
accidental contact with the energized components.
4. For AC input, be sure to use the AC adapter and AC power cable that come
with your computer or Dynabook-recommended equivalents.
5. To avoid the risk of electrical shock, make sure that all the replacement
components meet the specifications of the computer and that all the cables and
connectors are fastened securely.
6. Inside the PC are components that become hot during operation (such as the
CPU and cooling module). To avoid burns, let the hot components cool down
before starting inspection or repair task.

Before You BeginBefore
Before you begin to disassembly the computer, keep in mind the precautions and advice in
this section. Always begin disassembly by removing the AC adapter and battery pack.
Remove the optional parts and accessories as well. The procedures for removing the batteries
will be explained later.
Disassemble the computer only when an abnormality has occurred.
Use only the recommended tools.
To run and store the computer, be sure to prepare a working environment that is free from:
� Dust and contaminants

� Static electricity
� Extremely high or low temperatures and extremely high humidity
Run the diagnostic tests explained in Chapter 3 of this manual to identify the FRU that
has probably caused the system failure.
Perform only the required machine operations. Use only the disassembly and
reinstallation procedures described in this manual.
Place the removed components in a safe place away from the computer so that they are not
damaged or get in the way of you doing your work.
Normally, a number of screws need to be removed or replaced during disassembling.

Place the removed screws in a safe place so that you can easily find the right screws for the
right components.
When assembling the computer, use the specified screws to fasten the parts to the
specified locations. See the appropriate explanations and figures for screw sizes.
To avoid personal injury, use care to handle components that have sharp edges or corners.
After you have replaced a FRU, check that the FRU works correctly to ensure normal
computer operation.

Disassembly Procedures
The cable connectors come in these two basic types:
� Pressure plate connectors

� Normal pin connectors
To remove a pressure plate connector, pull up the tabs on either side of the connector's
plastic pressure plate and gently pull the cable out of the connector. To reconnect the cable to
the pressure plate's connector, raise the pressure plate up to a satisfactory height and slide the
cable into the connector. Secure the cable in the correct position by pressing down the sides of
the pressure plate so that the plate is flush with the sides of the connector. Grasp and pull the
cable gently to check that the cable is connected firmly. If the cable comes off the connector,
reinsert the cable by raising the pressure plate up to a satisfactory height.
Normal pin connectors are used for all the other types of cables. These connectors can be
installed or removed by simply inserting them or pulling them out.
Assembly Procedures
You have to reassemble the computer after you have disassembled the computer and fixed the
component that caused the problem.
When reassembling the computer, keep the following general guidelines in mind:
� Take your time to carry out the suggested instructions completely. Hurried reassembly
can often cause problems.
� Check that all the cable and connectors are fastened securely.
� Before securing the FRUs or other parts, check that the cables are not caught by the
screws or FRUs.
� Check that all the latches are closed securely.
� Check that all the required screws are used to secure the FRUs. Using wrong screws
can damage the threads or heads of the screws or does not ensure that the FRUs are
secure.
After installing a FRU, make sure that the FRU and computer work normally.

Tools and Equipment
For your safety and that of other people in the working environment, it is strongly
recommended that you use electrostatic discharge (ESD) equipment. The proper use of this
equipment will ensure successful repair work and reduce the costs for repairing damaged
components. The equipment and tools required for disassembly and reassembly are:
� One 2 mm Phillips screwdriver

� Tweezers (for pulling out screws)
� ESD mats (for the floor and work desks)
� An ESD wrist strap or heel grounder
� Anti-static carpets or flooring
� Air ionizers (for highly electrostatic sensitive areas)
� A plastic card (in credit card size)
Screw Tightening Torque
To secure screws, follow the torque values listed below. Over tightening can damage
components and screws. Under tightening can loosen the screw or cause screws to come off,
which may result in short circuits or other damage.
� M2.0*L3.0*D7.5*T0.5 0.36 N･m (2.0 kgf･cm)

� M2.0*L3.0*D4.5*T0.5 0.22 N･m (1.5 kgf･cm)
� M2.0*L2.5*D5.0*T0.5 0.22 N･m (1.5 kgf･cm)
� M2.0*L3.5*D4.5*T0.5 0.36 N･m (2.0 kgf･cm)
� M2.0*L5.5*D4.5*T0.5 0.36 N･m (2.0 kgf･cm)
� M2.0*L7.5*D4.5*T0.5 0.36 N･m (2.0 kgf･cm)

Base Enclosure
4.2 Base Enclosure
Removing Base Enclosure
Remove Base Enclosure according to the following procedures and Figure 4-7.
1. Remove seven M2.0x7.5x4.5black Phillips head screws securing Base Enclosure

and four M2.0x.3.5x4.5black Phillips head screws securing Base Enclosure .
2. Remove Base Enclosure..
Figure 4-7 Removing Base Enclosure

4.2 Base Enclosure 4 Replacement Procedures
Installing Base Enclosure
Install Base Enclosure according to the following procedures and Figure 4-7.
1. Place Base Enclosure in correct position.
2. Secure Base Enclosure with seven M2.0x7.5x4.5black Phillips head screws

and M2.0x3.5x4.5black Phillips head screws .

4.3 Battery Pack 4 Replacement Procedures
4.3 Battery Pack
Removing Battery Pack
Remove battery pack according to the following procedures and Figure 4-9.
CAUTION: When handling the battery packs, use care not to short circuit the
terminals. Do not drop, hit, twist, or bend the battery packs. Do not scratch or break
up their casing.
1. Remove Battery Maly.
2. Disconnect Battery cable from CN3 on system board.
3. Remove four M2.0x3.5x4.5 black Phillips head screws securing Battery.
4. Remove Battery.

4.3 Battery Pack 4 Replacement Procedures
Figure 4-9Removing battery pack
NOTE: Dispose of the used battery packs as required by local ordinances

or regulations.
Installing Battery Pack
Install battery pack according to the following procedures and Figure 4-9.
CAUTION: The battery packs contain a lithium ion battery, which can explode due to
improper replacement, use, handling, or disposal.Always dispose of the battery packs as
required by local ordinances or regulations. Use only replacement batteries
recommendedbyDynabook.
NOTE: Visually check the battery's terminals. If they are dirty, clean them with a dry
cloth.
1. Take a new or recharged Battery Pack.
2. Place Battery Pack in correct position.
3. Secure Battery with four M2.0x3.5x4.5 black Phillips head screws.
4. Check the battery screw hole ,if there is cracking,please replace the parts.
5. Connect Battery cable to CN3 on system board.
6. Installing Battery Maly.

4.4 SSD 4 Replacement Procedures
4.4 SSD
Removing SSD
Remove SSD according to the following procedures and Figures 4-13.
CAUTION: Do not touch the connectors on SSD and in the computer with your bare
hands. SSD can fail if they are contaminated with sweat, natural oils, etc. from your
hands.
1. Remove thermally conductive pad
2. Remove one M2_L0.3xL2.2×OD5.5×T0.6 black Phillips head screw securing

the SSD.
3. Pull SSD from CN8 on system board.
Figure 4-13Removing SSD

4.4 SSD 4 Replacement Procedures
Installing SSD
Install SSD according to the following procedures and Figures 4-13.
1.Insert SSD into CN8 on system board.
2.Secure it with one M2_L0.3xL2.2×OD5.5× T0.6 black Phillips head screw.
3.Install thermal silica gel
CAUTION: Do not touch the connectors on SSD and in the computer with your bare
hands. SSD can fail if they are contaminated with sweat, natural oils, etc. from your hand

4.5 SODIMM 4 Replacement Procedures
4.5 SODIMM
Removing SODIMM
Remove SODIMM according to the following procedures and Figures 4-14.
CAUTION: Do not touch the connectors on SODIMM and in the computer with your
bare hands. SODIMM can fail if they are contaminated with sweat, natural oils, etc. from
your hands.
1.Press both sides of the J1 connector shrapnel 15° with both index fingers
2.Take out the SODIMM at 45° horizontal
Figure 4-14 Removing SODIMM

4.5 SODIMM 4 Replacement Procedures
Installing SODIMM
Install SODIMM according to the following procedures and Figures 4-14.
1.Aim the SODIMM at the JI slot
2.Lightly press the SODIMM upper and lower sides with two fingers
CAUTION: Do not touch the connectors on SODIMM and in the computer with your bare
hands. SODIMM can fail if they are contaminated with sweat, natural oils, etc. from your
hands

4 Replacement Procedures 4.6 LCD Module Assembly
4.6 LCD Module Assembly
NOTE: Touch SKU will provide the FRU parts as LCD Module Assembly.
Removing LCD Module Assembly
Remove LCD Module Assembly according to the following procedures and Figure 4-17.
1. Remove tape for fasten LCD cable.
2. Remove PC gasket from WIFI module Remove plastic chips on wifi module.
3. Disconnect LCD cable from CN6 on system board.
4. Released wireless antenna cables from top cover latch.
5. Open LCD Module Assembly at an angle of 90 degrees.
6. Remove six M2.0x5.5x4.5 black Phillips head screws securing LCD Module
Assembly with top cover.
7. Remove LCD Module Assembly.
Figure 4-17 Removing the LCD Module assembly

4.6 LCD Module Assembly 4 Replacement Procedures
Figure 4-18 Removing the LCD Module assembly

4 Replacement Procedures 4.6 LCD Module Assembly
Installing the LCD Module Assembly
Install the LCD Module Assembly according to the following procedures and Figure 4-
17and 4-18.
1. Place the LCD Module Assembly in the correct position.
2. Secure LCD Module Assembly with four M2.0x5.5x4.5 black Phillips head screws.
(▲ mark portions)
3. Close LCD Module Assembly.
4. Note the module definition :grey wire connects MAIN interface and black wire
connects AUX
5. Routing antenna cables under Rib on Top cover to secure antenna cables according
to Figure 4-18.
6. Put the PC gasket back on the WiFi module Install plastic chips on wifi module.
7. Connect LCD cable to CN6 on system board.
8. Routing LCD cable according to Figure 4-18, need to under Rib on Top Cover.
9. Stick tape to fasten LCD cable.

4.7 CPU Cooling Module and Fan 4 Replacement Procedures
4.7 CPU Cooling Module and Fan
CAUTION: When removing CPU Cooling Module and Fan, keep following in mind:
The CPU Cooling Module can become very hot during operation. Be sure to let it cool
down before starting the repair work. Hold Fan on its outline, do not press on its center.
Do not touch or cause damage to the fan in the CPU Cooling Module.
Remove CPU Cooling Module and Fan_VGA SKU only
Remove CPU Cooling Module and Fan according to the following procedures and
Figures 4-19 and 4-20.
1. Remove cushion for FAN.
2. Remove four M2.0x3.0x4.5 black Phillips head screws securing CPU Cooling
Module.
3. Remove CPU Cooling Module.
4. Disconnect Fan cable from CN21 on system board.
5. Remove the plastic pad from the fan screw.Remove the plastic pad from the fan
screw.
6. Remove three M2.0x3.0x4.5 black Phillips head screws securing Fan.
7. Remove FAN.
Figure 4-19Removing the CPU Cooling Module and Fan

4 Replacement Procedures 4.7 CPU Cooling Module and Fan
Figure 4-20 Applying silicon grease

4.8 4.8 System Board 4 Replacement
Procedures
4.8 System Board
Removing System Board
Remove System Board according to the following procedures and Figures 4-21.
1. Disconnect the following cable from the connector on System Board: -

Speaker cable from SPK.
- LCD cable from CN6.
- IO Board cable from CON19
- Touch Pad cable from TPCON1.
- Keyboard cable from KBCON1.
- FAN cable from CN21.
- Battery Pack cable from CN3.
- RTC Battery from RTC CN1.
- Released wireless antenna cables from top cover latch.
2. Remove four M2.0x3.0x4.5and one M2.0x2.5x5.0 black Phillips head screw

securing System Board.
3. Remove System Board.
4. Remove the high position adhesive paper of DC seat
Figure 4-21 Removing System Board

4 Replacement Procedures0.8 4.8 System Board
Install System Board according to the following procedures and Figures 4-21.
1. Place System Board in correct position.
2. Securing System Board with four M2.0x3.0x4.5and one M2.0x2.5x5.0 black

Phillips head screw.
( ▲ mark portions)
3. Connect following cable to the connector on System Board:
- Speaker cable from SPK.

- LCD cable from CN6.
- IO Board cable from CON19
- FFC-MB terminal connected to TP-CON1
- keyboard connection KBCON1,over the speaker wire wiring. -
FAN cable from CN21.
- Battery Pack cable from CN3.
- RTC Battery from RTCCN1.
- Released wireless antenna cables from top cover latch. -
Place System Board in correct position
- DC block paste high temperature adhesive paper
NOTE:
Be sure to place all cables into the ditch to avoid the damage during assembling the
bottom cover.
NOTE:
Be sure to align Type-C connector to Top Cover, when place system board on the
unit..

4.9 IO Board 4 Replacement Procedures
4.9 IO Board
Removing IO Board
Remove IO Board according to the following procedures and Figures 4-23.
1. Disconnect the following cable from the connector on IO Board: -

IO Board cable from JDB1
2. Remove three M2.0x3.0x4.5 black Phillips head screw securing IO Board.
3. Remove the IO panel Myla.
Figure 4-23 Removing IO Board

4 Replacement Procedures 4.9 IO board
Install IO Board according to the following procedures and Figures 4-23.
1. Place IO Board in correct position.
2. Securing IO Board with three M2.0x3.0x4.5 black Phillips head screw.
3. Connect following cable to the connector on System Board:
-IO Board cable from JDB1
4. Stick tape on the IO Board.

4.10 Speaker 4 Replacement Procedures
4.10 Speaker
Removing Speaker
Remove Speake according to the following procedures and Figure 4-25.
1. Disconnect Speaker cable from SPK on system board.
2. Remove left and right Speaker.
Figure 4-25 Removing Speaker

4 Replacement Procedures 4.10 Speaker
Installing Speaker
Install Speaker according to the following procedures and Figure 4-25.
1. Place speaker in correct position.
2. Connect speaker cable to SPK on system board

4.11 4.11 LCD Module Mask 4 Replacement
Procedures
4.11 LCD Module Mask
NOTE: This chapter is only for Non-Touch SKU. We provide Touch Panel Assembly for
Touch SKU.
Remove the LCD Module Mask
Removing the LCD Module Mask according to the following procedures and Figure 4-11
& 4-12.
1. 1.Remove four Black (Remove the four rubber footpads from the B shell)
2. Remove four M2.0x3.0x4.5 black Phillips head screws securing the LCD Module
Mask as Figure 4-11 shown .
3. Insert your finger between the edge of LCD Module Mask and the LCD panel by
twist in correct indication and follow step 1, 2 & 3 to release the latches as Figure 4-
27 shown.
4. Remove the LCD Module Mask while unlatching the LCD Module Mask.
Figure 4-27 Removing the LCD Module Mask

4 Replacement Procedures 4.11 4.11LCD Module
Mask
Figure 4-28 Removing the LCD Module Mask

4.11 4.11 LCD Module Mask 4 Replacement
Procedures
Installing the LCD Module Mask
Install the LCD Module Mask according to the following procedures and Figure 4-27 &
4-28.
1. Install the LCD Module Mask and follow step 3, 2 & 1 to press & lock the latches.
2. Securing the LCD Module Mask with four M2.0x3.0x4.5 black Phillips head screw.
3. Install 4 rubber foot pads Install four plastic pads.
NOTE: When installing the LCD Module Mask, ensure there is no gap between the
LCD Module Mask and the LCD module cover.
NOTE: Do not lose the Camera Shutter.

4 Replacement Procedures 4.12 4.12 LCD
Panel
4.12 LCD Panel
NOTE: Touch SKU will provide the FRU parts as LCD Module Assembly.
This chapter only for Non-Touch SKU.
NOTE: ICs are fragile. Use extreme care not to apply pressure to the ICs along the
edges of the LCD module.
NOTE: Dispose of used LCD Panel (fluorescent (FL) tubes) as required by local
ordinances or regulations.
NOTE: The LCD cable must be carefully peeled away before disconnecting it from the
module.
Removing the LCD Panel
Remove the LCD Panel according to the following procedures and Figures 4-29 & 4-
30.
1. Follow the Figure 4-29 direction 1 to lift up LCD panel.
2. Carefully tilt the LCD module toward you.
3. Turn the LCD upside down. Be sure to place it on a cushioned surface such as a
foam pad.
4. Remove the tape and LCD cable connector. Then disconnect the LCD cable as
Figure 4-30 shown.

4.12 4.12 LCD Panel 4 Replacement Procedures
Figure 4-29 Removing LCD Panel follow direction 1.
Figure 4-30 removing the LCD cable

4 Replacement Procedures 4.12 4.12LCD
Panel
Installing the LCD Panel
NOTE: LCD/FL cable must be carefully peeled away before disconnecting it from the
module.
Install the LCD Panel according to the following procedures and Figures 4-29and4-30
Installing the LCD panel
Install the LCD Panel according to the following procedures.
1. Turn the LCD upside down.
2. Connect the LCD cable to the LCD module connector as Figure 4-30-1 shown.
3. Lift LCD panel top side up as Figure4-30 shown anbottom side down on the LCD
module cover.
4. d then place the LCD panel Check LCD cable below the LCD module cover latch
as Figure 4-30 shown.
CAUTION: When installing the LCD module, please follow below instruction:
When plug in LCD/FL cable into LCD panel connector, need to plug horizontally.

13CCDModule 4 Replacement Procedures
4.13 CCD Module
NOTE: Touch SKU will provide the FRU parts as LCD Module Assembly. This chapter
only for Non-Touch SKU.
Removing the CCD Module
Remove the CCD Module according to the following procedures and Figure 4-33
1. Lift the CCD Module from the LCD module cover.
2. Disconnect LCD cable from CCD Module connector.
Figure 4-33Removing the CCD Module

4 Replacement Procedures 4.13 CCD Module
Installing the CCD Module
Install the CCD Module according to the following procedures and Figure 4-33.
1. Remove CCD Module release paper.
2.Connect LCD cable to CCD module connector.
3.After ripping off FPC release paste FPC into shell LCD cover.
4.Seat the CCD Module in the correct position.
5.Route the LCD cables according to Figure 4-29, place the cable into the ditch
and correct position. Avoid to pinching the cables.

1 4 To u c h p a d 4
Replacement Procedures
4.14 Touch pad
Removing Touch pad
Remove Touch pad according to the following procedures and Figures 4-35.
CAUTION: Do not touch the connectors on Touch pad and in the computer with your
bare hands. Touch pad can fail if they are contaminated with sweat, natural oils, etc. from
your hands.
1.Separate the touchpad from the C shell 2.Detach the bracket from the trackpad
Figure 4-35 Removing Touch pad

4 Replacement Procedures 4.14 Touch pad
Installing Touch pad
Install Touch pad according to the following procedures and Figures 4-35.
1.Tear off 3MM adhesive release paper 2.Paste the touchpad holder
3.Tear off fingerprint high temperature tape
4.Tilt the touchpad to 45°, put the bottom into the C shell, paste and press
5.Remove the mylar release paper and paste the adhesive
CAUTION: Do not touch the connectors on Touch pad and in the computer with your
bare hands. Touch pad can fail if they are contaminated with sweat, natural oils, etc.
from your hands

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Chapter 1

1.1 Syestem Feature ......................................................................................................... 1-1

Figure 1-1 ID Parts Description Placement .................................................................... 1-5

SATELLITE PRO C40-J Maintenance Manual 1-i

1.1 System Features

The computer has the following features:

1. CPU is mobile Intel TGL & TGL-R series processor:

Intel TGL-R i7 CPU

Intel TGL-R i5 CPU

Intel TGL-R i3 CPU

Intel TGL i7 CPU

Intel TGL i5 CPU

Intel TGL i3 CPU

1-1 Maintenance Manual SATELLITE PRO C40-J

Intel TGL i3 CPU

� Host Bridge System Controller

System Controller: Intel integrated Host bridge system into CPU.

� 4096 MB SO-DIMM DDR4-3200MHz

� 8192 MB SO-DIMM DDR4-3200MHz

� 16384 MB SO-DIMM DDR4-3200MHz

� Solid State Drive (SSD)

SATELLITE PRO C40-J Maintenance Manual 1-2

� 14" HD 220nits eDP 1366x768 LED display

The internal LAN supports 10/100/1Gbit Ethernet, enabling connection to a

REALTEK ALC256&ALC256N integrated audio controller supports multimedia.

many kinds’ countries keyboard, which is Non-backlight keyboardwith

1-3 Maintenance Manual SATELLITE PRO C40-J

� HDMI Out Port

A HDMI monitor can be connected to HDMI Out Port on the computer.

� Bridge Media Slot

� Webcam with embedded internal microphone

The computer has an internal camera. It supports HD (0.9M) with Camera

The computer has a 2 Cell (6000mAh) Lithium Ion battery pack.

SATELLITE PRO C40-J Maintenance Manual 1-4

1-5 Maintenance Manual SATELLITE PRO C40-J

Figure 1-1 ID Parts Description Placement

Figure 1-2 Computer Block Diagram

SATELLITE PRO C40-J Maintenance Manual 1-6

Figure 1-3 System Board Configurations

SATELLITE PRO C40-J Maintenance Manual 1-7

1.2 System Unit Components

Figure 1-4 System Unit Block

1-8 Maintenance Manual SATELLITE PRO C40-J

The system unit of the computer consists of the following components:

� Processor: CPU is mobile Intel TGL&TGL-R Processor:

Intel TGL-R i7 CPU

Intel TGL-R i5 CPU

Intel TGL-R i3 CPU

Intel TGL i7 CPU

Intel TGL i5 CPU

Intel TGL i3 CPU

Intel TGL i3 CPU

� PC4-3200(3200MHz) SO-DIMM DDR4 supported

� DDR4 1.2V operation

SATELLITE PRO C40-J Maintenance Manual 1-9

� Data transfer rates: PC4-3200

� BIOS ROM (Flash memory)

Nv Storage size: 128K

� NVRAM_BACKUP size: 192k