E28-2G4M12XX Usermanual EN v2.0
E28-2G4M12XX Usermanual EN v2.0
E28-2G4M12XX Usermanual EN v2.0
Contents
1. Overview ........................................................................................................................................................................................................ 2
1.1 Brief introduction ..............................................................................................................................................................................2
1.2 Features ............................................................................................................................................................................................... 2
1.3 Application ......................................................................................................................................................................................... 2
2.Specification and parameter ........................................................................................................................................................................3
2.1 Limit parameter .................................................................................................................................................................................3
2.2 Operating parameter .........................................................................................................................................................................3
3.Size and pin definition ..................................................................................................................................................................................4
4.Basic operation ...............................................................................................................................................................................................6
4.1 Hardware design ............................................................................................................................................................................... 6
4.2 Software editing ................................................................................................................................................................................ 6
5.Basic application ............................................................................................................................................................................................7
5.1 Basic circuit diagram ....................................................................................................................................................................... 7
6.FAQ ...................................................................................................................................................................................................................7
6.1 Communication range is too short ................................................................................................................................................7
6.2 Module is easy to damage .............................................................................................................................................................. 8
6.3 BER(Bit Error Rate) is high ...........................................................................................................................................................8
7.Production guidance ..................................................................................................................................................................................... 8
7.1 Reflow soldering temperature ....................................................................................................................................................... 8
7.2 Reflow soldering curve ................................................................................................................................................................... 9
8.E28 Series ........................................................................................................................................................................................................9
9.Antenna guidance ........................................................................................................................................................................................10
9.1 Antenna recommendation .............................................................................................................................................................10
9.2 Antenna selection ........................................................................................................................................................................... 10
Revision history .............................................................................................................................................................................................. 11
About us ............................................................................................................................................................................................................11
1. Overview
1.1 Brief introduction
E28-2G4M12S/SX is a 2.4GHz bluetooth module designed by Chengdu Ebyte,with long distance and ultra-low
power consumption. E28-2G4M12S is small-sized SMD module(pin spacing 1.27mm),built-in PCB antenna and IPEX
antenna. High precision 52MHz crystal is used.
Based on the original imported RF chip SX1281 from SEMTECH, it features multiple physical layers and various
modulating methods such as LoRa, FLRC and GFSK, the special modulating methods and processing ways enable longer
operating range under LoRa and FLRC modulating methods, and the GFSK method covers BLE protocol. The
outstanding ultra-low power consumption and the DC-DC and Time-of-Flight on chip make the chip much more capable
for smart home, security system, tracking and locating, wireless distance measuring, wearable electronics, smart bracelet
and health management & etc. SX1281 supports RSSI,users need to conduct a secondary development based on their
own demands;SX1281 also integrates time of flight for ranging functions.
Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.
1.2 Features
Communication distance tested is up to 3km;
Maximum transmission power of 18mW, software multi-level adjustable;
Compatible with BLE protocol;
Support the global license-free ISM 2.4GHz band;
Support air date rate of 0.476kbps~2Mbps;
Support multiple modulation methods, (GFSK Mode ,FLRC Mode,LoRa Mode);
Support 1.8V~3.6V power supply, power supply over 3.3V can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
IPEX and PCB antenna optional, good for secondary development and integration;
The air data rate is adjustable, the maximum air data rate is up to 1.3 Mbps in FLRC mode;
Excellent anti-blocking properties;
Ranging, with Time-of-flight function.
1.3 Application
Home security alarm and remote keyless entry;
Smart home and industrial sensors;
Wireless alarm security system;
Building automation solutions;
Performance
Main parameter Remark
Min. Typ. Max.
Operating voltage(V) 1.8 3.3 3.6 ≥3.3 V ensures output power
For 5V TTL, it may be at risk of burning
Communication level(V) 3.3
down
Operating temperature(℃) -40 - 85 Industrial design
Operating frequency(MHz) 2400 2430 2500 Support ISM band
Power TX current(mA) 45 Instant power consumption
consumpti RX current(mA) 10
on Sleep current (μA) 2.0 Software is shut down
Max Tx power(dBm) 12 12.5 14
LoRa receiver sensitivity with CR=4/5
Receiving sensitivity(dBm) - -130 and high sensitivity mode enabled
-128 1SF12,BW=203kHz
LoRa(bps) 0.595k~253.9k Programming
E28-2G4M12S:260k
Air data rate FLRC(bps) Programming
E28-2G4M12SX:1.3M
GFSK(bps) 125k~2M Programming
E28-2G4M12S
E28-2G4M12SX
4.Basic operation
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;
Please check the stability of the power supply, the voltage can not be fluctuated frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.;
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
This module is based on SX1281,same drive way as SX1281,user can refer to SX1281 datasheet.
GDO 0 is general I/O port,see more in SX1281 datasheet.
GDO 2 is generally configurated as IRQ function, IRQ pin can also be disconnected. The SPI query mode can be
Copyright ©2012–2024,Chengdu Ebyte Electronic Technology Co.,Ltd. 6
Chengdu Ebyte Electronic Technology Co., Ltd. E28-2G4M12XX User Manual
used to obtain the interrupt status. However, it is recommended to use the external interrupt of the MCU.
After SX1281 restores IDLE mode or configures sleep mode, it is recommended that the power configuration table
be reinitialized.
5.Basic application
6.FAQ
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
Please check the power supply source, ensure it is within right voltage range.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production guidance
7.1 Reflow soldering temperature
Profile Feature Sn-Pb Assembly Pb-Free Assembly
8.E28 Series
Test
Frequency Communication
Model No. IC Tx power (dBm) distance Package Size
(Hz) interface
(km)
E28-2G4T12S SX1280 2.4G 12.5 3 SMD 17.5* 28.7 TTL
E28-2G4M27S SX1281 2.4G 27 8 SMD 15*26.5 SPI
E28-2G4M20S SX1281 2.4G 20 6 SMD 15 * 26.5 SPI
E28-2G4M12S SX1281 2.4G 12.5 3 SMD 25*14 SPI
9.Antenna guidance
The antenna is an important role in the communication process. A good antenna can largely improve the
communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Frequency Gain
Model No. Type Interface Height Cable Function feature
Hz dBi
TX2400-NP-5010 FCB antenna 2.4G SMA-J 2 50*10mm - FPC soft antenna
Sucker antenna, High
TX2400-XPL-150 Sucker 2.4G SMA-J 3.5 15cm 150cm
gain
Flexible
TX2400-JK-20 Rubber 2.4G SMA-J 3 200mm -
&omnidirectional
Flexible
TX2400-JK-11 Rubber 2.4G SMA-J 2.5 110mm -
&omnidirectional
Short straight
TX2400-JZ-3 Rubber 2.4G SMA-J 2 30mm -
&omnidirectional
Revision history
About us