Tle 2426
Tle 2426
Tle 2426
SLOS098D − AUGUST 1991 − REVISED MAY 1998
Voltage − V
6
termination of all analog signal grounds. Texas
Instruments presents a precision virtual ground
VO
whose output voltage is always equal to one-half 4
the input voltage, the TLE2426 “rail splitter.”
The unique combination of a high-performance,
micropower operational amplifier and a precision- 2
trimmed divider on a single silicon chip results in
a precise VO/VI ratio of 0.5 while sinking and
sourcing current. The TLE2426 provides a low- 0
0 0.25 0.5 0.75 1
impedance output with 20 mA of sink and source
t − Time − s
capability while drawing less than 280 µA
of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board
space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage
references. The performance and precision of the TLE2426 is available in an easy-to-use, space saving,
3-terminal LP package. For increased performance, the optional 8-pin packages provide a noise-reduction pin.
With the addition of an external capacitor (CNR), peak-to-peak noise is reduced while line ripple rejection is
improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% with 3.6% over the full 40-V input range.
Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data acquisition front end, analog
signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system
error.
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
SMALL CERAMIC PLASTIC
PLASTIC FORM
TA OUTLINE DIP DIP
(LP) (Y)
(D) (JG) (P)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
! " #$%! " &$'(#! )!%* Copyright 1998, Texas Instruments Incorporated
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
description (continued)
The C-suffix devices are characterized for operation from 0°C to 70°C. The I suffix devices are characterized
for operation from −40°C to 85°C. The M suffix devices are characterized over the full military temperature range
of −55°C to 125°C.
D, JG, OR P PACKAGE LP PACKAGE
(TOP VIEW) (TOP VIEW)
NC − No internal connection
(2) (2)
(3) (3) (1) (1)
IN CHIP THICKNESS:
(3) 15 MILS TYPICAL
BONDING PADS:
NOISE (8) (1) 4 × 4 MILS MINIMUM
+1 OUT
REDUCTION
60 TJmax = 150°C
(8)
NOTE A: Both bonding pads numbered 1, both numbered 2,
88 and both numbered 3, must be bonded out to the
corresponding functions pin.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Continuous filter trap voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 80 mA
Duration of short-circuit current at (or below) 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG or LP package . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
TA ≤ 25
25°C
C DERATING FACTOR TA = 70
70°C
C TA = 85
85°C
C TA = 125
125°C
C
PACKAGE
POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING
D 725 mV 5.8 mW/°C 464 mW 377 mW 145 mW
JG 1050 mV 8.4 mW/°C 672 mW 546 mW 210 mW
LP 775 mV 6.2 mW/°C 496 mW 403 mW 155 mW
P 1000 mV 8.0 mW/°C 640 mW 520 mW 200 mW
TYPICAL CHARACTERISTICS
Table Of Graphs
FIGURE
Output voltage Distribution 1,2
Output voltage change vs Free-air temperature 3
Output voltage error vs Input voltage 4
vs Input voltage 5
Input bias current
vs Free-air temperature 6
Output voltage regulation vs Output current 7
Output impedance vs Frequency 8
vs Input voltage 9,10
Short-circuit output current
vs Free-air temperature 11,12
Ripple rejection vs Frequency 13
Spectral noise voltage density vs Frequency 14
Output voltage response to output current step vs Time 15
Output voltage power-up response vs Time 16
Output current vs Load capacitance 17
TYPICAL CHARACTERISTICS†
DISTRIBUTION DISTRIBUTION
OF OF
OUTPUT VOLTAGE OUTPUT VOLTAGE
3 40
98 Units Tested 98 Units Tested
From 2 Wafer Lots From 2 Wafer Lots
2.5 VI = 5 V VI = 12 V
TA = 25°C TA = 25°C
30
Percentage of Units − %
Percentage of Units − %
2
1.5 20
10
0.5
0 0
2.48 2.49 2.5 2.51 2.52 6 6.025 6.05 6.075 6.1
VO − Output Voltage − V VO − Output Voltage − V
Figure 1 Figure 2
3
75 Error Equals VO / VI Deviation From 50%
Output Voltage Error − %
VI = 12 V
2
0
VI = 4 V, 5 V
1
−75
O
0
∆V
−150 −1
−75 −50 −25 0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40
TA − Free-Air Temperature − °C VI − Input Voltage − V
Figure 3 Figure 4
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
150 150
VI = 4 V
TA = 125°C
100 100
IIB
IIB
50 50
IO = 0
0 0
0 5 10 15 20 25 30 35 40 −75 −50 −20 0 25 50 75 100 125
VI − Input Voltage − V TA − Free-Air Temperature − °C
Figure 5 Figure 6
10
250
z o − Output Impedance − Ω
Max
Typ 1
0
Typ
0.1
Min
−250
0.01
Min
0.001
−500
−20 −10 0 10 20 10 100 1k 10 k 100 k 1M
IO − Output Current − mA f − Frequency − Hz
Figure 7 Figure 8
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
TA = 25°C
−20 30 TA = − 55°C
TA = 125°C
−40 20
TA = − 55°C
−60 10
VO = VI
IOS
IOS
−80 0
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
VI − Input Voltage − V VI − Input Voltage − V
Figure 9 Figure 10
VI = 12 V
−20 30
VI = 5 V
−30 VI = 4 V
VI = 5 V
−40 20
−50
−60 VI = 12 V 10
IOS
IOS
−70 VO = VI
VI = 40 V (Output Sinking)
−80 0
−75 −50 −25 0 25 50 75 100 125 −75 −50 −25 0 25 50 75 100 125
TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C
Figure 11 Figure 12
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
60
50 200
40
30
100
20 CNR = 0
CNR = 0
10 CNR = 1 µF
0 0
10 100 1k 10 k 100 k 1M 1 10 100 1k 10 k 100 k
f − Frequency − Hz f − Frequency − Hz
Figure 13 Figure 14
2
1.5
1
IO = 0
0.01% 1
0 CL = 100 pF
0.01% TA = 25°C
−1 0.5
VV)
−2 10 mA 0
IO Step 0.1%
−3
VO
5
∆V
TYPICAL CHARACTERISTICS
STABILITY RANGE
OUTPUT CURRENT
vs
LOAD CAPACITANCE
20
VI = 5 V
15 Unstable
TA = 25°C
I O − Output Current − mA 10
−5 Stable
−10
−15
−20
10 −6 10 −5 10 −4 10 −3 10 −2 10 −1 10 0 10 1 10 2
CL− Load Capacitance − mF
Figure 17
MACROMODEL INFORMATION
* TLE2426 OPERATIONAL AMPLIFIER “MACROMODEL” SUBCIRCUIT
* CREATED USING PARTS RELEASE 4.03 0N 08/21/90 AT 13:51
* REV (N/A) SUPPLY VOLTAGE: 5 V
* CONNECTIONS: FILTER
| INPUT
* | | COMMON
* | | | OUTPUT
* | | | |
.SUBCKT TLE2426 1 3 4 5
C1 11 12 21.66E−12
C2 6 7 30.00E−12
C3 87 0 10.64E−9
CPSR 85 86 15.9E−9
DCM + 81 82 DX
DCM − 83 81 DX
DC 5 53 DX
DE 54 5 DX
DLP 90 91 DX
DLN 92 90 DX
DP 4 3 DX
ECMR 84 99 (2,99) 1
EGND 99 0 POLY(2) (3,0) (4,0) 0 .5 .5
EPSR 85 0 POLY(1) (3,4) −16.22E − 6 3.24E − 6
ENSE 89 2 POLY(1) (88,0) 120E − 6 1
FB 7 99 POLY(6) VB VC VE VLP VLN VPSR 0 74.8E6 − 10E6 10E6 10E6 − 10E6 74E6
GA 6 0 11 12 320.4E − 6
GCM 0 6 10 99 1.013E − 9
GPSR 85 86 (85,86) 100E − 6
GRC1 4 11 (4,11) 3.204E − 4
GRC2 4 12 (4,12) 3.204E − 4
GRE1 13 10 (13,10) 1.038E − 3
GRE2 14 10 (14,10) 1.038E − 3
HLIM 90 0 VLIM 1K
HCMR 80 1 POLY(2) VCM+ VCM − 0 1E2 1E2
IRP 3 4 146E − 6
IEE 3 10 DC 24.05E − 6
IIO 2 0 .2E − 9
I1 88 0 1E − 21
Q1 11 89 13 QX
Q2 12 80 14 QX
R2 6 9 100.0E3
RCM 84 81 1K
REE 10 99 8.316E6
RN1 87 0 2.55E8
RN2 87 88 11.67E3
RO1 8 5 63
RO2 7 99 62
VCM + 82 99 1.0
VCM − 83 99 − 2.3
VB 9 0 DC 0
VC 3 53 DC 1.400
VE 54 4 DC 1.400
VLIM 7 8 DC 0
VLP 91 0 DC 30
VLN 0 92 DC 30
VPSR 0 86 DC 0
RFB 5 2 1K
RIN1 3 1 220K
RIN2 1 4 220K
.MODEL DX D(IS=800.OE−18)
.MODEL QX PNP(IS=800.OE− 18 BF=480)
.ENDS
www.ti.com 7-Apr-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TLE2426CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CLP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CLPE3 ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CLPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426CP Samples
TLE2426ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426IDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426ILP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426I Samples
TLE2426ILPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2426I Samples
TLE2426IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426IP Samples
TLE2426IPE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426IP Samples
TLE2426MD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 2426M Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 7-Apr-2024
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive : TLE2426-Q1
• Enhanced Product : TLE2426-EP
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION
2.67
3X
2.03 4.19
3.17
3 2 1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92
FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP
2X
METAL
(1.5) 2X (1.5)
2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING
METAL
2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
16.5
15.5
11.0 9.75
8.5 8.50
19.0
17.5
4215214/B 04/2017
www.ti.com
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