CD4093B

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Data sheet acquired from Harris Semiconductor

SCHS115D – Revised September 2003

The CD4093B types are supplied in 14-lead


hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages (E
suffix), 14-lead small-outline packages (M, MT,
M96, and NSR suffixes), and 14-lead thin
shrink small-outline packages (PW and PWR
suffixes).

PACKAGE THERMAL IMPEDANCE, JA (See Note 1):


E package.................................................................................................................................................80C/W
M package.................................................................................................................................................86C/W
NS package...............................................................................................................................................76C/W

NOTE 1: Package thermal impedance is calculated in accordance with JESD 51-7.

VDD

VDD

VP
VOH VN

VOL
VSS

PRODUCTION DATA information is current as of publication


date. Products conform to specifications per the terms of Texas POST OFFICE BOX 655303  DALLAS, TEXAS 75265
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright  2003 Texas Instruments Incorporated

1
2 POST OFFICE BOX 655303  DALLAS, TEXAS
75265
POST OFFICE BOX 655303  DALLAS, TEXAS 3
75265
4 POST OFFICE BOX 655303  DALLAS, TEXAS
75265
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
7704602CA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
CD4093BE ACTIVE PDIP N 14 25 Pb- CU NIPDAU Level-NC-NC-NC
Free
(RoHS)
CD4093BEE4 ACTIVE PDIP N 14 25 Pb- CU NIPDAU Level-NC-NC-NC
Free
(RoHS)
CD4093BF ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
CD4093BF3A ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
CD4093BM ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BM96 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BME4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BMT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BMTE4 ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BNSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BPW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)
CD4093BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no
Sb/Br)

The marketing status values are defined as follows:


(1)

ACTIVE: Product device recommended for new designs.


LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb)
based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and
(3)

peak solder

Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date
that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or
warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI
has taken and continues to take reasonable steps to provide representative and accurate information but may not have
conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain
information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this
document sold by TI to Customer on an annual basis.

Addendum-Page 2
MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE


14 PINS SHOWN

0,30
0,65 0,10 M
0,19
14 8

0,15 NOM
4,50 6,60
4,30 6,20

Gage Plane

0,25
1 7
0– 8
A 0,75
0,50

Seating Plane

1,20 MAX 0,10


0,15

PINS **
8 14 16 20 24 28
DIM

A MAX 3,10 5,10 5,10 6,60 7,90 9,80

A MIN 2,90 4,90 4,90 6,40 7,70 9,60

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.


B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153

POST OFFICE BOX 655303  DALLAS, TEXAS 75265


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