SC8701英文原版

SC8701 DATASHEET
SOUTHCHIP SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO.,LTD SOUTHCHIP CONFIDENTIAL
SC8701 High Efficiency, Synchronous Buck-Boost Controller
1 Description 2 Features
The SC8701 is a synchronous 4-switch buck-boost  High efficient buck-boost operation
controller. It is able to effectively output voltage no  Dynamic adjustable output voltage
matter it is higher, lower or equal to the input voltage.
 Dynamic adjustable Input and Output current limit
The SC8701 supports very wide input and output
 Wide input voltage range: 2.7 V to 36 V
voltage range. It can support applications from 2.7V to
36V input range and 2V to 36V output range. The  Wide output range: 2V to 36V
driver voltage is set to 10V to fully utilize external
 Integrated 10V, 2A gate driver
MOSFETs for highest efficiency.
 Adjustable frequency 200kHz to 600kHz
The SC8701 supports input current limit, output current
limit and over temperature protections to ensure safety  Under voltage protection
under different abnormal conditions.  QFN-32 Package
The SC8701 adopts 32 pin QFN 4x4 package.
3 Applications
 Power Bank
 USB PD
 Car Charger
 Industrial applications
4 Device Information
ORDER NUMBER PACKAGE BODY SIZE
SC8701QDER 32 pin QFN 4mm x 4mm x 0.75mm
Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co.,Ltd

Please contact application@southchip.com for more information.
SC8701 DATASHEET
SOUTCHIP CONFIDENTIAL, TO LUXSHARE ONLY SOUTHCHIP SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO.,LTD
5 Typical Application Circuit
OPT
VIN VOUT
VCC
SNS1P
SW1
SNS1N
LD1
PGND
HD1
BT1
VCC
VIN LD2
SW2
CEb VCC
PWM SC8701 BT2
IPWM HD2
VCC SNS2P
PG
AGND SNS2N
ITUNE
COMP
FREQ
ILIM2
ILIM1
VOUT
DT
FB
2 Please contact application@southchip.com for more information. Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.
SC8701 DATASHEET
SOUTHCHIP SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO.,LTD SOUTHCHIP CONFIDENTIAL, TO LUXSHARE ONLY
6 Terminal Configuration and Functions
SNS1N
SNS1P
PGND
SW1
HD1
BT1
LD1
VIN
/CE VCC
NC LD2
PWM SW2
PG HD2
PGND
IPWM BT2
ITUNE VOUT
NC SNS2P
DT SNS2N
AGND
COMP
FB
NC
FREQ
ILIM1
ILIM2
TERMINAL NC
I/O DESCRIPTION
NUMBER NAME
1 /CE I Chip Logic Enable, CE=Low, chip enable. Internal pull low
2 NC I Floating
PWM pin accepts square waveform from 20K to 100K. By adjusting duty cycle, output voltage can
be adjusted according to needs. When duty=0, output voltage = 1/6 of the preset value by the
feedback resistor divider at FB pin. When duty = 100%, output voltage = preset value.
3 PWM I
1 5
VOUT = VOUT_SET×( + ×D)
6 6
4 PG O Open drain, active high when VOUT is within 90% to 110% * VOUT target.
IPWM pin is used together with ITUNE pin to adjust the current limit value of either ILIM1 or ILIM2.
The ITUNE pin is used to select the control object between ILIM1 and ILIM2, and IPWM signal is to
adjust the limit value.
IPWM pin accepts PWM waveform from 20kHz to 100kHz, and the current limit value is
proportional to its duty cycle.
For example, if ITUNE pin selects ILIM1, then the input current limit is set by:
5 IPWM I
IIN = ILIM1_SET×D
In the equation above, ILIM1_SET is the current limit value set by the resistor at ILIM1 pin, D is the duty
cycle of the IPWM signal.
Similarly, if ITUNE pin selects ILIM2, then the output current limit is set by:
IOUT = ILIM2_SET×D
ITUNE pin selects the IPWM control object between ILIM1 and ILIM2. .
If ILIM1 current limit needs to be controlled, connect the ILIM1 resistor between ILIM1 pin and
ITUNE pin. If ILIM2 current limit is to be controlled, connect the ILIM2 resistor between ILIM2 pin
and ITUNE pin.
6 ITUNE IO
Only one current limit can be selected by ITUNE pin.
If IPWM function is not needed, leave ITUNE pin and IPWM pin floating, and connect the ILIMx
resistor from the ILIMx pin to AGND accordingly.
Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd. Please contact application@southchip.com for more information 3
SC8701 DATASHEET
7 NC I Floating.
Dead Time selection.

8 DT I
Short to ground: 20ns; 68kΩ: 40ns; 270kΩ: 60ns; Open: 80ns
9 NC I Floating
Frequency selection
10 FREQ I
Short to ground: 200kHz; 68kΩ: 400kHz; Open: 600kHz
Connect a resistor to set the current limit value of input current.

VREF RSS1
ILIM1_SET = ×
RILIM1 RSNS1
VREF is the internal reference voltage 1.21V;
RLIM1 is the resistor from ILIMT1 to ground or to ITUNE;

11 ILIM1 I
RSNS1 is the current sense resistor. Recommended 5mΩ-20mΩ，typical 10mΩ;
RSS1 are the resistors connected to SNS1P，SNS1N. The two resistors must be equal and the
recommended value is 1kΩ.
A 2.2nF capacitor to ground is needed to bypass noise. If IPWM function is applied to ILIM1,
increase the capacitor value to 10nF. If current limiting function is not needed, please short ILIM1 to
ground.
Connect a resistor to set the current limit value of output current.
VREF RSS2
ILIM2_SET = ×
RILIM2 RSNS2
VREF is the internal reference voltage 1.21V；
12 ILIM2 I RLIM2 is the resistor from ILIM2 to ground or to ITUNE；
RSNS2 is current sensing resistor. Recommended 5mΩ-20mΩ，typical 10mΩ；
RSS2 are the resistors connected to SNS2P，SNS2N. The two resistors must be equal and the
recommended value is 1kΩ.
A 2.2nF capacitor to ground is needed to bypass noise. If IPWM function is applied to ILIM2,
increase the capacitor value to 10nF. If current limiting function is not needed, please short ILIM2 to
ground.
13 NC I Floating
14 AGND IO Analog Ground
15 COMP O Compensation for the control loop.
Feedback for output voltage.

RUP
16 FB I VOUT = VREF× (1+ )
RDOWN
VREF equals to 1.22V. RUP and RDOWN are the value of voltage divider.
Negative input of current sense amplifier. Connect an external current sense resistor between
17 SNS2N I
SNS2P and SNS2N. Current flows from SNS2P to SNS2N.
SC8701 DATASHEET
Positive input of current sense amplifier. Connect an external current sense resistor between SNS2P
18 SNS2P I
and SNS2N. Current flows from SNS2P to SNS2N.
19 VOUT I Output node of the converter.
Connect a capacitor between BT2 pin and SW2 pin to bootstrap a voltage to provide the bias
20 BT2 PWR
voltage for high side MOSFET gate driver2.
21 HD2 PWR High side MOSFET gate driver2 output
22 SW2 PWR Switching Node 2
23 LD2 PWR Low side MOSFET gate driver2 output
Output of internal regulator to provide 10V voltage for the bias voltage of internal gate drivers.
24 VCC PWR
Connect a 1 µF ceramic capacitor from VCC to PGND pin.
25 PGND PWR Power Ground
26 LD1 PWR Low side MOSFET gate driver1 output
27 SW1 PWR Switching Node 1
28 HD1 PWR High side MOSFET gate driver1 output
Connect a capacitor between BT1 pin and SW1 pin to bootstrap a voltage to provide the bias
29 BT1 PWR
voltage for high side MOSFET gate driver1.
30 VIN I Input node of the converter
Negative input of current sense amplifier. Connect an external current sense resistor between
31 SNS1N I
Positive input of current sense amplifier. Connect an external current sense resistor between
32 SNS1P I
Thermal
For thermal dissipation. Connect to AGND or PGND.
Pad
SC8701 DATASHEET
7 Specifications
7.1 Absolute Maximum Ratings
(1)
Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT

VIN, VOUT, SNS1P, SNS1N, SNS2P, SNS2N, /CE -0.3 42 V
SW1, SW2 -1 42 V
VCC, PG, PWM, IPWM -0.3 20 V
Voltage range at FREQ, ILIM1, ILIM2, COMP, DT, FB, ITUNE -0.3 5.5 V
terminals (2) LD1, LD2 -0.3 12 V
BT1, HD1 to SW1 -0.3 12 V
BT2, HD2 to SW2 -0.3 12 V
BT1, BT2 -0.3 50 V
Operating Junction, TJ -40 150 °C
Temperature Range
Storage temperature range, Tstg -65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
7.2 Handling Ratings

PARAMETER DEFINITION MIN MAX UNIT
(2)
Human body model (HBM) ESD stress voltage -2 2 kV
ESD (1) (3)
Charged device model (CDM) ESD stress voltage -750 750 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions

MIN TYP MAX UNIT
VIN Input voltage range 2.7 36 V
VOUT Output voltage range 2 36 V
CIN Input Capacitance 30 µF
COUT Output capacitance 30 µF
L Inductance 2.2 6.8 µH
RSNS1/2 Current Sensing Resistor 5 20 mΩ
fSW Operating frequency range 200 600 kHz
SC8701 DATASHEET
fPWM, fIPWM PWM signal frequency range 20 100 kHz
DPWM, DIPWM PWM signal duty cycle range 0 100 %
TJ Operating junction temperature -40 125 C
SC8701 DATASHEET
7.4 Electrical Characteristic

TJ= 25°C and VIN = 12V, VOUT = 5V, RSS1 = RSS2 = 1kΩ unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN, VOUT)
VIN Operating voltage 2.7 36 V
VOUT Operating voltage 2 36 V
Input under-voltage lockout Rising edge 2.6 2.7 V

VUVLO
threshold Hysteresis 160 mV
Standby current into VIN or VOUT
IQ /CE = low, controller non-switching 0.7 2 mA
pin (whichever is higher)
Shutdown current into VIN or
/CE = high 6 10 μA
VOUT pin (which is higher)
ISD
Shutdown current into VIN or
/CE = high 2 μA
VOUT pin (which is lower)
VCC AND DIRVER
VCC VCC clamp voltage 9.4 10 10.6 V
IVCC_LIM VCC current limit VCC = 2V ~10V 50 75 100 mA
RHVx_pu High side driver pull up resistor 1.5 Ω
RHVx_pd High side driver pull down resistor 1 Ω
RLVx_pu Low side driver pull up resistor 1.5 Ω
RLVx_pd Low side driver pull down resistor 1 Ω
ERROR AMPLIFIER
VFB_REF FB reference voltage 1.214 1.22 1.226 V
VILIMx_REF ILIMx reference voltage 1.196 1.212 1.228 V
GmEA Error amplifier gm 0.16 mS
ROUT Error amplifier output resistance (1) 20 MΩ
IBIAS(FBx) FBx pin input bias current FBx in regulation 100 nA
CURRENT LIMIT
IIN_LIM RSNS1 ≥ 30 mV
ILIMx ILIMx current limit accuracy -5% 5%
IOUT_LIM RSNS2 ≥ 30 mV
SWITCHING FREQUENCY
RFREQ = 0Ω 180 210 240 kHz
fSW Switching frequency RFREQ = 68kΩ (±10%) 360 410 460 kHz
RFREQ = 270kΩ (±10%) 540 600 660 kHz
INDICATION
tPG_deglitch PG signal deglitch time fsw = 200kHz 27 38.5 50 ms
ISINK_PG PG sink current VPG = 0.4 V 3.6 4.1 4.6 mA
High limit falling edge (PG from low
110%
to high)
High limit hysteresis (PG from high
5%
to low)
VOUT_PG VOUT power good threshold
Low limit rising edge (PG from low
90%
to high)
Low limit hysteresis (PG from high
5%
to low)
SC8701 DATASHEET
LOGIC CONTROL
/CE internal pull down resistor 1 MΩ
PWM pin internal pull down
0.5 MΩ
RPD resistor
IPWM pin internal pull down
1 MΩ
resistor
/CE, PWM, IPWM input low
VIL 0.4 V
voltage
/CE, PWM, IPWM input high
VIH 1.2 V
voltage
Soft Start
tSS Internal soft-start time From /CE low to 90% VOUT 8 15 ms
THERMAL SHUTDOWN
Thermal shutdown temperature (1) 165 °C
TSD (1)
Thermal shutdown hysteresis 15 °C
(1) Guarantee by design
SC8701 DATASHEET
VOUT_SET = VOUT voltage which is set by FB resistor divider;

8 Detailed Description
D = Duty cycle of PWM signal.
The SC8701 is a synchronous four-switch buck-boost
controller with a wide input/output voltage range. The The relationship between VOUT voltage and D is showed in
SC8701 regulates the output at, above, below the input Figure 1
voltage. VOUT
The SC8701 features automatic buck, boost mode smooth

transition and maximum input and output current limit VOUT_SET
capability using additional resistors. In addition, the SC8701
features output voltage dynamic change, input/output current
limit dynamic change, and power MOSFETs dead time
control.
8.1 Feature Description

1/6*VOUT_SET
D
8.1.1 Chip Enable (/CE) 0 100%
The SC8701 turns on/off by /CE signal. When /CE input is

“L”, the SC8701 is turned on; when /CE input is “H”, the Figure 1 VOUT voltage vs PWM duty cycle.
SC8701 is turned off. If PWM input signal is logic high, it means 100% of duty
cycle, then the output voltage become the set value by FB1
8.1.2 VOUT voltage setting (FB) resistor divider.
The VOUT voltage is set by external resistor divider at FB If PWM input signal is logic low, it means 0% of duty cycle,
pin and is calculated as: then the output voltage become the 1/6 of the set value.
RUP If PWM pin is left floating, due to the IC internal pull down
VOUT = VFB_REF× (1+ )
RDOWN circuit at PWM pin, VOUT voltage becomes the 1/6 of
programmed voltage.
If real-time output voltage control is not required, connect
Where: PWM pin to VCC pin.
VFB_REF = Internal reference voltage 1.22V
8.1.5 Input/output current setting (ILIMx)
RUP and RDWON = Resistor divider at FB connected to VOUT
and AGND. The SC8701 can adjust the current limit of both input side
and output side by resistors at ILIM1 and ILIM2 pins.
8.1.3 Output voltage POWER GOOD indicator (PG)
Control Pins Description
The PG signal indicates VOUT voltage status.
If VOUT voltage remains in between 90% ~ 110% of ILM1 Set the input current limit (IIN_LIM)
programmed voltage, PG pin becomes high impedance and
due to the output pull-up resistor, PG out becomes “H” to ILM2 Set the output current limit(IOUT_LIM)
indicate the output voltage is good.
If VOUT is out of normal voltage range, PG out becomes “L”. The SC8701 senses the input and output current by
monitoring RSNS1 and RSNS2 respectively as below figure
If power good indication is not required, leave PG pin floating. shows.
8.1.4 Real-time output voltage control (PWM)

The SC8701 supports VOUT voltage change by PWM signal
at PWM pin.
The PWM pin accepts a PWM signal in the range of 20kHz
to 100kHz, and its duty cycle can adjust the VOUT voltage.
VOUT output voltage is calculated as:
1 5
VOUT = VOUT_SET×( + ×D)
6 6
Where;
SC8701 DATASHEET
If both VIN and VOUT current limits are programmed, the

VIN
Input current RSNS1 RSNS2 Output current
VOUT
SC8701 controls the current which reaches its current limit
10 mΩ 10 mΩ
first.
+
If the input/output current limit is not required, connect

ILIM1/ILIM2 pin to GND.
RSS1 RSS1' RSS2 RSS2'
1 kΩ CSS1 1 kΩ 1 kΩ CSS2 1 kΩ 8.1.6 Real-Time current control (IPWM)
47 pF 47 pF
The SC8701 is able to control the input/output current

dynamically by applying a PWM signal to IPWM pin.
SNS2P
SNS2N
SNS1N
SNS1P
SC8701
The IPWM signal should be in the range of 20kHz ~ 100kHz,
ILIM2
ILIM1
and the input/output current is proportional to its duty cycle

as:
RILIM1 CILIM1 RILIM2 CILIM2
10 nF 10 nF ILIMx =ILIMx_SET ×D
Where:
Figure 3 Input/output current monitoring circuit ILIMX_SET = ILIMX Input or output current limit value (x=1: input,
x=2: output);
RSNSX is the current sense resistor (x means 1 or 2) at input
/output. The SC8701 monitors the voltage across the sense D = IPWM duty cycle;
resistors RSNSx through RSSX and RSSX’ and calculates the
ILIMx = Target current limit of input/output current.
input and output current. CSSX is the filter capacitor and
typically 47pF is sufficient.
The ILIMx pin is used to set the current limit. Connect the ITUNE pin selects the target which is controlled by IPWM. If
RILIMX resistor between ILIMX pin and GND (or ITUNE pin if input current should be controlled, the resistor at ILIM1
IPWM function is used). should be connected between ILIM1 and ITUNE pins; If
output current should be controlled, the resistor at ILIM2
The current limit is calculated as:
should be connected between ILIM2 and ITUNE pins.
VLIM_REF RSS1
IIN_LIM = × Only one target can be selected by ITUNE pin.
RILIM1 RSNS1
Refer to Figure 2. IPWM real-time input/output current
control.
VLIM_REF RSS2
IOUT_LIM = ×
RILIM2 RSNS2
Where: IPWM
SC8701
VLIM_REF = Internal reference voltage 1.21V; ITUNE
ILIM2
ILIM1
RILIMx = Resistors at ILIMx pin;

RSNSx = Current sense resistors;
RILIM1 CILIM1 RILIM2 CILIM2
RSSx = Resistors between current sense resistor and the 10nF 2.2nF
SC8701 pins (SNSxP, SNSxN).

RSNS1 should be placed between MOSFET and input a. IPWM controls input current, ILIM1 = ILIM1_set x D，as above
capacitor. RSNS2 can be placed either between the MOSFET
and output capacitor or behind the output capacitor.
RSS1 and RSS1’ should have the same value; RSS2 and RSS2’
IPWM
also the same. Typically 1kΩ resistor is used. SC8701
ITUNE
ILIM2
ILIM1
If RSNSx is changed, RSSX/RSSX’ values need to be adjusted

accordingly with below calculation:
RSSx 10 mΩ RILIM1 CILIM1 RILIM2 CILIM2
=
RSNSx 1 kΩ 2.2nF 10nF
For example, If RSNSX is 20mΩ, then RSSX/RSSX’ should be

b. IPWM controls output current，ILIM2 = ILIM2_set x D，as above
2kΩ; if RSNSX is 5mΩ, then RSSX/RSSX’ should be 500Ω.
Figure 2. IPWM real-time input/output current control.
SC8701 DATASHEET
When the IPWM signal is logic high, which means the duty
cycle is 100%, the current limit is then the ILIMx set value.
For the ILIMx pin which is controlled by IPWM signal, its filter
capacitor should still be connected to ground. If the IPWM SC8701
frequency is low, higher capacitance should be applied. For
COMP
example, 22nF capacitor is suggested for 20kHz frequency.
If real-time current control is not required, connect ILIMx
resistor to GND and float IPWM and ITUNE pins. 4.99k
Do not leave IPWM pin float if the ITUNE pin is connected to

one ILIMx resistor; otherwise, the SC8701 cannot operate 47nF
normally.
8.1.7 Dead time setting (DT)

Figure 4 Feedback loop compensation setting
The one of four dead times is selectable by resistor value at
DT pin: 8.1.10 VCC driver voltage
DT resistor Dead time The SC8701 generates driver voltage VCC internally. The
0Ω 20ns VCC is selected higher voltage between VIN and VOUT, and
68kΩ（±10%） 40ns clamped to 10V if it is higher than 10V.
270kΩ（±10%） 60ns The driving signal LDx to drive low side MOSFET (Q2 and
Open 80ns Q3) is directly supplied from VCC; the driving signal HDx to
drive high side MOSFET (Q1 and Q4) is supplied from the
The accuracy of the resistor at DT is allowed ±10%. DT diode in between VCC to BTx pin, which is generated by
does not support the real-time change and new resistor bootstrap circuit with bootstrap capacitor between BTx and
value change will be applied in next turn on. SWx.
When driving large power MOSFET with high CISS value, or

adding driver resistors at LDx or HDx to adjust the MOSFET
turning on/off time, it is suggested to check and change the
dead time to prevent MOSFET shoot-through.
8.1.8 Switching frequency setting (FREQ)

The one of three switching frequency is selectable by
resistor value at FREQ pin:
FREQ resistor Switching frequency fsw
0Ω 200kHz
68kΩ（±10%） 400kHz
Open 600kHz
The accuracy of the resistor at FREQ is allowed ±10%. The

real-time switching frequency change is not valid and new
resistor value change will be applied in next turn on.
8.1.9 Feedback compensation (COMP)

The feedback loop can be compensated by adjusting the
external components to the COMP pin. Typically, the values
in Figure 4 are used. If faster loop response is required, user
can increase the resistor to like 10kOhm or 20kOhm. After
changing the compensation, check and make sure the loop
is stable under the application operation conditions.
SC8701 DATASHEET
9 Application Information causes higher conduction loss. Typically, 10mΩ is

recommended. Resistor value can be adjusted depending on
9.1 Input and output capacitor selection current limit and target power efficiency. If RSNSx valued is
adjusted, related RSSx value should be adjusted
The switching frequency of the SC8701 is in the range of
simultaneously.
200kHz ~ 600kHz. Since MLCC ceramic capacitor has good
high frequency filtering with low ESR, above 60µF X5R or Please refer to 8.1.5 Input/output current setting (ILIMx) for
X7R capacitors with higher voltage rating then operating proper RSNSx and RSSx values. The resistor power rating and
voltage with margin is recommended. For example, if the temperature coefficient should also be considered. The
2
highest operating Vin or Vout voltage is 12V, select at least power dissipation is roughly calculated as P=I R, and I is the
16V capacitor and to secure enough margin, 25V voltage highest current flowing through the resistor. The resistor
rating capacitor is recommended. power rating should be higher than roughly calculated power
dissipation. The resistor value can be varied if the
The high capacitance electrolytic capacitor and tantalum temperature increased and the variation is decided by
capacitor can be used for stable input and output but temperature coefficient along with temperature change. If
capacitor voltage rating should be higher than the highest high accuracy of current limit is required, select lower
operating voltage. When the tantalum capacitor is used, at temperature coefficient resistor as much as possible.
least 1µF ceramic capacitor is placed in parallel. If the
electrolytic capacitor is used, much more ceramic capacitors
9.4 MOSFET selection
are required. For example, if a 47µF electrolytic capacitor is The SC8701 is a synchronous 4-switch buck-boost controller
used, the ceramic capacitors’ capacitance is allowed to and it requires 4 NMOS for power switching circuit.
reduce to 30µF ~ 40µF. Even higher capacitance electrolytic The VDS of MOSFET should be higher than the highest
operating voltage with enough margin (recommend more
capacitor is used, at least 20µF ceramic capacitor is required.
than 10V higher). For example, if the highest operating
voltage is 20V, at least 30V rated VDS MOSFET should be
selected; If the highest operating voltage is 24V, 40V V DS
9.2 Inductor selection voltage rating should be selected.
In the application, if the input and output voltage are higher
For the SC8701 system stability, the inductance of 2.2µH ~ than 10V, driver circuit voltage can reach 10V, and VGS
6.8µH inductor is required. High inductance (4.7µH ~ 6.8µH) voltage rating of MOSFET should be selected higher than
is used in the system where the input voltage and output ±10V.
voltage difference is big, such as 5V Vin and 20V Vout or the
Considering PCB parasitic parameters during operation,
switching frequency is low; Low inductance (2.2µH) is used driver voltage can be higher than VCC due to transient
in the system which the input voltage and output voltage overshoot, and ±20V VGS is recommended to secure
difference is small but high current is required. Typically,
sufficient margin.
3.3µH inductor is recommended. The inductance can be
adjusted for high efficiency and optimization in application. The MOSFET current ID should be higher than the highest
input and output current with enough margin.
The inductor DC resistance value (DCR) affects the
To ensure the sufficient current capability in relatively high
conduction loss of switching regulator, so around 10mΩ
temperature circumstance, the current rate at TA=70˚C or TC
DCR is recommended for the first selection. If the power is
relatively small, high DCR inductor can be selected. But if = 100˚C should be considered. In addition, the power
switch current is high, just like around 10A, then select the dissipation value PD should also be considered and higher
lowest DCR inductor as much as possible because 10mΩ PD is better in applications. Make sure that MOSFET power
DCR also causes 1W power loss. consumption must not exceed PD value.
The inductor saturation current ISAT should be higher than The MOSFET RDS(ON) and input capacitor CISS impact power
input / output current with sufficient margin. efficiency directly. Typically, lower RDS(ON) MOSFET has
higher CISS. The RDS(ON) is related to conduction loss. Higher
RDS(ON) results in higher conduction loss, thus lower
efficiency and higher thermal dissipation; the CISS is related
9.3 Current sense resistor to MOSFET switch on/off time, and longer on/off time results
in higher switching loss and lower efficiency. The proper
The RSNS1 and RSNS2 are current sense resistors and
MOSEFT should be selected based on tradeoff between the
5mΩ ~ 20mΩ resistor value is recommended. RDS(ON) and CISS.
Higher resistor value leads to higher current limit accuracy Normally, if the output power is around 20W ~ 30W, the
but using higher resistor value in high current application MOSFET with around 10mΩ of RDS(ON) and lower than
SC8701 DATASHEET
1000pF of CISS is recommended. If the output power is be monitored. If the dead time is insufficient, adjust dead
increased, the MOSFET with lower RDS(ON) and under time accordingly.
2000pF CISS is recommended. The highest CISS is suggested
not to exceed 3000pF. Q1 Q4
0R 0R
If high CISS MOSFET is selected, the switching on and off HD1 HD2
time become longer, then the dead time should be adjusted
with DT pin to avoid simultaneous turn on for both high side
and low side MOSFETs. NC NC
Q2 Q3
0R 0R
NC NC
9.5 Driver resistor and SWx snubber circuit LD1 LD2
For a convenient adjustment of MOSFET switching time and

transient overshoot at EMI debugging, recommend to add
0603 series resistor between driver pins (LD1, LD2, HD1,
HD2) and MOSFET Gate pins, and add RC snubber (0603) Figure 5 Driver resistor and SWx snubber circuit
circuit at SW1 and SW2 (refer to Figure 5 Driver resistor and The RC snubber circuit is required when the overshoot at
SWx snubber circuit) SWx needs to suppressed. Leave RC snubber circuit as NC
The driver resistor should be placed near to MOSFET Gate at the first time
pin. At first, add 0Ω and adjust the resistor value .
appropriately within 10Ω. After increasing the driver resistor
value, the on time of high side and low side MOSFET should
SC8701 DATASHEET
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QFN32L(0404x0.75-0.40)

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SC8701 DATASHEET

SOUTHCHIP SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO.,LTD SOUTHCHIP CONFIDENTIAL

SC8701 High Efficiency, Synchronous Buck-Boost Controller

under different abnormal conditions.  QFN-32 Package

The SC8701 adopts 32 pin QFN 4x4 package.

Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co.,Ltd

5 Typical Application Circuit

6 Terminal Configuration and Functions

Dead Time selection.

Connect a resistor to set the current limit value of input current.

RLIM1 is the resistor from ILIMT1 to ground or to ITUNE;

Connect a resistor to set the current limit value of output current.

12 ILIM2 I RLIM2 is the resistor from ILIM2 to ground or to ITUNE；

RSNS2 is current sensing resistor. Recommended 5mΩ-20mΩ，typical 10mΩ；

14 AGND IO Analog Ground

15 COMP O Compensation for the control loop.

Feedback for output voltage.

19 VOUT I Output node of the converter.

21 HD2 PWR High side MOSFET gate driver2 output

22 SW2 PWR Switching Node 2

23 LD2 PWR Low side MOSFET gate driver2 output

25 PGND PWR Power Ground

26 LD1 PWR Low side MOSFET gate driver1 output

27 SW1 PWR Switching Node 1

28 HD1 PWR High side MOSFET gate driver1 output

30 VIN I Input node of the converter

MIN MAX UNIT

7.2 Handling Ratings

7.3 Recommended Operating Conditions

VIN Input voltage range 2.7 36 V

VOUT Output voltage range 2 36 V

CIN Input Capacitance 30 µF

COUT Output capacitance 30 µF

L Inductance 2.2 6.8 µH

RSNS1/2 Current Sensing Resistor 5 20 mΩ

fSW Operating frequency range 200 600 kHz

fPWM, fIPWM PWM signal frequency range 20 100 kHz

DPWM, DIPWM PWM signal duty cycle range 0 100 %

TJ Operating junction temperature -40 125 C

7.4 Electrical Characteristic

Input under-voltage lockout Rising edge 2.6 2.7 V

RFREQ = 270kΩ (±10%) 540 600 660 kHz

VOUT_SET = VOUT voltage which is set by FB resistor divider;

The SC8701 features automatic buck, boost mode smooth

8.1 Feature Description

The SC8701 turns on/off by /CE signal. When /CE input is

8.1.4 Real-time output voltage control (PWM)

If both VIN and VOUT current limits are programmed, the

If the input/output current limit is not required, connect

The SC8701 is able to control the input/output current

and the input/output current is proportional to its duty cycle

RILIMx = Resistors at ILIMx pin;

SC8701 pins (SNSxP, SNSxN).

If RSNSx is changed, RSSX/RSSX’ values need to be adjusted

For example, If RSNSX is 20mΩ, then RSSX/RSSX’ should be

Do not leave IPWM pin float if the ITUNE pin is connected to

8.1.7 Dead time setting (DT)

When driving large power MOSFET with high CISS value, or

8.1.8 Switching frequency setting (FREQ)

The accuracy of the resistor at FREQ is allowed ±10%. The