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TR 20201109010112006

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0% found this document useful (0 votes)
19 views1 page

TR 20201109010112006

Uploaded by

ahmed suliman
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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HMAA4GR7AJR8N-VK/WM/XN

Serial Presence Detect


VK T4 WM T4 XN T4
Byte Function described
Function support Function support Function support HEX
0 Number of Serial PD Bytes Written / SPD Device Size SPD Bytes Used : 384 / SPD Bytes Total : 512 23 SPD Bytes Used : 384 / SPD Bytes Total : 512 23 SPD Bytes Used : 384 / SPD Bytes Total : 512 23
1 SPD Revision Rev. 1.2 12 Rev. 1.2 12 Rev. 1.2 12
2 Key Byte / DRAM Device Type DDR4 SDRAM 0C DDR4 SDRAM 0C DDR4 SDRAM 0C
3 Key Byte / Module Type RDIMM 01 RDIMM 01 RDIMM 01
4 SDRAM Density and Banks 4BG/4BK/16Gb 86 4BG/4BK/16Gb 86 4BG/4BK/16Gb 86
5 SDRAM Addressing 17/10 29 17/10 29 17/10 29
6 Primary SDRAM Package Type Flipchip SDP 00 Flipchip SDP 00 Flipchip SDP 00
7 SDRAM Optional Features Unlimited MAC 08 Unlimited MAC 08 Unlimited MAC 08
8 SDRAM Thermal and Refresh Options Reserved 00 Reserved 00 Reserved 00
9 Other SDRAM Optional Features (PPR) hPPR, sPPR supported 60 hPPR, sPPR supported 60 hPPR, sPPR supported 60
10 Secondary SDRAM Package Type Blank 00 Blank 00 Blank 00
11 Module Nominal Volatage, VDD 1.2V 03 1.2V 03 1.2V 03
12 Module Organization 2Rx8 09 2Rx8 09 2Rx8 09
13 Module Memory Bus Width LP/x72 0B LP/x72 0B LP/x72 0B
14 Module Thermal Sensor Termal sensor incorporated 80 Termal sensor incorporated 80 Termal sensor incorporated 80
15 Extended Module Type Reserved 00 Reserved 00 Reserved 00
16 Reserved Blank 00 Blank 00 Blank 00
17 Timebases MTB : 125ps, FTB : 1ps 00 MTB : 125ps, FTB : 1ps 00 MTB : 125ps, FTB : 1ps 00
18 SDRAM Minimum Cycle Time (tCKAVGmin) 0.75ns 06 0.682ns 06 0.625ns 05
19 SDRAM Maximum Cycle Time (tCKAVGmax) 1.6ns 0D 1.6ns 0D 1.6ns 0D
20 CAS Latencies Supported, First Byte 10, 11, 12, 13, 14 F8 10, 11, 12, 13, 14 F8 10, 11, 12, 13, 14 F8
21 CAS Latencies Supported, Second Byte 15, 16, 17, 18, 19, 20 3F 15, 16, 17, 18, 19, 20, 21, 22 FF 15, 16, 17, 18, 19, 20, 21, 22 FF
22 CAS Latencies Supported, Third Byte 00 00 24 02
23 CAS Latencies Supported, Fourth Byte 00 00 00
24 Minimum CAS Latency Time (tAAmin) 13.75ns 6E 13.75ns 6E 13.75ns 6E
25 Minimum RAS to CAS Delay Time (tRCDmin) 13.75ns 6E 13.75ns 6E 13.75ns 6E
26 Minimum RAS to CAS Delay Time (tRPmin) 13.75ns 6E 13.75ns 6E 13.75ns 6E
27 Upper Nibbles for tRASmin and tRCmin 32ns / 45.75ns 11 32ns / 45.75ns 11 32ns / 45.75 11
28 tRASmin, Least Significant Byte 32ns 00 32ns 00 32 00
29 tRCmin, Least Significant Byte 45.75ns 6E 45.75ns 6E 45.75ns 6E
30 tRFC1min, LSB 350ns F0 350ns F0 350ns F0
31 tRFC1min, MSB 350ns 0A 350ns 0A 350ns 0A
32 tRFC2min, LSB 260ns 20 260ns 20 260ns 20
33 tRFC2min, MSB 260ns 08 260ns 08 260ns 08
34 tRFC4min, LSB 160ns 00 160ns 00 160ns 00
35 tRFC4min, MSB 160ns 05 160ns 05 160ns 05
36 Upper Nibble for tFAW 21ns 00 21ns 00 21ns 00
37 tFAWmin LSB 21ns A8 21ns A8 21ns A8
38 tRRD_Smin 3ns 18 2.7ns 16 2.5ns 14
39 tRRD_L min 4.90ns 28 4.90ns 28 4.90ns 28
40 tCCD_Lmin, same bank group 5ns 28 5ns 28 5ns 28
41 tWRmin Upper Nibbles 15ns 00 15ns 00 15ns 00
42 tWRmin 15ns 78 15ns 78 15ns 78
43 tWTRmin Upper Nibbles 2.5ns/7.5ns 00 2.5ns/7.5ns 00 2.5ns/7.5ns 00
44 tWTR_Smin 2.5ns 14 2.5ns 14 2.5ns 14
45 tWTR_Lmin 7.5ns 3C 7.5ns 3C 7.5ns 3C
46~59 Reserved Blank 00 Blank 00 Blank 00
60 Connector to SDRAM Bit Mapping DQ0-3 0C DQ0-3 0C DQ0-3 0C
61 Connector to SDRAM Bit Mapping DQ4-7 2C DQ4-7 2C DQ4-7 2C
62 Connector to SDRAM Bit Mapping DQ8-11 0C DQ8-11 0C DQ8-11 0C
63 Connector to SDRAM Bit Mapping DQ12-15 2C DQ12-15 2C DQ12-15 2C
64 Connector to SDRAM Bit Mapping DQ16-19 0C DQ16-19 0C DQ16-19 0C
65 Connector to SDRAM Bit Mapping DQ20-23 2C DQ20-23 2C DQ20-23 2C
66 Connector to SDRAM Bit Mapping DQ24-27 0C DQ24-27 0C DQ24-27 0C
67 Connector to SDRAM Bit Mapping DQ28-31 2C DQ28-31 2C DQ28-31 2C
68 Connector to SDRAM Bit Mapping CB0-3 0C CB0-3 0C CB0-3 0C
69 Connector to SDRAM Bit Mapping CB4-7 2C CB4-7 2C CB4-7 2C
70 Connector to SDRAM Bit Mapping DQ32-35 0C DQ32-35 0C DQ32-35 0C
71 Connector to SDRAM Bit Mapping DQ36-39 2C DQ36-39 2C DQ36-39 2C
72 Connector to SDRAM Bit Mapping DQ40-43 0C DQ40-43 0C DQ40-43 0C
73 Connector to SDRAM Bit Mapping DQ44-47 2C DQ44-47 2C DQ44-47 2C
74 Connector to SDRAM Bit Mapping DQ48-51 0C DQ48-51 0C DQ48-51 0C
75 Connector to SDRAM Bit Mapping DQ52-55 2C DQ52-55 2C DQ52-55 2C
76 Connector to SDRAM Bit Mapping DQ56-59 0C DQ56-59 0C DQ56-59 0C
77 Connector to SDRAM Bit Mapping DQ60-63 2C DQ60-63 2C DQ60-63 2C
78~116 Reserved Blank 00 Blank 00 Blank 00
117 Fine offset for tCCD_Lmin, same bank group 5ns 00 5ns 00 5ns 00
118 tRRD_L min offset 4.90ns 9C 4.90ns 9C 4.90ns 9C
119 tRRD_Smin offset 3.0ns 00 2.7ns CE 2.5ns 00
120 Fine offset for tRCmin 45.75ns 00 45.75ns 00 45.75ns 00
121 Fine offset for tRPmin 13.75ns 00 13.75ns 00 13.75ns 00
122 Fine offset for tRCDmin 13.75ns 00 13.75ns 00 13.75ns 00
123 Fine offset for tAAmin 13.75ns 00 13.75ns 00 13.75ns 00
124 Fine offset for tCKAVGmax 1.6ns E7 1.6ns E7 1.6ns E7
125 Fine offset for tCKAVGmin 0.75ns 00 0.682ns BC 0.625ns 00
126 CRC for Base Configuration Section, LSB CRC cover 0~125 byte AB CRC cover 0~125 byte 7B CRC cover 0~125 byte 9F
127 CRC for Base Configuration Section, MSB CRC cover 0~125 byte 5C CRC cover 0~125 byte 42 CRC cover 0~125 byte 00
128 RC Extention, Module Nominal Height 31 31 31
129 Module Maximum Thickness 1.2/1.4 11 1.2/1.4 11 1.2/1.4 11
130 Reference Raw Card Used E4 64 E4 64 E4 64
131 DIMM Module Attributes DDR4RCD02, 1rows, 1register 15 DDR4RCD02, 1rows, 1register 15 DDR4RCD02, 1rows, 1register 15
132 RDIMM Thermal Heat Spreader Solution Not incorporated 00 Not incorporated 00 Not incorporated 00
133 Register Manufacturer ID Code, LSB Montage 86 Montage 86 Montage 86
134 Register Manufacturer ID Code, MSB Montage 32 Montage 32 Montage 32
135 Register Revision Number H1 D1 H1 D1 H1 D1
136 Address Mapping from Register to DRAM Mirrored 01 Mirrored 01 Mirrored 01
137 Register Output Drive Strength for Control Light/Str/Light/Light 10 Light/Str/Light/Light 10 Light/Str/Light/Light 10
138 Register Output Drive Strength for Clock Light/Light 40 Light/Light 40 Light/Light 40
139 Reserved Blank 00 Blank 00 Blank 00
140~154 Reserved Blank 00 Blank 00 Blank 00
155~253 Reserved Blank 00 Blank 00 Blank 00
254 CRC for Module Specific Section, LSB CRC cover 128~253 byte E0 CRC cover 128~253 byte E0 CRC cover 128~253 byte E0
255 CRC for Module Specific Section, MSB CRC cover 128~253 byte 68 CRC cover 128~253 byte 68 CRC cover 128~253 byte 68
256~319 Reserved Blank 00 Blank 00 Blank 00
320 Module Manufacturer's ID Code, LSB SK hynix 80 SK hynix 80 SK hynix 80
321 Module Manufacturer's ID Code, MSB SK hynix AD SK hynix AD SK hynix AD
322 Module Manufacturing Location SK hynix 01 SK hynix 01 SK hynix 01
323 Module Manufacturing Date Variable 00 Variable 00 Variable 00
324 Module Manufacturing Date Variable 00 Variable 00 Variable 00
325~328 Module Serial Number Undefined 00 Undefined 00 Undefined 00
329 Module Part Number H 48 H 48 H 48
330 Module Part Number M 4D M 4D M 4D
331 Module Part Number A 41 A 41 A 41
332 Module Part Number 16Gb 41 16Gb 41 16Gb 41
333 Module Part Number 32GB 34 32GB 34 32GB 34
334 Module Part Number 32GB 47 32GB 47 32GB 47
335 Module Part Number RDIMM 52 RDIMM 52 RDIMM 52
336 Module Part Number LP/x72 37 LP/x72 37 LP/x72 37
337 Module Part Number A die 41 A die 41 A die 41
338 Module Part Number Flipchip SDP 4A Flipchip SDP 4A Flipchip SDP 4A
339 Module Part Number Lead & Halogen Free 52 Lead & Halogen Free 52 Lead & Halogen Free 52
340 Module Part Number x8 38 x8 38 x8 38
341 Module Part Number Commercial Temp & 1.2V 4E Commercial Temp & 1.2V 4E Commercial Temp & 1.2V 4E
342 Module Part Number - 2D - 2D - 2D
343 Module Part Number 2666V 56 2933Y 57 3200AA 58
344 Module Part Number 2666V 4B 2933Y 4D 3200AA 4E
345 Module Part Number Blank Space 20 Blank Space 20 Blank Space 20
346 Module Part Number Blank Space 20 Blank Space 20 Blank Space 20
347 Module Part Number Blank Space 20 Blank Space 20 Blank Space 20
348 Module Part Number Blank Space 20 Blank Space 20 Blank Space 20
349 Module Revision Code Revision 0 00 Revision 0 00 Revision 0 00
350 DRAM Manufacturer's ID code, LSB SK hynix 80 SK hynix 80 SK hynix 80
351 DRAM Manufacturer's ID code, MSB SK hynix AD SK hynix AD SK hynix AD
352 DRAM Stepping Undefined FF Undefined FF Undefined FF
353~381 Module Manufacturer's Specific Data 00 00 00
382 Reserved Blank 00 Blank 00 Blank 00
383 Reserved Blank 00 Blank 00 Blank 00
384~511 End User Programmable 00 00 00

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