MBKM Hasil Akhir_Elysa Umiati
MBKM Hasil Akhir_Elysa Umiati
MBKM Hasil Akhir_Elysa Umiati
RESEARCH INTERNSHIP IN
TAIWAN EXPERIENCE EDUCATION PROGRAM (TEEP)
NATIONAL TAIWAN UNIVERSITY
ELYSA UMIATI
21/476555/PA/20580
Supervisor:
Prof. Indriana Kartini, S.Si., M.Si., Ph.D.
1 9690421 199803 2 002
DEPARTMENT OF CHEMISTRY
FACULTY OF MATHEMATICS AND NATURAL SCIENCES
UNIVERSITAS GADJAH MADA
YOGYAKARTA
2024
RESEARCH INTERNSHIP PROPOSAL
TAIWAN EXPERIENCE EDUCATION PROGRAM (TEEP)
NATIONAL TAIWAN UNIVERSITY
ELYSA UMIATI
21/476555/PA/20580
Supervisor:
Prof. Indriana Kartini, S.Si., M.Si., Ph.D.
1 9690421 199803 2 002
DEPARTMENT OF CHEMISTRY
FACULTY OF MATHEMATICS AND NATURAL SCIENCES
UNIVERSITAS GADJAH MADA
YOGYAKARTA
2024
RATIFICATION PAGE
Supervisor, Student,
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PREFACE
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TABLE OF CONTENTS
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FIGURE CAPTIONS
vi
GROWTH AND ATOM-RESOLVED STUDIES OF 2D TRANSITION
METAL DICHALCOGENIDES: FOCUSING ON TIS2 THIN FILMS AND
TIS2/TISE2 HETEROSTRUCTURES
Elysa Umiati
21/476555/PA/20580
ABSTRACT
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CHAPTER 1
INTRODUCTION
1.1 Background
Recently, there have been many research break throughs in two-dimensional (2D)
materials including graphene, boron nitride (h-BN), black phosphors (BPs), and transition-
metal dichalcogenides (TMDCs). The unique electrical, optical, and thermal properties in
2D materials are associated with their strictly defined low dimensionalities. These materials
provide a wide range of basic building blocks for next-generation electronics (Choi et al.,
2022). Graphene has been unambiguously produced and identified, soon causing a boom in
global research on 2D materials. Graphene shows great potential in electronics, composites,
and catalyst due to its great conductivity, high electron mobility, and high surface area.
According to quantum mechanics, finite-size effects have been theoretically predicted and
experimentally confirmed. Many studies have utilized a new type of graphene nanostructure,
graphene quantum dots (GQDs), whose sizes are smaller than 100 nm (Wang and Lu, 2015).
Transition metal dichalcogenides (TMDCs) is 2D layered semiconductor materials
with a chemical bond within an in-plane structure and an attraction by Van der Waals force
between layers, have attracted much attention in recent years. For example are the
molybdenum disulfide (MoS2), tungsten disulfide (WS2), molybdenum diselenide (MoSe2),
and tungsten diselenide (WSe2) are noted for their low cost, abundance, and easy processing.
Two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as a class of
materials with unique electronic, optical, and catalytic properties, making them promising
candidates for various applications in nanoelectronics, optoelectronics, and energy
conversion. Among these materials, titanium disulfide (TiS2) and its heterostructures, such
as TiS2/TiSe2, have garnered significant interest due to their intriguing charge density wave
(CDW) phenomena, electronic properties, and potential for catalytic applications.
Meanwhile, 2D materials with a high surface area and high conductivity have also attracted
much attention in recent years. There is a transformation from indirect bandgap to direct
bandgap when 2D materials are stripped from bulk ones to monolayers. Studies have shown
that 2D materials show promise in catalyst and energy storage because of their unique
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properties and structure. Similar for graphene, in bulk transition metal dichalcogenides
(TMDs) adjacent layers are bonded through Van der Waals interactions. This bonding
characteristic facilitates the separation of TMDs into monolayer and few-layer crystals using
various methods. These methods include mechanical exfoliation with Scotch tape, Molecular
Beam Epitaxy (MBE), and chemical vapor deposition (CVD). The synthesis of atomically
thin, large-scale TMDs is crucial for unlocking their novel properties and advancing their
application in various fields (Regan et al.,2022). Electronic band gaps are crucial in
determining a materials conductivity and optical properties influencing the performance of
semiconductor devices in fields like electronics and optoelectronics. Wide bandgap materials
facilitate the development of smaller, faster, and more efficient electronic components. Two-
dimensional TMDCs have become key in various applications, ranging from nanoelectronics
to sensing, due to their unique bandgap properties and structural versatility (Chaves et al.,
2020).
The upcoming proposed research internship at National Taiwan University, focused
on “Growth and Atom-resolved Studies of 2D Transition Metal Dichalcogenides,” will
further explore these TMDCs involve synthesizing and analysing ultrathin films of these
TMDCs. This project will utilize techniques such as atomic force microscopy, Raman
spectroscopy, X-ray Diffraction, and Scanning Tunneling Microscopy. This research
internship conducted by the Taiwan Experience Education Program (TEEP). This program
is a prestigious and comprehensive initiative by the Taiwan government, aimed at fostering
global talent and promoting international educational and cultural exchange. This program
offers a unique opportunity for international students and professionals to engage in
internships and educational experiences across various sectors in Taiwan. TEEP also allows
international students to gain an in-depth educational experience in Taiwan while also
preparing themselves for the Asian job market.
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materials science, and engineering. This collaborative approach enables the Center to stay at
the forefront of research and technological development in condensed matter sciences.
Currently, the CCMS have 12 regular research faculty members, 7 additional faculty
members through joint appointments, 2 NSC research scholars, more than 20 postdoctoral
associates, and over 100 graduate students and assistants. The research work at CCMS has
been focused in the following two areas which is emergent materials and advances devices
and spectro-microscopy.
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CHAPTER 2
LITERATURE REVIEW AND HYPOTHESIS
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materials, including adjustable electronic structures, optical transparency, peak
electrostatic efficiency, and heightened sensor sensitivity, render them highly suitable
for diverse technological uses. The weak Van der Waals interactions between layers
in these materials facilitate the creation of high-quality, atomically precise
heterostructures. This section aims to highlight the key applications of TMD-based
heterostructures, particularly in fields like optoelectronics, sensors, photovoltaic
systems, and energy devices (Joseph et al., 2023).
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an alternative to organic HTLs. The electrochemical deposition of TiS2 thin films
holds significant promises owing to its facile, versatile, scalable, and low-cost
potential. The electrodeposition of thin films of semiconductors has mostly been
conducted in either aqueous or organic electrolyte medium that often has concerns
such as corrosion, oxidation, toxicity, and high cost. The as-deposited films exhibited
highly crystalline structure formed with preferred crystallographic orientation
confirming film growth predominantly in the hexagonal (2H) TiS2 phase (Asif et al.,
2020).
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CHAPTER 3
RESEARCH METHODS
3.1 Materials
The material that using in this research methods were sulfur guns, titanium powder,
selenium powder, HOPG sample, aluminium foil, IPA, and acetone. Liquid nitrogen was
used for Low Temperature Scanning Tunneling Microscopy (LTSTM). And Nitrogen air was
used for the suitcase.
3.2 Equipment
The equipment that using in this research methods were sample plate, tantalum foil,
spot welding gun, plastic point tweezers, ultrasonicator were used for preparation of the
MBE sample. K-type thermocouple, microprocessor thermometer, Sulfur gun with filament,
Titanium gun with filament, regulated power supply, and MBE instrument were used for
MBE process. Stainless Tube, Tungsten wire, beakers, tip holder, suitcase, gasket, and a
multimeter were used for STM preparation. Softwares of XPMPro2 SPM was used for
LTSTM imaging.
3.3 Procedures
3.3.1 Preparation of STM Tip Etching
The process for preparing and etching STM tips begins with wearing gloves
and regularly cleaning them with IPA or methanol. All beakers and tweezers must be
thoroughly cleaned. The Tungsten wire is straightened using sandpaper, and a fresh
piece is cut, with the polished side made flat to prevent cracks from spreading. The
Tungsten wire is then crimped into a steel tube, ensuring that the exposed part is
symmetrical and untouched on both sides. The tip holder is attached to the etching
holder, and the tip-SS tube is positioned correctly for spot welding in three to four
areas, with the energy set to 7.0. It is crucial to ensure that the tip and the ground of
the tip holder do not touch, verified using a multi-meter. The length for surface and
the tip max for the 5 mm.
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a) b)
Figure 3. (a) cracked polished tungsten wire (b) normal polished tungsten
wire
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a) b) c)
Figure 6. (a) good tip ; (b) bad tip, not sharp ; (c) bad tip, too long
The good tip should be store for some time. The tip was inserted into a
plastic tube, which was then placed inside a bell jar connected to a vacuum pump.
After activating the pressure panel to display the pressure inside both the bell
jar and the pump pipe, the valve was briefly opened and closed to introduce a
controlled amount of air. This process was repeated, and the O-ring seal was
carefully detached and then reattached to ensure that the introduction of air into the
system was gradual. Once the O-ring valve was securely reattached, the bell jar
was ready to get opened. The plastic tube containing the tip was placed inside the
bell jar, which was then sealed by adjusting and pressing the rubber seal under the
jar’s glass to ensure a tight fit. Subsequently, the vacuum pump was activated, and
the bell jar was gently tapped and adjusted to help achieve a complete seal. The
pressure was monitored until it reached zero. Upon completion of the process, the
valve was closed, and the pump was turned off.
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3.3.2 Mounting the HOPG Sample into Sample Plate
The preparation and mounting of Highly Oriented Pyrolytic
Graphite (HOPG) onto a sample plate involve several meticulous steps to
ensure a clean and stable sample for analysis. First, the sample plate must
be thoroughly cleaned with isopropanol or acetone, rinsed with deionized
water, and dried with nitrogen to remove contaminants.
a) b)
Figure 8. (a) uncleaved sample plate (b) cleaved sample
The HOPG sample is then prepared by cleaving it with adhesive tape
to expose a fresh surface, handling it with clean tweezers to avoid
contamination. The HOPG is mounted using a small piece of tantalum foil
and conductive adhesive, ensuring the cleaved surface faces up and is
properly aligned. The adhesive is allowed to dry or cure according to the
manufacturer’s instructions to ensure stability.
a) b)
Figure 9. a) wielding process b) The welding % energy required
A final inspection using an optical microscope is conducted to
confirm the surface is clean and free from debris. If necessary, additional
cleaving and cleaning are performed until a smooth, defect-free surface is
achieved, ready for high-quality analysis.
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Figure 10. Cleaved HOPG under Microscope
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conditions to ensure a consistent sulfur supply. Titanium deposition was
carefully controlled with the source set at 0.5 mA, under voltage settings
below 6 A and 2 kV. Sulfur source management maintained a vapor pressure
of 1.2 x 10⁻⁸ Torr, ensuring proper stoichiometry and layer quality. The TiS2
(1.3 ML) growth was completed over 26 minutes, with continuous
monitoring and adjustments to maintain optimal conditions, ensuring
uniform and high-quality deposition.
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atomic steps, defects, and atom arrangements, essential for assessing layer
quality and identifying structural imperfections. Additionally, by varying
the bias voltage and recording the tunneling current, STM can measure the
local density of states, providing insights into the electronic properties of
the material. Analysis of STM data involves interpreting topographical
images and electronic measurements to understand the material’s properties.
For TiS2 and TiSe2 heterostructures grown in MBE, STM can reveal
stacking order, interface quality, and electronic interactions. This detailed
analysis is crucial for optimizing growth parameters and improving material
quality. The Scanning Tunneling Microscopy (STM) analysis of the sample
provided by your collaborators in France that from my analysis.
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CHAPTER 4
RESULT AND DISCUSSION
4.1 Result
4.1.1 TiS2 Thin Film Imaging through LT STM
TiS2 thin film was produced with Molecular Beam Epitaxy (MBE)
with the Ti flux was set at 1nA. The obtained TiS2 was produced at 1.3
monolayer. The TiS2 Thin Film was analyzed using LT STM that operated
with a Tungsten tip at 78K.
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4.1.3 Charge Density Wave of TiS2 from the Fourier Transform
TiS2 1.3 monolayer using Scanning Tunneling Microscopy (STM)
and Fourier Transform (FT) techniques to identify and characterize the
Charge Density Wave (CDW) phenomena within the material. CDWs are
periodic modulations of the electronic charge density that occur due to
strong electron-phonon interactions, and they play a crucial role in
determining the electronic properties of materials.
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4.2 Discussion
4.2.1 Analysis of TiS2 Thin Film and TiS2/TiSe2 Heterostructure
The STM image analysis of TiS₂ thin films reveals a well-ordered
lattice structure with a lattice constant of approximately 4.8 Å. This value is
slightly larger than the lattice constant reported for bulk TiS₂, which could
be due to strain effects or the thin film synthesis process. The high-
resolution imaging confirms the crystalline quality of the thin films, with
minimal defects and uniform atomic distribution. The comparison with the
findings of Fang et al., (1997) supports the reliability of our measurements
and the structural integrity of the TiS₂ thin films. The slight increase in
lattice constant might be attributed to the thin film's unique environment,
where strain and surface effects can play a significant role. These findings
are crucial for understanding the material’s properties and potential
applications in nanoelectronics and optoelectronic devices.
a) b)
Figure 17. Hexagonal Structure of (a) TiS2 thin film and (b)
Heterostructure
The STM image from our research reveals a well-ordered atomic
arrangement with a lattice constant of approximately 4.2 Å for the
TiS₂/TiSe₂ heterostructure. This finding aligns with the minimal lattice
mismatch reported by Duong et al., (2017), which is essential for forming
stable heterostructures. The close match in lattice constants between TiS₂
(approximately 3.40 Å) and TiSe₂ (approximately 3.54 Å) supports the
observed stability and periodicity in our STM image. The consistency
between our experimental results and the literature underscores the
reliability of our methods and the structural integrity of the TiS₂/TiSe₂
heterostructure. The minimal lattice mismatch facilitates the seamless
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stacking of layers, preserving the unique properties of each constituent
material. This structural integrity is crucial for potential applications in
nanoelectronics and optoelectronic devices, where maintaining the distinct
electronic characteristics of each layer is necessary for device performance.
a) b)
Figure 18. Defect Analysis for (a) 2D and (b) 3D Visualization of
the TiS₂/TiSe₂ Heterostructure
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Meanwhile this 2D of the TiS₂ thin film at the atomic level, revealing
a well-ordered crystalline surface characterized by a regular lattice
structure. However, several darker spots and irregularities are visible, likely
corresponding to vacancies where Ti or S atoms are missing, or to adsorbed
impurities on the surface. Such defects disrupt electronic uniformity and
create localized states within the bandgap, affecting the film’s overall
electronic properties. The 3D STM visualization offers a comprehensive
view of the surface topography of the TiS₂ thin film. The undulating pattern
indicates the presence of step edges and terraces, typical features in layered
materials like TiS₂. The observed protrusions and depressions correspond to
atomic-scale defects such as vacancies or interstitials. These defects
significantly impact the film's structural integrity and electronic behavior,
as step edges and terraces scatter charge carriers, while vacancies and
interstitials introduce trap states, influencing the film's conductivity and
carrier mobility.
a) b)
Figure 19. Defect Analysis for (a) 2D and (b) 3D Visualization of
the TiS₂ Thin Film
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minimal high-frequency disturbances. Additionally, the log-log PSD plot
reveals a linear decay, indicative of scale-invariant features and fractal-like
behavior in the CDW, implying self-similar patterns across different length
scales.
a) b)
Figure 20. (a) Log. Scales and (b) Linear scales of PSD Curve
The low-frequency peak in the PSD plot indicates a stable CDW
with well-defined periodicity, essential for understanding the electronic
structure of the heterostructure. The amplitude of this peak reflects the
strength of charge density modulations; a higher amplitude signifies a more
pronounced CDW, which can influence the electronic band structure and
potentially open gaps at the Fermi surface. The sharp decline in PSD values
at higher frequencies suggests a stable CDW, free from high-frequency
disturbances, which is crucial for maintaining consistent electronic
properties and reducing scattering events. The linear decay in the log-log
PSD plot further suggests the CDW’s fractal nature, enhancing its stability
and resilience against external perturbations.
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The significant peaks near -2 to 0 1/nm in the PSD plot indicate strong
periodic modulations in the charge density, characteristic of a well-formed
Charge Density Wave (CDW). These high amplitude peaks highlight the
robustness and stability of the CDW within the TiS₂/TiSe₂ heterostructure.
Additionally, the relatively low amplitude in the region from -16 to -3 1/nm
suggests minimal background noise, reinforcing the presence of a well-
defined CDW signal. This low noise level indicates that the observed CDW
is not significantly disrupted by extraneous factors, ensuring a clear and
distinct modulation pattern.
The PSD analysis from the FT results highlights the stability and
properties of the CDW in the TiS₂/TiSe₂ heterostructure. The prominent
low-frequency peak and the linear decay in the log-log plot indicate a stable,
well-defined CDW with fractal-like behavior. These characteristics suggest
that the CDW in this heterostructure is robust and significantly influences
the electronic properties, enhancing the material’s potential for advanced
electronic applications. Understanding these correlations is essential for
optimizing the heterostructure’s performance and tailoring its properties for
specific uses.
4.2.3.2 TiS2 Thin Film
The FT plot of TiS₂ thin films reveals significant peaks at low
frequencies (0 to 2 1/nm), indicating strong periodic modulations in the
charge density characteristic of a well-formed Charge Density Wave
(CDW). The highest amplitude peak near 1 1/nm suggests a dominant
periodicity in the CDW, corresponding to the real-space wavelength of the
charge density modulation. Additionally, the relatively low amplitude
beyond 2 1/nm indicates minimal background noise, reinforcing the
presence of a well-defined CDW signal with smooth FT amplitude decline
at higher frequencies, suggesting a CDW characterized mainly by low-
frequency components with minimal high-frequency disturbances.
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Figure 22. TiS2 Thin Film analyzed form Fourier Transform
The PSD vs. frequency plot further confirms these findings with a
prominent peak at low frequencies (around 0.1 Å⁻¹), reflecting strong
periodic modulations in the charge density. The rapid decline in PSD values
beyond this peak suggests that the CDW is characterized by long-
wavelength modulations, with minimal high-frequency noise. The log-log
PSD plot shows a linear decay, indicating scale-invariant features and
fractal-like behavior in the CDW, with self-similar patterns across different
length scales.
a) b)
Figure 23. (a) Log. Scales and (b) Linear scales of PSD Curve
These analyses highlight that the CDW in TiS₂ thin films is stable
and well-defined, with significant low-frequency peaks and minimal high-
frequency noise. The high amplitude of the low-frequency peaks suggests
strong charge density modulations, which stabilize the CDW and enhance
electron mobility and overall material conductivity by reducing electronic
scattering. The fractal nature of the CDW, as indicated by the linear decay
in the log-log PSD plot, suggests robustness and resilience against external
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perturbations, making TiS₂ thin films promising for advanced electronic
applications.
4.2.4 Doping Effect of CDW between TiS2 Thin Film and TiS2/TiSe2
Heterostructure
Doping significantly impacts the Charge Density Wave (CDW)
stability and properties in TiS₂ thin films and TiS₂/TiSe₂ heterostructures. In
TiS₂ thin films, doping can introduce localized impurity states that either
stabilize the CDW by pinning it or disrupt it, depending on the type and
concentration of dopants. In TiS₂/TiSe₂ heterostructures, doping can modify
interlayer interactions, enhancing or destabilizing the CDW. By altering
carrier concentration and introducing lattice strain, doping affects electronic
properties, potentially shifting the Fermi level and modifying the CDW gap.
Overall, controlled doping can optimize the material’s electronic and
structural characteristics for advanced applications.
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CHAPTER 5
OBSTACLES AND FUTURE WORK
5.1 Obstacles
Conducting research on the growth and atom-resolved studies of TiS2 thin
films and TiS2/TiSe2 heterostructures using MBE and STM involves several
obstacles. Precise control over MBE growth parameters and ensuring high-quality
interfaces in heterostructures are challenging, as small variations can significantly
impact crystal quality and electronic properties. Achieving atomic resolution with
STM requires ultra-clean surfaces and stable conditions, necessitating meticulous
sample preparation. Consistently reproducing doped samples and accurately
characterizing CDW phenomena under varying conditions further complicate the
research. While advanced tools like RHEED, XPS, SIMS, and ARPES can help,
they require specialized knowledge, high costs, and complex setups, highlighting
the balance between technological capabilities and practical constraints.
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cell technology particularly for high-specific-power applications in emerging
technologies (Dallaev et al., 2023)
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