pico-2-w-datasheet
pico-2-w-datasheet
pico-2-w-datasheet
Colophon
© 2024 Raspberry Pi Ltd
This documentation is licensed under a Creative Commons Attribution-NoDerivatives 4.0 International (CC BY-ND).
build-date: 2024-11-26
build-version: d912d5f-clean
RPL reserves the right to make any enhancements, improvements, corrections or any other modifications to the
RESOURCES or any products described in them at any time and without further notice.
The RESOURCES are intended for skilled users with suitable levels of design knowledge. Users are solely responsible for
their selection and use of the RESOURCES and any application of the products described in them. User agrees to
indemnify and hold RPL harmless against all liabilities, costs, damages or other losses arising out of their use of the
RESOURCES.
RPL grants users permission to use the RESOURCES solely in conjunction with the Raspberry Pi products. All other use
of the RESOURCES is prohibited. No licence is granted to any other RPL or other third party intellectual property right.
HIGH RISK ACTIVITIES. Raspberry Pi products are not designed, manufactured or intended for use in hazardous
environments requiring fail safe performance, such as in the operation of nuclear facilities, aircraft navigation or
communication systems, air traffic control, weapons systems or safety-critical applications (including life support
systems and other medical devices), in which the failure of the products could lead directly to death, personal injury or
severe physical or environmental damage ("High Risk Activities"). RPL specifically disclaims any express or implied
warranty of fitness for High Risk Activities and accepts no liability for use or inclusions of Raspberry Pi products in High
Risk Activities.
Raspberry Pi products are provided subject to RPL’s Standard Terms. RPL’s provision of the RESOURCES does not
expand or otherwise modify RPL’s Standard Terms including but not limited to the disclaimers and warranties
expressed in them.
Table of contents
Colophon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Legal disclaimer notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1. About Pico 2 W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1. Raspberry Pi Pico 2 W design files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Mechanical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Pico 2 W pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2. Surface-mount footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.1. Keep-out area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3. Applications information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1. Programming the flash. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2. General purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3. Using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4. Powerchain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.5. Powering Raspberry Pi Pico 2 W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.6. Using a battery charger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.7. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.8. Wireless interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9. Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Appendix A: Availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Appendix B: Pico 2 W component locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Appendix C: Mean Time Between Failure (MTBF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Documentation Release History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
25 November 2024. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table of contents 2
Raspberry Pi Pico 2 W Datasheet
Figure 1. The
Raspberry Pi Pico 2 W
board.
Raspberry Pi Pico 2 W has been designed to be a low cost yet flexible development platform for RP2350, with a 2.4GHz
wireless interface and the following key features:
• External Quad-SPI flash with eXecute In Place (XIP) and 16kB on-chip cache
• High performance full-crossbar bus fabric
• On-board USB1.1 (device or host)
• 30 multi-function general purpose I/O (four can be used for ADC)
◦ 1.8-3.3V I/O voltage
• 12-bit 500ksps analogue to digital converter (ADC)
• Various digital peripherals
◦ 2 × UART, 2 × I2C, 2 × SPI, 24 × PWM channels, 1× HSTX peripheral
◦ 1 × timer with 4 alarms, 1 × AON Timer
• 3 × programmable I/O (PIO) blocks, 12 state machines in total
◦ Flexible, user-programmable high-speed I/O
◦ Can emulate interfaces such as SD card and VGA
NOTE
Raspberry Pi Pico 2 W provides a minimal yet flexible external circuitry to support the RP2350 chip: flash memory
(Winbond W25Q16JV), crystal (Abracon ABM8-272-T3), power supplies and decoupling, and USB connector. The
majority of the RP2350 microcontroller pins are brought to the user I/O pins on the left and right edge of the board. Four
RP2350 I/O are used for internal functions: driving an LED, on-board switch mode power supply (SMPS) power control,
and sensing the system voltages.
Pico 2 W has an on-board 2.4GHz wireless interface using an Infineon CYW43439. The antenna is an onboard antenna
licensed from Abracon (formerly ProAnt). The wireless interface is connected via SPI to the RP2350.
Pico 2 W has been designed to use either soldered 0.1-inch pin-headers (it is one 0.1-inch pitch wider than a standard
40-pin DIP package), or to be positioned as a surface-mountable 'module', as the user I/O pins are also castellated.
There are SMT pads underneath the USB connector and BOOTSEL button, which allow these signals to be accessed if used
as a reflow-soldered SMT module.
Raspberry Pi Pico 2 W uses an on-board buck-boost SMPS which is able to generate the required 3.3V (to power
RP2350 and external circuitry) from a wide range of input voltages (~1.8 to 5.5V). This allows significant flexibility in
powering the unit from various sources, such as a single lithium-ion cell, or three AA cells in series. Battery chargers can
also be very easily integrated with the Pico 2 W powerchain.
Reprogramming the Pico 2 W flash can be done using USB (simply drag and drop a file onto the Pico 2 W, which
appears as a mass storage device), or the standard serial wire debug (SWD) port can reset the system and load and run
code without any button presses. The SWD port can also be used to interactively debug code running on the RP2350.
The Getting started with Raspberry Pi Pico-series book walks through loading programs onto the
board, and shows how to install the C/C++ SDK and build the example C programs. See the Raspberry
Pi Pico-series Python SDK book to get started with MicroPython, which is the fastest way to get code
running on Pico 2 W.
Layout The CAD files, including PCB layout, can be found here. Note that Pico 2 W was designed in
Cadence Allegro PCB Editor, and opening in other PCB CAD packages will require an import script
or plugin.
STEP 3D A STEP 3D model of Raspberry Pi Pico 2 W, for 3D visualisation and fit-check of designs which
include Pico 2 W as a module, can be found here.
Fritzing A Fritzing part for use in e.g. breadboard layouts can be found here.
Permission to use, copy, modify, and/or distribute this design for any purpose with or without fee is hereby granted.
THE DESIGN IS PROVIDED "AS IS" AND THE AUTHOR DISCLAIMS ALL WARRANTIES WITH REGARD TO THIS DESIGN
INCLUDING ALL IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS. IN NO EVENT SHALL THE AUTHOR BE
LIABLE FOR ANY SPECIAL, DIRECT, INDIRECT, OR CONSEQUENTIAL DAMAGES OR ANY DAMAGES WHATSOEVER
RESULTING FROM LOSS OF USE, DATA OR PROFITS, WHETHER IN AN ACTION OF CONTRACT, NEGLIGENCE OR
OTHER TORTIOUS ACTION, ARISING OUT OF OR IN CONNECTION WITH THE USE OR PERFORMANCE OF THIS DESIGN.
Figure 3. The
dimensions of the
Pico 2 W
NOTE
The physical pin numbering is shown in Figure 4. For pin allocation see Figure 2.
A few RP2350 GPIO pins are used for internal board functions:
GPIO25 OP wireless SPI CS - when high also enables GPIO29 ADC pin to read VSYS
WL_GPIO1 OP controls the on-board SMPS power save pin (Section 3.4)
Apart from GPIO and ground pins, there are seven other pins on the main 40-pin interface:
PIN40 VBUS
PIN39 VSYS
PIN37 3V3_EN
PIN36 3V3
PIN35 ADC_VREF
PIN33 AGND
PIN30 RUN
VBUS is the micro-USB input voltage, connected to micro-USB port pin 1. This is nominally 5V (or 0V if the USB is not
connected or not powered).
VSYS is the main system input voltage, which can vary in the allowed range 1.8V to 5.5V, and is used by the on-board
SMPS to generate the 3.3V for the RP2350 and its GPIO.
3V3_EN connects to the on-board SMPS enable pin, and is pulled high (to VSYS) via a 100kΩ resistor. To disable the
3.3V (which also de-powers the RP2350), short this pin low.
3V3 is the main 3.3V supply to RP2350 and its I/O, generated by the on-board SMPS. This pin can be used to power
external circuitry (maximum output current will depend on RP2350 load and VSYS voltage; it is recommended to keep
the load on this pin under 300mA).
ADC_VREF is the ADC power supply (and reference) voltage, and is generated on Pico 2 W by filtering the 3.3V supply.
This pin can be used with an external reference if better ADC performance is required.
AGND is the ground reference for GPIO26-29. There is a separate analogue ground plane running under these signals
and terminating at this pin. If the ADC is not used or ADC performance is not critical, this pin can be connected to digital
ground.
RUN is the RP2350 enable pin, and has an internal (on-chip) pull-up resistor to 3.3V of about ~50kΩ. To reset RP2350,
short this pin low.
Finally, there are also six test points (TP1-TP6), which can be accessed if required, for example if using as a surface-
mount module. These are:
TP2 USB DM
TP3 USB DP
TP6 BOOTSEL
TP1, TP2 and TP3 can be used to access USB signals instead of using the micro-USB port. TP6 can be used to drive the
system into mass-storage USB programming mode (by shorting it low at power-up). Note that TP4 is not intended to be
used externally, and TP5 is not really recommended to be used as it will only swing from 0V to the LED forward voltage
(and hence can only really be used as an output with special care).
The footprint shows the test point locations and pad sizes as well as the 4 USB connector shell ground pads (A,B,C,D).
The USB connector on Pico 2 W is a through-hole part, which provides it with mechanical strength. The USB socket pins
do not protrude all the way through the board, however solder does pool at these pads during manufacture and can stop
the module sitting completely flat. Hence we provide pads on the SMT module footprint to allow this solder to reflow in
a controlled manner when Pico 2 W goes through reflow again.
For test points that are not used, it is acceptable to void any copper under these (with suitable clearance) on the carrier
board.
Through trials with customers, we have determined that the paste stencil must be bigger than the footprint. Over-
pasting the pads ensures the best possible results when soldering. The following paste stencil (Figure 6) indicates the
dimensions of solder paste zones on the Pico 2 W. We recommend paste zones 163% larger than the footprint.
2.20
2.54
3.80
15.58
Figure 7. Surface-
mount and
throughhole footprint
for attaching to
Raspberry Pi Pico W
VBUS 5V ± 10%.
Note that VBUS and VSYS current will depend on use-case, some examples are given in the next section.
The simplest way to reprogram the Pico 2 W’s flash is to use the USB mode. To do this, power-down the board, then
hold the BOOTSEL button down during board power-up (e.g. hold BOOTSEL down while connecting the USB). The Pico 2
W will then appear as a USB mass storage device. Dragging a special '.uf2' file onto the disk will write this file to the
flash and restart the Pico 2 W.
The USB boot code is stored in ROM on RP2350, so can not be accidentally overwritten.
To get started using the SWD port see the Debugging with SWD section in the Getting started with Raspberry Pi Pico-
series book.
Pico 2 W exposes 26 of the 30 possible RP2350 GPIO pins by routing them straight out to Pico 2 W header pins. GPIO0
to GPIO22 are digital-only, and GPIO 26-28 can be used either as digital GPIO or as ADC inputs (software selectable).
NOTE
GPIO 26-29 are ADC-capable and have an internal reverse diode to the VDDIO (3.3V) rail, so the input voltage must
not exceed VDDIO plus about 300mV. If the RP2350 is unpowered, applying a voltage to these GPIO pins will 'leak'
through the diode into the VDDIO rail. GPIO pins 0-25 (and the debug pins) do not have this restriction and therefore
voltage can safely be applied to these pins when RP2350 is unpowered up to 3.3V.
3. The ADC draws current (about 150μA if the temperature sense diode is disabled, which can vary between chips);
there will be an inherent offset of about 150μA*200 = ~30mV. There is a small difference in current draw when the
ADC is sampling (about +20μA), so that offset will also vary with sampling as well as operating temperature.
Changing the resistance between the ADC_VREF and 3.3V pin can reduce the offset at the expense of more noise, which
is helpful if the use case can support averaging over multiple samples.
Driving the SMPS mode pin (WL_GPIO1) high forces the power supply into PWM mode. This can greatly reduce the
inherent ripple of the SMPS at light load, and therefore reduces the ripple on the ADC supply. This does reduce the
power efficiency of the Pico 2 W at light load, so at the end of an ADC conversion PFM mode can be re-enabled by
driving WL_GPIO1 low once more. See Section 3.4.
The ADC offset can be reduced by tying a second channel of the ADC to ground, and using this zero measurement as an
For much improved ADC performance, an external 3.0V shunt reference, such as LM4040, can be connected from the
ADC_VREF pin to ground. Note that if doing this the ADC range is limited to 0V - 3.0V signals (rather than 0V - 3.3V), and
the shunt reference will draw continuous current through the 200Ω filter resistor (3.3V - 3.0V)/200 = ~1.5mA.
Note that the 1Ω resistor on Pico 2 W (R9) is designed to help with shunt references that would otherwise become
unstable when directly connected to 2.2μF. It also ensures there is filtering even in the case that 3.3V and ADC_VREF
are shorted together (which users who are tolerant to noise and want to reduce the inherent offset may wish to do).
R7 is a physically large 1608 metric (0603) package resistor, so can be removed easily if a user wants to isolate
ADC_VREF and make their own changes to the ADC voltage, for example powering it from an entirely separate voltage
(e.g. 2.5V). Note that the ADC on RP2350 has only been qualified at 3.0/3.3V, but should work down to about 2V.
3.4. Powerchain
Pico 2 W has been designed with a simple yet flexible power supply architecture and can easily be powered from other
sources such as batteries or external supplies. Integrating the Pico 2 W with external charging circuits is also
straightforward. Figure 8 shows the power supply circuitry.
Figure 8. The
powerchain of the L1
TP1
Pico 2 W board.
1u
6
7
VBUS VSYS
D1 U2
9
8
6
7
3V 3
J1 1 2 1 10 4
LX2b
LX2a
LX1b
LX1a
2 USB_DM 11 VIN10 VO UTa 5 R21
3 USB_DP TP2 R10 C1 C 20 1 VIN11 VO UTb 560 K C2 C 21
690 -005 -298 -48 6 4 TP3 10K MBR120VLS FT1G R2 47u 100 n VINA 14 50 mW 47u 47u
5 50 mW 100 K M2012 M0 60 3 PGOO D 1% M2012 M2012
1% 50 mW 6.3V 6.3V 3 M0 60 3 6.3V 6.3V
M0 60 3 1% X5 R X5 R FB R20 X5 R X5 R
M0 60 3 20 % 10% 100 K 20 % 20 %
8
9
W L_GPIO 2 13 50 mW
PS/SYNC PGND
1%
GND
R1 3V3_E N 12 M0 60 3
10K EN
50 mW RT6154AGQ W
2
15
1%
M0 60 3 W L_GPIO 1 TP4
R8
100 K PS=0: PFM mode (default, best efficiency)
50 mW
1%
PS=1: PWM mode (improved ripple but much
M0 60 3 worse efficiency at light loads)
VBUS is the 5V input from the micro-USB port, which is fed through a Schottky diode to generate VSYS. The VBUS to
VSYS diode (D1) adds flexibility by allowing power ORing of different supplies into VSYS.
VSYS is the main system 'input voltage' and feeds the RT6154 buck-boost SMPS, which generates a fixed 3.3V output
for the RP2350 device and its I/O (and can be used to power external circuitry). VSYS divided by 3 (by R5, R6 in the Pico
2 W schematic) and can be monitored on ADC channel 3 when a wireless transmission isn’t in progress. This can be
used for example as a crude battery voltage monitor.
The buck-boost SMPS, as its name implies, can seamlessly switch from buck to boost mode, and therefore can
maintain an output voltage of 3.3V from a wide range of input voltages, ~1.8V to 5.5V, which allows a lot of flexibility in
the choice of power source.
WL_GPIO2 monitors the existence of VBUS, while R10 and R1 act to pull VBUS down to make sure it is 0V if VBUS is not
present.
WL_GPIO1 controls the RT6154 PS (power save) pin. When PS is low (the default on Pico 2 W) the regulator is in pulse
frequency modulation (PFM) mode, which, at light loads, saves considerable power by only turning on the switching
MOSFETs occasionally to keep the output capacitor topped up. Setting PS high forces the regulator into pulse width
modulation (PWM) mode. PWM mode forces the SMPS to switch continuously, which reduces the output ripple
considerably at light loads (which can be good for some use cases) but at the expense of much worse efficiency. Note
that under heavy load the SMPS will be in PWM mode irrespective of the PS pin state.
The SMPS EN pin is pulled up to VSYS by a 100kΩ resistor and made available on Pico 2 W pin 37. Shorting this pin to
ground will disable the SMPS and put it into a low power state.
3.4. Powerchain 16
Raspberry Pi Pico 2 W Datasheet
NOTE
The RP2350 has an on-chip linear regulator (LDO) that powers the digital core at 1.1V (nominal) from the 3.3V
supply, which is not shown in Figure 8.
If the USB port is the only power source, VSYS and VBUS can be safely shorted together to eliminate the Schottky diode
drop (which improves efficiency and reduces ripple on VSYS).
If the USB port is not going to be used, it is safe to power Pico 2 W by connecting VSYS to your preferred power source
(in the range ~1.8V to 5.5V).
IMPORTANT
If you are using Pico 2 W in USB host mode (e.g. using one of the TinyUSB host examples) then you must power Pico
2 W by providing 5V to the VBUS pin.
The simplest way to safely add a second power source to Pico 2 W is to feed it into VSYS via another Schottky diode
(see Figure 9). This will 'OR' the two voltages, allowing the higher of either the external voltage or VBUS to power VSYS,
with the diodes preventing either supply from back-powering the other. For example a single Lithium-Ion cell* (cell
voltage ~3.0V to 4.2V) will work well, as will three AA series cells (~3.0V to ~4.8V) and any other fixed supply in the
range ~2.3V to 5.5V. The downside of this approach is that the second power supply will suffer a diode drop in the
same way as VBUS does, and this may not be desirable from an efficiency perspective or if the source is already close
to the lower range of input voltage allowed for the RT6154.
Figure 9. Pico 2 W
power ORing using
diodes.
Feed VSYS pin f rom
external supply (V) via
Schotty diode (D)
V
D
D1
VBUS VSYS
2 1
R10 C1
10K MBR120V LS FT1G R2 47u
50 mW 100 K M2012
1% 50 mW 6.3V
M0 60 3 1% X5 R
M0 60 3 20 %
W L_GPIO 2
R1 3V3_E N
10K
50 mW
1%
M0 60 3
An improved way to power from a second source is using a P-channel MOSFET (P-FET) to replace the Schottky diode as
shown in Figure 10. Here, the gate of the FET is controlled by VBUS, and will disconnect the secondary source when
VBUS is present. The P-FET should be chosen to have low on resistance, and therefore overcomes the efficiency and
Note that the Vt (threshold voltage) of the P-FET must be chosen to be well below the minimum external input voltage,
to make sure the P-FET is turned on swiftly and with low resistance. When the input VBUS is removed, the P-FET will not
start to turn on until VBUS drops below the P-FET’s Vt, meanwhile the body diode of the P-FET may start to conduct
(depending on whether Vt is smaller than the diode drop). For inputs that have a low minimum input voltage, or if the P-
FET gate is expected to change slowly (e.g. if any capacitance is added to VBUS) a secondary Schottky diode across
the P-FET (in the same direction as the body diode) is recommended. This will reduce the voltage drop across the P-
FET’s body diode.
An example of a suitable P-MOSFET for most situations is Diodes DMG2305UX which has a maximum Vt of 0.9V and
Ron of 100mΩ (at 2.5V Vgs).
D1
VBUS VSYS
2 1
R10 C1
10K MBR120V LS FT1G R2 47u
50 mW 100 K M2012
1% 50 mW 6.3V
M0 60 3 1% X5 R
M0 60 3 20 %
W L_GPIO 2
R1 3V3_E N
10K
50 mW
1%
M0 60 3
CAUTION
If using Lithium-Ion cells they must have, or be provided with, adequate protection against over-discharge, over-
charge, charging outside allowed temperature range, and overcurrent. Bare, unprotected cells are dangerous and can
catch fire or explode if over-discharged, over-charged or charged / discharged outside their allowed temperature
and/or current range.
IN OUT
Cha rger
BAT
+
D1
VBUS VSYS
2 1
R10 C1
10K MBR120V LS FT1G R2 47u
50 mW 100 K M2012
1% 50 mW 6.3V
M0 60 3 1% X5 R
M0 60 3 20 %
W L_GPIO 2
R1 3V3_E N
10K
50 mW
1%
M0 60 3
In the example we feed VBUS to the input of the charger, and we feed VSYS with the output via the previously mentioned
P-FET arrangement. Depending on your use case you may also want to add a Schottky diode across the P-FET as
described in the previous section.
3.7. USB
RP2350 has an integrated USB1.1 PHY and controller which can be used in both device and host mode. Pico 2 W adds
the two required 27Ω external resistors and brings this interface to a standard micro-USB port.
The USB port can be used to access the USB bootloader (BOOTSEL mode) stored in the RP2350 boot ROM. It can also
be used by user code, to access an external USB device or host.
Due to pin limitations, some of the wireless interface pins are shared. The CLK is shared with VSYS monitor, so only
when there isn’t an SPI transaction in progress can VSYS be read via the ADC. The Infineon CYW43439 DIN/DOUT and
3.7. USB 19
Raspberry Pi Pico 2 W Datasheet
IRQ all share one pin on the RP2350. Only when an SPI transaction isn’t in progress is it suitable to check for IRQs. The
interface typically runs at 33MHz.
For best wireless performance, the antenna should be in free space. For instance, putting metal under or close by the
antenna can reduce its performance both in terms of gain and bandwidth. Adding grounded metal to the sides of the
antenna can improve the antenna’s bandwidth.
There are three GPIO pins from the CYW43439 that are used for other board functions and can easily be accessed via
the SDK:
WL_GPIO2
IP VBUS sense - high if VBUS is present, else low
WL_GPIO1
OP controls the on-board SMPS power save pin (Section 3.4)
WL_GPIO0
OP connected to user LED
NOTE
Full details of the Infineon CYW43439 can be found on the Infineon website.
3.9. Debugging
Pico 2 W brings the RP2350 serial wire debug (SWD) interface to a three-pin debug header. To get started using the
debug port see the Debugging with SWD section in the Getting started with Raspberry Pi Pico-series book.
NOTE
The RP2350 chip has internal pull-up resistors on the SWDIO and SWCLK pins, both nominally 60kΩ.
3.9. Debugging 20
Raspberry Pi Pico 2 W Datasheet
Appendix A: Availability
Raspberry Pi guarantee availability of the Raspberry Pi Pico 2 W product until at least January 2028.
Support
For support see the Pico section of the Raspberry Pi website, and post questions on the Raspberry Pi forum.
Support 21
Raspberry Pi Pico 2 W Datasheet
Ground, benign
Applies to non-mobile, temperature and humidity controlled environments readily accessible to maintenance;
includes laboratory instruments and test equipment, medical electronic equipment, business and scientific
computer complexes.
Ground, mobile
Assumes levels of operational stress well above normal domestic or light industrial use, without temperature,
humidity or vibration control: applies to equipment installed on wheeled or tracked vehicles and equipment
manually transported; includes mobile and handheld communications equipment.
25 November 2024
• Initial release.
25 November 2024 24