&   

Europäisches Patentamt
(19) European Patent Office

Office européen des brevets (11) EP 1 461 386 B1

(12) EUROPEAN PATENT SPECIFICATION

(45) Date of publication and mention (51) Int Cl.:

of the grant of the patent: C08L 25/04 (2006.01) C08L 71/12 (2006.01)
29.11.2006 Bulletin 2006/48 C08L 55/02 (2006.01) H01L 23/29 (2006.01)

(21) Application number: 02806064.8 (86) International application number:

PCT/JP2002/013313
(22) Date of filing: 19.12.2002
(87) International publication number:
WO 2003/057779 (17.07.2003 Gazette 2003/29)

(54) ELECTROCONDUCTIVE RESIN COMPOSITION

ELEKTRISCH LEITFÄHIGE HARZZUSAMMENSETZUNG
COMPOSITION DE RESINE ELECTROCONDUCTRICE

(84) Designated Contracting States: • HIURA, M.

AT DE FR GB Denki Kagaku Kogyo Kabushiki Kaisha
Naganuma-cho
(30) Priority: 07.01.2002 JP 2002000406 Isezaki-shi, Gunma 372-0855 (JP)
• ODA, M.
(43) Date of publication of application: Denki Kagaku Kogyo Kabushiki Kaisha
29.09.2004 Bulletin 2004/40 Naganuma-cho
Isezaki-shi, Gunma 372-0855 (JP)
(73) Proprietor: DENKI KAGAKU KOGYO KABUSHIKI
KAISHA (74) Representative: Hartz, Nikolai
Chiyoda-ku, Wächtershäuser & Hartz
Tokyo 100-8455 (JP) Patentanwälte
Weinstrasse 8
(72) Inventors: 80333 München (DE)
• MIYAKAWA, T.
Denki Kagaku Kogyo Kabushiki Kaisha (56) References cited:
Naganuma-cho EP-A- 0 272 541 EP-A- 0 355 602
Isezaki-shi, Gunma 372-0855 (JP) EP-A- 0 562 179 EP-A- 1 125 985
• OGITA, K. JP-A- 8 188 710 JP-A- 8 337 714
Denki Kagaku Kogyo Kabushiki Kaisha JP-A- 2002 256 125 JP-A- 2002 355 935
Naganuma-cho US-A- 5 876 632 US-A- 5 955 164
Isezaki-shi, Gunma 372-0855 (JP)
EP 1 461 386 B1

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give
notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in
a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art.
99(1) European Patent Convention).

Printed by Jouve, 75001 PARIS (FR)

 EP 1 461 386 B1

Description

TECHNICAL FIELD

5 [0001] The present invention relates to an electroconductive resin composition. The electroconductive resin compo-
sition is useful for e.g. packaging an electronic device.

BACKGROUND ART

10 [0002] US 5,955,164 discloses an electroconductive resin composition.

[0003] As a container for packaging an electronic device such as IC, an injection tray, a vacuum-formed tray, a
magazine or an embossed carrier tape may, for example, be mentioned. For such a container for packaging an electronic
device, an electroconductive resin composition is used to prevent breakage of the accommodated IC or the like by
abrasion between the electronic device and the container or by static electricity generated when a cover is peeled from
15 the container.
[0004] As such an electroconductive resin composition, one comprising a thermoplastic resin and an electroconductive
filler, is known. The electroconductive filler may, for example, be fine metal powder, carbon fiber or carbon black. Carbon
black is most commonly used, since it can uniformly be dispersed by adjusting the kneading conditions, etc., and a
constant surface resistivity can easily be obtained. As the thermoplastic resin, a polyvinyl chloride resin, a polypropylene
20 resin, a polyethylene terephthalate resin, a polystyrenic resin or an ABS resin is employed. Further, as one having heat
resistance at a temperature of at least 100°C, a polyphenylene ether resin or a polycarbonate resin may, for example,
be used. Among these resins, a polyphenylene ether resin is superior for heat resistance, and for general purposes, a
polystyrenic resin and an ABS resin are superior to other resins in that even if carbon black is incorporated in a large
amount, there will be no substantial decrease in the flowability or moldability, and they are advantageous also from the
25 viewpoint of costs.
[0005] Such containers for packaging electronic devices are disclosed, for example, in JP-A-2001-84834, JP-A-
2000-34408, JP-A-2000-143891, JP-A-2000-119454, JP-A-11-335549, JP-A-11-256025, JP-A-11-80534, JP-A-
11-10806, JP-A-10-329279, JP-A-10-329278, JP-A-10-329885, JP-A-10-309784, JP-A-09-265835, JP-A-09-245524,
JP-A-09-174769, JP-A-09-76422, JP-A-09-76423, JP-A-09-76425, JP-A-09-76424, JP-A-08-337678, JP-A-08-283584,
30 JP-A-08-199075, JP-A-08-199077, JP-A-08-198999 and JP-A-08-199076.
[0006] A molded product of a composition having a large amount of carbon black incorporated, has a drawback that
carbon black is likely to fall off from the surface of the molded product by abrasion.

DISCLOSURE OF THE INVENTION

35
[0007] The present invention is to overcome such a drawback and to provide an electroconductive resin composition
comprising at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a poly-
styrenic resin and an ABS resin, and carbon black, wherein a styrene/butadiene/butylene/styrene block copolymer or a
mixture of an olefinic resin and a styrene/butadiene/butylene/styrene block copolymer, is incorporated to such an elec-
40 troconductive resin composition, whereby contamination of IC or the like caused by falling off of carbon black or the like
by abrasion when contacted with IC or the like, is remarkably reduced.
[0008] Namely, the present invention provides the following.

(1) An electroconductive resin composition which comprises (A) 100 parts by weight of at least one thermoplastic
45 resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin and
(B) from 5 to 50 parts by weight of carbon black, and, based on 100 parts by weight of the total amount of (A) and
(B), (D) from 1 to 30 parts by weight of an olefinic resin and (C) from 0.2 to 10 parts by weight of a styrene/butadiene/
butylene/styrene block copolymer, and which has a surface resistivity of from 102 to 1010 Ω as further defined by
claim 1.
50 (2) An electroconductive resin composition which comprises (A) 100 parts by weight of at least one thermoplastic
resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin and
(B) from 5 to 50 parts by weight of carbon black, and, based on 100 parts by weight of the total amount of (A) and
(B), (C) from 1 to 30 parts by weight of a styrene/butadiene/butylene/styrene block copolymer, and which has a
surface resistivity of from 102 to 1010 Ω as further defined by claim 2.
55 (3) The electroconductive resin composition according to the above (1), wherein (D) the olefinic resin is a polyethylene
resin.
(4) A container for packaging an electronic device, which employs the electroconductive resin composition as defined
in any one of the above (1) to (3).

2
 EP 1 461 386 B1

(5) An electronic device package which employs the container for packaging an electronic device as defined in the
above (4).
(6) A sheet which employs the electroconductive resin composition as defined in any one of the above (1) to (3).
(7) The sheet as defined in the above (6), which has a multilayer structure.
5 (8) The sheet as defined in the above (7), which has a substrate layer and a layer of the electroconductive resin
composition.
(9) The container for packaging an electronic device, which employs the sheet as defined in any one of the above
(6) to (8).
(10) An electronic device package which employs the sheet as defined in any one of the above (6) to (8).
10
BEST MODE FOR CARRYING OUT THE INVENTION

[0009] Now, the present invention will be described in further detail.

[0010] In the present invention, (A) at least one thermoplastic resin selected from the group consisting of a polyphe-
15 nylene ether resin, a polystyrenic resin and an ABS resin, is used.
[0011] In the present invention, the polyphenylene ether resin is a resin containing a polyphenylene ether resin, or
such a polyphenylene ether resin and a polystyrenic resin, as the main component. In the latter case, the polyphenylene
ether resin is incorporated in an amount of from 28 to 86 wt%, particularly preferably from 40 to 80 wt%, based on the
total amount of the polyphenylene ether resin and the polystyrenic resin. If it is less than 28 wt%, no adequate mechanical
20 properties can be obtained as a polyphenylene ether resin, and if it exceeds 86 wt%, the molding tends to be difficult
due to a decrease in the flowability. As such a polyphenylene ether resin, a homopolymer or a copolymer as disclosed
in U.S. Patent 3,383,435, may, for example, be mentioned.
[0012] In the present invention, the polystyrenic resin is a common polystyrene resin, an impact resistant polystyrene
resin or one containing a mixture thereof as the main component.
25 [0013] The ABS resin is one containing a copolymer composed mainly of three components of acrylonitrile/butadiene/
styrene, as the main component.
[0014] In the present invention, (B) carbon black is, for example, furnace black, channel black or acetylene black,
preferably one having a large specific surface area, whereby a high level of electroconductivity can be obtained in a
small amount of incorporation to the resin. For example, S.C.F. (Super Conductive Furnace), E.C.F. (Electric Conductive
30 Furnace), Ketjenblack (tradename, manufactured by LION-AKZO K.K.) or acetylene black, may be mentioned. It is
added in an amount such that the surface resistivity can be made to be from 102 to 1010 Ω, preferably from 104 to 108
Ω. If the surface resistivity exceeds 1010 Ω, no adequate antistatic effect can be obtained, and if it is less than 102 Ω,
inflow of electricity from outside by e.g. static electricity will be facilitated, whereby an electronic device is likely to be
broken.
35 [0015] In order to obtain the above surface resistivity, the amount of carbon black to be added, is specifically such
that per 100 parts by weight of (A) the thermoplastic resin, (B) carbon black is preferably from 5 to 50 parts by weight,
particularly preferably from 7 to 40 parts by weight. If the amount is less than 5 parts by weight, no adequate electro-
conductivity can be obtained, and the surface resistivity tends to be high, and if it exceeds 50 parts by weight, uniform
dispersibility with the resin tends to deteriorate, the molding property tends to remarkably decrease, and the characteristic
40 value such as the mechanical strength tends to be low.
[0016] In the present invention, (C) the styrene/butadiene/butylene/styrene block copolymer is a copolymer having
the following chemical structure.

45

50

55

3
 EP 1 461 386 B1

[0017] So long as it has the above structure, the method for its production is not particularly limited. For example,
production methods are reported in "Structure and Performance of Novel Styrene Type Thermoplastic Elastomer (SBBS)"
(Shuji Sakae et al, the 9th Polymer Material Forum, p. 125-126, 2000), JP-A-64-38402, JP-A-60-220147, JP-A-63-5402,
10 JP-A-63-4841, JP-A-61-33132, JP-A-63-5401, JP-A-61-28507 and JP-A-61-57524. A commercial product of (C) the
styrene/butadiene/butylene/styrene block copolymer may be used as it is.
[0018] In the present invention, when the electroconductive resin composition contains (A) at least one thermoplastic
resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, (B)
carbon black and (C) a styrene/butadiene/butylene/styrene block copolymer, but does not contain (D) an olefinic resin,
15 the amount of (C) the styrene/butadiene/butylene/styrene block copolymer is preferably from 1 to 30 parts by weight,
more preferably from 3 to 25 parts by weight, per 100 parts by weight of the total amount of (A) the thermoplastic resin
and (B) carbon black. If the amount is less than 1 part by weight, its effects tend to be inadequate, and if it exceeds 30
parts by weight, it tends to be difficult to uniformly disperse it in the polyphenylene ether resin, the polystyrenic resin or
the ABS resin.
20 [0019] In the present invention, when the electroconductive resin composition comprises (A) at least one thermoplastic
resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin or an ABS resin, (B) carbon
black, (D) an olefinic resin and (C) a styrene/butadiene/butylene/styrene block copolymer, the amount of (C) the styrene/
butadiene/butylene/styrene block copolymer is such that per 100 parts by weight of the total amount of (A) the thermo-
plastic resin and (B) carbon black, the amount of (C) the styrene/butadiene/butylene/styrene block copolymer is from
25 0.2 to 10 parts by weight.
[0020] In the present invention, (D) the olefinic resin may, for example, be a homopolymer of ethylene or propylene,
a copolymer of ethylene or propylene as the main component, for example, an ethylene/vinyl acetate copolymer, an
ethylene/ethyl acrylate copolymer, an ethylene/α-olefin copolymer, or a blend product thereof. Among them, it is partic-
ularly preferred to use a polyethylene resin represented by a low density polyethylene resin, a high density polyethylene
30 resin or a straight chain low density polyethylene resin. The melt flow index of (D) the olefinic resin is preferably at least
0.1 g/10 min at 190°C under a load of 2.16 kg (measured in accordance with JIS K-7210). The amount of (D) the olefinic
resin is preferably from 1 to 30 parts by weight, more preferably from 3 to 25 parts by weight, per 100 parts by weight
of the total amount of (A) the thermoplastic resin and (B) carbon black. If the amount is less than 1 part by weight, its
effects tend to be inadequate, and if it exceeds 30 parts by weight, it tends to be difficult to uniformly disperse it in an
35 polyphenylene ether resin, a polystyrenic resin or an ABS resin.
[0021] In a case where carbon black is incorporated to bring the surface resistivity to a level of from 102 to 1010 Ω in
order for the electroconductive resin composition of the present invention to maintain sufficient moldability, the melt flow
index (as measured in accordance with JIS K-7210) is at least 0.1 g/10 min, particularly preferably at least 0.5 g/10 min
under conditions of 230°C and a load of 10 kg in the case of a polyphenylene ether resin, under conditions of 200°C
40 and a load of 5 kg in the case of a polystyrenic resin or under conditions of 220°C and a load of 10 kg in the case of an
ABS resin.
[0022] In order to improve the flowability of the composition or the mechanical properties of its molded product, it is
possible to incorporate various additives such as a lubricant, a plasticizer, a processing adjuvant and a reinforcing agent,
or other resin components, to the electroconductive resin composition, as the case requires.
45 [0023] In the present invention, in order to have the raw materials kneaded and pelletized to obtain the electroconductive
resin composition, a known method by means of a Banbury mixer, an extruder or the like, may be employed. At the time
of kneading, it is possible to knead the raw materials all at once, or it is possible to knead them stepwisely in such a
manner that for example, a mixture of a styrenic resin and carbon black, and a mixture of a styrenic resin and a block
copolymer, are separately kneaded, and the kneaded mixtures are finally kneaded all at once.
50 [0024] The electroconductive resin composition can be molded and thus used as a container for packaging an electronic
device. The container for packaging an electronic device is a packaging container for an electronic device. For example,
by means of a conventional method such as injection molding of the composition, or vacuum molding, blow molding,
hot plate molding or the like of the composition molded into a sheet shape, it can be formed into a container for packaging
an electronic device, such as a tray, a magazine tube or a carrier tape (an embossed carrier tape). It is particularly
55 suitably employed as a carrier tape or a tray. By accommodating an electronic device in the container for packaging an
electronic device, an electronic device package is obtained. In such a case, the container may have a covering, as the
case requires. For example, in the case of a carrier tape, after an electronic device is accommodated, a cover is applied
by a cover tape. The electronic device package includes one having such a structure.

4
 EP 1 461 386 B1

[0025] The sheet of the electroconductive resin composition of the present invention may be a single layer sheet or
a multilayer sheet. The multilayer sheet is one having a layer of the above electroconductive resin composition at least
on one side of a substrate layer of a thermoplastic resin. The thermoplastic resin is not particularly limited. For example,
a polyphenylene ether resin, a polystyrenic resin, an ABS resin or a polycarbonate resin may be used. The thickness
5 of the sheet is usually from 0.1 to 3.0 mm, and in the multilayer sheet, the thickness of the layer of the electroconductive
resin composition is preferably from 2 to 80% of the entire thickness.
[0026] The electronic device is not particularly limited, and it may, for example, be IC, a resistance, a capacitor, an
inductor, a transistor, a diode, LED (light emitting diode), a liquid crystal, a piezoelectric element resistor, a filter, a crystal
oscillator, a quartz resonator, a connector, a switch, a volume or a relay. The type of IC is not particularly limited, and it
10 may, for example, be SOP, HEMT, SQFP, BGA, CSP, SOJ, QFP or PLCC.
[0027] Now, the present invention will be described in further detail with reference to Examples.

EXAMPLES 1 to 5

15 [0028] The raw materials in the proportions as identified in Table 1, were uniformly mixed by a high speed mixer, then
kneaded by means of a φ45 mm vented twin screw extruder and pelletized by a strand cut method. Then, the pelletized
resin composition was formed into a sheet having a thickness of 300 Pm by means of a φ65 mm extruder (L/D=28) and
a T-die.

20 COMPARATIVE EXAMPLES 1 to 5

[0029] The operation was carried out in the same manner as in Example 1 except that the raw materials were in the
proportions as identified in Table 1. Evaluations were carried out by the following methods.

25 (1) Surface resistivity

[0030] The resistivity was measured at optional ten points in a sample by means of a LORESTA surface resistance
meter (manufactured by Mitsubishi Petrochemical Co., Ltd.) with an electrode gap being 10 mm.

30 (2) Falling off of carbon

[0031] A frame of 20 mm  30 mm was attached to each sheet, and IC i.e. QFP14 mm  20 mm  64 pin was inserted
therein, followed by reciprocation for 200,000 times with a stroke of 20 mm. Then, the presence or absence of a black
colored deposition of carbon black, etc. on the lead portion of the above IC, was inspected by a microscope. Evaluation
35 was made with respect to four pieces of IC in accordance with the following standards for six grades, and the total was
taken as the result.

1: Deposition is observed over the entire portion of the lead which was in contact with the sheet.
2: Deposition is observed over the entire lead.
40 3: Deposition is observed on 21 to 63 pieces.
4: Deposition is observed on not more than 20 leads.
5: No deposition is observed.

(3) Tear strength

45
[0032] Evaluation was carried out in accordance with JIS 7128-3.

(4) Du Pont impact

50 [0033] Evaluation was carried out in accordance with ASTM D-2794.

(5) Folding endurance

[0034] In accordance with JIS P-8115, evaluation was carried out at a folding angle of 135° under a load of 500 g at
55 a speed of 175 rpm.

5
 EP 1 461 386 B1

(6) Tensile elongation, tensile strength at yield point, tensile strength at break and tensile modulus

[0035] In accordance with JIS-7127, evaluation was carried out at a tensile speed of 10 mm/min using a No. 4 test
specimen.
5
Table 1
Composition (parts by weight)
(A) HIPS Carbon black(B) (A) + (B) Olefinic resin (C) SEBS (D) SBBS SBR
10 A B EEA HDPE A B
Example 1 100 31.6 100 26.7 6.7
Example 2 100 28.6 100 19.8 3.7
Example 3 100 28.6 100 19.8 3.7
15 Example 4 100 30.0 100 12.8 10.3 2.6 2.6
Example 5 100 30.0 100 12.8 10.3 2.6 2.6
Comparative 100 27.6 100 12.0 7.2 0.9
Example 1
20
Comparative 100 26.5 100 7.6 6.4
Example 2
Comparative 100 26.5 100 7.6 6.4
Example 3
Comparative 100 23.5 100 7.7 6.5
25 Example 4
Comparative 100 24.5 100 12.3 7.4 0.9
Example 5

30
Table 2
Thickness Surface Tear strength Du Folding Falling off of carbon
(Pm) resistivity (N/mm) Pont endurance (times) (perfect score: 20
impact points)
35
MD TD MD TD 200,000 400,000
(Ω) (J) times times
Example 1 321 5.51102 84.0 73.5 0.795 314 459 11 11
Example 2 321 3.79102 80.1 73.1 0.795 622 492 13 12
40 Example 3 318 3.92102 73.7 66.9 0.736 377 358 12 11
Example 4 325 4.64102 78.5 71.4 0.883 1389 925 11 11
Example 5 313 4.52102 80.2 70.5 0.868 1069 756 13 11
Comparative 325 4.10102 74.6 62.3 0.559 307 260 11 10
Example 1
45
Comparative 313 4.7102 72.6 72.0 0.383 67 175 11 10
Example 2
Comparative 310 2.17102 59.1 56.7 0.280 1 2 8 8
Example 3
50 Comparative 306 3.56102 69.1 67.4 0.441 7 15 9 9
Example 4
Comparative 311 2.34102 70.4 54.5 0.456 17 9 11 9
Example 5

55
[0036] As shown in Table 2, each of Examples 1 to 5 is superior to Comparative Examples 1 to 5 in the teat strength,
the Du Pont impact, the folding endurance and the falling off of carbon.
[0037] Using the electroconductive resin composition of Example 1 and an ABS resin as a substrate layer, a sheet

6
 EP 1 461 386 B1

having a layer of the conductive resin composition laminated in a thickness of 30 Pm on each side of the substrate layer
in a total thickness of 300 Pm, was prepared by a feed block method by means of a φ65 mm extruder and two φ40 mm
extruders. This multilayer sheet was formed into a carrier tape by a heat molding method wherein the sheet was heated
in contact with a heater plate, followed by blow molding, and the carrier tape was suitable for packaging IC.
5 [0038] The resins used in Examples and Comparative Examples were as follows.
HIPS (impact resistant polystyrene resin): Toyo Styrol HI-E4 (manufactured Toyo Styrene K.K.)
Carbon Black A: Denka black granule (manufactured by Denki Kagaku Kogyo K.K.)
Carbon Black B: Vulcan black XC-72 (manufactured by Cabot)
EEA (ethylene/ethyl acrylate resin): NUC copolymer DPDJ-6169 (manufactured by Nippon Unicar K.K.)
10 PS/PE (polystyrene resin/polyethylene resin alloy): WS-2776 (manufactured by BASF)
HDPE (high density polyethylene resin): HI-ZEX 5000H (manufactured Mitsui Chemicals Inc.)
SEBS (hydrogenated styrene/butadiene copolymer resin) A: Tuftec H-1052 (manufactured by Asahi Kasei Corporation)
SEBS (hydrogenated styrene/butadiene copolymer resin) B: Tuftec H-1062 (manufactured by Asahi Kasei Corporation)
SBBS (styrene/butadiene/butylene/styrene block copolymer resin): JT-82 (manufactured by Asahi Kasei Corporation,
15 styrene content: 76.7 wt%, butadiene content: 11.7 wt% and butylene content: 11.6 wt%, by 1H-NMR spectrum integral
values)
SBR (styrene/butadiene copolymer resin): DENKA STR1250 (manufactured by Denki Kagaku Kogyo K.K.) EXAMPLES
6 and 7
[0039] The raw materials in the proportions as identified in Table 3, were uniformly mixed by a high speed mixer, then
20 kneaded by means of a φ45 mm vented twin screw extruder and pelletized by a strand cut method. Then, the pelletized
resin composition was formed into a sheet having a thickness of 300 Pm by means of a φ65 mm extruder (L/D=28) and
a T-die.

COMPARATIVE EXAMPLE 6
25
[0040] The operation was carried out in the same manner as in Example 6 except that the raw materials were in the
proportions as identified in Table 3.

Table 3
30
Example 6 Example 7 Comparative Example 6
HI-E4 74 76 60
DPDJ-6169 10
WS-2776 12
35 JT-83 8 6
Denka Black granule 18 18 18

40

45

50

55

7
 30

25

20

15

10
55

50

45

40

35

5
Table 4
Surface resistivity Elongation at break Tensile strength at yield point Tensile strength at break Tensile modulus Falling off of
(Ω) (%) (Mpa) (Mpa) (Mpa) carbon (perfect
score: 20
Front surface Rear surface MD TD MD TD MD TD MD TD
points)
Example 1 1.14103 1.11103 2.5 2.7 - - 27.2 27.3 1825 1796 6
Example 2 1.04103 1.04103 2.8 2.5 - - 27.5 27.6 1840 1868 12
Comparative 1.49103 2.09103 11.5 4.7 21.8 17 17.6 17.9 1185 1123 15
Example 1

EP 1 461 386 B1
8
 EP 1 461 386 B1

[0041] Each of Examples 6 and 7 is superior to Comparative Example 6 in the strength at break and the falling off of
carbon. Using the electroconductive resin composition of Example 6 and an ABS resin for a substrate layer, a sheet
having a layer of the electroconductive resin composition laminated in a thickness of 30 Pm on each side of the substrate
layer in a total thickness of 300 Pm, was prepared by a feed block method by means of a φ65 mm extruder and two φ40
5 mm extruders. This multilayer sheet was formed into a carrier tape by a heat molding method wherein the sheet was
heated in contact with a heater plate, followed by blow molding, and the carrier tape was suitable for packaging IC.

INDUSTRIAL APPLICABILITY

10 [0042] The electroconductive resin composition of the present invention, which comprises (A) 100 parts by weight of
at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin
and an ABS resin and (B) from 5 to 50 parts by weight of carbon black, and, based on 100 parts by weight of the total
amount of (A) and (B), (D) from 1 to 30 parts by weight of an olefinic resin, or (D) from 1 to 30 parts by weight of an
olefinic resin and (C) from 0.2 to 10 parts by weight of a styrene/butadiene/butylene/styrene block copolymer, and which
15 has a surface resistivity of from 102 to 1010 Ω, is capable of remarkably reducing contamination due to falling off of
carbon black by abrasion when contacted with an electronic device such as IC, and it is excellent in tensile strength.
Especially when it contains (D) the olefinic resin and (C) the styrene/butadiene/butylene/styrene block copolymer, it is
excellent also in the Du Pont impact and the folding endurance.

20
Claims

1. An electroconductive resin composition which comprises

25 (A) 100 parts by weight of at least one thermoplastic resin selected from the group consisting of a polyphenylene
ether resin, a polystyrenic resin and an ABS resin and
(B) from 5 to 50 parts by weight of carbon black, and, based on 100 parts by weight of the total amount of (A)
and (B),

30 (D) from 1 to 30 parts by weight of an olefinic resin, and

(C) from 0.2 to 10 parts by weight of a styrene/butadiene/butylene/styrene block copolymer, and which has
a surface resistivity of from 102 to 1010 Ω, and

wherein the melt flow index as measured in accordance with JIS K-7210 is at least 0.1g/10 min, under conditions
35 of 230 °C and a load of 10 kg in the case of a polyphenylene ether resin, under conditions of 200 °C and a load of
5 kg in the case of a polystyrenic resin, or under conditions of 220 °C and a load of 10 kg in the case of an ABS resin.

2. An electroconductive resin composition which comprises

40 (A) 100 parts by weight of at least one thermoplastic resin selected from the group consisting of a polyphenylene
ether resin, a polystyrenic resin and an ABS resin and
(B) from 5 to 50 parts by weight of carbon black, and, based on 100 parts by weight of the total amount of (A)
and (B),
(C) from 1 to 30 parts by weight of a styrene/butadiene/butylene/styrene block copolymer, and which has a
45 surface resistivity of from 102 to 1010 Ω, and

wherein the melt flow index as measured in accordance with JIS K-7210 is at least 0.1g/10 min, under conditions
of 230 °C and a load of 10 kg in the case of a polyphenylene ether resin, under conditions of 200 °C and a load of
5 kg in the case of a polystyrenic resin, or under conditions of 220 °C and a load of 10 kg in the case of an ABS resin.
50
3. The electroconductive resin composition according to Claim 1, wherein (D) the olefinic resin is a polyethylene resin.

4. A container for packaging an electronic device, which employs the electroconductive resin composition as defined
in any one of Claims 1 to 3.
55
5. An electronic device package which employs the container for packaging an electronic device as defined in Claim 4.

6. A sheet which employs the electroconductive resin composition as defined in any one of Claims 1 to 3.

9
 EP 1 461 386 B1

7. The sheet as defined in Claim 6, which has a multilayer structure.

8. The sheet as defined in Claim 7, which has a substrate layer and a layer of the electroconductive resin composition.

5 9. The container for packaging an electronic device, which employs the sheet as defined in any one of Claims 6 to 8.

10. An electronic device package which employs the sheet 15 as defined in any one of Claims 6 to 8.

10 Patentansprüche

1. Elektrisch leitfähige Harzzusammensetzung, die umfasst:

(A) 100 Gew.-Teile von mindestens einem thermoplastischen Harz, ausgewählt aus der Gruppe bestehend aus
15 einem Polyphenylenetherharz, einem Polystyrolharz und einem ABS-Harz, und
(B) 5 bis 50 Gew.-Teile Carbon-Black und, bezogen auf 100 Gew.-Teile der Gesamtmenge an (A) und (B),
(D) 1 bis 30 Gew.-Teile eines Olefinharzes, und
(C) 0,2 bis 10 Gew.-Teile eines Styrol/Butadien/Butylen/Styrol-Blockcopolymers, und die einen spezifischen
Oberflächenwiderstand von 102 bis 1010 Ω aufweist, und worin der Schmelzindex, gemessen nach JIS K-7210,
20 mindestens 0,1 g/10 min unter den Bedingungen von 230°C und einer Belastung von 10 kg im Falle eines
Polyphenylenetherharzes, unter Bedingungen von 200°C und einer Belastung von 5 kg im Falle eines Polysty-
rolharzes oder unter Bedingungen von 220°C und einer Belastung von 10 kg im Falle eines ABS-Harzes, beträgt.

2. Elektrisch leitfähige Harzzusammensetzung, die umfasst:

25
(A) 100 Gew.-Teile von mindestens einem thermoplastischen Harz, ausgewählt aus der Gruppe bestehend aus
einem Polyphenylenetherharz, einem Polystyrolharz und einem ABS-Harz, und
(B) 5 bis 50 Gew.-Teile Carbon-Black und, bezogen auf 100 Gew.-Teile der Gesamtmenge an (A) und (B),
(C) 1 bis 30 Gew.-Teile eines Styrol/Butadien/Butylen/Styrol-Blockcopolymers, und die einen spezifischen Ober-
30 flächenwiderstand von 102 bis 1010 Ω aufweist, und worin der Schmelzindex, gemessen nach JIS K-7210,
mindestens 0,1 g/10 min unter den Bedingungen von 230°C und einer Belastung von 10 kg im Falle eines
Polyphenylenetherharzes, unter Bedingungen von 200°C und einer Belastung von 5 kg im Falle eines Polysty-
rolharzes oder unter Bedingungen von 220°C und einer Belastung von 10 kg im Falle eines ABS-Harzes, beträgt.

35 3. Elektrisch leitfähige Harzzusammensetzung nach Anspruch 1, worin das Olefinharz (D) ein Polyethylenharz ist.

4. Behälter zum Verpacken einer elektronischen Vorrichtung, der die elektrisch leitfähige Harzzusammensetzung nach
einem der Ansprüche 1 bis 3 verwendet.

40 5. Packung mit elektronischer Vorrichtung, die den Behälter zum Verpacken einer elektronischen Vorrichtung nach
Anspruch 4 verwendet.

6. Folie, die die elektrisch leitfähige Harzzusammensetzung nach einem der Ansprüche 1 bis 3 verwendet.

45 7. Folie nach Anspruch 6, die eine Mehrschichtstruktur aufweist.

8. Folie nach Anspruch 7, die eine Substratschicht und eine Schicht aus der elektrisch leitfähigen Harzzusammenset-
zung aufweist.

50 9. Behälter zum Verpacken einer elektronischen Vorrichtung, der die Folie nach einem der Ansprüche 6 bis 8 verwendet.

10. Packung mit elektronischer Vorrichtung, die die Folie (15) nach einem der Ansprüche 6 bis 8 verwendet.

55 Revendications

1. Composition de résine électroconductrice qui comprend

10
 EP 1 461 386 B1

(A) 100 parties en poids d’au moins une résine thermoplastique choisie dans le groupe constitué par une résine
poly(phénylène éther), une résine polystyrénique et une résine ABS, et
(B) de 5 à 50 parties en poids de noir de carbone, et sur la base de 100 parties en poids de la quantité totale
de (A) et (B),
5
(D) de 1 à 30 parties en poids d’une résine oléfinique, et
(C) de 0,2 à 10 parties en poids d’un copolymère séquencé de styrène/butadiène/butylène/styrène,

et qui a une résistivité superficielle de 102 à 1010 Ω, et

10 dans laquelle l’indice de fluidité à chaud, tel que mesuré selon la norme JIS K-7210, est d’au moins 0,1 g/10 min,
dans des conditions de 230°C et une charge de 10 kg dans le cas d’une résine poly(phénylène éther), dans des
conditions de 200°C et une charge de 5 kg dans le cas d’une résine polystyrénique, ou dans des conditions de
220°C et une charge de 10 kg dans le cas d’une résine ABS.

15 2. Composition de résine électroconductrice qui comprend

(A) 100 parties en poids d’au moins une résine thermoplastique choisie dans le groupe constitué par une résine
poly(phénylène éther), une résine polystyrénique et une résine ABS, et
(B) de 5 à 50 parties en poids de noir de carbone, et,
20 sur la base de 100 parties en poids de la quantité totale de (A) et (B),

(C) de 1 à 30 parties en poids d’un copolymère séquencé de styrène/butadiène/butylène/styrène, et

qui a une résistivité superficielle de 102 à 1010 Ω, et

25 dans laquelle l’indice de fluidité à chaud, tel que mesuré selon la norme JIS K-7210, est d’au moins 0,1 g/10 min,
dans des conditions de 230°C et une charge de 10 kg dans le cas d’une résine poly(phénylène éther), dans des
conditions de 200°C et une charge de 5 kg dans les cas d’une résine polystyrénique, ou dans des conditions de
220°C et une charge de 10 kg dans le cas d’une résine ABS.

30 3. Composition de résine électroconductrice selon la revendication 1, dans laquelle la résine oléfinique (D) est une
résine polyéthylène.

4. Conteneur pour emballage d’un dispositif électronique, qui emploie la composition de résine électroconductrice telle
que définie dans l’une quelconque des revendications 1 à 3.
35
5. Emballage de dispositif électronique qui emploie le conteneur pour emballage d’un dispositif électronique tel que
défini dans la revendication 4.

6. Feuille qui emploie la composition de résine électroconductrice telle que définie dans l’une quelconque des reven-
40 dications 1 à 3.

7. Feuille selon la revendication 6, qui a une structure multicouche.

8. Feuille selon la revendication 7, qui comporte une couche de substrat et une couche de composition de résine
45 électroconductrice.

9. Conteneur pour emballage d’un dispositif électronique, qui emploie la feuille telle que définie dans l’une quelconque
des revendications 6 à 8.

50 10. Emballage de dispositif électronique qui emploie la feuille 15 telle que définie dans l’une quelconque des revendi-
cations 6 à 8.

55

11