Anders Product Specification

Manufacturer EASTTOP
Manufacturer Part n˚ T104102768-A4WMC-003
Customer Part n˚ T104102768-A4WMC-003
Specification Revision n˚ 1.3
Issue Date 21/11/2024

Specification Approval
Company name
Product/Project Name
Printed name
Job title
Signature
Approval Stage: This product is approved for the
following production stage:
☐Sample / Prototype
☐Pre-Production
☐Mass Production
Approval Date

Supplied by Anders Electronics plc

 PRODUCT SPECIFICATION

10.4” TFT LCD MODULE

MODEL: T104102768-A4WMC-003 Ver:1.3

< ◇> Preliminary Specification

< ◆> Finally Specification

CUSTOMER’S APPROVAL
CUSTOMER :

SIGNATURE: DATE:

APPROVED PM PD PREPARED

BY REVIEWED REVIEWED BY
TFT TFT TFT
- S.G.H 周福云 D.F.G
20241025 20241025 20241025
 T104102768-A4WMC-003
Rev:1.3

Revision History

Revision Date Originator Detail Remarks

1.0 2024.06.17 LL Initial Release

Modify Backlight Characteristic P5
1.1 2024.06.21 LL
Modify Outline Drawing(B) P25
Modify Modify temperature P4/P21
Modify Touch Screen Panel Specifications P6
1.2 2024.07.31 LL Modify Block Diagram and Power Supply P10
Modify Interface Pins Definition P12
Modify Outline Drawing(C) P25
Modify Module Outline P4
Add Weight P4
Add Current Consumption All White P5
1.3 2024.10.25 DFG Modify PWM Dimming Frequency P5
Add Chromaticity Transmissive P7
Add RGB timing table P13
Modify Outline Drawing(E) P27

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Table of Contents
No. Item Page
1. General Description ................................................................................................................................4
2. Module Parameter .................................................................................................................................. 4
3. Absolute Maximum Ratings .................................................................................................................... 4
4. DC Characteristics ..................................................................................................................................5
5. Backlight Characteristic .......................................................................................................................... 5
5.1. LED Driver ....................................................................................................................................5
5.2. Backlight Characteristic ................................................................................................................5
5.3. Backlighting circuit ........................................................................................................................5
6. Touch Screen Panel Specifications ........................................................................................................ 6
7. Optical Characteristics ............................................................................................................................7
7.1. Optical Characteristics ................................................................................................................. 7
7.2. Definition of Response Time ........................................................................................................ 7
7.3. Definition of Contrast Ratio .......................................................................................................... 8
7.4. Definition of Viewing Angles .........................................................................................................8
7.5. Definition of Color Appearance .................................................................................................... 9
7.6. Definition of Surface Luminance, Uniformity and Transmittance .................................................9
8. Block Diagram and Power Supply ........................................................................................................10
9. Interface Pins Definition ........................................................................................................................11
10. AC Characteristics ..............................................................................................................................13
10.1. RGB timing table ...................................................................................................................... 13
10.2. 8-Bit LVDS Input .......................................................................................................................14
11. Quality Assurance ............................................................................................................................... 15
11.1. Purpose .................................................................................................................................... 15
11.2. Standard for Quality Test .......................................................................................................... 15
11.3. Nonconforming Analysis & Disposition .....................................................................................15
11.4. Agreement Items ...................................................................................................................... 15
11.5. Standard of the Product Visual Inspection ............................................................................... 15
11.6. Inspection Specification ............................................................................................................16
11.7. Classification of Defects ........................................................................................................... 22
11.8. Identification/marking criteria ....................................................................................................22
11.9. Packaging ................................................................................................................................. 22
12. Reliability Specification .......................................................................................................................23
13. Precautions and Warranty .................................................................................................................. 24
13.1. Safety ....................................................................................................................................... 24
13.2. Handling ................................................................................................................................... 24
13.3. Storage .....................................................................................................................................24
13.4. Metal Pin (Apply to Products with Metal Pins) ......................................................................... 24
13.5. Operation ..................................................................................................................................25
13.6. Static Electricity ........................................................................................................................ 25
13.7. Limited Warranty ...................................................................................................................... 25
14. Packaging ........................................................................................................................................... 26
15. Outline Drawing .................................................................................................................................. 27

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Rev:1.3

1. General Description

The specification is a transmissive type color active matrix liquid crystal display (LCD) which uses
amorphous thin film transistor (TFT) as switching devices. This product is composed of a TFT-LCD panel,
driver ICs, a touch panel and a backlight unit.

2. Module Parameter

Features Details Unit

Display Size(Diagonal) 10.4”
LCD type IPS TFT
Display Mode Transmissive / Normally Black
Resolution 1024 x 768 Pixels
View Direction full view Best Image
Module Outline 264.3(H) x 185.8(V) x 8.65(T) (Note1 ) mm
Active Area 211.2(H) x 158.40(V) mm
Pixel Pitch 206.25 x 206.25 um
Pixel Arrangement RGB Vertical stripe
Polarizer Surface Treatment Anti-glare
Display Colors 16.7 M
Interface LVDS
Driver IC JD9168S -
With or Without Touch Panel With CTP
Operating Temperature -20～70 ºC
Storage Temperature -30～80 ºC
Weight 746 g
Note 1: Exclusive hooks, posts, FFC/FPC tail etc.

3. Absolute Maximum Ratings

GND=0V, Ta=25ºC
Item Symbol Min. Max. Unit
Supply Voltage VDD -0.3 3.6 V
Storage temperature Tstg -30 +80 ºC
Operating temperature Top -20 +70 ºC
Note 1: If Ta below 50ºC, the maximal humidity is 90%RH, if Ta over 50ºC, absolute humidity should be
less than 60%RH.
Note 2: The response time will be extremely slow when the operating temperature is around -10℃, and
the back ground will become darker at high temperature operating.

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4. DC Characteristics

Item Symbol Min. Typ. Max. Unit

Supply Voltage VDD 2.5 3.0 3.3 V
Differential input high threshold voltage RxVTH +0.1 +0.2 +0.3 V
Differential input low threshold voltage RxVTL -0.3 -0.2 -0.1 V
Input voltage range (singled-end) RxVIN 0.7 - 1.7 V
Differential input common mode voltage RxVCM 1.0 1.2 1.4 V
Current Consumption
IDD - 72 - mA
All White

5. Backlight Characteristic

5.1. LED Driver

Item Symbol Condition Min. Typ. Max. Unit

Power supply for BL driver VLED - 12 - V
EN PWM Logic-High VIH 1.5 3.3 3.6
V
Threshold Voltage Logic-Low VIL 0 - 0.6
PWM Dimming Frequency 0.1 - 30 KHZ
Note1：Backlight drive circuit 12V input

5.2. Backlight Characteristic

Item Symbol Condition Min. Typ. Max. Unit

Forward Voltage VF Ta=25 ºC, IF=60mA/LED 22.4 24 26.4 V
Forward Current IF Ta=25 ºC, VF=3.0V/LED - 240 - mA
Power dissipation PD - - 5.76 - W
Uniformity Avg - - 80 - %
LED working life(25℃) - - 30000 - Hrs
Drive method Constant current
LED Configuration 32 White LEDs (8 LEDs in one string and 4 groups in parallel)
Note1：LED life time defined as follows: The final brightness is at 50% of original brightness.
The environmental conducted under ambient air flow, at Ta=25±2 ºC,60%RH±5%, IF=60mA/LED.
5.3. Backlighting circuit

A K
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6. Touch Screen Panel Specifications

Item CTP Description

1 IC ILI2511
2 Interface USB
3 Operation voltage 5V
4 Surface hardness ≥6H
5 Operation temperature -20℃~+70℃
6 Storage temperature -30℃~+80℃
7 Strengthened Type Chemical
8 Transmittance ≥85%
9 Origin of Coordinates T/L
10 Resolution Ratio 1024*768

Item Main layer define Thinkness/materials

1 Lens 2.0mm/Glass
2 OCA 0.25mm
3 Sensor 0.7mm

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7. Optical Characteristics

7.1. Optical Characteristics

Ta=25ºC,VDD=3.0V
Specification
Item Symbol Condition Unit
Min. Typ. Max.
Luminance on
Lv 400 500 - cd/m²
TFT( I f =60mA/LED)
Backlight On (Transmissive Mode)

Contrast ratio(See 6.3) CR 1000 1200 -

Response time TR
- 25 35 ms
(See 6.2) TF
XR 0.615 0.665 0.715
Red
YR 0.268 0.318 0.368
XG 0.258 0.308 0.358
Chromaticity Green
YG 0.588 0.638 0.688
Transmissive Backlight is on
XB 0.067 0.117 0.167
(See 6.5) Blue
YB 0.003 0.053 0.103
XW 0.236 0.286 0.336
White
YW 0.278 0.328 0.378
θX+ 80 85 -
Viewing Horizontal
θX- 80 85 -
Angle Center CR≥10 Deg.
φY+ 80 85 -
(See 6.4) Vertical
φY- 80 85 -

NTSC Ratio(Gamut) - θ=0º 65 70 - %

7.2. Definition of Response Time

7.2.1. Normally Black Type (Negative)

Relative Non-selected state Non-selected state

Selected state
Brightness

100%

90%

10%

0%
Tr Tf

Tr is the time it takes to change form non-selected stage with relative luminance 10%
to selected state with relative luminance 90%;
Tf is the time it takes to change from selected state with relative luminance 90% to
non-selected state with relative luminance 10%.

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Note : Measuring machine: LCD-5100

7.2.2. Normally White Type (Positive)

Relative Non-selected state Non-selected state

Selected state
Brightness

100%

90%

10%

0%
Tr Tf

Tr is the time it takes to change form non-selected stage with relative luminance 90%
to selected state with relative luminance 10%;
Tf is the time it takes to change from selected state with relative luminance 10% to
non-selected state with relative luminance 90%;
Note : Measuring machine: LCD-5100 or EQUI
7.3. Definition of Contrast Ratio
Contrast is measured perpendicular to display surface in reflective and transmissive mode.
The measurement condition is:
Measuring Equipment Eldim or Equivalent
Measuring Point Diameter 3mm//1mm
Measuring Point Location Active Area centre point
A: All Pixels white
Test pattern
B: All Pixel black
Contrast setting Maximum
Definitions: CR (Contrast) = Luminance of White Pixel / Luminance of Black Pixel
7.4. Definition of Viewing Angles

Measuring machine: LCD-5100 or EQUI

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7.5. Definition of Color Appearance

R,G,B and W are defined by (x, y) on the IE chromaticity diagram
NTSC=area of RGB triangle/area of NTSC triangleX100%
Measuring picture: Red, Green, Blue and White (Measuring machine: BM-7)

7.6. Definition of Surface Luminance, Uniformity and Transmittance

Using the transmissive mode measurement approach, measure the white screen luminance of
the display panel and backlight.
7.6.1. Surface Luminance: LV = average (LP1:LP9)
7.6.2. Uniformity = Minimal (LP1:LP9) / Maximal (LP1:LP9) * 100%
7.6.3. Transmittance = LV on LCD / LV on Backlight * 100%

Note: Measuring machine: BM-7

X
X/6 X/3 X/3 X/6
Display Area

Y/6
1 2 3
Y/3
Y
4 5 6
c
Y/3

7 8 9
Y/6

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8. Block Diagram and Power Supply

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9. Interface Pins Definition

No. Symbol Function Remark

1 GND Ground
2 GND Ground
3 EN Enable Control for Backlight
4 PWM Brightness Control for Backlight
5 VLED Power Supply for LED Backlight (12V)
6 VLED Power Supply for LED Backlight (12V)
7 VDD Power Supply
8 NC No connection
9 NC No connection
10 GND Ground
11 RxIN0- Negative LVDS Differential Data Input
12 RxIN0+ Positive LVDS Differential Data Input
13 GND Ground
14 RxIN1- Negative LVDS Differential Data Input
15 RxIN1+ Positive LVDS Differential Data Input
16 GND Ground
17 RxIN2- Negative LVDS Differential Data Input
18 RxIN2+ Positive LVDS Differential Data Input
19 GND Ground
20 RxCLK- Negative LVDS Differential Clock Input
21 RxCLK+ Positive LVDS Differential Clock Input
22 GND Ground
23 RxIN3- Negative LVDS Differential Data Input
24 RxIN3+ Positive LVDS Differential Data Input
25 VDD Power Supply
26 NC No connection
27 NC No connection
28 NC No connection
29 NC No connection
30 GND Ground

CTP:
No. Symbol Function
1 VDD CTP Power Supply
2 D+ CTP Data
3 D- CTP Data
4 GND CTP Ground

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CN3:
No. Symbol Function
1 SCL CTP Serial Clock Signal
2 INT CTP Interrupt Signal
3 SDA CTP Serial Data Signal
4 VDUT CTP Power Supply
5 GND CTP Ground
6 NC No connection

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10. AC Characteristics

10.1. RGB timing table

Spec.
Parameter Symbol Unit
Min. Typ. Max.
DCLK Frequency fclk - (51) - MHz
Horizontal Display Area thd 1024 DCLK
HS Period th - (1084) - DCLK
HS Pulse Width thpw - (20) - DCLK
HS Back Porch thbp - (20) - DCLK
HS Front Porch thfp - (20) - DCLK
Vertical Display Area thd 768 TH
VS Period th - (784) - TH
VS Pulse Width thpw - (1) - TH
VS Back Porch thbp - (8) - TH
VS Front Porch thfp - (7) - TH

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10.2.8-Bit LVDS Input

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 T104102768-A4WMC-003
Rev:1.3

11. Quality Assurance

11.1.Purpose
This standard for Quality Assurance assures the quality of LCD module products supplied to
customer.
11.2.Standard for Quality Test

11.2.1. Sampling Plan:

GB2828.1-2012
Single sampling, general inspection level II
11.2.2. Sampling Criteria:
Visual inspection: AQL 1.5
Electrical functional: AQL 0.65.
11.2.3. Reliability Test:
Detailed requirement refer to Reliability Test Specification.

11.3.Nonconforming Analysis & Disposition

11.3.1. Nonconforming analysis:

11.3.1.1. Customer should provide overall information of non-conforming sample for
their complaints.
11.3.1.2. After receipt of detailed information from customer, the analysis of
nonconforming parts usually should be finished in one week.
11.3.1.3. If cannot finish the analysis on time, customer will be notified with the
progress status.
11.3.2. Disposition of nonconforming:
11.3.2.1. Non-conforming product over PPM level will be replaced.
11.3.2.2. The cause of non-conformance will be analyzed. Corrective action will be
discussed and implemented.
11.4.Agreement Items
Shall negotiate with customer if the following situation occurs:
11.4.1. There is any discrepancy in standard of quality assurance.
11.4.2. Additional requirement to be added in product specification.
11.4.3. Any other special problem.

11.5.Standard of the Product Visual Inspection

11.5.1. Appearance inspection:

11.5.1.1. The inspection must be under illumination about 1000 – 1500 lx, and the
distance of view must be at 30cm ± 2cm.
11.5.1.2. The viewing angle should be 45° from the vertical line without reflection light
or follows customer's viewing angle specifications.
11.5.1.3. Definition of area: A Zone: Active Area, B Zone: Viewing Area,

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Eye Eye

45° 45°
A zone

B zone

11.5.2. Basic principle:

11.5.2.1. A set of sample to indicate the limit of acceptable quality level must be
discussed by both us and customer when there is any dispute happened.
11.5.2.2. New item must be added on time when it is necessary.
11.6.Inspection Specification

No. Item Criteria (Unit: mm)

Area
Acc. Qty
Black / White spot Size
a
Foreign material φ≤0.20 Ignore
(Round type) 0.20<φ≤0.50 N≤3
01 Pinholes 0.50<φ 0
Stain
b
Particles inside cell.
(Minor defect) φ= ( a + b) /2

Distance between 2 defects should more than 5mm apart.

Display Area Total

Bright dot
N≤2 N≤2
Note1
Dark dot N≤4 N≤4
Electrical Defect Total dot N≤4 N≤4
02
(Minor defect) Not visible through 5% ND
Mura Note 2
filters.
Remark:
1. Bright dot caused by scratch and foreign object accords to item 1.

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L
Black and White line L
Scratch
03 Foreign material
(Line type)
(Minor defect) Length Width Acc. Qty

/ W ≦ 0.1 Ignore
L ≦ 2.5 0.1 ＜ W ≦ 0.2 3
L＞2.5 0.2 ＜ W 0
Total 3

Distance between 2 defects should more than 3mm apart. Scratches not
viewable through the back of the display are acceptable.

Glass Crack
04
(Minor defect)

Crack is potential to enlarge, any type is not allowed.

Glass Chipping Pad Area:

(Minor defect)
Length and Width Acc. Qty
c > 3.0, b< 1.0 1
05 c< 3.0, b< 1.0 3
a<Glass Thickness

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Glass Chipping Rear of Pad Area:

(Minor defect)
Length and Width Acc. Qty
c > 3.0, b< 1.0 1
06 c< 3.0, b< 1.0 2
c< 3.0, b< 0.5 4
a<Glass Thickness

Glass Chipping Except Pad Area:

(Minor defect)
Length and Width Acc. Qty
c > 3.0, b< 1.0 1
07 c< 3.0, b< 1.0 2
c< 3.0, b< 0.5 4
a<Glass Thickness

Glass Corner Chipping:

(Minor defect)
Length and Width Acc. Qty
c < 3.0, b< 3.0 Ignore
08 a<Glass Thickness

Glass Burr:
(Minor defect) Length Acc. Qty
F < 1.0 Ignore

Glass burr don’t affect assemble and module

dimension.

09

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FPC Defect:
(Minor defect)
10.1 Dent, pinhole width a<w/3.
a
(w: circuitry width.)
10 w
10.2 Open circuit is unacceptable.
10.3 No oxidation, contamination and distortion.
a

Diameter Acc. Qty

Bubble on Polarizer φ≤0.30 Ignore
11
(Minor defect) 0.30 <φ≤0.50 N≤2
0.50 < φ N=0

Diameter Acc. Qty

Dent on Polarizer φ≤0.25 Ignore
12
(Minor defect) 0.25 <φ≤0.50 N≤4
0.50 < φ None

13.1 No rust, distortion on the Bezel.

13 Bezel
13.2 No visible fingerprints, stains or other contamination.

14.1 No distortion or contamination on PCB terminals.

14.2 All components on PCB must same as documented on the
14 PCB
BOM/component layout.
14.3 Follow IPC-A-600F.

15 Soldering Follow IPC-A-610C standard

The below defects must be rejected.

16.1 Missing vertical / horizontal segment,
16.2 Abnormal Display.
16.3 No function or no display.
Electrical Defect
16 16.4 Current exceeds product specifications.
(Major defect)
16.5 LCD viewing angle defect.
16.6 No Backlight.
16.7 Dark Backlight.
16.8 Touch Panel no function.
Remark: LCD Panel Broken shall be rejected. Defect out of LCD viewing area is acceptable.

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Inspection Specification for the Capacitive Touch Panel

Chipping Pad Area(Not include the cover

lens):
(Minor defect)
The chip is seriously influence the product’s function,
01 any type is not allowed.

Chipping Except Pad Area(Not include the

cover lens): Length and Width Acc. Qty
(Minor defect) c< 1.5, b< 1 N≤5
a<1/2 Glass Thickness
02

Corner Chipping(Not include the cover

lens): Length and Width Acc. Qty
(Minor defect) c < 1.5, b< 0.5 Ignore
a<1/2 Glass Thickness
03

Crack:
04
(Minor defect)

Crack is potential to enlarge, any type is not allowed.

05 Cover lens must be without any chips, cracks or other damage when viewed from the front.

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D: Diameter W: width L: length

Diameter Acc. Qty

D < 0.20 Ignore

Active Area：

Diameter Acc. Qty

Same/Different color spot 0.20 ＜ D ≦ 0.30 2

0.30 ＜ D ≦ 0.50 1
D>0.5 NG
06
Viewing Area :

Diameter Acc. Qty

D<0.20 Ignore
0.20 ＜ D ≦ 0.5 3
D>0.5 NG

Distance between 2 defects should more than15mm

apart.

Cover lens line Scratch

Length Width Acc. Qty

/ W ≦ 0.08mm Ignore
L ≦ 5 0.08 ＜ W ≦ 0.15 2
07 L ≦ 3 0.15 ＜ W ≦ 0.20 1
- W>0.2 NG
L>5 - NG
Distance between 2 defects should more than15mm
apart.

Printing sawtooth
Length Width Acc. Qty

/ W ≦ 0.2mm 2
08
L ≦ 2 0.2 ＜ W ≦ 0.3 1
L ≦ 2 W>0.3 NG

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11.7.Classification of Defects

11.7.1. Visual defects (Except no / wrong label) are treated as minor defect and electrical
defect is major.
11.7.2. Two minor defects are equal to one major in lot sampling inspection.

11.8.Identification/marking criteria
Any unit with illegible / wrong /double or no marking/ label shall be rejected.
11.9.Packaging

11.9.1. There should be no damage of the outside carton box, each packaging box should
have one identical label.
11.9.2. Modules inside package box should have compliant mark.
11.9.3. All direct package materials shall offer ESD protection
Note1: Bright dot is defined as the defective area of the dot is larger than 50% of one sub-pixel area.

Bright dot: The bright dot size defect at black display pattern. It can be recognized by 2% transparency of
filter when the distance between eyes and panel is 350mm±50mm.
Dark dot: Cyan, Magenta or Yellow dot size defect at white display pattern. It can be recognized by 5%
transparency of filter when the distance between eyes and panel is 350mm±50mm.
Note2: Mura on display which appears darker / brighter against background brightness on parts of
display area.

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12. Reliability Specification

No Item Condition Quantity Criteria

GB/T2423.2
1 High Temperature Operating 70℃, 96Hrs 2
-2008
GB/T2423.1
2 Low Temperature Operating -20℃, 96Hrs 2
-2008
GB/T2423.3
3 High Humidity Storage 50℃, 90%RH, 96Hrs 2
-2016
GB/T2423.2
4 High Temperature Storage 80℃, 96Hrs 2
-2008
GB/T2423.1
5 Low Temperature Storage -30℃, 96Hrs 2
-2008
-20℃, 70min~70℃, 60min, GB/T2423.22
6 Thermal Cycling Test Storage 2
20 cycles. -2012
Frequency range:10Hz~50Hz
GB/T5170.14
7 Packing vibration Acceleration of gravity:5G -
-2009
X,Y,Z 30 min for each direction.
Air:±4KV 150pF/330Ω 5 times GB/T17626.2
8 Electrical Static Discharge 2
Contact:±2KV 150pF/330Ω 5 times -2018

Drop Test Height:80 cm,1 corner, 3 edges, GB/T2423.7

9 -
(Packaged) 6 surfaces. -2018

Note1. No defection cosmetic and operational function allowable.

Note2. Total current Consumption should be below double of initial value

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13. Precautions and Warranty

13.1.Safety

13.1.1. The liquid crystal in the LCD is poisonous. Do not put it in your mouth. If the liquid
crystal touches your skin or clothes, wash it off immediately using soap and water.
13.1.2. Since the liquid crystal cells are made of glass, do not apply strong impact on them.
Handle with care.

13.2.Handling

13.2.1. Reverse and use within ratings in order to keep performance and prevent damage.
13.2.2. Do not wipe the polarizer with dry cloth, as it might cause scratch. If the surface of the
LCD needs to be cleaned, wipe it swiftly with cotton or other soft cloth soaked with
petroleum IPA, do not use other chemicals.

13.3.Storage

13.3.1. Do not store the LCD module beyond the specified temperature ranges.
13.3.2. Strong light exposure causes degradation of polarizer and color filter.

13.4.Metal Pin (Apply to Products with Metal Pins)

13.4.1. Pins of LCD and Backlight

13.4.1.1. Solder tip can touch and press on the tip of Pin LEAD during the soldering
13.4.1.2. Recommended Soldering Conditions
Solder Type: Sn96.3~94-Ag3.3~4.3-Cu0.4~1.1

Maximum Solder Temperature: 370℃

Maximum Solder Time: 3s at the maximum temperature

Recommended Soldering Temp: 350±20℃

Typical Soldering Time: ≤3s

13.4.1.3. Solder Wetting

Solder Pin Lead Solder Pin Lead

Recommended Not Recommended
13.4.2. Pins of EL
13.4.2.1. Solder tip can touch and press on the tip of EL leads during soldering.
13.4.2.2. No Solder Paste on the soldering pad on the motherboard is recommended.
13.4.2.3. Recommended Soldering Conditions
Solder type: Nippon Alimit Leadfree SR-34, size 0.5mm

Recommended Solder Temperature: 270～290℃

Typical Soldering Time: ≤2s

Minimum solder distance from EL lamp (body):2.0mm
13.4.2.4. No horizontal press on the EL leads during soldering.
13.4.2.5. 180° bend EL leads three times is not allowed.

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13.4.2.6. Solder Wetting

Recommended Not Recommended

13.4.2.7. The type of the solder iron:

Recommended Not Recommended

13.4.2.8. Solder Pad

13.5.Operation

13.5.1. Do not drive LCD with DC voltage

13.5.2. Response time will increase below lower temperature
13.5.3. Display may change color with different temperature
13.5.4. Mechanical disturbance during operation, such as pressing on the display area, may
cause the segments to appear “fractured”.
13.5.5. Do not connect or disconnect the LCM to or from the system when power is on.
13.5.6. Never use the LCM under abnormal condition of high temperature and high humidity.
13.5.7. Module has high frequency circuits. Sufficient suppression to the electromagnetic
interface shall be done by system manufacturers. Grounding and shielding methods
may be important to minimize the interference.
13.5.8. Do not display the fixed pattern for long time（we suggest the time not longer than one
hour）because it will develop image sticking due to the TFT structure.

13.6.Static Electricity

13.6.1. CMOS LSIs are equipped in this unit, so care must be taken to avoid the
electro-static charge, by ground human body, etc.
13.6.2. The normal static prevention measures should be observed for work clothes and
benches.
13.6.3. The module should be kept into anti-static bags or other containers resistant to static
for storage.

13.7.Limited Warranty

13.7.1. Our warranty liability is limited to repair and/or replacement. We will not be
responsible for any consequential loss.
13.7.2. If possible, we suggest customer to use up all modules in six months. If the module
storage time over twelve months, we suggest that recheck it before the module be
used.
13.7.3. After the product shipped, any product quality issues must be feedback within three
months, otherwise, we will not be responsible for the subsequent or consequential
events.

25/27
 T104102768-A4WMC-003
Rev:1.3

14. Packaging

TBD

26/27
 REV. DESCRIPTION DATE NAME
A First Issue 24.06.15 CYB
B Change remarks 24.06.20 CYB
C Modify BLU and LENS 24.08.01 CYB
D Modify LENS and Add Detail map 24.08.02 CYB
E Add Dimension 24.08.08 CYB

264.3±0.3/LENS
(26.25) 211.8±0.2/LENS V.A 26.25±0.2 8.65±0.5
(26.55) (211.2)/LCD A.A (26.55)
2.95±0.25/CTP

13.4±0.2
(132.15) 20±0.4

(13.7)
5.5±0.3/LCM (18.1) 226.2±0.3/LCM

(0,0) X:1024Max A
LCM

6.5±0.4
Black Tape
15. Outline Drawing

PIN Symbol
Y:768Max Engrave line

(92.9)
Ambient Light 1 GND
Sensor(OPT3001) 29.5±0.5
attached to LENS
2 GND
(1.1)/Senosr
The component 3±0.3
13.15±0.3 components
area faces LENS Connector:STM MSBK2407P30 3 EN
)
10.4"TFT (? 2 6 RF:HB or Equivalent 4 PWM
1024(RGB)*768 1
CN3 5 VLED-12V
Black semi-permeable hole,

(158.4)/LCD A.A
Insertion Direction

185.8±0.3/LENS
174.65±0.3/LCM

159±0.2/LENS V.A
0.5±0.1
550nm transmittance less 6 VLED-12V

3.5±0.1
than 7% 30 1
7 VDD

W=0.35±0.05
P0.5*5=2.5±0.05
8 NC

OCA T=0.25mm

92.9±0.3
Black Tape 9 NC
(51.25)

10

(13.7)
GND

(13.4)
Tear Tape
11 RxIN0-
4-2 Insulation Tape 12 RxIN0+

4-4
B

4-2

5°
AG&AR&AF (72.38) 13 GND
(4.65)

Black Silk

27/27
component
area Insulation 14 RxIN1-
Tape

43.59±0.5
SUS 304
1 4 T=0.2mm
CTP 15 RxIN1+
(15) (4.08)
SYA1250WR-S-04P 37.72±0.5
or Equivalent
PIN Symbol 16 GND
Insertion Direction 1 VDD 17 RxIN2-
2 D+ 18 RxIN2+
2/LENS D- 19 GND
0.25/OCA 3
2/LENS 0.7/Sensor
0.25/OCA
4 GND 20 RxCLK-
0.25/OCA
0.7/Sensor LENS LCM
5.5/LCM 21 RxCLK+
0.25/OCA DST
OCA
5.5/LCM CN3 22 GND
Sensor PCB
PCB Component
23 RxIN3-
OCA PIN Symbol
LENS
24 RxIN3+
OCA LCM 1 SCL 25 VDD
Sensor 0.1/DST 2 INT
1.6/PCB 26 NC
OCA (2)/PCB Component 3 SDA
27 NC
4 VDUT
28 NC
LCM FPC GND
5 NC
29
Notes: CTP FPC 6 NC
30 GND
1.Display size:10.4"TFT IPS Detail A 5:1
Detail B 5:1
2.Viewing direction:full view
3.Display mode:Transmissive/Normal Black/Anti-Glare Item CTP Description
4.Operation temperature:-20°C~+70°C ILI2511 Item Main layer define Thinkness/materials
A K
1 IC
5.Storage temperature:-30°C~+80°C 1 Lens 2.0mm/Glass Backlight LED Circuit:8×4=32(LED)
2 Interface USB
6.Driver IC:JD9168S 2 OCA 0.25mm If=240mA;Vf=22.4V~26.4V
7.Power supply voltage:3.0V 3 Operation voltage 5V
3 Sensor 0.7mm
8.Backlight :White(32LED)/24(TYP)V/240mA 4 Surface hardness ≥6H General Tolerance± VERSION DATE MODEL NAME:
(Backlight drive circuit 12V input) 5 Operation temperature -20°C~+70°C DIM Level 1 2 3 4
9.LCM Luminance:500(TYP)cd/m2(with CTP) 0-5 0.05 0.1 0.1 0.2
E 2024.08.08
6 Storage temperature -30°C~+80°C
10.Interface type:LVDS 7 Strengthened Type Chemical 5-10 0.05 0.1 0.1 0.2 SCALE NO. UNIT TITLE:
11.RoHS must be complied 10-50 0.05 0.1 0.2 0.3
8 Transmittance ≥85%
* The dimension with mark brackets "()"just for reference 50-100 0.1 0.2 0.3 0.5
9 Origin of coordinates T/L 100-150 0.1 0.2 0.5 0.8
APPROVED CHECKED DRAWN FILE NAME:
10 Resolution Ratio 1024*768 Level Seclect WSL ZWH CYB
Rev:1.3
T104102768-A4WMC-003