MLCC Automotive 1837966

January 2024
MULTILAYER CERAMIC
CAPACITORS
for AUTOMOTIVE
OBC BAU
BMS Lighting
MULTILAYER CERAMIC CAPACITORS
for AUTOMOTIVE
Interactive User Guide

Samsung Electro-Mechanics’ MLCC for AUTOMOTIVE Catalog was produced as an INTERACTIVE PDF that
allows transferring to related webpages for better understanding of the content. Click ‘HOME,’ ‘CONTENTS,’
OR ‘GO BACK TO PAGE’ as needed, and it is also possible to ‘PRINT’ the pages. If you click the icon at the
top of the page, it is possible to view a specific page of choice.
By clicking this icon, you can By clicking this icon, you can
jump directly to the cover page of jump directly to the Table of
this catalog. Contents.
By clicking this icon, you can By clicking this icon, you can set
jump directly to the previous page. and print pages of your choice.
C O N T E N T S
04 Part Numbering
06 General Capacitors
30 Mid/High Voltage Capacitors
36 High Bending Strength Capacitors
46 Fail Safe Capacitors
48 High Temperature Capacitors
52 ESD Protection Capacitors
53 Low ESL Capacitors
54 Application Guide
74 Reliability Test Conditions
78 Packaging Specifications
83 Caution/Notice
105 Components Sales Offices/Manufacturing Sites

Part Numbering High Temperature Capacitors Packaging Specifications
General Capacitors ESD Protection Capacitors Caution/Notice
Mid/High Voltage Capacitors Low ESL Capacitors Components Sales Offices/
High Bending Strength Capacitors Application Guide Manufacturing Sites
Fail Safe Capacitors Reliability Test Conditions
Part Numbering
CL 10 B 105 K B 9 V P N C
1 2 3 4 5 6 7 8 9 10 11
1 SERIES CODE
CL = Multilayer Ceramic Capacitors
2 SIZE CODE
Code Inch(mm) Code Inch(mm)
03 0201(0603) 21 0805(2012)
L5 0204(0510) 31 1206(3216)
05 0402(1005) 32 1210(3225)
10 0603(1608)
3 DIELECTRIC CODE
Class I (Temperature Compensation)
Symbol EIA Code Operation Temperature Range (℃) Temperature Coefficient Range (ppm/℃)
C C0G -55 ~ +125 0 ±30
G X8G -55 ~ +150 0 ±30
Class Ⅱ (High Dielectric Constant)

Symbol EIA Code Operation Temperature Range (℃) Capacitance Change (△℃%)
B X7R -55 ~ +125 ±15
Y X7S -55 ~ +125 ±22
Z X7T -55 ~ +125 -33 ~ +22
E X8L -55 ~ +150 -40 ~ +15
M X8M -55 ~ +150 -50 ~ +15
4 CAPACITANCE CODE
Capacitance expressed in ㎊. 2 significant digits plus number of zeros. example) 107=10×107=100,000,000㎊
For values ＜10㎊, Letter R denotes decimal point example) 1R5 =1.5㎊
5 CAPACITANCE TOLERANCE CODE

Code Tolerance TCC Capacitance series Remark
B ±0.1㎊ C0G E-12 series* ≤2pF
C ±0.25㎊ C0G E-12 series* ≤5pF
D ±0.5㎊ C0G E-12 series* 5pF<Cp<10pF
J ±5% C0G E-12 series ≥10pF
K ±10% X7R/X7S E-6 series
M ±20% X7R/X7S E-6 series
* E-24 series is also available (necessary to be checked with Sales or Marketing department.)
※ This code has only typical specifications. Please refer to individual specifications.
※ Please contact us for tolerance which are not indicated the above table. (A: ±0.05㎊ F: 1% G: 2%)
MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 04

Part Numbering
Code Capacitance Step
E-3 1.0 2.2 4.7
E-6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
E-24
1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1
6 RATED VOLTAGE CODE

S = 2.5V R = 4V Q = 6.3V P = 10V O = 16V A = 25V L = 35V B = 50V T = 75V C = 100V E = 250V H = 630V I = 1000V
7 THICKNESS CODE
Size inch/mm Code Thickness* Tolerance Size inch/mm Code Thickness* Tolerance
3 0.30 ± 0.03 9 0.80 ± 0.20
0201/0603 S 0.30 ± 0.05 0805/2012 Y 1.25 ± 0.20
R 0.30 ± 0.09 B 1.25 ± 0.25
2 0.20 ± 0.02 P 1.15 ± 0.10
0204/0510
4 0.43 ± 0.10 F 1.25 ± 0.15
5 0.50 ± 0.05 1206/3216 W 1.05 ± 0.20
0402/1005
6 0.50 ± 0.20 H 1.60 ± 0.20
8 0.80 ± 0.10 K 1.60 ± 0.30
0603/1608
9 0.90 ± 0.10 U 1.80 ± 0.20
6 0.60 ± 0.10 I 2.00 ± 0.20
1210/3225
C 0.85 ± 0.10 J 2.50 ± 0.20
0805/2012
F 1.25 ± 0.10 V 2.50 ± 0.30
Q 1.25 ± 0.15
* In case of High Bending Strength, ESD protection capacitors, Please refer to individual specifications.
8 DESIGN CODE
Code Inner electrode Termination Plating material Design
1 Ni Cu Ni_Sn 100% Standard
2 Ni Cu Ni_Sn 100% Open Mode
3 Ni Cu Ni_Sn 100% Float Mode
4 Ni Cu_Ag Epoxy Ni_Sn 100% Standard
5 Ni Cu_Ag Epoxy Ni_Sn 100% Open Mode
6 Ni Cu_IMC Epoxy Ni_Sn 100% Standard
P Ni Cu_IMC Epoxy Ni_Sn 100% Open Mode
R Ni Cu_IMC Epoxy Ni_Sn 100% Float Mode
V Ni Cu_Cu Epoxy Ni_Sn 100% Standard
W Ni Cu_Cu Epoxy Ni_Sn 100% Open Mode
X Ni Cu_Cu Epoxy Ni_Sn 100% Float Mode
9 PRODUCT CODE OR SIZE CONTROL CODE

P = Automotive product meet AEC - Q200
10 CONTROL CODE
N = Standard J = High Bending Strength E = ESD Protection
11 PACKAGING CODE
Code Type Code Type
C Cardboard Tape, 7"reel E Embossed Tape, 7"reel
D/L Cardboard Tape, 13"reel (Quantity option)* F Embossed Tape, 13"reel
* Refer to the packaging specsheet

General Capacitors General
Features
Manufactured by state-of-the-art facilities, recommended for registration of ISO 9001 & IATF 16949
AEC-Q200 and JEDEC-020-D qualified products.
RoHS compliant products.
X7R dielectric components have BME and metal-epoxy terminations with a Ni/Sn plated overcoat.
C0G dielectric components contain BME and copper terminations with a Ni/Sn plated overcoat.
❶ Ceramic Body
❷ Electrode (Ni)
❸ ‌Termination
(Cu or Cu+Metal Epoxy)
❹ Plating (Ni)
⑤ Plating (Sn)
Applications
‌Powertrain, Safety, Body & Chassis, Convenience, Infotainment, ADAS and Electric Vehicle
Structure and Dimensions

BW
BW
T (Thickness)
T(Thickness)
W (Width)
L (Length) W(Width)
L(Length)
C0G
Plating (Sn)
Plating (Ni)
Termination (Cu)
Electrode (Ni)
Ceramic Body
X7R Standard [VPN, 6PN] X7R Open mode [WPN]
Plating (Sn)
Plating (Ni)
Termination (Metal - Epoxy)
Termination (Cu)
Electrode (Ni)
Ceramic Body

General Capacitors
Thickness Dimension (mm)
Size Code EIA (inch)
Code L W T BW
3 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05
03 S 0.60±0.05 0.30±0.05 0.30±0.05 0.15±0.05 0201
R 0.60±0.09 0.30±0.09 0.30±0.09 0.15±0.05
5 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10
05 0402
6 1.00±0.20 0.50±0.20 0.50±0.20 0.25±0.10
8 1.60±0.10 0.80±0.10 0.80±0.10 0.30±0.20
10 0603
9 1.60±0.20 0.80±0.20 0.80±0.20 0.30±0.20
6 2.00±0.10 1.25±0.10 0.60±0.10 0.50+0.20/-0.30
C 2.00±0.10 1.25±0.10 0.85±0.10 0.50+0.20/-0.30
F 2.00±0.10 1.25±0.10 1.25±0.10 0.50+0.20/-0.30
21 0805
Q 2.00±0.15 1.25±0.15 1.25±0.15 0.50+0.20/-0.30
Y 2.00±0.20 1.25±0.20 1.25±0.20 0.50+0.20/-0.30
B 2.00±0.25 1.25±0.25 1.25±0.25 0.50+0.20/-0.30
P 3.20±0.15 1.60±0.15 1.15±0.10 0.50±0.30
W 3.20±0.20 1.60±0.20 1.05±0.20 0.50±0.30
31 1206
H 3.20±0.20 1.60±0.20 1.60±0.20 0.50±0.30
K 3.20±0.30 1.60±0.30 1.60±0.30 0.50±0.30
U 3.20±0.30 2.50±0.20 1.80±0.20 0.60±0.30
I 3.20±0.30 2.50±0.20 2.00±0.20 0.60±0.30
32 1210
J 3.20±0.30 2.50±0.20 2.50±0.20 0.60±0.30
V 3.20±0.40 2.50±0.30 2.50±0.30 0.60±0.30
Capacitance Table (C0G)
Rated Capacitance
Size Code Capacitance
Category TCC Voltage pF nF uF
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
50 1pF - 1nF
0402/1005
100 1pF - 1nF
50 1pF - 1nF
AEC-Q200 C0G 0603/1608
100 1pF - 1nF
Normal (125℃)
50 10pF - 10nF
0805/2012
100 12pF - 10nF
1206/3216 100 4.7nF - 4.7nF

General Capacitors
Capacitance Table (X7R/X7S/X7T)
Rated Capacitance
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
6.3 1nF - 10nF
10 1nF - 10nF
0201/0603
16 1nF – 10nF
25 1nF – 10nF
6.3 100nF - 100nF
10 10nF - 220nF
16 330pF - 220nF
0402/1005
25 1nF - 220nF
50 220pF - 100nF
100 220pF - 10nF
6.3 1uF - 1uF
10 220nF - 1uF
16 1.2nF - 1uF
0603/1608 25 1nF - 1uF
35 470nF - 1uF
50 220pF - 1uF
100 220pF - 100nF
6.3 4.7uF - 10uF
X7R
10 1uF - 10uF
(125℃)
16 220nF - 4.7uF
0805/2012 25 100nF - 4.7uF
35 1uF - 4.7uF
50 470pF - 2.2uF
AEC-Q200
100 470pF - 1uF
Normal
6.3 15uF - 22uF
10 6.8uF - 22uF
16 2.2uF - 10uF
1206/3216 25 100nF - 10uF
35 10uF - 10uF
50 100nF - 10uF
100 100nF - 2.2uF
6.3 47uF - 47uF
10 22uF - 22uF
16 10uF - 22uF
1210/3225
25 4.7uF - 10uF
50 1uF - 10uF
100 1uF - 2.2uF
4 100nF - 100nF
0201/0603 6.3 22nF - 100nF
16 100nF - 100nF
6.3 220nF - 1uF
X7S 0402/1005 10 220nF - 1uF
(125℃) 16 220nF - 220nF
6.3 2.2uF - 4.7uF
10 1.5uF - 4.7uF
0603/1608
16 1.0uF - 2.2uF
25 2.2uF - 2.2uF

General Capacitors
Rated Capacitance
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
6.3 6.8uF - 10uF

10 4.7uF - 10uF
16 10uF - 10uF
0805/2012 25 2.2uF - 10uF
35 3.3uF - 4.7uF
50 2.2uF - 4.7uF
100 330nF - 1uF
16 22uF - 22uF
25 10uF - 10uF
1206/3216 35 6.8uF - 10uF
X7S
50 4.7uF - 10uF
(125℃)
100 2.2uF - 2.2uF
4 100uF - 100uF
6.3 47uF - 47uF
10 47uF - 47uF
16 22uF - 22uF
1210/3225 25 15uF - 22uF
AEC-Q200
35 10uF - 10uF
Normal
50 6.8uF - 10uF
75 10uF - 10uF
100 3.3uF - 10uF
2.5 1uF - 1uF
0201/0603
4 1uF - 1uF
2.5 22uF - 22uF
0603/1608 4 10uF - 22uF
6.3 4.7uF - 10uF
4 22uF - 22uF
0805/2012
X7T 6.3 22uF - 22uF
(125℃) 4 33uF - 47uF
6.3 47uF - 47uF
1206/3216
35 10uF - 10uF
50 10uF - 10uF
2.5 100uF - 220uF
1210/3225 4 100uF - 100uF
6.3 47uF - 100uF

General Capacitors
Product LineUp (C0G)
Size Code (inch/mm) : 0402/1005
Thickness Max. Rated Voltage Capacitance

No. TCC Capacitance Part Number
(mm) (Vdc) Tolerance
1 0.55 50 C0G 1pF ±0.1pF CL05C010BB51PN#
2 0.55 50 C0G 1pF ±0.25pF CL05C010CB51PN#
3 0.55 50 C0G 1.2pF ±0.1pF CL05C1R2BB51PN#
4 0.55 50 C0G 1.2pF ±0.25pF CL05C1R2CB51PN#
5 0.55 50 C0G 1.3pF ±0.25pF CL05C1R3CB51PN#
6 0.55 50 C0G 1.5pF ±0.1pF CL05C1R5BB51PN#
7 0.55 50 C0G 1.5pF ±0.25pF CL05C1R5CB51PN#
8 0.55 50 C0G 1.8pF ±0.1pF CL05C1R8BB51PN#
9 0.55 50 C0G 1.8pF ±0.25pF CL05C1R8CB51PN#
10 0.55 50 C0G 2pF ±0.1pF CL05C020BB51PN#
11 0.55 50 C0G 2pF ±0.25pF CL05C020CB51PN#
12 0.55 50 C0G 2.2pF ±0.25pF CL05C2R2CB51PN#
13 0.55 50 C0G 2.4pF ±0.1pF CL05C2R4BB51PN#
14 0.55 50 C0G 2.4pF ±0.25pF CL05C2R4CB51PN#
15 0.55 50 C0G 2.5pF ±0.1pF CL05C2R5BB51PN#
16 0.55 50 C0G 2.5pF ±0.25pF CL05C2R5CB51PN#
17 0.55 50 C0G 2.7pF ±0.1pF CL05C2R7BB51PN#
18 0.55 50 C0G 2.7pF ±0.25pF CL05C2R7CB51PN#
19 0.55 50 C0G 3pF ±0.1pF CL05C030BB51PN#
20 0.55 50 C0G 3pF ±0.25pF CL05C030CB51PN#
21 0.55 50 C0G 3.3pF ±0.1pF CL05C3R3BB51PN#
22 0.55 50 C0G 3.3pF ±0.25pF CL05C3R3CB51PN#
23 0.55 50 C0G 3.6pF ±0.25pF CL05C3R6CB51PN#
24 0.55 50 C0G 3.9pF ±0.25pF CL05C3R9CB51PN#
25 0.55 50 C0G 4pF ±0.1pF CL05C040BB51PN#
26 0.55 50 C0G 4pF ±0.25pF CL05C040CB51PN#
27 0.55 50 C0G 4.7pF ±0.1pF CL05C4R7BB51PN#
28 0.55 50 C0G 4.7pF ±0.25pF CL05C4R7CB51PN#
29 0.55 50 C0G 5pF ±0.1pF CL05C050BB51PN#
30 0.55 50 C0G 5pF ±0.25pF CL05C050CB51PN#
31 0.55 50 C0G 5pF ±0.5pF CL05C050DB51PN#
32 0.55 50 C0G 5pF ±1pF CL05C050FB51PN#
33 0.55 50 C0G 5.1pF ±0.1pF CL05C5R1BB51PN#
34 0.55 50 C0G 5.1pF ±0.5pF CL05C5R1DB51PN#
35 0.55 50 C0G 5.6pF ±0.1pF CL05C5R6BB51PN#
36 0.55 50 C0G 5.6pF ±0.25pF CL05C5R6CB51PN#
37 0.55 50 C0G 5.6pF ±0.5pF CL05C5R6DB51PN#
38 0.55 50 C0G 6pF ±0.1pF CL05C060BB51PN#
39 0.55 50 C0G 6pF ±0.25pF CL05C060CB51PN#
40 0.55 50 C0G 6pF ±0.5pF CL05C060DB51PN#
41 0.55 50 C0G 6pF ±1pF CL05C060FB51PN#
42 0.55 50 C0G 6.2pF ±0.1pF CL05C6R2BB51PN#
43 0.55 50 C0G 6.2pF ±0.25pF CL05C6R2CB51PN#
44 0.55 50 C0G 6.8pF ±0.1pF CL05C6R8BB51PN#
45 0.55 50 C0G 6.8pF ±0.25pF CL05C6R8CB51PN#

General Capacitors

46 0.55 50 C0G 6.8pF ±0.5pF CL05C6R8DB51PN#
47 0.55 50 C0G 7pF ±0.1pF CL05C070BB51PN#
48 0.55 50 C0G 7pF ±0.25pF CL05C070CB51PN#
49 0.55 50 C0G 7pF ±0.5pF CL05C070DB51PN#
50 0.55 50 C0G 8pF ±0.1pF CL05C080BB51PN#
51 0.55 50 C0G 8pF ±0.25pF CL05C080CB51PN#
52 0.55 50 C0G 8pF ±0.5pF CL05C080DB51PN#
53 0.55 50 C0G 8.2pF ±0.1pF CL05C8R2BB51PN#
54 0.55 50 C0G 8.2pF ±0.25pF CL05C8R2CB51PN#
55 0.55 50 C0G 8.2pF ±0.5pF CL05C8R2DB51PN#
56 0.55 50 C0G 9pF ±0.1pF CL05C090BB51PN#
57 0.55 50 C0G 9pF ±0.25pF CL05C090CB51PN#
58 0.55 50 C0G 9pF ±0.5pF CL05C090DB51PN#
59 0.55 50 C0G 10pF ±0.5pF CL05C100DB51PN#
60 0.55 50 C0G 10pF ±1% CL05C100FB51PN#
61 0.55 50 C0G 10pF ±2% CL05C100GB51PN#
62 0.55 50 C0G 10pF ±5% CL05C100JB51PN#
63 0.55 50 C0G 11pF ±5% CL05C110JB51PN#
64 0.55 50 C0G 12pF ±1% CL05C120FB51PN#
65 0.55 50 C0G 12pF ±5% CL05C120JB51PN#
66 0.55 50 C0G 13pF ±1% CL05C130FB51PN#
67 0.55 50 C0G 13pF ±2% CL05C130GB51PN#
68 0.55 50 C0G 13pF ±5% CL05C130JB51PN#
69 0.55 50 C0G 15pF ±1% CL05C150FB51PN#
70 0.55 50 C0G 15pF ±2% CL05C150GB51PN#
71 0.55 50 C0G 15pF ±5% CL05C150JB51PN#
72 0.55 50 C0G 16pF ±1% CL05C160FB51PN#
73 0.55 50 C0G 16pF ±2% CL05C160GB51PN#
74 0.55 50 C0G 16pF ±5% CL05C160JB51PN#
75 0.55 50 C0G 18pF ±1% CL05C180FB51PN#
76 0.55 50 C0G 18pF ±5% CL05C180JB51PN#
77 0.55 50 C0G 20pF ±2% CL05C200GB51PN#
78 0.55 50 C0G 20pF ±5% CL05C200JB51PN#
79 0.55 50 C0G 22pF ±1% CL05C220FB51PN#
80 0.55 50 C0G 22pF ±2% CL05C220GB51PN#
81 0.55 50 C0G 22pF ±5% CL05C220JB51PN#
82 0.55 50 C0G 24pF ±5% CL05C240JB51PN#
83 0.55 50 C0G 27pF ±1% CL05C270FB51PN#
84 0.55 50 C0G 27pF ±5% CL05C270JB51PN#
85 0.55 50 C0G 30pF ±1% CL05C300FB51PN#
86 0.55 50 C0G 30pF ±2% CL05C300GB51PN#
87 0.55 50 C0G 30pF ±5% CL05C300JB51PN#
88 0.55 50 C0G 33pF ±1% CL05C330FB51PN#
89 0.55 50 C0G 33pF ±2% CL05C330GB51PN#
90 0.55 50 C0G 33pF ±5% CL05C330JB51PN#

General Capacitors

91 0.55 50 C0G 39pF ±1% CL05C390FB51PN#
92 0.55 50 C0G 39pF ±2% CL05C390GB51PN#
93 0.55 50 C0G 39pF ±5% CL05C390JB51PN#
94 0.55 50 C0G 47pF ±1% CL05C470FB51PN#
95 0.55 50 C0G 47pF ±2% CL05C470GB51PN#
96 0.55 50 C0G 47pF ±5% CL05C470JB51PN#
97 0.55 50 C0G 51pF ±5% CL05C510JB51PN#
98 0.55 50 C0G 56pF ±5% CL05C560JB51PN#
99 0.55 50 C0G 68pF ±1% CL05C680FB51PN#
100 0.55 50 C0G 68pF ±2% CL05C680GB51PN#
101 0.55 50 C0G 68pF ±5% CL05C680JB51PN#
102 0.55 50 C0G 82pF ±1% CL05C820FB51PN#
103 0.55 50 C0G 82pF ±5% CL05C820JB51PN#
104 0.55 50 C0G 100pF ±1% CL05C101FB51PN#
105 0.55 50 C0G 100pF ±2% CL05C101GB51PN#
106 0.55 50 C0G 100pF ±5% CL05C101JB51PN#
107 0.55 50 C0G 120pF ±5% CL05C121JB51PN#
108 0.55 50 C0G 150pF ±5% CL05C151JB51PN#
109 0.55 50 C0G 180pF ±1% CL05C181FB51PN#
110 0.55 50 C0G 180pF ±2% CL05C181GB51PN#
111 0.55 50 C0G 180pF ±5% CL05C181JB51PN#
112 0.55 50 C0G 220pF ±5% CL05C221JB51PN#
113 0.55 50 C0G 270pF ±1% CL05C271FB51PN#
114 0.55 50 C0G 270pF ±5% CL05C271JB51PN#
115 0.55 50 C0G 330pF ±1% CL05C331FB51PN#
116 0.55 50 C0G 330pF ±5% CL05C331JB51PN#
117 0.55 50 C0G 390pF ±5% CL05C391JB51PN#
118 0.55 50 C0G 470pF ±1% CL05C471FB51PN#
119 0.55 50 C0G 470pF ±5% CL05C471JB51PN#
120 0.55 50 C0G 560pF ±1% CL05C561FB51PN#
121 0.55 50 C0G 560pF ±5% CL05C561JB51PN#
122 0.55 50 C0G 680pF ±1% CL05C681FB51PN#
123 0.55 50 C0G 680pF ±2% CL05C681GB51PN#
124 0.55 50 C0G 680pF ±5% CL05C681JB51PN#
125 0.55 50 C0G 820pF ±1% CL05C821FB51PN#
126 0.55 50 C0G 820pF ±5% CL05C821JB51PN#
127 0.55 50 C0G 1nF ±1% CL05C102FB51PN#
128 0.55 50 C0G 1nF ±5% CL05C102JB51PN#
129 0.55 100 C0G 1pF ±0.25pF CL05C010CC51PN#
130 0.55 100 C0G 1.2pF ±0.25pF CL05C1R2CC51PN#

General Capacitors

131 0.55 100 C0G 1.5pF ±0.25pF CL05C1R5CC51PN#
132 0.55 100 C0G 1.8pF ±0.25pF CL05C1R8CC51PN#
133 0.55 100 C0G 2.2pF ±0.25pF CL05C2R2CC51PN#
134 0.55 100 C0G 2.7pF ±0.25pF CL05C2R7CC51PN#
135 0.55 100 C0G 3.3pF ±0.25pF CL05C3R3CC51PN#
136 0.55 100 C0G 3.5pF ±0.25pF CL05C3R5CC51PN#
137 0.55 100 C0G 3.9pF ±0.25pF CL05C3R9CC51PN#
138 0.55 100 C0G 4pF ±0.25pF CL05C040CC51PN#
139 0.55 100 C0G 4.7pF ±0.1pF CL05C4R7BC51PN#
140 0.55 100 C0G 4.7pF ±0.25pF CL05C4R7CC51PN#
141 0.55 100 C0G 5.6pF ±0.25pF CL05C5R6CC51PN#
142 0.55 100 C0G 6pF ±0.1pF CL05C060BC51PN#
143 0.55 100 C0G 6pF ±0.25pF CL05C060CC51PN#
144 0.55 100 C0G 6.8pF ±0.25pF CL05C6R8CC51PN#
145 0.55 100 C0G 6.8pF ±0.5pF CL05C6R8DC51PN#
146 0.55 100 C0G 7pF ±0.25pF CL05C070CC51PN#
147 0.55 100 C0G 8.2pF ±0.25pF CL05C8R2CC51PN#
148 0.55 100 C0G 8.2pF ±0.5pF CL05C8R2DC51PN#
149 0.55 100 C0G 9pF ±0.25pF CL05C090CC51PN#
150 0.55 100 C0G 10pF ±5% CL05C100JC51PN#
151 0.55 100 C0G 12pF ±5% CL05C120JC51PN#
152 0.55 100 C0G 15pF ±5% CL05C150JC51PN#
153 0.55 100 C0G 18pF ±5% CL05C180JC51PN#
154 0.55 100 C0G 22pF ±5% CL05C220JC51PN#
155 0.55 100 C0G 27pF ±5% CL05C270JC51PN#
156 0.55 100 C0G 33pF ±5% CL05C330JC51PN#
157 0.55 100 C0G 39pF ±5% CL05C390JC51PN#
158 0.55 100 C0G 47pF ±5% CL05C470JC51PN#
159 0.55 100 C0G 56pF ±5% CL05C560JC51PN#
160 0.55 100 C0G 68pF ±5% CL05C680JC51PN#
161 0.55 100 C0G 82pF ±1% CL05C820FC51PN#
162 0.55 100 C0G 82pF ±5% CL05C820JC51PN#
163 0.55 100 C0G 100pF ±5% CL05C101JC51PN#
164 0.55 100 C0G 220pF ±5% CL05C221JC51PN#
165 0.55 100 C0G 270pF ±5% CL05C271JC51PN#
166 0.55 100 C0G 470pF ±5% CL05C471JC51PN#
167 0.55 100 C0G 1nF ±5% CL05C102JC51PN#

General Capacitors

1 0.90 50 C0G 1pF ±0.25pF CL10C010CB81PN#
2 0.90 50 C0G 1.2pF ±0.25pF CL10C1R2CB81PN#
3 0.90 50 C0G 1.5pF ±0.25pF CL10C1R5CB81PN#
4 0.90 50 C0G 1.8pF ±0.25pF CL10C1R8CB81PN#
5 0.90 50 C0G 2pF ±0.1pF CL10C020BB81PN#
6 0.90 50 C0G 2pF ±0.25pF CL10C020CB81PN#
7 0.90 50 C0G 2.2pF ±0.25pF CL10C2R2CB81PN#
8 0.90 50 C0G 2.7pF ±0.25pF CL10C2R7CB81PN#
9 0.90 50 C0G 3pF ±0.25pF CL10C030CB81PN#
10 0.90 50 C0G 3.3pF ±0.25pF CL10C3R3CB81PN#
11 0.90 50 C0G 3.9pF ±0.25pF CL10C3R9CB81PN#
12 0.90 50 C0G 3.9pF ±0.5pF CL10C3R9DB81PN#
13 0.90 50 C0G 4pF ±0.1pF CL10C040BB81PN#
14 0.90 50 C0G 4pF ±0.25pF CL10C040CB81PN#
15 0.90 50 C0G 4.7pF ±0.25pF CL10C4R7CB81PN#
16 0.90 50 C0G 5pF ±0.1pF CL10C050BB81PN#
17 0.90 50 C0G 5pF ±0.25pF CL10C050CB81PN#
18 0.90 50 C0G 5.1pF ±0.5pF CL10C5R1DB81PN#
19 0.90 50 C0G 5.6pF ±0.25pF CL10C5R6CB81PN#
20 0.90 50 C0G 5.6pF ±0.5pF CL10C5R6DB81PN#
21 0.90 50 C0G 6pF ±0.25pF CL10C060CB81PN#
22 0.90 50 C0G 6pF ±0.5pF CL10C060DB81PN#
23 0.90 50 C0G 6.8pF ±0.25pF CL10C6R8CB81PN#
24 0.90 50 C0G 6.8pF ±0.5pF CL10C6R8DB81PN#
25 0.90 50 C0G 7pF ±0.1pF CL10C070BB81PN#
26 0.90 50 C0G 7pF ±0.25pF CL10C070CB81PN#
27 0.90 50 C0G 7pF ±0.5pF CL10C070DB81PN#
28 0.90 50 C0G 7.5pF ±0.1pF CL10C7R5BB81PN#
29 0.90 50 C0G 7.5pF ±0.25pF CL10C7R5CB81PN#
30 0.90 50 C0G 7.5pF ±0.5pF CL10C7R5DB81PN#
31 0.90 50 C0G 8pF ±0.25pF CL10C080CB81PN#
32 0.90 50 C0G 8pF ±0.5pF CL10C080DB81PN#
33 0.90 50 C0G 8.2pF ±0.1pF CL10C8R2BB81PN#
34 0.90 50 C0G 8.2pF ±0.25pF CL10C8R2CB81PN#
35 0.90 50 C0G 8.5pF ±0.5pF CL10C8R5DB81PN#
36 0.90 50 C0G 9pF ±0.1pF CL10C090BB81PN#
37 0.90 50 C0G 9pF ±0.25pF CL10C090CB81PN#
38 0.90 50 C0G 9pF ±0.5pF CL10C090DB81PN#
39 0.90 50 C0G 9.4pF ±0.25pF CL10C9R4CB81PN#
40 0.90 50 C0G 10pF ±0.25pF CL10C100CB81PN#
41 0.90 50 C0G 10pF ±0.5pF CL10C100DB81PN#
42 0.90 50 C0G 10pF ±5% CL10C100JB81PN#
43 0.90 50 C0G 12pF ±5% CL10C120JB81PN#
44 0.90 50 C0G 15pF ±1% CL10C150FB81PN#
45 0.90 50 C0G 15pF ±5% CL10C150JB81PN#

General Capacitors

46 0.90 50 C0G 18pF ±5% CL10C180JB81PN#
47 0.90 50 C0G 20pF ±5% CL10C200JB81PN#
48 0.90 50 C0G 22pF ±5% CL10C220JB81PN#
49 0.90 50 C0G 27pF ±5% CL10C270JB81PN#
50 0.90 50 C0G 33pF ±5% CL10C330JB81PN#
51 0.90 50 C0G 39pF ±1% CL10C390FB81PN#
52 0.90 50 C0G 39pF ±2% CL10C390GB81PN#
53 0.90 50 C0G 39pF ±5% CL10C390JB81PN#
54 0.90 50 C0G 47pF ±1% CL10C470FB81PN#
55 0.90 50 C0G 47pF ±5% CL10C470JB81PN#
56 0.90 50 C0G 56pF ±5% CL10C560JB81PN#
57 0.90 50 C0G 62pF ±5% CL10C620JB81PN#
58 0.90 50 C0G 68pF ±5% CL10C680JB81PN#
59 0.90 50 C0G 75pF ±5% CL10C750JB81PN#
60 0.90 50 C0G 82pF ±5% CL10C820JB81PN#
61 0.90 50 C0G 100pF ±1% CL10C101FB81PN#
62 0.90 50 C0G 100pF ±5% CL10C101JB81PN#
63 0.90 50 C0G 120pF ±5% CL10C121JB81PN#
64 0.90 50 C0G 130pF ±5% CL10C131JB81PN#
65 0.90 50 C0G 150pF ±5% CL10C151JB81PN#
66 0.90 50 C0G 180pF ±5% CL10C181JB81PN#
67 0.90 50 C0G 220pF ±5% CL10C221JB81PN#
68 0.90 50 C0G 270pF ±5% CL10C271JB81PN#
69 0.90 50 C0G 330pF ±5% CL10C331JB81PN#
70 0.90 50 C0G 390pF ±5% CL10C391JB81PN#
71 0.90 50 C0G 470pF ±1% CL10C471FB81PN#
72 0.90 50 C0G 470pF ±5% CL10C471JB81PN#
73 0.90 50 C0G 510pF ±1% CL10C511FB81PN#
74 0.90 50 C0G 510pF ±2% CL10C511GB81PN#
75 0.90 50 C0G 510pF ±5% CL10C511JB81PN#
76 0.90 50 C0G 560pF ±5% CL10C561JB81PN#
77 0.90 50 C0G 680pF ±1% CL10C681FB81PN#
78 0.90 50 C0G 680pF ±5% CL10C681JB81PN#
79 0.90 50 C0G 750pF ±5% CL10C751JB81PN#
80 0.90 50 C0G 820pF ±1% CL10C821FB81PN#
81 0.90 50 C0G 820pF ±5% CL10C821JB81PN#
82 0.90 50 C0G 1nF ±1% CL10C102FB81PN#
83 0.90 50 C0G 1nF ±2% CL10C102GB81PN#
84 0.90 50 C0G 1nF ±5% CL10C102JB81PN#
85 0.90 100 C0G 1pF ±0.25pF CL10C010CC81PN#
86 0.90 100 C0G 1.2pF ±0.25pF CL10C1R2CC81PN#
87 0.90 100 C0G 1.5pF ±0.25pF CL10C1R5CC81PN#
88 0.90 100 C0G 1.8pF ±0.25pF CL10C1R8CC81PN#
89 0.90 100 C0G 2pF ±0.25pF CL10C020CC81PN#
90 0.90 100 C0G 2.2pF ±0.25pF CL10C2R2CC81PN#

General Capacitors

91 0.90 100 C0G 2.7pF ±0.25pF CL10C2R7CC81PN#
92 0.90 100 C0G 3pF ±0.25pF CL10C030CC81PN#
93 0.90 100 C0G 3.3pF ±0.25pF CL10C3R3CC81PN#
94 0.90 100 C0G 3.9pF ±0.25pF CL10C3R9CC81PN#
95 0.90 100 C0G 3.9pF ±0.5pF CL10C3R9DC81PN#
96 0.90 100 C0G 4pF ±0.25pF CL10C040CC81PN#
97 0.90 100 C0G 4.7pF ±0.25pF CL10C4R7CC81PN#
98 0.90 100 C0G 5pF ±0.25pF CL10C050CC81PN#
99 0.90 100 C0G 5.6pF ±0.25pF CL10C5R6CC81PN#
100 0.90 100 C0G 6.8pF ±0.5pF CL10C6R8DC81PN#
101 0.90 100 C0G 7pF ±0.25pF CL10C070CC81PN#
102 0.90 100 C0G 8pF ±0.25pF CL10C080CC81PN#
103 0.90 100 C0G 8pF ±0.5pF CL10C080DC81PN#
104 0.90 100 C0G 8.2pF ±0.5pF CL10C8R2DC81PN#
105 0.90 100 C0G 9pF ±0.1pF CL10C090BC81PN#
106 0.90 100 C0G 9pF ±0.25pF CL10C090CC81PN#
107 0.90 100 C0G 10pF ±5% CL10C100JC81PN#
108 0.90 100 C0G 12pF ±5% CL10C120JC81PN#
109 0.90 100 C0G 15pF ±5% CL10C150JC81PN#
110 0.90 100 C0G 18pF ±5% CL10C180JC81PN#
111 0.90 100 C0G 20pF ±5% CL10C200JC81PN#
112 0.90 100 C0G 22pF ±5% CL10C220JC81PN#
113 0.90 100 C0G 27pF ±5% CL10C270JC81PN#
114 0.90 100 C0G 33pF ±5% CL10C330JC81PN#
115 0.90 100 C0G 39pF ±5% CL10C390JC81PN#
116 0.90 100 C0G 47pF ±5% CL10C470JC81PN#
117 0.90 100 C0G 50pF ±5% CL10C500JC81PN#
118 0.90 100 C0G 56pF ±5% CL10C560JC81PN#
119 0.90 100 C0G 68pF ±5% CL10C680JC81PN#
120 0.90 100 C0G 82pF ±5% CL10C820JC81PN#
121 0.90 100 C0G 100pF ±5% CL10C101JC81PN#
122 0.90 100 C0G 120pF ±5% CL10C121JC81PN#
123 0.90 100 C0G 150pF ±5% CL10C151JC81PN#
124 0.90 100 C0G 180pF ±5% CL10C181JC81PN#
125 0.90 100 C0G 220pF ±5% CL10C221JC81PN#
126 0.90 100 C0G 1nF ±5% CL10C102JC81PN#

General Capacitors

1 0.70 50 C0G 10pF ±5% CL21C100JB61PN#
2 0.70 50 C0G 12pF ±5% CL21C120JB61PN#
3 0.70 50 C0G 15pF ±1% CL21C150FB61PN#
4 0.70 50 C0G 15pF ±2% CL21C150GB61PN#
5 0.70 50 C0G 15pF ±5% CL21C150JB61PN#
6 0.70 50 C0G 22pF ±5% CL21C220JB61PN#
7 0.70 50 C0G 24pF ±1% CL21C240FB61PN#
8 0.70 50 C0G 24pF ±2% CL21C240GB61PN#
9 0.70 50 C0G 27pF ±5% CL21C270JB61PN#
10 0.70 50 C0G 33pF ±1% CL21C330FB61PN#
11 0.70 50 C0G 33pF ±2% CL21C330GB61PN#
12 0.70 50 C0G 33pF ±5% CL21C330JB61PN#
13 0.70 50 C0G 39pF ±5% CL21C390JB61PN#
14 0.70 50 C0G 47pF ±5% CL21C470JB61PN#
15 0.70 50 C0G 56pF ±5% CL21C560JB61PN#
16 0.70 50 C0G 68pF ±5% CL21C680JB61PN#
17 0.70 50 C0G 82pF ±1% CL21C820FB61PN#
18 0.70 50 C0G 82pF ±2% CL21C820GB61PN#
19 0.70 50 C0G 82pF ±5% CL21C820JB61PN#
20 0.70 50 C0G 100pF ±5% CL21C101JB61PN#
21 0.70 50 C0G 120pF ±5% CL21C121JB61PN#
22 0.70 50 C0G 150pF ±5% CL21C151JB61PN#
23 0.95 50 C0G 150pF ±5% CL21C151JBC1PN#
24 0.70 50 C0G 220pF ±2% CL21C221GB61PN#
25 0.70 50 C0G 220pF ±5% CL21C221JB61PN#
26 0.70 50 C0G 270pF ±5% CL21C271JB61PN#
27 0.70 50 C0G 330pF ±5% CL21C331JB61PN#
28 0.95 50 C0G 470pF ±5% CL21C471JBC1PN#
29 0.95 50 C0G 560pF ±5% CL21C561JBC1PN#
30 0.95 50 C0G 680pF ±5% CL21C681JBC1PN#
31 0.95 50 C0G 820pF ±5% CL21C821JBC1PN#
32 0.95 50 C0G 1nF ±5% CL21C102JBC1PN#
33 0.95 50 C0G 1.2nF ±5% CL21C122JBC1PN#
34 0.95 50 C0G 1.5nF ±5% CL21C152JBC1PN#
35 1.35 50 C0G 1.8nF ±1% CL21C182FBF1PN#
36 1.35 50 C0G 1.8nF ±2% CL21C182GBF1PN#
37 1.35 50 C0G 1.8nF ±5% CL21C182JBF1PN#
38 0.95 50 C0G 2.2nF ±5% CL21C222JBC1PN#
39 0.95 50 C0G 3.9nF ±5% CL21C392JBC1PN#
40 0.95 50 C0G 4.7nF ±5% CL21C472JBC1PN#

General Capacitors

41 0.95 50 C0G 5.6nF ±5% CL21C562JBC1PN#
42 1.35 50 C0G 6.8nF ±5% CL21C682JBF1PN#
43 1.35 50 C0G 8.2nF ±5% CL21C822JBF1PN#
44 1.35 50 C0G 10nF ±5% CL21C103JBF1PN#
45 0.70 100 C0G 12pF ±5% CL21C120JC61PN#
46 0.70 100 C0G 15pF ±5% CL21C150JC61PN#
47 0.70 100 C0G 20pF ±5% CL21C200JC61PN#
48 0.70 100 C0G 22pF ±5% CL21C220JC61PN#
49 0.70 100 C0G 24pF ±5% CL21C240JC61PN#
50 0.70 100 C0G 27pF ±5% CL21C270JC61PN#
51 0.70 100 C0G 33pF ±5% CL21C330JC61PN#
52 0.70 100 C0G 39pF ±5% CL21C390JC61PN#
53 0.70 100 C0G 47pF ±5% CL21C470JC61PN#
54 0.70 100 C0G 56pF ±5% CL21C560JC61PN#
55 0.70 100 C0G 68pF ±5% CL21C680JC61PN#
56 0.70 100 C0G 82pF ±5% CL21C820JC61PN#
57 0.70 100 C0G 100pF ±5% CL21C101JC61PN#
58 0.70 100 C0G 150pF ±5% CL21C151JC61PN#
59 0.95 100 C0G 150pF ±5% CL21C151JCC1PN#
60 0.70 100 C0G 220pF ±5% CL21C221JC61PN#
61 0.70 100 C0G 270pF ±5% CL21C271JC61PN#
62 0.70 100 C0G 330pF ±5% CL21C331JC61PN#
63 0.95 100 C0G 470pF ±5% CL21C471JCC1PN#
64 0.95 100 C0G 680pF ±5% CL21C681JCC1PN#
65 0.95 100 C0G 820pF ±5% CL21C821JCC1PN#
66 0.95 100 C0G 1nF ±5% CL21C102JCC1PN#
67 0.95 100 C0G 1.5nF ±5% CL21C152JCC1PN#
68 1.45 100 C0G 3.3nF ±5% CL21C332JCY1PN#
69 1.45 100 C0G 4.7nF ±5% CL21C472JCY1PN#
70 1.45 100 C0G 10nF ±5% CL21C103JCY1PN#

1 1.80 100 C0G 4.7nF ±5% CL31C472JCH1PN#

General Capacitors
Product LineUp (X7R/X7S/X7T)

1 0.39 2.5 X7T 1uF ±20% CL03Z105MSR6PN#
2 0.35 4 X7S 100nF ±10% CL03Y104KRSVPN#
3 0.39 4 X7T 1uF ±20% CL03Z105MRR6PN#
4 0.35 6.3 X7R 1nF ±10% CL03B102KQSVPN#
5 0.35 6.3 X7R 2.2nF ±10% CL03B222KQSVPN#
6 0.35 6.3 X7R 3.3nF ±10% CL03B332KQSVPN#
7 0.35 6.3 X7R 4.7nF ±10% CL03B472KQSVPN#
8 0.35 6.3 X7R 6.8nF ±10% CL03B682KQSVPN#
9 0.35 6.3 X7R 10nF ±10% CL03B103KQSVPN#
10 0.35 6.3 X7S 22nF ±10% CL03Y223KQSVPN#
11 0.35 6.3 X7S 33nF ±10% CL03Y333KQSVPN#
12 0.35 6.3 X7S 47nF ±10% CL03Y473KQSVPN#
13 0.35 6.3 X7S 68nF ±10% CL03Y683KQSVPN#
14 0.35 6.3 X7S 100nF ±10% CL03Y104KQSVPN#
15 0.35 10 X7R 1nF ±10% CL03B102KPSVPN#
16 0.35 10 X7R 1.5nF ±10% CL03B152KPSVPN#
17 0.35 10 X7R 2.2nF ±10% CL03B222KPSVPN#
18 0.35 10 X7R 3.3nF ±10% CL03B332KPSVPN#
19 0.35 10 X7R 4.7nF ±10% CL03B472KPSVPN#
20 0.35 10 X7R 6.8nF ±10% CL03B682KPSVPN#
21 0.35 10 X7R 10nF ±10% CL03B103KPSVPN#
22 0.35 16 X7R 1nF ±10% CL03B102KOSVPN#
23 0.35 16 X7R 1.5nF ±10% CL03B152KOSVPN#
24 0.35 16 X7R 2.2nF ±10% CL03B222KOSVPN#
25 0.35 16 X7R 3.3nF ±10% CL03B332KOSVPN#
26 0.35 16 X7R 4.7nF ±10% CL03B472KOSVPN#
27 0.35 16 X7R 10nF ±10% CL03B103KOSVPN#
28 0.35 16 X7S 100nF ±10% CL03Y104KOS6PN#
29 0.35 25 X7R 1nF ±10% CL03B102KASVPN#
30 0.35 25 X7R 1.5nF ±10% CL03B152KASVPN#
31 0.35 25 X7R 2.2nF ±10% CL03B222KASVPN#
32 0.35 25 X7R 3.3nF ±10% CL03B332KASVPN#
33 0.35 25 X7R 4.7nF ±10% CL03B472KASVPN#
34 0.35 25 X7R 6.8nF ±10% CL03B682KASVPN#
35 0.35 25 X7R 10nF ±10% CL03B103KASVPN#

General Capacitors

1 0.55 6.3 X7R 100nF ±10% CL05B104KQ5VPN#
2 0.55 6.3 X7S 220nF ±10% CL05Y224KQ5VPN#
3 0.55 6.3 X7S 470nF ±10% CL05Y474KQ5VPN#
4 0.70 6.3 X7S 680nF ±10% CL05Y684KQ6VPN#
5 0.70 6.3 X7S 1uF ±10% CL05Y105KQ6VPN#
6 0.55 10 X7R 10nF ±10% CL05B103KP5VPN#
7 0.55 10 X7R 33nF ±10% CL05B333KP5VPN#
8 0.55 10 X7R 100nF ±10% CL05B104KP5VPN#
9 0.55 10 X7R 220nF ±10% CL05B224KP5VPN#
10 0.55 10 X7S 220nF ±10% CL05Y224KP5VPN#
11 0.55 10 X7S 330nF ±10% CL05Y334KP5VPN#
12 0.60 10 X7S 470nF ±10% CL05Y474KP5VPN#
13 0.70 10 X7S 680nF ±10% CL05Y684KP6VPN#
14 0.67 10 X7S 1uF ±10% CL05Y105KPAVPN#
15 0.70 10 X7S 1uF ±10% CL05Y105KP6VPN#
16 0.55 16 X7R 330pF ±10% CL05B331KO5VPN#
17 0.55 16 X7R 1nF ±10% CL05B102KO5VPN#
18 0.55 16 X7R 2.2nF ±10% CL05B222KO5VPN#
19 0.55 16 X7R 3.3nF ±10% CL05B332KO5VPN#
20 0.55 16 X7R 4.7nF ±10% CL05B472KO5VPN#
21 0.55 16 X7R 6.8nF ±10% CL05B682KO5VPN#
22 0.55 16 X7R 10nF ±10% CL05B103KO5VPN#
23 0.55 16 X7R 15nF ±10% CL05B153KO5VPN#
24 0.55 16 X7R 22nF ±10% CL05B223KO5VPN#
25 0.55 16 X7R 33nF ±10% CL05B333KO5VPN#
26 0.55 16 X7R 47nF ±10% CL05B473KO5VPN#
27 0.55 16 X7R 56nF ±10% CL05B563KO5VPN#
28 0.55 16 X7R 68nF ±10% CL05B683KO5VPN#
29 0.55 16 X7R 82nF ±10% CL05B823KO5VPN#
30 0.55 16 X7R 100nF ±10% CL05B104KO5VPN#
31 0.55 16 X7R 150nF ±10% CL05B154KO5VPN#
32 0.55 16 X7R 220nF ±10% CL05B224KO5VPN#
33 0.55 16 X7S 220nF ±10% CL05Y224KO5VPN#
34 0.55 25 X7R 1nF ±10% CL05B102KA5VPN#
35 0.55 25 X7R 1.5nF ±10% CL05B152KA5VPN#
36 0.55 25 X7R 1.8nF ±10% CL05B182KA5VPN#
37 0.55 25 X7R 2.2nF ±10% CL05B222KA5VPN#
38 0.55 25 X7R 3.3nF ±10% CL05B332KA5VPN#
39 0.55 25 X7R 4.7nF ±10% CL05B472KA5VPN#
40 0.55 25 X7R 5.6nF ±10% CL05B562KA5VPN#

General Capacitors

41 0.55 25 X7R 6.8nF ±10% CL05B682KA5VPN#
42 0.55 25 X7R 8.2nF ±10% CL05B822KA5VPN#
43 0.55 25 X7R 10nF ±10% CL05B103KA5VPN#
44 0.55 25 X7R 15nF ±10% CL05B153KA5VPN#
45 0.55 25 X7R 22nF ±10% CL05B223KA5VPN#
46 0.55 25 X7R 27nF ±10% CL05B273KA5VPN#
47 0.55 25 X7R 33nF ±10% CL05B333KA5VPN#
48 0.55 25 X7R 47nF ±10% CL05B473KA5VPN#
49 0.55 25 X7R 68nF ±10% CL05B683KA54PN#
50 0.55 25 X7R 100nF ±10% CL05B104KA54PN#
51 0.55 25 X7R 150nF ±10% CL05B154KA5VPN#
52 0.55 25 X7R 220nF ±10% CL05B224KA5VPN#
53 0.55 50 X7R 220pF ±10% CL05B221KB5VPN#
54 0.55 50 X7R 330pF ±10% CL05B331KB5VPN#
55 0.55 50 X7R 470pF ±10% CL05B471KB5VPN#
56 0.55 50 X7R 680pF ±10% CL05B681KB5VPN#
57 0.55 50 X7R 1nF ±5% CL05B102JB5VPN#
58 0.55 50 X7R 1nF ±10% CL05B102KB5VPN#
59 0.55 50 X7R 1.2nF ±10% CL05B122KB5VPN#
60 0.55 50 X7R 1.5nF ±10% CL05B152KB5VPN#
61 0.55 50 X7R 1.8nF ±10% CL05B182KB5VPN#
62 0.55 50 X7R 2.2nF ±10% CL05B222KB5VPN#
63 0.55 50 X7R 2.7nF ±10% CL05B272KB5VPN#
64 0.55 50 X7R 3.3nF ±5% CL05B332JB5VPN#
65 0.55 50 X7R 3.3nF ±10% CL05B332KB5VPN#
66 0.55 50 X7R 3.9nF ±5% CL05B392JB5VPN#
67 0.55 50 X7R 3.9nF ±10% CL05B392KB5VPN#
68 0.55 50 X7R 4.7nF ±5% CL05B472JB5VPN#
69 0.55 50 X7R 4.7nF ±10% CL05B472KB5VPN#
70 0.55 50 X7R 5.6nF ±5% CL05B562JB5VPN#
71 0.55 50 X7R 5.6nF ±10% CL05B562KB5VPN#
72 0.55 50 X7R 6.8nF ±10% CL05B682KB5VPN#
73 0.55 50 X7R 8.2nF ±10% CL05B822KB5VPN#
74 0.55 50 X7R 10nF ±5% CL05B103JB5VPN#
75 0.55 50 X7R 10nF ±10% CL05B103KB5VPN#
76 0.55 50 X7R 15nF ±10% CL05B153KB5VPN#
77 0.55 50 X7R 22nF ±10% CL05B223KB5VPN#
78 0.55 50 X7R 27nF ±10% CL05B273KB5VPN#
79 0.55 50 X7R 33nF ±10% CL05B333KB5VPN#
80 0.55 50 X7R 47nF ±10% CL05B473KB5VPN#

General Capacitors

81 0.55 50 X7R 68nF ±10% CL05B683KB54PN#
82 0.55 50 X7R 100nF ±10% CL05B104KB54PN#
83 0.55 100 X7R 220pF ±10% CL05B221KC5VPN#
84 0.55 100 X7R 330pF ±10% CL05B331KC5VPN#
85 0.55 100 X7R 470pF ±10% CL05B471KC5VPN#
86 0.55 100 X7R 680pF ±10% CL05B681KC5VPN#
87 0.55 100 X7R 1nF ±10% CL05B102KC5VPN#
88 0.55 100 X7R 1.5nF ±10% CL05B152KC5VPN#
89 0.55 100 X7R 1.8nF ±10% CL05B182KC5VPN#
90 0.55 100 X7R 2.2nF ±10% CL05B222KC5VPN#
91 0.55 100 X7R 2.7nF ±10% CL05B272KC5VPN#
92 0.55 100 X7R 3.3nF ±10% CL05B332KC5VPN#
93 0.55 100 X7R 4.7nF ±10% CL05B472KC5VPN#
94 0.55 100 X7R 6.8nF ±10% CL05B682KC5VPN#
95 0.55 100 X7R 10nF ±10% CL05B103KC5VPN#

1 1.00 2.5 X7T 22uF ±20% CL10Z226MS96PN#
2 1.00 4 X7T 10uF ±20% CL10Z106MR9VPN#
3 1.00 4 X7T 22uF ±20% CL10Z226MR96PN#
4 0.90 6.3 X7R 1uF ±10% CL10B105KQ8VPN#
5 0.90 6.3 X7S 2.2uF ±10% CL10Y225KQ8VPN#
6 1.00 6.3 X7S 4.7uF ±10% CL10Y475KQ96PN#
7 1.00 6.3 X7T 4.7uF ±20% CL10Z475MQ9VPN#
8 1.00 6.3 X7T 10uF ±20% CL10Z106MQ9VPN#
9 0.90 10 X7R 220nF ±10% CL10B224KP8VPN#
10 0.90 10 X7R 470nF ±10% CL10B474KP8VPN#
11 0.90 10 X7R 1uF ±10% CL10B105KP8VPN#
12 0.90 10 X7S 1.5uF ±10% CL10Y155KP84PN#
13 0.90 10 X7S 2.2uF ±10% CL10Y225KP84PN#
14 1.00 10 X7S 4.7uF ±10% CL10Y475KP96PN#
15 0.90 16 X7R 1.2nF ±5% CL10B122JO8WPN#
16 0.90 16 X7R 10nF ±10% CL10B103KO8WPN#
17 0.90 16 X7R 15nF ±10% CL10B153KO8WPN#
18 0.90 16 X7R 22nF ±10% CL10B223KO8WPN#
19 0.90 16 X7R 27nF ±10% CL10B273KO8WPN#
20 0.90 16 X7R 33nF ±10% CL10B333KO8WPN#
21 0.90 16 X7R 47nF ±10% CL10B473KO8WPN#
22 0.90 16 X7R 68nF ±10% CL10B683KO8WPN#
23 0.90 16 X7R 100nF ±10% CL10B104KO8WPN#
24 0.90 16 X7R 150nF ±10% CL10B154KO8VPN#
25 0.90 16 X7R 220nF ±10% CL10B224KO8VPN#

General Capacitors

26 0.90 16 X7R 270nF ±10% CL10B274KO8VPN#
27 0.90 16 X7R 330nF ±10% CL10B334KO8VPN#
28 0.90 16 X7R 470nF ±10% CL10B474KO8VPN#
29 0.90 16 X7R 680nF ±10% CL10B684KO8VPN#
30 0.90 16 X7R 1uF ±10% CL10B105KO8VPN#
31 0.90 16 X7S 1uF ±10% CL10Y105KO8VPN#
32 1.00 16 X7S 2.2uF ±10% CL10Y225KO96PN#
33 0.90 25 X7R 1nF ±10% CL10B102KA8WPN#
34 0.90 25 X7R 1.5nF ±10% CL10B152KA8WPN#
35 0.90 25 X7R 2.2nF ±10% CL10B222KA8WPN#
36 0.90 25 X7R 3.3nF ±10% CL10B332KA8WPN#
37 0.90 25 X7R 4.7nF ±10% CL10B472KA8WPN#
38 0.90 25 X7R 6.8nF ±10% CL10B682KA8WPN#
39 0.90 25 X7R 10nF ±10% CL10B103KA8WPN#
40 0.90 25 X7R 15nF ±10% CL10B153KA8WPN#
41 0.90 25 X7R 22nF ±10% CL10B223KA8WPN#
42 0.90 25 X7R 33nF ±10% CL10B333KA8WPN#
43 0.90 25 X7R 47nF ±10% CL10B473KA8WPN#
44 0.90 25 X7R 68nF ±10% CL10B683KA8WPN#
45 0.90 25 X7R 100nF ±10% CL10B104KA8WPN#
46 0.90 25 X7R 100nF ±20% CL10B104MA8WPN#
47 0.90 25 X7R 150nF ±10% CL10B154KA8VPN#
48 0.90 25 X7R 220nF ±10% CL10B224KA8VPN#
49 0.90 25 X7R 330nF ±10% CL10B334KA8VPN#
50 0.90 25 X7R 470nF ±10% CL10B474KA8VPN#
51 0.90 25 X7R 680nF ±10% CL10B684KA8VPN#
52 0.90 25 X7R 1uF ±5% CL10B105JA8VPN#
53 0.90 25 X7R 1uF ±10% CL10B105KA8VPN#
54 1.00 25 X7S 2.2uF ±10% CL10Y225KA96PN#
55 0.90 35 X7R 470nF ±10% CL10B474KL8VPN#
56 1.00 35 X7R 1uF ±10% CL10B105KL9VPN#
57 0.90 50 X7R 220pF ±10% CL10B221KB8WPN#
58 0.90 50 X7R 330pF ±10% CL10B331KB8WPN#
59 0.90 50 X7R 470pF ±10% CL10B471KB8WPN#
60 0.90 50 X7R 680pF ±10% CL10B681KB8WPN#
61 0.90 50 X7R 1nF ±10% CL10B102KB8WPN#
62 0.90 50 X7R 1.2nF ±10% CL10B122KB8WPN#
63 0.90 50 X7R 1.5nF ±10% CL10B152KB8WPN#
64 0.90 50 X7R 1.8nF ±10% CL10B182KB8WPN#
65 0.90 50 X7R 2.2nF ±10% CL10B222KB8WPN#
66 0.90 50 X7R 3.3nF ±10% CL10B332KB8WPN#
67 0.90 50 X7R 3.9nF ±10% CL10B392KB8WPN#
68 0.90 50 X7R 4.7nF ±5% CL10B472JB8WPN#
69 0.90 50 X7R 4.7nF ±10% CL10B472KB8WPN#
70 0.90 50 X7R 6.8nF ±10% CL10B682KB8WPN#

General Capacitors

71 0.90 50 X7R 8.2nF ±10% CL10B822KB8WPN#
72 0.90 50 X7R 10nF ±5% CL10B103JB8WPN#
73 0.90 50 X7R 10nF ±10% CL10B103KB8WPN#
74 0.90 50 X7R 15nF ±10% CL10B153KB8WPN#
75 0.90 50 X7R 22nF ±10% CL10B223KB8WPN#
76 0.90 50 X7R 27nF ±10% CL10B273KB8WPN#
77 0.90 50 X7R 33nF ±10% CL10B333KB8WPN#
78 0.90 50 X7R 47nF ±10% CL10B473KB8WPN#
79 0.90 50 X7R 68nF ±10% CL10B683KB8WPN#
80 0.90 50 X7R 100nF ±10% CL10B104KB8VPN#
81 0.90 50 X7R 100nF ±10% CL10B104KB8WPN#
82 0.90 50 X7R 150nF ±10% CL10B154KB8VPN#
83 0.90 50 X7R 220nF ±10% CL10B224KB8VPN#
84 0.90 50 X7R 330nF ±10% CL10B334KB8VPN#
85 0.90 50 X7R 470nF ±10% CL10B474KB8VPN#
86 1.00 50 X7R 1uF ±10% CL10B105KB9VPN#
87 0.90 100 X7R 220pF ±10% CL10B221KC8WPN#
88 0.90 100 X7R 270pF ±10% CL10B271KC8WPN#
89 0.90 100 X7R 330pF ±10% CL10B331KC8WPN#
90 0.90 100 X7R 390pF ±10% CL10B391KC8WPN#
91 0.90 100 X7R 470pF ±10% CL10B471KC8WPN#
92 0.90 100 X7R 560pF ±10% CL10B561KC8WPN#
93 0.90 100 X7R 1nF ±10% CL10B102KC8WPN#
94 0.90 100 X7R 1.5nF ±10% CL10B152KC8WPN#
95 0.90 100 X7R 2.2nF ±10% CL10B222KC8WPN#
96 0.90 100 X7R 3.3nF ±10% CL10B332KC8WPN#
97 0.90 100 X7R 4.7nF ±10% CL10B472KC8WPN#
98 0.90 100 X7R 6.8nF ±10% CL10B682KC8WPN#
99 0.90 100 X7R 10nF ±5% CL10B103JC8WPN#
100 0.90 100 X7R 10nF ±10% CL10B103KC8WPN#
101 0.90 100 X7R 15nF ±10% CL10B153KC8WPN#
102 0.90 100 X7R 22nF ±10% CL10B223KC8WPN#
103 0.90 100 X7R 33nF ±10% CL10B333KC8WPN#
104 0.90 100 X7R 47nF ±10% CL10B473KC8WPN#
105 0.90 100 X7R 68nF ±10% CL10B683KC8WPN#
106 0.90 100 X7R 100nF ±10% CL10B104KC8VPN#

General Capacitors

1 1.45 4 X7T 22uF ±20% CL21Z226MRYVPN#
2 1.40 6.3 X7R 4.7uF ±10% CL21B475KQQVPN#
3 1.40 6.3 X7S 6.8uF ±10% CL21Y685KQQVPN#
4 1.40 6.3 X7S 10uF ±10% CL21Y106KQQVPN#
5 1.45 6.3 X7R 10uF ±10% CL21B106KQY6PN#
6 1.45 6.3 X7T 22uF ±20% CL21Z226MQYVPN#
7 1.35 10 X7R 1uF ±10% CL21B105KPFVPN#
8 1.35 10 X7R 2.2uF ±10% CL21B225KPFVPN#
9 1.40 10 X7R 3.3uF ±10% CL21B335KPQVPN#
10 1.40 10 X7R 4.7uF ±10% CL21B475KPQVPN#
11 1.50 10 X7S 4.7uF ±10% CL21Y475KPBVPN#
12 1.40 10 X7S 6.8uF ±10% CL21Y685KPQVPN#
13 1.40 10 X7S 10uF ±10% CL21Y106KPQVPN#
14 1.45 10 X7R 10uF ±10% CL21B106KPY6PN#
15 1.35 16 X7R 220nF ±10% CL21B224KOFVPN#
16 1.35 16 X7R 470nF ±10% CL21B474KOFVPN#
17 1.35 16 X7R 680nF ±10% CL21B684KOFVPN#
18 1.35 16 X7R 1uF ±10% CL21B105KOFVPN#
19 1.35 16 X7R 1.5uF ±10% CL21B155KOFVPN#
20 1.35 16 X7R 2.2uF ±10% CL21B225KOFVPN#
21 1.40 16 X7R 3.3uF ±10% CL21B335KOQVPN#
22 1.40 16 X7R 4.7uF ±10% CL21B475KOQVPN#
23 1.40 16 X7S 10uF ±10% CL21Y106KOQ4PN#
24 1.50 16 X7S 10uF ±10% CL21Y106KOBVPN#
25 0.95 25 X7R 100nF ±10% CL21B104KACWPN#
26 1.35 25 X7R 220nF ±10% CL21B224KAFVPN#
27 1.35 25 X7R 470nF ±10% CL21B474KAFVPN#
28 1.35 25 X7R 680nF ±10% CL21B684KAFVPN#
29 1.35 25 X7R 1uF ±10% CL21B105KAFVPN#
30 1.35 25 X7R 1.5uF ±10% CL21B155KAFVPN#
31 1.35 25 X7R 2.2uF ±10% CL21B225KAFVPN#
32 1.45 25 X7S 2.2uF ±10% CL21Y225KAYVPN#
33 1.50 25 X7R 3.3uF ±10% CL21B335KAB6PN#
34 1.50 25 X7S 3.3uF ±10% CL21Y335KABVPN#
35 1.50 25 X7R 4.7uF ±10% CL21B475KAB6PN#
36 1.50 25 X7S 4.7uF ±10% CL21Y475KABVPN#
37 1.50 25 X7S 6.8uF ±10% CL21Y685KABVPN#
38 1.50 25 X7S 10uF ±10% CL21Y106KABVPN#
39 1.35 35 X7R 1uF ±10% CL21B105KLFVPN#
40 1.45 35 X7R 1.5uF ±10% CL21B155KLYVPN#
41 1.45 35 X7R 2.2uF ±10% CL21B225KLYVPN#
42 1.50 35 X7R 3.3uF ±10% CL21B335KLB6PN#
43 1.50 35 X7S 3.3uF ±10% CL21Y335KLBVPN#
44 1.50 35 X7R 4.7uF ±10% CL21B475KLB6PN#
45 1.50 35 X7S 4.7uF ±10% CL21Y475KLBVPN#

General Capacitors

46 0.70 50 X7R 470pF ±10% CL21B471KB6WPN#
47 0.70 50 X7R 1nF ±5% CL21B102JB6WPN#
48 0.70 50 X7R 1nF ±10% CL21B102KB6WPN#
49 0.70 50 X7R 1.5nF ±10% CL21B152KB6WPN#
50 0.70 50 X7R 2.2nF ±10% CL21B222KB6WPN#
51 0.70 50 X7R 3.3nF ±10% CL21B332KB6WPN#
52 0.70 50 X7R 4.7nF ±10% CL21B472KB6WPN#
53 0.70 50 X7R 6.8nF ±10% CL21B682KB6WPN#
54 0.70 50 X7R 10nF ±10% CL21B103KB6WPN#
55 0.70 50 X7R 22nF ±10% CL21B223KB6WPN#
56 0.95 50 X7R 39nF ±10% CL21B393KBCWPN#
57 0.95 50 X7R 47nF ±10% CL21B473KBCWPN#
58 0.95 50 X7R 68nF ±10% CL21B683KBCWPN#
59 0.95 50 X7R 100nF ±10% CL21B104KBCWPN#
60 1.35 50 X7R 100nF ±10% CL21B104KBFWPN#
61 1.35 50 X7R 150nF ±10% CL21B154KBFVPN#
62 1.35 50 X7R 180nF ±10% CL21B184KBFVPN#
63 1.35 50 X7R 220nF ±10% CL21B224KBFVPN#
64 1.35 50 X7R 330nF ±10% CL21B334KBFVPN#
65 1.35 50 X7R 470nF ±10% CL21B474KBFVPN#
66 1.35 50 X7R 680nF ±10% CL21B684KBFVPN#
67 1.35 50 X7R 1uF ±10% CL21B105KBFVPN#
68 1.45 50 X7R 1.5uF ±10% CL21B155KBYVPN#
69 1.45 50 X7R 2.2uF ±10% CL21B225KBYVPN#
70 1.45 50 X7S 2.2uF ±10% CL21Y225KBYVPN#
71 1.50 50 X7S 3.3uF ±10% CL21Y335KBBVPN#
72 1.50 50 X7S 4.7uF ±10% CL21Y475KBBVPN#
73 0.70 100 X7R 470pF ±10% CL21B471KC6WPN#
74 0.70 100 X7R 1nF ±10% CL21B102KC6WPN#
75 0.70 100 X7R 1.5nF ±10% CL21B152KC6WPN#
76 0.70 100 X7R 1.8nF ±10% CL21B182KC6WPN#
77 0.70 100 X7R 2.2nF ±10% CL21B222KC6WPN#
78 0.70 100 X7R 3.3nF ±10% CL21B332KC6WPN#
79 0.70 100 X7R 4.7nF ±10% CL21B472KC6WPN#
80 0.70 100 X7R 6.8nF ±10% CL21B682KC6WPN#
81 0.70 100 X7R 10nF ±10% CL21B103KC6WPN#
82 0.70 100 X7R 15nF ±10% CL21B153KC6WPN#
83 0.70 100 X7R 22nF ±10% CL21B223KC6WPN#
84 1.35 100 X7R 22nF ±10% CL21B223KCFWPN#
85 1.35 100 X7R 33nF ±10% CL21B333KCFWPN#
86 0.95 100 X7R 47nF ±10% CL21B473KCCWPN#
87 1.35 100 X7R 47nF ±10% CL21B473KCFWPN#
88 0.95 100 X7R 68nF ±10% CL21B683KCCWPN#
89 1.35 100 X7R 100nF ±5% CL21B104JCFWPN#
90 0.95 100 X7R 100nF ±10% CL21B104KCCWPN#

General Capacitors

91 1.35 100 X7R 100nF ±10% CL21B104KCFWPN#
92 1.35 100 X7R 150nF ±10% CL21B154KCFVPN#
93 1.40 100 X7R 220nF ±10% CL21B224KCQVPN#
94 1.45 100 X7S 330nF ±10% CL21Y334KCYVPN#
95 1.45 100 X7R 470nF ±10% CL21B474KCYVPN#
96 1.45 100 X7S 470nF ±10% CL21Y474KCYVPN#
97 1.45 100 X7R 1uF ±10% CL21B105KCYVPN#
98 1.45 100 X7S 1uF ±10% CL21Y105KCYVPN#

1 1.90 4 X7T 33uF ±20% CL31Z336MRKVPN#
2 1.90 4 X7T 47uF ±20% CL31Z476MRKVPN#
3 1.90 6.3 X7R 15uF ±10% CL31B156KQKVPN#
4 1.90 6.3 X7R 22uF ±10% CL31B226KQKVPN#
5 1.90 6.3 X7R 22uF ±20% CL31B226MQKVPN#
6 1.90 6.3 X7T 47uF ±20% CL31Z476MQKVPN#
7 1.80 10 X7R 6.8uF ±10% CL31B685KPHVPN#
8 1.80 10 X7R 10uF ±10% CL31B106KPHVPN#
9 1.90 10 X7R 22uF ±10% CL31B226KPKVPN#
10 1.80 16 X7R 2.2uF ±10% CL31B225KOHVPN#
11 1.80 16 X7R 3.3uF ±10% CL31B335KOHVPN#
12 1.80 16 X7R 4.7uF ±10% CL31B475KOHVPN#
13 1.80 16 X7R 6.8uF ±10% CL31B685KOHVPN#
14 1.80 16 X7R 10uF ±10% CL31B106KOHVPN#
15 1.90 16 X7S 22uF ±20% CL31Y226MOK6PN#
16 1.25 25 X7R 100nF ±10% CL31B104KAPWPN#
17 1.25 25 X7R 220nF ±10% CL31B224KAPWPN#
18 1.80 25 X7R 470nF ±10% CL31B474KAHWPN#
19 1.25 25 X7R 680nF ±10% CL31B684KAPWPN#
20 1.25 25 X7R 1uF ±10% CL31B105KAPWPN#
21 1.80 25 X7R 1.5uF ±10% CL31B155KAHVPN#
22 1.80 25 X7R 2.2uF ±10% CL31B225KAHVPN#
23 1.80 25 X7R 3.3uF ±10% CL31B335KAHVPN#
24 1.80 25 X7R 4.7uF ±10% CL31B475KAHVPN#
25 1.80 25 X7R 6.8uF ±10% CL31B685KAHVPN#
26 1.80 25 X7R 10uF ±10% CL31B106KAHVPN#
27 1.90 25 X7R 10uF ±10% CL31B106KAK6PO#
28 1.90 25 X7S 10uF ±10% CL31Y106KAKVPN#
29 1.90 35 X7S 6.8uF ±10% CL31Y685KLKVPN#
30 1.90 35 X7R 10uF ±10% CL31B106KLK6PN#

General Capacitors

31 1.90 35 X7S 10uF ±10% CL31Y106KLKVPN#
32 1.90 35 X7T 10uF ±10% CL31Z106KLKVPN#
33 1.00 50 X7R 100nF ±10% CL31B104KBCWPN#
34 1.25 50 X7R 100nF ±10% CL31B104KBPWPN#
35 1.25 50 X7R 150nF ±10% CL31B154KBPWPN#
36 1.25 50 X7R 220nF ±10% CL31B224KBPWPN#
37 1.80 50 X7R 330nF ±10% CL31B334KBHWPN#
38 1.80 50 X7R 470nF ±10% CL31B474KBHWPN#
39 1.80 50 X7R 680nF ±10% CL31B684KBHWPN#
40 1.80 50 X7R 1uF ±10% CL31B105KBHWPN#
41 1.80 50 X7R 1.5uF ±10% CL31B155KBHVPN#
42 1.80 50 X7R 2.2uF ±10% CL31B225KBHVPN#
43 1.80 50 X7R 3.3uF ±10% CL31B335KBHVPN#
44 1.80 50 X7R 4.7uF ±10% CL31B475KBHVPN#
45 1.90 50 X7R 4.7uF ±10% CL31B475KBKVPN#
46 1.90 50 X7S 4.7uF ±10% CL31Y475KBKVPN#
47 1.90 50 X7S 6.8uF ±10% CL31Y685KBKVPN#
48 1.90 50 X7R 10uF ±10% CL31B106KBK6PN#
49 1.90 50 X7S 10uF ±10% CL31Y106KBKVPN#
50 1.90 50 X7T 10uF ±10% CL31Z106KBKVPN#
51 1.25 100 X7R 100nF ±10% CL31B104KCPWPN#
52 1.25 100 X7R 220nF ±10% CL31B224KCPWPN#
53 1.80 100 X7R 330nF ±10% CL31B334KCHWPN#
54 1.80 100 X7R 470nF ±10% CL31B474KCHWPN#
55 1.80 100 X7R 680nF ±10% CL31B684KCHVPN#
56 1.80 100 X7R 1uF ±10% CL31B105KCHVPN#
57 1.80 100 X7R 2.2uF ±10% CL31B225KCHVPN#
58 1.80 100 X7S 2.2uF ±10% CL31Y225KCHVPN#

General Capacitors

1 2.80 2.5 X7T 100uF ±20% CL32Z107MSV6PN#
2 2.85 2.5 X7T 220uF ±20% CL32Z227MSV6PN#
3 2.80 4 X7S 100uF ±20% CL32Y107MRV6PN#
4 2.80 4 X7T 100uF ±20% CL32Z107MRV6PN#
5 2.80 4 X7T 100uF ±20% CL32Z107MRVVPN#
6 2.80 6.3 X7R 47uF ±10% CL32B476KQVVPN#
7 2.80 6.3 X7T 47uF ±10% CL32Z476KQVVPN#
8 2.80 6.3 X7S 47uF ±20% CL32Y476MQVVPN#
9 2.80 6.3 X7T 100uF ±20% CL32Z107MQV6PN#
10 2.80 6.3 X7T 100uF ±20% CL32Z107MQVVPN#
11 2.70 10 X7R 22uF ±10% CL32B226KPJVPN#
12 2.80 10 X7S 47uF ±10% CL32Y476KPVVPN#
13 2.80 10 X7S 47uF ±20% CL32Y476MPVVPN#
14 2.70 16 X7R 10uF ±10% CL32B106KOJVPN#
15 2.70 16 X7R 15uF ±10% CL32B156KOJVPN#
16 2.70 16 X7R 22uF ±10% CL32B226KOJVPN#
17 2.80 16 X7S 22uF ±10% CL32Y226KOVVPN#
18 2.70 16 X7R 22uF ±20% CL32B226MOJVPN#
19 2.70 25 X7R 4.7uF ±10% CL32B475KAJVPN#
20 2.70 25 X7R 10uF ±10% CL32B106KAJ4PN#
21 2.80 25 X7S 15uF ±10% CL32Y156KAVVPN#
22 2.80 25 X7S 22uF ±10% CL32Y226KAVVPN#
23 2.70 35 X7S 10uF ±10% CL32Y106KLJVPN#
24 2.70 50 X7R 1uF ±10% CL32B105KBJVPN#
25 2.70 50 X7R 2.2uF ±10% CL32B225KBJVPN#
26 2.70 50 X7R 3.3uF ±10% CL32B335KBJVPN#
27 2.70 50 X7R 4.7uF ±10% CL32B475KBJVPN#
28 2.70 50 X7S 6.8uF ±10% CL32Y685KBJVPN#
29 2.70 50 X7S 10uF ±10% CL32Y106KBJVPN#
30 2.80 50 X7R 10uF ±10% CL32B106KBVVPO#
31 2.80 75 X7S 10uF ±10% CL32Y106KTV6PN#
32 2.70 100 X7R 1uF ±10% CL32B105KCJVPN#
33 2.70 100 X7R 2.2uF ±10% CL32B225KCJVPN#
34 2.20 100 X7S 3.3uF ±10% CL32Y335KCIVPN#
35 2.20 100 X7S 4.7uF ±10% CL32Y475KCIVPN#
36 2.20 100 X7S 4.7uF ±20% CL32Y475MCIVPN#
37 2.80 100 X7S 10uF ±10% CL32Y106KCV6PN#

Mid/High Voltage Capacitors

Features
Meet AEC-Q200 and JEDEC-020-D qualified products.
Voltage rating of 250V, 630V and 1000V.
3mm bending strength guaranteed.
Operating temperature range : -55 to 125°C.
X7R dielectric components have BME and metal-epoxy terminations with a Ni/Sn plated overcoat.
C0G dielectric components contain BME and copper terminations with a Ni/Sn plated overcoat.
❶ Ceramic Body
❷ Electrode (Ni)
❸ Termination (Cu or Cu+Metal Epoxy)
❹ Plating (Ni)
⑤ Plating (Sn)
Applications
‌Powertrain, Safety, Body & Chassis, Convenience, Infotainment, ADAS, EV
C0G [1PN] C0G Float mode [3PN] BW
T (Thickness)
Plating (Sn)
Plating (Ni)
W (Width)
Termination (Cu)
L (Length)
Electrode (Ni)
Ceramic Body
X7R [VPN, 6PN] X7R Float mode [XPN, RPN]
Plating (Sn)
Plating (Ni)
Termination (Cu)
Electrode (Ni)
Ceramic Body


Code L W T BW
10 8 1.60±0.10 0.80±0.10 0.80±0.10 0.30±0.20 0603
C 2.00±0.10 1.25±0.10 0.85±0.10 0.50+0.20/-0.30
F 2.00±0.10 1.25±0.10 1.25±0.10 0.50+0.20/-0.30
21 0805
9 2.00±0.20 1.25±0.20 0.80±0.20 0.50+0.20/-0.30
Y 2.00±0.20 1.25±0.20 1.25±0.20 0.50+0.20/-0.30
F 3.20±0.15 1.60±0.15 1.25±0.15 0.50±0.30
31 W 3.20±0.20 1.60±0.20 1.05±0.20 0.50±0.30 1206
H 3.20±0.20 1.60±0.20 1.60±0.20 0.50±0.30
U 3.20±0.30 2.50±0.20 1.80±0.20 0.60±0.30
I 3.20±0.30 2.50±0.20 2.00±0.20 0.60±0.30
32 1210
J 3.20±0.30 2.50±0.20 2.50±0.20 0.60±0.30
V 3.20±0.40 2.50±0.30 2.50±0.30 0.60±0.30
Capacitance Table (C0G/X7R)
Rated Capacitance
(inch/mm) Range
(Vdc) 10 100 1 10 100 1
0603/1608 250 10pF - 1nF

250 10pF - 10nF
0805/2012
630 10pF - 560pF
C0G 250 10pF – 33nF
(125℃) 1206/3216 630 10pF - 10nF
1000 10pF - 1nF
AEC-Q200 630 15nF - 33nF
1210/3225
Mid/High 1000 1nF - 22nF
Voltage 0805/2012 250 220pF - 22nF
250 22nF - 100nF
1206/3216 630 220pF - 22nF
X7R
1000 1nF - 10nF
(125℃)
250 220nF - 220nF
1210/3225 630 4.7nF - 47nF
1000 22nF - 22nF


1 0.90 250 C0G 10pF ±5% CL10C100JE81PN#
2 0.90 250 C0G 22pF ±5% CL10C220JE81PN#
3 0.90 250 C0G 33pF ±5% CL10C330JE81PN#
4 0.90 250 C0G 47pF ±5% CL10C470JE81PN#
5 0.90 250 C0G 56pF ±5% CL10C560JE81PN#



6 0.90 250 C0G 68pF ±5% CL10C680JE81PN#
7 0.90 250 C0G 82pF ±5% CL10C820JE81PN#
8 0.90 250 C0G 100pF ±5% CL10C101JE81PN#
9 0.90 250 C0G 220pF ±5% CL10C221JE81PN#
10 0.90 250 C0G 330pF ±5% CL10C331JE81PN#
11 0.90 250 C0G 390pF ±5% CL10C391JE81PN#
12 0.90 250 C0G 470pF ±5% CL10C471JE81PN#
13 0.90 250 C0G 560pF ±5% CL10C561JE81PN#
14 0.90 250 C0G 680pF ±5% CL10C681JE81PN#
15 0.90 250 C0G 820pF ±5% CL10C821JE81PN#
16 0.90 250 C0G 1nF ±5% CL10C102JE81PN#

1 0.95 250 C0G 10pF ±5% CL21C100JEC3PN#
2 0.95 250 C0G 22pF ±5% CL21C220JEC3PN#
3 0.95 250 C0G 47pF ±5% CL21C470JEC3PN#
4 0.95 250 C0G 100pF ±5% CL21C101JEC3PN#
5 0.95 250 C0G 220pF ±5% CL21C221JEC3PN#
6 0.95 250 C0G 330pF ±5% CL21C331JEC1PN#
7 0.95 250 C0G 390pF ±5% CL21C391JEC1PN#
8 0.95 250 C0G 470pF ±5% CL21C471JEC1PN#
9 1.35 250 C0G 560pF ±5% CL21C561JEF1PN#
10 1.00 250 C0G 1nF ±5% CL21C102JE91PN#
11 1.00 250 C0G 2.2nF ±5% CL21C222JE91PN#
12 1.45 250 C0G 3.3nF ±5% CL21C332JEY1PN#
13 1.45 250 C0G 4.7nF ±1% CL21C472FEY1PN#
14 1.45 250 C0G 4.7nF ±5% CL21C472JEY1PN#
15 1.45 250 C0G 10nF ±1% CL21C103FEY1PN#
16 1.45 250 C0G 10nF ±5% CL21C103JEY1PN#
17 0.95 630 C0G 10pF ±5% CL21C100JHC3PN#
18 0.95 630 C0G 15pF ±5% CL21C150JHC3PN#
19 0.95 630 C0G 22pF ±5% CL21C220JHC3PN#
20 0.95 630 C0G 47pF ±5% CL21C470JHC3PN#
21 0.95 630 C0G 68pF ±5% CL21C680JHC3PN#
22 0.95 630 C0G 100pF ±5% CL21C101JHC3PN#
23 0.95 630 C0G 220pF ±5% CL21C221JHC3PN#
24 0.95 630 C0G 330pF ±5% CL21C331JHC1PN#
25 0.95 630 C0G 390pF ±5% CL21C391JHC1PN#
26 0.95 630 C0G 470pF ±5% CL21C471JHC1PN#
27 1.35 630 C0G 560pF ±5% CL21C561JHF1PN#



1 1.40 250 C0G 10pF ±5% CL31C100JEF3PN#
2 1.40 250 C0G 15pF ±5% CL31C150JEF3PN#
3 1.40 250 C0G 22pF ±5% CL31C220JEF3PN#
4 1.40 250 C0G 33pF ±5% CL31C330JEF3PN#
5 1.40 250 C0G 47pF ±5% CL31C470JEF3PN#
6 1.40 250 C0G 68pF ±5% CL31C680JEF3PN#
7 1.40 250 C0G 100pF ±5% CL31C101JEF3PN#
8 1.40 250 C0G 220pF ±5% CL31C221JEF1PN#
9 1.40 250 C0G 330pF ±5% CL31C331JEF1PN#
10 1.40 250 C0G 470pF ±5% CL31C471JEF1PN#
11 1.40 250 C0G 680pF ±5% CL31C681JEF1PN#
12 1.80 250 C0G 680pF ±5% CL31C681JEH1PN#
13 1.80 250 C0G 1nF ±5% CL31C102JEH1PN#
14 1.80 250 C0G 3.3nF ±5% CL31C332JEH1PN#
15 1.80 250 C0G 4.7nF ±5% CL31C472JEH1PN#
16 1.25 250 C0G 6.8nF ±5% CL31C682JEW1PN#
17 1.25 250 C0G 8.2nF ±5% CL31C822JEW1PN#
18 1.25 250 C0G 12nF ±5% CL31C123JEW1PN#
19 1.80 250 C0G 22nF ±5% CL31C223JEH1PN#
20 1.80 250 C0G 33nF ±5% CL31C333JEH1PN#
21 1.40 630 C0G 10pF ±5% CL31C100JHF3PN#
22 1.40 630 C0G 15pF ±5% CL31C150JHF3PN#
23 1.40 630 C0G 22pF ±5% CL31C220JHF3PN#
24 1.40 630 C0G 33pF ±5% CL31C330JHF3PN#
25 1.40 630 C0G 47pF ±5% CL31C470JHF3PN#
26 1.40 630 C0G 56pF ±5% CL31C560JHF3PN#
27 1.40 630 C0G 68pF ±5% CL31C680JHF3PN#
28 1.40 630 C0G 100pF ±5% CL31C101JHF3PN#
29 1.40 630 C0G 150pF ±5% CL31C151JHF1PN#
30 1.40 630 C0G 220pF ±5% CL31C221JHF1PN#
31 1.40 630 C0G 330pF ±5% CL31C331JHF1PN#
32 1.00 630 C0G 390pF ±5% CL31C391JHC3PN#
33 1.40 630 C0G 470pF ±5% CL31C471JHF1PN#
34 1.40 630 C0G 680pF ±2% CL31C681GHF1PN#
35 1.40 630 C0G 680pF ±5% CL31C681JHF1PN#
36 1.80 630 C0G 1nF ±2% CL31C102GHH1PN#
37 1.80 630 C0G 1nF ±5% CL31C102JHH1PN#
38 1.80 630 C0G 1.2nF ±2% CL31C122GHH1PN#
39 1.80 630 C0G 1.5nF ±2% CL31C152GHH1PN#
40 1.80 630 C0G 1.5nF ±5% CL31C152JHH1PN#
41 1.80 630 C0G 1.8nF ±5% CL31C182JHH1PN#
42 1.80 630 C0G 2.2nF ±2% CL31C222GHH1PN#
43 1.80 630 C0G 2.2nF ±5% CL31C222JHH1PN#



44 1.80 630 C0G 3.3nF ±2% CL31C332GHH1PN#
45 1.80 630 C0G 3.3nF ±5% CL31C332JHH1PN#
46 1.80 630 C0G 3.9nF ±2% CL31C392GHH1PN#
47 1.80 630 C0G 3.9nF ±5% CL31C392JHH1PN#
48 1.80 630 C0G 4.7nF ±2% CL31C472GHH1PN#
49 1.80 630 C0G 4.7nF ±5% CL31C472JHH1PN#
50 1.80 630 C0G 8.2nF ±5% CL31C822JHH3PN#
51 1.80 630 C0G 10nF ±5% CL31C103JHH3PN#
52 1.40 1000 C0G 10pF ±5% CL31C100JIF3PN#
53 1.40 1000 C0G 22pF ±5% CL31C220JIF3PN#
54 1.40 1000 C0G 47pF ±5% CL31C470JIF3PN#
55 1.40 1000 C0G 56pF ±5% CL31C560JIF3PN#
56 1.40 1000 C0G 100pF ±5% CL31C101JIF3PN#
57 1.80 1000 C0G 220pF ±5% CL31C221JIH3PN#
58 1.80 1000 C0G 470pF ±5% CL31C471JIH3PN#
59 1.80 1000 C0G 1nF ±5% CL31C102JIH3PN#

1 2.20 630 C0G 15nF ±5% CL32C153JHI3PN#
2 2.70 630 C0G 22nF ±5% CL32C223JHJ1PN#
3 2.70 630 C0G 27nF ±5% CL32C273JHJ1PN#
4 2.70 630 C0G 33nF ±5% CL32C333JHJ1PN#
5 2.20 1000 C0G 1nF ±5% CL32C102JII3PN#
6 2.20 1000 C0G 2.2nF ±5% CL32C222JII3PN#
7 2.20 1000 C0G 8.2nF ±5% CL32C822JII3PN#
8 2.70 1000 C0G 10nF ±5% CL32C103JIJ3PN#
9 2.70 1000 C0G 15nF ±2% CL32C153GIJ3PN#
10 2.70 1000 C0G 15nF ±5% CL32C153JIJ3PN#
11 2.80 1000 C0G 22nF ±5% CL32C223JIV1PN#


Product LineUp (X7R)

1 0.95 250 X7R 220pF ±10% CL21B221KECXPN#
2 0.95 250 X7R 1nF ±10% CL21B102KECXPN#
3 0.95 250 X7R 2.2nF ±10% CL21B222KECXPN#
4 0.95 250 X7R 2.7nF ±10% CL21B272KECXPN#
5 0.95 250 X7R 3.3nF ±10% CL21B332KECXPN#
6 0.95 250 X7R 4.7nF ±10% CL21B472KECXPN#
7 1.35 250 X7R 6.8nF ±10% CL21B682KEFXPN#
8 1.35 250 X7R 10nF ±10% CL21B103KEFXPN#
9 1.35 250 X7R 15nF ±10% CL21B153KEFXPN#
10 1.45 250 X7R 22nF ±10% CL21B223KEY6PN#

1 1.40 250 X7R 22nF ±10% CL31B223KEFXPN#
2 1.80 250 X7R 33nF ±10% CL31B333KEHXPN#
3 1.80 250 X7R 47nF ±10% CL31B473KEHVPN#
4 1.80 250 X7R 68nF ±10% CL31B683KEHVPN#
5 1.80 250 X7R 100nF ±10% CL31B104KEHVPN#
6 1.40 630 X7R 220pF ±10% CL31B221KHFXPN#
7 1.40 630 X7R 330pF ±10% CL31B331KHFXPN#
8 1.40 630 X7R 1nF ±10% CL31B102KHFXPN#
9 1.40 630 X7R 1.5nF ±10% CL31B152KHFXPN#
10 1.40 630 X7R 2.2nF ±10% CL31B222KHFXPN#
11 1.80 630 X7R 3.3nF ±10% CL31B332KHHXPN#
12 1.40 630 X7R 4.7nF ±10% CL31B472KHFXPN#
13 1.40 630 X7R 6.8nF ±10% CL31B682KHFXPN#
14 1.40 630 X7R 10nF ±10% CL31B103KHFXPN#
15 1.80 630 X7R 22nF ±10% CL31B223KHHRPN#
16 1.40 1000 X7R 1nF ±10% CL31B102KIFXPN#
17 1.40 1000 X7R 2.2nF ±10% CL31B222KIFXPN#
18 1.80 1000 X7R 3.3nF ±10% CL31B332KIHXPN#
19 1.80 1000 X7R 4.7nF ±10% CL31B472KIHXPN#
20 1.80 1000 X7R 6.8nF ±10% CL31B682KIHXPN#
21 1.80 1000 X7R 10nF ±10% CL31B103KIHXPN#

1 2.00 250 X7R 220nF ±10% CL32B224KEU6PN#
2 2.00 630 X7R 47nF ±10% CL32B473KHURPN#
3 2.20 1000 X7R 22nF ±10% CL32B223KIIXPN#

High Bending Strength Capacitors High Bending

Strength
Features
X7*/X8* dielectric components have BME and metal-epoxy terminations with a Ni/Sn plated overcoat.
5mm bending strength guaranteed.
Strong thermo-mechanical properties.
① Ni/Sn
❷ Metal/Epoxy Termination
❸ Cu-Term
Applications
‌Critical circuits and battery line circuits.
(Cracking caused by flexing stress after board mounting is minimized)

BW Standard Design (VPJ, 6PJ) Open mode Design (WPJ, PPJ)
T Plating (Sn)
Plating (Ni)
Termination (Soft Termination)
W
Termination (Cu)
L
Electrode (Ni)
Ceramic Body

High Bending Strength Capacitors

Code L W T BW
5 1.00±0.10 0.50±0.05 0.50±0.05 0.25±0.10
05 0402
6 1.00±0.20 0.50±0.20 0.50±0.20 0.25±0.10
8 1.60±0.20 0.80±0.10 0.80±0.10 0.30±0.20
10 0603
9 1.60±0.30 0.80±0.20 0.80±0.20 0.30±0.20
C 2.00±0.30 1.25±0.20 0.85±0.10 0.50+0.20/-0.30
F 2.00±0.30 1.25±0.20 1.25±0.20 0.50+0.02/-0.30
21 Q 2.00±0.35 1.25±0.25 1.25±0.25 0.50+0.20/-0.30 0805
Y 2.00±0.20 1.25±0.20 1.25+0.20/-0.15 0.50+0.20/-0.30
B 2.00±0.25 1.25±0.25 1.25+0.25/-0.20 0.50+0.20/-0.30
H 3.20±0.30 1.60±0.30 1.60±0.30 0.60+0.40/-0.30
31 1206
K ¹ 3.20±0.30 1.60±0.30 1.60+0.30/-0.25 0.60+0.40/-0.30
I 3.20±0.40 2.50±0.30 2.00±0.30 0.60+0.40/-0.30
32 J 3.20±0.40 2.50±0.30 2.50±0.30 0.60+0.40/-0.30 1210
V 3.20±0.40 2.50±0.35/-0.30 2.50+0.35/-0.30 0.60+0.40/-0.30
※ ¹ Size exception : CL31Y106KBKVPJ# L 3.20±0.30, W 1.60±0.30, T 1.60±0.30
Capacitance Table (C0G/X7R/X7S/X7T/X8L/X8M)
Rated Capacitance
(inch/mm) Range
(Vdc) 1 10 100 1 10 100
C0G
1210/3225 630 33nF - 33nF
(125℃)
10 100nF - 100nF
16 47nF - 220nF
0402/1005
25 10nF - 220nF
50 10nF - 10nF
6.3 1uF - 1uF
10 150nF - 220nF
16 10nF - 1uF
AEC-Q200
Soft 0603/1608 25 1nF - 1uF
Termination X7R 35 1uF - 1uF
(5mm) (125℃) 50 1nF - 1uF
100 1nF - 100nF
6.3 4.7uF - 10uF
10 2.2uF - 10uF
16 330nF - 4.7uF
0805/2012 25 1nF - 4.7uF
35 2.2uF - 4.7uF
50 1nF - 2.2uF
100 1nF - 470nF


Rated Capacitance
(inch/mm) Range
(Vdc) 1 10 100 1 10 100
6.3 22uF - 22uF

10 10uF - 22uF
16 1uF - 10uF
1206/3216 25 100nF - 10uF
35 10uF - 10uF
50 100nF - 10uF
X7R
100 100nF - 2.2uF
(125℃)
6.3 47uF - 47uF
10 22uF - 22uF
16 22uF - 22uF
1210/3225
25 10uF - 10uF
50 1uF - 10uF
100 1uF - 4.7uF
10 330nF - 1uF
0402/1005
16 220nF - 220nF
6.3 2.2uF - 4.7uF
10 4.7uF - 4.7uF
0603/1608
16 2.2uF - 2.2uF
25 2.2uF - 2.2uF
6.3 10uF - 10uF
10 2.2uF - 10uF
16 10uF - 10uF
25 4.7uF - 10uF
AEC-Q200 0805/2012
Soft 35 4.7uF - 4.7uF
Termination 50 2.2uF - 4.7uF
(5mm)
X7S 75 1uF - 1uF
(125℃) 100 150nF - 1uF
16 22uF - 22uF
25 10uF - 10uF
35 10uF - 10uF
1206/3216
50 4.7uF - 10uF
75 2.2uF - 2.2uF
100 2.2uF - 2.2uF
6.3 47uF - 47uF
10 47uF - 47uF
25 15uF - 22uF
1210/3225
50 6.8uF - 10uF
75 10uF - 10uF
100 3.3uF - 10uF
4 10uF - 10uF
0603/1608
6.3 4.7uF - 10uF
4 22uF - 22uF
0805/2012
6.3 22uF - 22uF
X7T
4 47uF - 47uF
(125℃) 1206/3216
6.3 47uF - 47uF
2.5 100uF - 100uF
1210/3225 4 100uF - 100uF
6.3 100uF - 100uF


Rated Capacitance
(inch/mm) Range
(Vdc) 1 10 100 1 10 100
0603/1608 50 1uF - 1uF

16 1uF - 1uF
25 470nF - 1uF
0805/2012
X8L 35 470nF - 4.7uF
AEC-Q200
Soft (150℃) 50 470nF - 470nF
Termination 10 22uF - 22uF
(5mm) 1206/3216
100 1uF - 1uF
1210/3225 100 4.7uF - 4.7uF
X8M
0805/2012 16 10uF - 10uF
(150℃)


1 2.80 630 C0G 33nF ±5% CL32C333JHJ6PJ#
Product LineUp (X7R/X7S/X7T)


1 0.55 10 X7R 100nF ±10% CL05B104KP5VPJ#
2 0.55 10 X7S 330nF ±10% CL05Y334KP5VPJ#
3 0.60 10 X7S 470nF ±10% CL05Y474KP5VPJ#
4 0.70 10 X7S 680nF ±10% CL05Y684KP6VPJ#
5 0.70 10 X7S 1uF ±10% CL05Y105KP6VPJ#
6 0.55 16 X7R 47nF ±10% CL05B473KO5VPJ#
7 0.55 16 X7R 68nF ±10% CL05B683KO5VPJ#
8 0.55 16 X7R 100nF ±10% CL05B104KO5VPJ#
9 0.55 16 X7R 220nF ±10% CL05B224KO5VPJ#
10 0.55 16 X7S 220nF ±10% CL05Y224KO5VPJ#
11 0.55 25 X7R 10nF ±10% CL05B103KA5VPJ#
12 0.55 25 X7R 220nF ±10% CL05B224KA5VPJ#
13 0.55 50 X7R 10nF ±10% CL05B103KB5VPJ#



1 1.00 4 X7T 10uF ±20% CL10Z106MR9VPJ#
2 0.90 6.3 X7R 1uF ±10% CL10B105KQ8VPJ#
3 0.90 6.3 X7S 2.2uF ±10% CL10Y225KQ8VPJ#
4 1.00 6.3 X7S 4.7uF ±10% CL10Y475KQ96PJ#
5 1.00 6.3 X7T 4.7uF ±20% CL10Z475MQ96PJ#
6 1.00 6.3 X7T 10uF ±20% CL10Z106MQ9VPJ#
7 0.90 10 X7R 150nF ±10% CL10B154KP8VPJ#
8 0.90 10 X7R 220nF ±10% CL10B224KP8VPJ#
9 1.00 10 X7S 4.7uF ±10% CL10Y475KP96PJ#
10 0.90 16 X7R 10nF ±10% CL10B103KO8WPJ#
11 0.90 16 X7R 15nF ±10% CL10B153KO8VPJ#
12 0.90 16 X7R 33nF ±10% CL10B333KO8VPJ#
13 0.90 16 X7R 47nF ±10% CL10B473KO8VPJ#
14 0.90 16 X7R 68nF ±10% CL10B683KO8VPJ#
15 0.90 16 X7R 100nF ±10% CL10B104KO8VPJ#
16 0.90 16 X7R 150nF ±10% CL10B154KO8VPJ#
17 0.90 16 X7R 220nF ±10% CL10B224KO8VPJ#
18 0.90 16 X7R 330nF ±10% CL10B334KO8VPJ#
19 0.90 16 X7R 470nF ±10% CL10B474KO8VPJ#
20 0.90 16 X7R 1uF ±10% CL10B105KO8VPJ#
21 1.00 16 X7S 2.2uF ±10% CL10Y225KO96PJ#
22 0.90 25 X7R 1nF ±10% CL10B102KA8WPJ#
23 0.90 25 X7R 1.5nF ±10% CL10B152KA8WPJ#
24 0.90 25 X7R 2.2nF ±10% CL10B222KA8WPJ#
25 0.90 25 X7R 3.3nF ±10% CL10B332KA8WPJ#
26 0.90 25 X7R 4.7nF ±10% CL10B472KA8WPJ#
27 0.90 25 X7R 6.8nF ±10% CL10B682KA8WPJ#
28 0.90 25 X7R 10nF ±10% CL10B103KA8WPJ#
29 0.90 25 X7R 15nF ±10% CL10B153KA8VPJ#
30 0.90 25 X7R 22nF ±10% CL10B223KA8VPJ#
31 0.90 25 X7R 33nF ±10% CL10B333KA8VPJ#
32 0.90 25 X7R 47nF ±10% CL10B473KA8VPJ#
33 0.90 25 X7R 68nF ±10% CL10B683KA8VPJ#
34 0.90 25 X7R 100nF ±10% CL10B104KA8VPJ#
35 0.90 25 X7R 150nF ±10% CL10B154KA8VPJ#
36 0.90 25 X7R 220nF ±10% CL10B224KA8VPJ#
37 0.90 25 X7R 470nF ±10% CL10B474KA8VPJ#
38 0.90 25 X7R 1uF ±10% CL10B105KA8VPJ#
39 1.00 25 X7S 2.2uF ±10% CL10Y225KA96PJ#
40 1.00 35 X7R 1uF ±10% CL10B105KL9VPJ#
41 0.90 50 X7R 1nF ±10% CL10B102KB8WPJ#
42 0.90 50 X7R 1.5nF ±10% CL10B152KB8WPJ#
43 0.90 50 X7R 2.2nF ±10% CL10B222KB8WPJ#
44 0.90 50 X7R 3.3nF ±10% CL10B332KB8WPJ#
45 0.90 50 X7R 4.7nF ±10% CL10B472KB8WPJ#



46 0.90 50 X7R 6.8nF ±10% CL10B682KB8WPJ#
47 0.90 50 X7R 10nF ±10% CL10B103KB8WPJ#
48 0.90 50 X7R 15nF ±10% CL10B153KB8VPJ#
49 0.90 50 X7R 22nF ±10% CL10B223KB8VPJ#
50 0.90 50 X7R 33nF ±10% CL10B333KB8VPJ#
51 0.90 50 X7R 47nF ±10% CL10B473KB8VPJ#
52 0.90 50 X7R 68nF ±10% CL10B683KB8VPJ#
53 0.90 50 X7R 100nF ±10% CL10B104KB8VPJ#
54 0.90 50 X7R 150nF ±10% CL10B154KB8VPJ#
55 0.90 50 X7R 220nF ±10% CL10B224KB8VPJ#
56 0.90 50 X7R 220nF ±10% CL10B224KB8VPL#
57 0.90 50 X7R 220nF ±20% CL10B224MB8VPL#
58 0.90 50 X7R 330nF ±10% CL10B334KB8VPJ#
59 0.90 50 X7R 470nF ±10% CL10B474KB8VPJ#
60 1.00 50 X7R 1uF ±10% CL10B105KB9VPJ#
61 0.90 100 X7R 1nF ±10% CL10B102KC8WPJ#
62 0.90 100 X7R 1.5nF ±10% CL10B152KC8WPJ#
63 0.90 100 X7R 2.2nF ±10% CL10B222KC8WPJ#
64 0.90 100 X7R 3.3nF ±10% CL10B332KC8WPJ#
65 0.90 100 X7R 4.7nF ±10% CL10B472KC8WPJ#
66 0.90 100 X7R 6.8nF ±10% CL10B682KC8WPJ#
67 0.90 100 X7R 10nF ±10% CL10B103KC8WPJ#
68 0.90 100 X7R 15nF ±10% CL10B153KC8VPJ#
69 0.90 100 X7R 22nF ±10% CL10B223KC8VPJ#
70 0.90 100 X7R 33nF ±10% CL10B333KC8VPJ#
71 0.90 100 X7R 47nF ±10% CL10B473KC8VPJ#
72 0.90 100 X7R 68nF ±10% CL10B683KC8VPJ#
73 0.90 100 X7R 100nF ±10% CL10B104KC8VPJ#

1 1.45 4 X7T 22uF ±20% CL21Z226MRYVPJ#
2 1.50 6.3 X7R 4.7uF ±10% CL21B475KQQVPJ#
3 1.45 6.3 X7R 10uF ±10% CL21B106KQY6PJ#
4 1.50 6.3 X7S 10uF ±10% CL21Y106KQQVPJ#
5 1.45 6.3 X7T 22uF ±20% CL21Z226MQYVPJ#
6 1.45 10 X7R 2.2uF ±10% CL21B225KPFVPJ#
7 1.45 10 X7S 2.2uF ±10% CL21Y225KPYVPJ#
8 1.50 10 X7S 4.7uF ±10% CL21Y475KPBVPJ#
9 1.45 10 X7R 10uF ±10% CL21B106KPY6PJ#
10 1.50 10 X7S 10uF ±10% CL21Y106KPQVPJ#



11 1.45 16 X7R 330nF ±10% CL21B334KOFVPJ#
12 1.45 16 X7R 470nF ±10% CL21B474KOFVPJ#
13 1.45 16 X7R 1uF ±10% CL21B105KOFVPJ#
14 1.50 16 X7R 2.2uF ±10% CL21B225KOQVPJ#
15 1.50 16 X7R 3.3uF ±10% CL21B335KOQVPJ#
16 1.50 16 X7R 4.7uF ±10% CL21B475KOQVPJ#
17 1.50 16 X7S 10uF ±10% CL21Y106KOBVPJ#
18 0.95 25 X7R 1nF ±10% CL21B102KACWPJ#
19 0.95 25 X7R 1.5nF ±10% CL21B152KACWPJ#
20 0.95 25 X7R 2.2nF ±10% CL21B222KACWPJ#
21 0.95 25 X7R 3.3nF ±10% CL21B332KACWPJ#
22 0.95 25 X7R 4.7nF ±10% CL21B472KACWPJ#
23 0.95 25 X7R 6.8nF ±10% CL21B682KACWPJ#
24 1.45 25 X7R 15nF ±10% CL21B153KAFWPJ#
25 1.45 25 X7R 22nF ±10% CL21B223KAFWPJ#
26 1.45 25 X7R 68nF ±10% CL21B683KAFWPJ#
27 1.45 25 X7R 100nF ±10% CL21B104KAFWPJ#
28 1.45 25 X7R 330nF ±10% CL21B334KAFVPJ#
29 1.45 25 X7R 470nF ±10% CL21B474KAFVPJ#
30 1.45 25 X7R 1uF ±10% CL21B105KAFVPJ#
31 1.45 25 X7R 2.2uF ±10% CL21B225KAFVPJ#
32 1.50 25 X7R 4.7uF ±10% CL21B475KAB6PJ#
33 1.50 25 X7S 4.7uF ±10% CL21Y475KABVPJ#
34 1.50 25 X7S 10uF ±10% CL21Y106KABVPJ#
35 1.45 35 X7R 2.2uF ±10% CL21B225KLYVPJ#
36 1.50 35 X7R 3.3uF ±10% CL21B335KLB6PJ#
37 1.50 35 X7R 4.7uF ±10% CL21B475KLB6PJ#
38 1.50 35 X7S 4.7uF ±10% CL21Y475KLBVPJ#
39 0.95 50 X7R 1nF ±10% CL21B102KBCWPJ#
40 0.95 50 X7R 1.5nF ±10% CL21B152KBCWPJ#
41 0.95 50 X7R 2.2nF ±10% CL21B222KBCWPJ#
42 0.95 50 X7R 3.3nF ±10% CL21B332KBCWPJ#
43 0.95 50 X7R 4.7nF ±10% CL21B472KBCWPJ#
44 0.95 50 X7R 6.8nF ±10% CL21B682KBCWPJ#
45 0.95 50 X7R 10nF ±10% CL21B103KBCWPJ#
46 1.45 50 X7R 15nF ±10% CL21B153KBFWPJ#
47 1.45 50 X7R 22nF ±10% CL21B223KBFWPJ#
48 1.45 50 X7R 47nF ±10% CL21B473KBFWPJ#
49 1.45 50 X7R 68nF ±10% CL21B683KBFWPJ#
50 1.45 50 X7R 100nF ±10% CL21B104KBFWPJ#
51 1.45 50 X7R 150nF ±10% CL21B154KBFVPJ#
52 1.45 50 X7R 220nF ±10% CL21B224KBFVPJ#
53 1.45 50 X7R 330nF ±10% CL21B334KBFVPJ#
54 1.45 50 X7R 470nF ±10% CL21B474KBFVPJ#
55 1.45 50 X7R 1uF ±10% CL21B105KBFVPJ#



56 1.45 50 X7R 2.2uF ±10% CL21B225KBYVPJ#
57 1.45 50 X7S 2.2uF ±10% CL21Y225KBYVPJ#
58 1.50 50 X7S 4.7uF ±10% CL21Y475KBBVPJ#
59 1.45 75 X7S 1uF ±10% CL21Y105KTFVPJ#
60 0.95 100 X7R 1nF ±10% CL21B102KCCWPJ#
61 0.95 100 X7R 1.5nF ±10% CL21B152KCCWPJ#
62 0.95 100 X7R 2.2nF ±10% CL21B222KCCWPJ#
63 0.95 100 X7R 3.3nF ±10% CL21B332KCCWPJ#
64 0.95 100 X7R 4.7nF ±10% CL21B472KCCWPJ#
65 0.95 100 X7R 6.8nF ±10% CL21B682KCCWPJ#
66 0.95 100 X7R 10nF ±10% CL21B103KCCWPJ#
67 1.45 100 X7R 15nF ±10% CL21B153KCFWPJ#
68 1.45 100 X7R 22nF ±10% CL21B223KCFWPJ#
69 1.45 100 X7R 47nF ±10% CL21B473KCFWPJ#
70 1.45 100 X7R 68nF ±10% CL21B683KCFWPJ#
71 1.45 100 X7R 100nF ±10% CL21B104KCFWPJ#
72 1.45 100 X7R 150nF ±10% CL21B154KCFVPJ#
73 1.45 100 X7S 150nF ±10% CL21Y154KCFVPJ#
74 1.45 100 X7R 220nF ±10% CL21B224KCFVPJ#
75 1.45 100 X7R 470nF ±10% CL21B474KCFVPJ#
76 1.45 100 X7S 470nF ±10% CL21Y474KCFVPJ#
77 1.45 100 X7S 470nF ±10% CL21Y474KCYVPJ#
78 1.45 100 X7S 1uF ±10% CL21Y105KCFVPJ#

1 1.90 4 X7T 47uF ±20% CL31Z476MRKVPJ#
2 1.90 6.3 X7R 22uF ±10% CL31B226KQKVPJ#
3 1.90 6.3 X7R 22uF ±20% CL31B226MQKVPJ#
4 1.90 6.3 X7T 47uF ±20% CL31Z476MQKVPJ#
5 1.90 10 X7R 10uF ±10% CL31B106KPKVPJ#
6 1.90 10 X7R 22uF ±10% CL31B226KPKVPJ#
7 1.90 16 X7R 1uF ±10% CL31B105KOHVPJ#
8 1.90 16 X7R 2.2uF ±10% CL31B225KOHVPJ#
9 1.90 16 X7R 4.7uF ±10% CL31B475KOHVPJ#
10 1.90 16 X7R 10uF ±10% CL31B106KOHVPJ#
11 1.90 16 X7S 22uF ±20% CL31Y226MOK6PJ#
12 1.90 25 X7R 100nF ±10% CL31B104KAHVPJ#
13 1.90 25 X7R 220nF ±10% CL31B224KAHVPJ#
14 1.90 25 X7R 1uF ±10% CL31B105KAHVPJ#
15 1.90 25 X7R 2.2uF ±10% CL31B225KAHVPJ#



16 1.90 25 X7R 4.7uF ±10% CL31B475KAHVPJ#
17 1.90 25 X7R 10uF ±10% CL31B106KAHVPJ#
18 1.90 25 X7R 10uF ±10% CL31B106KAK6PL#
19 1.90 25 X7S 10uF ±10% CL31Y106KAKVPJ#
20 1.90 35 X7R 10uF ±10% CL31B106KLK6PJ#
21 1.90 35 X7S 10uF ±10% CL31Y106KLKVPJ#
22 1.90 50 X7R 100nF ±10% CL31B104KBHVPJ#
23 1.90 50 X7R 220nF ±10% CL31B224KBHVPJ#
24 1.90 50 X7R 470nF ±10% CL31B474KBHVPJ#
25 1.90 50 X7R 1uF ±10% CL31B105KBHVPJ#
26 1.90 50 X7R 2.2uF ±10% CL31B225KBHVPJ#
27 1.90 50 X7R 4.7uF ±10% CL31B475KBHVPJ#
28 1.90 50 X7R 4.7uF ±10% CL31B475KBKVPJ#
29 1.90 50 X7S 4.7uF ±10% CL31Y475KBKVPJ#
30 1.90 50 X7R 10uF ±10% CL31B106KBK6PJ#
31 1.90 50 X7S 10uF ±10% CL31Y106KBKVPJ#
32 1.90 75 X7S 2.2uF ±10% CL31Y225KTHVPJ#
33 1.90 100 X7R 100nF ±10% CL31B104KCHVPJ#
34 1.90 100 X7R 220nF ±10% CL31B224KCHVPJ#
35 1.90 100 X7R 680nF ±10% CL31B684KCHVPJ#
36 1.90 100 X7R 1uF ±10% CL31B105KCHVPJ#
37 1.90 100 X7R 2.2uF ±10% CL31B225KCHVPJ#
38 1.90 100 X7S 2.2uF ±10% CL31Y225KCHVPJ#

1 2.85 2.5 X7T 100uF ±20% CL32Z107MSV6PJ#
2 2.85 4 X7T 100uF ±20% CL32Z107MRV6PJ#
3 2.85 4 X7T 100uF ±20% CL32Z107MRVVPJ#
4 2.85 6.3 X7R 47uF ±10% CL32B476KQVVPJ#
5 2.85 6.3 X7S 47uF ±20% CL32Y476MQVVPJ#
6 2.85 6.3 X7T 100uF ±20% CL32Z107MQV6PJ#
7 2.80 10 X7R 22uF ±10% CL32B226KPJVPJ#
8 2.85 10 X7S 47uF ±10% CL32Y476KPVVPJ#
9 2.85 10 X7S 47uF ±20% CL32Y476MPVVPJ#
10 2.80 16 X7R 22uF ±10% CL32B226KOJVPJ#
11 2.80 25 X7R 10uF ±10% CL32B106KAJVPJ#
12 2.85 25 X7S 15uF ±10% CL32Y156KAVVPJ#
13 2.85 25 X7S 22uF ±10% CL32Y226KAVVPJ#
14 2.80 50 X7R 1uF ±10% CL32B105KBJVPJ#
15 2.80 50 X7R 2.2uF ±10% CL32B225KBJVPJ#



16 2.80 50 X7R 4.7uF ±10% CL32B475KBJVPJ#
17 2.80 50 X7S 6.8uF ±10% CL32Y685KBJVPJ#
18 2.80 50 X7S 10uF ±10% CL32Y106KBJVPJ#
19 2.85 50 X7R 10uF ±10% CL32B106KBVVPL#
20 2.80 75 X7S 10uF ±10% CL32Y106KTJ6PJ#
21 2.80 100 X7R 1uF ±10% CL32B105KCJVPJ#
22 2.80 100 X7R 2.2uF ±10% CL32B225KCJVPJ#
23 2.30 100 X7S 3.3uF ±10% CL32Y335KCIVPJ#
24 2.30 100 X7R 4.7uF ±10% CL32B475KCI6PJ#
25 2.30 100 X7S 4.7uF ±10% CL32Y475KCIVPJ#
26 2.30 100 X7S 4.7uF ±20% CL32Y475MCIVPJ#
27 2.80 100 X7S 10uF ±10% CL32Y106KCJ6PJ#
Product LineUp (X8L/X8M)


No. TCC Capacitance Part Number Remarks
1 1.00 50 X8L 1uF ±10% CL10E105KB9VPJ# Derating B

1 1.45 16 X8L 1uF ±10% CL21E105KOFVPJ#
2 1.50 16 X8M 10uF ±10% CL21M106KOBVPJ# Derating B
3 1.45 25 X8L 470nF ±10% CL21E474KAFVPJ#
4 1.45 25 X8L 1uF ±10% CL21E105KAFVPJ#
5 1.45 35 X8L 470nF ±10% CL21E474KLFVPJ#
6 1.45 35 X8L 1uF ±10% CL21E105KLFVPJ#
7 1.50 35 X8L 4.7uF ±10% CL21E475KLBVPJ# Derating B
8 1.45 50 X8L 470nF ±10% CL21E474KBFVPJ#

1 1.90 10 X8L 22uF ±10% CL31E226KPKVPJ# Derating B
2 1.90 100 X8L 1uF ±10% CL31E105KCHVPJ# Derating B

1 2.30 100 X8L 4.7uF ±10% CL32E475KCIVPJ# Derating B
※ ¹ Derating B : This MLCC should be applied with the derated voltage and temperature according to derating guide. Please refer to individual specifications.

Fail Safe Capacitors (Soft Termination 5mm) Fail Safe
Features
Designed to prevent circuit malfunction in the case of an internal short, caused by a crack which occurrs in a MLCC product.
This also guarantees 5mm bending and prevents defects caused by PCB deformation.
This product has the highest degree of safety among all MLCCs.
- Series(Float) Design : D
esigned to operate like two MLCCs in a series
Even if a defect such as a crack occurs on one side, the circuit can be protected on the other side
- 5mm Bending Guarantee : Guarantees no bending cracks for board flex 5mm variants
Applications
All automotive application include 12V Battery line, circuit near hole and connector.

BW
BW
T(Thickness)
T(Thickness)
W(Width)
L(Length)
W(Width)
L(Length)

Code L W T BW
10 8 1.60±0.20 0.80±0.10 0.80±0.10 0.30±0.20 0603
21 F 2.00±0.30 1.25±0.20 1.25±0.20 0.5+0.2/-0.3 0805

Fail Safe Capacitors (Soft Termination 5mm)

Capacitance Table
Rated Capacitance
(inch/mm) Range
(Vdc) 1 10 100 1 10 100
AEC-Q200 50 10nF - 22nF

0603/1608
Fail Safe/ 100 10nF - 22nF
X7R
Soft
(125℃) 50 10nF - 100nF
Termination
0805/2012
(5mm) 100 10nF - 100nF


1 0.90 50 X7R 10nF ±10% CL10B103KB8XPJ#
2 0.90 50 X7R 15nF ±10% CL10B153KB8XPJ#
3 0.90 50 X7R 22nF ±10% CL10B223KB8XPJ#
4 0.90 100 X7R 10nF ±10% CL10B103KC8XPJ#
5 0.90 100 X7R 15nF ±10% CL10B153KC8XPJ#
6 0.90 100 X7R 22nF ±10% CL10B223KC8XPJ#

1 1.45 50 X7R 10nF ±10% CL21B103KBFXPJ#
2 1.45 50 X7R 100nF ±10% CL21B104KBFXPJ#
3 1.45 100 X7R 10nF ±10% CL21B103KCFXPJ#
4 1.45 100 X7R 68nF ±10% CL21B683KCFXPJ#
5 1.45 100 X7R 100nF ±10% CL21B104KCFXPJ#

High Temperature Capacitors

Features
Meet AEC-Q200 and JEDEC-020-D qualified products.
Operating temperature range : -55 to 150°C.
High reliability MLCC that ensure the heating environment of Powertrain network and EV high temperature products.
❶ Ceramic Body
❷ Electrode (Ni)
❸ ‌Termination (Cu or Cu+Metal Epoxy)
❹ ‌Plating (Ni)
⑤ Plating (Sn)
Applications
‌Used in places with high power consumption and high operating temperature like Powertrain, Engine oil, Inverter, Lighting etc.

Code L W T BW
05 5 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 0402
8 1.60±0.10 0.80±0.10 0.80±0.10 0.30±0.20
10 0603
9 1.60±0.20 0.80±0.20 0.80±0.20 0.30±0.20
C 2.00±0.10 1.25±0.10 0.85±0.10 0.50+0.20/-0.30
F 2.00±0.10 1.25±0.10 1.25±0.10 0.50+0.20/-0.30
21 0805
Q 2.00±0.15 1.25±0.15 1.25±0.15 0.50+0.20/-0.30
B 2.00±0.25 1.25±0.25 1.25±0.25 0.50+0.20/-0.30
H 3.20±0.20 1.60±0.20 1.60±0.20 0.50±0.30
31 1206
K 3.20±0.30 1.60±0.30 1.60±0.30 0.50±0.30
I 3.20±0.30 2.50±0.20 2.00±0.20 0.60±0.30
32 J 3.20±0.30 2.50±0.20 2.50±0.20 0.60±0.30 1210
V 3.20±0.40 2.50±0.30 2.50±0.30 0.60±0.30
Capacitance Table (X8G/X8L/X8M)
Rated Capacitance
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
50 4.7pF - 1nF
0402/1005
100 270pF - 1nF
X8G 50 10pF - 680pF
AEC-Q200 0603/1608
(150℃) 100 10pF - 1nF
50 150pF - 6.8nF
0805/2012
100 150pF - 1.5nF


Rated Capacitance
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
16 47nF - 47nF
0402/1005 25 10nF - 100nF
50 47nF - 100nF
6.3 4.7uF - 4.7uF
16 220nF - 220nF
0603/1608 25 220nF - 220nF
50 1nF - 1uF
100 100nF - 100nF
16 10uF - 10uF
X8L 25 470nF - 470nF
AEC-Q200 0805/2012
(150℃)/
High 35 2.2uF - 4.7uF
X8M
Temperature 50 220nF - 220nF
(150℃)
4 47uF - 47uF
10 22uF - 22uF
16 2.2uF - 2.2uF
1206/3216
25 2.2uF - 10uF
35 10uF - 10uF
100 1uF - 2.2uF
25 22uF - 22uF
1210/3225 50 4.7uF - 10uF
100 2.2uF - 4.7uF
Product LineUp (X8G)


1 0.55 50 X8G 4.7pF ±0.25pF CL05G4R7CB51PN#
2 0.55 50 X8G 5.6pF ±0.1pF CL05G5R6BB51PN#
3 0.55 50 X8G 5.6pF ±0.25pF CL05G5R6CB51PN#
4 0.55 50 X8G 10pF ±5% CL05G100JB51PN#
5 0.55 50 X8G 22pF ±5% CL05G220JB51PN#
6 0.55 50 X8G 33pF ±5% CL05G330JB51PN#
7 0.55 50 X8G 47pF ±5% CL05G470JB51PN#
8 0.55 50 X8G 100pF ±5% CL05G101JB51PN#
9 0.55 50 X8G 220pF ±5% CL05G221JB51PN#
10 0.55 50 X8G 270pF ±5% CL05G271JB51PN#
11 0.55 50 X8G 470pF ±5% CL05G471JB51PN#
12 0.55 50 X8G 1nF ±5% CL05G102JB51PN#
13 0.55 100 X8G 270pF ±5% CL05G271JC51PN#
14 0.55 100 X8G 470pF ±5% CL05G471JC51PN#
15 0.55 100 X8G 1nF ±5% CL05G102JC51PN#



1 0.90 50 X8G 10pF ±5% CL10G100JB81PN#
2 0.90 50 X8G 15pF ±5% CL10G150JB81PN#
3 0.90 50 X8G 47pF ±5% CL10G470JB81PN#
4 0.90 50 X8G 100pF ±5% CL10G101JB81PN#
5 0.90 50 X8G 220pF ±5% CL10G221JB81PN#
6 0.90 50 X8G 330pF ±5% CL10G331JB81PN#
7 0.90 50 X8G 470pF ±5% CL10G471JB81PN#
8 0.90 50 X8G 680pF ±5% CL10G681JB81PN#
9 0.90 100 X8G 10pF ±5% CL10G100JC81PN#
10 0.90 100 X8G 15pF ±5% CL10G150JC81PN#
11 0.90 100 X8G 22pF ±5% CL10G220JC81PN#
12 0.90 100 X8G 47pF ±5% CL10G470JC81PN#
13 0.90 100 X8G 100pF ±5% CL10G101JC81PN#
14 0.90 100 X8G 220pF ±5% CL10G221JC81PN#
15 0.90 100 X8G 330pF ±5% CL10G331JC81PN#
16 0.90 100 X8G 470pF ±5% CL10G471JC81PN#
17 0.90 100 X8G 680pF ±5% CL10G681JC81PN#
18 0.90 100 X8G 1nF ±5% CL10G102JC81PN#

1 0.95 50 X8G 150pF ±5% CL21G151JBC1PN#
2 0.95 50 X8G 680pF ±5% CL21G681JBC1PN#
3 0.95 100 X8G 820pF ±5% CL21G821JCC1PN#
4 0.95 50 X8G 1.5nF ±5% CL21G152JBC1PN#
5 0.95 50 X8G 4.7nF ±5% CL21G472JBC1PN#
6 1.35 50 X8G 6.8nF ±5% CL21G682JBF1PN#
7 0.95 100 X8G 150pF ±5% CL21G151JCC1PN#
8 0.95 100 X8G 1.5nF ±5% CL21G152JCC1PN#
Product LineUp (X8L/X8M)


1 0.55 16 X8L 47nF ±10% CL05E473KO5VPN#
2 0.55 25 X8L 10nF ±10% CL05E103KA5VPN#
3 0.55 25 X8L 33nF ±10% CL05E333KA54PN#
4 0.55 25 X8L 47nF ±10% CL05E473KA5VPN#
5 0.55 25 X8L 100nF ±10% CL05E104KA5VPN#
6 0.55 50 X8L 47nF ±10% CL05E473KB5VPN# Derating B



1 1.00 6.3 X8L 4.7uF ±10% CL10E475KQ96PN# Derating B
2 1.00 6.3 X8M 4.7uF ±10% CL10M475KQ96PN# Derating B
3 0.90 16 X8L 220nF ±10% CL10E224KO8VPN#
4 0.90 25 X8L 220nF ±10% CL10E224KA84PN#
5 0.90 50 X8L 1nF ±10% CL10E102KB8WPN#
6 0.90 50 X8L 10nF ±10% CL10E103KB8WPN#
9 1.00 50 X8L 1uF ±10% CL10E105KB9VPN# Derating B
10 0.90 100 X8L 100nF ±10% CL10E104KC8VPN# Derating B

1 1.50 16 X8M 10uF ±10% CL21M106KOBVPN# Derating B
2 1.35 25 X8L 470nF ±10% CL21E474KAF4PN#
3 1.50 35 X8L 2.2uF ±10% CL21E225KLBVPN# Derating B
4 1.50 35 X8L 4.7uF ±10% CL21E475KLBVPN# Derating B
5 1.40 50 X8L 220nF ±10% CL21E224KBQVPN#

1 1.90 4 X8M 47uF ±20% CL31M476MRKVPN# Derating B
2 1.90 10 X8L 22uF ±10% CL31E226KPKVPN# Derating B
3 1.80 16 X8L 2.2uF ±10% CL31E225KOHVPN#
4 1.80 25 X8L 2.2uF ±10% CL31E225KAH4PN#
5 1.90 25 X8L 10uF ±10% CL31E106KAKVPN# Derating B
6 1.90 35 X8M 10uF ±10% CL31M106KLKVPN# Derating B
7 1.80 100 X8L 1uF ±10% CL31E105KCHVPN# Derating B
8 1.80 100 X8L 2.2uF ±10% CL31E225KCHVPN# Derating B

1 2.80 25 X8L 22uF ±10% CL32E226KAVVPN# Derating B
2 2.20 50 X8L 4.7uF ±10% CL32E475KBIVPN#
3 2.80 50 X8L 10uF ±10% CL32E106KBVVPO# Derating B
4 2.70 100 X8L 2.2uF ±10% CL32E225KCJVPN#
5 2.20 100 X8L 4.7uF ±10% CL32E475KCIVPN# Derating B
※ ¹ Derating B : This MLCC should be applied with the derated voltage and temperature according to derating guide. Please refer to individual specifications.

ESD Protection Capacitors ESD
Features
Compliance with the IEC 61000-4-2 standard for ESD immunity.
Enhanced DC-Bias
ESD Protection
I/O Connector ESD Sensitive Device
ESD Protection MLCC
GND
Applications
Input and output sections in a wide range of automotive electronics.

BW
Plating (Sn)
Plating (Ni)
T
Termination (Cu)
W
L
Electrode (Ni)
Ceramic Body
Dimension (mm)
L W T BW
10 1.70±0.10 0.90±0.10 0.90±0.10 0.30±0.20 0603
Capacitance Table
Rated Capacitance
(inch/mm) Range
(Vdc) 0.1 1 10 100 1 10 100 1 10 100
AEC-Q200 X7R
ESD 0603/1608 100 1nF - 10nF
(125℃)
Protection


1 1.00 100 X7R 1nF ±10% CL10B102KC84PE#
2 1.00 100 X7R 1.5nF ±10% CL10B152KC84PE#
3 1.00 100 X7R 2.2nF ±10% CL10B222KC84PE#
4 1.00 100 X7R 3.3nF ±10% CL10B332KC84PE#
5 1.00 100 X7R 4.7nF ±10% CL10B472KC84PE#
6 1.00 100 X7R 6.8nF ±10% CL10B682KC84PE#
7 1.00 100 X7R 10nF ±10% CL10B103KC84PE#

Low ESL Capacitors Low ESL
Features
‌MLCCs with low equivalent series inductance (ESL) can be used in circuits with limited mounting area,
as a small quantity of such MLCCs can sufficiently replace high-speed IC MLCCs.
Applications
‌ADAS, Infortainment, In-Vehicle Networking(IVN), Powertrain, Satety System
Reversed Type
BW
T(Thickness)
W(Width)
L(Length)

Code L W T BW
2 0.65+0.05/-0.10 1.15+0.05/-0.10 0.20±0.02 0.20±0.06
L5 0204
4 0.58±0.10 1.10±0.10 0.43±0.10 0.20±0.06
Capacitance Table
Rated Capacitance
(inch/mm) Range
(Vdc) 1 10 100 1 10 100
AEC-Q200 2.5 1uF - 1uF

X7T
Reverse 0204/0510
(125℃) 4 1uF - 1uF
(Low ESL)
Product LineUp (X7T)


1 0.22 2.5 X7T 1uF ±20% CLL5Z105MS21PN#
2 0.53 4 X7T 1uF ±20% CLL5Z105MR41PN#

Application Guide
Inverter BMS LDC OBC
Engine ECU Transmission ECU Headlamp ACU
TPMS ADAS ABS/ESC
Powertrain IVI
LDWS/LKAS
Body Chassis
Radar LiDAR
Autonomous
Parking Assist HUD Night View
Driving
AVN EPS Keyless Entry Digital Cluster

Application Guide
Inverter
Powertrain Main Inverter
A Main Inverter provides energy to the vehicle’s driving motor.
The main inverter directly uses a high voltage battery power through a DC-Link capacitor
and performs improvement of the fuel economy of the vehicle by absorbing energy Motor
through a regenerative braking function.
LV Battery
DC-link HV Battery
Capacitor
LV Power
Supply Isolation
Isolated
User Interface Gate Driver
& MCU M
Communication
Power
Supply IGBT Module
Temperature
Sense & Phase Current / Voltage

Monitor
Resolver / Temperature
* Notice : Each company may have different circuit designs
Crack Mitigation
Normal Mid/High Voltage ESD Strengthen
(ConnectorⅠ/F)
(12V Battery Line,
(All Location) (250V, 630V, 1000V)
Near Hole & Connector)
X7* Normal (Epoxy) X7*, C0G Soft Termination ESD Strengthen

PN Series PN Series *PJ Series PE Series
C0G Normal Fail Safe/Soft Term.

PN Series XPJ Series

Application Guide
Powertrain On Board Charger

An On-Board Charger (OBC) is a built-in system to charge a high voltage battery from
AC power outside the car. OBC allows a vehicle for a standard charge at a charging
station as well as at home.
85V 200V
to to
265Vac 400Vdc
Full‐Bridge Converter
or Half‐Bridge Converter
Isolation Isolated Gate Driver
User Power Supply

Interface & MCU
Communication
LV Battery Current / Voltage

LV Power Sense &
Supply Monitor
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
Powertrain Battery Management System

A Battery Management System (BMS) is the control system that manages a high voltage
battery built with numerous cells, monitoring and controlling temperatures and voltage
of the each cell.
HV
Battery (+)
Cell HV
Module Battery (+)(-)
Cell HV
Module Sensing
Volt.
Isolator
Cell Balancing CAN User
MCU MCU
& Fault Interface &
Temp. (Slave#1) (Master)
Monitoring Communication
LV Battery
LV Power
LDO
Isolation Supply
Cell Module Control Unit

HV
Battery (-)
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
Powertrain DC-DC Converter (High Voltage to 12V)

A DC-DC Converter converts a high voltage battery into a 12V battery.
As there is no engine using fossil fuels, the DC-DC Converter plays a role in charging
a 12V battery as an alternator used the engine to charge a 12V battery.
VBus Isolation
ISense
HV Battery LV Battery
Isolated
Gate Driver
Gate Driver
Power Supply
LV Power
Supply
MCU
Temperature
User
Sense &
Current / Bus Voltage Interface &
Monitor
Communication
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
ECU
Powertrain Engine Control Unit
An Engine Control Unit (ECU) is a type of electronic control unit that provides the power
with a series of actuators on an engine.
It is becoming increasingly significant to reduce gas emission and improve fuel efficiency
by the stricter global environmental regulation. Regarding the situation, ECU collects
Engine
data from various sensors on an engine, controlling its components in the unit.
LV Battery HV Power
Supply Injector
Solenoid
high & low Switch

LV Power
Low Voltage
Supply
FPCV
Solenoid
high & low Switch

· Throttle Position
· Fuel Pressure
· Intake air Volume Sensor SBC
Gate
Interface & &
· Air Temperature Driver
Communication MCU
· Oil Temperature E-CVVT
· Cooling Water Temp. Motor
Full‐Bridge Switch
Crack Mitigation
Normal High Temperature ESD Strengthen
(ConnectorⅠ/F)
(12V Battery Line,
(All Location) (near Power Semiconductor)
X7* Normal (Epoxy) Soft Termination X8* Normal ESD Strengthen

PN Series *PJ Series PN Series PE Series


Application Guide
Powertrain Transmission Control Unit

A transmission is an automatic device that transmits output torque from a crank shaft
on an engine to wheels. TCU controls determines the ratio of a transmission, controlling TCU
its unit to transmit the ratio. As TCU is getting closer to the transmission to reduce price Transmission
and weight for the transmission system, an operating temperature of TCU is getting
increasing.
LV Battery Safety Driver

& high‐side
Switch
Solenoid
Solenoid
System Gate Solenoid
Basic Chip Driver low‐side
Switch
Solenoid
· Brake
· Shift lever position
Sensor · Clutch
· Input Speed · DRP Position
Interface & MCU
· Output Speed Communication
· Oil temperature
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
Chassis Airbag Control Unit

An Airbag Control Unit (ACU) determines whether to run restraint systems according to
the level of an accident being detected by an Airbag Control Unit. Acceleration sensor
and speed sensor are embedded in an airbag system.
+ ER
LV Battery Squib
Squib
Driver
- Cap.
System
Basic Chip
Acceleration
· Crash Sensor (Front, Side) Sensor
Sense &
· Passenger Detection Interface & MCU Roll Over
Monitor
· Vehicle Network (CAN) Communication
Crack Mitigation
Normal ESD Strengthen
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)
X7* Normal (Epoxy) Soft Termination ESD Strengthen

PN Series *PJ Series PE Series


Application Guide
Chassis Brake Actuation Unit

A Brake Actuation Unit is an integrated control system including functions of an
integrated active hydraulic booster and Electronic Stability Control (ESC). BAU provides
hydraulic pressure to brake calipers to control braking force on the vehicle.
Pump
LV Battery Pump Driver
& Switch M
MCU
LV Power System Safety Driver
Supply Basic Chip & high‐side
Switch
Low Voltage Solenoid

· Oil Pressure
· Wheel speed Solenoid Solenoid
· Brake pedal Sensor Driver
· Yaw rate Interface & MCU &
Communication low‐side
· Brake‐light control
Switch
· ‌Engine/Transmission
torque request
Solenoid
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
Chassis Electric Power Steering

Motor
An Electric Power Steering (EPS) helps drivers turn a steering wheel of a vehicle via an
electric motor. EPS gives an opportunity to augment the quality of driving to the driver, ECU
making it easier for the driver to put less efforts to turn the steering wheel.
LV Battery
LV Power
Low Voltage
Supply
User Gate Driver

Interface & SBC & MCU M
Communication
3‐phase Inverter
Phase Current / Voltage

Torque Sense &
Sensor Monitor Resolver
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
Body LED Light Module with AFLS

A number of drivers favor a vehicle with head and rear ramps using LED that provides
power efficiency, long lifespan and a various designs available. AFLS is an adaptive front
lighting system to modulate the angles of the beam according to the driving direction of
a vehicle.
LV Battery
AFLS
LV Power left & right

Supply Stepper up &
Motor Driver down M M
&
Current Limit
Low Voltage MCU
User
Interface &
Communication LV Batt
High Beam Position Light
Head
LED Driver Low Beam Turn Light
LED Lamp
LV Batt DRL Fog Light
Cooling Fan
Driver
Fan LV Batt
Tail Light Reverse Light
Rear
LED Driver
Lamp
Stop Light Turn Light
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,



Application Guide
Body Heating, Ventilation, Air Conditioning

A Heating & Ventilation, Air Conditioning (HVAC) system provides indoor environmental
comfort of a vehicle: thermal comfort and high indoor air quality. For this, a heater, a
fan and an air-conditioning compressor are operated after the HVAC system analyzes
temperatures inside the vehicle. Actuators are used to control the direction of the fan
and the air flow.
Seat Ventilation Fan

LV Battery Seat Heater
Blower Fan
Electronic Control Valve
(for Aircon Compressor)
High-side Switch
LV Power
Low Voltage
Supply
Seat Heater
PTC Heater
Low‐side Switch
· ‌User Command
(Button)
Sensor
· Indoor Temp. SBC & Gate
Interface &
MCU Driver
· Outdoor Temp. Communication
· Seat Temp. Actuator Motor
Touch Switch
Full‐Bridge Switch
& LED Display
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
Body Smart key Control System & TPMS

A Smart Key Control System offers automatic driver recognition, a door lock and unlock
function and an engine starter function. Basic functions and optional functions are
available depending on a type of vehicles.
Body Control Unit Key Key Fob
Battery
LV Battery HV/LV Power
3.3V
Cell Supply Rx (RF) SAW
Tx (RF)
*434 MHz Filter
· Ignition Start Low Voltage MCU
· Door Lock/Unlock
Tx (LF)
User Rx (LF)
· Trunk Open/Close
Interface & MCU
· Light on/off Communication
Immobilizer
· Warning Buzzer TPMS Sensor Module
*‌Antenna
· Burglarproof Device *125 KHz
Inner
Driver Battery
Passenger
Door Knob Sensor 3.3V
Trunk
Tx (RF)
Tail
MCU
(ADC/ROM)
Rx (LF)
*Sensor
Pressure/Temp.
/Acceleration
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
IVI Head Unit (for AVN)

A Head Unit is a main control system of AVN (Audio, Video, Navigation). It provides
unified hardware interface for devices such as a camera, microphone and an antenna to
turn on a video and a stereo system according to user command.
LV Battery
LV Power
LDO & Switch Low Voltage
Supply
Memory
(Flash & RAM)
· Camera (Rear)
· Microphone (for Hands‐Free)
Transceiver
· Bluetooth
· Integrated Antenna (GPS/DMB)
· Radio Monitor (Touch)
· Control Button (Volume) Multimedia
Core
Audio Amplifier (to Speaker)
Mobile
Integrated Antenna (LTE) Communication
(2G, 3G, 4G)
Memory
Control Button
(Flash & RAM)
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
IVI Telematics Control Unit

A Telematics Control Unit realizes a wireless network to provide an infotainment service
such as route guidance using location information, traffic information, emergency
recovery, the Internet, movies, games and so on, which is intended for drivers' safety
and convenience.
LV Battery LV Power
Low Voltage
Supply
Audio Codec Microphone
Audio Amp. Speaker
WiFi/BT
User GNSS
Interface & AP
Communication
RF IC
FEM
(LTE/3G)
Modem
Baseband 5G C‐V2X
Processor
RF transceiver
Memory
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
IVI Head Up Display

A Head Up Display (HUD) is a transparent display that presents data on driving with an
image on a wind shield or a combiner from drivers viewpoint.
LV Battery LV Power
Low Voltage
Supply
Wind Shield or Combiner

LED LED
Driver Backlight
Graphic LCD Panel

Controller Module
RGB/LVDS
M
Mirror
User
Motor Driver
Interface & MCU
(Stepper)
Communication
Motor Driver
(DC)
M
Open/Close
Operation
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
ADAS Smart Cruise Control (Radar)

Smart Cruise Control (SCC) is a driver-friendly system to automatically adjust a vehicle
speed and to maintain a safe distance from vehicles ahead by radar.
LV Battery LV Power
Low Voltage
Supply
User Tx#1~2
Wave form 76/77 GHz
Interface & MCU
generator Transmitter
Communication
Rx#1~4
ADC 76/77 GHz
#1 Receiver#1
Rx#5~8
ADC 76/77 GHz
#2 Receiver#2
Targets
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
ADAS Light Detection And Ranging

A LiDAR system creates 2D&3D images by measuring a distance with laser beam. LIDAR
is considerable regarded as a significant technology to achieve complete autonomous
driving.
LV Battery high‐side
PTC Heater
Switch
for Beam steering

LV Power Motor Emitting
Supply Driver
M
MCU
Mirror
Low Voltage
Reflection
LV Batt
Light Source
User
(Laser Diode → Collimating Lens)
Interface & SoC
Communication
LV Batt
Light Detector
(AMP ← APD array ← Condenser Lens)
Targets
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
ADAS Night Vision System

A Night Vision System is intended to take greater care of driver's view at night by proving
reliable visual information. It enables drivers to increase their perception and seeing
distance in darkness, which is beyond the reach of the vehicle's headlights. The Night
Vision System uses an infrared camera using thermography or infrared reflective light for
awareness of surroundings where human drivers hardly notice them in darkness.
LV Battery LV Power
Low Voltage
Supply
IR
Image
Infrared
FPGA GMSL Signal Display
Sensor
Processing * Cluster
* HUD
* Microbolometer
Targets
* SDRAM
Shutter
Memory * FLASH
Driver
* EEPROM
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Application Guide
ADAS Autonomous Control Unit

An autonomous vehicle is no longer to need driver's effort during driving safely, known
as "Autonomous" or a "Driverless car", where the driver is able to leave all responsibility
to operate systems. Autonomous unit analyzes big data on sensor, operating functions
to search routes, control and drive the vehicle.
LV Battery
PMIC/VR/LDO Low Voltage
Deserializer Camera
Display GMSL/LVDS
LPDDR
GDDR
GPU SoC NAND
FLASH
Audio Codec AMP Audio
FLASH
Ethernet
GPS Ant. ADR MCU
Switch
Flexray/CAN/LIN/UART Ethernet
Radar/LiDAR/*ACC
Crack Mitigation
(ConnectorⅠ/F)
(12V Battery Line,
(All Location)



Reliability Test Conditions

No. Item Performance Test condition
1 Pre-and Post-Stress Electrical Test -
Appearance No abnormal exterior appearance
Capacitance ClassⅠ Within±2.5% or ±0.25pF, (Whichever is larger)
Change ClassⅡ Within±10% Unpowered, 1000hrs@T = Max Temp.
Capacitance ≥
‌ 30pF : Q ≥ 1,000
ClassＩ
Initial Measurement
Q < 30pF : Q ≥ 400 + 20 × C Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
High (C : Capacitance) and leave the capacitor in ambient condition for 24±2 hours
2 Temper-ature Rated Voltage ≥ 250V : 0.050 max before measurement. Then perform the measurement.
Exposure
ClassⅡ
≥ 25V : 0.030 max
Tanδ Final Measurement
≥ 16V : 0.050 max
≤ 10V : 0.075 max (X8L : 0.050 max) *1) Leave the capacitor in ambient condition for 24±2 hours
before measurement. Then perform the measurement.
Rated Voltage ≥ 250V : More than 10,000㏁ or 100㏁ × ㎌
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌
(Whichever is smaller) *1)
Appearance No abnormal exterior appearance 1000Cycles
Capacitance ClassⅠ
Within±2.5% or ±0.25pF, Initial Measurement
(Whichever is larger) Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
ClassⅡ
Change
Within±10% and leave the capacitor in ambient condition for 24±2 hours
Capacitance ≥
‌ 30pF : Q ≥ 1,000 before measurement. Then perform the measurement.
Q ClassⅠ < 30pF : Q ≥ 400 + 20 × C
Final Measurement
(C : Capacitance)
Temper-ature Leave the capacitor in ambient condition for 24±2 hours
3 Rated Voltage ≥ 250V : 0.050 max before measurement. Then perform the measurement.
Cycling
ClassⅡ
≥ 25V : 0.030 max
Tanδ Step Temperature (℃) Time (min.)
≥ 16V : 0.050 max
Min. operating
≤ 10V : 0.075 max (X8L : 0.050 max) *1) 1 30±3
Temp.+0/-3
2 25±2 1
Rated Voltage ≥ 250V : More than 10,000㏁ or 100㏁ × ㎌ Max. operating
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌ 3 30±3
Temp.+3/-0
4 25±2 1
4 Destructive Physical Analysis No defects or abnormalities Per EIA 469

Change ClassⅡ Within±12.5%
1000hrs 85℃/85%RH, Rated voltage and 1.3 ~ 1.5V,
Capacitance ≥ ‌ 30pF : Q ≥ 200 (add 100kohm resistor)
Q ClassⅠ < 30pF : Q ≥ 100 + (10/3) × C
(C : Capacitance) Initial Measurement
Rated Voltage ≥ 250V : 0.050 max Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
Biased ≥ 25V : 0.030 max and leave the capacitor in ambient condition for 24±2 hours
5
Humidity before measurement. Then perform the measurement.
ClassⅡ
≥ 16V : 0.050 max
Tanδ
≤ 10V : 0.075 max *1) Final Measurement
(*X8L - ≥ 35V : 0.035 max Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
≥ 10V : 0.050 max) and leave the capacitor in ambient condition for 24±2 hours
Rated Voltage ≥ 250V : More than 10,000㏁ or 10㏁ × ㎌ before measurement. Then perform the measurement.
≤ 200V : More than 500㏁ or 25㏁ × ㎌
IR
(*X8L/X8G : More than 1,000㏁ or 10㏁ × ㎌)
Change ClassⅡ Within±12.5%
Capacitance ≥ 30pF : Q≥ 350 1000hrs @ TA = Max temp., Rated Voltage *2)
ClassⅠ
≥ 10pF : Q≥ 275 + (5 / 2) × C Initial Measurement
Q
＜ 10pF : Q≥ 200 + 10 × C Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
High (C : Capacitance) and leave the capacitor in ambient condition for 24±2 hours
6 Temper-ature Rated Voltage ≥ 250V : 0.050 max before measurement. Then perform the measurement.
Operating Life ≥ 25V : 0.030 max
ClassⅡ
≥ 16V : 0.050 max Final Measurement
Tanδ Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
≤ 10V : 0.075 max *1)
(*X8L - ≥ 35V : 0.035 max and leave the capacitor in ambient condition for 24±2 hours
≥ 10V : 0.050 max) before measurement. Then perform the measurement.
IR ≤ 200V : More than 1,000㏁ or 50㏁ × ㎌
※ ‌*1) : Indicates typical specification. Please refer to individual specifications.

*2) : Some of the parts are applicable in rated voltage × 150% or × 120%, Please refer to individual specifications.


7 External Visual No abnormal exterior appearance Microscope (×10)
8 Physical Dimensions Within the specified dimensions Using the calipers
Three shocks in each direction should be applied along
3 mutually perpendicular axes of the test specimen (18 shocks)
Change ClassⅡ Within±10%
Peak value Duration Wave Velocity
Capacitance ≥
‌ 30pF : Q ≥ 1,000
ClassＩ
1,500G 0.5ms Half sine 4.7m / sec
Q < 30pF : Q ≥ 400 + 20 × C
Mechanical (C : Capacitance) Initial Measurement
9
Shock Rated Voltage ≥ 250V : 0.050 max Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
ClassⅡ
≥ 25V : 0.030 max and leave the capacitor in ambient condition for 24±2 hours
Tanδ
≥ 16V : 0.050 max before measurement. Then perform the measurement.
≤ 10V : 0.075 max (X8L : 0.035 max) *1)
Final Measurement
Rated Voltage ≥ 250V : More than 10,000㏁ or 100㏁ × ㎌ Leave the capacitor in ambient condition for 24±2 hours
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌ before measurement. Then perform the measurement.
Capacitance ClassⅠ Within±2.5% or ±0.25pF, (Whichever is larger) 5g's for 20min., 12cycles each of 3 orientations,
Change ClassⅡ Within±10% Use 8”× 5” PCB 0.031” Thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts mounted
Capacitance ≥
‌ 30pF : Q ≥ 1,000 within 2” from any secure point. Test from 10~2000Hz.
Q ClassⅠ < 30pF : Q ≥ 400 + 20 × C
(C : Capacitance) Initial Measurement
10 Vibration Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
Rated Voltage ≥ 250V : 0.050 max
and leave the capacitor in ambient condition for 24±2 hours
ClassⅡ
≥ 25V : 0.030 max
Tanδ before measurement. Then perform the measurement.
≥ 16V : 0.050 max
≤ 10V : 0.075 max (X8L : 0.035 max) *1) Final Measurement
Rated Voltage ≥ 250V : More than 10,000㏁ or 100㏁ × ㎌ Leave the capacitor in ambient condition for 24±2 hours
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌ before measurement. Then perform the measurement.
Change ClassⅡ Within±10% Solder pot : 260±5℃, 10±1sec.
Capacitance ≥
‌ 30pF : Q ≥ 1,000
ClassＩ
Initial Measurement
Q < 30pF : Q ≥ 400 + 20 × C Perform the heat treatment at 150℃ +0/-10℃ for 1 hour
Resistance to (C : Capacitance) and leave the capacitor in ambient condition for 24±2 hours
11
Solder Heat Rated Voltage ≥ 250V : 0.050 max before measurement. Then perform the measurement.
ClassⅡ
≥ 25V : 0.025 max
Tanδ Final Measurement
≥ 16V : 0.035 max
≤ 10V : 0.050 max (X8L : 0.035 max) *1) Leave the capacitor in ambient condition for 24±2 hours
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌
Change ClassⅡ Within±10% AEC - Q200 - 002
Capacitance ≥
‌ 30pF : Q ≥ 1,000 Initial Measurement
Q ClassⅠ < 30pF : Q ≥ 400 + 20 × C Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour
(C : Capacitance) and leave the capacitor in ambient condition for 24±2 hours
12 ESD before measurement. Then perform the measurement.
ClassⅡ
≥ 25V : 0.025 max Final Measurement
Tanδ
≥ 16V : 0.035 max Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour
≤ 10V : 0.050 max (X8L : 0.035 max) *1) and leave the capacitor in ambient condition for 24±2 hours
Rated Voltage ≥ 250V : More than 10,000㏁ or 100㏁ × ㎌ before measurement. Then perform the measurement.
IR ≤ 200V : More than 10,000㏁ or 500㏁ × ㎌
a) Preheat at 155℃ for 4 hrs, Immerse in solder for 5s at 245±5℃
95% of the terminations is to be soldered b) Steam aging for 8 hrs, Immerse in solder for 5s at 245±5℃
13 Solderability
evenly and continuously c) S
team aging for 8 hrs, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
※ *1) : Indicates typical specification. Please refer to individual specifications.


Capacitance Within specified tolerance
Capacitance ‌≥ 30pF : Q ≥ 1,000
Q ClassⅠ < 30pF : Q ≥ 400 + 20 × C
(C : Capacitance) The Capacitance / D.F. should be measured at 25℃.
Tanδ ClassⅡ ≥ 16V : 0.035 max Class Capacitance Frequency Voltage
≤ 10V : 0.050 max (X8L : 0.035 max) *1)
Ⅰ
≤1,000㎊ 1㎒±10% 0.5 ~ 5.0Vrms
ClassⅠ
More than 100,000㏁ or 1,000㏁ × ㎌＞1,000㎊
Electrical 1㎑±10% 1.0±0.2Vrms
Ⅱ
(Whichever is smaller) ≤10㎌
14 Characteri- IR
＞10㎌ 120㎐±20% 0.5±0.1Vrms
ClassⅡ
zation @25℃ More than 10,000㏁ or 500㏁ × ㎌
(Whichever is smaller) I.R. should be measured with a DC voltage not exceeding
Rated Voltage @25℃, @125℃ for 60 ~ 120 sec.
ClassⅠ
More than 10,000㏁ or 100㏁ × ㎌
IR (Whichever is smaller) Dielectric Strength : 250% of the rated voltage for 1 ~ 5 seconds
@Max More than 1,000㏁ or 10㏁ × ㎌ The charge / discharge current is less than 50mA.
temp. ClassⅡ (*X8L: More than 1,000㏁ or 10㏁ × ㎌)
(Whichever is smaller)
Dielectric Strength No dielectric breakdown or mechanica breakdown
Appearance No abnormal exterior appearance Bending to the limit for 60 seconds.
Limit : Class
‌ Ⅰ- 3mm
ClassⅠ ClassⅡ- 3mm *1)
Within±5.0% or ±0.5pF,
(Whichever is larger)
(Substrate for board flex test)
Ф 4.5
40mm c
100mm 1.6mm
[unit : mm]
Code (inch) Dimension (mm) a b c
15 Board Flex Capacitance 03 (0201) 0.6 × 0.3 0.3 0.9 0.3
ClassⅡ Within±10%
Change 05 (0402) 1.0 × 0.5 0.5 1.5 0.6
10 (0603) 1.6 × 0.8 0.6 2.2 0.9
21 (0805) 2.0 × 1.25 0.8 3.0 1.3
31 (1206) 3.2 × 1.6 2.0 4.4 1.7
32 (1210) 3.2 × 2.5 2.0 4.4 2.6
Material: Glass epoxy substrate

Thickness: T=1.6㎜, *03(0201), 05(0402) T=0.8㎜
Initial Measurement
Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour
and leave the capacitor in ambient condition for 24±2 hours
Final Measurement
Leave the capacitor in ambient condition for 24±2 hours
Appearance No abnormal exterior appearance 18N, for 60±1 sec.
* 0603(1608) _ 10N, 0402(1005), 0201(0603) _ 2N
ClassⅠ
Within±2.5% or ±0.25pF,
(Whichever is larger) Initial Measurement
Terminal Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour
16 Strength Capacitance and leave the capacitor in ambient condition for 24±2 hours
(SMD) before measurement. Then perform the measurement.
ClassⅡ Within±10%
Change
Final Measurement
Leave the capacitor in ambient condition for 24±2 hours
※ *1) : Indicates typical specification. Please refer to individual specifications.


Destruction value should be exceed
Chip Length ≤ 2.5mm
a) Chip Thickness > 0.5mm : 20N Beam speed
b) Chip Thickness = 0.5mm : 8N Chip Length ≤ 2.5mm, 20N, 8N, 0.50±0.05mm / sec.
17 Beam Load c) Chip Thickness = 0.3mm : 5N Chip Length ≤ 2.5mm, 5N, 0.10±0.01mm / sec.
Chip Length ≥ 3.2mm Chip Length ≥ 3.5mm, 2.50±0.25mm / sec.
a) Chip Thickness ≥ 1.25mm : 54.5N
b) Chip Thickness < 1.25mm : 15N
ClassⅠ 0±30ppm / ℃ Capacitance shall be measured by the steps shown in the
following table.
Step Temperature (℃)

1 25±2
2 Min. operating temp.±2
3 25±2
4 Max. operating temp.±2
5 25±2
Capacitance X*R : ±15% ■ ClassⅠ

Tempera-ture Capacitance X*S : ±22% Temperature Coefficient shall be calculated from the formula as
Change ClassⅡ
18
Character- X*T : +22/-33% below
istics X*L : +15/-40% Temp. Coefficient = C2 - C1 ×106[ppm /℃]
X*M : +15/-50% C1×△T
C1 : Capacitance at step 3 C2 : Capacitance at step 4
△T : Temp. at step 4 - Temp. at step 3
■ ClassⅡ
Capacitance change shall be calculated from the formula as
below
△C = C2 - C1 ×100 (%)
C1
C1 : Capacitance at step 3 C2 : Capacitance at step 2 or step 4
※ ‌*1) : Indicates typical specification. Please refer to individual specifications.

If you want more detaiedl imformation, Please Visit Samsung Electro - mechanics website (www.semlcr.com)

Packaging Specifications
Packaging
This specification applies to taping of MLCC.
When customers require, the specification may be changed under the agreement.
1 Figure
Cover (Top) tape
Carrier tape
Reel
Empty section
Empty section 200mm Chip mounting section Minimum 280mm Leading section 240mm
End Start
Unreeling
* The chip is only use for identifying the label and packaged products. Please don't use the chip.
2 Quantity
(Unit : pcs)
Size Code Chip Thickness Pitch Plastic Plastic Plastic

Type Taping Type
(inch/mm) (mm) (mm) 7 inches reel 10 inches reel 13 inches reel
0201/0603 0.3 PAPER 2 10K - 50K
0402/1005 0.5 PAPER 2 10K - 50K
0603/1608 0.8 PAPER 4 4K 10K 15K/10K
T ≤ 0.85 PAPER 4 4K 10K 15K/10K
0805/2012
MLCC T ≥ 1.0 EMBOSSED 4 2K 6K 10K
T ≤ 0.85 PAPER 4 4K 10K 10K
1206/3216
T ≥ 1.0 EMBOSSED 4 2K 4K 10K
T ≤ 1.6 EMBOSSED 4 2K 4K 10K
1210/3225
T ≥ 2.0 EMBOSSED 4 1K 4K 4K

3 Tape Size
Ｉ. Cardboard(Paper) tape : 4mm pitch
Feeding Hole
Chip inserting Hole
D
A
F
W
B
t P0 P2 P1
(Unit : mm)
Size Code
A B W F E P1 P2 P0 D t
(inch/mm)
0603/ 1.00 1.90
1608 ±0.05 ±0.05
0805/ 1.60 2.40 8.00 3.50 1.75 4.00 2.00 4.00 φ1.50 1.1
2012 ±0.20 ±0.20 ±0.30 ±0.05 ±0.10 ±0.10 ±0.05 ±0.10 +0.10/-0 Below
1206/ 2.00 3.60
3216 ±0.20 ±0.20
※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.
Ⅱ. Cardboard(Paper) tape : 2mm pitch

Feeding Hole
Chip inserting Hole D
A
F
W
B
t P0 P2 P1
(Unit : mm)
Size Code
A B W F E P1 P2 P0 D t
(inch/mm)
01005/ 0.26 0.46 0.25
0402 ±0.03 ±0.03 ±0.02
0201/ 0.38 0.68 0.35
0603 ±0.03 ±0.03 φ1.50 ±0.03
8.00 3.50 1.75 2.00 2.00 4.00
0402/ 0.62 1.12 +0.1 0.60
±0.30 ±0.05 ±0.10 ±0.05 ±0.05 ±0.10
1005 ±0.05 ±0.05 /-0.03 ±0.05
0.62 1.12
0204/ 0.37
0.05 0.05
0510 ±0.03
/-0.10 /-0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.

Ⅲ. Embossed (Plastic) tape
(1) Embossed (Plastic) tape (P1: 4mm pitch ) (2) Embossed (Plastic) tape (P1: 1mm/ 2mm pitch )
Feeding Hole Chip inserting Hole Feeding Hole Chip inserting Hole
D D
E E
A A
F F
t1 W t1 B W
B
t0 P0 P2 P1 t0 P0 P2 P1
(Unit : mm)
Size
A B W F E P1 P2 P0 D t1 t0
(inch/mm)
01005/ 0.23 0.45 4.00 1.80 0.90 1.00 1.00 2.00 φ0.80
0402 ±0.02 ±0.02 ±0.05 ±0.02 ±0.05 ±0.02 ±0.02 ±0.03 ±0.04 0.35 0.50
015008/ 0.32 0.58 2.00 φ1.50 Below Below
05025 ±0.03 ±0.03 ±0.05 0.1/-0.03
0603/ 1.05 1.90
1608 ±0.15 ±0.15
0805/ 1.45 2.30 8.00 3.50 1.75 2.00 4.00
2012 ±0.20 ±0.20 ±0.30 ±0.05 ±0.10 4.00 ±0.05 ±0.10 φ1.50 2.92 0.60
1206/ 1.90 3.50 ±0.10 0.1/-0 Below Below
3216 ±0.20 ±0.20
1210/ 2.90 3.70
3225 ±0.20 ±0.20
Ⅳ.
‌ Reel Size
E
C
C B
D
t
A W
(Unit : mm)
Symbol Tape Width A B C D E W t

4mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 5±0.5 1.2±0.2
7”Reel 8mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.9±0.2
12mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 13±0.5 1.2±0.2
10”Reel 8mm φ258±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2
8mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2
13”Reel
12mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 13±0.5 2.2±0.2

4 Cover tape peel-off force
Ｉ. ‌P
eel-off force
10 g.f ≤ peel-off force ≤ 70 g.f
Ⅱ.
‌ Measurement Method
Cover tape’s pulling strength
300mm/min
Cover tape 165~180°
Carrier tape
Bottom tape
Unreeling direction
‌Taping Packaging design : Packaging design follows IEC 60286-3 standard.

(IEC 60286-3 Packaging of components for automatic handling - parts 3)
* If the static electricity of SMT process causes any problems, please contact us.
5 BOX package
Ｉ. Packaging Label
REEL & Box Type
Label includes the information as below.
1) Chip size
1) 2) 3) 2) Temperature Characteristics
3) Nominal Capacitance
4) 4) Model Name
5) LOT Number & Reel Number
5) 6) 6) Q’ty
Ⅱ. Box Packaging
1) Double packaging with the paper type of inner box and outer box.
2) Avoid any damages during transportation by car, airplane and ship.
3) Remark information of contents on inner box and outer box
※ If special packaging is required, please contact us.

Ⅲ. 7" Box packaging
(Unit : mm)
Inner Box (7" × 5 REEL ) Inner Box (7" × 10 REEL )
30±1.0 30±1.0
185±1.0 185±1.0
66±1.0 122±1.0
182±1.0 183±1.0
Outer Box (7" × 20 REEL) Outer Box (7" × 60 REEL)
195±5.0 192±5.0
187±5.0 376±5.0
285±5.0 376±5.0
Ⅳ. 13” Box packaging
Inner Box (13" × 4 REEL ) Outher Box (13" × 20 REEL )
30±1.0
336±1.0
340±5.0
336±5.0
66±1.0
330±1.0
339±5.0

Caution/Notice
Product Characteristic data
1 Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change. Due to the fact that the capacitance
may be subject to change with the measured voltage and frequency, it is highly recommended to measure the capacitance based
on the following conditions.
Ｉ. ‌Measure capacitance with voltage and frequency specified in this document.

Regarding the voltage/frequency condition for capacitance measurement of each MLCC model, please make sure to follow a
section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance range.
[The voltage and frequency condition according to MLCC the capacitance range]
ClassⅠ ClassⅡ
Capacitance Frequency Voltage Capacitance Frequency Voltage

≤1,000㎊ 1㎒±10% ≤10㎌ 1㎑±10% 1.0±0.2Vrms
0.5~5Vrms >10㎌ 120㎐±20% 0.5±0.1Vrms
>1,000㎊ 1㎑±10% Exception 1㎑±10% 0.5±0.1Vrms
※ ‌Capacitance shall be measured after the heat treatment of 150+0/

-10℃ for 1hr, leaving at room temperature for 24±2hr. (ClassⅡ)
Ⅱ. ‌It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of measurement equipment can
be lower than the setting voltage due to the equipment limitation. Note that when capacitance or measurement frequency
is excessively high, the measurement equipment may show ALC off warning and provide a lower output voltage than the
setting voltage even with ALC option selected. It is necessary to ensure the output voltage of measurement equipment is the
same as the setting voltage before measuring capacitance.
Ⅲ. ‌Capacitance value of high dielectric constant (ClassⅡ) MLCC changes with applied AC and DC voltage. Therefore, it is
necessary to take into account MLCC’s AC voltage characteristics and DC-bias voltage characteristics when applying MLCC to
the actual circuit.
Ⅳ. ‌T
he capacitance is in compliance with the EIA RS-198-1-F-2002.
2 Tan δ (DF)
Ｉ. ‌An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of electrode. DF (Dissipation Factor)
is defined as the ratio of loss energy to stored energy and typically being calculated as percentage.
Ⅱ. ‌Quality factor (Q factor) is defined as the ratio of stored energy to loss energy. The equation can be described as 1/DF.
Normally the loss characteristic of Class I MLCC is presented in Q, since the DF value is so small whereas the loss characteristic
of ClassⅡ MLCC is presented in DF.
Ⅲ. ‌It is recommended to use ClassⅠ MLCC for applications to require good linearity and low loss such as coupling circuit, filter
circuit and time constant circuit.

Caution/Notice
3 Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
‌ hen applying DC voltage to MLCC, a charging current and a leakage current flow together at the initial stage of
Ｉ. W
measurement. While the charging current decreases, and insulation resistance (IR) in MLCC is saturated by time. Therefore,
insulation resistance shall be measured 1 minute after applying the rated voltage.
4 Capacitance Aging
The aging characteristic is that the high dielectric (ClassⅡ) MLCC decreases capacitance value over time. It is also necessary to
consider the aging characteristic with voltage and temperature characteristics when Class II MLCC is used in circuitry.
Ｉ. I‌n general, aging causes capacitance to decrease linearly with the log of time as shown in the following graph. Please check
with SEMCO for more details, since the value may vary between different models.
‌ fter heat treatment (150 °C, 1hour), the capacitance decreased by aging is recovered, so aging should be considered again
Ⅱ. A
from the time of heat treatment.
C0G
X7R
X5R
Capacitance Change(%)
1 10 100 1,000 10,000 100,000
Time(h)
* Sample : C0G, X7R, X5R
[Example of Capacitance Aging]

Caution/Notice
5 Temperature Characteristics of Capacitance (TCC)
Please consider temperature characteristics of capacitance since the electrical characteristics such as capacitance changes which
is caused by a change in ceramic dielectric constant by temperature.
Ｉ. ‌It is necessary to check the values specified in section “C. Reliability test Condition–Temperature Characteristics” for the
temperature and capacitance change range of MLCC.
20 20
0 0
-20 -20
ΔC(%)
ΔC(%)
-40 -40
-60 -60
DC Voltage = 3.15Vdc
-80 -80
-100 -100
-55 -35 -15 5 25 45 65 85 105 125 -55 -35 -15 5 25 45 65 85 105 125
Temperature(℃) Temperature(℃)
* Sample : 10uF, Rated voltage 6.3V * Sample : 10uF, Rated voltage 6.3V
[Example of Temperature Characteristics (X7R)] [Example of Bias TCC]
Ⅱ. ‌When selecting MLCC, it is necessary to consider the heat characteristics of a system, room temperature and TCC of MLCC,
since the applied temperature may change the capacitance of MLCC.
Ⅲ. ‌In addition, Bias TCC of MLCC should be taken into account when DC voltage is applied to MLCC.
6 Self-heating Temperature
It is necessary to design the system, with considering self-heating generated by the ESR (Equivalent Series Resistance) of MLCC
when AC voltage or pulse voltage is applied to MLCC.
Ｉ. ‌When MLCC is used in an AC voltage or pulse voltage

circuit, self-heating is generated when AC or pulse current 100
flows through MLCC. Short-circuit may be occurred by the
degradation of MLCC’s insulating properties.
Ⅱ. ‌The reliability of MLCC may be affected by MLCC being used

ΔT(degC)
in an AC voltage or pulse voltage circuit, even the AC voltage 10

or the pulse voltage is within the range of rated voltage.
10㎑
Therefore, make sure to check the following conditions. 100㎑
1) ‌The surface temperature of MLCC must stay within 500㎑
the maximum operating temperature after AC or Pulse 1000㎑

1
voltage is applied.
0 1 2 3 4 5
2) ‌The rise in increase by self-heating of MLCC must not
exceed 20℃ Ripple Current(Arms)
(Applicable to Rated Voltage of less than 100Vdc) * Sample : X7R 1uF, Rated voltage 50V
[Example of Ripple current]

Caution/Notice
7 DC & AC Voltage Characteristics
It is required to consider voltage characteristics in the circuit since the capacitance value of high dielectric constant MLCC(ClassⅡ)
is changed by applied DC & AC voltage.
Ｉ. ‌Please ensure the capacitance change is within the allowed operating range of a system. In particular, when high dielectric
constant type MLCC (ClassⅡ) is used in circuit with narrow allowed capacitance tolerance, a system should be designed with
considering DC voltage, temperature characteristics and aging characteristics of MLCC.
Ⅱ. I‌t is necessary to consider the AC voltage characteristics of MLCC and the AC voltage of a system, since the capacitance value
of high dielectric constant type MLCC (ClassⅡ) varies with the applied AC voltage.
20 40
30
0
20
-20
10
ΔC(%)
ΔC(%)
-40 0
-10
-60
-20
-80
-30
-100 -40
0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5
DC Voltage(V) AC Voltage(Vrms)
* Sample : X7R 10uF, Rated voltage 6.3V * Sample : X7R 10uF, Rated voltage 6.3V
[ Example of DC Bias characteristics ] [Example of AC voltage characteristics]

Caution/Notice
8 Impedance Characteristic
Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a current (I) when a voltage (V) is
applied. It is defined as the ratio of the voltage to the current (Z=V/I). Impedance extends the concept of resistance to AC circuits
and is a complex number consisting of the real part of resistance (R) and the imaginary part of reactance (X) as Z=R+jX.
Therefore, it is required to design circuit with consideration of the impedance characteristics of MLCC based on the frequency
( Z=R+jX )
‌ LCC operates as a capacitor in the low frequency and its reactance (XC) decreases as frequency increases ( X_C=1/j2πfC )
Ｉ. M
where f is frequency and C is capacitance. The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency
mainly comes from the loss of its dielectric material.
‌ LCC operates as an inductor in the high frequency and the inductance of MLCC is called ESL (Equivalent Series Inductance).
Ⅱ. M
The reactance (XL) of MLCC in the high frequency increases as frequency increases (X_L=j2πf·ESL). The resistance (ESR) of
MLCC in the high frequency mainly comes from the loss of its electrode metal.
Ⅲ. ‌SRF (Self Resonant Frequency) of MLCC is the frequency Impedance IZI, ESR
where its capacitive reactance (XC) and inductive 1000
reactance (XL) cancel each other and the impedance of (Capacitor region) (Inductor region)
MLCC has only ESR at SRF. 100
SRF
Ⅳ. ‌The impedance of MLCC can be measured by a network

10
lZl, ESR(Ohm)
analyzer or an impedance analyzer. When using the 1

network analyzer, please note that the small-signal input
may lead to the impedance of low capacitance caused 0.1
by the AC voltage characteristic of MLCC.
0.01 lZl
ESR
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000 10000
Frequency(㎒)
* Sample : X7R 10uF, Rated voltage 6.3V
[Example of Impedance characteristics]

Caution/Notice
Electrical & Mechanical Caution
1 Applied Voltage
The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications.
Ｉ. Cautions by types of voltage applied to MLCC
‌For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should not exceed the rated
voltage of MLCC.
‌For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage should not exceed the rated voltage
of MLCC.
‌Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of MLCC.
DC Voltage AC Voltage DC+AC Voltage 1 DC+AC Voltage 2 DC+Pulse Voltage

Voltage
Voltage
Voltage
Voltage
Voltage
VMax
VMax 0 VMax
Time VMax VMax
0 Time 0 Time 0 Time 0 Time
[Types of Voltage Applied to the Capacitor]
Ⅱ.
‌‌Effect of EOS (Electrical Overstress)
‌Electrical Overstress can cause damages to MLCC, resulting in the electrical short failure caused by the dielectric breakdown
in MLCC.
‌Down time of MLCC is varied with the applied voltage and the room temperature and a dielectric shock caused by EOS can
accelerate heating on the dielectric. Therefore, it can bring about a failure of MLCC in a market at the early stage.
‌Please use caution not to apply excessive electrical overstress including spike voltage MLCC when preparing MLCC for
testing or evaluating.
2 Vibration
Please check the types of vibration and shock, and the status of resonance. Manage MLCC not to generate resonance and avoid
any kind of impact to terminals. When MLCC is used in a vibration environment, please make sure to contact us for the situation
and consider special MLCC such as Soft-term, etc.
3 Shock
Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC. Do not use a dropped MLCC to avoid
any quality and reliability deterioration. When piling up or handling printed circuit boards, do not hit MLCC with the corners of a
PCB to prevent cracks or any other damages to the MLCC.
4 Piezo-electric Phenomenon
MLCC may generate a noise due to vibration at specific frequency when using the high dielectric constant MLCC (Class Ⅱ) at AC
or Pulse circuits. MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks

Caution/Notice
Process of Mounting and Soldering
1 Mounting
Ｉ. M
‌ ounting position
It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress
Not recommended Recommended
Ⅱ. ‌Cautions during mounting near the cutout
Please take the following measures to effectively reduce the stress generated from the cutting of PCB. Select the mounting
location shown below, since the mechanical stress is affected by a location and a direction of MLCC mounted near the cutting
line.
※ ‌Relative mechanical stress

②>①
③>①
④>①
Cutting line
Ⅲ. ‌C
autions during mounting near screw
If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque. Mount MLCC as far from the
screw holes as possible.

Caution/Notice
2 Caution before Mounting
Ｉ. I‌t is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from the reel.
Ⅱ. ‌C
heck the capacitance characteristics under actual applied voltage.
Ⅲ. C
‌ heck the mechanical stress when actual process and equipment is in use.
Ⅳ. ‌Check the rated capacitance, rated voltage and other electrical characteristics before assembly. Heat treatment must be done
prior to measurement of capacitance.
Ⅴ. Check the solderability of MLCC that has passed shelf life before use.
Ⅵ. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
3 Cautions during Mounting with Mounting (pick-and-place) Machines

Ｉ. Mounting Head Pressure
‌Excessive pressure may cause cracks in MLCC. It is recommended to adjust the nozzle pressure within the maximum value of
300g.f. Additional conditions must be set for both thin film and special purpose MLCC.
Ⅱ. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before mounting on the other side due to
the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side. If the substrate is not
supported, bending of the substrate may cause cracks in MLCC.
Nozzle
Force
Support Pin
Ⅲ. ‌S
uction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of the nozzle. This may cause
cracks in MLCC due to the excessive force during mounting. If the mounting claw is worn out, it may cause cracks in MLCC
due to the uneven force during positioning. A regular inspection such as maintenance, monitor and replacement for the
suction nozzle and mounting claw should be conducted.

Caution/Notice
4 Reflow soldering
MLCC is in a direct contact with the dissolved solder during soldering, which may be exposed to potential mechanical stress
caused by the sudden temperature change. Therefore, MLCC may be contaminated by the location movement and flux. For the
reason, the mounting process must be closely monitored.
Method Classification
Infrared rays
Overall heating Hot plate
VPS(Vapor phase)
Reflow soldering
Air heater
Local heating Laser
Light beam
Ｉ. Reflow Profile
Temp.(℃)
260+0/-5°C
within 30 sec.
Soldering Temp.
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Liquidus Temp.217
Below 3216 size ΔT≤150°C Gradual cooling

ΔT
Above 3225 size ΔT≤130°C in the air
Preheat Temp. Max.200
Preheat Temp. Min.150
Preheat Area
60~120 60~150 Time(sec)
[Reflow Soldering Conditions]
Use caution not to exceed the peak temperature (260℃) and time (30sec) as shown. Pre-heating is necessary for all
constituents including the PCB to prevent the mechanical damages on MLCC. The temperature difference between the PCB
and the component surface must be kept to the minimum.
As for reflow soldering, it is recommended to keep the number of reflow soldering to less than three times. Please check with
us when the number of reflow soldering needs to exceed three times. Care must be exercised especially for the ultra-small
size, thin film and high capacitance MLCC as they can be affected by thermal stress more easily.

Caution/Notice
Ⅱ.
‌ Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than the reflow temperature
recommended by a solder manufacturer. The specified peak temperature must be maintained after taking into consideration
the factors such as the placement of peripheral constituent and the reflow temperature.
‌Drop in solder wettability
‌Solder voids
‌Potential occurrence of whisker
‌Drop in adhesive strength
‌Drop in self-alignment properties
‌Potential occurrence of tombstones
Ⅲ.
‌ Cooling
Natural cooling with air is recommended.
Ⅳ.
‌ Optimum solder flux for reflow soldering
‌Overly the thick application of solder pastes results in an excessive solder fillet height. This makes MLCC more vulnerable to
the mechanical and thermal stress from the board, which may cause cracks in MLCC.
‌Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to isolate from PCB
‌Check if solder has been applied uniformly after soldering is completed.
Too Much Solder Not enough solder

large stress may cause cracks Weak holding force may cause bad
connections or detaching of the capacitor
‌It is required to design a PCB with consideration of a solder land pattern and its size to apply an appropriate amount of
solder to MLCC. The amount of the solder at the edge may impact directly on cracks in MLCC.

Caution/Notice
5 Flow soldering
Ｉ. Flow profile
Temp.(°C)
Peak 260℃ max.

within 5 sec.
Soldering Temp.
Preheat Area
ΔT≤150°C
Gradual cooling
in the air
Preheat Temp.Typ.120
120 Min. Time(sec)
[Flow Soldering Conditions]
Take caution not to exceed peak temperature (260℃) and time (5sec) as shown.
Please contact us before use the type of high capacitance and thin film MLCC for some exceptions that may be caused.
Ⅱ. Caution before Flow soldering
‌When a sudden heat is applied to MLCC, the mechanical rigidity of MLCC is deteriorated by the internal deformation
of MLCC. Preheating all the constituents including PCB is required to prevent the mechanical damages on MLCC. The
temperature difference between the solder and the surface of MLCC must be kept to the minimum.
‌If the flow time is too long or the flow temperature is too high, the adhesive strength with PCB may be deteriorated by the
leaching phenomenon of the outer termination, or the capacitance value may be dropped by weak adhesion between the
internal termination and the outer termination.

Caution/Notice
6 Soldering Iron
Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature soldering iron tip may come
into a direct contact with the ceramic body of MLCC due to the carelessness of an operator. Therefore, the soldering iron must
be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the
tip.
Ｉ. How to use a soldering Iron
‌In order to minimize damages on MLCC, preheating MLCC and PCB is necessary. A hot plate and a hot air type preheater
should be used for preheating
‌Do not cool down MLCC and PCB rapidly after soldering.
‌Keep the contact time between the outer termination of MLCC and the soldering iron as short as possible. Long soldering
time may cause problems such as adhesion deterioration by the leaching phenomenon of the outer termination.
Variation of Temp. Soldering Temp.(℃) Pre-heating Time(sec) Soldering Time(sec) Cooling Time(sec)
ΔT≤130 300±10℃ max ≥60, @150℃ ≤4 -
* Control Δ T in the solder iron and preheating temperature.
Condition of Iron facilities

Wattage Tip diameter Soldering time
20W max 3㎜ max 4sec max
* Caution - ‌Iron tip should not contact with ceramic body directly
Lead-free solder: Sn-3.0Ag-0.5CU
Ⅱ.
‌ Cautions for re-work
Too much solder amount will increase the risk of PCB

bending or cause other damages.
Too little solder amount will result in MLCC breaking loose

from the PCB due to the inadequate adhesive strength.
Check if the solder has been applied properly and ensure

the solder fillet has a proper shape. * Soldering wire below ø0.5mm is required for soldering.
7 Cleaning
Ｉ. In general, cleaning is unnecessary if rosin flux is used.
When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the
performance of MLCC. This means that the cleansing solution must be carefully selected and should always be new.
Ⅱ.
‌ Cautions for cleaning
MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong during cleaning. When
high pressure cleaning equipment is used, test should be done for the cleaning equipment and its process before the cleaning
in order to avoid damages on MLCC.

Caution/Notice
8 Cautions for using electrical measuring probes
Confirm the position of the support pin or jig when checking the electrical performance of MLCC after mounting on the PCB.
Watch for PCB bending caused by the pressure of a test-probe or other equipment.
If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may be damaged.
Avoid PCB flexing by using the support pin on the back side of the PCB.
Place equipment with the support pin as close to the test-probe as possible.
Prevent shock vibrations of the board when the test-probe contacts a PCB.
Test Pin
Test Pin Test Pin
9 Printed Circuit Board Cropping

Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC on the PCB.
The stress as shown may cause cracks in MLCC when cutting the board.
Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
Avoid these types of stresses applied to MLCC.
[Bending] [Twisting]
Ｉ. Cautions for cutting PCB
Check a cutting method of PCB in advance.
‌The high density board is separated into many individual boards after the completion of soldering. If the board is bent or
deformed during separation, MLCC may be cracked. Carefully select a separation method that minimizes the deformation of
the PCB.

Caution/Notice
10 Assembly Handling
Ｉ. Cautions for PCB handling
‌Hold the edges of the board mounted with MLCC with both hands since holding with one hand may bend the board. Do not
use dropped boards, which may degrade the quality of MLCC.
Ⅱ.
‌ Mounting other components
Pay attention to the following conditions when mounting other components on the back side of The board after MLCC
has been mounted on the front side. When the suction nozzle is placed too close to the board, board deflection stress may
be applied to MLCC on the back side, resulting in cracks in MLCC. Check if proper value is set on each chip mounter for a
suction location, a mounting gap and a suction gap by the thickness of components.
Nozzle
Force
Ⅲ.
‌ Board mounting components with leads
If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder joint may be cracked.
Pay attention to the following:
Reduce the stress on the board during insertion by increasing the size of the lead insertion hole.
Insert components with leads into the board after fixing the board with support pins or a dedicated jig.
Support the bottom side of the board to avoid bending the board.
Check the status of the height of each support pin regularly when the support pins are used.

Caution/Notice
Ⅳ.
‌ Socket and / or connector attach / detach
Since the insertion or removal from sockets and connectors may cause the board to bent, make sure that MLCC mounted on
the board should not be damaged in this process.
Force
Ⅴ.
‌ Fastening screw
When attaching a shield on a board, the board may be bent during a screw tightening work.
Pay attention to the following conditions before performing the work.
Plan the work to prevent the board from bending.
Use a torque driver to prevent over-tightening of the screw.
Since the board may be bent by soldering, use caution in tightening the screw.
11 Adhesive selection
Pay attention to the following if an adhesive is used to position MLCC on the board before soldering.
Ｉ. Requirements for Adhesives
They must have enough adhesive strength to prevent MLCC from slipping or moving during the handling the board.
They must maintain their adhesive strength when exposed to soldering temperatures.
They should not spread when applied to the PCB.
They should have a long pot life.
They should hardened quickly.
They should not corrode the board or MLCC materials.
They should be an insulator type that does not affect the characteristic of MLCC.
They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives.

Caution/Notice
Ⅱ.
‌ Caution before Applying Adhesive
Check the correct application conditions before attaching MLCC to the board with an adhesive. If the dimension of land,
the type of adhesives, the amount of coating, the contact surface areas, the curing temperature, or other conditions are not
appropriate, it may degrade the MLCC performance.
Ⅲ.
‌ Cautions for selecting Adhesive
Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded. In addition, MLCC may be
cracked by the difference in contractile stress caused by the different contraction rate between MLCC and the adhesive.
Ⅳ.
‌ Cautions for the amount of applied adhesive and curing temperature
‌The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the mounting defect in MLCC.
‌Excessive use of the adhesive may cause a soldering defect, loss of electrical connection, incorrect curing, or slippage of a
mounting position, thereby an inflow of the adhesive onto the land section should be avoided.
‌If the curing temperature is too high or the curing time is too long, the adhesive strength will be degraded. In addition,
oxidation both on the outer termination (Sn) of MLCC and the surface of the board may deteriorate the solderability.
12 Flux
Ｉ. ‌The excessive amount of flux generates excessive flux gases which may deteriorate solderability. Therefore, apply the flux thin
and evenly as a whole.
Ⅱ. ‌Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not done properly. Therefore, use
flux with a halogen content of 0.1% max.
Ⅲ. ‌S
trong acidic flux can degrade the MLCC performance.
Ⅳ. ‌C
heck the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the mounting process.
13 Coating
Ｉ. ‌C
rack caused by Coating
‌A crack may be caused in the MLCC due to amount of the resin and stress of thermal contraction of the resin during coating
process. During the coating process, the amount of resin and the stress of thermal contraction of the resin may cause cracks
in MLCC. The difference of thermal expansion coefficient between the coating, or a molding resin may cause destruction,
deterioration of insulation resistance or dielectric breakdown of MLCC such as cracks or detachment, etc.
Ⅱ.
‌ Recommended Coating material
A thermal expansion coefficient should be as close to that of MLCC as possible.
A silicone resin can be used as an under-coating to buffer the stress.
The resin should have a minimum curing contraction rate.
The resin should have a minimum sensitivity (ex. Epoxy resin).
‌The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is used in a high humidity
condition.
‌Do not use strong acid substances due to the fact that coating materials inducing a family of halogen substances and
organic acid may corrode MLCC.

Caution/Notice
Design
1 Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the drop in insulation resistance.
Therefore, it is required to install safety equipment such as a fuse to prevent additional accidents when MLCC is short-circuited,
otherwise, electric short and fire may occur. This product is not a safety guaranteed product.
2 PCB Design
Ｉ. ‌Unlike lead type components, SMD type components that are designed to be mounted directly on the board are fragile to the
stress. In addition, they are more sensitive to mechanical and thermal stress than lead type components.
‌Ⅱ. MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal expansion and contraction,
resulting in cracks in MLCC. Even though MLCC is mounted on a board with a fluorine resin or on a single-layered glass epoxy,
cracks in MLCC may occur.
3 Design system evaluation

Ｉ. E
‌ valuate the actual design with MLCC to make sure there is no functional issue or violation of specifications of the finished
goods.
Ⅱ. Please
‌‌ note that the capacitance may differ based on the operating condition of the actual system since Class 2 MLCC
capacitance varies with applied voltage and temperature.
Ⅲ. Surge
‌‌ resistance must be evaluated since the excessive surge caused by the inductance of the actual system may apply to
MLCC.
Ⅳ. ‌Note the actual MLCC size and the termination shape.
4 Land dimension
The recommended land dimension is determined by evaluating the actual SET and a board.
BW
T
c
a b

Caution/Notice
Reflow Footprint
Chip Size Chip Tol. a b c (a+2b) (a+2b)

(mm) (mm) (mm) (mm) (mm) min max
± 0.013 0.07~0.08 0.09~0.14 0.125~0.135 0.25 0.36
0201
± 0.03 0.07~0.09 0.10~0.15 0.135~0.145 0.27 0.39
± 0.02 0.14~0.18 0.19~0.23 0.20~0.24 0.52 0.64
0402
± 0.05 0.15~0.19 0.20~0.24 0.23~0.27 0.55 0.67
05025 ± 0.025 0.18~0.22 0.24~0.28 0.25~0.29 0.66 0.78
± 0.03 0.22~0.28 0.31~0.37 0.30~0.36 0.84 1.02
± 0.05 0.23~0.29 0.32~0.38 0.32~0.38 0.87 1.05
0603
± 0.07 0.24~0.30 0.32~0.38 0.35~0.40 0.88 1.06
± 0.09 0.25~0.31 0.33~0.39 0.36~0.42 0.91 1.09
± 0.05 0.36~0.44 0.49~0.57 0.51~0.59 1.34 1.58
± 0.07 0.37~0.45 0.49~0.57 0.53~0.61 1.35 1.59
± 0.10 0.38~0.46 0.50~0.58 0.56~0.64 1.38 1.62
± 0.15 0.40~0.48 0.52~0.60 0.61~0.69 1.44 1.68
1005
± 0.20 0.42~0.50 0.53~0.61 0.66~0.74 1.48 1.72
± 0.25 0.44~0.52 0.55~0.63 0.71~0.79 1.54 1.78
± 0.30 0.45~0.53 0.56~0.64 0.76~0.84 1.57 1.81
± 0.40 0.49~0.57 0.59~0.67 0.86~0.94 1.67 1.91
± 0.10 0.63~0.73 0.71~0.81 0.80~0.90 2.05 2.35
± 0.15 0.65~0.75 0.73~0.83 0.90~1.00 2.11 2.41
1608 ± 0.20 0.67~0.77 0.74~0.84 0.95~1.05 2.15 2.45
± 0.25 0.69~0.79 0.76~0.86 1.00~1.10 2.21 2.51
± 0.30 0.71~0.81 0.77~0.87 1.05~1.15 2.25 2.55
±0.10 0.79~0.89 0.88~0.98 1.25~1.35 2.55 2.85
±0.15 0.81~0.91 0.90~1.00 1.30~1.40 2.61 2.91
2012 ±0.20 0.83~0.93 0.91~1.01 1.35~1.45 2.65 2.95
±0.25 0.85~0.95 0.93~1.03 1.40~1.50 2.71 3.01
±0.30 0.89~0.97 0.94~1.04 1.45~1.55 2.75 3.05
±0.20 1.64~1.76 1.19~1.31 1.74~1.86 4.02 4.38
3216
±0.30 1.69~1.81 1.22~1.34 1.84~1.96 4.13 4.49
±0.20 1.64~1.76 1.29~1.41 2.64~2.76 4.22 4.58
3225
±0.30 1.69~1.81 1.32~1.44 2.74~2.86 4.33 4.69
4532 ±0.40 2.17~2.33 1.75~1.91 3.42~3.58 5.67 6.15
5750 ±0.40 2.75~2.95 2.03~2.23 5.30~5.50 6.81 7.41

Caution/Notice
Flow Footprint
Chip Size Chip Tol. a b c (a+2b) (a+2b)

Wmin Wmax
(mm) (mm) (mm) (mm) (mm) min max
± 0.05 0.55~0.65 0.70~0.80 0.55~0.65 1.95 2.25 0.55 0.65
± 0.07 0.55~0.65 0.70~0.80 0.55~0.65 1.95 2.25 0.55 0.65
± 0.10 0.55~0.65 0.70~0.80 0.60~0.70 1.95 2.25 0.60 0.70
1005
± 0.15 0.55~0.65 0.70~0.80 0.60~0.70 1.95 2.25 0.60 0.70
± 0.20 0.60~0.70 0.70~0.80 0.65~0.75 2.00 2.30 0.65 0.75
± 0.25 0.60~0.70 0.70~0.80 0.65~0.75 2.00 2.30 0.65 0.75
± 0.10 0.90~1.00 0.80~0.90 0.90~1.00 2.50 2.80 0.90 1.00
± 0.15 0.90~1.00 0.85~0.95 0.90~1.00 2.60 2.90 0.90 1.00
1608 ± 0.20 0.90~1.00 0.85~0.95 0.95~1.05 2.60 2.90 0.95 1.05
± 0.25 0.95~1.05 0.85~0.95 0.95~1.05 2.65 2.95 0.95 1.05
± 0.30 0.95~1.05 0.85~0.95 1.00~1.10 2.65 2.95 1.00 1.10
± 0.10 1.00~1.10 1.05~1.15 1.30~1.40 3.10 3.40 1.30 1.40
± 0.15 1.05~1.15 1.05~1.15 1.30~1.40 3.15 3.45 1.30 1.40
± 0.20 1.05~1.15 1.05~1.15 1.35~1.45 3.15 3.45 1.35 1.45
2012
± 0.25 1.05~1.15 1.10~1.20 1.35~1.45 3.25 3.55 1.35 1.45
± 0.30 1.05~1.15 1.10~1.20 1.40~1.50 3.25 3.55 1.40 1.50
± 0.35 1.05~1.15 1.10~1.20 1.40~1.50 3.25 3.55 1.40 1.50
± 0.15 2.00~2.10 1.40~1.50 1.70~1.80 4.80 5.10 1.70 1.80
3216 ± 0.20 2.00~2.10 1.40~1.50 1.75~1.85 4.80 5.10 1.75 1.85
± 0.30 2.05~2.15 1.40~1.50 1.80~1.90 4.85 5.15 1.80 1.90
± 0.30 1.90~2.00 1.55~1.65 2.70~2.80 5.00 5.30 2.70 2.80
3225
± 0.40 1.95~2.05 1.55~1.65 2.75~2.85 5.05 5.35 2.75 2.85

Caution/Notice
Others
1 Storage environment
Ｉ. Recommendation for temperature/humidity
‌Even taping and packaging materials are designed to endure a long-term storage, they should be stored with a temperature
of 0~40°C and an RH of 0~70% otherwise, too high temperatures or humidity may deteriorate the quality of the product
rapidly.
‌As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is, the better the solderability
is. As the temperature difference may cause dew condensation during the storage of the product, it is a must to maintain a
temperature control environment
Ⅱ. Shelf Life
An allowable storage period should be within 6 months from the outgoing date of delivery in consideration of solderability.
As for products in storage over 6 months, please check solderability before use.
2 Caution for corrosive environment

As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to store MLCC in an environment
without gases. MLCC that is exposed to corrosive gases may cause its quality issues due to the corrosion of plating layers and the
penetration of moisture.
3 Equipment in operation
Ｉ. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.
Ⅱ. ‌The termination of MLCC shall not be contacted with a conductive object (short –circuit). Do not expose MLCC to conductive
liquid containing acidic or alkaline material.
Ⅲ. D
‌ o not use the equipment in the following conditions.
(1) Exposure to water or oil

(2) Exposure to direct sunlight
(3) Exposure to Ozone or ultra-violet radiation.
(4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas)
(5) Exposure to vibration or mechanical shock exceeding specified limit
(6) Exposure to high humidity
Ⅳ. ‌If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug from the power source. If
the equipment is not switched off or unplugged, serious damage may occur due to the continuous power supply. Please be
careful with the high temperature in this condition.
4 Waste treatment
In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company. When scrapping MLCC, it is
recommended to incinerate or bury the scrappage by a licensed industrial waste company.

Caution/Notice
5 Operating temperature
The operating temperature limit is determined by the specification of each models.
Ｉ. ‌Do not use MLCC over the maximum operating temperature. Pay attention to equipment’s temperature distribution and the
seasonal fluctuation of ambient temperature.
Ⅱ. ‌T
he surface temperature of MLCC cannot exceed the maximum operating temperature including self-heating effects.
6 Transportation
The performance of MLCC may be affected by transportation conditions.
Ｉ. ‌MLCC shall be protected from excessive temperature, humidity and a mechanical force during transportation. During
transportation, the cartons shall not be deformed and the inner packaging shall be protected from excessive external forces.
Ⅱ. ‌D
o not apply excessive vibrations, shocks or excessive forces to MLCC.
If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
‌When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a tweezer, etc, MLCC may crack or
become short-circuited.
Ⅲ. M
‌ LCC may crack and become non-functional due to the excessive shocks or dropping during transportation.
7 Notice
Some special products are excluded from this document. Please be advised that this is a standard product specification for a
reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to
approve the product specifications before placing an order. Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.

Caution/Notice
Caution of Application
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this spec sheet or made available on
the website are subject to change.
The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable
to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility
of any kind, expressed or implied.
ANY USE OF PRODUCT OUTSIDE OF SPECIFICATIONS OR ANY STORAGE OR INSTALLATION INCONSISTENT WITH PRODUCT
GUIDANCE VOIDS ANY WARRANTY.
Although Samsung Electro-Mechanics designs and manufactures its products to the most stringent quality and safety standards,
given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other
safeguards (such as installation of protective circuitry or redundancies)
in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety
measures are indicted or that other measures may not be required.
Limitation
Please contact us with usage environment information such as voltage, current, temperature, or other special conditions before using
our products for the applications listed below. The below application conditions require especially high reliability products to prevent
defects that may directly cause damages or loss to third party’s life, body or property.
If you have any questions regarding this ‘Limitation’，you should first contact our sales personnel or application engineers.
① Aerospace/Aviation equipment ⑧ Traffic signal equipment

② Military equipment ⑨ Data-processing equipment
③ Atomic energy-related equipment ⑩ Electric heating apparatus，burning equipment
④ Undersea equipment ⑪ Safety equipment
⑤ Medical equipment ⑫ ‌Any other applications with the same as or similar complexity
⑥ Disaster prevention/crime prevention equipment or reliability to the applications
⑦ Power plant control equipment

Component Sales Offices

Head Office
150, Maeyeong-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
Tel +82-31-210-5114 (Main Number)
America Asia
San Jose Shenzhen
Samsung Electro Mechanics America Inc. (HQ) Samsung Electro-Mechanics (ShenZhen) Co.,Ltd.(HQ)
3655 N 1st street, San Jose CA 95134, U.S.A. 14F, Tower A, SCC Building, Junction of Houhai Blvd. and Haide 1st Rd., Nanshan
Tel +1-408-544-5454 Dist., Shenzhen City, China.
Tel +86-755-8608-5589
San Diego
Samsung Electro Mechanics America Inc.(San Diego office) Shanghai
5405 Morehouse Drive, Suite #220 San Diego CA 92121 USA Samsung Electro-Mechanics Co.,Ltd. (Shanghai Branch)
Tel +1-858-766-9863 13F Room 1301-1302, Tower B, SOHO Zhongshan Building, No.1065 Zhongshan
West Rd., Changning Dist., Shanghai City, China.
Phoenix Tel +86-21-2501-5803
Samsung Electro Mechanics America Inc.(Phoenix Office)
4505 E Chandler Blvd suite #105, Phoenix, AZ, 85048, U.S.A. Beijing
Tel +1-480-592-0184 Samsung Electro-Mechanics Co.,Ltd. (Beijing Branch)
21F 2101-3, Samsung Tower, Building 1,Yard31, Jinghui Street,Chaoyang Dist,
Detroit Beijing City, China.
Samsung Electro Mechanics America Inc.(Detroit Office) Tel +86-10-5092-8701
27777 Franklin Road Suite 1040 Southfield, MI 48034 USA
Tel +1-248-499-8830 Taipei
Samsung Electro-Mechanics Co.,Ltd. (Taipei Branch)
Austin 9F-1, No.399 Rueykuang Rd., Neihu Dist., Taipei City, Taiwan.
Samsung Electro Mechanics America Inc.(Austin Office) Tel +886-2-2656-8351
710 Hesters Crossing Road Suite 180 Round Rock, TX 78681 USA
Tel +1-480-216-4432 Singapore
Samsung Electro-Mechanics Private Limited(HQ)
3 Church Street Samsung Hub #23-01 Singapore.
Europe Tel +65-6933-2600
Frankfurt Penang
Samsung Electro-Mechanics GmbH. (HQ) Samsung Electro-Mechanics Private Limited(Penang Office)
Koelner Str. 12, 65760 Eschborn, Germany. Unit 9-06, Menara Boustead, 39 Jalan Sultan Ahmad Shah, 10050, Georgetown,
Tel ‌+49-6196-66-3300 Penang, Malaysia.
Tel +60-12-803-7001
Munich
Samsung Electro-Mechanics GmbH. (Munich Office)
New Delhi
Reichenbachstrasse 2, 85737 Ismaning, Germany. Samsung Electro-Mechanics Private Limited(New Delhi Office)
Tel +49-6196-66-7237 Unit No. 606, DLF Tower A, District Center Jasola, New Delhi-110025, India
Tel +91-956-005-0310
Stuttgart
Samsung Electro-Mechanics GmbH. (Stuttgart Office)
Tokyo
Leitzstrasse 45, 70469 Stuttgart, Germany. Samsung Electro-Mechanics Japan Co., Ltd(HQ)
Tel +49-7114-906-6281 Shinagawa Grand Central Tower 9F, 2-16-4, Kounan, Minato-ku, Tokyo, Japan.
Tel +81-3-6369-6461
Helsinki
Samsung Electro-Mechanics GmbH. (Helsinki Office)
Keilaranta 1, 02150 Espoo, Finland.
Tel +35-898-53-1132
Manufacturing Sites
Busan Plant China Tianjin Philippines

333, Noksansaneopjung-ro, Gangseo-gu, No.80&96, Xiaqing Road, The west zone of BLK 5&6 Calamba Premiere International Park
Busan, Republic of Korea TEDA Tianjin, China 300462 Brgy. Batino Calamba, Laguna Philippines
Tel +82-31-210-5114 (Main Number) Tel +86-22-6686-3333 Tel +63-49-508-8300
* Suwon (R&D)

www.samsungsem.com
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Samsung Electro-Mechanics:
CL10B102KB85PNC CL10B222KB85PNC CL10B103KC85PNC CL21B104KBC5PNL CL21C221JB61PNL

CL31B105KBH5PNE CL21B223KC65PNC CL21B473KBC5PNL CL32Y106KLJ4PNE CL10B102KB85PNL
CL21B473KCCWPND CL21C221GB61PNC CL21B224KBF4PNE CL31B104KCPWPNE CL05B104KA54PNC
CL21B104KCC5PND CL21B152KB6WPNC CL21B105KOF4PNF CL31B225KBH4PNF CL10B104KB85PNL
CL21B103KB6WPND CL10B152KB85PNC CL21B105KAF4PNF CL21B473KBC5PNC CL21B472KC65PNC
CL10B473KB85PNL CL31B104KBC5PNC CL32B475KBJ4PNF CL31B104KBPWPNE CL21B683KBC5PNC
CL10B471KC85PNC CL10B471KC85PNL CL10Y225KQ84PNC CL21B152KB65PNC CL21B223KB65PNC
CL21B104KBCWPNL CL21B104KBF5PNE CL21C101JB61PND CL32Y476MPVVPJE CL21B102KB65PND
CL21B334KBF4PNF CL21B103KB6WPNC CL21C102JCC1PNC CL05B104KO54PND CL21B105KOF4PNE
CL31B225KBH4PNE CL05B104KO54PNC CL10B221KC85PNC CL21B334KBF4PNE CL10B103KB85PND
CL10B332KB85PNC CL10B104KO85PNC CL21B472KB65PND CL21B224KBF4PNG CL21B473KBCWPNC
CL21B683KBCWPNC CL32B475KBJ4PNE CL10B683KB85PNC CL21B105KOF4PNG CL21C102JBC1PNC
CL21C820JC61PNC CL21B104KBCWPNC CL10B105KO84PNC CL10B103KB85PNC CL10B223KB85PNC
CL21B223KC6WPNC CL21B102KB6WPNC CL21C101JC61PNC CL10B472KB85PNC CL31B224KBPWPNE
CL31B105KAP5PNE CL21C100JB61PNC CL21C221JB61PNC CL21C680JC61PNC CL21B683KBC5PNL
CL21B102KB65PNC CL10B104KB85PNC CL21B474KBF4PNG CL10B104KB85PND CL21C222JBC1PNC
CL21C681JCC1PNC CL10B473KB85PNC CL31B334KBH5PNF CL21B105KAF4PNG CL21B103KC6WPNC
CL21B222KB6WPNC CL21B473KCCWPNC CL21C220JB61PNC CL21B104KCC5PNC CL31B225KAH4PNE
CL21B105KAF4PNE CL21C121JB61PNC CL21B104KBC5PNC CL10B153KB85PNC CL21C331JB61PNC
CL21C820JB61PNC CL21B103KB65PNC CL21C120JB61PNC CL21C101JB61PNC CL21B223KB6WPNC

MLCC Automotive 1837966

Uploaded by

Copyright:

Available Formats

MLCC Automotive 1837966

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

MLCC Automotive 1837966

Uploaded by

Copyright:

Available Formats

January 2024

Interactive User Guide

30 Mid/High Voltage Capacitors

36 High Bending Strength Capacitors

46 Fail Safe Capacitors

48 High Temperature Capacitors

52 ESD Protection Capacitors

53 Low ESL Capacitors

74 Reliability Test Conditions

105 Components Sales Offices/Manufacturing Sites

Class Ⅱ (High Dielectric Constant)

5 CAPACITANCE TOLERANCE CODE

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 04

6 RATED VOLTAGE CODE

9 PRODUCT CODE OR SIZE CONTROL CODE

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 05

General Capacitors General

AEC-Q200 and JEDEC-020-D qualified products.

RoHS compliant products.

Structure and Dimensions

X7R Standard [VPN, 6PN] X7R Open mode [WPN]

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 06

Capacitance Table (C0G)

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 07

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 08

6.3 6.8uF - 10uF

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 09

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 10

Size Code (inch/mm) : 0402/1005

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 11

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 12

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 13

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 14

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 15

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 16

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 17

Thickness Max. Rated Voltage Capacitance

Size Code (inch/mm) : 1206/3216

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 18

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 19

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 20

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 21

Thickness Max. Rated Voltage Capacitance

Size Code (inch/mm) : 0603/1608

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 22

Thickness Max. Rated Voltage Capacitance

MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE 23