BS EN IEC 62969-1-2018
BS EN IEC 62969-1-2018
BS EN IEC 62969-1-2018
National foreword
This British Standard is the UK implementation of EN IEC 62969-1:2018.
It is identical to IEC 62969-1:2017.
The UK participation in its preparation was entrusted to Technical
Committee EPL/47, Semiconductors.
A list of organizations represented on this committee can be obtained on
request to its secretary.
This publication does not purport to include all the necessary provisions
of a contract. Users are responsible for its correct application.
© The British Standards Institution 2018
Published by BSI Standards Limited 2018
ISBN 978 0 580 93186 4
ICS 31.080.99
Compliance with a British Standard cannot confer immunity from
legal obligations.
This British Standard was published under the authority of the
Standards Policy and Strategy Committee on 28 February 2018.
ICS 31 .080.99
English Version
This European Standard was approved by CENELEC on 201 8-01 -1 7. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
© 201 8 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
European foreword
The text of document 47/2433/FDIS, future edition 1 of IEC 62969-1 , prepared by IEC/TC
47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62969-1 .
The following dates are fixed:
• latest date by which the document has to be (dop) 201 8-1 0-1 7
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021 -01 -1 7
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62969-1 :201 7 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61 508 (all parts) NOTE Harmonized as EN 61 508 (all parts).
2
BS EN IEC 62969-1:2018
IEC EN 62969-1 :201 8 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
3
BS EN IEC 62969-1:2018
IEC EN 62969-1 :201 8 (E)
4
BS EN IEC 62969-1:2018
CONTENTS
FOREWORD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
I N TRODU CTI ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 N orm ati ve references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Term s and d efin itions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 General system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 1 General system blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2 Classificati on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2. 1 Sensors i n autom oti ve veh icles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2. 2 Power sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. 3 Data in terface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
4. 3. 2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
4. 3. 3 Mon itori ng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5 En vironm en tal con di tions an d req u irem ents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2 Test con d ition s an d i tem s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2. 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2. 2 Tem perature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 3 H um id ity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 4 Dam p heat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 5 Tem perature cycl i ng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 6 Mech an ical im pact and vi bration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 2. 7 EMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 2. 8 I P rati ngs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 3 Test setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
6 Power i nterfaces an d checking item s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
6. 1 I n put vol tage l evel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
6. 2 Mai n error sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 2. 1 AC noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 2. 2 Vol tag e drop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 3 Red un d ancy of power i n terface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
Ann ex A (inform ati ve) G en eral d escri pti on of power interface for au tom oti ve vehicle
sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5
Bibl i ograph y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AU TOMOTIVE VEHICLES –
Part 1 : General requirements of power interface
for automotive vehicle sensors
FOREWORD
1 ) Th e I n ternati on al El ectrotechn i cal Com m issi on (I EC) i s a worl d wi d e organ i zati on for stan d ardi zati on com pri si n g
al l n ati on al el ectrotech ni cal com m i ttees (I EC N ati on al Com m i ttees). Th e obj ect of I EC i s to prom ote
i n ternati on al co-operati on on al l q uesti on s con cern i n g stand ardi zati on i n th e el ectri cal an d el ectroni c fi el ds. To
thi s end an d i n ad di ti on to other acti vi ti es, I EC pu bl i sh es I n ternati on al Stan d ard s, Tech n i cal Speci fi cati ons,
Tech ni cal Reports, Pu bl i cl y Avai l abl e Speci fi cati on s (PAS) an d G ui d es (h ereafter referred to as “I EC
Publ i cati on (s)”). Thei r preparati on i s entru sted to techn i cal com m i ttees; any I EC N ati onal Com m i ttee i nterested
i n th e su bj ect d eal t wi th m ay parti ci pate i n thi s preparatory work. I n tern ati onal , govern m en tal an d n on -
govern m ental organ i zati ons l i ai si n g wi th th e I EC al so parti ci pate i n th i s preparati on . I EC col l aborates cl osel y
wi th th e I n tern ati onal Org an i zati on for Stan d ard i zati on (I S O) i n accordan ce wi th con d i ti on s d eterm i ned by
agreem en t between th e two organ i zati on s.
2) Th e form al d eci si on s or agreem en ts of I EC on tech ni cal m atters express, as n earl y as possi bl e, an i n ternati on al
con sen su s of opi ni on on th e rel evan t su bj ects si nce each techn i cal com m i ttee has represen tati on from al l
i n terested I EC N ati on al Com m ittees.
3) I EC Publ i cati ons h ave th e form of recom m end ati on s for i n tern ati onal use an d are accepted by I EC N ati onal
Com m i ttees i n th at sense. Whi l e al l reasonabl e efforts are m ade to ensure th at th e tech n i cal con ten t of I EC
Pu bl i cati on s i s accu rate, I E C cann ot be h el d responsi bl e for th e way i n whi ch th ey are u sed or for an y
m i si n terpretati on by an y en d u ser.
4) I n ord er to prom ote i n tern ati onal u n i form i ty, I EC N ati on al Com m i ttees u nd ertake to appl y I EC Pu bl i cati on s
tran sparen tl y to th e m axi m u m extent possi bl e i n th ei r nati on al an d regi on al publ i cati ons. An y d i vergen ce
between an y I EC Pu bl i cati on and the correspon di ng n ati on al or regi on al pu bl i cati on sh al l be cl earl y i n di cated i n
the l atter.
5) I EC i tsel f d oes not provi d e an y attestati on of conform i ty. I n d epend ent certi fi cati on bod i es provi de con form i ty
assessm en t servi ces and , i n som e areas, access to I EC m arks of con form i ty. I EC i s not respon si bl e for an y
servi ces carri ed out by i nd epend en t certi fi cati on bod i es.
6) Al l users shou l d ensure that th ey h ave th e l atest edi ti on of thi s pu bl i cati on .
7) N o l i abi l i ty sh al l attach to I EC or i ts di rectors, em pl oyees, servan ts or ag ents i ncl u di n g i n di vi d u al experts an d
m em bers of i ts tech ni cal com m i ttees an d I EC N ati on al Com m i ttees for an y person al i n j u ry, property d am age or
oth er dam age of an y n atu re wh atsoever, wh eth er d i rect or i nd i rect, or for costs (i ncl u d i n g l eg al fees) and
expen ses ari si n g ou t of the publ i cati on , u se of, or rel i an ce u pon , thi s I EC Pu bl i cati on or any oth er I EC
Publ i cati on s.
8) Atten ti on i s drawn to th e N orm ati ve referen ces ci ted i n th i s pu bl i cati on. U se of th e referenced publ i cati on s i s
i n di spen sabl e for the correct appl i cati on of thi s pu bl i cati on .
9) Atten ti on i s drawn to th e possi bi l i ty that som e of th e el em en ts of th i s I EC Pu bl i cati on m ay be th e subj ect of
patent ri g h ts. I EC sh al l not be hel d respon si bl e for i den ti fyi n g any or al l su ch patent ri ghts.
I n tern ati on al Stan dard I EC 62969-1 h as been prepared by I EC techn i cal comm ittee 47:
Sem icond uctor d evices.
This bili n gu al version (201 8-01 ) correspon ds to th e m on olin g ual En g lish versi on , publ ished in
201 7-1 2.
The text of th is I nternational Stan d ard is based on the followi n g d ocum ents:
Fu l l inform ati on on th e voting for th e approval of th is I n tern ati onal Stan dard can be fou n d in
th e report on voti n g i nd icated i n th e above tabl e.
BS EN IEC 62969-1:2018
The French version of th i s stan d ard has not been voted upon.
This d ocum en t h as been drafted i n accord ance wi th th e I SO/I EC Directi ves, Part 2.
A list of all th e parts i n th e I EC 62969 seri es, publi shed u n der th e g eneral ti tl e Semiconductor
devices – Semiconductor interface for automotive vehicles , can be fou n d on th e I EC website.
The com m ittee h as d eci d ed that th e con ten ts of th is docum en t wi l l rem ai n u nch anged un til the
stabi lity d ate i n dicated on th e I EC website u nd er "http: //webstore. i ec. ch " i n th e d ata rel ated to
th e specific d ocum ent. At th is date, the docum ent wi l l be
• reconfirm ed,
• wi thdrawn ,
• repl aced by a revised ed iti on, or
• am end ed.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
BS EN IEC 62969-1:2018
I NTRODUCTI ON
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AU TOMOTIVE VEHICLES –
Part 1 : General requirements of power interface
for automotive vehicle sensors
1 Scope
This part of I EC 62969 provid es general requ i rem ents for perform ance eval u ati ons an d
en vironm ental con d iti on s for th e power in terface of au tom oti ve veh icle sensors. For
perform ance evalu ati ons, vari ous electrical perform ances such as voltag e drop from power
source to autom otive sensors, AC n oises and voltage level are includ ed. For en vironm ental
con d iti ons, various test con d iti ons such as tem perature, h um id ity an d vibrati on are i nclu ded .
I n ad d iti on , term s, d efiniti ons, sym bols an d confi gu rati ons are covered in th is part.
N OTE Add i ti on al i n form ati on on power i n terface for au tom oti ve veh i cl e sensors i s provi d ed i n Ann ex A.
2 Normative references
The foll owi n g d ocum ents are referred to i n the text in such a way th at som e or al l of their
con ten t constitutes req u irem ents of th is d ocum ent. For d ated references, on l y the ed iti on
cited appl i es. For u nd ated references, th e latest ed iti on of the referenced d ocum en t (i ncl ud i n g
an y am endm en ts) appli es.
For the purposes of th is docum en t, the foll owi ng term s an d d efi n iti ons apply.
I SO an d I EC m ain tai n term in ological databases for use i n stand ard i zati on at th e foll owi n g
ad dresses:
E XAM PLE con n ecti on between battery an d el ectri cal l oad such as el ectron i c control u n i ts (ECU ) an d sensors
th rou gh el ectri cal cabl e to tran sfer el ectri cal power.
BS EN IEC 62969-1:2018
3.2
reference voltage
Vr
valu e of th e voltage in accord ance with wh ich th e relevant perform ance of a m eter is fixed
3.3
maximum voltage
Vm ax
th e specifi ed hi ghest voltage appl ied to a load at wh ich th e load (system s or devices) operate
norm al l y
3.4
minimu m voltage
Vm i n
th e specifi ed lowest voltag e appli ed to a load at wh ich th e l oad (system s or d evices) operate
norm al l y
4 General system
4.1 General system blocks
Power sources in autom oti ve veh icles vary d epend i n g on th e type of au tom otive veh icles.
U si n g energ y h arvesti n g an d wireless power transfer tech nolog ies, the battery i n an
au tom otive veh icl e can be ch arged to provid e power to sensors d irectl y or throu gh ECU as
shown in Fig ure 1 .
Ru n/Safety
ECU (Pressu re, fl u i d )
Battery I gni ti on Al tern ator
m ode
AC power
- En erg y harvesti n g En ergy harvesti ng Wi rel ess sen sors
(TPMS )
- Wi rel ess power transfer
IEC
4.2 Classification
4.2.1 Sensors in automotive vehicles
The type of th e applicabl e sensors wi th respect to usage sh all be l isted as shown in Tabl e 1 .
BS EN IEC 62969-1:2018
Energ y harvesting Acqu i ri ng el ectri cal power from ph ysi cal ph enom ena of en vi ronm ent
such as vi brati on, therm al di fference, etc.
N OTE Add i ti on al power sou rci n g tech n ol ogi es can be add ed.
BS EN IEC 62969-1:2018
The fu ncti ons descri bed in 4. 3. 2 and 4. 3. 3 shal l be i nclu ded to con trol an d m oni tor th e status
of power su ppl y between ECU an d sensors.
4.3.2 Reset
Reset fu ncti on of power suppl y sh al l be provid ed. This fu ncti on sh al l be done au tom aticall y or
m anual l y.
4.3.3 M onitoring
Mon itoring fu nction of power su ppl y shal l be provid ed. This fu ncti on sh all be provi d ed wi th
user in terface (U I ) such as d isplay.
En vi ronm en tal con d iti ons shal l be d efi ned for sem icon d uctor com pon ents u sed for autom otive
veh icle accord i ng to existi n g specificati on s based on I EC 61 851 -1 an d classification of
en vironm ental cond i ti ons based on I EC 60721 (all parts).
Voltage level on each m ode EMC (EMI/E MS) Temperature on each m ode Impact test
5.2.3 Humidity
The sem icon d uctor com pon en ts in th e power in terface sh all be ch ecked by ECU or other
m onitori ng system u nd er various h um id ity con d iti ons to prevent m alfu ncti on an d dam age.
The sem icond uctor com pon ents i n th e power interface shal l be tested at a ran ge between 5 %
an d 95 % . Th e test sh all be i n accordance with I EC 60068-2-30 for the 1 2 days. The test sh all
be don e 5 cycles at th e various d am p h eat cycl in g, (40 ± 3) ° C an d rel ative h um id ity of 95 %
for 24 h ours accord in g to I EC 60068-2-30.
5.2.7 EM C
5.2.7.1 General
The EMC of the sem icon ductor com ponents in th e power i nterface sh all be tested to preven t
m alfuncti on and dam age.
5.2.7.2 Immunity
The im m uni ty of the sem icon ductor com pon en ts in th e power i n terface shal l be tested wi th
respect to perform ance criteri a to prevent m alfu ncti on and d am ag e.
5.2.7.3 Emission
The electrom agn etic wave em issi on from the sem icon d uctor com pon en ts i n the power
interface sh all be tested un d er th e worst cast scenari os in order to create m axim um em issi ons.
The test sh all be in accord ance with I EC 61 967-1 , I EC 61 967-2, I EC 61 967-3, I EC 61 967-4,
I EC 61 967-5, I EC 61 967-6 and I EC 61 967-8.
5.2.8 IP ratings
The I P (I n gress Protection) rati n g of th e sem icond uctor com ponen ts in power in terface sh all
be provi d ed by th e m an ufacturer.
d ata
Power I n terface /
power swi tch power ECU d ata
source Actu ators
board
power data
Mu l ti -m eter
(M easu ri n g V/I )
Sen sors
(DU T)
IEC
F i g u re 3 – T e s t s e t u p fo r c h e c k i n g t h e p o w e r l e v e l t o s e n s o rs
6 P o w e r i n t e rfa c e s a n d c h e c ki n g i t e m s
6. 1 I n p u t vo l tag e l evel
Man y sensors cou l d be used to provi d e dri vers or users of au tom oti ve veh icl es wi th
con ven ience and safety. I n th at case, a secured power su ppl y to the sensor is a key i ssu e to
ensure fu nction al safety.
Vol tage (V)
16
Vma x
14
Vr
12
Vmi n
10
6
4
Ti m e (m s)
IEC
Ke y:
F i g u re 4 – C h e c k i n g i n p u t v o l t a g e l e v e l t o s e n s o rs ( 1 2 V s e n s o rs )
BS EN IEC 62969-1:2018
This test sh all be perform ed to ch eck the i nput voltage level to sensors as sh own in Fi gure 4.
U si n g an oscil l oscope or m ulti-m eter, i nput voltage l evel to sensors sh all be ch ecked to
ensure proper fu nction of sensors. Th e d evi ati on between “ Vr” and “ Vm ax ” or “ Vr” an d “ Vm i n ”
shall be confirm ed .
Annex A
(informative)
The n eeds for sensors i n autom oti ve veh icles are i ncreased to ensure h um ans ’ safety an d
con ven ience. The sensors con vert ph ysical an d en vironm ental i nform ati on in to electrical
si gn al to con trol vari ous actu ators such as m otor, en g i ne, etc. (see Fi gure A. 1 ).
Power
IEC
To guarantee th e functi on al safety of vari ous sensors i n autom oti ve veh icl es, th e power
interface and d istribu ti on of power to th e sensors an d the data i nterface between sensors and
electron ic control u n its (ECU s) are very im portant.
BS EN IEC 62969-1:2018
Bibliograph y
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