BS EN IEC 62969-1-2018

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BS EN IEC 62969-1:2018

BSI Standards Publication

Semiconductor devices – Semiconductor


interface for automotive vehicles

Part 1: General requirements of power interface for


automotive vehicle sensors (IEC 62969-1:2017)
BS EN IEC 62969-1:2018 BRITISH STANDARD

National foreword
This British Standard is the UK implementation of EN IEC 62969-1:2018.
It is identical to IEC 62969-1:2017.
The UK participation in its preparation was entrusted to Technical
Committee EPL/47, Semiconductors.
A list of organizations represented on this committee can be obtained on
request to its secretary.
This publication does not purport to include all the necessary provisions
of a contract. Users are responsible for its correct application.
© The British Standards Institution 2018
Published by BSI Standards Limited 2018
ISBN 978 0 580 93186 4
ICS 31.080.99
Compliance with a British Standard cannot confer immunity from
legal obligations.
This British Standard was published under the authority of the
Standards Policy and Strategy Committee on 28 February 2018.

Amendments/corrigenda issued since publication


Date Text affected
BS EN IEC 62969-1:2018
EUROPEAN STANDARD EN IEC 62969-1
NORME EUROPÉENNE
EUROPÄISCHE NORM February 201 8

ICS 31 .080.99

English Version

Semiconductor devices - Semiconductor interface for automotive


vehicles - Part 1 : General requirements of power interface for
automotive vehicle sensors
(IEC 62969-1 :201 7)
Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle für
semiconducteurs pour les véhicules automobiles - Partie 1 : Automobile - Teil 1 : Allgemeine Anforderungen an Energie-
Exigences générales de l'interface d'alimentation destinée Schnittstellen für Automobil-Sensoren
aux capteurs des véhicules automobiles (IEC 62969-1 :201 7)
(IEC 62969-1 :201 7)

This European Standard was approved by CENELEC on 201 8-01 -1 7. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization


Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Rue de la Science 23, B-1 040 Brussels

© 201 8 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62969-1 :201 8 E


BS EN IEC 62969-1:2018
IEC EN 62969-1 :201 8 (E)

European foreword
The text of document 47/2433/FDIS, future edition 1 of IEC 62969-1 , prepared by IEC/TC
47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62969-1 .
The following dates are fixed:
• latest date by which the document has to be (dop) 201 8-1 0-1 7
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021 -01 -1 7
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62969-1 :201 7 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61 508 (all parts) NOTE Harmonized as EN 61 508 (all parts).

2
BS EN IEC 62969-1:2018
IEC EN 62969-1 :201 8 (E)

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year


IEC 60068-2-1 - Environmental testing -- Part 2-1 : Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing -- Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-1 4 - Environmental testing -- Part 2-1 4: Tests - EN 60068-2-1 4 -
Test N: Change of temperature
IEC 60068-2-30 - Environmental testing -- Part 2-30: Tests - EN 60068-2-30 -
Test Db: Damp heat, cyclic (1 2 h + 1 2 h
cycle)
IEC 60529 - Degrees of protection provided by - -
enclosures (IP Code)
IEC 60721 series Classification of environmental conditions - EN 60721 series
- Part 1 : Environmental parameters and
their severities
IEC 60749-1 0 - Semiconductor devices - Mechanical and EN 60749-1 0 -
climatic test methods -- Part 1 0:
Mechanical shock
IEC 60749-1 2 - Semiconductor devices - Mechanical and EN 60749-1 2 -
climatic test methods - Part 1 2: Vibration,
variable frequency
IEC 61 851 -1 - Electric vehicle conductive charging - -
system -- Part 1 : General requirements
IEC 61 967-1 - Integrated circuits - Measurement of - -
electromagnetic emissions, 1 50 kHz to 1
GHz - Part 1 : General conditions and
definitions
IEC 61 967-2 - Integrated circuits - Measurement of EN 61 967-2 -
electromagnetic emissions, 1 50 kHz to 1
GHz -- Part 2: Measurement of radiated
emissions - TEM cell and wideband TEM
cell method
IEC TS 61 967-3 - Integrated circuits - Measurement of - -
electromagnetic emissions - Part 3:
Measurement of radiated emissions -
Surface scan method

3
BS EN IEC 62969-1:2018
IEC EN 62969-1 :201 8 (E)

IEC 61 967-4 - Integrated circuits - Measurement of EN 61 967-4 -


electromagnetic emissions, 1 50 kHz to 1
GHz -- Part 4: Measurement of conducted
emissions - 1 ohm/1 50 ohm direct coupling
method
IEC 61 967-5 - Integrated circuits - Measurement of EN 61 967-5 -
electromagnetic emissions, 1 50 kHz to 1
GHz -- Part 5: Measurement of conducted
emissions - Workbench Faraday Cage
method
IEC 61 967-6 - Integrated circuits - Measurement of EN 61 967-6 -
electromagnetic emissions, 1 50 kHz to 1
GHz -- Part 6: Measurement of conducted
emissions - Magnetic probe method
IEC 61 967-8 - Integrated circuits - Measurement of EN 61 967-8 -
electromagnetic emissions -- Part 8:
Measurement of radiated emissions - IC
stripline method
IEC 621 32-1 - Integrated circuits - Measurement of EN 621 32-1 -
electromagnetic immunity - Part 1 : General
conditions and definitions
IEC 621 32-2 - Integrated circuits - Measurement of EN 621 32-2 -
electromagnetic immunity -- Part 2:
Measurement of radiated immunity - TEM
cell and wideband TEM cell method
IEC 621 32-3 - Integrated circuits - Measurement of EN 621 32-3 -
electromagnetic immunity, 1 50 kHz to 1
GHz -- Part 3: Bulk current injection (BCI)
method
IEC 621 32-4 - Integrated circuits - Measurement of EN 621 32-4 -
electromagnetic immunity, 1 50 kHz to 1
GHz -- Part 4: Direct RF power injection
method
IEC 621 32-5 - Integrated circuits - Measurement of EN 621 32-5 -
electromagnetic immunity, 1 50 kHz to 1
GHz -- Part 5: Workbench Faraday cage
method
IEC TS 61 967-3 - Integrated circuits - Measurement of - -
electromagnetic emissions - Part 3:
Measurement of radiated emissions -
Surface scan method
IEC 62262 - Degrees of protection provided by EN 62262 -
enclosures for electrical equipment against
external mechanical impacts (IK code)

4
BS EN IEC 62969-1:2018

–2– I EC 62969-1 : 201 7 © I EC 201 7

CONTENTS
FOREWORD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
I N TRODU CTI ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 N orm ati ve references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Term s and d efin itions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 General system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 1 General system blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2 Classificati on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2. 1 Sensors i n autom oti ve veh icles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. 2. 2 Power sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. 3 Data in terface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
4. 3. 2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
4. 3. 3 Mon itori ng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5 En vironm en tal con di tions an d req u irem ents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2 Test con d ition s an d i tem s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2. 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
5. 2. 2 Tem perature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 3 H um id ity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 4 Dam p heat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 5 Tem perature cycl i ng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
5. 2. 6 Mech an ical im pact and vi bration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 2. 7 EMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 2. 8 I P rati ngs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
5. 3 Test setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
6 Power i nterfaces an d checking item s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
6. 1 I n put vol tage l evel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
6. 2 Mai n error sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 2. 1 AC noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 2. 2 Vol tag e drop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
6. 3 Red un d ancy of power i n terface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
Ann ex A (inform ati ve) G en eral d escri pti on of power interface for au tom oti ve vehicle
sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5
Bibl i ograph y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6

Figu re 1 – Power su ppl y chai ns to th e veh icl e sen sors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8


Figu re 2 – Exam pl e of test con d iti ons an d i tem s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
Figu re 3 – Test setup for checki n g th e power level to sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
Figu re 4 – Ch eckin g in pu t voltage level to sensors (1 2 V sensors) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
Figu re A. 1 – Sensor-based system in autom otive veh icl es . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5

Tabl e 1 – Sensors for autom otive veh icles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9


Tabl e 2 – Power sources to sensors in au tom oti ve veh icles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 –3–

I NTERNATI ON AL ELECTROTECH NI CAL COM MI SSI ON


____________

SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AU TOMOTIVE VEHICLES –
Part 1 : General requirements of power interface
for automotive vehicle sensors
FOREWORD
1 ) Th e I n ternati on al El ectrotechn i cal Com m issi on (I EC) i s a worl d wi d e organ i zati on for stan d ardi zati on com pri si n g
al l n ati on al el ectrotech ni cal com m i ttees (I EC N ati on al Com m i ttees). Th e obj ect of I EC i s to prom ote
i n ternati on al co-operati on on al l q uesti on s con cern i n g stand ardi zati on i n th e el ectri cal an d el ectroni c fi el ds. To
thi s end an d i n ad di ti on to other acti vi ti es, I EC pu bl i sh es I n ternati on al Stan d ard s, Tech n i cal Speci fi cati ons,
Tech ni cal Reports, Pu bl i cl y Avai l abl e Speci fi cati on s (PAS) an d G ui d es (h ereafter referred to as “I EC
Publ i cati on (s)”). Thei r preparati on i s entru sted to techn i cal com m i ttees; any I EC N ati onal Com m i ttee i nterested
i n th e su bj ect d eal t wi th m ay parti ci pate i n thi s preparatory work. I n tern ati onal , govern m en tal an d n on -
govern m ental organ i zati ons l i ai si n g wi th th e I EC al so parti ci pate i n th i s preparati on . I EC col l aborates cl osel y
wi th th e I n tern ati onal Org an i zati on for Stan d ard i zati on (I S O) i n accordan ce wi th con d i ti on s d eterm i ned by
agreem en t between th e two organ i zati on s.
2) Th e form al d eci si on s or agreem en ts of I EC on tech ni cal m atters express, as n earl y as possi bl e, an i n ternati on al
con sen su s of opi ni on on th e rel evan t su bj ects si nce each techn i cal com m i ttee has represen tati on from al l
i n terested I EC N ati on al Com m ittees.
3) I EC Publ i cati ons h ave th e form of recom m end ati on s for i n tern ati onal use an d are accepted by I EC N ati onal
Com m i ttees i n th at sense. Whi l e al l reasonabl e efforts are m ade to ensure th at th e tech n i cal con ten t of I EC
Pu bl i cati on s i s accu rate, I E C cann ot be h el d responsi bl e for th e way i n whi ch th ey are u sed or for an y
m i si n terpretati on by an y en d u ser.
4) I n ord er to prom ote i n tern ati onal u n i form i ty, I EC N ati on al Com m i ttees u nd ertake to appl y I EC Pu bl i cati on s
tran sparen tl y to th e m axi m u m extent possi bl e i n th ei r nati on al an d regi on al publ i cati ons. An y d i vergen ce
between an y I EC Pu bl i cati on and the correspon di ng n ati on al or regi on al pu bl i cati on sh al l be cl earl y i n di cated i n
the l atter.
5) I EC i tsel f d oes not provi d e an y attestati on of conform i ty. I n d epend ent certi fi cati on bod i es provi de con form i ty
assessm en t servi ces and , i n som e areas, access to I EC m arks of con form i ty. I EC i s not respon si bl e for an y
servi ces carri ed out by i nd epend en t certi fi cati on bod i es.
6) Al l users shou l d ensure that th ey h ave th e l atest edi ti on of thi s pu bl i cati on .
7) N o l i abi l i ty sh al l attach to I EC or i ts di rectors, em pl oyees, servan ts or ag ents i ncl u di n g i n di vi d u al experts an d
m em bers of i ts tech ni cal com m i ttees an d I EC N ati on al Com m i ttees for an y person al i n j u ry, property d am age or
oth er dam age of an y n atu re wh atsoever, wh eth er d i rect or i nd i rect, or for costs (i ncl u d i n g l eg al fees) and
expen ses ari si n g ou t of the publ i cati on , u se of, or rel i an ce u pon , thi s I EC Pu bl i cati on or any oth er I EC
Publ i cati on s.
8) Atten ti on i s drawn to th e N orm ati ve referen ces ci ted i n th i s pu bl i cati on. U se of th e referenced publ i cati on s i s
i n di spen sabl e for the correct appl i cati on of thi s pu bl i cati on .
9) Atten ti on i s drawn to th e possi bi l i ty that som e of th e el em en ts of th i s I EC Pu bl i cati on m ay be th e subj ect of
patent ri g h ts. I EC sh al l not be hel d respon si bl e for i den ti fyi n g any or al l su ch patent ri ghts.

I n tern ati on al Stan dard I EC 62969-1 h as been prepared by I EC techn i cal comm ittee 47:
Sem icond uctor d evices.

This bili n gu al version (201 8-01 ) correspon ds to th e m on olin g ual En g lish versi on , publ ished in
201 7-1 2.

The text of th is I nternational Stan d ard is based on the followi n g d ocum ents:

FDI S Report on voti n g


47/2433/FDI S 47/2447/RVD

Fu l l inform ati on on th e voting for th e approval of th is I n tern ati onal Stan dard can be fou n d in
th e report on voti n g i nd icated i n th e above tabl e.
BS EN IEC 62969-1:2018

–4– I EC 62969-1 : 201 7 © I EC 201 7

The French version of th i s stan d ard has not been voted upon.

This d ocum en t h as been drafted i n accord ance wi th th e I SO/I EC Directi ves, Part 2.

A list of all th e parts i n th e I EC 62969 seri es, publi shed u n der th e g eneral ti tl e Semiconductor
devices – Semiconductor interface for automotive vehicles , can be fou n d on th e I EC website.
The com m ittee h as d eci d ed that th e con ten ts of th is docum en t wi l l rem ai n u nch anged un til the
stabi lity d ate i n dicated on th e I EC website u nd er "http: //webstore. i ec. ch " i n th e d ata rel ated to
th e specific d ocum ent. At th is date, the docum ent wi l l be

• reconfirm ed,
• wi thdrawn ,
• repl aced by a revised ed iti on, or
• am end ed.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 –5–

I NTRODUCTI ON

The I EC 62969 series is com posed of four parts as follows:

• I EC 62969-1 , Semiconductor devices – Semiconductor interface for automotive vehicles –


Part 1: General requirements of power interface for automotive vehicle sensors
• I EC 62969-2, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 2: Efficiency evaluation methods of wireless power transmission using resonance for
automotive vehicle sensors
• I EC 62969-3, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
• I EC 62969-4, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation methods of data interface for automotive vehicle sensors
The I EC 62969 series covers power an d data in terfaces for sensors i n autom oti ve veh icl es.
The first part covers gen eral req ui rem en ts of test cond i ti ons such as tem perature, h um id i ty,
vi bration, etc. for au tom oti ve sensor power i n terface. Th is part also i nclu d es vari ous electrical
perform ances of power i nterface such as voltage drop from power source to au tom oti ve
sensors, n oises, voltage l evel , etc. Th e second part covers “Efficiency evalu ation m ethods of
wirel ess power transm ission usi ng resonance for au tom oti ve veh icl e sensors “. The th ird part
covers “Sh ock driven pi ezoel ectric energ y h arvestin g for autom oti ve veh icle sensors”. The
fourth part covers “Evalu ati on m eth ods of data i nterface for au tom oti ve veh icl e sensors”.
BS EN IEC 62969-1:2018

–6– I EC 62969-1 : 201 7 © I EC 201 7

SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AU TOMOTIVE VEHICLES –
Part 1 : General requirements of power interface
for automotive vehicle sensors

1 Scope
This part of I EC 62969 provid es general requ i rem ents for perform ance eval u ati ons an d
en vironm ental con d iti on s for th e power in terface of au tom oti ve veh icle sensors. For
perform ance evalu ati ons, vari ous electrical perform ances such as voltag e drop from power
source to autom otive sensors, AC n oises and voltage level are includ ed. For en vironm ental
con d iti ons, various test con d iti ons such as tem perature, h um id ity an d vibrati on are i nclu ded .
I n ad d iti on , term s, d efiniti ons, sym bols an d confi gu rati ons are covered in th is part.

N OTE Add i ti on al i n form ati on on power i n terface for au tom oti ve veh i cl e sensors i s provi d ed i n Ann ex A.

2 Normative references
The foll owi n g d ocum ents are referred to i n the text in such a way th at som e or al l of their
con ten t constitutes req u irem ents of th is d ocum ent. For d ated references, on l y the ed iti on
cited appl i es. For u nd ated references, th e latest ed iti on of the referenced d ocum en t (i ncl ud i n g
an y am endm en ts) appli es.

I EC 60068-2-1 , Environmental testing – Part 2-1: Tests – Test A: Cold


I EC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
I EC 60068-2-1 4, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
I EC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
I EC 60529, Degrees of protection provided by enclosures (IP Code)
IEC 60721 (all parts), Classification of environmental conditions
I EC 60749-1 0, Semiconductor devices – Mechanical and climatic test methods – Part 10:
Mechanical shock
I EC 60749-1 2, Semiconductor devices – Mechanical and climatic test methods – Part 12:
Vibration, variable frequency
I EC 61 851 -1 , Electric vehicle conductive charging system – Part 1: General requirements
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
I EC 61 967-1 ,
1 GHz – Part 1: General conditions and definitions
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
I EC 61 967-2,
1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell
method
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 –7–

I EC TS 61 967-3, Integrated circuits – Measurement of electromagnetic emissions – Part 3:


Measurement of radiated emissions – Surface scan method
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
I EC 61 967-4,
1 GHz – Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling
method
I EC 61 967-5, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 5: Measurement of conducted emissions – Workbench Faraday Cage method
I EC 61 967-6, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method
Integrated circuits – Measurement of electromagnetic emissions – Part 8:
I EC 61 967-8,
Measurement of radiated emissions – IC stripline method
Integrated circuits – Measurement of electromagnetic immunity – Part 1:
I EC 621 32-1 ,
General conditions and definitions
Integrated circuits – Measurement of electromagnetic immunity – Part 2:
I EC 621 32-2,
Measurement of radiated immunity – TEM cell and wideband TEM cell method
I EC 621 32-3, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to
1 GHz – Part 3: Bulk current injection (BCI) method
I EC 621 32-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF power injection method
I EC 621 32-5,Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to
1 GHz – Part 5: Workbench Faraday cage method
I EC TS 6221 5-2, Integrated circuits – Measurement of impulse immunity – Part 2:
Synchronous transient injection method
I EC 62262, Degrees of protection provided by enclosures for electrical equipment against
external mechanical impacts (IK code)

3 Terms and definitions

For the purposes of th is docum en t, the foll owi ng term s an d d efi n iti ons apply.

I SO an d I EC m ain tai n term in ological databases for use i n stand ard i zati on at th e foll owi n g
ad dresses:

• I EC Electroped i a: avai labl e at h ttp: //www. electroped ia. org/


• I SO On l in e browsin g platform : avai l abl e at http: //www. iso. org/obp
3. 1
power interface
ph ysical conn ecti on between two d ifferen t functi on al u n its th ose are conn ected via cabl e,
prin ted circu it or wireless con nection throu gh a m edium such as air to transfer th e el ectrical
power

E XAM PLE con n ecti on between battery an d el ectri cal l oad such as el ectron i c control u n i ts (ECU ) an d sensors
th rou gh el ectri cal cabl e to tran sfer el ectri cal power.
BS EN IEC 62969-1:2018

–8– I EC 62969-1 : 201 7 © I EC 201 7

3.2
reference voltage
Vr
valu e of th e voltage in accord ance with wh ich th e relevant perform ance of a m eter is fixed

[SOU RCE: I EC 60050-31 4: 2001 , 31 4-07-04]

3.3
maximum voltage
Vm ax
th e specifi ed hi ghest voltage appl ied to a load at wh ich th e load (system s or devices) operate
norm al l y

3.4
minimu m voltage
Vm i n
th e specifi ed lowest voltag e appli ed to a load at wh ich th e l oad (system s or d evices) operate
norm al l y

4 General system
4.1 General system blocks
Power sources in autom oti ve veh icles vary d epend i n g on th e type of au tom otive veh icles.
U si n g energ y h arvesti n g an d wireless power transfer tech nolog ies, the battery i n an
au tom otive veh icl e can be ch arged to provid e power to sensors d irectl y or throu gh ECU as
shown in Fig ure 1 .

DC power Parki ng Con veni en ce


m ode (Bl ack box, m oti on )

Accessory Fu nd am en tal fun cti on


m od e (Au di o, cl ock)

Power on Con veni en ce


m od e (Rai n sensor)

Ru n/Safety
ECU (Pressu re, fl u i d )
Battery I gni ti on Al tern ator
m ode

AC power
- En erg y harvesti n g En ergy harvesti ng Wi rel ess sen sors
(TPMS )
- Wi rel ess power transfer

IEC

Figure 1 – Power supply chains to the vehicle sensors

4.2 Classification
4.2.1 Sensors in automotive vehicles
The type of th e applicabl e sensors wi th respect to usage sh all be l isted as shown in Tabl e 1 .
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 –9–

Table 1 – Sensors for automotive vehicles


Usag e Sensors Type
oxyg en sensor gas sen sor
cran ksh aft posi ti on sensor m agneti c sensor
en gi ne cool ant tem peratu re sen sor tem peratu re sen sor
wh eel s speed sen sor m agneti c sensor
shaft speed sen sor h al l sensor
m an i fol d absol u te pressu re (M AP) sen sor pressu re sen sor
th rottl e posi ti on sensor h al l sensor
Run (power train and torq u e sen sor m agneti c sensor
control )
tran sm i ssi on fl u i d tem peratu re sen sor tem peratu re sen sor
tu rbi n e speed sen sor m agneti c sensor
veh i cl e speed sen sor m agneti c sensor
current sensor curren t sensor
fu el l evel sensor capaci ti ve sen sor
en gi ne oi l l evel sensor u l trasoni c sen sor
brake fl u i d l evel sen sor m agneti c sensor
ai r bag sen sor accel erom eter sen sor
steeri n g wheel an gl e sen sor m agneti c sensor
bl i n d spot m oni tor i m age sensor
Safety parki n g sensor u l trasoni c sen sor
rad ar sensor rad ar sensor
yaw rate sensor gyro sensor
ti re pressure sen sor pressu re sen sor
rai n sensor l i ght sen sor
l i gh t sen sor l i gh t sen sor
Security,
Conveni ence and tem peratu re/ h um i d i ty sensor tem peratu re/ h u m i d i ty sen sor
Entertainmen t
ai r q u al i ty sen sor gas sen sor
bl ack box i m age sensor

N OTE Add i ti on al sensors can be ad d ed.

4.2.2 Power sources


To provid e power to sensors, vari ous power sourci ng techn ol ogi es can be u sed as i n Table 2.

Table 2 – Power sources to sensors in automotive vehicles


Power sources Power sourcing method s
Generating power u sing Fuel or gas Acti vati n g eng i n e to gen erate el ectri cal power u si n g fu el or gas
Provi d i n g el ectri cal power from tran sm i tter to sensors th rough ai r or
Wireless power transfer m edi u m (i n du cti ve coupl i n g, m agn eti c reson an ce, m i crowave-based
transfer, etc. )

Energ y harvesting Acqu i ri ng el ectri cal power from ph ysi cal ph enom ena of en vi ronm ent
such as vi brati on, therm al di fference, etc.

N OTE Add i ti on al power sou rci n g tech n ol ogi es can be add ed.
BS EN IEC 62969-1:2018

– 10 – I EC 62969-1 : 201 7 © I EC 201 7

4.3 Data interface


4.3.1 General

The fu ncti ons descri bed in 4. 3. 2 and 4. 3. 3 shal l be i nclu ded to con trol an d m oni tor th e status
of power su ppl y between ECU an d sensors.

4.3.2 Reset
Reset fu ncti on of power suppl y sh al l be provid ed. This fu ncti on sh al l be done au tom aticall y or
m anual l y.

4.3.3 M onitoring
Mon itoring fu nction of power su ppl y shal l be provid ed. This fu ncti on sh all be provi d ed wi th
user in terface (U I ) such as d isplay.

5 Environmental conditions and requirements


5.1 General
The power i nterface for sensors i n au tom oti ve veh icl es sh al l be d esi gn ed an d m anufactured
to resist th e effect of vari ous solvents and fl u i ds, vibrati on an d sh ock, tem perature ch anges,
hum i di ty ch anges and du st.

En vi ronm en tal con d iti ons shal l be d efi ned for sem icon d uctor com pon ents u sed for autom otive
veh icle accord i ng to existi n g specificati on s based on I EC 61 851 -1 an d classification of
en vironm ental cond i ti ons based on I EC 60721 (all parts).

5.2 Test conditions and items


5.2.1 General
Al l test cond i ti ons an d item s sh all be listed i n a table or d i agram as sh own as an exam ple in
Fi gu re 2.

Test procedure and items

Electri cal properti es EM C/ESD Environmental test Reliability test

Voltage level on each m ode EMC (EMI/E MS) Temperature on each m ode Impact test

Voltage l evel in battery ESD Temperature/humidity Vibration test

Power switching test Thermal shock

Open/short test Temperature cycle

Reverse voltage test Temperature/humidity cycle

Over voltage test Dust

Water proof test

Salt water IEC

Figure 2 – Example of test conditions and items


BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 – 11 –

N OTE Add i ti on al tests can be add ed.

5.2.2 Temperature range


5.2.2.1 General
The sem icond uctor compon en ts i n the power i nterface sh all be ch ecked by ECU or an oth er
m onitori ng system u nd er various tem perature con d iti ons to preven t m alfun cti on and d am age.

5.2.2.2 Temperature monitoring


The tem perature for th e am bi ent, cold est an d h ottest i nclu d in g d am p h eat an d tem perature
cycl in g shal l be m on itored and record ed at real ti m e and various pl aces. For th e m onitori n g,
wi d el y used therm istors can be used.

5.2.2.3 Ambient temperature


The am bi ent tem perature sh all be m easured an d record ed to provi d e reference tem perature
for th e cold est an d the h ottest tem perature con d iti ons. Th e am bient tem perature range sh all
be provi ded by th e m an ufacturer.

5.2.2.4 Coldest temperature


The col d est tem perature sh al l be m easured and record ed at real tim e an d in vari ous places
an d the sem icond uctor com pon ents in th e power interface sh al l be tested at th e col d est
tem perature.

The test sh al l be i n accordance with I EC 60068-2-1 at – 25 °C ± 3 °C for 1 6 h ours.

5.2.2.5 Hottest temperature


The hottest tem perature sh all be m easured an d recod ed at real tim e an d i n vari ous places
an d th e sem icon ductor com pon ents i n th e power i nterface sh al l be tested at the hottest
tem perature.

The test sh al l be i n accordance with I EC 60068-2-2.

5.2.3 Humidity
The sem icon d uctor com pon en ts in th e power in terface sh all be ch ecked by ECU or other
m onitori ng system u nd er various h um id ity con d iti ons to prevent m alfu ncti on an d dam age.

The sem icond uctor com pon ents i n th e power interface shal l be tested at a ran ge between 5 %
an d 95 % . Th e test sh all be i n accordance with I EC 60068-2-30 for the 1 2 days. The test sh all
be don e 5 cycles at th e various d am p h eat cycl in g, (40 ± 3) ° C an d rel ative h um id ity of 95 %
for 24 h ours accord in g to I EC 60068-2-30.

5.2.4 Damp heat


This test applies a h i ghl y accelerated tem perature and h um id i ty stress test for th e purpose of
eval u ati ng th e resistance of the sem icond uctor com pon ents i n the power in terface agai nst
dam p heat con ditions. The effect of d am p h eat con d iti ons on sem icond u ctor com pon en ts in
th e power i n terface sh all be checked by ECU or an oth er m on itori ng system to prevent
m alfuncti on and dam age.

5.2.5 Temperature cycling


The abi l ity of th e sem icond uctor com pon ents in the power in terface to withstand m echan ical
stresses in duced by alternatin g h i gh an d l ow tem perature extrem es sh all be checked by ECU
or anoth er m on itorin g system to prevent m alfu nction an d d am age.
BS EN IEC 62969-1:2018

– 12 – I EC 62969-1 : 201 7 © I EC 201 7

The test sh all be i n accordance with I EC 60068-2-1 4.

5.2.6 M echanical impact and vibration


The effect of m echan ical sh ock, im pact an d vi brati on to th e sem icond uctor com ponen ts in the
power in terface sh all be checked by ECU or an other m on itorin g system to prevent m alfu ncti on
an d d am age. Th is test is i ntend ed to d eterm ine th e su itabil ity of th e sem icon ductor
com pon ents in th e power i nterface for use i n veh icles wh ich m ay be su bj ected to m od eratel y
severe shocks as a resu lt of su dd enl y appl ied forces or abru pt chan ges in m otion prod uced by
rou gh h an d l in g, transportati on , or field operation .

The test sh al l be in accordance wi th I EC 62262 an d I EC 60749-1 0.

5.2.7 EM C
5.2.7.1 General
The EMC of the sem icon ductor com ponents in th e power i nterface sh all be tested to preven t
m alfuncti on and dam age.

5.2.7.2 Immunity
The im m uni ty of the sem icon ductor com pon en ts in th e power i n terface shal l be tested wi th
respect to perform ance criteri a to prevent m alfu ncti on and d am ag e.

The test sh al l be i n accordance wi th I EC TS 6221 5-2, I EC 621 32-1 , I EC 621 32-2,


I EC 621 32-3, I EC 621 32-4 and I EC 621 32-5.

5.2.7.3 Emission
The electrom agn etic wave em issi on from the sem icon d uctor com pon en ts i n the power
interface sh all be tested un d er th e worst cast scenari os in order to create m axim um em issi ons.

The test sh all be in accord ance with I EC 61 967-1 , I EC 61 967-2, I EC 61 967-3, I EC 61 967-4,
I EC 61 967-5, I EC 61 967-6 and I EC 61 967-8.

5.2.8 IP ratings
The I P (I n gress Protection) rati n g of th e sem icond uctor com ponen ts in power in terface sh all
be provi d ed by th e m an ufacturer.

The test sh all be i n accordance with I EC 60529.

5.3 Test setup


A m ulti-m eter or oth er equ i pm ent can be used to evaluate q u ality of power from th e power
source throu gh an in terface such as swi tch board to the ECU and sensors as sh own
in Fi gu re 3.
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 – 13 –

Osci l l oscope Ch ecki n g


error cod e

d ata

Power I n terface /
power swi tch power ECU d ata
source Actu ators
board

power data
Mu l ti -m eter
(M easu ri n g V/I )
Sen sors
(DU T)

IEC

F i g u re 3 – T e s t s e t u p fo r c h e c k i n g t h e p o w e r l e v e l t o s e n s o rs

6 P o w e r i n t e rfa c e s a n d c h e c ki n g i t e m s

6. 1 I n p u t vo l tag e l evel

Man y sensors cou l d be used to provi d e dri vers or users of au tom oti ve veh icl es wi th
con ven ience and safety. I n th at case, a secured power su ppl y to the sensor is a key i ssu e to
ensure fu nction al safety.
Vol tage (V)

16
Vma x
14
Vr
12
Vmi n
10

6
4

Ti m e (m s)
IEC

Ke y:

Vr Referen ce vol tag e


V ma x Maxi m u m vol tage
V mi n M i n i m u m vol tage

F i g u re 4 – C h e c k i n g i n p u t v o l t a g e l e v e l t o s e n s o rs ( 1 2 V s e n s o rs )
BS EN IEC 62969-1:2018

– 14 – I EC 62969-1 : 201 7 © I EC 201 7

This test sh all be perform ed to ch eck the i nput voltage level to sensors as sh own in Fi gure 4.
U si n g an oscil l oscope or m ulti-m eter, i nput voltage l evel to sensors sh all be ch ecked to
ensure proper fu nction of sensors. Th e d evi ati on between “ Vr” and “ Vm ax ” or “ Vr” an d “ Vm i n ”
shall be confirm ed .

6.2 Main error sources


6.2.1 AC noise
AC n oise level from m otors, pan , oil pum ps, etc. shal l be provi ded by th e m an ufacturer to
eval u ate power q uality.

6.2.2 Voltage drop


Vol tag e drops from power sources (generator or battery) to sensors sh all be checked
accord i ng to a power path . Th e path cou ld be pri nted circui t board , cabl e and som e acti ve
sem icond uctor com pon ents.

6.3 Redundancy of power interface


Power in terface cou ld be open or voltage l evel cou ld be u nstable d ue to several reasons such
as m alfu ncti ons or dam age. To secure functi on al safety of power in terface from power source
to sensors, a red u nd ant power i nterface sh al l be provi d ed .
BS EN IEC 62969-1:2018

I EC 62969-1 : 201 7 © I EC 201 7 – 15 –

Annex A
(informative)

General description of power interface


for automotive vehicle sensors
There is a great i n terest for sem icon d uctor electronic devices i n veh i cl es. I n particu lar,
various sensors are used in autom otive veh icles to en hance th e safety an d com fort of h um ans.
For exam pl e, I SO 26262 (all parts) covers vari ous req u irem ents of el ectron ic system s in
au tom otive veh icles to secure fu ncti on al safety.

The n eeds for sensors i n autom oti ve veh icles are i ncreased to ensure h um ans ’ safety an d
con ven ience. The sensors con vert ph ysical an d en vironm ental i nform ati on in to electrical
si gn al to con trol vari ous actu ators such as m otor, en g i ne, etc. (see Fi gure A. 1 ).

Power

Ph ysi cal /En vi ron m ental Si gn al Com m an d


i n form ati on Con trol
Sensors Unit Actuators
(ECU )

IEC

Figu re A.1 – Sensor-based system in automotive vehicles

To guarantee th e functi on al safety of vari ous sensors i n autom oti ve veh icl es, th e power
interface and d istribu ti on of power to th e sensors an d the data i nterface between sensors and
electron ic control u n its (ECU s) are very im portant.
BS EN IEC 62969-1:2018

– 16 – I EC 62969-1 : 201 7 © I EC 201 7

Bibliograph y

I EC 61 508 (all parts), Functional safety of electrical/electronic/programmable electronic


safety-related systems

I SO 26262 (all parts), Road vehicles – Functional safety

___________
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