Inforce_6701_Datasheet_003463_RevB

Inforce 67X1™ Micro SoM
Qualcomm® Snapdragon™ 845 Processor based System-on-Module
A compact compute module featuring on-device AI

and Immersion for Embedded Applications
50 mm
The Inforce 67X1 SoM is a small compute module that
integrates Qualcomm®Kryo™ 385 CPU, Adreno™ 630 GPU,
Hexagon™ 685 DSP, Spectra™ 280 camera ISP and
Qualcomm’s 3rd generation AI-Engine. This enables optimized
28 mm
AI performance for a more responsive, power-efficient user-

experience and capture of cinema-grade videos in
UHD@60fps resolution.
These components, coupled with 2x2 802.11ac Wi-Fi, BT 5.x,
a full featured USB-C interface with UHD display capability
and high fidelity audio make the Inforce 67X1 SoM a perfect
fit for applications that necessitate on-device AI and
immersive multimedia experiences. Optional SKUs support
extended operating temperature range and EMI shielding for
better RF noise protection, while also doubling up as a
medium for heat spreading and dissipation to further
improve performance.
Higher performance with Qualcomm Kryo 385 CPU

with independent efficiency and power clusters, each
designed to optimize for a unique UX
Hexagon™ 685 DSP and Adreno™ 630 GPU featuring

room-scale 6DoF with SLAM , to support on-device AI
and Efficient rendering of advanced 3D graphics
Connected Cameras On-device AI Dual 14-bit Spectra™ 280 ISPs support up to 16MP
for simultaneous concurrent cameras
Qualcomm Content Protection Framework; Secure

Boot; Storage and Debug security
Extended lifecycle; OEM engagement options for BTO

and custom variants
Production-ready with volume-conscious pricing
Wearables Portable Dedicated Technical Support from Inforce TechWeb

Healthcare
SoM +ACC-1C20 Carrier
* Some Features are SKU specific
Technical Specifications Carrier Board For Inforce 67X1 SoM

Processors
 Custom 64-bit Kryo Octocore ARM® V-8 compliant CPU (SDA845
SoC) @2.8/1.8GHz each
 Qualcomm® Adreno™ 630 GPU with support for OpenGL ES 3.2,
Vulkan 2 and OpenCL
 Qualcomm® Hexagon™ 685 DSP with dual-HVX512 for ultra low-
power audio processing
 ACC1C20 - A small but complete carrier that brings out all native
Memory / Storage interfaces of the SDA845 processor including USB-C to help create
and optimize your products with the shortest turnaround time.
 4GB LPDDR4 RAM/64GB UFS
 SD V3.0 µSD card interface
Other Specifications
 2x USB 3.1 interfaces off which one is USB-C (USB 3.1/Gen1)
 Power: +3.8V/6A Input
Connectivity  Operating Temp: Commercial grade
 802.11n/ac MU-MIMO WiFi and BT/LE 5.x via WCN3990

 Relative Humidity: 5 to 95% non-condensing
 GPS/GLONASS via SDR845

 RoHS and WEE compliant
 1x 1-lane PCIe Gen 2 and 1x 1-lane PCIe Gen 3

Ordering Info
Multimedia Part Number Description
 IFC6701-00-P1 Micro SoM (Android Pie OS); 2x B2B conn;
 DP Alternate Mode on USB-C for 4K-DCI@24fps display
Commercial Temp support (0⁰ - 70⁰C)
 Concurrent 4K60 10b encode + 4K60 10b decode Micro SoM (Android Pie OS); 3x B2B conn;
 IFC67A1-00-P1*
 Dual 4-lane MIPI-CSI lines for HEVC capture @4K60 Commercial Temp support (0⁰ - 70⁰C)
 SYS6701-00-P1 IFC6701-00-P1 SoM based Ref Design

Software
 SYS67A1-00-P1* IFC67A1-00-P1 SoM based Ref Design
 Android 9 BSP pre-loaded wth Hexagon/SNPE/OpenCV SDKs
enabled
* - BTO SKU. MOQ of 100
 Debian Linux BSP
SMART Wireless Computing® is a supplier of application-ready embedded hardware platforms in eco-aware, low-profile footprints, available
off-the-shelf to serve growing markets enabled by the next generation of connected devices. At SMART, we are inspired by the inflection point
in mobile and wireless technologies which is spawning innovative devices, content, and services. Together with silicon, software, and system
partners, SMART is pioneering products with an optimized delivery model for target markets such as connected cameras, connected displays
and connected fitness.
Global Sales & Support SMART Wireless Computing Inc. 39870 Eureka Dr, Newark, CA 94560 USA
Phone: (510) 623-1231 | sales@inforcecomputing.com
https://www.smartwirelesscompute.com
© 2020 SMART Wireless Computing, Inc. All rights reserved. All other trademarks and product information are the property of their respective owners.
©2020 SMART Wireless Computing, Inc. Specifications subject to change without notice. Document Number: 003463 Rev B

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Inforce 67X1™ Micro SoM

Qualcomm® Snapdragon™ 845 Processor based System-on-Module

A compact compute module featuring on-device AI

AI performance for a more responsive, power-efficient user-

Higher performance with Qualcomm Kryo 385 CPU

Hexagon™ 685 DSP and Adreno™ 630 GPU featuring

Qualcomm Content Protection Framework; Secure

Extended lifecycle; OEM engagement options for BTO

Production-ready with volume-conscious pricing

Wearables Portable Dedicated Technical Support from Inforce TechWeb

* Some Features are SKU specific

Technical Specifications Carrier Board For Inforce 67X1 SoM

 802.11n/ac MU-MIMO WiFi and BT/LE 5.x via WCN3990

 GPS/GLONASS via SDR845

 1x 1-lane PCIe Gen 2 and 1x 1-lane PCIe Gen 3

 SYS6701-00-P1 IFC6701-00-P1 SoM based Ref Design

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