SPEC 50398 XXXXX - Rev G
SPEC 50398 XXXXX - Rev G
宏致電子股份有限公司
桃 園 縣 中 壢 市 東 園 路 13 號
TEL: +886-3-463-2808
FAX: +886-3-463-1800
50398/51398-XXXXX-001 / 50399-XXXXX-001
50406-XXXXX-001 / 50407-XXXXX-001
PRODUCT NO: 50449-XXXXX-001 / 50412-XXXXX-00X
2010/10/31 TR-FM-73015L
Aces P/N: 50398 Series
1 REVISION HISTORY....................................................................................................... 3
2 SCOPE ............................................................................................................................... 4
3 APPLICABLE DOCUMENTS.......................................................................................... 4
4 REQUIREMENTS............................................................................................................. 4
5 PERFORMANCE .............................................................................................................. 5
6 INSERTION / EXTRACTION FORCE ............................................................................ 8
7 INFRARED REFLOW CONDITION ................................................................................ 8
8. PRODUCT QUALIFICATION AND TEST SEQUENCE................................................ 9
1 Revision History
Rev. ECN # Revision Description Prepared Date
1 ECN-0908092 FIRST SPEC RELEASE JASON 2009.08.13
2 SCOPE
This specification covers performance, tests and quality requirements for 0.5 WTB LVDS
CONN.
Female Board P/N : 50398,50406,51398
Male Cable P/N : 50399,50407,50412,50449
Cable: Coaxial cable AWG#36~42
Discrete Wire AWG#32
Teflon Wire AWG#34
Insulation O.D:0.4mm Max.
3 APPLICABLE DOCUMENTS
4 REQUIREMENTS
4.3 Ratings
5 Performance
5.1. Test Requirements and Procedures Summary
ELECTRICAL
Item Requirement Standard
Mate connectors, measure by dry
60 m Ω Max.(initial) per contact circuit, 20mV Max., 100mA Max.
Low Level
90 m Ω Max.(finish)
Contact Resistance
(EIA-364-23)
(EIA-364-21)
150 VAC Min. at sea level for 1
minute.
No discharge, flashover or
Dielectric Test between adjacent contacts of
breakdown.
Withstanding Voltage unmated connectors.
Current leakage: 1 mA max.
(EIA-364-20)
MECHANICAL
Operation Speed:
25.4 ± 3 mm/minute..
See item 6 Measure the force required to
Mating / Unmating Forces mate/unmate connector.
(EIA-364-13)
The sample should be mounted in
the tester and fully mated and
unmated the number of cycles
Durability 30 cycles. specified at the rate of
25.4 ± 3mm/min.
(EIA-364-09B)
The electrical load condition shall
be 100 mA maximum for all
contacts. Subject to a simple
harmonic motion having amplitude
of 0.76mm (1.52mm maximum
total excursion) in frequency
between the limits of 10 and 55
Hz. The entire frequency range,
Vibration 1 μs Max.
from 10 to 55 Hz and return to 10
Hz, shall be traversed in
approximately 1 minute. This
motion shall be applied for 2 hours
in each of three mutually
perpendicular directions.
(EIA-364-28 Condition I)
Subject mated connectors to
50 G’s (peak value) half-sine shock
pulses of 11 milliseconds duration.
Three shocks in each direction
shall be applied along the three
Shock (Mechanical) 1 μs Max. mutually perpendicular axes of the
test specimen (18 shocks). The
electrical load condition shall be
100mA maximum for all contacts.
ENVIRONMENTAL
Item Requirement Standard
Subject mated connectors to
temperature life at 85℃ for 96
See Product Qualification and Test
Temperature life hours.
Sequence Group 4
(EIA-364-17, Test condition A)
Mated Connector
40℃, 90~95% RH,
See Product Qualification and Test 96 hours
Humidity
Sequence Group 5
(EIA-364-31,Condition A, Method II)
Subject mated/unmated
See Product Qualification and Test connectors to 5% salt-solution
Salt Spray Sequence Group of Gold concentration, 35℃ for 48 hours.
(EIA-364-26,Test condition B)
Subject the test area of contacts
into the flux for 5-10 sec. And then
Solder able area shall have into solder bath, Temperature at
Solder ability
minimum of 95% solder coverage. 245 ±5℃, for 4-5 sec.
(EIA-364-52)
Resistance to Reflow See Product Qualification and Test Pre Heat:150~180℃,60~90sec.
Soldering Heat Sequence Group 8 (Lead Free) Heat:230℃ Min., 40sec Min.
2 Times Peak Temp.:260℃Max,
10sec Max.
Hand Soldering
Appearance: No damage T≧350℃, 3sec at least.
Temperature Resistance
Note. Flowing Mixed Gas shell be conduct by customer request.
Lead-free Process
cm
V-
PCB
V+
Test or Examination 1 2 3 4 5 6 7 8
Test Sequence
Temperature rise 2
Durability 4
Vibration 3
Shock (Mechanical) 4
Temperature life 5
Thermal Shock 5
Humidity 6
Salt Spray 3
Solder ability 1
Number of Sample 2 4 4 4 4 4 2 4