L9369

Automotive IC for a specific application of electric parking braking

Data brief

 2 Motor Speed Sensors (MSS) interfaces to

acquire speed information feedbacks via
external Hall sensors.
 System wake-up in Sleep Mode
 Watchdog (configurable via SPI)
'!0'03

LQFP64 (10x10x1.4mm) Description

The L9369 targets the specific application of
electric parking braking, suitable for system
Features configuration in cable-puller or Motor Gear Unit
(MGU).
 AEC-Q100 qualified
 Functional safety concept for ISO26262 The cores are two H-bridge driver stages to drive
compliance 8 external FETs for the rear wheels brakes
actuators. The stages are fully driven and
 4 High-side and Low-side gate pre-drivers for 8 configurable via SPI, also in PWM control mode
external power NFETs and protected against overcurrent, with drain-
 Overcurrent protection with programmable source and gate-source voltages monitoring.
thresholds
A synchronized motor voltages and currents
 Programmable and NFET independent acquisition, is performed via full differential
thresholds for VDS monitoring amplifiers with programmable and precise gain
 10 integrated Fully differential amplifiers with and low offset and 10 ADC sigma-delta
low offset, very precise gain, and self-test modulators.
 10 separate ADC channels for digital Two configurable HS/LS stages are present with
processing of motor current and voltage programmable output voltage to drive LED arrays,
measurement with feedforward regulation.
 32-bits - 10 MHz SPI with CRC for internal 2 Motor Speed Sensor interfaces (MSS) are
setting, self-test and diagnostics available to acquire position feedback from brake
 Full drive of external power NFETs down to actuators (shared with Lamp driver stage and
5.5 V battery input voltage GPIO).
 Monitoring on Main power supply and The set of the interfaces is completed by 4 GPIO
continuous BIST for internal regulators (General Purpose I/O) pins and a button interface
 Double Bandgap reference allows to manage specific customer requirements
from Electronic parking braking (EPB) button
 4 General Purpose I/O stages (GPIO) console both in Normal and Sleep Mode.
 Button Interface (9 configurable I/O pins) for
monitoring and diagnostics in Normal and Table 1. Device summary
Sleep Mode.
Order code Package Packing

L9369-TR LQFP64 Tape & Reel

January 2019 DB3819 Rev 1 1/13

For further information contact your local STMicroelectronics sales office. www.st.com
Contents L9369

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 LQFP64 (10x10x1.4 mm) package information . . . . . . . . . . . . . . . . . . . . . 9
2.2 LQFP64 (10x10x1.4 mm) marking information . . . . . . . . . . . . . . . . . . . . 11

3 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2/13 DB3819 Rev 1

L9369 Block diagram and pin description

1 Block diagram and pin description

Figure 1. Simplified block diagram

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DB3819 Rev 1 3/13

13
Block diagram and pin description L9369

Figure 2. Pin out

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PIN-out definition and related functions are described in the following Table 2.

4/13 DB3819 Rev 1

L9369 Block diagram and pin description

Table 2. Pin definition and brief function description

Pin # Symbol Function I/O type

SYS_WAKE_IN is a GPIO (General Purpose Programmable

input/output) configured by default as digital input for system
wake-up trigger in Sleep mode only. Configuration is stored in
PROM. (This function needs the SYS_WAKE as companion
function to work properly, as SYS_WAKE_IN (feedback from ext
network) is managed by logic to provide wake-up output pulse
to System basis chip (SBC) during sleep mode (WAU=low).
SYS_WAKE_IN / MSM_A is disabled due to pin sharing with GPIO block).
1 I/O
(GPIO1) / (MSM_A)
GPIO1 = General Purpose Programmable input/output pin.
After the 1st start-up SYS_WAKE_IN can be disabled via SPI in
case not requested by application.
MSM_A = Return pin for the motor speed sensor of stage A with
monitoring and short-circuit protection. (SYS_WAKE_IN and
GPIO1 functionalities are disabled)
GPIO0 = General Purpose Programmable input/output pin
MSP_A = Supply pin for the motor speed sensor of stage A with
GPIO0 / MSP_A (FAULT monitoring short to GND protection and reverse supply
2 I/O
PIN) protection
(GPIO0 can be configured as Fault pin with programmable fault
set via SPI and storage in PROM).
GPIO2 = General Purpose Programmable input/output pin
MSP_B = Supply pin for the motor speed sensor of stage B with
3 GPIO2/MSP_B I/O
monitoring short to GND protection and reverse supply
protection
GPIO3 = General Purpose Programmable input/output pin
4 GPIO3/MSM_B MSM_B = Return pin for the motor speed sensor of stage B with I/O
monitoring and short-circuit protection

5 CL1 Low connection of the stage 1 external pump capacitor I

6 CH1 High connection of the stage 1external pump capacitor I

7 CL2 Low connection of the stage 2 external pump capacitor I

8 CH2 High connection of the stage 2 external pump capacitor I

9 CP Charge pump output voltage O

10 VSCP Charge pump supply voltage with monitoring I

Battery supply and redundant supply for charge pump

11 VBP stage.(Due to PROM data loss, configuration is lost if I
VBP<VBPpermanent)
Drain connection of the external H-Bridge High-side NFET and
12 VSBRIDGE_A I
measurement input for H-bridge supply voltage (stage A)
Drain connection of the external H-Bridge High-side NFET and
13 VSBRIDGE_B I
measurement input for H-bridge supply voltage (stage B)
Negative input pin of the external shunt #1 connected to CSA
14 CSIN1M_B I
stage B

DB3819 Rev 1 5/13

13
Block diagram and pin description L9369

Table 2. Pin definition and brief function description (continued)

Pin # Symbol Function I/O type

Positive input pin of the external shunt #1 connected to CSA

15 CSIN1P_B I
stage B
Gate connection of the H-Bridge Low-side NFET for wheel
16 GL2_B O
brake actuator B

17 ACT_OFF_LS2_B Safety LS switch-off switches for H-bridge stage B I

Source connection of the H-Bridge Low-side switches for wheel

18 SL_B I
brake actuator B

19 ACT_OFF_LS1_B Safety LS switch-off switches for stage H-bridge B I

Gate connection of the H-Bridge Low-side NFET for right wheel

20 GL1_B I
brake actuator B
Positive input signal of the external shunt #2 connected to
21 CSIN2P_B I
redundant CSA for stage B
Negative input signal of the external shunt #2 connected to
22 CSIN2M_B I
redundant CSA for stage B
Source connection of the H-Bridge High-side NFET for wheel
23 SH2_B I
brake actuator B
Gate connection of the H-Bridge High-side NFET for wheel
24 GH2_B O
brake actuator B
Source connection of the H-Bridge High-side NFET for wheel
25 SH1_B I
brake actuator B
Gate connection of the H-Bridge High-side NFET for wheel
26 GH1_B O
brake actuator B
Positive input signal of the external shunt #2 connected to
27 CSIN2P_A I
redundant CSA stage for A
Negative input signal of the external shunt #2 connected to
28 CSIN2M_A I
redundant CSA for stage A
Gate connection of the H-Bridge Low-side NFET for wheel
29 GL2_A O
brake actuator A

30 ACT_OFF_LS2_A Safety LS switch-off switch for stage H-bridge A I

Source connection of the H-Bridge Low-side switches for wheel

31 SL_A I
brake actuator A

32 ACT_OFF_LS1_A Safety LS switch-off switch for stage H-bridge A I

Gate connection of the H-Bridge Low-side NFET for wheel

33 GL1_A O
brake actuator A
Source connection of the H-Bridge High-side NFET for wheel
34 SH2_A I
brake actuator A
Gate connection of the H-Bridge High-side NFET for wheel
35 GH2_A O
brake actuator A
Source connection of the H-Bridge High-side NFET for wheel
36 SH1_A I
brake actuator A

6/13 DB3819 Rev 1

L9369 Block diagram and pin description

Table 2. Pin definition and brief function description (continued)

Pin # Symbol Function I/O type

Gate connection of the H-Bridge High-side NFET for wheel

37 GH1_A O
brake actuator A
Negative input signal of the external shunt #1 connected to CSA
38 CSIN1M_A I
for stage A
Positive input signal of the external shunt #1 connected to CSA
39 CSIN1P_A I
for stage A

40 GIO0 Programmable Input / Output for Button Interface control I/O

41 GIO1 Programmable Input / Output for Button Interface control I/O

42 GIO2 Programmable Input / Output for Button Interface control I/O

43 GIO3 Programmable Input / Output for Button Interface control I/O

44 RVPG Gate driver output for reverse voltage switch control O

45 AGND Analog reference ground connection GND

L9369 generated Low noise analog voltage, supplies the

internal current measurement path. (It can be used to supply
46 VANALOG O
external circuits with low current consumption. External
capacitor required for stabilization.)
EN_EL: digital enable input for GPIO (default pin function).
47 RST (EN_EL) RST: High active Input Reset pin. (Enabled via dedicated SPI I
bit. GPIO block can be enabled and configured independently)
Wake-up input. (digital input, low level active to enter Sleep
48 WAU I
Mode)

49 V3V3VIN 3.3 V supply voltage for L9369 output buffers I

SYS WAKE (default configuration at start-up) is a digital output

pin to wake System basis chip (SBC) up as support for general
diagnostics on the external button during Sleep Mode only. This
function/pin needs the SYS_WAKE_IN as companion function
to work properly. MSSUC_B is disabled due to pin sharing with
GPIO block.
50 SYS_WAKE/MSSUC_B O
In case the SYS_WAKE function is not requested by
application, It can be disabled via SPI at 1st start-up and the pin
can be configured as:
MSSUC_B = Motor speed sensor signal output to the μC. (MSS
interface is disabled by default and its functionality is shared
with Lamp driver HSOUT).
HSOUT1 = SPI programmable HS/LS current source for
51 HSOUT1 O
external bulb lamp or LED array with monitoring

HSOUT0 = SPI programmable HS/LS current source for

external bulb lamp or LED array with monitoring
52 HSOUT0/MSSUC_A O
MSSUC_A = Motor speed sensor signal output to the μC. MSS
interface is disabled by default.

53 GIO8 Programmable Input / Output for Button Interface control I/O

DB3819 Rev 1 7/13

13
Block diagram and pin description L9369

Table 2. Pin definition and brief function description (continued)

Pin # Symbol Function I/O type

54 GIO7 Programmable Input / Output for Button Interface control I/O

55 GIO6 Programmable Input / Output for Button Interface control I/O

56 GIO5 Programmable Input / Output for Button Interface control I/O

57 GIO4 Programmable Input / Output for Button Interface control I/O

58 GND Digital and power ground connection GND

Synchronization signal from μC for ADC voltage/current

59 SYNC5 I
measurement path
Synchronization signal from μC for ADC voltage/current
60 SYNC1 I
measurement path

61 MISO Serial data out for SPI communication to μC O

62 SPICLK Clock signal for SPI I

63 MOSI Serial data input for SPI communication from μC I

64 SPICS Chip select for SPI I

Table 3. General conditions

Symbol Parameter Test conditions Min Typ Max Unit Parameter ID

Function (parameters
Tjunction -40 - 175 °C L9369_194
temperature guaranteed)
(Housing
Application specific
Rth mounted on 6- - - 40 °C/W L9369_3052
Rth
Layer PCB)

8/13 DB3819 Rev 1

L9369 Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

2.1 LQFP64 (10x10x1.4 mm) package information

Figure 3. LQFP64 (10x10x1.4 mm) package outline

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DB3819 Rev 1 9/13

13
Package information L9369

Table 4. LQFP64 (10x10x1.4 mm) package mechanical data

Dimensions

Ref Millimeters Inches(1)

Min. Typ. Max. Min. Typ. Max.

A - - 1.60 - - 0.0630
A1 0.05 - 0.15 0.0020 - 0.0059
A2 1.350 1.40 1.45 0.0531 0.0551 0.0571
b 0.17 0.22 0.27 0.0067 0.0087 0.0106
c 0.09 - 0.20 0.0035 - 0.0079
D 11.80 12.00 12.20 0.4646 0.4724 0.4803
D1 9.80 10.00 10.20 0.3858 0.3937 0.4016
D3 - 7.50 - - 0.2953 -
E 11.80 12.00 12.20 0.4646 0.4724 0.4803
E1 9.80 10.00 10.20 0.3858 0.3937 0.4016
E3 - 7.50 - - 0.2953 -
e - 0.50 - - 0.0197 -
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 - 1.00 - - 0.0394 -
K 0° (min.), 3.5° (typ.) 7° (max.)
ccc - - 0.08 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.

10/13 DB3819 Rev 1

L9369 Package information

2.2 LQFP64 (10x10x1.4 mm) marking information

Figure 4. LQFP64 (10x10x1.4 mm) marking information

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Parts marked as ‘ES’ are not yet qualified and therefore not approved for use in production.
ST is not responsible for any consequences resulting from such use. In no event ST is liable
for the customer using any of these engineering samples in production. ST’s Quality
department must be contacted to run a qualification activity prior to any decision to use
these engineering samples.

DB3819 Rev 1 11/13

13
Revision history L9369

3 Revision history

Table 5. Document revision history

Date Revision Changes

11-Jan-2019 1 Initial release.

12/13 DB3819 Rev 1

L9369

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DB3819 Rev 1 13/13

13
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