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Manual
750-306
TM
DeviceNet Fieldbus Coupler
125 Kbaud ... 500 Kbaud; digital and analog signals
Version 2.0.0
2 WAGO-I/O-SYSTEM 750
TM
750-306 DeviceNet Fieldbus Coupler
Hansastraße 27
D-32423 Minden
E-Mail: info@wago.com
Web: http://www.wago.com
Technical Support
E-Mail: support@wago.com
Every conceivable measure has been taken to ensure the accuracy and
completeness of this documentation. However, as errors can never be fully
excluded, we always appreciate any information or suggestions for improving the
documentation.
E-Mail: documentation@wago.com
We wish to point out that the software and hardware terms as well as the
trademarks of companies used and/or mentioned in the present manual are
generally protected by trademark or patent.
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WAGO-I/O-SYSTEM 750 Table of Contents 3
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Table of Contents
1 Notes about this Documentation ................................................................. 7
1.1 Validity of this Documentation ................................................................. 7
1.2 Copyright................................................................................................... 7
1.3 Symbols ..................................................................................................... 8
1.4 Number Notation ..................................................................................... 10
1.5 Font Conventions .................................................................................... 10
2 Important Notes ......................................................................................... 11
2.1 Legal Bases ............................................................................................. 11
2.1.1 Subject to Changes ............................................................................. 11
2.1.2 Personnel Qualifications ..................................................................... 11
2.1.3 Use of the WAGO-I/O-SYSTEM 750 in Compliance with Underlying
Provisions ........................................................................................... 11
2.1.4 Technical Condition of Specified Devices ......................................... 12
2.2 Safety Advice (Precautions) .................................................................... 13
3 System Description..................................................................................... 15
3.1 Manufacturing Number ........................................................................... 16
3.2 Component Update.................................................................................. 17
3.3 Storage, Assembly and Transport ........................................................... 17
3.4 Assembly Guidelines/Standards.............................................................. 18
3.5 Power Supply .......................................................................................... 19
3.5.1 Isolation .............................................................................................. 19
3.5.2 System Supply .................................................................................... 20
3.5.2.1 Connection ..................................................................................... 20
3.5.2.2 Dimensioning ................................................................................. 21
3.5.3 Field Supply........................................................................................ 24
3.5.3.1 Connection ..................................................................................... 24
3.5.3.2 Fusing ............................................................................................ 26
3.5.4 Supplementary Power Supply Regulations ........................................ 29
3.5.5 Supply Example.................................................................................. 30
3.5.6 Power Supply Unit ............................................................................. 32
3.6 Grounding ............................................................................................... 33
3.6.1 Grounding the DIN Rail ..................................................................... 33
3.6.1.1 Framework Assembly .................................................................... 33
3.6.1.2 Insulated Assembly........................................................................ 33
3.6.2 Grounding Function............................................................................ 34
3.7 Shielding ................................................................................................. 35
3.7.1 General ............................................................................................... 35
3.7.2 Bus Cables .......................................................................................... 35
3.7.3 Signal Lines ........................................................................................ 36
3.7.4 WAGO Shield Connecting System .................................................... 36
4 Device Description ..................................................................................... 37
4.1 View ........................................................................................................ 38
4.2 Connectors............................................................................................... 40
4.2.1 Device Supply .................................................................................... 40
4.2.2 Fieldbus Connection ........................................................................... 41
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9 Diagnostics .................................................................................................. 74
9.1 LED Signaling ......................................................................................... 74
9.1.1 Evaluating the Fieldbus Status ........................................................... 75
9.1.2 Evaluating Node Status – I/O LED (Blink Code Table) .................... 76
9.1.3 Evaluating Power Supply Status ........................................................ 83
10 Fieldbus Communication .......................................................................... 84
10.1 DeviceNetTM ............................................................................................ 84
10.1.1 Network Structure .............................................................................. 85
10.1.1.1 Transfer Media............................................................................... 85
10.1.1.2 Cabling ........................................................................................... 86
10.1.1.3 Topology ........................................................................................ 88
10.1.1.4 Network Grounding ....................................................................... 89
10.1.1.5 Interface Modules .......................................................................... 89
10.1.2 Network Communication ................................................................... 90
10.1.2.1 Objects, Classes, Instances and Attributes .................................... 90
10.1.3 Characteristics of DeviceNetTM Devices ............................................ 91
10.1.3.1 Communication Model .................................................................. 91
10.1.3.1.1 Message Groups ........................................................................ 91
10.1.3.1.2 Message Types .......................................................................... 91
10.1.3.1.2.1 I/O Messages ........................................................................ 91
10.1.3.1.2.2 Explicit Messages ................................................................. 91
10.1.3.2 Data Exchange ............................................................................... 92
10.1.4 Process Data and Diagnostic Status ................................................... 92
10.1.4.1 Process Image ................................................................................ 92
10.1.4.1.1 Assembly Instances ................................................................... 92
10.1.5 Configuration and Parameterization Using the Object Model ........... 94
10.1.5.1 EDS Files ....................................................................................... 94
10.1.5.2 Object Model ................................................................................. 94
10.1.5.2.1 Object Classes ........................................................................... 96
10.1.5.2.1.1 Identity Class (0x01) ............................................................ 96
10.1.5.2.1.2 Message Router (0x02) ........................................................ 97
10.1.5.2.1.3 DeviceNet Object (0x03) ..................................................... 97
10.1.5.2.1.4 Assembly Object (0x04)....................................................... 98
10.1.5.2.1.5 Connection Object (0x05) .................................................. 103
10.1.5.2.1.6 Acknowledge Handler Object (0x2B) ................................ 108
10.1.5.2.1.7 Coupler Configuration Object (0x64) ................................ 108
10.1.5.2.1.8 Discrete Input Point Object (0x65) .................................... 114
10.1.5.2.1.9 Discrete Output Point Object (0x66) .................................. 115
10.1.5.2.1.10 Analog Input Point Object (0x67) ...................................... 116
10.1.5.2.1.11 Analog Output Point Object (0x68) ................................... 117
10.1.5.2.1.12 Module Configuration Object (0x80) ................................. 118
11 I/O Modules .............................................................................................. 119
11.1 Overview ............................................................................................... 119
11.2 Process Data Architecture for DeviceNetTM ......................................... 120
11.2.1 Digital Input Modules....................................................................... 120
11.2.2 Digital Output Modules .................................................................... 121
11.2.3 Analog Output Modules ................................................................... 123
11.2.4 Specialty Modules ............................................................................ 124
11.2.5 System Modules ............................................................................... 144
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1.2 Copyright
This Manual, including all figures and illustrations, is copyright-protected. Any
further use of this Manual by third parties that violate pertinent copyright
provisions is prohibited. Reproduction, translation, electronic and phototechnical
filing/archiving (e.g., photocopying) as well as any amendments require the
written consent of WAGO Kontakttechnik GmbH & Co. KG, Minden, Germany.
Non-observance will involve the right to assert damage claims.
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1.3 Symbols
Personal Injury!
Indicates a high-risk, imminently hazardous situation which, if not avoided, will
result in death or serious injury.
Personal Injury!
Indicates a moderate-risk, potentially hazardous situation which, if not avoided,
could result in death or serious injury.
Personal Injury!
Indicates a low-risk, potentially hazardous situation which, if not avoided, may
result in minor or moderate injury.
Damage to Property!
Indicates a potentially hazardous situation which, if not avoided, may result in
damage to property.
Important Note!
Indicates a potential malfunction which, if not avoided, however, will not result in
damage to property.
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Additional Information:
Refers to additional information which is not an integral part of this
documentation (e.g., the Internet).
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2 Important Notes
This section includes an overall summary of the most important safety
requirements and notes that are mentioned in each individual section. To protect
your health and prevent damage to devices as well, it is imperative to read and
carefully follow the safety guidelines.
All changes to the coupler or controller should always be carried out by qualified
personnel with sufficient skills in PLC programming.
The devices have been developed for use in an environment that meets the IP20
protection class criteria. Protection against finger injury and solid impurities up to
12.5 mm diameter is assured; protection against water damage is not ensured.
Unless otherwise specified, operation of the devices in wet and dusty
environments is prohibited.
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Please send your request for modified and new hardware or software
configurations directly to WAGO Kontakttechnik GmbH & Co. KG.
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3 System Description
The WAGO-I/O-SYSTEM 750 is a modular, fieldbus-independent input/output
system (I/O system). The configuration described here consists of a fieldbus
coupler/controller (1) and the modular I/O modules (2) for any signal shapes that
form the fieldbus node together. The end module (3) completes the node and is
required for correct operation of the fieldbus node.
The fieldbus coupler/controller exchanges process data with the respective control
via the respective fieldbus. The programmable fieldbus controllers (PFC) allow
implementation of additional PLC functions. WAGO-I/O-PRO is used to program
the fieldbus controllers according to IEC 61131-3.
I/O modules for diverse digital and analog I/O signals as well as special functions
can be connected to the fieldbus coupler/controller. The communication between
the fieldbus coupler/controller and the I/O modules is carried out via an internal
bus.
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In addition, the serial number is printed on the cover cap of the configuration and
programming interface of the fieldbus coupler/controller, so that it can also be
read when installed.
There are two serial numbers in two rows in the side marking. They are left of the
release tab. The first 10 positions in the longer row of the serial numbers contain
version and date identifications.
The row order can vary depending on the production year, only the longer row is
relevant. The back part of this and the shorter row contain internal administration
information from the manufacturer.
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This matrix makes columns available for altogether three updates to the entry of
the current update data, like production order number (NO; starting from calendar
week 13/2004), date stamp (DS), software version (SW), hardware version (HW)
and the firmware loader version (FWL, if available).
If the update of a component took place, the current version data are registered
into the columns of the matrix.
Additionally with the update of a fieldbus coupler or controller also the cover of
the configuration and programming interface of the fieldbus coupler or controller
is imprinted with the current production order number.
When assembling or repacking the components, the contacts must not be soiled or
damaged. The components must be stored and transported in appropriate
containers/packaging. Thereby, the ESD information is to be regarded.
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3.5.1 Isolation
Within the fieldbus node, there are three electrically isolated potentials:
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3.5.2.1 Connection
Figure 4: System Supply via Fieldbus Coupler/Controller (left) and via Internal System Supply
Module (right)
Table 3: Legend for Figure “System Supply via Fieldbus Coupler/Controller (left) and via Internal
System Supply Module (right)”
Position Description
1 System supply DC 24 V (-25 % … +30 %)
2 System supply 0 V
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Figure 5: System Voltage for Standard Couplers/Controllers and Extended ECO Couplers
3.5.2.2 Dimensioning
Recommendation
A stable power supply cannot always be assumed. Therefore, you should use
regulated power supplies to ensure the quality of the supply voltage.
Table 4: Alignment
Internal current Current consumption via system voltage (5 V for electronics
consumption*) of I/O modules and fieldbus coupler/controller).
Total current Available current for the I/O modules. Provided by the bus
for I/O modules*) power supply unit. See fieldbus coupler/controller and
internal system supply module
*)
See current catalog, manuals, Internet
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Example:
The internal current consumption is indicated in the technical data for each bus
terminal. In order to determine the total requirement, add together the values of all
I/O modules in the node.
Please note the aggregate current for I/O modules. It may be necessary to
supply potential!
When the sum of the internal current consumption for the I/O modules exceeds
their aggregate current, you must use a supply module with bus power supply.
Install it before the position where the permissible aggregate current would be
exceeded.
Example:
However, the fieldbus coupler can only provide 1650 mA for the I/O modules.
Consequently, an internal system supply module (750-613), e. g. in the middle of
the node, should be added.
Recommendation
Utilize the smartDESIGNER feature WAGO ProServe® software to configure
fieldbus node assembly. You can test the configuration via the integrated
plausibility check.
The maximum input current of the 24 V system supply is 500 mA. The exact
electrical consumption (I(V)) can be determined with the following formulas:
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5V I(5 V) total
Input current I(24 V) = ×
24 V η
η = 0.87
(87 % Efficiency of the power supply at nominal load 24 V)
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3.5.3.1 Connection
Sensors and actuators can be directly connected to the relevant channel of the I/O
module in 1, 2, 3 or 4 conductor connection technology. The I/O module supplies
power to the sensors and actuators. The input and output drivers of some I/O
modules require the field side supply voltage.
The fieldbus coupler/controller provides field side power (DC 24 V). In this case
it is a passive power supply without protection equipment.
Power supply modules with or without fuse holder and diagnostic capability are
available for the power supply of other field potentials (DC 24 V, AC/DC 0 …
230 V, AC 120 V, AC 230 V). The power supply modules can also be used to set
up various potential groups. The connections are connected in pairs to a power
contact.
Figure 6: Field Supply for Standard Couplers/Controllers and Extended ECO Couplers
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Table 5: Legend for Figure “Field Supply for Standard Couplers/Controllers and Extended ECO
Couplers”
Field supply
1 24 V (-15 % / +20 %)
2 0V
3 Optional ground potential
Power jumper contacts
4 Potential distribution to adjacent I/O modules
The field-side power supply is automatically derived from the power jumper
contacts when snapping an I/O module.
The current load of the power contacts must not exceed 10 A on a continual basis.
By inserting an additional power supply module, the field supply via the power
contacts is disrupted. From there a new power supply occurs which may also
contain a new voltage potential.
Re-establish the ground connection when the connection to the power jumper
contacts is disrupted!
Some I/O modules have no or very few power contacts (depending on the I/O
function). Due to this, the passing through of the relevant potential is disrupted. If
you require a field supply via power jumper contacts for subsequent I/O modules,
then you have to use a power supply module.
Note the data sheets of the I/O modules.
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3.5.3.2 Fusing
Internal fusing of the field supply is possible for various field voltages via an
appropriate power supply module.
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In order to insert or change a fuse, or to switch off the voltage in succeeding I/O
modules, the fuse holder may be pulled out. In order to do this, use a screwdriver
for example, to reach into one of the slits (one on both sides) and pull out the
holder.
After changing the fuse, the fuse carrier is pushed back into its original position.
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Alternatively, fusing can be done externally. The fuse modules of the WAGO
series 281 and 282 are suitable for this purpose.
Figure 13: Fuse Modules with Pivotable Fuse Carrier, Series 281
Figure 14: Fuse Modules with Pivotable Fuse Carrier, Series 2002
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Filter modules for 24 V supply are required for the certified operation of the
system.
Therefore, the following power supply concept must be absolutely complied with.
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Recommendation
A stable power supply cannot always be assumed everywhere. Therefore, you
should use regulated power supplies to ensure the quality of the supply voltage
(see also table “WAGO power supply units”).
For brief voltage dips, a buffer (200 µF per 1 A load current) must be provided.
The power demand must be determined individually depending on the entry point
of the field supply. All loads through field devices and I/O modules must be taken
into account. The field supply also impacts the I/O modules because the input and
output drivers of some I/O modules require the voltage of the field supply.
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3.6 Grounding
3.6.1 Grounding the DIN Rail
3.6.1.1 Framework Assembly
When setting up the framework, the carrier rail must be screwed together with the
electrically conducting cabinet or housing frame. The framework or the housing
must be grounded. The electrical connection is established via the screw. Thus,
the carrier rail is grounded.
Recommendation
The optimal setup is a metallic assembly plate with grounding connection which
is electrically conductive linked to the carrier rail.
The separate grounding of the carrier rail can be easily set up with the aid of the
WAGO ground wire terminals.
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The bottom CAGE CLAMP® connectors of the supply modules enable optional
connection of a field-side functional ground. This potential is made available to
the I/O module arranged on the right through the spring-loaded contact of the
three power contacts. Some I/O modules are equipped with a knife-edge contact
that taps this potential. This forms a potential group with regard to functional
ground with the I/O module arranged on the left.
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3.7 Shielding
3.7.1 General
Use of shielded cables reduces electromagnetic interference and thus increases
signal quality. Measurement errors, data transmission errors and interference due
to excessive voltage can be prevented.
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4 Device Description
The DeviceNetTM Fieldbus Coupler 750-306 links the WAGO-I/O-SYSTEM 750
as a slave to the DeviceNetTM fieldbus system.
This fieldbus coupler can be used for applications in mechanical and systems
engineering, as well as in the processing industry.
The fieldbus connection is made via 231 series 5-pin plug connector of the WAGO
MULTI CONNECTION SYSTEM (MCS).
The DIP switch can be used to specify baud rate and station address of the
fieldbus coupler.
In the Fieldbus Coupler, all input signals from the sensors are combined. After
connecting the Fieldbus Coupler, the Fieldbus Coupler determines which I/O
modules are on the node and creates a local process image from these. Analog and
specialty module data is sent via words and/or bytes; digital data is grouped bit-
by-bit.
The local process image is divided into two data zones containing the data
received and the data to be sent.
The process data is sent via the DeviceNetTM fieldbus to a control system for
further processing. The process output data is sent via the DeviceNetTM fieldbus.
The data of the analog modules is mapped first into the process image. The
modules are mapped in the order of their physical position after the Coupler.
The bits of the digital modules are combined into bytes and then mapped after the
analog ones in the process image. If the number of digital I/Os is greater than 8
bits, the Fieldbus Coupler automatically begins a new byte.
The fieldbus coupler supports the DeviceNetTM “Bit Strobe” function where the
function is limited to the extent that only the status byte is supplied.
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4.1 View
The view below shows the three parts of the device:
• The left side shows the fieldbus connection and a DIP switch to set both the
node ID and baud rate.
• LEDs for operation status, bus communication, error messages and
diagnostics, as well as the service interface are in the middle area.
• The right side shows the power supply unit for the system supply and for the
field supply of the attached I/O modules via power jumper contacts.
LEDs show the status of the operating voltage for the system and field
supply (jumper contacts).
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4.2 Connectors
The device supply generates the necessary voltage to power the electronics of the
device and the internal electronics of the connected I/O modules.
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Table 12: Pin Assignment for the Fieldbus Connection, Series 231 (MCS)
PIN Signal Code* Description
5 V+ red 11 V … 25 V
4 CAN_H white CAN Signal High
3 Drain shield Shield termination
2 CAN_L blue CAN Signal Low
1 V- black 0V
* TM
according to DeviceNet specification, identical to the conductors of the
DeviceNetTM cable
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For the diagnostics of the different domains fieldbus, node and supply voltage, the
LEDs can be divided into three groups:
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Table 16: Legend for Figure “Service Interface (Closed and Opened Flap)”
Number Description
1 Open closed
2 View Service Interface
The connection to the 4-pin header under the cover flap can be realized via the
communication cables with the item numbers750-920 and 750-923 or via the
WAGO radio adapter with the item number 750-921.
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The DIP switch is used to set the baud rate of the fieldbus coupler and to set the
DeviceNetTM station address (relating to DeviceNetTM, also called “MAC ID”).
The position of the individual slide switches is only evaluated when turning on the
fieldbus coupler, i.e., changes are applied when the power supply for the fieldbus
coupler is turned OFF then ON again.
The baud rate is set using slide switches 7 and 8 of the DIP switch. 3 different
baud rates are supported.
Example:
- ON
- OFF
Figure 27: Example with Baud rate Sent to 250 kBaud
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The binary significance of the individual slide switches increases in the direction
of the slide switch numbers. Slide switch 1 is used to set the lowest bit with a
significance of 20 and slide switch 6 to set the highest bit with a significance of 25.
If slide switch 1 is set to “ON”, “MAC ID” 1 is set, if slide switch 1 and 4 are set
to “ON”, “MAC ID” 9 is set ((20 + 23).
Station addresses in the range of 0 (all slide switches set to “OFF”) to 63 (all slide
switches set to “ON”) can be set for the DeviceNetTM fieldbus nodes. The station
address is set to 1 when delivered.
Example:
- ON 20 = 1
- OFF
- OFF
- ON 23 = 8
- ON 24 = 16
- OFF
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4.5.4 Supply
Table 21: Technical Data, Power Supply
Voltage via power jumper contacts 24 VDC (-15% ... +20%)
Current via power jumper contacts max. 10 ADC
Power supply efficiency typ. at nominal 87%
load
Internal current consumption 350 mA at 5 V
Current consumption via
- Power supply < 500 mA at 24 V
- CAN interface < 120 mA at 11 V
Total current for I/O modules 1650 mA at 5 V
Electrical isolation 500 V system/supply
4.5.5 Accessories
Table 22: Technical Data, Accessories
Pluggable connectors Plug connectors 231-305/010-000/050-000 for
MCS male connector (included)
Marking Miniature WSB Quick marking system
EDS Files Download via http://www.wago.com
4.5.6 Connection Type
Table 23: Technical Data – Field Wiring
Wire connection CAGE CLAMP®
Cross section 0.08 mm² … 2.5 mm², AWG 28 … 14
Stripped lengths 8 mm … 9 mm / 0.33 in
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4.6 Approvals
Conformity Marking
CULUS UL508
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BV (Bureau Veritas)
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5 Mounting
5.1 Installation Position
Along with horizontal and vertical installation, all other installation positions are
allowed.
Examples:
Exception:
The number of connected I/O modules also depends on the type of fieldbus
coupler/controller is used. For example, the maximum number of stackable I/O
modules on one PROFIBUS DP/V1 fieldbus coupler/controller is 63 with no
passive I/O modules and end module.
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Increase the total length using a coupler module for internal data bus
extension!
You can increase the total length of a fieldbus node by using a 750-628 I/O
Module (coupler module for internal data bus extension). For such a
configuration, attach a 750-627 I/O Module (end module for internal data bus
extension) after the last I/O module of a module assembly. Use an RJ-45 patch
cable to connect the I/O module to the coupler module for internal data bus
extension of another module block.
This allows you to segment a fieldbus node into a maximum of 11 blocks with
maximum of 10 I/O modules for internal data bus extension.
The maximum cable length between two blocks is five meters.
More information is available in the manuals for the 750-627 and 750-628 I/O
Modules.
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Carrier rails have different mechanical and electrical properties. For the optimal
system setup on a carrier rail, certain guidelines must be observed:
• The carrier rail must optimally support the EMC measures integrated into
the system and the shielding of the I/O module connections.
• The geometry of the carrier rail must not be altered in order to secure the
safe hold of the components. In particular, when shortening or mounting the
carrier rail, it must not be crushed or bent.
• The base of the I/O components extends into the profile of the carrier rail.
For carrier rails with a height of 7.5 mm, mounting points are to be riveted
under the node in the carrier rail (slotted head captive screws or blind
rivets).
• The medal springs on the bottom of the housing must have low-impedance
contact with the DIN rail (wide contact surface is possible).
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5.4 Spacing
The spacing between adjacent components, cable conduits, casing and frame sides
must be maintained for the complete fieldbus node.
The spacing creates room for heat transfer, installation or wiring. The spacing to
cable conduits also prevents conducted electromagnetic interferences from
influencing the operation.
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The reliable positioning and connection is made using a tongue and groove
system. Due to the automatic locking, the individual devices are securely seated
on the rail after installation.
Starting with the fieldbus coupler/controller, the I/O modules are mounted
adjacent to each other according to the project design. Errors in the design of the
node in terms of the potential groups (connection via the power contacts) are
recognized, as the I/O modules with power contacts (blade contacts) cannot be
linked to I/O modules with fewer power contacts.
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3. Use a screwdriver blade to turn the locking disc until the nose of the locking
disc engages behind the carrier rail (see the following figure). This prevents
the fieldbus coupler/controller from canting on the carrier rail.
Electrical connections for data or power contacts to adjacent I/O modules are
disconnected when removing the fieldbus coupler/controller.
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6 Connect Devices
6.1 Data Contacts/Internal Bus
Communication between the fieldbus coupler/controller and the I/O modules as
well as the system supply of the I/O modules is carried out via the internal bus. It
is comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
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Self-cleaning power jumper contacts used to supply the field side are located on
the right side of most of the fieldbus couplers/controllers and on some of the I/O
modules. These contacts come as touch-proof spring contacts. As fitting
counterparts the I/O modules have male contacts on the left side.
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If more than one conductor must be routed to one connection, these must be
connected in an up-circuit wiring assembly, for example using WAGO feed-
through terminals.
Exception:
If it is unavoidable to jointly connect 2 conductors, then you must use a ferrule to
join the wires together. The following ferrules can be used:
Length: 8 mm
Nominal cross section max.: 1 mm2 for 2 conductors with 0.5 mm2 each
WAGO product: 216-103 or products with comparable properties
1. For opening the CAGE CLAMP® insert the actuating tool into the opening
above the connection.
3. For closing the CAGE CLAMP® simply remove the tool. The conductor is
now clamped firmly in place.
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7 Function Description
7.1 Operating System
After master configuration and electrical installation of the fieldbus station, the
system is operative.
The coupler begins running up after switching on the power supply or after a
reset.
Upon initialization, the fieldbus coupler determines the I/O modules and
configuration. The 'I/O' LED flashes red. After a trouble-free start-up, the coupler
enters “Fieldbus start” mode and the 'I/O' LED lights up green.
In the event of a failure, the 'I/O' LED will blink continuously. Detailed error
messages are indicated by blinking codes; an error is indicated cyclically by up to
3 blinking sequences.
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Additional Information
For the number of input and output bits or bytes of the individual I/O modules,
refer to the corresponding description of the I/O modules.
The coupler creates an internal local process image on the basis of the data width,
the type of I/O module and the position of the module in the node. This process
image is separated into input and output data range.
The data of the digital input/output modules is bit-oriented, i.e., data is exchanged
bit by bit. The analog I/O bus modules represent all byte-oriented bus modules,
which send data byte by byte.
This group includes: counter modules, angle and distance measurement modules
and communication modules.
For both, the local input and output process image, the I/O module data is stored
in the corresponding process image depending on the order in which the modules
are connected to the coupler.
First, all the byte-oriented (analog) IO modules are filed in the process image,
then the bit-oriented (digital) IO modules. The bits of the digital modules are
grouped into bytes. If the amount of digital information exceeds 8 bits, the coupler
automatically starts with a new byte.
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For access from the network to the individual objects, connections between the
required subscribes must first be established and connection objects set up or
activated.
For a quick and easy connection, the DeviceNetTM 750-306 fieldbus coupler uses
the “Predefined Master/Slave Connection Set” in which 4 connections are already
predefined. Access to the fieldbus coupler is then possible by simply activating
(allocating) the connections.
The “Assembly Object” specifies the structure of the objects for data
transmission. With the “Assembly Object”, I/O data can be combined into blocks,
for example, and sent via a single message connection. Creating blocks requires
less traffic on the network.
An output assembly writes data to the application or pulls data from the network.
In the fieldbus coupler, various assembly instances are pre-programmed (static
assembly).
Additional Information
The assembly instances for static assembly are described in the section “Fieldbus
Communication” > … > “Process Data and Diagnostic Status” > “Assembly
Instances.”
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Data is exchanged between the fieldbus master and the I/O modules.
Access from the fieldbus side to the data is fieldbus specific.
1 The input module data can be read from the fieldbus side.
2 Likewise, data can be written to the output modules from the fieldbus side.
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7.3.3 Addressing
After turning on the power supply, the assembly object combines data from the
process image. As soon as a connection is established, a DeviceNetTM master
(scanner) can address the data with “class”, “instance” and “Attribute” and then
access it or read and/or write via I/O connections.
Additional Information
The assembly instances for static assembly are described in the section “Fieldbus
Communication” > … > “Assembly Instances.”
Additional Information
For the number of input and output bits or bytes of the individual I/O modules,
please refer to their corresponding descriptions.
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Take into account the process data of previous I/O modules in case of an
expansion!
If a node is changed or expanded, this may result in a new process image
structure. In this case, the process data addresses also change. In case of an
expansion, the process data of all previous I/O modules has to be taken into
account.
On delivery of the fieldbus coupler, the default setting for the static assembly is:
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8 Commissioning
This section shows a step-by-step procedure for starting up exemplarily a WAGO
fieldbus node.
Exemplary Example!
This description is exemplary and is limited here to the execution of a local start-
up of one individual DeviceNetTM fieldbus node with a non-interlaced computer
running Windows.
For start-up, three steps are necessary. The description of these work steps can be
found in the corresponding following sections.
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24V power is supplied to the fieldbus via connections V+, V- of the 5-pin
fieldbus connector (Series 231 (MCS)) from an external fieldbus power supply
unit.
The fieldbus coupler is initialized. The coupler determines the I/O module
configuration and creates a process image.
During start-up, the I/O LED (red) flashes.
If the I/O LED lights up green after a brief period, the fieldbus coupler is
operational.
If an error occurs during start-up indicated by the I/O LED flashing red, evaluate
the error code and argument and resolve the error.
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2. Set the required DeviceNet™ station address (“MAC ID”) using slide
switches 1 … 6 of the DIP switch.
Example:
Setting the station address “MAC ID” 4 (DIP 3 = ON) and baud rate 500 kBaud
(DIP 7 = OFF, DIP 8 = ON).
OFF
OFF
ON (2² = 4)
Station address
OFF
OFF
OFF
OFF
Baud rate
ON
Figure 40: Example of DIP Switch Settings
Additional Information
ESD files for the fieldbus coupler are available in the Download area on the
website http://www.wago.com.
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9 Diagnostics
9.1 LED Signaling
For on-site diagnostics, the fieldbus coupler has several LEDs that indicate the
operational status of the fieldbus coupler or the entire node (see following figure).
The diagnostics displays and their significance are explained in detail in the
following section.
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Device boot-up occurs after turning on the power supply. The I/O LED flashes
orange.
In the event of an error, the I/O LED continues to blink red. Blink codes indicate
detailed error messages. An error is indicated cyclically by up to 3 flashing
sequences.
After elimination of the error, restart the node by turning the power supply of the
device off and on again.
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• The I/O LED starts the error display with the first flashing sequence
(approx. 10 Hz).
• After the first break, the second flashing sequence starts (approx. 1 Hz):
The I/O LED blinks four times.
Error code 4 indicates “data error internal data bus”.
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• After the second break, the third flashing sequence starts (approx. 1 Hz):
The I/O LED blinks twelve times.
Error argument 12 means that the internal data bus is interrupted behind the
twelfth I/O module.
The thirteenth I/O module is either defective or has been pulled out of the
assembly.
Table 35: Blink code- table for the I/O LED signaling, error code 1
Error code 1: “Hardware and configuration error”
Error Error Description Solution
Argument
Invalid check sum in 1. Turn off the power supply for the node.
- the parameter area of 2. Replace the fieldbus coupler.
the fieldbus coupler. 3. Turn the power supply on again.
Overflow of the
1. Turn off the power for the node.
internal buffer
2. Reduce the number of I/O modules.
1 memory for the
3. Turn the power supply on again.
attached I/O
4. If the error persists, replace the fieldbus coupler.
modules.
1. Determine the faulty I/O module by first turning off the
power supply.
2. Plug the end module into the middle of the node.
3. Turn the power supply on again.
4. - LED continues to flash? -
Turn off the power supply and plug the end module into
the middle of the first half of the node (toward the
fieldbus coupler).
I/O module(s) with - LED not flashing? -
2 Turn off the power and plug the end module into the
unknown data type
middle of the second half of the node (away from the
fieldbus coupler).
5. Turn the power supply on again.
6. Repeat the procedure described in step 4 while halving
the step size until the faulty I/O module is detected.
7. Replace the faulty I/O module.
8. Inquire about a firmware update for the fieldbus coupler.
Unknown module
1. Turn off the power supply for the node.
type of the
3 2. Replace the fieldbus coupler.
Flash program
3. Turn the power supply on again.
memory
Fault when writing in 1. Turn off the power supply for the node.
4 the Flash program 2. Replace the fieldbus coupler.
memory. 3. Turn the power supply on again.
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Table 35: Blink code- table for the I/O LED signaling, error code 1
Error code 1: “Hardware and configuration error”
Error Error Description Solution
Argument
The I/O module
configuration after
AUTORESET
differs from the
1. Restart the fieldbus coupler by turning the power supply
6 configuration
off and on.
determined the last
time the fieldbus
coupler was powered
up.
Invalid hardware- 1. Turn off the power supply for the node.
8 firmware 2. Replace the fieldbus coupler.
combination. 3. Turn the power supply on again.
Fault when reading 1. Turn off the power supply for the node.
11 in the serial 2. Replace the fieldbus coupler.
EEPROM. 3. Turn the power supply on again.
Timeout during 1. Turn off the power supply for the node.
12 access on the serial 2. Replace the fieldbus coupler.
EEPROM 3. Turn the power supply on again.
Table 36: Blink Code Table for the I/O LED Signaling, Error Code 2
Error code 2: – not used –
Error Error Description Solution
Argument
1 Not used -
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Table 37: Blink Code Table for the I/O LED Signaling, Error Code 3
Error code 3: “Protocol error, internal bus”
Error Error Description Solution
Argument
- Are passive power supply modules (750-613) located in the
node? -
1. Check that these modules are supplied correctly with
power.
2. Determine this by the state of the associated status LEDs.
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Table 38: Blink Code Table for the I/O LED Signaling, Error Code 4
Error code 4: “Physical error, internal bus”
Error Error Description Solution
Argument
1. Turn off the power supply to the node.
2. Plug in an end module behind the fieldbus coupler.
3. Turn the power supply on.
4. Observe the error argument signaled.
Table 39: Blink Code Table for the I/O LED Signaling, Error Code 5
Error code 5: “Initialization error, internal bus”
Error Error Description Solution
Argument
Error in register
1. Turn off the power supply to the node.
communication
n* 2. Replace the nth I/O module containing process data.
during internal bus
3. Turn the power supply on.
initialization
* The number of light pulses (n) indicates the position of the I/O module.
I/O modules without data are not counted (e.g., supply modules without diagnostics)
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Table 40: Blink Ccode Table for the I/O LED Signaling, Error Code 6 … 8
Error code 6 … 8: -not used-
Error Error Description Solution
Argument
- Not used
Table 41: Blink Code Table for the I/O LED Signaling, Error Code 9
Error code 9: “CPU Trap error”
Error Error Description Solution
Argument
1 Illegal Opcode
2 Stack overflow
Fault in the program sequence.
3 Stack underflow 1. Please contact the I/O Support.
4 NMI
Table 42: Blink code table for I/O LED signaling, error code 10
Error code 10: -not used-
Error Error description Remedy
argument
- not used -
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Table 43: Blink Code Table for the I/O LED Signaling, Error Code 11
Error code 11: “Error in I/O modules with gateway/mailbox functionality”
Error Error Description Remedy
Argument
Too many I/O
modules with
gateway 1. Reduce the number of gateway modules.
functionality are
plugged in
Maximum mailbox
2 1. Reduce the size of the mailbox.
size exceeded
Maximum PA size
exceeded due to
1. Reduce the data width of I/O modules with mailbox
3 connected I/O
functionality.
modules with
mailbox functionality
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10 Fieldbus Communication
10.1 DeviceNetTM
DeviceNetTM is a network concept on the device level based on the serial bus
system “Controller Area Network” (CAN). It is particularly characterized by easy
addition and removal of devices during operation. The range of devices spans
from simple light barriers to complex engine control units. DeviceNetTM is
primarily used in industrial automation and robot controllers.
The physical data link layer is defined in the CAN specification. The telegram
structure is described, but nothing is said about the application layer. DeviceNetTM
is implemented here. It describes the significance of the transmitted data defined
in the application layer. The “Open DeviceNetTM Vendor Association” (ODVA) is
the user organization for DeviceNetTM. In a specification, the ODVA devices
DeviceNetTM as a uniform application layer and specifies technical and functional
characteristics for device linking.
The devices are allowed to send messages whenever the bus is available. Each bus
node decides by itself when it wants to send data or prompts other bus nodes to
send data. Thus, communication without the bus master module is possible. Bus
conflicts are solved by assigning messages a specific priority. This priority is
defined by the CAN identifier, “Connection ID” at DeviceNetTM. The smaller the
identifier is, the higher the priority.
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Additional Information
The “Open DeviceNetTM Vendor Association” (ODVA) makes more information
available on the Internet at: http://www.odva.org.
Additional Information
“CAN in Automation” (CiA) makes documentation about CAN networks
available on the Internet at: http://www.can-cia.de.
A bus medium forms the basis for the physical implementation of a network with
DeviceNetTM.
The DeviceNetTM- bus is configured from a remote bus cable as the trunk line and
several drop lines.
• Thick Cable
For the trunk line with maximum 8 A or for networks extending over more
than 100 m.
The trunk line topology is linear, i.e., remote bus cables are not further
branched. At each end of the remote bus cable, terminating resisters are
required.
• Thin Cable
For drop lines with maximum 3 A or for networks extending less than
100 m.
One or more nodes can be connected to the drop lines, i.e., branching is
permitted here. The length of the individual drop lines is measured from the
branching point of the node and can be up to 6 m The entire length of the
drop line depends on the baud rate.
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Additional Information
The detailed specification regarding cable types is available on the Internet at:
http://www.odva.org.
In the following table, the permitted cable length is represented based on the baud
rate. A distinction is made between the maximum lengths for transmission with
thick and thin cable.
10.1.1.2 Cabling
The connection of a WAGO fieldbus node to the DeviceNetTM bus cable is made
by the included 5-pole plug, Series 231 (MCS).
Figure 44: Plug Assignment for the Fieldbus Connection, Series 231 (MCS)
For wiring with shielded cable, the connector is assigned the connections V+, V-
for the power supply and CAN_High, CAN_Low for data transmission
The 24 V field bus supply is fed by an external fieldbus network power supply.
CAN_High and CAN_Low are two physically different bus signal levels. The
cable's shielding is connected to the “drain” connection. This is terminated to PE
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Each DeviceNetTM node forms the UDiff differential voltage from the CAN_High
and CAN_Low as follows: UDiff = UCAN_High - UCAN_Low.
Use the proper terminating resistor for both ends of the bus cable!
The bus cable must have a terminating resistor of 121 Ω / ±1% / ¼ W at both ends
between CAN-High and CAN-Low to prevent reflections and transmission
problems.
This is also required for very short cable lengths.
Because the CAN bus can be designed as a 2-wire bus, bus fault management
detects a break or short circuit in a line by asymmetric operation.
Additional Information
The “CAN in Automation” (CiA) organization makes specification documents for
a CAN network available on the Internet at: http://www.can-cia.de.
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10.1.1.3 Topology
Figure 45: DeviceNetTM Network – Line Structure (Trunk Line) with Terminating Resistors
In systems with more than two stations, all nodes are wired in parallel. The nodes
are connected to the fieldbus cable (trunk line) by drop lines. This requires the bus
cable to be looped through without disruption. The maximum length of a line
branch should not exceed 6 m.
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To connect the nodes, a branching unit (“Multi-Port DeviceNetTM Tap”) has been
developed by WAGO Kontakttechnik GmbH & Co. KG. The unit allows remote
bus cables and drop lines to be connected using CAGE CLAMP® technology. A
secure and fast, as well as vibration- and corrosion-resistant connection is thereby
achieved.
810-901/000-001 Open design for connecting 2 drop lines and 2 remote bus
cables.
All devices in the network communicate at the same baud rate. The bus structure
makes it possible to couple and decouple stations or to start up the system step by
step in a non-reactive manner.
Later upgrades have no effect on stations that are already in operation. If a device
malfunctions or is added to the network, it is automatically detected.
The devices can either be powered by the DeviceNetTM bus or have their own
power supply. However, the network can only be grounded at one location. The
network is preferably grounded in the network center (surge arrestor V- and
“drain” shielding for round media) to optimize capacity and to minimize
interference.
Not permitted are ground loops via devices that are not disconnected from the
power supply. The device must either be insulated or, if that is not possible, the
power must be disconnected from the device.
Other interface modules for programmable logic controllers are also available
from other manufacturers.
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• Object
An object is an abstract representation of individual, related components
within a device. It is determined by its data or attributes, its outwardly
applied functions or services and by its defined behavior.
• Class
A class contains related components (objects) of a product organized in
instances, e.g., Identity Class, DeviceNet Class.
• Instance
An instance is composed of various variables (attributes). Different
instances of a class have the same services, the same behavior and the same
variables (attributes).
However, they can have different variable values, e.g., different
“Connection Instances”: “Explicit Message”, “Poll I/O” or “Bit-Strobe
Connection Instance”.
• Attributes
The attributes represent data provided by a device via DeviceNetTM. They
contain the current values of e.g., a configuration or input, such as “Vendor
ID”, “Device Type” or “Product Name”.
• Service
Services can be applied to classes and attributes and perform defined
actions, e.g., reading attributes or resetting a class.
• Behavior
The behavior defines how a device responds to external events, e.g.,
changed process data or as a consequence of internal events, e.g., elapsed
timers.
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• Message group 1 is used for the exchange of I/O data via I/O messages
• Message group 2 is provided for master/slave applications
• Message group 3 is used to exchange configuration data via explicit
communication links
• Message group 4 is reserved for future applications (e.g., “Offline
Connection Set”)
• I/O messages
• Explicit messages
The messages, primarily input/output data, are sent by a node and can be received
and processed by one or more nodes. No protocol data are specified in the data
field.
Explicit messages are directly transmitted from one node to the other. They
consist of a requirement and a reply. As such, services can be directly requested or
performed by a different subscriber. The data field contains, among other things,
the target address and the service identification. The format of explicit messages
is fixed. Explicit messages are used to configure devices or to create a dynamic
structure of communication links.
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Process data are exchanged between scanner and DeviceNetTM device by means
of the following three mechanisms:
• Change of Cyclic/State
Message are transmitted either cyclically by the master or the slave or in the
event of a state change.
• Bit-Strobe
All slaves are polled by the master by means of a command.
The process image is distinguished between input and output process image.
By setting the “Produced Connection Path” and the “Consumed Connection Path”
for individual I/O connections (poll, bit strobe, change of state or change of
value), the required process image can be selected.
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Structure, content and coding of the EDS files are standardized, allowing
configuration via configuration devices from various manufacturers.
The ESD file is read by the configuration software. Corresponding settings are
transmitted.
Additional Information
Refer to the software user manuals for the important entries and handling steps for
settings in the configuration.
Additional Information
The “Open DeviceNet Vendor Association” (ODVA) provides information about
the EDS files for all listed manufacturers. http://www.odva.org.
EDS and symbol files to configure the I/O modules are available under order
number 750-912 on the Internet at: http://www.wago.com.
• “Identity Object”
• “Message Router Object”
• “DeviceNet Object”
• “Connection Object”
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• “Application Object(s)”
• “Assembly Object”
• “Parameter Object”
The data types used in the object model are described below.
Ranges of input classes may overlap, ranges of output ranges classes also.
Example:
class 160 / instance 1 and 2 (USINT) = Class 166 / instance 1 (UINT) or
class 166 / instance 1 and 2 (UINT) = Class 170 / instance 1 (UDINT).
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Instance 0
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Instance 1
Services
No attributes, no services
Instance 0
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Instance 0
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Description of Instances
Instance 1
Instance 2
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Instance 3
Instance 4
Instance 5
Instance 6
Instance 7
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Instance 8
Instance 9
Instance 12
Instance 13
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Instance 14
Services
Instance Services
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Instance 0
Description of Instances
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Services
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Instance 0
Instance 1
Services
Instance 0
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Services
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Instance 0
Description of Instances
Instance 1 … 255
Services
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Instance 1 … 255
Services
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Instance 1 … 255
Services
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Instance 0
Description of Instances
Instance 1 … 255
Services
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Instance 0
Description of Instances
Instance 1 … 65
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11 I/O Modules
11.1 Overview
For modular applications with the WAGO-I/O-SYSTEM 750/753, different types
of I/O modules are available
• Specialty Modules
• System Modules
For detailed information on the I/O modules and the module variations, refer to
the manuals for the I/O modules.
You will find these manuals on the WAGO web pages under www.wago.com.
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With the DeviceNetTM fieldbus coupler, the process image uses a byte structure
(no word alignment). The internal mapping method for data greater than one byte
conforms to Intel formats.
Take into account the process data of all connected I/O modules!
Depending on the specific position of an I/O module in the fieldbus node, the
process data of all previous byte- or bit-oriented modules must be taken into
account to determine its location in the process data map.
Each input channel occupies one instance in the “Discrete Input Point Object”
(Class 0x65). I/O modules with data bits assigned by channel also occupy more
instances of this class accordingly.
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Each output channel occupies one instance in the "Discrete Output Point Object"
(Class 0x66). I/O modules with data bits assigned by channel also occupy more
instances of this class accordingly.
Some digital output modules provide additional data, e.g., status bits mapped in
the input process image. The input data of these I/O modules occupies a
corresponding number of instances in class (0x65).
For 4-channel or 8-channel digital output modules with diagnostics, the diagnostic
bits are occupied accordingly in the input process image.
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The analog input modules provide 16-bit measured data and 8 control/status bits
per channel. DeviceNetTM does not use the 8 control/status bits, however, i.e., it
does not access or evaluate them.
Therefore, only the 16-bit measured values per channel are in Intel format and
mapped by byte in the input process image for the fieldbus for the DeviceNetTM
fieldbus coupler.
If digital input modules are in the node, the analog input data is mapped first into
the input process image, followed by the digital input data.
Each input channel occupies one instance in the “Analog Input Point Object”
(Class 0x67).
Particularly interesting are I/O modules that send multiple measured values per
channel, e.g., the 1-channel analog input module 750-491 that provides two
measured values per channel.
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Therefore, only the 16-bit output values for each channel are in Intel format and
are mapped by byte in the output process image for the fieldbus with the
DeviceNetTM fieldbus coupler.
If digital output modules are in the node, the analog output data is mapped first
into the output process image, followed by the digital output data.
Each output channel occupies one instance in the “Analog Output Point Object”
(Class 0x68).
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The control byte (Control “C”) is transmitted from the coupler to the I/O module.
The status byte (Status “S”) is transmitted from the I/O module to the coupler. As
a result, it is possible to set the counter with the control byte or indicate a range
overflow/underflow with the status byte.
Additional Information
The special configuration of the respective control/status byte can be found in the
corresponding description of the I/O module. A manual with the detailed
description of each I/O module can be found on the Internet at:
http://www.wago.com.
The specialty modules represent analog I/O modules. Therefore, their process
input values also occupy one instance per channel in the “Analog Input Point
Object” (Class 0x67) and their process output values one instance per channel in
the “Analog Output Point Object” (Class 0x68).
Up/down counters
750-404, (and all versions except /000-005),
753-404, (and versions /000-003)
In the input and output process image, counter modules occupy 5 bytes of user
data: 4 data bytes and 1 additional control/status byte. The I/O module provides
32-bit counter values. 6 bytes are occupied in the process image.
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Up/down counters
750-404/000-005
In the input and output process image, counter modules occupy 5 bytes of user
data: 4 data bytes and 1 additional control/status byte. The I/O module provides
16-bit counter values for every counter. 6 bytes are occupied in the process image.
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In the input and output process image, pulse width output modules occupy 6 bytes
of user data: 4 data bytes and two additional control/status bytes. 6 bytes are
occupied in the process image.
In the input and output process image, counter modules occupy 6 bytes of user
data: 4 data bytes and two additional control/status bytes. The I/O module
provides 16-bit counter values for every counter. 6 bytes are occupied in the
process image.
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In the input and output process image, SSI transmitter interface modules occupy 4
data bytes. A total of 4 bytes are occupied in the process image.
In the input process image, SSI transmitter interface modules with status occupy 5
bytes of user data: 4 data bytes and one additional status byte. A total of 6 bytes
are occupied in the process image.
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The I/O module 750-631 occupies 5 bytes in the input process image and 3 bytes
in the output process image. 6 bytes are occupied in the process image.
1-channel mode
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2-channel mode
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In Class 0x4, Instance 0x7 of the assembly object, the analog and digital input
data occupy 6 or 12 bytes. The output data occupy 6 or 12 bytes in Class 0x4,
Instance ID 0x1.
The incremental encoder interface module occupies 5 bytes in the input process
image, or 6 bytes in cycle duration measurement operating mode, and 3 bytes in
the output process image. 6 bytes are occupied in the process image.
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In the input and output process image, the digital impulse interface module
occupies a total of 4 bytes of user data: 3 data bytes and 1 additional control/status
byte. 4 bytes are occupied in the process image.
DC drive controller
750-636
The I/O module occupies 6 bytes of input and output data in the process image.
The position data to be sent and received is stored in 4 output bytes and 4 input
bytes. 2 control/status bytes are used to control the module and drive. In addition
to the position data in the input process image, extended status information can
also be shown.
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The incremental encoder interface module appears with 6 bytes of reference data
in the input and output area of the process image, 4 data bytes and two additional
control/status bytes. 6 bytes are occupied in the process image.
RTC module
750-640
In both the input and output process image, the RTC module occupies 6 bytes of
user data: 4 data bytes and 1 additional control/status byte, as well as 1 command
byte (ID) each. Six bytes are occupied in the process image with word alignment.
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In the input and output process image, the DALI/DSI master module occupies 6
data bytes, 5 data bytes and 1 additional control/status byte. 6 bytes are occupied
in the process image.
In the input and output process image, the radio receiver I/O module occupies 4
bytes of user data: 3 data bytes and 1 additional control/status byte. However, the
3 bytes of output data are not used. 4 bytes are occupied in the process image.
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In the input and output process image, the MP bus master module occupies 8
bytes of user data: 6 data bytes and 2 additional control/status bytes. 8 bytes are
occupied in the process image.
Bluetooth® RF transceiver
750-644
The length of the process image of the Bluetooth® I/O module can be adjusted to a
fixed size of 12, 24 or 48 Byte.
It consists of one control byte (input) or one status byte (output), one empty byte,
one 6-, 12- or 18-byte overlayable mailbox (mode 2) and the Bluetooth® process
data with a size of 4 to 46 bytes.
The Bluetooth® I/O module uses between 12 to 48 bytes in the process image. The
size of the input and output process images is always the same.
The first byte contains the control/status byte; the second contains an empty byte.
Process data attach to this directly when the mailbox is hidden. When the mailbox
is visible, the first 6, 12 or 18 bytes of process data are overlaid by the mailbox
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data, depending on their size. Bytes in the area behind the optionally visible
mailbox contain basic process data. The internal structure of the Bluetooth®
process data can be found in the documentation for the Bluetooth® RF
Transceiver.
In both input and the output process image, the vibration velocity/bearing
condition monitoring VIB I/O module occupies 12 bytes of user data: 8 data bytes
and 4 additional control/status bytes. 12 bytes are occupied in the process image.
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The DALI Multi-Master module occupies a total of 24 bytes in the input and
output process image.
The DALI Multi-Master module can be operated in “Easy” mode (default) and
“Full” mode. "Easy" mode is used to transmit simply binary signals for lighting
control. Configuration or programming via DALI master module is unnecessary
in “Easy” mode.
Changes to individual bits of the process image are converted directly into DALI
commands for a pre-configured DALI network. 22 bytes of the 24-byte process
image can be used directly for switching of ECGs, groups or scenes in the Easy
mode. Switching commands are transmitted via DALI and group addresses, where
each DALI and each group address is represented by a 2-bit pair.
The structure of the process data is described in detail in the following tables.
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- Not used
-
DA = DALI address
GA = Group address
Table 156: Overview of the Output Process Image in the “Easy” mode
Input Process Image
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The process image of the LON® FTT module consists of a control/status byte and
23 bytes of bidirectional communication data that is processed by the WAGO-
I/O-PRO function block “LON_01.lib”. This function block is required for the
function of the LON® FTT module and makes a user interface available on the
control side.
In the input and output process image, serial interface modules using an
alternative data format occupy 4 bytes of user data: 3 data bytes and 1 additional
control/status byte. 4 bytes are occupied in the process image.
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In the input and output process image, serial interface modules using the standard
data format occupy 6 bytes of user data: 5 data bytes and 1 additional
control/status byte. 6 bytes are occupied in the process image.
Table 138: Input/Output Process Image of the Serial Interfaces with Standard Data Format
Input/Output Process Image
Instance Byte designation Remark
C/S Control/status byte
D0
D1
n
D2 Data bytes
D3
D4
These specialty modules represent 1 x 6 bytes and occupy 1 instance in class
(0x67) and 1 instance in class (0x68).
Table 139: Input/Output Process Image of the Serial Interface, Serial Transmission Mode
Input/Output Process Image
Instance Byte designation Remark
S0/C0 Control/status byte S0
S1/C1 Control/status byte S1
D0 Data byte 0
D1 Data byte 1
D2 Data byte 2
… …
n 8 bytes D5 Data byte 5
D6 Data byte 6
… …
24 bytes D21 Data byte 21
D22 Data byte 22
… …
48 bytes D45 Data byte 45
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Data exchange mode: The data to be sent and received is stored in up to 47 input
and output bytes. The data flow is controlled with the control/status byte.
Table 140: Input/Output Process Image of the Serial Interface, Data Exchange Mode
Input/Output Process Image
Instance Byte designation Remark
S0/C0 Control/status byte S0
D0 Data byte 0
D1 Data byte 1
D2 Data byte 2
… …
8 bytes D6 Data byte 6
n
D7 Data byte 7
… …
24 bytes D22 Data byte 22
D23 Data byte 23
… …
48 bytes D46 Data byte 46
These specialty modules represent 1 x 8, 1 x 24 or 1 x 48 bytes and occupy 1
instance in class (0x67) and 1 instance in class (0x68).
In the input and output process image, data exchange modules occupy 4 data
bytes. 4 bytes are occupied in the process image.
The image process size for the AS-interface master module is adjustable to 12, 24,
32, 40 or 48 bytes. It consists of a control or status byte, a mailbox with 0, 6, 10,
12 or 18 bytes and 0–32 bytes of AS-interface process data. The AS-interface
master module occupies 12–48 bytes in the process image.
The first byte contains the control/status byte, the second contains an empty byte.
Subsequently, mailbox data is mapped when the mailbox is permanently
superimposed (Mode 1). While in operating mode with a suppressible mailbox
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(Mode 2), the mailbox and the cyclical process data are mapped next. The
remaining bytes contain the remaining process data.
The length of the process image of the 4-channel IO-Link Master can be adjusted
to a fixed size of 4, 6, 8, 10, 12, 16, 20 or 24 bytes.
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CAN gateway
750-658
The length of the process image of the CAN Gateway module can adjusted to a
fixed size of 8, 12, 16, 20, 24, 32, 40 or 48 bytes.
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Stepper module
750-670
750-671
750-672
750-673
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750-610, -611
Power supply modules (750-610 and -611) with diagnostics provide 2 bits in the
input process image to monitor the power supply.
750-622
The binary spacer module (750-622) can operate as a 2-channel digital input
module or output module and, depending on the setting, and occupies 1, 2, 3 or 4
bits per channel.
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Figure 48: Side Marking Example for Approved I/O Modules According to ATEX and IECEx
Figure 49: Text Detail – Marking Example for Approved I/O Modules According to ATEX and
IECEx.
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Table 150: Description of Marking Example for Approved I/O Modules According to ATEX and
IECEx
Printing on Text Description
TÜV 07 ATEX 554086 X Approving authority and certificate numbers
IECEx TUN 09.0001 X
Dust
II Equipment group: All except mining
3D Category 3 (Zone 22)
Ex Explosion protection mark
tc Dc Type of protection and equipment protection
level (EPL):protection by enclosure
IIIC Explosion group of dust
T 135°C Max. surface temperature of the enclosure
(without a dust layer)
Mining
I Equipment group: Mining
M2 Category: High level of protection
Ex Explosion protection mark
d Mb Type of protection and equipment protection
level (EPL): Flameproof enclosure
I Explosion group for electrical equipment for
mines susceptible to firedamp
Gases
II Equipment group: All except mining
3G Category 3 (Zone 2)
Ex Explosion protection mark
nA Gc Type of protection and equipment protection
level (EPL): Non-sparking equipment
nC Gc Type of protection and equipment protection
level (EPL): Sparking apparatus with protected
contacts. A device which is so constructed that
the external atmosphere cannot gain access to the
interior
IIC Explosion group of gas and vapours
T4 Temperature class: Max. surface temperature
135°C
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Figure 50: Side Marking Example for Approved Ex i I/O Modules According to ATEX and
IECEx.
Figure 51: Text Detail – Marking Example for Approved Ex i I/O Modules According to ATEX
and IECEx.
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Table 151: Description of Marking Example for Approved Ex i I/O Modules According to ATEX
and IECEx
Inscription Text Description
TÜV 07 ATEX 554086 X Approving authority and certificate numbers
IECEx TUN 09.0001X
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Table 151: Description of Marking Example for Approved Ex i I/O Modules According to ATEX
and IECEx
Gases
II Equipment group: All except mining
3(1)G Category 3 (Zone 2) equipment containing a safety
device for a category 1 (Zone 0) equipment
3(2)G Category 3 (Zone 2) equipment containing a safety
device for a category 2 (Zone 1) equipment
Ex Explosion protection mark
nA Gc Type of protection and equipment protection level
(EPL): Non-sparking equipment
[ia Ga] Type of protection and equipment protection level
(EPL): associated apparatus with intrinsic safety
circuits for use in Zone 0
[ia Gb] Type of protection and equipment protection level
(EPL): associated apparatus with intrinsic safety
circuits for use in Zone 1
IIC Explosion group of gas and vapours
T4 Temperature class: Max. surface temperature 135°C
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Figure 52: Side Marking Example for I/O Modules According to NEC 500
Figure 53: Text Detail – Marking Example for Approved I/O Modules According to NEC 500
Table 152: Description of Marking Example for Approved I/O Modules According to NEC 500
Printing on Text Description
CL I Explosion protection group (condition of use
category)
DIV 2 Area of application
Grp. ABCD Explosion group (gas group)
Op temp code T4 Temperature class
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Additional Information
Proof of certification is available on request.
Also take note of the information given on the operating and assembly
instructions.
The manual, containing these special conditions for safe use, must be readily
available to the user.
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List of Figures
Figure 1: Fieldbus Node (Example) ...................................................................... 15
Figure 2: Marking Area for Serial Numbers ......................................................... 16
Figure 3: Isolation for Fieldbus Couplers/Controllers (Example)......................... 19
Figure 4: System Supply via Fieldbus Coupler/Controller (left) and via Internal
System Supply Module (right) ..................................................................... 20
Figure 5: System Voltage for Standard Couplers/Controllers and Extended ECO
Couplers ....................................................................................................... 21
Figure 6: Field Supply for Standard Couplers/Controllers and Extended ECO
Couplers ....................................................................................................... 24
Figure 7: Supply Module with Fuse Carrier (Example 750-610) ......................... 26
Figure 8: Removing the Fuse Carrier .................................................................... 27
Figure 9: Opening the Fuse Carrier ....................................................................... 27
Figure 10: Changing the Fuse ............................................................................... 27
Figure 11: Fuse Modules for Automotive Fuses, Series 282 ................................ 28
Figure 12: Fuse Modules for Automotive Fuses, Series 2006 .............................. 28
Figure 13: Fuse Modules with Pivotable Fuse Carrier, Series 281 ....................... 28
Figure 14: Fuse Modules with Pivotable Fuse Carrier, Series 2002 ..................... 28
Figure 15: Power Supply Concept......................................................................... 29
Figure 16: Supply Example for Standard Couplers/Controllers ........................... 30
Figure 17: Carrier Rail Contact (Example) ........................................................... 34
Figure 18: Cable Shield at Ground Potential......................................................... 35
Figure 19: Examples of the WAGO Shield Connecting System........................... 36
Figure 20: Application of the WAGO Shield Connecting System ....................... 36
Figure 21: View DeviceNetTM Fieldbus Coupler .................................................. 38
Figure 22: Device Supply ...................................................................................... 40
Figure 23: Fieldbus Connections, Series 231 (MCS) ............................................ 41
Figure 24: Display Elements ................................................................................. 42
Figure 25: Service Interface (Closed and Opened Flap) ....................................... 43
Figure 26: DIP Switch ........................................................................................... 44
Figure 27: Example with Baud rate Sent to 250 kBaud ........................................ 44
Figure 28: Example with Station Address Set to 25 ............................................. 45
Figure 29: Spacing................................................................................................. 55
Figure 30: Release Tab Standard Fieldbus Coupler/Controller (Example) .......... 58
Figure 31: Insert I/O Module (Example) ............................................................... 59
Figure 32: Snap the I/O Module into Place (Example) ......................................... 59
Figure 33: Removing the I/O Module (Example) ................................................. 60
Figure 34: Data Contacts ....................................................................................... 61
Figure 35: Example for the Arrangement of Power Contacts ............................... 62
Figure 36: Connecting a Conductor to a CAGE CLAMP® ................................... 63
Figure 37: Operating System ................................................................................. 64
Figure 38: Memory Areas and Data Exchange ..................................................... 67
Figure 39: Fieldbus-Specific Data Exchange ........................................................ 68
Figure 40: Example of DIP Switch Settings ......................................................... 73
Figure 41: Display Elements ................................................................................. 74
Figure 42: Node Status – I/O LED Signaling........................................................ 77
Figure 43: Error Message Coding ......................................................................... 77
Figure 44: Plug Assignment for the Fieldbus Connection, Series 231 (MCS) ...... 86
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Figure 45: DeviceNetTM Network – Line Structure (Trunk Line) with Terminating
Resistors ....................................................................................................... 88
Figure 46: DeviceNetTM Network with Cable Branches ....................................... 88
Figure 47: I/O Connection Object State .............................................................. 107
Figure 48: Side Marking Example for Approved I/O Modules According to
ATEX and IECEx ...................................................................................... 146
Figure 49: Text Detail – Marking Example for Approved I/O Modules According
to ATEX and IECEx. ................................................................................. 146
Figure 50: Side Marking Example for Approved Ex i I/O Modules According to
ATEX and IECEx. ..................................................................................... 148
Figure 51: Text Detail – Marking Example for Approved Ex i I/O Modules
According to ATEX and IECEx. ............................................................... 148
Figure 52: Side Marking Example for I/O Modules According to NEC 500 ..... 151
Figure 53: Text Detail – Marking Example for Approved I/O Modules According
to NEC 500 ................................................................................................ 151
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750-306 DeviceNet Fieldbus Coupler
List of Tables
Table 1: Number Notation ..................................................................................... 10
Table 2: Font Conventions .................................................................................... 10
Table 3: Legend for Figure “System Supply via Fieldbus Coupler/Controller (left)
and via Internal System Supply Module (right)” ......................................... 20
Table 4: Alignment ................................................................................................ 21
Table 5: Legend for Figure “Field Supply for Standard Couplers/Controllers and
Extended ECO Couplers” ............................................................................ 25
Table 6: Power Supply Modules ........................................................................... 26
Table 7: Filter Modules for 24 V Supply .............................................................. 29
Table 8: Legend for Figure “Supply Example for Fieldbus Coupler/Controller” . 31
Table 9: WAGO Power Supply Units (Selection)................................................. 32
Table 10: WAGO Ground Wire Terminals ........................................................... 33
Table 11: Legend for Figure “View DeviceNetTM Fieldbus Coupler” .................. 39
Table 12: Pin Assignment for the Fieldbus Connection, Series 231 (MCS) ......... 41
Table 13: Display Elements Fieldbus Status ......................................................... 42
Table 14: Display Elements Node Status .............................................................. 42
Table 15: Display Elements Supply Voltage ........................................................ 42
Table 16: Legend for Figure “Service Interface (Closed and Opened Flap)” ....... 43
Table 17: Setting the Baud Rate via DIP Switch .................................................. 44
Table 18: Technical Data, Device Data................................................................. 46
Table 19: Technical Data, System Data ................................................................ 46
Table 20: Technical Data, DeviceNetTM fieldbus .................................................. 46
Table 21: Technical Data, Power Supply .............................................................. 47
Table 22: Technical Data, Accessories ................................................................. 47
Table 23: Technical Data – Field Wiring .............................................................. 47
Table 24: Technical Data – Power Jumper Contacts ............................................ 47
Table 25: Technical Data – Data Contacts ............................................................ 47
Table 26: Technical Data – Climatic Environmental Conditions ......................... 48
Table 27: Technical Data – Mechanical Strength acc. to IEC 61131-2 ................ 48
Table 28: WAGO DIN Rail................................................................................... 55
Table 29: Input Process Image .............................................................................. 69
Table 30: Output Process Image ........................................................................... 70
Table 31: LED Assignment for Diagnostics ......................................................... 74
Table 32: Diagnostics – Module Status (MS) ....................................................... 75
Table 33: Diagnostics – Network Status (NS) ...................................................... 75
Table 34: Node Status Diagnostics – Solution in Event of Error .......................... 76
Table 35: Blink code- table for the I/O LED signaling, error code 1.................... 78
Table 36: Blink Code Table for the I/O LED Signaling, Error Code 2 ................ 79
Table 37: Blink Code Table for the I/O LED Signaling, Error Code 3 ................ 80
Table 38: Blink Code Table for the I/O LED Signaling, Error Code 4 ................ 81
Table 39: Blink Code Table for the I/O LED Signaling, Error Code 5 ................ 81
Table 40: Blink Ccode Table for the I/O LED Signaling, Error Code 6 … 8 ....... 82
Table 41: Blink Code Table for the I/O LED Signaling, Error Code 9 ................ 82
Table 42: Blink code table for I/O LED signaling, error code 10 ......................... 82
Table 43: Blink Code Table for the I/O LED Signaling, Error Code 11 .............. 83
Table 44: Power Supply Status Diagnostics – Solution in Event of Error ............ 83
Table 45: Maximum bus lengths dependent on preset baud rate .......................... 86
Table 46: DeviceNetTM Tap Versions ................................................................... 89
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162 List of Tables WAGO-I/O-SYSTEM 750
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Manual
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