TECHNICAL BULLETIN

ALPHA® OM-353 SOLDER PASTE

No-Clean, Low-Silver, Lead-Free, Zero-Halogen, ROL0, Ultra-Fine Feature Print &
Air Reflow Capable Solder Paste

DESCRIPTION

ALPHA OM-353 is a low silver and SAC305 capable paste designed for Type 5 (15 to 25 µm)
powder to meet market segments requiring ultra-fine features application. It has been tested to
give excellent printing performance down to 180 µm pad size dimension with a 60° angled
squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing
parameters. ALPHA OM-353 is also available in Type 4 (20 to 38 µm) powder size distribution.
ALPHA OM-353 has been shown to result in low Non-Wet-Open, Head-In-Pillow, Low Residue.
Additional testing demonstrates there is low residue spread and low flux wicking.

READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT

FEATURES & BENEFITS

• Long Stencil Life: up to 80 hours stencil life as tested per Alpha internal procedures,
engineered for consistent performance in warm/humid production climates while reducing
variations in print performance and paste dry-out
• High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: enables quality soldering of complex, high density PWB
assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170 °C
to 180 °C
• Good Coalescence under the following conditions
Alloy
Powder Size Reflow Profile (Air)
SAC305 SACX 0307
Low Soak 160 microns 170 microns
T5
High Soak 160 microns 170 microns
• Reduced Mid Chip Solder Balling, Head-in-Pillow minimizes rework and increases first
time yield
• Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn
after reflow soldering, even when using long/high thermal soaking
• Excellent Voiding Performance: Pass IPC-7095 Class 3 classification for BGA

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• Halogen Content: Zero Halogen, no halogen intentionally added

• Reliability: Pass JIS Copper Corrosion Test and all standard SIR Tests
• Safe and Environmentally Friendly: Materials comply with ROHS, TSCA, EINECS and
Halogen-free requirements (Zero-halogen, see table below)
• Low-Silver alloy availability

PRODUCT INFORMATION

Alloys: SAC305, SAC105, Sn96.5Ag3.5, SACX Plus 0307, Innolot

Powder Size: Type 4 (20 to 38 µm), Type 5 (15 to 25 µm)
Packaging Sizes: 500 gram jars, 6 inch & 12 inch cartridges
Flux Gel: Flux gel is available in 10 and 30 cc syringes for rework
applications
Lead Free: RoHS Directive EU/2015/863; amending Annex II of 2011/65/EU

NOTE 1: For other alloys, powder size and packaging sizes, contact your local Alpha Sales
Office.

HALOGEN STATUS

Halogen Standards

Standard Requirement Test Method Status

JEITA ET-7304A
< 1000 ppm Br, Cl, I, F in solder
Definition of Halogen Free Pass
material solids
Soldering Materials
Post Soldering Residues
TM EN
contain < 900 ppm each or total
IEC 612249-2-21 14582 Pass
of < 1500 ppm Br or Cl from
flame retardant source
JEDEC Post soldering residues contain
A Guideline for Defining "Low < 1000 ppm Br or Cl from flame Pass
Halogen" Electronics retardant source
Zero-Halogen: No halogenated compounds have been intentionally added to this product

ALPHA OM-353 SOLDER PASTE

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TECHNICAL DATA

Category Results Procedures/Remarks

Chemical Properties
Flux Classification ROL0 IPC J-STD-004B
Halide-free
Halide Content IPC J-STD-004B
(by I.C.), < 0.05%
Pass, No fluoride
Fluoride Spot Test JIS Z 3197:1999 8.1.4.2.4
present
Pass, Zero Halogen - EN14582, by oxygen bomb
Halogen Test No halogen combustion, Non-detectable
intentionally added (ND) at < 50 ppm

Pass, No Halides IPC J-STD-004B

Ag Chromate Test
present JIS Z 3197:1999 8.1.4.2.3

Pass, Low activity, no IPC J-STD-004B

Copper Mirror Test
breakthrough JIS Z 3197:1999 8.4.2

Pass, Low activity, no IPC J-STD-004B

Copper Corrosion Test
corrosion JIS Z 3197:1999 8.4.1
Electrical Properties
Water Extract Resistivity 11,500 ohm-cm JIS Z 3197:1999 8.1.1
Pass, ≥108 Ohms for
SIR (7 days, 40 °C/90% RH IPC J-STD-004B, IPC TM-650
7 days down to 100
12V) 2.6.3.7 (Pass ≥ 1 x 108 ohm)
µm spacing
Pass, ≥108 Ohms for IPC J-STD-004A, IPC TM-
SIR (7days, 85 °C/85%RH) 7 days down to 100 650 2.6.3.3 (Pass ≥ 1 x 108
µm spacing ohm)

JIS Electromigration (1000 JIS Z 3197:1999 8.5.4

Pass
hrs @ 85 °C/85% RH 48V) (Pass ≥ 1 x 109 ohm)
Bono Test 85 °C/85% RH
Pass Bono Test
and 50V bias

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Category Results Procedures/Remarks

Physical Properties
Color Clear, Colorless Flux Residue
Pass, Change of <1
g/mm2 over 24 hrs @ 25 IPC J-STD-005
± 2 °C and 50 ± 10% TM-650 2.4.44
Relative Humidity
Tack Life
Pass, Change of <10%
when stored at 25 ± 2 °C
JIS Z 3284 Annex 9
and 50 ± 10% Relative
Humidity

Coalescence Test – finest 160 µm

Internal Test Method
feature (SAC305, T5 powder)
IPC J-STD-005, IPC
Solder Ball Preferred
TM-650 2.4.43
Spread >80% JIS Z 3197:1999
Rhesca Test, zero cross
Wetting Time Pass, 1.6 seconds
time T0
@ 50% RH/25 °C
Stencil Life ~80 hours
(77 °C)
Pass, no bridging at 0.20
IPC J-STD-005A
Cold Slump (25 °C /50% mm gap & above
RH) Pass, no bridging at 0.20
JIS Z 3284:1994 Annex 7
mm gap & above
Pass, no bridging at 0.25
IPC J-STD-005A
mm gap & above
Hot Slump (150 °C/10min)
Pass, no bridging at 0.40
JIS Z 3284:1994 Annex 8
mm gap & above
Dryness Test (Talc) Pass JIS Z 3197:1999 8.5.1

ALPHA OM-353 SOLDER PASTE

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PROCESSING GUIDELINES

Storage &
Printing Reflow (See Fig. 1) Cleaning
Handling

1. Refrigerate to STENCIL: Recommend ATMOSPHERE: ALPHA OM-353 residue

guarantee stability @ 0 to ALPHA CUT, ALPHA Clean-dry air or is designed to remain on
10 °C (32 to 50 °F). NICKEL-CUT, ALPHA nitrogen atmosphere. the board after reflow. If
When stored under these TETRABOND, or reflowed residue cleaning
conditions, the shelf life ALPHA FORM stencils PROFILE: is required, Vigon A201
of OM-353 is 6 months. @ 0.100 mm to 0.150 Soak: 155 to 175 °C, (in line cleaning), Vigon A
mm (4 to 6 mil) thick for 60 to 100 seconds 250 (Batch Cleaning) or
2. Paste can be stored 0.4 to 0.5 mm (0.016 soak profiles have Vigon US (Ultrasonic
for 2 weeks at room inch or 0.020 inch) been determined to Cleaning) are
temperature up to 25 °C pitch. Stencil design is give optimal results, recommended. Vigon is
(77 °F) prior to use subject to many please see profile a registered trademark of
process variables. chart, ALPHA OM-353 Zestron.
3. When refrigerated, Contact your local SAC305/SACX Plus
warm up paste container Alpha Sales Rep for 0307 Typical Reflow Misprints and stencil
to room temperature for advice. Profile. If required, cleaning may be done
up to 4 hours. Paste good results are also with IPA, ALPHA SM-
must be 19 °C (66 °F) SQUEEGEE: Metal achievable with high 110E & ALPHA SM-440.
before processing. Verify (recommended) soak temperature
paste temperature with a profiles of 170 to
thermometer to ensure PRESSURE: 0.21 to 180 °C for 60 to 120
paste is at 19 °C (66 °F) 0.36 kg/cm of blade seconds, especially in
or greater before set up (1.25 to 2.0 Ibs/inch) N2. Typical peak
of printer. temperature is 235 to
SPEED: 25 to 150 245 °C.
4. Paste can be manually mm/sec (1 to 6
stirred before use. A inch/sec) NOTE 2: Keeping the
rotating/Centrifugal force peak temperature
mixing operation is not PASTE ROLL: 1.5 to below 241 ºC may
required. If a 2.0 cm diameter and reduce the number
rotating/centrifugal force make additions when and size of BGA and
mixing is used, 30 to 60 roll reaches 1 cm (0.4 QFN voids.
seconds at 300 RPM is inch) diameter (min.).
adequate. Max. roll size will NOTE 3: Refer to
depend upon blade. component and board
5. Do not remove worked supplier data for
paste from stencil and STENCIL RELEASE thermal properties at
mix with unused paste in SPEED: elevated
jar. This will alter the 5 to 20 mm/sec (0.20 to temperatures. Lower
rheology of unused 0.79 inch/sec) peak temperatures
paste. require longer TAL for
LIFT HEIGHT: 8 to 14 improved joint
mm (0.31 to 0.55 inch) cosmetics.
These are starting recommendations and all process settings should be reviewed
independently.

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REFLOW PROFILES

Fig 1: ALPHA OM-353 SAC305/SACX Plus 0307

Typical Reflow Profile (High Soak)

Fig 2: ALPHA OM-353 SAC305/SACX Plus 0307

Typical Reflow Profile (Low Soak - Preferable)

NOTE 4: These are profiles that were tested in the lab with acceptable reflow and coalescence
performance. Optimization to each board application should still be carried out by users to
ensure best results.

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RECYCLING SERVICES

We provide safe and efficient recycling services to help companies

meet their environmental and legislative requirements and at the
same time, maximize the value of their waste streams.

Our service collects solder dross, solder scrap, and various forms
of solder paste waste. Please contact your local sales
representative for recycling capabilities in your area or link here.

SAFETY & WARNING

It is recommended that the company/operator read and review the Safety Data Sheets for the
appropriate health and safety warnings before use. Safety Data Sheets are available at
MacdermidAlpha.com/assembly-solutions/knowledge-base.

CONTACT INFORMATION

To confirm this document is the most recent version, please contact

Assembly@MacDermidAlpha.com
www.macdermidalpha.com

North America Europe Asia

109 Corporate Blvd. Unit 2, Genesis Business Park 8/F., Paul Y. Centre
South Plainfield, NJ 07080, USA Albert Drive 51 Hung To Road
1.800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
44.01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE. Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800
172 020, Mexico 01800 002 1400 and (55) 5559 1588

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF
MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all
other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer
under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct,
indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies
operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product
failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold
harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to use any product in a
manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.

© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or
other countries.

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