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    Note 1: Introduction: EE669 Nanofabrication Fall 2015

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    This document provides an overview of a nanofabrication course, including discussions of Moore's law, transistor scaling, cleanroom environments, and the future of integrating electronics at the nanoscale. Key topics covered include the historical background of miniaturization, basic nanofabrication processes, and challenges of integrating billions of nanoscale components.

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    Note 1: Introduction: EE669 Nanofabrication Fall 2015

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    This document provides an overview of a nanofabrication course, including discussions of Moore's law, transistor scaling, cleanroom environments, and the future of integrating electronics at the nanoscale. Key topics covered include the historical background of miniaturization, basic nanofabrication processes, and challenges of integrating billions of nanoscale components.

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    This document provides an overview of a nanofabrication course, including discussions of Moore's law, transistor scaling, cleanroom environments, and the future of integrating electronics at the nanoscale. Key topics covered include the historical background of miniaturization, basic nanofabrication processes, and challenges of integrating billions of nanoscale components.

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    Note 1: Introduction: EE669 Nanofabrication Fall 2015

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    NehruBoda
    This document provides an overview of a nanofabrication course, including discussions of Moore's law, transistor scaling, cleanroom environments, and the future of integrating electronics at the nanoscale. Key topics covered include the historical background of miniaturization, basic nanofabrication processes, and challenges of integrating billions of nanoscale components.

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    EE669 Nanofabrication

    Fall 2015

    Note 1: Introduction

    Udayan Ganguly, IIT Bombat


    Slides have been heavily borrowed from Prof
    Edwin Kans notes at Cornell University

    Reading Assignments
    Campbell: pp. 3 8, on a resistor example
    Plummer: pp. 1 13, on semiconductor history

    Catalogue Description
    This course will give an introduction to modern nanofabrication
    technologies with emphasis on integrated circuits manufacturing.
    Thermal budget, scaling of geometry, pitch and registry and
    control of parametric yield will be used for integration guidelines.
    Physical principles and process modeling will be covered in
    lectures and labs will include a series of fabrication steps of
    lithography, metallization, plasma etching and annealing to
    produce semiconductor devices (Schottky diodes, pn junction
    diodes, MOS capacitors, and MOSFETs). Recent advances in
    nanofabrication will be briefly reviewed for their possible
    technology insertion and main integration challenges.

    The Moores Law for VLSI


    50+ years of EXPONENTIAL progresses in
    integrated circuits

    Quotable Quotes
    The technology at the leading edge changes so rapidly
    that you have to keep current after you get out of school.
    I think probably the most important thing is having good
    fundamentals.

    Gordon Moore (1929 )

    Transistor Size and Pitch


    Transistor gate half pitch is used
    to name the technology, not the
    minimum feature size. Pitch
    dictates the maximum number
    of devices in a given area, and
    hence the functional density.

    Gate
    Pitch
    Gate

    Gate

    v
    Source

    D
    S

    Drain

    v
    Source

    = half pitch
    Minimal device area = 42
    Highest function density = 1/(4 2)

    Transistor Counts

    Popular Forms of Moores Law


    1.
    2.
    3.
    4.
    5.
    6.
    7.
    8.

    Transistor count per integrated circuits


    Cost per transistor
    Functional density at minimum cost
    Electronic memory capacity (SRAM, DRAM and Flash)
    Hard disk storage cost per unit of information
    Information network capacity
    Image pixels per dollar
    The great Moores Law compensator (TGMLC): bloat by Wirth

    More
    More Moore: maintaining the Moores law for as long
    as possible.
    - Exponential growth cannot be forever, but we can delay
    eternity. -- Andy Grove

    More than Moore: apply what has been achieved by


    the Moores law to applications other than electronics
    and information.

    IT products cannot be more than 20% of the GDP.


    Biomedical sensors, network security, etc.

    The Wafer Size Increases

    300mm
    200mm
    100mm

    450mm

    Sometime the Size Matters


    450mm silicon wafers

    Chicken nugget bigger


    than your face

    All Started with a Famous Talk


    There's Plenty of Room at the Bottom
    An Invitation to Enter a New Field of Physics
    by Richard P. Feynman

    This classic talk by Richard Feynman given on December 29th


    1959 at the annual meeting of the American Physical Society at
    the California Institute of Technology (Caltech) was first
    published in the February 1960 issue of Caltech's Engineering
    and Science, which owns the copyright. It has been made
    available on the web at www.zyvex.com/nanotech/feynman.html
    with their kind permission.
    Richard Feynman was a Cornell Professor of Theoretical Physics
    1945-50. He later moved to Caltech. He won the Nobel Prize in
    Physics in 1965.

    I would like to describe a field, in which little has been


    done, but in which an enormous amount can be done in
    principle. This field is not quite the same as the others in
    that it will not tell us much of fundamental physics (in the
    sense of, ``What are the strange particles?'') but it is more
    like solid-state physics in the sense that it might tell us
    much of great interest about the strange phenomena that
    occur in complex situations. Furthermore, a point that is
    most important is that it would have an enormous number
    of technical applications.
    What I want to talk about is the problem of manipulating
    and controlling things on a small scale.

    I have estimated how many letters there are in the


    Encyclopaedia, and I have assumed that each of my 24
    million books is as big as an Encyclopaedia volume, and
    have calculated, then, how many bits of information there are
    (10^15). For each bit I allow 100 atoms. And it turns out
    that all of the information that man has carefully
    accumulated in all the books in the world can be written
    in this form in a cube of material one two-hundredth of
    an inch wide--- which is the barest piece of dust that can
    be made out by the human eye. So there is plenty of room
    at the bottom! Don't tell me about microfilm!

    On the Future of Computers


    The information cannot go any faster than the speed of
    light---so, ultimately, when our computers get faster and
    faster and more and more elaborate, we will have to make
    them smaller and smaller.
    But there is plenty of room to make them smaller. There
    is nothing that I can see in the physical laws that says the
    computer elements cannot be made enormously smaller
    than they are now. In fact, there may be certain
    advantages.

    As soon as I mention this, people tell me about miniaturization,


    and how far it has progressed today. They tell me about electric
    motors that are the size of the nail on your small finger. And there
    is a device on the market, they tell me, by which you can write the
    Lord's Prayer on the head of a pin. But that's nothing; that's the
    most primitive, halting step in the direction I intend to discuss. It is
    a staggeringly small world that is below. In the year 2000, when
    they look back at this age, they will wonder why it was not until
    the year 1960 that anybody began seriously to move in this
    direction.
    Now, this talk was given in 1959 !
    If you want to learn more about Feynman read Surely You're Joking, Mr. Feynman!": Adventures
    of a Curious Character by Edward Hutchings (Editor), Ralph Leighton, Richard Phillips
    Feynman, Albert Hibbs (Introduction) Amazon $10.47. A very, very funny book.

    Scaling and Integration

    A silicon chip with many many


    small components!!!

    Guess What This Is?


    A rock?

    A dust particle
    sitting on a
    computer line
    (magnified
    approximately 105
    or 100,000 times)

    What Is This??
    A dragon? A
    tape?
    A scratch on the
    metal surface by
    dusts or other
    contaminants
    (magnified
    200,000 times)

    And This?
    A bees nest?
    Jelly beans?
    Dirty surface after
    high temperature
    processing
    (magnified
    200,000 times)

    Take a Closer Look

    The segregated thin-film


    material (magnified
    500,000 times)

    The damaged surface


    beside a good computer
    line (line width 2m)

    Now What Is This?


    An algae
    farm? An
    alien nest?
    Surface after dirty
    solution treatment
    (magnified
    200,000 times)

    Take a Closer Look

    Lines and surfaces


    that are contaminated
    (magnified 200,000
    times)

    Broken Small Structures

    Though small
    structures are
    relatively strong,
    we still need to be
    extra careful.
    (magnified 100,000
    times)

    Good Parts (Frontend and Backend)!!


    Six layers of
    copper lines
    First metal lines
    gate
    plug

    Contact
    plugs

    S/D
    plugs

    gate
    silicon island
    Buried oxide
    in SOI (BOX)

    Transistors

    silicon substrate

    Transistors (magnified 500,000 times)

    Connecting micro-lines

    Cleanroom Suit
    Other items to avoid:
    No makeup (the color particle is
    totally bad)
    No perfume (aromatic molecules)
    No suntan lotion (especially those
    with TiO2 nanocrystals)
    No diamond ring (glove piercing)
    Avoid gold or platinum ring
    (catalyst for hydrogen)
    No regular paper (carbon black and
    inkjet are bad; whitening agent)

    Cleanroom Environment
    Something you may want to know

    Radiation
    warning
    sign

    Air is very dry (below 15%), as


    moisture carries contaminants.
    Electronics such as computer and cell
    phones are fine, actually often
    necessary (after surface cleaning), but
    pay attention to stickers.
    Pay high attention to other people
    Pay high attention to MSDS for any
    chemicals (material safety datasheet)
    Pay high attention to warnings of
    laser, X-ray, hot surface, etc.

    Electrostatic Discharge (ESD)


    Human Body Model
    Up to 20C can be on your finger
    tip on a dry day.
    Depending on the discharging
    time, the voltage spike can be >
    2,000V, sufficient to ionize air,
    and also damage small parts.

    So How Can We Integrate 1011 Parts?


    We need to be VERY careful and VERY clean.
    Size resolution (how to reach that scale) and Integration
    (how to manage the number and integral functionality)
    Manufacturing:
    parallel (like printing, photograph, and IC processes): no
    ambient temperature constraint
    exponential (like biological): always at operating temp.
    Implications on reliability
    Implications on testability

    What Have You Learned?


    Moores Law
    Scaling down and integrating up
    Nanometer is the scale when electronics meet
    microbiology
    Key aspects to large-scale integration

    Class Activity: Future of Nanofabrication


    We are using nanofabrication to build electronics
    applications today (computers, cameras, smart phones,
    etc.), what do you see as the next big application?
    Give one detailed example within that big application.
    Find your neighboring students to form groups of 3
    4 students.

    Class Activity: Which is a semiconductor


    company?
    If your starting salary is the same for company A and
    B and all other factors are the same except the cost
    structure:
    Company A: human resource cost is 70% of company
    spending.
    Company B: human resource cost is 10% of company
    spending.

    The Concepts of A Billion 109


    By counting: 1, 2, 3, even you can speak
    really fast and doing nothing else, you will
    be at least 30 years old to finish counting to a
    billion (109).
    A thousand biggest dinosaurs, brachiosaurus,
    are still shorter than a billion (109 ) ants in
    line.
    40 of your hair stacked together is about one
    millimeter (mm). A billion (109) of it can
    reach the highest plane in the sky (25km) .

    1 meter Picture

    1 meter

    The scale we
    are most
    familiar.
    (Photo courtesy from
    Powers of Ten, Scientific
    America)

    10 Times Smaller
    The size of your
    hand.

    100 Times Smaller


    You can see the
    texture of your hand
    The size of the heart
    of all modern
    electronics: a silicon
    chip

    1,000 Times Smaller


    A dot on your skin
    The size of the
    head of an ant

    10,000 (104) Times Smaller


    A dust on your
    hand will look like
    a bowling ball!!

    A dust sitting on a line

    100,000 (105) Times Smaller


    A cell under your skin
    Some
    structures
    in a silicon
    chip can
    now be
    seen.

    106 Times Smaller


    You can see the
    details on a cell
    wall.
    Detailed structures
    on silicon.

    107 Times Smaller


    Basic components
    (ion channels or
    DNA strands) in a
    cell.
    The smallest
    transistor today
    Gate
    Source
    n+

    Leff

    Drain
    n+

    108 Times Smaller


    Basic information in
    life is stored in
    double-helix DNA
    strands.
    Smallest structures we
    can define on silicon
    today

    Al2O3 nanopores

    Au Nanocrystals

    109 Times Smaller (Nano!!)


    The future:
    nanotechnology to
    join the biological
    and silicon worlds so
    that we can build and
    manipulate in the
    same scale of life.

    ??
    1.6nm

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