SRAM Presentation
SRAM Presentation
SRAM Presentation
CMOS VLSI
DESIGN
SRAM
OUTLINE
Memory Arrays
SRAM Architecture
SRAM Cell
Decoders
Column Circuitry
Multiple Ports
Slide 2
MEMORY ARRAYS
Memory Arrays
Read/Write Memory
(RAM)
(Volatile)
Static RAM
(SRAM)
Dynamic RAM
(DRAM)
Mask ROM
Programmable
ROM
(PROM)
Shift Registers
Serial In
Parallel Out
(SIPO)
Erasable
Programmable
ROM
(EPROM)
Queues
Parallel In
Serial Out
(PISO)
Electrically
Erasable
Programmable
ROM
(EEPROM)
First In
First Out
(FIFO)
Last In
First Out
(LIFO)
Flash ROM
Slide 3
ARRAY ARCHITECTURE
2n words of 2m bits each bitline conditioning
wordlines
n-k
n
memory cells:
2n-k rows x
2m+k columns
column
circuitry
k
column
decoder
2m bits
Slide 4
Slide 5
6T SRAM CELL
Cell size accounts for most of array size
Reduce cell size at expense of complexity
6T SRAM Cell
Used in most commercial chips
Data stored in cross-coupled inverters
Read:
bit
bit_b
word
Write:
Drive data onto bit, bit_b
Raise wordline
CMOS VLSI Design
SRAM
Slide 6
SRAM READ
Precharge both bitlines high
Then turn on wordline
bit_b
bit
word
P1 P2
One of the two bitlines will be pulled down byN2 the
cell N4
A
Ex: A = 0, A_b = 1
A_b
N1 N3
A_b
bit_b
1.5
Read stability
1.0
bit
word
0.5
A
0.0
0
100
200
300
time (ps)
400
500
600
Slide 7
SRAM READ
Precharge both bitlines high
Then turn on wordline
bit_b
bit
word
P1 P2
One of the two bitlines will be pulled down byN2 the
cell N4
A
Ex: A = 0, A_b = 1
A_b
N1 N3
A_b
bit_b
1.5
Read stability
1.0
bit
word
0.5
A
0.0
0
100
200
300
time (ps)
400
500
600
Slide 8
SRAM WRITE
Drive one bitline high, the other low
Then turn on wordline
bit_b
bit
word
P1 P2
N2
A
A_b
N1 N3
A_b
A
1.5
Writability
N4
bit_b
1.0
0.5
word
0.0
0
100
200
300
400
500
600
700
time (ps)
Slide 9
SRAM WRITE
Drive one bitline high, the other low
Then turn on wordline
bit_b
bit
word
P1 P2
N2
A
A_b
N1 N3
A_b
A
1.5
Writability
N4
bit_b
1.0
0.5
word
0.0
0
100
200
300
400
500
600
700
time (ps)
Slide 10
SRAM SIZING
High bitlines must not overpower inverters during
reads
bit_b
bit
weak
med
med
A
A_b
strong
Slide 11
Bitline Conditioning
Read
Write
More
Cells
More
Cells
word_q1
word_q1
SRAM Cell
bit_b_v1f
out_b_v1r
bit_v1f
bit_b_v1f
bit_v1f
SRAM Cell
write_q1
out_v1r
data_s1
1
2
word_q1
bit_v1f
out_v1r
Slide 12
SRAM
LAYOUT
Cell size is critical: 26 x 45 (even smaller in industry)
Tile cells sharing VDD, GND, bitline contacts
GND
VDD
WORD
Cell boundary
Slide 13
DECODERS
n:2n decoder consists of 2n n-input AND gates
One needed for each row of memory
Build AND from NAND or NOR gates
A1
A0
A1
Static CMOS
Pseudo-nMOS
word0
word1
A0
A1
A0
word
word0
word1
word2
word2
word3
word3
1/2
A0
A1
16
word
Slide 14
DECODER LAYOUT
Decoders must be pitch-matched to SRAM cell
Requires very skinny gates
A3
A3
A2
A2
A1
A1
A0
A0
VDD
word
GND
buffer inverter
NAND gate
Slide 15
LARGE DECODERS
A3 gates
A2
A1 become
A0
For n > 4, NAND
slow
word0
word1
word2
word3
word15
Slide 16
PREDECODING
A3
A1
A0
predecoders
1 of 4 hot
predecoded lines
word0
word1
word2
word3
word15
Slide 17
COLUMN CIRCUITRY
Some circuitry is required for each column
Bitline conditioning
Sense amplifiers
Column multiplexing
Slide 18
BITLINE CONDITIONING
Precharge
bitlines
high before reads
bit
bit_b
Equalize bitlines
to minimize voltage difference when
bit_b
Slide 19
SENSE AMPLIFIERS
Bitlines have many cells attached
Ex: 32-kbit SRAM has 256 rows x 128 cols
128 cells on each bitline
tpd (C/I) V
Even with shared diffusion contacts, 64C of diffusion capacitance
(big C)
Discharged slowly through small transistors (small I)
Slide 20
P1
P2
N1
N2
sense
bit_b
N3
Slide 21
sense_clk
regenerative
feedback
sense
sense_b
Slide 22