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    ECE Millipede

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    Virrru Narendra
    The document describes a new data storage concept called "Millipede" that uses atomic force microscopy (AFM) to achieve ultra-high density data storage at terabits per square inch. Millipede uses a microscanner and array of AFM cantilevers to write individual data bits only 40 nanometers across in a thin polymer layer. The technology offers advantages of small size, low power consumption, rewritability, and high data rates.

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    ECE Millipede

    Uploaded by

    Virrru Narendra
    47 views29 pages
    The document describes a new data storage concept called "Millipede" that uses atomic force microscopy (AFM) to achieve ultra-high density data storage at terabits per square inch. Millipede uses a microscanner and array of AFM cantilevers to write individual data bits only 40 nanometers across in a thin polymer layer. The technology offers advantages of small size, low power consumption, rewritability, and high data rates.

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    Millipede PPT

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    ECE Millipede PPT

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    The document describes a new data storage concept called "Millipede" that uses atomic force microscopy (AFM) to achieve ultra-high density data storage at terabits per square inch. Millipede uses a microscanner and array of AFM cantilevers to write individual data bits only 40 nanometers across in a thin polymer layer. The technology offers advantages of small size, low power consumption, rewritability, and high data rates.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    47 views29 pages

    ECE Millipede

    Uploaded by

    Virrru Narendra
    The document describes a new data storage concept called "Millipede" that uses atomic force microscopy (AFM) to achieve ultra-high density data storage at terabits per square inch. Millipede uses a microscanner and array of AFM cantilevers to write individual data bits only 40 nanometers across in a thin polymer layer. The technology offers advantages of small size, low power consumption, rewritability, and high data rates.

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    www.studymafia.

    org

    SEMINAR
    ON
    MILLIPEDE

    Submitted To: Submitted By:


    www.studymafia.org www.studymafia.org
    Content
    What is millipede
    The millipede concept
    Thermomechanical AFM Data Storage
    Microscanner concept
    Layout of the platform
    Visco-elastic model of bit writing Topographic image of indi
    vidual bits
    Demonstration of the new erasing scheme
    Advantages
    References
    What is millipede

     "Millipede" is a new (AFM)-based data sto


    rage concept that has a potentially ultra
    high density, terabit capacity, small for
    m factor, and high data rate.
    Millipede concept
    Highly parallel, very dense AFM data storage syst
    m
    Write one bit

    New storage medium used for writing small bits. A thi


    n writable PMMA layer is deposited on top of a Si su
    bstrate separated by a crosslinked film of epoxy photo
    resist
    Series of 40-nm data bits formed

    (a) (b)

    In a uniform array with (a) 120-nm pitch and (b) variable pitch
    2
    (>40 nm), resulting in bit area densities of up to 400 Gb/in . I
    mages obtained with a thermal read-back technique
    Read one bit

    Principle of AFM thermal sensing. The tip of the heate


    r cantilever is continuously heated by a dc power sup
    ply while the cantilever is being scanned and the heat
    er resistivity measured.
    Layout and cross section of one cantilever
    cell
    Second general

    Photograph of fabricated chip (14x7 mm2). The 32x32 cantile


    ver array is located at the center, with bond pads distributed on
    either side.
    SEM image

    SEM images of the cantilever array section with appr


    oaching and thermal sensors in the corners, array and
    single cantilever details, and tip apex.
    I/v curve of one cantilever

    The curve is nonlinear owing to the heating of the plat


    form as the power and temperature are increased. For
    doping concentrations between and
    1*10 17
    2 * ,
    1018

    at./cm3 the maximum temperature varies between 500


    ℃ and 700 ℃
    Crosstalk current
    Comparison of the I/V curve of an indepen
    dent cantilever (solid line) with the current
    response when addressing a cantilever in a
    5x5 (dotted line) or a 32x32 (dashed line)
    array with a Schottky diode serially to the
    cantilever. Little change is observed in the
    I/V curve between the different cases. Also
    shown in the inset is a sketch representing
    the direct path (thick line) and a parasitical
    path (thin line) in a cantilever-diode array.
    In the parasitical path there is always one
    diode in reverse bias that reduces the paras
    itical current.
    Tip-apex height
    Tip-apex height uniform
    ity across one cantilever
    row of the array with in
    dividual contributions fr
    om the tip height and ca
    ntilever bending.
    Microscanner concept

    Using a mobile platform and flexible posts


    Layout of the platform

    Arrangement of the coils, the interconnects and the pe


    rmanent magnets, as well as the various motions addr
    essed by the corresponding coils
    Cross section of the platform-fabrication proc
    ess

    (a) Coils are electroplated throug


    h an SU-8 resist mask, which is re
    tained as the body of the platform;
    (b) an insulator layer is deposited;
    (c) interconnects are electroplated;
    (d) the platform is released from t
    he silicon substrate
    Visco-elastic model of bit writing

    The hot tip heats a small volume of polymer material to more than Tg: the s
    hear modulus of the polymer drops drastically from GPa to MPa, which in t
    urn allows the tip to indent the polymer. In response, elastic stress (represe
    nted as compression springs) builds up in the polymer. In addition, viscous
    forces (represented as pistons) associated with the relaxation time for the lo
    cal deformation of molecular segments limit the indentation speed
    Visco-elastic model of bit writing

    At the end of the writing process, the temperature is q


    uenched on a microsecond time scale to room temper
    ature: the stressed configuration of the polymer is froz
    en-in (represented by the locked pistons)
    Visco-elastic model of bit writing

    The final bit corresponds to a metastable configuratio


    n. The original unstressed flat state of the polymer ca
    n be recovered by heating the bit volume to more than
    Tg, which unlocks the compressed springs
    Bit-writing threshold measurement
    s
    The load was controlled by pushin
    g the cantilever/tip into the sample
    with a controlled displacement and
    a known spring constant of the can
    tilever. When a certain threshold is
    reached, the indentations become v
    isible in subsequent imaging scan
    s. The solid lines are guides to the
    eye. Curves of similar shape woul
    d be expected from the time-tempe
    rature superposition principle
    Topographic image of individual bits

    (a) The region around the actual indentations clearly


    shows the three-fold symmetry of the tip, here a thre
    e-sided pyramid . (b) The indentations themselves exh
    ibit sharp edges, as can be seen from the inverted 3D i
    mage. Image size is 2 um.
    Written bits for different polymer materials

    The heating pulse length was 10 us, the load about 10 nN. The gray scale is
    the same for all images. The heater temperatures for the bit on the left-hand
    side are 445, 400, 365, and 275°C for the polymers Polysulfone, PMMA II
    (anionically polymerized PMMA, M ~ 26k), PMMA I (Polymer Standard S
    ervice (Germany) M ~ 500k), and Polystyrene, respectively. The temperatu
    re increase between events on the horizontal axis was 14, 22, 20, and 9°C, r
    espectively
    The heater temperature threshold for writing
    bits

    The heater temperature thre


    shold for writing bits with t
    he same parameters as in Fi
    g. 21 is plotted against the
    glass-transition temperature
    for these polymers includin
    g poly-a-methyl-styrene
    Section through a series of bits similar to Fig. 21

    Here, a load of about 200 nN was applied before a heating pulse of 10-us length wa
    s fired. The temperature of the heater at the end of the pulse has been increased from
    430 to 610°C in steps of about 10.6°C. (a) The load was sufficient to form a plastic i
    ndentation even if the polymer is not heated enough to come near the glass transitio
    n, (b) By increasing the heater temperature a swelling of the polymer occurs which
    works against the indentation and leads to an erasure of previously written "cold" bit
    s, (c) As this process continues, the thermomechanical formation of indentations beg
    ins to dominate until, finally, normal thermomechanical bit writing occurs.
    Indentations in a PMMA film at several distances

    The depth of the indentations is ~15 nm, about the thi


    ckness of the PMMA layer. The indentations on the le
    ft-hand side were written first, then a second series of
    indentations were made with decreasing distance to th
    e first series in going from a to e
    Demonstration of the new erasing scheme

    A bit pattern with variable pitch in the vertical axis (fa


    st scan axis) and constant pitch in the horizontal direct
    ion (slow scan axis) was prepared
    Advantages

     High storage capacity (1 Tb/in2).


     Very small form factor.
     Low power consumption (100 milliwatts).
     It is re-writeable.
     High data rate (high as 1 - 2 MB/s).
     Long-term perspectives.
    References
    28

     Google.com
     Wikipedia.org
     Studymafia.org
     Pptplanet.com
    Thanks

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