"60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D ..."

Satoshi Yoshida et al. (2012)

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DOI: 10.1587/TRANSELE.E95.C.1276

access: closed

type: Journal Article

metadata version: 2024-05-07

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Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi:
60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. IEICE Trans. Electron. 95-C(7): 1276-1284 (2012)

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