List of materials-testing resources

Material Testing

Materials (biomaterials as well as inorganic or organic materials) and devices (integrated circuits, LED, Solar cell etc.) need analysis to assess product quality, functioning, safety, reliability and toxicity. Effective materials testing covers verification of material characteristics for application trials, detection of defects, analysis of failures, improvement of new materials or conducting basic research on the theoretical strength of materials.

International Organizations For Material Testing

The following are some global organizations which are involved in setting up of "testing standards" and active research for material analysis and reliability testing.

This list is incomplete; you can help by expanding it.

• American Association of Textile Chemists and Colorists (AATCC)
• American National Standards Institute (ANSI)
• American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE)
• ASTM International
• Bundesanstalt für Materialforschung und -prüfung
• Cooper Research Technology
• Electrostatic Discharge Association [1]
• European Reference Materials
• Instron
• International Committee for Non Destructive Testing [2]
• International Organization for Standardization (ISO)
• ISTFA: Useful resources on Material, Device and Failure Analysis [3]
• Nadcap
• National Physical Laboratory (United Kingdom)
• XYZTEC
• Zwick Roell Group

Global Research Laboratories for Material Testing

Following are some international laboratories working in the area of material testing.

• Evans Analytical Group [4]
• FEI Company
• ISTI [5]
• Lucideon
• Materials Analysis and Technology
• Metallurgical Services in Mumbai, India [6]
• Micom Laboratories Inc. [7]
• Razi Metallurgical Research Center, RMRC [8]
• Rocky Mountain Laboratories [9]
• SEMATECH
• Toxicology testing [10]

See also

• List of materials analysis methods

External links

• ContractLaboratory.com
• Handbook of analytical methods for materials
• TRIM/SRIM simulations to calculate sputtering yield and deformation of a substrate bombarded by energetic ion [11]