Tantalum nitride

Tantalum nitride

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Names
Other names Tantalum mononitride
Identifiers
CAS Number	12033-62-4 Y
EC Number	234-788-4
Jmol 3D model	Interactive image
PubChem	83832
InChI InChI=1S/N.Ta
SMILES N#[Ta]
Properties
Chemical formula	TaN
Molar mass	194.955 g/mol
Appearance	black crystals
Density	14.3 g/cm3
Melting point	3,090 °C (5,590 °F; 3,360 K)
Solubility in water	insoluble
Structure
Crystal structure	Hexagonal, hP6
Space group	P-62m, No. 189
Vapor pressure	{{{value}}}
Related compounds
Other cations	Vanadium nitride Niobium nitride
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Infobox references

Tantalum nitride (TaN) is an inorganic chemical compound. It is sometimes used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.