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BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation

BOS and Intel co-promote Automotive AI solution to China and global customers at AutoShanghai 2025 event using BOS Eagle-N and Intel Malibou-lake system. ... Read

TSMC Unveils Next-Generation A14 Process at North America Technology Symposium

A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones ... Read

M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation

M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven ... Read

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture ... Read

Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions ...

Certus Semiconductor, a leading provider of custom I/O and ESD solutions, specializes in high-performance ESD solutions for many RF and high-speed interfaces, ... Read

Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions ...

Nextchip license NeuPro-M NPU to bring powerful and highly efficient AI capabilities to boost performance and capabilities of automotive safety systems ... Read

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