SN74LVC125A

www.ti.com SCAS290P JANUARY 1993 REVISED OCTOBER 2010

QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS

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1

FEATURES
Operates From 1.65 V to 3.6 V Specified From 40C to 85C and 40C to 125C Inputs Accept Voltages to 5.5 V Max tpd of 4.8 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)

D, DB, NS, OR PW PACKAGE (TOP VIEW)

1OE 1A 1Y 2OE 2A 2Y GND

1 2 3 4 5 6 7

14 13 12 11 10 9 8

VCC 4OE 4A 4Y 3OE 3A 3Y

RGY PACKAGE (TOP VIEW)

1OE

14 13 4OE 12 4A 11 4Y 10 3OE 9 3A

1A 1Y 2OE 2A 2Y

2 3 4 5 6 7 8

GND

DESCRIPTION/ORDERING INFORMATION
This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC125A features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 19932010, Texas Instruments Incorporated

3Y

VCC

SN74LVC125A
SCAS290P JANUARY 1993 REVISED OCTOBER 2010 www.ti.com

ORDERING INFORMATION
TA 40C to 85C QFN RGY SOIC D SOP NS SSOP DB TSSOP PW PACKAGE (1)
(2)

ORDERABLE PART NUMBER SN74LVC125ARGYR SN74LVC125AD SN74LVC125ADRG3 SN74LVC125ADT SN74LVC125ANSR SN74LVC125ADBR SN74LVC125APW SN74LVC125APWRG3 SN74LVC125APWT

TOP-SIDE MARKING LC125A LVC125A LVC125A LC125A LC125A

Reel of 1000 Tube of 50 Reel of 2500 Reel of 250 Reel of 2000 Reel of 2000 Tube of 90 Reel of 2000 Reel of 250

40C to 125C

(1) (2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.

Table 1. FUNCTION TABLE (EACH BUFFER)

INPUTS OE L L H A H L X OUTPUT Y H L Z

LOGIC DIAGRAM (POSITIVE LOGIC)

1OE 1A 1 2 3 3OE 1Y 3A 10 9 8

3Y

2OE 2A

4 5 6

4OE 2Y 4A

13 12 11

4Y

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Copyright 19932010, Texas Instruments Incorporated

SN74LVC125A
www.ti.com SCAS290P JANUARY 1993 REVISED OCTOBER 2010

Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)
MIN VCC VI VO IIK IOK IO Supply voltage range Input voltage range Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND D package (4) DB package (4) qJA Package thermal impedance NS package (4) PW package (4) RGY package (5) Tstg Ptot (1) (2) (3) (4) (5) (6) (7) Storage temperature range Power dissipation TA = 40C to 125C (6)
(7) (2) (3)

MAX 6.5 6.5 VCC + 0.5 50 50 50 100 86 96 76 113 47

UNIT V V V mA mA mA mA

0.5 0.5 0.5 VI < 0 VO < 0

Output voltage range (2)

C/W

65

150 500

C mW

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. For the D package: above 70C, the value of Ptot derates linearly with 8 mW/K. For the DB, NS, and PW packages: above 60C, the value of Ptot derates linearly with 5.5 mW/K.

Recommended Operating Conditions (1)

TA = 25C MIN VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 1.65 V to 1.95 V VIL VI VO Low-level input voltage Input voltage Output voltage VCC = 1.65 V IOH High-level output current VCC = 2.3 V VCC = 2.7 V VCC = 3 V VCC = 1.65 V IOL Low-level output current VCC = 2.3 V VCC = 2.7 V VCC = 3 V t/v (1) Input transition rise or fall rate VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V 0 0 1.65 1.5 0.65 VCC 1.7 2 0.35 VCC 0.7 0.8 5.5 VCC 4 8 12 24 4 8 12 24 8 0 0 MAX 3.6 40C to 85C MIN 1.65 1.5 0.65 VCC 1.7 2 0.35 VCC 0.7 0.8 5.5 VCC 4 8 12 24 4 8 12 24 8 0 0 MAX 3.6 40C to 125C MIN 1.65 1.5 0.65 VCC 1.7 2 0.35 VCC 0.7 0.8 5.5 VCC 4 8 12 24 4 8 12 24 8 ns/V mA mA V V V V MAX 3.6 UNIT V

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

Copyright 19932010, Texas Instruments Incorporated

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SN74LVC125A
SCAS290P JANUARY 1993 REVISED OCTOBER 2010 www.ti.com

Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS IOH = 100 mA IOH = 4 mA VOH IOH = 8 mA IOH = 12 mA IOH = 24 mA IOL = 100 mA IOL = 4 mA VOL IOL = 8 mA IOL = 12 mA IOL = 24 mA II IOZ ICC ICC Ci VI = 5.5 V or GND VO = VCC or GND VI = VCC or GND, IO = 0 One input at VCC 0.6 V, Other inputs at VCC or GND VI = VCC or GND VCC TA = 25C MIN 1.29 1.9 2.2 2.4 2.3 0.1 0.24 0.3 0.4 0.55 1 1 1 500 5 TYP MAX 40C to 85C MIN VCC 0.2 1.2 1.7 2.2 2.4 2.2 0.2 0.45 0.7 0.4 0.55 5 10 10 500 MAX 40C to 125C MIN VCC 0.3 1.05 1.55 2.05 2.25 2 0.3 0.6 0.75 0.6 0.8 20 20 40 5000 mA mA mA mA pF V V MAX UNIT

1.65 V to 3.6 V VCC 0.2 1.65 V 2.3 V 2.7 V 3V 3V 1.65 V to 3.6 V 1.65 V 2.3 V 2.7 V 3V 3.6 V 3.6 V 3.6 V 2.7 V to 3.6 V 3.3 V

Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER FROM (INPUT) TO (OUTPUT) VCC 1.8 V 0.15 V tpd A Y 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V 1.8 V 0.15 V ten OE Y 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V 1.8 V 0.15 V tdis OE Y 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V tsk(o) 3.3 V 0.3 V TA = 25C MIN 1 1 1 1 1 1 1 1 1 1 1 1 TYP 4.5 2.7 3 2.5 4.3 2.7 3.3 2.4 4.3 2.2 2.5 2.4 MAX 11.8 5.8 5.3 4.6 13.8 6.9 6.4 5.2 10.6 5.1 4.8 4.4 40C to 85C MIN 1 1 1 1 1 1 1 1 1 1 1 1 MAX 12.3 6.3 5.5 4.8 14.3 7.4 6.6 5.4 11.1 5.6 5 4.6 1 40C to 125C MIN 1 1 1 1 1 1 1 1 1 1 1 1 MAX 13.8 8.4 7 6 15.8 9.5 8.5 7 12.6 7.7 6.5 6 1.5 ns ns ns ns UNIT

Operating Characteristics
TA = 25C
PARAMETER TEST CONDITIONS f = 10 MHz VCC 1.8 V Cpd Power dissipation capacitance per gate 2.5 V 3.3 V TYP 7.4 11.3 15 pF UNIT

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Copyright 19932010, Texas Instruments Incorporated

SN74LVC125A
www.ti.com SCAS290P JANUARY 1993 REVISED OCTOBER 2010

PARAMETER MEASUREMENT INFORMATION

VLOAD From Output Under Test CL (see Note A) RL S1 Open GND RL TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open VLOAD GND

LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI VCC VCC 2.7 V 2.7 V tr/tf 2 ns 2 ns 2.5 ns 2.5 ns VM VCC/2 VCC/2 1.5 V 1.5 V VLOAD 2 VCC 2 VCC 6V 6V CL 30 pF 30 pF 50 pF 50 pF RL 1 k 500 500 500 V 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input tw VI Input VM VM 0V VOLTAGE WAVEFORMS PULSE DURATION VI Input tPLH Output tPHL VM VM VM VM 0V tPHL VOH VM VOL tPLH VOH Output VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) Output Control tPZL Output Waveform 1 S1 at VLOAD (see Note B) tPZH VM VM VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM VM 0V tPLZ VLOAD/2 VOL + V tPHZ VOH - V VOH 0 V VOL Data Input tsu VM th VI VM 0V VM 0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING

NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

Copyright 19932010, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2010

PACKAGING INFORMATION
Orderable Device SN74LVC125AD SN74LVC125ADBLE SN74LVC125ADBR SN74LVC125ADBRG4 SN74LVC125ADE4 SN74LVC125ADG4 SN74LVC125ADR SN74LVC125ADRE4 SN74LVC125ADRG3 SN74LVC125ADRG4 SN74LVC125ADT SN74LVC125ADTE4 SN74LVC125ADTG4 SN74LVC125ANSR SN74LVC125ANSRE4 SN74LVC125ANSRG4 SN74LVC125APW Status
(1)

Package Type Package Drawing SOIC SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SO SO SO TSSOP D DB DB DB D D D D D D D D D NS NS NS PW

Pins 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 50

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login) Purchase Samples Samples Not Available Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Request Free Samples Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Purchase Samples Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Purchase Samples

ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000 50 50 2500 2500 2500 2500 250 250 250 2000 2000 2000 90

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2010

Orderable Device SN74LVC125APWE4 SN74LVC125APWG4 SN74LVC125APWLE SN74LVC125APWR SN74LVC125APWRE4 SN74LVC125APWRG3 SN74LVC125APWRG4 SN74LVC125APWT SN74LVC125APWTE4 SN74LVC125APWTG4 SN74LVC125ARGYR SN74LVC125ARGYRG4

Status

(1)

Package Type Package Drawing TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP VQFN VQFN PW PW PW PW PW PW PW PW PW PW RGY RGY

Pins 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 90 90

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login) Purchase Samples Purchase Samples Samples Not Available Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Request Free Samples Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Purchase Samples Request Free Samples Request Free Samples

ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000 2000 2000 250 250 250 3000 3000

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2010

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC125A :

Automotive: SN74LVC125A-Q1 Enhanced Product: SN74LVC125A-EP

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SSOP SOIC SOIC SOIC SOIC SO TSSOP TSSOP TSSOP TSSOP TSSOP VQFN DB D D D D NS PW PW PW PW PW RGY 14 14 14 14 14 14 14 14 14 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 16.4 16.4 16.4 16.4 16.4 16.4 12.4 12.4 12.4 12.4 12.4 12.4 8.2 6.5 6.5 6.5 6.5 8.2 7.0 6.9 7.0 6.9 6.9 3.75

B0 (mm) 6.6 9.0 9.0 9.0 9.0 10.5 5.6 5.6 5.6 5.6 5.6 3.75

K0 (mm) 2.5 2.1 2.1 2.1 2.1 2.5 1.6 1.6 1.6 1.6 1.6 1.15

P1 (mm) 12.0 8.0 8.0 8.0 8.0 12.0 8.0 8.0 8.0 8.0 8.0 8.0

W Pin1 (mm) Quadrant 16.0 16.0 16.0 16.0 16.0 16.0 12.0 12.0 12.0 12.0 12.0 12.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

SN74LVC125ADBR SN74LVC125ADR SN74LVC125ADR SN74LVC125ADRG4 SN74LVC125ADT SN74LVC125ANSR SN74LVC125APWR SN74LVC125APWR SN74LVC125APWRG3 SN74LVC125APWRG4 SN74LVC125APWT SN74LVC125ARGYR

2000 2500 2500 2500 250 2000 2000 2000 2000 2000 250 3000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

*All dimensions are nominal

Device SN74LVC125ADBR SN74LVC125ADR SN74LVC125ADR SN74LVC125ADRG4 SN74LVC125ADT SN74LVC125ANSR SN74LVC125APWR SN74LVC125APWR SN74LVC125APWRG3 SN74LVC125APWRG4 SN74LVC125APWT SN74LVC125ARGYR

Package Type SSOP SOIC SOIC SOIC SOIC SO TSSOP TSSOP TSSOP TSSOP TSSOP VQFN

Package Drawing DB D D D D NS PW PW PW PW PW RGY

Pins 14 14 14 14 14 14 14 14 14 14 14 14

SPQ 2000 2500 2500 2500 250 2000 2000 2000 2000 2000 250 3000

Length (mm) 367.0 333.2 367.0 367.0 367.0 367.0 364.0 367.0 364.0 367.0 367.0 367.0

Width (mm) 367.0 345.9 367.0 367.0 367.0 367.0 364.0 367.0 364.0 367.0 367.0 367.0

Height (mm) 38.0 28.6 38.0 38.0 38.0 38.0 27.0 35.0 27.0 35.0 35.0 35.0

Pack Materials-Page 2

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M

PLASTIC SMALL-OUTLINE

0,25 0,09 5,60 5,00 8,20 7,40

Gage Plane 1 A 14 08 0,25 0,95 0,55

Seating Plane 2,00 MAX 0,05 MIN 0,10

PINS ** DIM A MAX

14

16

20

24

28

30

38

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30 4040065 /E 12/01

NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

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