MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS592B OCTOBER 2003 REVISED JANUARY 2004

D ESD Protection for RS-232 I/O Pins D D D D D D

15 kV Human-Body Model Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates Up To 120 kbit/s External Capacitors . . . 4 0.1 F Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Applications Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment

DB OR DW PACKAGE (TOP VIEW)

DOUT3 DOUT1 DOUT2 RIN1 ROUT1 DIN2 DIN1 GND VCC C1+ V+ C1

1 2 3 4 5 6 7 8 9 10 11 12

24 23 22 21 20 19 18 17 16 15 14 13

DOUT4 RIN2 ROUT2 DIN5 DOUT5 DIN4 DIN3 ROUT3 RIN3 V C2 C2+

description/ordering information
The MAX207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/s driver output slew rate. ORDERING INFORMATION
TA SOIC (DW) SSOP (DB) 40C to 85C SOIC (DW) PACKAGE Tube of 25 0C to 70C Reel of 2000 Reel of 2000 Tube of 25 Reel of 2000 ORDERABLE PART NUMBER MAX207CDW MAX207CDWR MAX207CDBR MAX207IDW MAX207IDWR MAX207I MAX207C MA207C TOP-SIDE MARKING

SSOP (DB) Reel of 2000 MAX207IDBR MB207I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 2004, Texas Instruments Incorporated

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

Function Tables
EACH DRIVER INPUT DIN L H OUTPUT DOUT H L

H = high level, L = low level EACH RECEIVER INPUT RIN L H Open OUTPUT ROUT H L H

H = high level, L = low level, Open = input disconnected or connected driver off

logic diagram (positive logic)

7 DIN1 6 DIN2 TTL/CMOS Inputs 18 DIN3 19 DIN4 21 DIN5 20 DOUT5 24 DOUT4 1 DOUT3 3 DOUT2 RS-232 Outputs 2 DOUT1

5 ROUT1 TTL/CMOS Outputs 22 ROUT2 17 ROUT3

4 RIN1 23 RIN2 16 RIN3

RS-232 Inputs

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS592B OCTOBER 2003 REVISED JANUARY 2004

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6 V Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC 0.3 V to 14 V Negative charge pump voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 V to 0.3 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V 0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VCC + 0.3 V Short-circuit duration: DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Package thermal impedance, JA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 63C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 4 and Figure 4)

MIN Supply voltage VIH VIL VI TA Driver high-level input voltage Driver low-level input voltage Driver input voltage Receiver input voltage MAX207C Operating free-air temperature MAX207I NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 5 V 0.5 V. DIN DIN DIN 0 30 0 40 4.5 2 0.8 5.5 30 70 85 V C NOM 5 MAX 5.5 UNIT V V V

electrical characteristics over recommended ranges of supply voltage (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER ICC Supply current No load, TEST CONDITIONS VCC = 5 V, TA = 25C MIN TYP 11 MAX 20 UNIT mA

NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 5 V 0.5 V.

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER VOH VOL IIH IIL IOS High-level output voltage Low-level output voltage High-level input current Low-level input current Short-circuit output current TEST CONDITIONS DOUT at RL = 3 k to GND, DOUT at RL = 3 k to GND, VI = VCC VI at 0 V VCC = 5.5 V, VO = 0 V DIN = GND DIN = VCC MIN 5 5 TYP 9 9 15 15 10 200 200 60 MAX UNIT V V A A mA

ro Output resistance VCC, V+, and V = 0 V, VO = 2 V 300 W All typical values are at VCC = 5 V, and TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 5 V 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER Maximum data rate tPLH (D) tPHL (D) tsk(p) SR(tr) Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Pulse skew Slew rate, transition region (see Figure 1) TEST CONDITIONS CL = 50 to 1000 pF, One DOUT switching, CL = 2500 pF, all drivers loaded, CL = 2500 pF, all drivers loaded, CL = 150 pF to 2500 pF, CL = 50 pF to 1000 pF VCC = 5 V RL = 3 k to 7 k, See Figure 1 RL = 3 k, See Figure 1 RL = 3 k, See Figure 1 RL = 3 k to 7 k, See Figure 2 RL = 3 k to 7 k, 3 MIN 120 2 2 300 6 30 TYP MAX UNIT kbit/s s s ns V/s

All typical values are at VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH tPHL| of each channel of the same device. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 5 V 0.5 V.

ESD protection
PIN DOUT, RIN Human-Body Model TEST CONDITIONS TYP 15 UNIT kV

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS592B OCTOBER 2003 REVISED JANUARY 2004

RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER VOH VOL VIT+ VIT Vhys ri High-level output voltage Low-level output voltage Positive-going input threshold voltage Negative-going input threshold voltage Input hysteresis (VIT+ VIT) Input resistance VI = 3 V to 25 V TEST CONDITIONS IOH = 1 mA IOL = 1.6 mA VCC = 5 V, VCC = 5 V, TA = 25C TA = 25C MIN 3.5 TYP VCC0.4 V 0.4 1.7 0.8 0.2 3 1.2 0.5 5 1 7 2.4 MAX UNIT V V V V V kW

All typical values are at VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 5 V 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3)
PARAMETER tPLH tPHL tsk(p) Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Pulse skew CL= 150 pF TEST CONDITIONS MIN TYP 0.5 0.5 300 MAX 10 10 UNIT s s ns

All typical values are at VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH tPHL| of each channel of the same device. NOTE 4: Test conditions are C1C4 = 0.1 F, at VCC = 5 V 0.5 V.

PARAMETER MEASUREMENT INFORMATION

Input Generator (see Note B) RS-232 Output 50 RL CL (see Note A) Output TEST CIRCUIT tPHL (D) 3V 3 V SR(tr) + 6V or t VOLTAGE WAVEFORMS PLH (D) 3V 3 V 3V 1.5 V 1.5 V 0V tPLH (D) VOH VOL

PHL (D)

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 1. Driver Slew Rate

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

PARAMETER MEASUREMENT INFORMATION
3V Generator (see Note B) RS-232 Output 50 RL CL (see Note A) Input tPHL (D) 50% VOLTAGE WAVEFORMS 1.5 V 1.5 V 0V tPLH (D) VOH Output TEST CIRCUIT 50% VOL

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 2. Driver Pulse Skew

Input Output Generator (see Note B) 50 CL (see Note A) tPHL (R) Output TEST CIRCUIT

3V 1.5 V 1.5 V 3 V tPLH (R) VOH 50% VOLTAGE WAVEFORMS 50% VOL

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 3. Receiver Propagation Delay Times

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS592B OCTOBER 2003 REVISED JANUARY 2004

APPLICATION INFORMATION
DOUT3 DOUT1 1 2 5 k 3 4 5 k 5 20 5V 400 k DIN2 6 5V 400 k DIN1 GND + 7 5V 400 k 5V 400 k 22 24 23 DOUT4 RIN2

DOUT2 RIN1

ROUT2

21

DIN5 DOUT5

ROUT1

19

DIN4

5V 400 k

18

DIN3

17

ROUT3

CBYPASS = 0.1F 5 k 9 VCC V 10 11 C1+ V+

16

RIN3 C4 = 0.1 F 16 V +

15

C3 = 0.1 F 6.3 V

C2

14 + C2 = 0.1 F 16 V

C1 = 0.1 F 6.3 V

+ 12 C1 C2+ 13

C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown.

Figure 4. Typical Operating Circuit and Capacitor Values

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SLLS592B OCTOBER 2003 REVISED JANUARY 2004

MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

APPLICATION INFORMATION capacitor selection
The capacitor type used for C1C4 is not critical for proper operation. The MAX207 requires 0.1-F capacitors, although capacitors up to 10 F can be used without harm. Ceramic dielectrics are suggested for the 0.1-F capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2) nominal value. The capacitors effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V. Use larger capacitors (up to 10 F) to reduce the output impedance at V+ and V. Bypass VCC to ground with at least 0.1 F. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1C4).

ESD protection
TI MAX207 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of 15-kV when powered down.

ESD test conditions

ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results.

Human-Body Model
The Human-Body Model (HBM) of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern, and subsequently discharged into the device under test (DUT) through a 1.5-k resistor.
RD 1.5 k

VHBM

CS 100 pF

DUT

Figure 5. HBM ESD Test Circuit

POST OFFICE BOX 655303

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MAX207 5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS592B OCTOBER 2003 REVISED JANUARY 2004

APPLICATION INFORMATION
1.5 VHBM = 2 kV DUT = 10-V, 1- Zener Diode

1.0 I DUT A 0.5 0.0

50

100 Time ns

150

200

Figure 6. Typical HBM Current Waveform

Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test no longer is as pertinent to the RS-232 pins.

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PACKAGE OPTION ADDENDUM

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11-Apr-2013

PACKAGING INFORMATION
Orderable Device MAX207CDB MAX207CDBE4 MAX207CDBG4 MAX207CDBR MAX207CDBRE4 MAX207CDBRG4 MAX207CDW MAX207CDWE4 MAX207CDWG4 MAX207CDWR MAX207CDWRE4 MAX207CDWRG4 MAX207IDB MAX207IDBE4 MAX207IDBG4 MAX207IDBR MAX207IDBRE4 Status
(1)

Package Type Package Pins Package Drawing Qty SSOP SSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SSOP SSOP SSOP SSOP SSOP DB DB DB DB DB DB DW DW DW DW DW DW DB DB DB DB DB 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 60 60 60 2000 2000 2000 25 25 25 2000 2000 2000 60 60 60 2000 2000

Eco Plan
(2)

Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp

(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85

Top-Side Markings
(4)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

MA207C MA207C MA207C MA207C MA207C MA207C MAX207C MAX207C MAX207C MAX207C MAX207C MAX207C MB207I MB207I MB207I MB207I MB207I

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device MAX207IDBRG4 MAX207IDW MAX207IDWE4 MAX207IDWG4 MAX207IDWR MAX207IDWRE4 MAX207IDWRG4

Status
(1)

Package Type Package Pins Package Drawing Qty SSOP SOIC SOIC SOIC SOIC SOIC SOIC DB DW DW DW DW DW DW 24 24 24 24 24 24 24 2000 25 25 25 2000 2000 2000

Eco Plan
(2)

Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp

(3)

Op Temp (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85

Top-Side Markings
(4)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

MB207I MAX207I MAX207I MAX207I MAX207I MAX207I MAX207I

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Addendum-Page 2

PACKAGE OPTION ADDENDUM

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11-Apr-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SSOP SOIC DW DB DW 24 24 24

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 24.4 16.4 24.4 10.75 8.2 10.75

B0 (mm) 15.7 8.8 15.7

K0 (mm) 2.7 2.5 2.7

P1 (mm) 12.0 12.0 12.0

W Pin1 (mm) Quadrant 24.0 16.0 24.0 Q1 Q1 Q1

MAX207CDWR MAX207IDBR MAX207IDWR

2000 2000 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

*All dimensions are nominal

Device MAX207CDWR MAX207IDBR MAX207IDWR

Package Type SOIC SSOP SOIC

Package Drawing DW DB DW

Pins 24 24 24

SPQ 2000 2000 2000

Length (mm) 367.0 367.0 367.0

Width (mm) 367.0 367.0 367.0

Height (mm) 45.0 38.0 45.0

Pack Materials-Page 2

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M

PLASTIC SMALL-OUTLINE

0,25 0,09 5,60 5,00 8,20 7,40

Gage Plane 1 A 14 08 0,25 0,95 0,55

Seating Plane 2,00 MAX 0,05 MIN 0,10

PINS ** DIM A MAX

14

16

20

24

28

30

38

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30 4040065 /E 12/01

NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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