Basic Electronics Definitions
Basic Electronics Definitions
Basic Electronics Definitions
Voltage - 1) the electric potential difference between two points in a circuit that will cause
an electric current to flow between these two points; 2) the electromotive pressure that
forces electric current to flow through a complete circuit; voltage is measured in volts
Current - 1) the rate of flow of electric charge through a conductor; 2) the net transfer of
electric charge per unit time; current is measured in amperes (1 ampere = 1 coulomb per
second)
Power - 1) the rate at which work is done in a circuit; 2) the amount of energy (in joules)
that a device delivers or consumes divided by the time (in seconds) that the device is
operating; 3) the product of the voltage across an electrical path and the current through it;
power is measured in watts
Circuit - 1) the complete path or closed loop through which electric current flows from the
power source to the load(s) (a load is a component or device that consumes power) and
then back to the source; 2) an electrical interconnection of power sources and electrical
loads that performs a certain electrical or electronic function
Resistance (R) - 1) the ability of an electronic component or an electrical path to resist the
flow of current; 2) the ratio of the voltage (V) across a conductor to the current (I)
flowing through it, i.e., R = V/I
Capacitance (C) - the ratio of the charge (Q) stored in a capacitor to the voltage (V) across
the capacitor, i.e., C = Q/V
Inductance - the amount of electromotive force (e.m.f.) or voltage induced within a circuit
by a change in current flowing through the circuit
Reactance - the ability of a capacitor or inductor to resist the flow of alternating current
Impedance - the ability of a circuit to resist the flow of alternating current
Parallel Connection (refer to Figure 1a) - a circuit arrangement wherein the electronic
components are connected to the power source independently of each other; in a parallel
connection, each component has the same voltage across it (but each may have a different
amount of current flowing through it)
Series Connection (refer to Figure 1b) - a circuit arrangement wherein the electronic
components are connected to each other along a single electrical path; in a series
connection, there is only one possible current path, so each component experiences the
same amount of current (but each may have a different voltage across it)
Open Circuit - a circuit that has a cut, break, or interruption, preventing current from
flowing through it; an open circuit may be due to a broken or disconnected wire, or a
damaged component that blocks current flow
Short Circuit - an unwanted or abnormal low-resistance path that causes current to bypass
a component or load; the low resistance of a short circuit can cause large amounts of
current to flow, which can result in greater damage (such as an open circuit due to
conductor burn-out)
Ground - 1) the common point of current return in a circuit; 2) the point(s) in a circuit that
is at zero volt; 3) the connection of an electrical circuit to earth; in a circuit that has a
single power supply, the ground is generally the point to which the negative terminal is
connected
Passive Components are electronic components that may be characterized as follows:
1) they do not require a power supply in order to operate;
2) they do not amplify or switch signals;
3) their behavior or basic electrical characteristics do not change with the application of
signal; and
4) they are often used for simple and basic applications such as limiting current, storing
electrical charge, filtering, suppressing current surges, timing, and tuning.
Examples of passive components are resistors, capacitors, and inductors.
Components that are not passive are referred to as 'active components'.
Resistor Value Color Coding
The color bands on a resistor indicate the resistance value of a resistor.
As shown in Figure 1, a common resistor usually has 4 color bands, the first two of which
indicates the first and second digit of its resistance value while the third band indicates the
number of zeros that follows the first two digits. The fourth band indicates the error or
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tolerance of the resistor. For example, the top resistor in Figure 1 has a resistance value of
1 kilo-ohm (10 ohms x 100) +/- 5%. Some resistors have 5 color bands to indicate their
resistance values more precisely, an example of which is the bottom resistor of Figure
1.
Figure 1. The color bands of a resistor indicate its resistance value (see Table 1)
Table 1. Resistor Color Codes (Refer to Figure 1)
Color
Black
Brown
10
Red
100
Orange
1K
Yellow
10K
Green
100K
Blue
1M
Violet
10M
Gray
100M
White
1G
Gold
0.1
5%
Silver
0.01
10%
No Color
20%
Crystal Oscillators
An oscillator is a device that produces a recurring waveform or oscillating signal, such as a
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voltage that continuously fluctuates (oscillates) between two levels. Oscillators are
generally used as timing or clocking devices in electronic circuits.
A crystal oscillator is simply an oscillator that's made of a piezoelectric crystal, a material
that generates a voltage when subjected to mechanical stress, or generates a mechanical
force when voltage is applied to it.
If electrodes are plated on opposite faces of a piezo crystal such as quartz and a potential is
applied across these electrodes, forces will be exerted on the bound charges within the
crystal, making the crystal bend. Removal of the applied voltage will make it return to its
original shape, which may generate a voltage in the process. Assuming that the device is
properly mounted, such conditions will allow the crystal to behave as an electromechanical
system that vibrates as long as it is subjected to proper electrical excitation.
Capacitance (C) is defined as the ratio of the charge (Q) stored in a capacitor to the voltage
(V) across the capacitor. Mathematically, therefore, C = Q/V. The unit of measurement for
capacitance is the 'farad', F, which is defined as coulomb/volt (coulomb and volt are the
units of measurement for charge and voltage, respectively). The higher the capacitance of a
capacitor, the greater is the charge it can store for a given voltage across it.
Figure 1. Photo of
Capacitors
Capacitors may be connected to each other to form new values of capacitance. They may
be connected in series or in parallel, as shown in Figure 2.
Equation
Remarks
Parallel Plate
Capacitance
C = [8.855(N1)kA] / d
f = frequency
where C =
capacitance (pF);
N = number of plates
k = relative dielectric
constant
A = plate area, sq. m
d = dielectric
thickness, m
Resistance (R) is defined as the ratio of the voltage (V) across a conductor to the current
(I) flowing through it. Mathematically, therefore, R = V/I, which is also known as Ohm's
Law. The unit of measurement for resistance is the 'ohm', , which is defined as
volt/ampere (volt and ampere are the units of measurement for voltage and current,
respectively). A component fabricated to exhibit nothing but a certain resistance (ideally)
is known as a resistor.
The higher the resistance, the greater is the voltage required to attain a given amount of
current flow. Resistance is therefore, as its name implies, a measure of the ability of a
conductor to resist the flow of current.
Figure 1. Photo of
Resistors
Resistance is an extrinsic property, i.e., its value is affected by characteristics that are not
inherent to the conductor, such as the conductor's dimensions. The inherent characteristic
of a material that defines its ability to resist the flow of current is known as its 'resistivity',
Figure 1. Photo of
Inductors
The unit of measurement for inductance is the 'henry', H, which is defined as volt per
ampere-sec, which is also equal to ohm-second (volt and ampere are the units of
measurement for voltage and current, respectively, while ohm is the unit of measure for
resistance). The higher the inductance, the greater is the voltage induced for a given
change in current flow. Inductance is a measure of the ability of a circuit to resist a change
in the flow of current through it.
Inductors may be connected to each other to form new values of inductance. They may be
connected in series or in parallel, as shown in Figure 2.
+ ... + -LX dI/dt, where dI/dt is the rate at which the current through the circuit changes
and Vi is the corresponding e.m.f. developed across every individual inductance Li. If
Leff is the effective inductance of the circuit, then -Leff dI/dt = -L1 dI/dt + -L2 dI/dt + ... +
-LX dI/dt, or Leff = L1 + L2 + ... + LX.
Thus, the effective self-inductance Leff of X inductors connected in series is just the sum
of their individual self-inductances, i.e., Leff = L1 + L2 + ... + LX.
When two or more inductors are connected in parallel, the voltages across each of them are
equal. However, the currents through each of them differs according to the equation: I =
1/L vdt. The total current Itotal flowing through the circuit is equal to the sum of the
individual currents flowing through each inductor. Thus, for a given circuit consisting of X
inductors connected in parallel, Itotal = 1/Leff vdt = 1/L1 vdt + 1/L2 vdt + ... + 1/LX
vdt, where Leff is the effective inductance of the entire circuit. This equation may be
simplified as follows: 1/Leff = 1/L1 + 1/L2 + ... + 1/LX.
Thus, the reciprocal of the effective self-inductance Leff of X inductors connected in
parallel is equal to the sum of the reciprocals of their individual self-inductances. i.e.,
1/Leff = 1/L1 + 1/L2 + ... + 1/LX
Inductance Equations
Table 1. Inductance Equations
Description
Equation
Remarks
where LT is the total
Equivalent Inductance
inductance, L1,
LT = L1+L2+...+LN
of Inductors in Series
L2,...,LN are the N
inductors in series
where LT is the total
Equivalent Inductance
1/LT = 1/L1+1/L2+...
inductance, L1,
of Inductors in
+1/LN
L2,...,LN are the N
Parallel
inductors in parallel
Equivalent Inductance
LT equals L1 and L2
of Two Parallel
LT = L1L2 / (L1+L2)
in parallel
Inductors
E = LI2 / 2
E = Energy (J);
Energy Storage in an
2
L = 2E / I
L = Inductance (H);
Inductor
I = sqrt(2E / L)
I = Current (A)
where L = inductance
V = LI / t
(H);
Constant Charging/
I = Vt / L
V = voltage (V)
Constant Discharging
L = Vt / I
I = current (A)
t = LI / V
t = time (s)
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where L = inductance
(H);
Instantaneous
v = voltage (V)
Charging/
v = L di/dt
i = current (A)
Instantaneous
i = 1/L vdt
di = change in current
Discharging
(A)
dt = time interval (s)
where XL =
inductive reactance;
Inductive Reactance
XL = 2fL
L = Inductance;
f = frequency
LT = total inductance
LT = L1 + L2 + 2M L1,L2 = individual
(aiding fields)
component selfMutual Inductance
LT = L1 + L2 - 2M
inductances (H)
(opposing fields)
M = mutual
inductance (H)
k = coupling
coefficient
L1,L2 = component
Coupling Coefficient k = M / (sqrt(L1L2))
inductances (H)
M = mutual
inductance (H)
L = inductance (H)
N = number of turns
in the coil
Flux Linkage in a
L = N / i
= magnetic flux
Coil
(Wb)
i = instantaneous
current (A)
A thermistor is a device that has a resistance that changes when the temperature changes.
The term 'thermistor' is a combination of the words 'thermal' and 'resistor'.
There are two types of thermistor: 1) the positive temperature coefficient (PTC) thermistor
(also known as posistor) and 2) the negative temperature coefficient (NTC) thermistor.
The basic linear relationship between the resistance and the temperature of a thermistor is
governed by the following equation: R = kT where R is the change in resistance, T is
the change in temperature, and k is the first-order temperature of coefficient of resistance.
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A PTC thermistor has a positive k while an NTC thermistor has a negative k. Thus, the
resistance of a PTC thermistor increases whenever the temperature increases, while the
resistance of an NTC thermistor decreases as the temperature increases.
Not all thermistors exhibit a linear relationship between its resistance and temperature.
Some thermistors are non-linear, i.e., they exhibit a different amount of change in
resistance for each degree of change in temperature.
Active Components are electronic components that can change their basic electrical
characteristics in a powered electrical circuit, i.e., a change in their input signal can result
in a change in their electrical behavior. Most active components today are in the form of
semiconductors.
Active components have the ability to rectify, switch, or amplify signals. Aside from the
input signal, most active components require a power supply in order to perform their
assigned functions. They are often used in dynamic applications such as rectification,
switching, amplification, modulation, etc.
Examples of active components are diodes, bipolar transistors, field effect transistors, and
thyristors.
Components that are not active are referred to as 'passive components'.
Block Diagram of the 555 Timer IC
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uncovered charges, these result in an over-all negative charge in the p-type material and an
over-all positive charge in the n-type material.
This separation of charges develops a potential across the depletion region, preventing
further diffusion of carriers across the junction. This potential, known as the potential
barrier, is about 0.6- 0.7V in a typical silicon p-n junction. A voltage greater than this
potential barrier has to be applied across the p-n junction in order to make current flow
through the junction. This characteristic of the p-n junction is the basis for the operation
of a device known as the junction diode.
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positive than its n-side by about 0.7 V. The p-side of an LED is known as an anode while
its n-side is known as a cathode.
In a semiconductor device, the charge carriers that comprise the flow of current are
electrons and holes. When an electron meets a hole during device operation, they
annihilate each other, since a hole is basically just the absence of an electron. The electron
then goes into a lower-energy state, releasing its 'excess' energy first before doing so. In
ordinary diodes, the energy released is not visible. In LED's, however, the energy released
is in the form of visible optical emissions. This is why an LED emits light during
conduction.
LED's are often used in digital indicators and signs, in decorative applications, or even for
illumination purposes. Figure 1 shows a photo of an LED (left), a photo of a car's tail light
consisting of numerous LED's (center), and the circuit symbol for an LED (right). The
LED's circuit symbol is just the symbol for a regular diode combined with arrows
signifying the emission of photons.
Symbol
AlGaAs
AlGaP
GaAsP
gallium phosphide
GaP
gallium nitride
gallium nitride w/ AlGaN
quantum barrier
GaN
Color
Red, Infrared
Green
Orange, Yellow,
Green
Red, Orange,
Yellow
Red, Yellow,
Green
Green, Blue
GaN
White
AlGaInP
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InGaN
SiC
Al2O3
ZnSe
C
AlN
AlGaN
near-UV, Blue
Blue
Blue
Blue
UV
UV
UV
LED's are often fabricated on an n-type substrate, although p-type substrates are also used
for the same purpose. Substrates that are transparent to the light emission and backed by a
reflective layer, increase the efficiency of the LED. The microchip of an LED is
encapsulated in a tough, solid plastic lens. The refractive index of the LED package must
be compatible with the semiconductor used; otherwise, the light emitted gets reflected
back into the semiconductor where it is absorbed and dissipated as heat.
Being a diode, an LED requires correct polarity (it must be forward-biased) in order to
emit light. LED's must not be subjected to large currents, since they are easily destroyed
by electrical overstress. A resistor is often connected in series with an LED to limit the
current flowing through the latter.
A zener diode is a special type of diode that is designed to conduct large currents in reverse
breakdown mode, mainly for voltage regulation purposes. A zener diode behaves like an
ordinary diode, i.e., it conducts current in only one direction and blocks current in the
other direction. Just like a regular diode, a zener diode conducts when it is forward-biased,
or when its anode is more positive than its cathode by a certain voltage. It is said to be in
reverse bias if its cathode is more positive than its anode, blocking the flow of current in
that state.
If an excessive reverse-bias voltage is applied across an ordinary diode, it goes into a
phenomenon known as 'avalanche breakdown'. Under this state, the diode starts
conducting large amounts of current even if it is in reverse bias. This phenomenon can
cause an ordinary diode to get permanently damaged. A zener diode, on the other hand, is
designed to operate in reverse-bias mode and can handle large currents when it is
conducting under reverse bias.
A zener diode is fabricated to exhibit a specified reverse bias voltage breakdown that is
much lower than that of an ordinary diode. This reverse breakdown voltage of a zener
diode is also known as its 'zener knee voltage' or simply its 'zener voltage'.
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A tunnel diode, also known as an Esaki diode, is a special type of diode that can be
operated at very high frequencies, i.e., well into the microwave frequency range. It was
invented by Leo Esaki of Tokyo Tsushin Kogyo in 1957.
A tunnel diode has this capability because it operates on the principle of electron tunneling
effect. Making use of extremely doped p-type and n-type materials, a tunnel diode
achieves very high concentrations of carriers that can interact readily without having to
pass over the junction's potential barrier. Instead, the carriers simple pass through the
potential hill. This is the electron tunneling effect mentioned earlier.
The very heavy doping of the p-n junction of a tunnel diode results in a broken bandgap,
somewhat causing the conduction band electron states on the n-side of the junction to be
aligned with the valence band hole states on the p-side.
Tunnel diodes are usually fabricated using germanium, although gallium arsenide and
silicon tunnel diodes also exist. They are used in applications such as oscillators,
amplifiers, frequency converters, and detectors.
When the forward bias voltage is initially applied in a tunnel diode, the current increases
as the filled electron states in the n-side conduction band aligns with the empty valence
band hole states in the p-side. As the voltage is further increased, these states begin to
misalign, causing the current to decrease. The current further drops as the voltage is
increased, which means that the tunnel diode is exhibiting a negative resistance under
these conditions. Increasing the voltage further eventually prevents the occurrence of
electron tunneling, causing the tunnel diode to just operate like a normal diode.
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circuit is the emitter. The common-emitter configuration, which is also known as the
'grounded-emitter' configuration, is the most widely used among the three configurations.
is basically the same as the common-emitter configuration, except that the load is in the
emitter instead of the collector. Just like in the common-emitter circuit, the current
flowing through the load when the transistor is reverse-biased is zero, with the collector
current being very small and equal to the base current. As the base current is increased,
the transistor slowly gets out of cut-off, goes into the active region, and eventually
becomes saturated. Once saturated, the voltage across the load becomes maximum, while
the voltage Vce across the collector and emitter of the transistor goes down to a very low
value, i.e., as low as a few tens of millivolts for germanium and 0.2 V for silicon
transistors.
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output voltage Vcb, while the dependent variables are the input voltage Veb and the output
current Ic. The family of input characteristic curves may therefore be described by the
function f1 wherein Veb = f1(Vcb, Ie), while the family of output curves may be described
by the function f2, wherein Ic = f2(Vcb, Ie).
The output curves corresponding to f2 are drawn with the collector-to-base voltage Vcb as
the abscissa, and the collector current Ic as the ordinate. Different output curves are
generated for different values of emitter current Ie, which are all drawn on the same plot.
Figure 1 shows an example of a common-base transistor circuit's Vcb-Ic curves for
different values of Ie.
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By applying a voltage across the source and the drain of a JFET, current consisting of
majority carriers (electrons for an n-channel and holes for a p-channel) is caused to flow
through the channel. The current flowing through the channel is controlled by applying a
gate voltage Vgs that reverse biases the p-n junction formed by the gate with respect to the
source. The higher the Vgs is, the more the p-n junction is reverse-biased, and the wider
the depletion region across the channel becomes. The wider depletion region results in a
narrower channel, consequently constricting the flow of current through the channel.
Varying Vgs therefore varies the current through the channel for any given voltage across
the source and the drain.
The JFET structure described above is no longer practical to use because of the difficulty
with having to diffuse dopants from two opposite sides of a bar. Most JFETs built onto
IC's nowadays involve single-ended geometries that require doping for the gate from only
one side of the channel, i.e., the surface of the wafer. This is achieved by building the
JFET on an epitaxially grown channel over a doped substrate that acts as the second gate.
The current through the channel of a MOSFET or JFET consists of only the majority
carriers, which is why FETs are referred to also as unipolar transistors.
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Like a bipolar transistor, the current flowing through a MOS transistor is controlled by the
input at its gate. However, unlike a bipolar transistor which is controlled by the amount of
current into its base, a MOS transistor is controlled by the voltage level at its gate.
The source and drain of a MOS transistor are created on the silicon substrate in such a way
that they are 'sandwiching' the gate. The source and drain are doped to be of the same
material type, which should be different from the doping received by the substrate. A
MOS transistor is referred to as a P-channel MOSFET, or PMOS, if the source and drain
are p-type, and the substrate is n-type. It is an N-channel MOSFET, or NMOS, if the
source and drain are n-type, and the substrate is p-type.
The area under the gate is known as the channel. The conductivity of the channel may be
controlled through the voltage level applied to the gate. For instance, in an NMOS, the
major carrier is the electron, so the channel becomes more conductive by applying a
positive voltage at the gate, which tends to attract more electrons from the substrate into
the channel. The layer formed by these attracted electrons is known as the 'inversion
layer', since electrons are the minority carriers of the p-substrate.
If the source of the NMOS is more negative than the drain while a sufficiently positive
voltage is applied to the gate, current would pass through the transistor. Removing the
positive voltage at the gate would significantly decrease the conductivity of the channel,
constricting the flow of electrons. A MOS transistor operating in this manner is known as
an enhancement-mode MOS transistor, because it is normally open and conducts only
when the channel is 'enhanced.' On the other hand, a normally conducting transistor is
known as a depletion-mode transistor, since its conduction is controlled by 'depleting' the
normally-present channel.
the diac and a corresponding decrease in the voltage across it. This conducting state
remains as long as the current flowing through the diac is higher than a current threshold
known as the diac's 'holding current.'
Once the current through a conducting diac falls below the holding current, the diac
switches back to its high-resistance or non-conducting state.
Prior to being triggered into conduction, a non-conducting diac exhibits negative
resistance. This means that increasing the voltage across a non-conducting diac will cause
the current flowing through it to decrease, as long as the breakdown voltage is not reached.
An SCR may be thought of as a rectifier whose ability to conduct current can be controlled
using a third terminal known as a 'gate'. While untriggered, an SCR will prevent any
current to flow through it, except for a very small leakage current caused by non-ideal
conditions. The SCR is triggered to turn on if the voltage across its gate and its cathode
exceeds a certain threshold level.
Once an SCR has been triggered, it will remain 'on' even if the triggering gate voltage is
removed, until the current flowing through it falls below a level known as its 'holding
current'. Thus, a conducting SCR will continue to conduct as long as the current flowing
through it is greater than the holding current. In normal AC applications, an SCR is turned
off automatically during the half-cycle wherein the voltage and current are below zero.
The p-n-p-n structure of an SCR may be modeled in terms of a PNP and an NPN transistor,
as shown in Figure 2. It can easily be seen from this diagram why an SCR remains 'on'
once triggered, even if the triggering gate voltage is removed. Applying sufficient
triggering voltage at the gate drives the NPN transistor to conduct. This, in turn, pulls
down the PNP's base voltage, causing the PNP to conduct. The conducting PNP then
supplies the base current to the NPN transistor to keep it conducting. Unless the supply of
current to the base of the NPN is cut off, the circuit will continue conducting under this 'on'
condition.
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The main terminals of a triac are often designated as 'MT1' and 'MT2', while its input
control terminal is referred to as a 'gate', as mentioned earlier. Whenever a sufficient
positive or negative voltage is applied at the gate of a triac, one of its two SCR's turn on,
causing current to flow through the triac. Which SCR is conducting at any one time
depends on the polarity of the voltage across the triac.
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The opposite of a digital signal is an analog signal, which is defined as a varying and
continuous signal.
Digital signals may be converted into analog signals and vice versa by devices known as
digital-to-analog converters (DAC's) and analog-to-digital converters (ADC's) ,
respectively.
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One of the earliest gates used in integrated circuits is a special type of RTL gate known as
the direct-coupled transistor logic (DCTL) gate. A DCTL gate is one wherein the bases of
the transistors are connected directly to inputs without any base resistors. Thus, the RTL
NOR gate shown in Figure 1 becomes a DCTL NOR gate if all the base resistors (Rb's) are
eliminated. Without the base resistors, DCTL gates are more economical and simpler to
fabricate onto integrated circuits than RTL gates with base resistors.
The main drawback of DCTL gates is that they suffer from a phenomenon known as
current hogging. Ideally, several transistors that are connected in parallel will share the
load current equally among themselves when they are all brought into saturation. In the
real world, however, the saturation points of different transistors are attained with different
levels of input voltages to the base (Vbe). As such, transistors that are in parallel and share
the same input voltage (which are commonly encountered in DCTL circuits) do not share
the load current evenly among themselves.
In fact, once the transistor with the lowest Vbesat saturates, the other transistors are
prevented from saturating themselves. This causes the saturated transistor to 'hog' the load
current, i.e., it carries the bulk of the load current whereas those transistors that were
prevented from saturating carries a minimal portion of it. Current hogging, which
prevented DCTL from becoming widely used, is largely avoided in RTL circuits simply by
retaining the base resistors.
RTL gates also exhibit limited 'fan-outs'. The fan-out of a gate is the ability of its output to
drive several other gates. The more gates it can drive, the higher is its fan-out. The fan-out
of a gate is limited by the current that its output can supply to the gate inputs connected to
it when the output is at logic '1', since at this state it must be able to drive the connected
input transistors into saturation.
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Another weakness of an RTL gate is its poor noise margin. The noise margin of a logic
gate for logic level '0', 0, is defined as the difference between the maximum input voltage
that it will recognize as a '0' (Vil) and the maximum voltage that may be applied to it as a
'0' (Vol of the driving gate connected to it). For logic level '1', the noise margin 1 is the
difference between the minimum input voltage that may be applied to it as a '1' (Voh of the
driving gate connected to it) and the minimum input voltage that it will recognize as a '1'
(Vih). Mathematically, 0 = Vil-Vol and 1 = Voh-Vih. Any noise that causes a noise
margin to be overcome will result in a '0' being erroneously read as a '1' or vice versa. In
other words, noise margin is a measure of the immunity of a gate from reading an input
logic level incorrectly.
In an RTL circuit, the collector output of the driving transistor is directly connected to the
base resistor of the driven transistor. Circuit analysis would easily show that in such an
arrangement, the differences between Vil and Vol, and between Voh and Vih, are not that
large. This is why RTL gates are known to have poor noise margins in comparison to DTL
and TTL gates.
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In the NAND gate in Figure 1, the current through diodes DA and DB will only be large
enough to drive the transistor into saturation and bring the output voltage Vo to logic '0' if
all the input diodes D1-D3 are 'off', which is true when the inputs to all of them are logic
'1'. This is because when D1-D3 are not conducting, all the current from Vcc through R
will go through DA and DB and into the base of the transistor, turning it on and pulling Vo
to near ground.
However, if any of the diodes D1-D3 gets an input voltage of logic '0', it gets forwardbiased and starts conducting. This conducting diode 'shunts' almost all the current away
from the reverse-biased DA and DB, limiting the transistor base current. This forces the
transistor to turn off, bringing up the output voltage Vo to logic '1'.
One advantage of DTL over RTL is its better noise margin. The noise margin of a logic
gate for logic level '0', 0, is defined as the difference between the maximum input voltage
that it will recognize as a '0' (Vil) and the maximum voltage that may be applied to it as a
'0' (Vol of the driving gate connected to it). For logic level '1', the noise margin 1 is the
difference between the minimum input voltage that may be applied to it as a '1' (Voh of the
driving gate connected to it) and the minimum input voltage that it will recognize as a '1'
(Vih). Mathematically, 0 = Vil-Vol and 1 = Voh-Vih. Any noise that causes a noise
margin to be overcome will result in a '0' being erroneously read as a '1' or vice versa. In
other words, noise margin is a measure of the immunity of a gate from reading an input
logic level incorrectly.
In a DTL circuit, the collector output of the driving transistor is separated from the base
resistor of the driven transistor by several diodes. Circuit analysis would easily show that
in such an arrangement, the differences between Vil and Vol, and between Voh and Vih, are
much larger than those exhibited by RTL gates, wherein the collector of the driving
transistor is directly connected to the base resistor of the driven transistor. This is why
DTL gates are known to have better noise margins than RTL gates.
35
One problem that DTL doesn't solve is its low speed, especially when the transistor is
being turned off. Turning off a saturated transistor in a DTL gate requires it to first pass
through the active region before going into cut-off. Cut-off, however, will not be reached
until the stored charge in its base has been removed. The dissipation of the base charge
takes time if there is no available path from the base to ground. This is why some DTL
circuits have a base resistor that's tied to ground, but even this requires some trade-offs.
Another problem with turning off the DTL output transistor is the fact that the effective
capacitance of the output needs to charge up through Rc before the output voltage rises to
the final logic '1' level, which also consumes a relatively large amount of time. TTL,
however, solves the speed problem of DTL elegantly.
36
Figure 1. A 2-input TTL NAND Gate with a Totem Pole Output Stage
In the TTL NAND gate of Figure 1, applying a logic '1' input voltage to both emitter
inputs of T1 reverse-biases both base-emitter junctions, causing current to flow through R1
into the base of T2, which is driven into saturation. When T2 starts conducting, the stored
base charge of T3 dissipates through the T2 collector, driving T3 into cut-off. On the other
hand, current flows into the base of T4, causing it to saturate and pull down the output
voltage Vo to logic '0', or near ground. Also, since T3 is in cut-off, no current will flow
from Vcc to the output, keeping it at logic '0'. Note that T2 always provides
complementary inputs to the bases of T3 and T4, such that T3 and T4 always operate in
opposite regions, except during momentary transition between regions.
On the other hand, applying a logic '0' input voltage to at least one emitter input of T1 will
forward-bias the corresponding base-emitter junction, causing current to flow out of that
emitter. This causes the stored base charge of T2 to discharge through T1, driving T2 intocut-off. Now that T2 is in cut-off, current from Vcc will be diverted to the base of T3
through R3, causing T3 to saturate. On the other hand, the base of T4 will be deprived of
current, causing T to go into cut-off. With T4 in cut-off and T3 in saturation, the output Vo
is pulled up to logic '1', or closer to Vcc.
Outputs of different TTL gates that employ the totem-pole configuration must not be
connected together since differences in their output logic will cause large currents to flow
from the logic '1' output to the logic '0' output, destroying both output stages. The output of
a typical TTL gate under normal operation can sink currents of up to 16 mA.
The noise margin of a logic gate for logic level '0', 0, is defined as the difference between
the maximum input voltage that it will recognize as a '0' (Vil) and the maximum voltage
that may be applied to it as a '0' (Vol of the gate driving it). For logic level '1', the noise
margin 1 is the difference between the minimum input voltage that may be applied to it
as a '1' (Voh of the gate driving it) and the minimum input voltage that it will recognize as
a '1' (Vih). Mathematically, 0 = Vil-Vol and 1 = Voh-Vih. Any noise that causes a noise
37
margin to be overcome will result in a '0' being erroneously read as a '1' or vice versa. In
other words, noise margin is a measure of the immunity of a gate from reading an input
logic level incorrectly. For TTL, Vil = 0.8V and Vol = 0.4V, so 0 = 0.4V, and Voh = 2.4V
and Vih = 2.0 V, so 1 = 0.4V. These noise margins are not as good as the noise margins
exhibited by DTL.
As mentioned earlier, TTL has a much higher speed than DTL. This is due to the fact that
when the output transistor (T4 in Figure 1) is turned off, there is a path for the stored
charge in its base to dissipate through, allowing it to reach cut-off faster than a DTL output
transistor. At the same time, the equivalent capacitance of the output is charged from Vcc
through T3 and the output diode, allowing the output voltage to rise more quickly to logic
'1' than in a DTL output wherein the output capacitance is charged through a resistor.
The commercial names of digital IC's that employ TTL start with '74', e.g., 7400, 74244,
etc. Most TTL devices nowadays, however, are named '74LSXXX', with the 'LS' standing
for 'low power Schottky'. Low power schottky TTL devices employ a Schottly diode,
which is used to limit the voltage between the collector and the base of a transistor, making
it possible to design TTL gates that use significantly less power to operate while allowing
higher switching speeds.
Boolean Algebra
Boolean Algebra, also known as the 'algebra of logic', is a branch of mathematics that is
similar in form to algebra, but dealing with logical instead of numerical relationships. It
was invented by George Boole, after whom this system was named. Thus, instead of
variables that represent numerical quantities as in conventional algebra, Boolean algebra
handles variables that represent two types of logic propositions: 'true' and 'false'.
Boolean algebra has become the main cornerstone of digital electronics, since the latter
also operates with two logic states, '1' and '0', represented by two distinct voltage levels.
Boolean algebra's formal interpretation of logical operators AND, OR, and NOT has
allowed the systematic development of complex digital systems from simple logic gates,
38
that now not only include circuits that perform mathematical operations, but intricate data
processing as well. Tables 1 to 4 summarize the definitions of logical operators and their
basic mathematical properties as represented in Boolean algebra.
Table 1. Elementary Logic Gate Actions
OR
0+0=0
0+1=1
1+0=1
1+1=1
AND
00=0
01=0
10=0
11=1
NOT
0=1
1=0
NOR
0+0=1
0+1=0
1+0=0
1+1=0
NAND
00=1
01=1
10=1
11=0
AND
A0=0
A1=A
AA=A
AA=0
NOT
A=NOT(A)
NOT(A)=A
NOR
A+0=A
A+1=0
A+A=A
A NOR
A=0
NAND
A0=1
A1=A
AA=A
A
NAND
A=1
De Morgan's Theorem
One important concept in digital electronics design is known as De Morgan's Theorem.
This theorem basically states that: 1) the complement of the product of a given set of
variables is equal to the sum of the complements of the individual variables; and 2) the
complement of the sum of a given set of variables is equal to the product of the
39
The response output (usually denoted by Q) of a logic gate to any combination of inputs
may be tabulated into what is known as a truth table. A truth table shows each possible
combination of inputs to a logic gate and the combination's corresponding output. The
Table of Logic Gates and Their Properties., which describes the various types of logic
gates, provides a truth table for each of them as well.
40
Interestingly, the operation of logic gates in relation to one another may be represented and
analyzed using a branch of mathematics called Boolean Algebra which, like the common
algebra, deals with manipulation of expressions to solve or simplify equations.
Expressions used in Boolean Algebra are called, well, Boolean expressions.
There are several kinds of logic gates, each one of which performs a specific function.
These are the: 1) AND gate; 2) OR gate; 3) NOT gate; 4) NAND gate; 5) NOR gate; and
6) EXOR gate. See the Table of Logic Gates and Their Properties.
Logic gates may be thought of as a combination of switches. For instance, the AND gate,
whose output can only be '1' if all its inputs are '1', may be represented by switches
connected in series, with each switch representing an input. All the switches need to be
activated and conducting (equivalent to all the inputs of the AND gate being at logic '1'),
for current to flow through the circuit load (equivalent to the output of the AND gate being
at logic '1').
An OR gate, on the other hand, may be represented by switches connected in parallel,
since only one of these parallel switches need to turn on in order to energize the circuit
load.
In Boolean Algebra, the AND operation is represented by multiplication, since the only
way that the result of multiplication of a combination of 1's and 0's will be equal to '1' is if
all its inputs are equal to '1'. A single '0' among the multipliers will result in a product
that's equal to '0'. The Boolean expression for 'A AND B' is similar to the expression
commonly used for multiplication, i.e., AB.
The OR operation, on the other hand, is represented by addition in Booelean Algebra. This
is because the only way to make the result of the addition operation equal to '0' is to make
all the inputs equal to '0', which basically describes an 'OR' operation. The Boolean
expression for 'A OR B' is therefore A+B.
The NOT operation is usually denoted by a line above the symbol or expression that is
being negated: A = NOT(A). The NAND operation is simply an AND operation
followed by a NOT operation. The NOR operation is simply an OR operation followed by
a NOT operation. The symbols used for logic gates in electronic circuit diagrams are
shown in Figure 1.
(AB) = A + B; and
(A+B) = A B.
De Morgan's Theorem has a practical implication in digital electronics - a designer may
eliminate the need to add more IC's to the design unnecessarily, simply by substituting
gates with the equivalent combination of other gates whenever possible. Since NAND and
NOR gates can be used as NOT gates, de Morgan's Theorem basically implies that any
Boolean operation may be simulated with nothing but NAND or NOR gates. This is why
NAND and NOR gates are also called universal gates.
Gate
AND Gate
OR Gate
NOT Gate
Description
Truth Table
Output Q
Output Q
Output Q
NAND Gate
NOR Gate
EXOR Gate
43
Output Q
Output Q
Output Q
There are several types of flip-flops, the common ones of which are described in the
following paragraphs.
The Set-Reset (S-R) Flip-flop
The Set-Reset (SR) flip-flop refers to a flip-flop that obeys the truth table shown in Table
1. It has two inputs, namely, a Set input, or S, and a Reset input, or R. It also has two
outputs, the main output Q and its complement Q.
S
0
0
1
1
R
0
1
0
1
QN+1
QN+1
QN
QN
0
1
1
0
Not Used
45
The JK flip-flop is a flip-flop that obeys the truth table in Table 2. The J-K flip-flop differs
from the S-R flip-flop in the sense that its next output is determined by its present output
state as well, aside from the states of its inputs. Note that in the J-K flip-flop, the S input
is now called the J input and the R input is now called the K input. Thus, in a JK flip-flop,
the output will not change if both J and K are '0', but will toggle to its complement if both
inputs are '1'.
J
0
0
1
1
K
0
1
0
1
QN+1
QN
0
1
QN
Shift Registers
A register is a semiconductor device that is used for storing several bits of digital data. It
basically consists of a set of flip-flops, with each flip-flop representing one bit of the
register. Thus, an n-bit register has n flip-flops. A basic register is also known as a 'latch.'
A special type of register, known as the shift register, is used to pass or transfer bits of data
from one flip-flop to another. This process of transferring data bits from one flip-flop to
the next is known as 'shifting'. Shift registers are useful for transferring data in a serial
manner while allowing parallel access to the data.
46
A shift register is simply a set of flip-flops interconnected in such a way that the input to a
flip-flop is the output of the one before it. Clocking all the flip-flops at the same time will
cause the bits of data to shift or move to the right in one direction (i.e., toward the last flipflop) . Figure 1 shows a simple implementation of a 4-bit shift register using D-type flipflops.
47
Figure 2. A Simple Synchronous Counter Consisting of J-K Flip-flops and AND gates
Digital Encoders/Decoders
48
0
X
1
1
1
1
1
1
1
1
X
1
0
0
0
0
0
0
0
0
X
1
0
0
0
0
0
0
0
0
X
X
0
0
0
0
1
1
1
1
X
X
0
0
1
1
0
0
1
1
X
X
0
1
0
1
0
1
0
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
If a multiplexer or encoder has N output lines, then it has 2N input lines. A common
example of a decoder/demultiplexer IC is the 74LS148, which is a Low-Power Schottky
TTL device that has 8 input lines and 3 output lines. The 74LS148 is a priority encoder,
which means that if more than one of its inputs are active, then the active input line with
the highest binary weight will be given priority, and the output of the encoder will depend
on this prioritized input. Table 2 shows the truth table for the 74LS148. Note that E0 and
GS are output pins while E1 is a control pin (input).
Table 2. Truth Table for the 74LS148, an 8-to-3 Line Priority Encoder
E1 D7 D6 D5 D4 D3 D2 D1 D0 A2 A1 A0 E0 GS
1 X X X X X X X X 1 1 1 1
1
0 1 1 1 1 1 1 1 1 1 1 1 0
1
0 0 X X X X X X X 0 0 0 1
0
0 1 0 X X X X X X 0 0 1 1
0
0 1 1 0 X X X X X 0 1 0 1
0
0 1 1 1 0 X X X X 0 1 1 1
0
0 1 1 1 1 0 X X X 1 0 0 1
0
0 1 1 1 1 1 0 X X 1 0 1 1
0
0 1 1 1 1 1 1 0 X 1 1 0 1
0
0 1 1 1 1 1 1 1 0 1 1 1 1
0
SRAM's
Random Access Memory (RAM) refers to a read/write memory device that can read data
from or write data to any of its memory addresses, regardless of what memory address was
last accessed for reading or writing. RAM comes in two major classifications: Static
RAM, or SRAM, and Dynamic RAM, or DRAM.
SRAMs store data in flip-flops, which retain data as long as the SRAM is powered up.
DRAMs store data in cells that depend on capacitors, which need to be 'refreshed'
continuously since they are not able to retain data indefinitely even if the device is
continuously powered up.
50
A typical SRAM IC has address lines, data lines, and control lines. The address lines are
used to identify the location of the memory storage element(s) or cell(s) to be read from or
written to. The data lines contain the value of the data read or being written into the
memory cells accessed. The control lines are used to direct the sequence of steps needed
for the read or write operations of the SRAM.
The memory elements of an SRAM are arranged in an array of rows and columns. Each
row of memory cells share a common 'Word Enable' line, while each column of cells share
a common 'bit' line. The number of columns of such a memory array is known as the bit
width of each word.
The basic storage element of an SRAM is a circuit that consists of 4 to 6 transistors. This
multi-transistor circuit usually forms cross-coupled inverters that can hold a '1' or '0' state
as long as the circuit is powered up. A pair of cross-coupled inverters have the output of
one inverter going into the input of the other and vice versa, such that the output (and
input) of one inverter is the complement of that of the other.
This circuit doesn't need periodic refreshing or clocking in order to hold its data, making
the SRAM faster than a DRAM (which needs data refreshing). All it needs is a constant
supply of power. However, since the memory cell of an SRAM is more complex than that
of a DRAM, it eats up more space on the chip (which means that you get less memory per
given area), making SRAM's more expensive than DRAM's.
Data is written into an SRAM's storage element by setting the 'bit' line (usually referred to
as Dataj) to the data value to be written and then enabling the element's corresponding
word line. Asserting the 'Word Enable' line while driving the data bit and its complement
into the cross-coupled inverters of the storage element causes the data bit to overwrite the
previous state of the element. If a word consists of several bits, then the whole word may
be written with new data in one step if the new values are provided to all the bit lines at the
same time before the 'Word Enable' line is asserted.
Reading the content of an SRAM's storage element also requires the 'Word Enable' line to
be asserted. This time, however, the SRAM uses sense amplifiers to detect the voltage
difference between the voltage at Dataj and that of Dataj's complement at the outputs of
the cross-coupled inverters. If the former is greater than the latter, then the cell contains a
logic '1'. Otherwise, the cell contains a logic '0'.
DRAM's
Random Access Memory (RAM) refers to a read/write memory device that can read data
from or write data to any of its memory addresses, regardless of what memory address was
last accessed for reading or writing. RAM comes in two major classifications: Dynamic
RAM, or DRAM, and Static RAM, or SRAM.
51
DRAMs store data in cells that depend on capacitors, which need to be 'refreshed'
continuously since they are not able to retain data indefinitely even if the device is
continuously powered up. SRAMs, on the other hand, store data in flip-flops, which retain
data without refreshing as long as the SRAM is powered up.
DRAMs provide more memory per unit chip area compared to SRAMs, mainly because of
the much simpler structure of its storage element. Whereas an SRAM memory cell consists
of 4 to 6 transistors, a DRAM memory cell consists of only a single transistor that is paired
with a capacitor. The presence or absence of charge in the capacitor determines whether
the cell contains a '1' or a '0'. This single-transistor configuration is commonly referred to
as a 1-T memory cell.
A typical DRAM IC has address lines, data lines, and control lines. The address lines are
used to identify the location of the memory storage element(s) or cell(s) to be read from or
written to. The data lines contain the value of the data read or being written into the
memory cells accessed. The control lines are used to direct the sequence of steps needed
for the read and write operations of the DRAM.
The memory elements of a DRAM are arranged in an array of rows and columns. Each
row of memory cells share a common 'word' line, while each column of cells share a
common 'bit' line. Thus, the location of a memory cell in the array is the intersection of its
'word' and 'bit' lines. The number of columns of such a memory array is known as the bit
width of each word.
Just like an SRAM memory cell, a DRAM memory cell uses these 'word' and 'bit' lines for
its read and write operations. During a 'write' operation, the data to be written ('1' or '0') is
provided at the 'bit' line while the 'word line' is asserted. This turns on the access transistor
and allows the capacitor to charge up or discharge, depending on the state of the bit line.
During a 'read' operation, the 'word' line is also asserted, which turns on the access
transistor. The enabled transistor allows the voltage on the capacitor to be read by a
sensitive amplifier circuit through the 'bit' line. This sense circuit is able to determine
whether a '1' or '0' is stored in the memory cell by comparing the sensed capacitor voltage
against a threshold, i.e., 50% of the full-charge voltage. Thus, it is a '1' (charged capacitor)
if the charge is still more than 50% and a '0' (discharged capacitor) if it's less than that.
For DRAMs, the simple operation of reading the data of a memory cell is destructive to
the stored data. This is because the cell capacitor undergoes discharging every time it is
sensed through the 'bit' line. In fact, the stored charge in a DRAM cell decays over time
even if it doesn't undergo a 'read' operation. Thus, in order to preserve the data in a DRAM
cell, it has to undergo what is known as a 'refresh' operation.
A refresh operation is simply the process of reading a memory cell's content before it
disappears and then writing it back into the memory cell. Typically it is done every few
milliseconds per word. However, the refresh cycle itself is very short (in the order of
52
EPROM's
The term "EPROM" is the acronym for "Erasable Programmable Read-only Memory". As
its name implies, it is a semiconductor memory device that can be programmed with data
which can only be read, but not altered, by the application circuit. As such, programming
an EPROM generally takes place prior to its attachment to the application circuit. One of
the most common applications for an EPROM is as a BIOS chip of a personal computer,
which stores information about the computer's basic input/output system.
An EPROM is a non-volatile memory device, i.e., it can retain its stored data even if it is
powered off. Reprogramming an EPROM with new data is possible, but it has to undergo
a special data erasure process that employs ultraviolet (uv) light before it can be done.
There are some EPROMs though, known as one-time programmable (OTP) EPROMs, that
are designed to be non-reprogrammable as a cheaper alternative for storing specific bugfree data that never require any change.
An EPROM, just like a Flash memory IC, is a "floating gate" device, i.e., it is a device that
employs a 'floating gate' in each of its memory cells to store data. A "floating gate" is a
structure embedded within the dielectric layer that isolates the silicon channel and the
external gate of each memory cell transistor. It is designed to store charge, the amount of
which is used to represent whether the bit of data stored in the memory cell is a '1' or '0'.
The memory cells of a completely erased EPROM all contain a '1'. Programming a cell,
which entails charging up the cell's floating gate to a certain level, gives it a new value of
'0'. A memory cell sensor determines the amount of charge stored in the floating gate and
compares it with a given threshold. If the charge stored exceeds the threshold, then the
stored data is considered a '0', otherwise it is a '1'.
53
Programming an EPROM requires higher voltages than just reading it, since injection of
charge into the floating gate is needed. Modern EPROMs just need a 5-V supply (Vcc) to
be read, but require a second power supply (set to a higher voltage in the range of 12 to 25
volts during programming) to be programmed. This second supply voltage used during
programming is often referred to as the "Vpp." In some EPROMS, programming also
requires a higher voltage at Vcc aside from the Vpp voltage.
Just like other memory devices, a typical EPROM has data pins, address pins, and control
pins (CE and OE). The data pins are bi-directional, acting as inputs during programming
and as outputs during reading. The CE or "chip enable" pin is used for activating or
deactivating the entire EPROM chip itself, while the OE or "output enable" pin is used for
activating or deactivating the EPROM's output pins only.
Programming an EPROM basically requires: 1) setting the Vcc and Vpp to their 'program
mode' levels; 2) applying the addresses and input data at the address and data pins; and 3)
applying the required programming pulses in accordance with a programming 'algorithm'.
Erasure of an EPROM requires the dissipation of the stored charge inside the floating gate,
which is accomplished by exposing the cells to ultraviolet light with a wavelength of 2537
angstroms. This is why EPROMs have a glass window directly over the chip area - to
allow ultraviolet radiation to reach the memory cells. This glass window must be covered
after the chip has been programmed to protect the stored data from ambient light, which
can indeed erase EPROM data if given enough time. A wide range of EPROM uv erasers
are available in the market for erasing EPROMS conveniently.
Flash Memory
Flash Memory is a semiconductor memory device that is electrically erasable and
programmable in sections of memory called 'blocks'. In a flash memory, a whole block of
memory cells can be erased in a single action, or in a 'flash,' which is how this device got
its name. Flash memory is non-volatile, i.e., it can retain its memory contents even if it is
powered off.
A basic flash memory cell consists of a MOSFET that was modified to include an isolated
inner gate between its external gate and the silicon (see Figure 1). This inner gate is
known as a 'floating gate', which is the data-storing element of the memory cell. Flash
memory is not the first memory device to use a floating gate to store information. The uverasable EPROM, which preceded the Flash memory, is also a 'floating gate' memory
device.
54
Data is stored in a flash memory cell in the form of electrical charge accumulated inside
the floating gate. The amount of charge stored in the floating gate depends on the voltage
applied to the external gate of the memory cell that controls the flow of charge into or out
of the floating gate. The data contained in the cell depends on whether the voltage of the
stored charge exceeds a specified threshold voltage Vth or not.
Intel has developed flash memory technology wherein memory cells can hold two or more
bits of data instead of just one each. The trick is to take advantage of the analog nature of
the charge stored in the memory cell and allow it to charge to several different voltage
levels. Each voltage range to which the floating gate can charge can then be assigned its
own digital code. Thus, a 2-bit cell can distinguish 4 distinct voltage ranges, while a 3-bit
one can distinguish 8 of them. Intel calls this technology 'Multi-Level Cell (MLC)"
technology.
A typical MLC consists of a single transistor with direct electrical connections to its gate,
source, and drain that allow very precise control of the charging of the cell's floating gate.
For a multi-level cell to work, it must be able to deposit charge with precision, sense
charge with precision, and store charge over time. High-precision charging and charge
sensing are the key to a MLC's ability to distinguish several charge levels. Table 1
illustrates how a 2-bit multi-level cell assigns digital codes to 4 different charge voltage
levels.
Table 1. 2-Bit Intel MLC Digital Code Assignment
Charge Level
Digital Code
Level 3
00
Level 2
01
Level 1
10
Level 0
11
MLC transistor is usually grounded. Column decoding of the MLC provides direct bitline
connection to the drain which is pulsed at a constant voltage. Row decoding of the MLC,
on the other hand, provides direct wordline connection that causes the MLC transistor gate
to be connected to an internally generated supply voltage. This direct and precise control
of the drain and gate is critical to the correct charging of the floating gate and, hence,
correct storage of information.
Reading the contents of multi-level cells involves highly precise sensing of the amount of
charge in the floating gate, measured in terms of cell currents that have an inverse
relationship with the Vth. The sensed currents are compared to reference currents, with the
comparison results inputted to a logic circuit that encodes them into the corresponding
digital data.
Flash memory erasure is achieved by 'discharging' the floating gate through a phenomenon
known as Fowler-Nordheim tunneling, wherein electrons from the floating gate pass
through the thin dielectric layer and get dissipated at the source of the memory cell
transistor.
Flash memory is used in a variety of applications such as: personal and notebook
computers, digital cell phones, digital cameras, portable memory devices, LAN switches,
embedded controllers, etc.
Microprocessors
A microprocessor is a programmable integrated circuit that is used for executing
instructions to process digital data or exercise digital control over other devices. It is
employed primarily as the central processing unit (CPU) of a computer system. The
complexity of present-day microprocessors make even a modest description of how they
work beyond the scope of this page. Thus, what is presented below is the architecture of a
typical microprocessor from a couple of decades ago. The following discussion, simple as
it is, nonetheless gives a reasonable understanding of how microprocessors in general
work.
As mentioned, a microprocessor is used to execute a series of steps or instructions, which
collectively constitutes a 'program'. Every microprocessor has a unique set of instructions
that it can execute. This set of instructions is known as its, well, instruction set. Every
instruction on the instruction set does something unique, and has different requirements in
terms of which part(s) of the microprocessor to utilize or what data to work on.
A basic microprocessor circuit has the following parts: 1) an Arithmetic and Logic Unit
(ALU), which is where the arithmetic and logic operations of the microprocessor take
place; 2) a data bus system where data that need to be processed are transported; 3) an
address bus system that provides the address of the memory location being accessed; 4) a
control unit for orchestrating the program execution of the microprocessor; 5) an
56
instruction register/decoder where instructions are loaded one at a time and 'interpreted'; 6)
a program counter that indicates the memory address where the next instruction will come
from; and 7) various registers, flags, and pointers.
A microprocessor executes a program stored in memory by fetching the instructions of the
program (and whatever data they require) one at a time and performing these instructions.
Memory in this context basically refers to external memory devices that complement the
microprocessor and the input/output devices of the computer system. The manner in which
the next instruction will be executed depends on the results of the last operation. Thus, the
output of the microprocessor depends on the instructions and the input data provided to it.
Microprocessors with different ALU designs have different arithmetic and logic
capabilities. For instance, some ALU's can handle all the basic arithmetic functions
directly, while the simplest ones only perform addition and shift operations, which are also
the steps used to emulate all other arithmetic functions such as multiplication and division.
The logic capability of the ALU also varies from one microprocessor to another, but
almost all ALU's can perform the AND, OR and EXOR.
The instructions being followed by a microprocessor come in the form of instruction
codes. Instruction execution can not occur haphazardly, and must be controlled precisely
as it happens. The control unit of the microprocessor is the one responsible for controlling
the sequencing of events needed for the execution of an instruction, as well as the timing
of this sequence of events. The control unit is complemented by a clock or timing
generator that helps it trigger the occurrence of each event at the correct point in time.
The program counter of a microprocessor indicates where the next instruction bytes are
located in memory. It is indexed by the control unit by 1 every time an instruction code is
transferred from memory to the microprocessor.
A microprocessor uses the instruction register to store the instruction code last fetched
from memory. The first byte of an instruction code is fed by the instruction register to the
instruction decoder, which 'decodes' it to determine which operation must be carried out,
how many bytes of data will be processed, and where to get these data. After instruction
decoding, the execution of the instruction proceeds.
Registers are elements composed of a set of flip-flops where data are stored temporarily
for subsequent processing or transfer, as the microprocessor goes about its task of
executing its instructions one at a time. The accumulator is a special register used by the
microprocessor for holding operands, or data to be manipulated by the ALU. Aside from
the accumulator, several general-purpose registers are also available to the microprocessor
for holding data that need to be operated on.
Microprocessors also have Status Flags, which are really just special registers for storing
the state of a condition that results from a previous operation. Examples of status flags
include: 1) the Carry Status Flag, which indicates if there's a need to do a 'carry' after
addition or a 'borrow' after subtraction; 2) the Zero Status Flag, which indicates if a given
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operation in the ALU results in a 'zero'; 3) the Sign Status Flag, which indicates whether
the result of an ALU operation is negative or positive; 4) the Overflow Status Flag, which
indicates if an operation produces a result that can't fit into the specified word length; and
5) the Parity Status Flag, a flag (used in error detection) that is set if the result of an
operation contains an even number of 1's.
The microprocessor has been around for more than two decades already. It now comes in
many forms, sizes and levels of sophistication, powering all kinds of applications that rely
on 'computer control'. Although it is the central processing unit of a computer system, it
also needs to interact with other semiconductor devices in order to perform its functions.
These 'other' devices include the memory and input/output devices that constitute the rest
of the computer system.
Digital-to-Analog Converters (DAC's)
A digital-to-analog converter, or simply DAC, is a circuit that is used to convert a digital
code into an analog signal. Digital-to-analog conversion is the primary means by which
digital equipment such as computer-based systems are able to translate digital data into
real-world signals that are more understandable to or useable by humans, such as music,
speech, pictures, video, and the like. It also allows digital control of machines, equipment,
household appliances, and the like.
R0 = 2 R 1 = 4 R 2 = 8 R 3
One problem with this circuit is the wide range of resistor values needed to build a DAC
with a high number of digital inputs. Putting thin-film resistors that come in a wide range
of values (e.g., from a few ks to several Ms) on a single semiconductor chip can be
very difficult, especially if high accuracy and stability are required.
A better-designed and more commonly-used circuit for digital-to-analog conversion is
known as the R-2R ladder DAC, a 4-bit version of which is shown in Fig. 2. It consists of
a network of resistors with only two values, R and 2R. The input SN to bit N is '1' if it is
connected to a voltage VR and '0' if it is grounded. Thevenin's Theorem may be applied to
prove that the output Vo of an R-2R ladder DAC with N bits is:
Vo = VR/2N (SN-12N-1 + SN-22N-2+...+S020).
Thus, the output of the R-2R ladder in Figure 2 is Vo = VR/24 (S323+S222+S121+S020) or Vo
= VR (S3/2 + S2/4 + S1/8 + S0/16). In effect, contribution of each bit to the analog output is
proportional to its binary weight.
Analog-to-digital converters come in many forms. One example is the parallel comparatortype ADC, which basically consists of: 1) a set of comparators that compare the input
analog voltage to different values of fixed voltages; 2) a corresponding set of D-type flipflops that hold the digital outputs of the comparators; and 3) an encoder that converts the
outputs of the D-type flip-flops into the final output digital code.
Another implementation of the ADC is known as the successive-approximation ADC. This
circuit consists of: 1) a sample and hold circuit to accept the analog input Va; 2) a
successive approximation register (SAR) consisting of clocked flip-flops and gates
designed to systematically and progressively approximate the digital code corresponding
to the analog input Va; 3) an internal reference DAC that gets its digital inputs from the
SAR; and 4) a voltage comparator that compares the analog output of the internal DAC to
the analog input Va.
In a successive approximation ADC, the SAR generates a series of digital codes as it is
clocked, which are fed into the reference DAC one at a time. The digital codes are
generated in binary search fashion, i.e., the bits are toggled to logic '1' one at a time
starting with the MSB. If the bit toggled to '1' causes the DAC to output an analog voltage
that exceeds Va, then it is returned to '0', otherwise it is kept at logic '1'.
Eventually all the bits would have been exercised, and the resulting digital code is the one
that causes the DAC to produce an analog voltage that is as close to Va as possible without
exceeding it. Thus, this will be the same digital code released by the ADC to its outputs,
since it was basically the code that produced a voltage equal to Va using the internal
reference DAC.
Another ADC design that operates similarly to the successive approximation ADC is the
counting ADC. It also employs an internal reference DAC, except that in this case it is fed
with digital data that are generated by a counter. As the counter is clocked, the digital
code fed to the DAC increases which causes the DAC to increase its analog output
proportionately. Eventually the DAC output exceeds the analog input Va and the counter
is stopped. The digital code fed to the DAC at this point becomes the output of the
counting ADC itself.
The ADC's discussed earlier all employ what is referred to as Pulse Code Modulation
(PCM), wherein an N-bit digital code is assigned to each sample taken from the analog
signal. Another major class of ADC's employs a process known as Delta Modulation
(DM) instead of PCM to digitize analog signals.
A basic linear DM ADC has an internal processor that generates an analog signal that
approximates the analog signal being digitized. It also has a comparator for comparing the
processor's analog output to the actual input analog voltage. If the comparator determines
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that the analog input is greater than the processor output, then the processor increases its
output by a step S0; otherwise the processor output is decreased by S0.
One strength of linear DM is the ease by which the analog signal can be reconstructed
from the digitized signal. The drawback of linear DM is that its output can only change in
steps of just one size, S0. This limits the slope of the digitized signal, which becomes a
problem when the input analog signal is changing rapidly.
Adaptive Delta Modulation (ADM) addresses the limitation of linear DM ADC's by
allowing variations in the step sizes at which the digitized signal changes. Under ADM,
the step size by which the digital output of the ADC changes increases whenever the
analog signal being digitized is changing rapidly.
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digital signal processing. However, it can not be as good as a DSP when it comes to
serious DSP applications.
Current trends in technology seem to indicate the possibility though that the distinction
between a DSP and a microprocessor will soon be gone. Microprocessors are becoming
more and more sophisticated that some of them are now equipped with true DSP
capabilities. It will just be a matter of time before high-end microprocessors will have the
capability to perform high-end signal processing, or any high-end task for that matter.
A DSP is also very similar to a microprocessor as far as architecture is concerned, i.e., it
has many parts that are also seen in a microprocessor, such as data and address buses, an
Arithmetic-Logic Unit (ALU), a program control unit, assorted flags and registers, etc. It
also has its own native instruction set, which defines what it can be programmed to do.
Programming DSP's is no longer complicated too, with the existence of various
development kits in the market that support DSP software development using high-level
programming languages such as C.
Many DSP applications deal with real-world analog signals (such as sound, light, analog
voltage, analog current, temperature, pressure). Since a DSP can only process digital
signals, there is a need to convert analog signals first into digital data before they can be
processed by a DSP. After processing, there is again a need for the DSP to convert these
digital data back into the original real-world analog signal format. In such applications, the
DSP must be supported by an analog-to-digital converter (ADC) and a digital-to-analog
converter (DAC), which will perform the required analog-digital and digital-analog
conversions, respectively.
Applications where DSP's are commonly used include: 1) digital sound and image
processing; 2) digital communications; 3) consumer electronics (e.g., mobile phones,
faxes, computer peripherals such as modems and sound cards, and digital entertainment
systems such as DVD players and digital TV); 4) medical electronics; and 5) industrial and
automation electronics.
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The implication of Kirchhoff's Current Law is that charge can not accumulate at a node or
junction of a circuit, and that charge is a conserved quantity. Kirchhoff's Current Law
complements Kirchhoff's Voltage Law in formalizing the algebra for circuit analysis.
Kirchhoff's Voltage Law
Kirchhoff's Voltage Law (KVL), which is also known as Kirchhoff's Second Law, states
that the sum of all voltage sources in a circuit loop equals the sum of all voltage drops in
the same loop. This law is also sometimes stated as follows: the net electromotive force
(e.m.f.) within a circuit loop equals the sum of all potential differences around the loop. In
this statement, e.m.f. refers to a source of electrical energy while potential differences are
drains of electrical energy.
and Ohm's Law are then applied to calculate the voltage across the resistor with this single
source present. Once all the voltage contributions have been determined, the voltage
across the resistor is simply the sum of all the individual voltages contributed by the
voltage sources.
5V and 4V sources across it. Figure 2 shows the equivalent circuit wherein the 4V source
is 'zeroed out', i.e., replaced by a short circuit. This circuit gives the voltage V1 applied by
the 5V source across the 3K resistor, wherein V1 = 5V (0.75/2.75) = 1.364 V. Figure 3
shows the equivalent circuit wherein the 5V source is replaced by a short circuit. This
circuit gives the voltage V2 applied by the 4V source across the 3K resistor, wherein V2 =
4V (1.2/2.2) = 2.182 V. Thus, from the Superposition Principle, the voltage across the 3K
resistor in Figure 1 is 1.364V + 2.182V = 3.546V.
Similarly, the voltage across the 2K resistor is -5V(2/2.75) + 4V(1.2/2.2) = -3.636 +
2.1818 = -1.454V and the voltage across the 1 K resistor is 5V(.75/2.75) - 4V(1/2.2) =
1.364 - 1.818 = -0.454.
Thevenin's Theorem
Thevenin's Theorem states that for any two linear networks A and B that are connected by
two conductors but not magnetically coupled, network A may be replaced by a simpler
equivalent network for the purpose of simpler circuit analysis computations with respect to
network B.
The equivalent network is known as the Thevenin equivalent network, and it consists of a
voltage source V(s) in series with an impedance Z(s). The voltage source V(s) is the
transform of the voltage at the two open terminals of network A, while the impedance
Z(s) is the transform impedance at the two terminals of A with all independent sources
reduced to zero. Related to Thevenin's Theorem is Norton's Theorem, which is just the
current representation of Thevenin's Theorem.
One must know the characteristics of networks to which Thevenin's Theorem is
applicable. Let A and B be the two connected but non-magnetically coupled linear
networks, with current i(t) or I(s) flowing from A to B, as shown in Figure 1. Network A
must have the following characteristics: 1) it only has linear passive elements; 2) it may
contain independent voltage and current sources as well as dependent (or controlled)
sources; 3) it may have initial conditions present (e.g., voltages in capacitors or currents in
inductors); 4) it has no magnetic coupling to B. On the other hand, network B may be
characterized as follows: 1) it has linear passive elements only; 2) it has no sources; 3) it
has no initial conditions; and 4) it has no magnetic coupling to B.
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One must know the characteristics of networks to which Norton's Theorem is applicable.
Let A and B be the two connected but non-magnetically coupled linear networks, with
current i(t) or I(s) flowing from A to B, as shown in Figure 1. Network A must have the
following characteristics: 1) it only has linear passive elements; 2) it may contain
independent voltage and current sources as well as dependent (or controlled) sources; 3) it
may have initial conditions present (e.g., voltages in capacitors or currents in inductors); 4)
it has no magnetic coupling to B. On the other hand, network B may be characterized as
follows: 1) it has linear passive elements only; 2) it has no sources; 3) it has no initial
conditions; and 4) it has no magnetic coupling to B.
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(1/R1 + 1/R2 + 1/R3 + ... + 1/Rn). The current Im through this simple circuit is given by:
Im = Vm / Rm, or Im = V1/R1 + V2/R2 + V3/R3 + ... + Vn/Rn.
Millman's Theorem, therefore, simplifies the computation of the voltage across the parallel
branches of a circuit. Note that Millman's Theorem is only applicable to circuits that can
be redrawn as a network of parallel branches, with each branch consisting of a resistor or a
resistor in series with a voltage source or current source.
Millman's Theorem may also be written in terms of the impedance Z or admittance Y (Z =
1/Y) through each branch. Thus,
Vm = (V1Y1 + V2Y2 + V3Y3 + ... + VnYn) / (Y1 + Y2 + Y3 + ... + Yn);
Zm = 1 / (Y1 + Y2 + Y3 + ... + Yn); and
Im = V1Y1 + V2Y2 + V3Y3 + ... + VnYn.
Analog Electronics
Analog Electronics refers to the field of electronics that deals with analog or 'real-world'
signals. An analog signal is a signal that is both variable and continuous, and therefore
allowed to assume any value between its applicable lower and upper limits. This is in
contrast with a digital signal, which can only assume discrete or quantized values. Analog
signals represent waveforms that are commonly encountered by humans in the real world.
In telephony, for example, one's voice is translated into an analog electrical signal that can
be transmitted continuously over wires, received on the other end, and made to vibrate a
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speaker that translates the analog electrical signal back into sound waves again.
Although our society is becoming more and more digital everyday, the output of a digital
system almost always needs to be converted back into analog form in one way or another
for our day-to-day use in the physical world.
Analog signals may be converted into digital signals and vice versa by devices known as
analog-to-digital converters (ADC's) and digital-to-analog converters (DAC's),
respectively.
Electronic Amplifiers
An electronic amplifier is a device that magnifies or increases the voltage, current, or
power of a signal. An amplifier accomplishes this by taking additional power from a
power supply, and producing an output signal that is an exact copy of the input signal, but
of a higher amplitude. The ratio of the output signal to the input signal is referred to as the
'gain' (G) of the amplifier. Thus, an amplifier that outputs a voltage signal Vout that is a
magnified copy of the input voltage signal Vin has a gain of G, wherein G = Vout / Vin.
An amplifier can be designed to magnify the voltage of a signal (voltage amp), the current
of a signal (buffer amp), or both the voltage and current of a signal (power amp).
Electronic amplifiers can operate using either a single-sided power supply (a voltage rail
or bus that's either positive or negative) or a double-sided or balanced power supply,
which has both a positive and a negative supply rail aside from the ground.
If the output waveform of an amplifier is not a perfect copy of the input signal, then the
amplifier is said to exhibit distortion. One type of distortion is linear distortion, which
causes an output signal to have a shape that's different from that of the input signal. Good
design of the amplifier circuit, proper selection of circuit components, and correct biasing
(which is discussed in the next paragraph), will minimize distortion.
An electronic amplifier needs what is known as an electrical 'bias' in order to function. The
bias of an amplifier is the method by which its active devices (usually transistors) are
powered up and excited in order to attain the desired amount of gain with minimum
distortion. This usually entails setting the DC component of the output signal midway
between the maximum voltages available from the power supply.
It is common to see amplifiers that consist of multiple stages connected in series to attain
higher gains. Each stage of the amplifier may be a different type of amplifier to meet the
requirements of each stage. For instance, the first stage might be a Class A stage, the
output of which is fed into a class AB push-pull second stage, which then drives a class G
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final output stage. This design takes advantage of the strengths of each amplifier class at
each stage while minimizing weaknesses. Refer to the definitions of the different classes
of amplifiers.
An amplifier's output signal may be of different phase or polarity as the input signal. A
non-inverting amplifier maintains equal phase relationship or polarity between the input
and output waveforms. An emitter follower is a type of this amplifier, indicating that the
signal at the emitter of a transistor follows the phase of the input signal. An inverting
amplifier produces an output that is of opposite polarity or 180 degrees out-of-phase with
the input signal.
There are many different ways to classify amplifiers. Amplifier classifications include the
following: 1) by function; 2) by frequency range; 3) by common terminal; 4) by type of
load; 5) by coupling, etc.
Types or Classifications of Electronic Amplifiers
Electronic amplifiers can be classified in many different ways. Some common
classifications for amplifiers are presented below.
Classification by Signal Type
Amplifiers may be classified based on the type of signal that they amplify. Thus, an
amplifier that amplifies voltage signals is a voltage amplifier, while a buffer amplifier is
one that amplifies current signals. An amplifier that amplifies both the voltage and current
is classified as a power amplifier.
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Amplifier Classes
Amplifier circuits are classified under different classes, which include the following:
classes A, B, AB and C for analog designs, and classes D and E/F for switching designs.
Below are brief descriptions of these amplifier classes.
Class A - 100% of the input signal is used (conduction angle a = 360 or 2)
Class A amplifiers amplify over the entire input cycle such that the output signal is an
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exact magnified copy of the input. They are not efficient (no more than 50% efficiency is
attainable), since the amplifying device is always conducting whether or not an input
signal is applied.
across it at the same time, thereby minimizing its power dissipation. The impedance
network, on the other hand, is set up such that the 'imaginary part' of the impedance is
eliminated through proper matching of complex conjugates to attain resonance, leaving
behind only its 'real part.' Thus, a Class E/F amp is very efficient because power loss only
occurs in the real part (resistive component) of the impedance network. Classes E and F
are distinguished from each other by their resonance topology.
There are several other classes of amplifiers not discussed in this article.
Negative Feedback
Negative feedback is used in amplifiers for a variety of reasons. The term 'feedback'
means using a fraction of the output voltage of the amplifier as input or as part of input.
When the signals at input and output are of opposite phase (i.e., they are mirror-imaged),
then the feedback signal is said to be negative.
Negative feedback signals are subtracted from the amplifier's input signal(s). In effect,
they reduce the overall gain of the amplifier. If G is the gain of the amplifier with no
feedback (also known as the 'open-loop gain'), and n is the feedback fraction (or loop
gain) such that Vout/n is fed back to the input of the amplifier, then the gain of the
amplifier when negative feedback is applied (closed-loop gain) is as follows:
Closed-Loop Gain = G / (1 + G/n).
For example, if the open-loop gain G = 100 and n = 10 (so that 1/10 of the output voltage
is fed back), then the closed-loop gain is 100/(1+100/10) = 100/11 = 9.09.
Note that if the open-loop gain G is very much larger than the loop gain n, then the closed
loop gain becomes approximately G/(G/n), or simply equal to n.
Negative feedback, aside from reducing gain, also reduces noise signals generated by the
components of the amplifier. Distortion that does not result in loss of open-loop gain will
also be reduced by negative feedback.
The input resistance of an amplifier may also be affected by feedback. If the feedback
signal is in shunt with the input signal (i.e., they are applied to the same terminal, as shown
in Figure 1a), then the input resistance of the amplifier decreases. Using a feedback signal
that is in series with the input signal (as shown in Figure 1b), on the other hand, will
increase the amplifier's input resistance.
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The output resistance may also be affected by a feedback network, although to a lesser
extent than the input resistance. Connecting the feedback circuit in series with the output
load increases the amplifier's output resistance while connecting it in parallel with the
output load will decrease the amplifier's output resistance
Low-Pass Filters
A Low-Pass Filter is a circuit that only allows low-frequency signals to pass, and
attenuates or reduces signals whose frequencies exceed its cut-off frequency. It is also
referred to as a 'high-cut filter' or, when used in audio applications, as a 'treble-cut filter'.
One common application of low-pass filters is for driving subwoofers (speakers designed
for bass sounds) and other loudspeakers that don't efficiently broadcast sounds of high
pitches. The low-pass filter is the opposite of the high-pass filter.
An ideal low-pass filter is one that completely blocks all frequencies above a given
frequency, while allowing all those with lower frequencies to pass unchanged. Of course,
an ideal low-pass filter doesn't exist in the real world, so ways to quantify or describe the
effectiveness and efficiency of a low-pass filter have been devised.
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High-Pass Filters
A High-Pass Filter is a circuit that only allows high-frequency signals to pass, and
attenuates or reduces signals whose frequencies are below its cut-off frequency. It is also
referred to as a 'low-cut filter' or, when used in audio applications, as a 'bass-cut filter' or
'rumble filter'. One common application of high-pass filters is for driving tweeters
(speakers designed for high-pitch sounds), so as to block low-frequency signals that can
interfere with or even damage the tweeter. The high-pass filter is the opposite of the lowpass filter.
An ideal high-pass filter is one that completely blocks all frequencies below a given
frequency, while allowing all those with higher frequencies to pass unchanged. Of course,
an ideal high-pass filter doesn't exist, so in the real world, the effectiveness and efficiency
of a high-pass filter is described is terms of the level of attenuation of signals with
frequencies below a cut-off frequency. The cut-off frequency of a high-pass filter is the
frequency at which the output voltage equals 70.7% of the input voltage.
Figure 1 shows some common implementations of high-pass filters. Note that in each of
the high-pass filters shown above, the inductors are in shunt with the input while the
capacitors are in series with the input. This is because the reactance XL of an inductor
increases with the signal frequency, i.e., XL = 2fL, while the reactance XC of a capacitor
decreases with the signal frequency, i.e., XC = 1 / 2fC. Thus in these high-pass filters,
the capacitors resist the passing of an ac signal as the frequency decreases, while the
inductors shunt them towards the ground as the frequency decreases. Either way, the
effect is to attenuate the signal as frequency decreases.
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The bipolar transistor, whether NPN or PNP, may be used as a switch. Recall that the
bipolar transistor has three regions of operation: the cut-off region, the linear or active
region, and the saturation region. When used as a switch, the bipolar transistor is operated
in the cut-off region (the region wherein the transistor is not conducting, and therefore
makes the circuit 'open') and saturation region (the region wherein the transistor is in full
conduction, thereby closing the circuit).
The bipolar transistor is a good switch because of its large transconductance Gm, with Gm
= Ic/Vbe where Ic is the collector-to-emitter (output) current and Vbe is the base-emitter
(input) voltage. Its high Gm allows large collector-to-emitter currents to be easily
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One problem with the simple switch circuit in Figure 1 is the fact that a stray capacitance
exists between the transistor's collector and its grounded emitter, such that the switch-off
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time of the transistor is slower than its switch-on time. This is because during switch-off,
this stray capacitance has to charge first through the load resistor before the load current
stops. During switch-on, on the other hand, this stray capacitance needs to discharge to
ground, which is easily accomplished by the conducting transistor. The slower charging up
of the stray capacitance compared to its quick discharging is the reason why the switch-off
of Figure 1's circuit is slower than its switch-on.
The circuit in Figure 2 addresses the limitation of the circuit in Figure 1. Two output
transistors are used in this circuit, driven by a single input transistor. The output of this
circuit is taken from the collector of the lower transistor. Just like the circuit in Figure 1,
this circuit is an inverting circuit, i.e., the output signal has a phase that's opposite that of
the input signal. Thus, the output is low if the input is high and the output is high if the
input is low.
If the input is high, the upper output transistor goes into cut-off because its base voltage is
pulled down by the conducting input transistor. Meanwhile, the lower output transistor
saturates because the conducting input transistor is supplying its base with a higher
current. Such conditions immediately pulls down the collector of the lower output
transistor to almost ground level, i.e., the output goes 'low'.
On the other hand, if the input is low, the input transistor stops conducting, causing the
voltage at the base of the upper output transistor to be pulled up by the positive supply,
thereby turning it on. Meanwhile, the non-conducting input transistor prevents the base of
the lower output transistor from receiving any current, driving it into cut-off. With the
lower output transistor in cut-off and the upper output transistor conducting, the output of
the circuit is pulled up towards the positive supply, i.e., the output goes 'high.'
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The circuit in Figure 2 allows the output to switch off as fast as its switch-on, since the
conducting lower output transistor immediately pulls the output to ground during switchoff.
The Darlington Pair
The Darlington pair is basically a combination of two bipolar transistors connected as
shown in Figure 1 below. This circuit is used for amplifying currents, i.e., the amplified
current from the first transistor is further amplified by the second transistor. Needless to
say, this transistor combination exhibits a much higher current gain than if only one
transistor were used.
The overall current gain of the Darlington pair is just equal to the product of the two
individual current gains of the transistors. Thus, if hFE1 and hFE2 are the current gains of
transistors 1 and 2, respectively, the over-all current gain hFE if they are formed as a
Darlington pair will be hFE = hFE1 x hFE2. The very high current gain (e.g., 10000) of a
Darlington pair means that only a tiny amount of base current is needed to make the pair
switch on.
Darlington pairs packaged as a single transistor are already very common in the
marketplace. However, this has not diminished the practice of forming Darlington pairs
from two discrete transistors, since this offers more flexibility. The load current will be
carried by the second transistor, so it has to have a higher power rating than the first
transistor. The maximum load current of the Darlington pair is the maximum current that
the second transistor can carry.
The long-tailed pair circuit is often used for amplifying any difference between the signals
applied at the base of each transistor. If the two transistors used are identical and
balanced, a common-mode signal (i.e., a signal applied in the same phase to both inputs)
applied to the bases of the transistors will not cause any significant differences between the
voltages at the collectors of the two transistors. In fact, any difference would only be due
to a lack of balance between the transistors. Thus, the output of this circuit (which is taken
across the collectors) for a common-mode signal would ideally be zero.
On the other hand, even a minute difference between the base signals will be amplified
considerably by the transistors, and will be reflected at the output as an amplified version
of the difference between the signals. Thus, the differential gain of this circuit is very
high, whereas its common-mode gain is very low. This is why this circuit is extensively
used in the input circuitries of operational amplifiers.
Operational Amplifiers (Op-Amps)
An Operational Amplifier, or Op Amp, is a dual-input, single-output linear amplifier that
exhibits a high open-loop gain, high input resistances, and a low output resistance. One of
the inputs of an operational amplifier amp is non-inverting while the other is inverting.
The output Vout of an operational amplifier without feedback (also known as open-loop) is
given by the formula: Vout = A(Vp-Vn) where A is the open-loop gain of the op amp, Vp
is the voltage at the non-inverting input, and Vn is the voltage at the inverting input. The
open-loop gain of a typical op amp is in the range of 105-106.
The operational amplifier got its name from the fact that it can be configured to perform
many different mathematical operations. Depending on its feedback circuit and biasing, an
op amp can be made to add, subtract, multiply, divide, negate, and, interestingly, even
perform calculus operations such as differentiation and integration. Of course, aside from
these operations, op amps are also found in a very large number of applications. In fact,
many consider the op amp as the foundation of many analog semiconductor products
today.
Because of the very high resistance exhibited by the inputs of an op amp, the currents
flowing through them are very small. The current flowing in or out of an op amp's input
pin, known as input bias current, is basically just leakage current at the base or gate of the
input transistor of that input, which is why it is very small. When solving voltage/current
equations for op amp circuits, the input currents are usually assumed to be zero. For most
of the commonly-used op-amp circuits, this means that the total output current of the op
amp is flowing through the feedback circuit between the output and the inverting input (the
feedback is usually connected to the inverting input for operation stability).
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As the main path for an op amp's output current, the feedback circuit used in an op amp
largely determines how the op amp will function. There are many ways to operate an op
amp, but one commonly-used basic configuration is to: 1) provide it with balanced supply
voltages (say, +/-15V, although single-supply operation is also commonly used); 2)
connect the non-inverting input to ground (either directly or with a passive element such as
a resistor); 3) connect a feedback circuit between the output and the inverting input; and 4)
connect a resistor between the inverting input and the input signal source. Figure 1 shows
some op amp circuits using this basic configuration.
Summer
Differentiator
Integrator
Vo = - If(Rf);
Vi = If(Ri);
Vo = (Rf/Ri) Vi
Vo = - If(Rf);
If = V1/R1 +
V2/R2;
Vo = Rf(V1/R1 +
V2/R2)
Vo = - If(Rf);
If = C
dVi/dt;
Vo =
-RfC(dVi/dt)
Vo = -1/C If
dt;
If = Vi/R;
Vo = -1/(RC)
Vi dt;
A typical op-amp is constructed with the following parts: 1) a differential input stage,
which consists of a matched pair of bipolar transistors or field effect transistors (FET's)
that produce an output that's proportional to the difference between the input signals; 2) an
intermediate-gain stage that amplifies the output of the differential input stage; and 3) a
push-pull output stage that is capable of delivering a large current to the load, hence the
small output impedance.
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Because it is an open-loop device, an op amp's function and gain is set by providing it with
external components that generally constitute a feedback circuit between its output and its
inverting input. On the other hand, the gain of an in-amp, which is used primarily as an
amplifier of low-level signals in noisy environments, is either manufacturer-preset or may
be set by the user using an external gain resistor or by manipulating internal resistors via
some of the in-amp's pins.
Of course, an operation amplifier may be utilized as an instrumentation amplifier. This is
done by configuring it as a differential amplifier or subtractor, as shown in Figure 1a, the
circuit of which gives an output voltage Vo that is proportional to the difference between
the input voltages, or Vo = Rf/Ri (V2-V1). This equation may be derived as follows:
1) Vo = -If Rf + Vi where Vi is the voltage at either input of the op amp;
2) but If = (V1-Vo)/(Ri+Rf) and Vi = V2(Rf/(Rf+Ri));
3) thus, Vo = (Vo-V1)(Rf/(Rf+Ri)) + V2 (Rf/(Rf+Ri));
4) or VoRf + VoRi = (V2-V1)Rf + VoRf;
5) simplifying, Vo = Rf/Ri (V2-V1).
A single op amp configured as a subtractor is capable of serving as an in amp for modest
applications, i.e., it can amplify the difference between very small signals and reject those
that are common-mode (or common to both inputs). This circuit, however, suffers from
certain limitations. Commercially available instrumentation amplifier IC's employ multiple
internal op amps to overcome these limitations and provide a much superior differential
amplification performance.
Figure 1b shows an example of a simple in-amp circuit consisting of multiple op amps
(three op amps, to be exact), two of which are used for input buffering with the third one
acting as the subtractor itself. Input buffering eliminates problems associated with
relatively low input resistances or resistance mismatch between inputs.
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There are several types of voltage regulators, which may be classified in terms of how they
operate or what type of regulation they offer. The most common regulator IC is the
standard linear regulator. A typical linear voltage regulator operates by forcing a fixed
voltage at the output through a voltage-controlled current source. It has a feedback
mechanism that continuously adjusts the current source output based on the level of the
output voltage. A drop in voltage would excite the current source into delivering more
current to the load to maintain the output voltage. Thus, the capacity of this current source
is generally the limiting factor for the maximum load current that the linear regulator can
deliver while maintaining the required output level. The amount of time needed for the
output to adjust to a change in the input or load is the transient response time of the
regulator.
The feedback loop used by linear regulators need some form of compensation for stability.
In most linear regulator IC's, the required feedback loop compensation is already built into
the circuit, thereby requiring no external components for this purpose. However, some
regulator IC's, like the low-dropout ones, do require that a capacitor be connected between
the output and ground to ensure stability. The main disadvantage of linear regulators is
their low efficiency, since they are constantly conducting.
The switching voltage regulator is another type of regulator IC. It differs from the linear
regulator in the sense that it employs pulse width modulation (PWM) to regulate its
output. The output is controlled by current that is switched at a fixed frequency ranging
from a few Hz to a few kHz but with varying duty cycle. The duty cycle of the pulses
increase if the output of the regulator needs to supply more load current to maintain the
output voltage and decreases if the output needs to be reduced. Switching regulators are
more efficient than linear regulators because they only supply power when necessary.
Complexity, output ripples, and limited current capacity are the disadvantages of switching
regulators.
There is also a group of regulator IC's known as Low Drop-out (LDO) regulators. The
drop-out voltage is the minimum voltage across the regulator that's required to maintain
the output voltage at the correct level. The lower the drop-out voltage, the less power is
dissipated internally within the regulator, the higher is the regulation efficiency. In LDO
regulators, the drop-out voltage is typically just about 0.6 V. Even at maximum current,
the drop-out voltage increases to just about 0.7-0.8 V.
Examples of applications of regulator IC's include the following: 1) regulated power
supplies; 2) data conversion (ADC/DAC) circuits; 3) sensor and triggering systems; 4)
DC-to-DC voltage converters; 5) measurement and instrumentation systems; 6) motor
control; and 7) battery charging.
Analog Switches
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An analog switch is a solid-state circuit that has one or more channels that can transmit
analog signals when they're in the 'on' state or block them when they're in the 'off' state.
The turning 'on' and 'off' of an analog switch is controlled by a digital gating signal applied
to its control gate. Applications of analog switches include data acquisition, process
control, instrumentation, video systems, and communication systems.
An ideal analog switch has zero resistance when 'on' (or closed), and infinite resistance
when 'off' (or open). It also has a perfectly linear volt-ampere characteristic when
transmitting an analog signal. Of course, analog switches of the real world are not 'ideal'.
Being solid-state semiconductor devices, real analog switches exhibit non-zero 'on'
resistance, a finite 'off' resistance, and a non-linear volt-ampere characteristic.
Just like mechanical switches, analog switches come in a variety of forms, depending on
the number of poles and throws they offer. Thus, terms such as 'SPST' and 'SPDT' (singlepole single throw and single-pole double-throw, respectively) which are commonly used to
describe mechanical switches are also applicable to analog switches. A single IC package
can also have multiple switches in it, each of which corresponds to an analog channel.
There are many circuit configurations that can be used as gates for analog switches, some
of which are very simple, e.g., consisting of just a single diode and several resistors. Most
commercially available analog switches though employ well-engineered bipolar
transistors, field-effect transistors (FET's), or a combination of both in their channels for
the transmission or blocking of analog signals. FET's are widely used in analog switches
because of their high 'off' resistance and low 'on' resistance. Figure 1 shows a simplified
CMOS analog switch circuit.
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The effect of this entire configuration is that one value of Vc will turn both transistors 'off'
and the other value of Vc will turn at least one transistor 'on'. In the latter case, which
transistor is conducting depends on the current value of analog input Vin. The analog
switch is 'off' if both transistors are 'off', and it is 'on' if at least one of the transistors is 'on.'
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integrated power management solution for the add-on features in new-generation mobile
phones, e.g., camera modules, sound systems, memory modules, Bluetooth modules, etc.
Analog Devices (ADI) is another major company that produces a large selection of power
management IC's. For instance, the ADP3806 is a stand-alone Li-Ion battery-charging IC
that combines high output voltage accuracy with precise current control to improve the
performance and reduce the design complexity of Constant-Current, Constant-Voltage
(CCCV) chargers. Other examples of battery chargers from ADI are: the ADP2291
Compact, 1.5 A Linear Charger for Single-Cell Li+ Battery; the ADP3804 High Frequency
Switch Mode Li-Ion Battery Charger; and the ADP3820 - 1% Precision, Single Cell LiIon Battery Charger.
ADI also manufactures GSM Power Controllers, which provide all of the power
management functions required to properly power ADI's industry-leading GSM/GPRS
chipsets. Examples of GSM power controllers from ADI are the ADP3404, the ADP3405,
and the ADP3522.
Another group of power management IC's from Analog Devices are known as
Microprocessor Supervisors and Reset Generators. These circuits monitor power supply
voltage levels and code execution integrity in microprocessor-based systems. Aside from
providing power-on reset signals, an on-chip watchdog timer can also reset the
microprocessor if it fails to strobe within a preset timeout period. A reset signal can also be
asserted by means of an external push-button, through a manual reset input. Examples of
microprocessor supervisory IC's and reset generators are the ADM6316; the ADM823; and
the ADM8617.
Aside from the above products, other power management IC's offered by ADI include: 1)
temperature sensors; 2) charge pumps for generating higher voltages from low voltage
inputs, using capacitors as storage elements; 3) hot swap controllers for providing accurate
inrush current control and protection against over-current events and voltage faults; 4) low
dropout linear regulators; 5) dual MOSFET drivers for use in non-isolated synchronous
buck power converters; 6) voltage sequencing and voltage tracking ICs for sequencing
multiple power supplies; 7) switching regulators that operate in step up, step down, and
inverting modes, and capable of generating a fixed or adjustable output voltage; and 8)
hardware system monitoring IC's.
Opto-Couplers
Optocouplers, also known as Opto-isolators, are devices that provide optical isolation and
coupling between two circuits, creating physically- and electrically-isolated signal
coupling between them. Optocouplers, which can be assembled using traditional
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semiconductor packages, contains both a light emitting diode (LED) and a photosensitive
semiconductor device in the same housing.
The LED and the photosensitive device of an optocoupler are assembled in close
proximity with each other within the package, arranged in such a way that the light emitted
by the LED would strike the photosensitive device and trigger it into conduction. The
photosensitive device is usually a transistor, SCR, or triac in normally non-conducting
state. In such an arrangement, therefore, the photo-emitting device is the transmitter and
the photo-sensing device is the receiver.
waveform. Some examples of these waveform generator IC's are presented below, with
brief descriptions provided by their respective manufacturers in their websites.
(FM) can be accomplished with an external control voltage. Each of the three basic
waveform outputs, (i.e., sine, triangle and square) are simultaneously available from
independent output terminals. The XR8038A monolithic waveform generator uses
advanced processing technology and Schottky barrier diodes to enhance its frequency
performance
Accelerometers
An accelerometer is a device that measures acceleration, or the rate of change of velocity
with respect to time. Accelerometers come in various forms and sizes, but cutting edge
micromachining technology advancements in recent years have allowed them to be built in
microchip form. Today, there are a multitude of semiconductor companies that
manufacture accelerometer IC's that not only measure linear acceleration, but other
parameters as well such as angular speed, vibrations, shock, and even tilt positions.
One of the pioneers in fabricating accelerometers in integrated circuit form is Analog
Devices, which produces the ADXL50 accelerometer. The ADXL50 provides an output
voltage that varies
proportionally with the amount of acceleration experienced along its sensitive axis. It has
an input range of -50g to +50g, with a sensitivity of approximately 1 V per 50 g. Thus, a
50-g acceleration would either decrease or increase the output at 0 g by 1V, depending on
the direction of the acceleration. Since the ADXL50 is calibrated to output 1.8V when
there is no acceleration, the output would either 0.8 V or 2.8 V at 50 g, again depending on
the acceleration's direction.
The ADXL50 is an example of a capacitive accelerometer, i.e., it measures capacitances in
order to measure the acceleration. This accelerometer applies two basic principles of
physics in its operation. The first one is Hooke's Law, which states that a spring, when
stretched, will exert a restoring force F that's proportional to its increase in length x, i.e., F
= kx. The second one is Newton's Second Law, which states that the force F exerted by a
body is equal to its mass m multiplied by its acceleration a, i.e., F = mA.
Combining these two equations, A = kx/m, which means that a body with mass m will
stretch a spring (whose elongation property is characterized by k) by a distance of x if its
acceleration is A. The ADXL50 has a mass-spring system consisting of a bar of silicon
(which is the mass) that is held by four tethers (one at each corner), as shown in Figure 1.
The four tethers, the feet of which are anchored, compose the spring system. When the
mass is subjected to an acceleration, it moves with respect to the anchored feet of the
tethers, causing the tethers to 'stretch' like a spring. The greater the acceleration
experienced, the larger is the displacement. This system therefore translates the
acceleration into a displacement, allowing the acceleration to be measured by measuring
the displacement.
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motor being driven. Experimentation may therefore be required on the part of the hobbyist
to make this circuit work.
Characteristics or features that designers take into consideration when choosing a stepper
motor controller IC include the following: 1) the ability to put a stepper motor in
continuous 'run' mode at various speed profiles, or in 'step' mode with precision control; 2)
directional control; 3) available stepping modes for resolution control; 4) programmability;
5) specialized I/O controls; 6) feedback mechanisms about the state of the stepper motor;
7) effective and efficient energization of the stepper motor; 8) industry-standard user
interfaces; and 9) ease of use.
Servo Motor Controllers
A servo motor is a motor whose angular displacement at any one time is determined by a
coded signal, which is usually the width of the pulse applied to its control terminal. It is
operated in a closed loop, i.e., it requires some form of analog feedback (usually provided
by a potentiometer) to let it know the current rotor position. Thus, the repeatability of a
servo motor's positioning depends greatly on the stability of the potentiometer and other
components used in the feedback circuit. Since a stepper motor operates without feedback,
a servo motor is a better choice than a stepper motor if monitoring of the rotor position at
any given time is important.
Since a servo motor operates on the widths of the control pulses it receives, a servo motor
controller must be capable of pulse width modulation (PWM). The servo motor expects to
see a pulse regularly, say, every 20 milliseconds. The pulse width influences the amount of
power delivered to the motor and, therefore, its angular displacement as well, i.e., the
longer the pulse, the larger the rotation will be.
Examples of features offered by servo motor controller IC's in the market include : 1)
ability to support multiple motors; 2) velocity and trapezoidal profiling; 3) directional
control; 4) programmability; 5) specialized I/O controls; 6) stable feedback mechanisms;
7) overcurrent and power failure protection; 8) industry-standard user interfaces; and 9)
ease of use.
4-Phase Stepper Motor Transistor Driver
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Figure 1. Circuit Diagram for a 4-Phase Stepper Motor Driver Using NPN Transistors
This is a circuit for driving a 4-phase stepper motor using 4 digital signals from a source of
digital control signals such as a computer or a stepper motor controller IC. A stepper motor
is actuated by energizing its internal windings one at a time, i.e., the motor shaft turns a
fraction of a revolution every time a winding is energized. The shaft of a stepper motor
'locks' into place after the incremental turn is made, even if the power to the winding is
sustained. Thus, to turn the motor shaft continuously, the windings must be energized
sequentially in continuous cycles.
The basic pattern for energizing the windings in sequence is conveniently achieved by
digital means, such as from the output port of a computer or from the digital outputs of a
stepper motor controller IC. These digital signals, however, are not strong enough to drive
the windings of a stepper motor directly, so there's a need to 'amplify' the current capacity
of these signals. This is achieved by using these digital signals to drive the base of a power
transistor, which in turn drives the windings of the stepper motor, as shown in Figure 1
above.
In this circuit, a logic '1' is fed into the base of a transistor to energize the winding that's
connected to the transistor. This logic '1' input turns on the transistor, allowing current to
pass through the winding from the 12V supply to ground, energizing the winding in the
process. Inputting a logic '0' to the base of the transistor turns it off, cutting off the current
flow through the winding.
Phase-Locked Loop IC's
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Charge-Coupled Devices
A Charge-Coupled Device, or CCD, is basically an array of closely-spaced metal-oxidesemiconductor (MOS) diodes that can store and transfer information using packets of
electric charge, or charge packets. Applying the proper sequence of voltage pulses (clock
signals) to a CCD biases the array of MOS diodes into the deep depletion region where the
charge packets may be moved in a controlled manner across the semiconductor substrate.
Some people also refer to a CCD's MOS diodes as 'MOS capacitors.'
There are two basic types of CCD, namely, the surface channel CCD (SCCD) and the
buried channel CCD (BCCD). Charge is stored and transferred at the semiconductor
surface in the SCCD, while in the BCCD, the charge packets are stored and transferred in
the bulk semiconductor below the surface.
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Aside from the nature of its application, an ASIC differs from a standard product in the
nature of its availability. The intellectual property, design database, and deployment of an
ASIC is usually controlled by just a single entity or company, which is generally the enduser of the ASIC too. Thus, an ASIC is proprietary by nature and not available to the
general public. A standard product, on the other hand, is produced by the manufacturer for
sale to the general public. Standard products are therefore readily available for use by
anybody for a wider range of applications.
The first ASIC's, known as uncommitted logic array or ULA's, utilized gate array
technology. Having up to a few thousand gates, they were customized by varying the
mask for metal interconnections. Thus, the functionality of such a device can be varied by
modifying which nodes in the circuit are connected and which are not. Later versions
became more generalized, customization of which involve variations in both the metal and
polysilicon layers.
ASIC's are usually classified into one of three categories: full-custom, semi-custom, and
structured.
Full-custom ASIC's are those that are entirely tailor-fitted to a particular application from
the very start. Since its ultimate design and functionality is pre-specified by the user, it is
manufactured with all the photolithographic layers of the device already fully defined, just
like most off-the-shelf general purpose IC's. The use of predefined masks for
manufacturing leaves no option for circuit modification during fabrication, except perhaps
for some minor fine-tuning or calibration. This means that a full-custom ASIC can not be
modified to suit different applications, and is generally produced as a single, specific
product for a particular application only.
Semi-custom ASIC's, on the other hand, can be partly customized to serve different
functions within its general area of application. Unlike full-custom ASIC's, semi-custom
ASIC's are designed to allow a certain degree of modification during the manufacturing
process. A semi-custom ASIC is manufactured with the masks for the diffused layers
already fully defined, so the transistors and other active components of the circuit are
already fixed for that semi-custom ASIC design. The customization of the final ASIC
product to the intended application is done by varying the masks of the interconnection
layers, e.g., the metallization layers.
Structured or Platform ASIC's, which belong to a relatively new ASIC classification, are
those which have been designed and produced from a tightly defined set of: 1) design
methodologies; 2) intellectual properties (IP's); and 3) well-characterized silicon, aimed at
shortening the design cycle and minimizing the development costs of the ASIC. A
platform ASIC is built from a group of 'platform slices', with a 'platform slice' being
defined as a pre-manufactured device, system, or logic for that platform. Each slice used
by the ASIC may be customized by varying its metal layers. The 're-use' of premanufactured and pre-characterized platform slices simply means that platform ASIC's are
not built from scratch, thereby minimizing design cycle time and costs.
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Examples of ASIC's include: 1) an IC that encodes and decodes digital data using a
proprietary encoding/decoding algorithm; 2) a medical IC designed to monitor a specific
human biometric parameter; 3) an IC designed to serve a special function within a factory
automation system; 4) an amplifier IC designed to meet certain specifications not
available in standard amplifier products; 5) a proprietary system-on-a-chip (SOC); and 6)
an IC that's custom-made for a particular automated test equipment.
RLC Measurement
The circuits on this page are types of bridge circuits, which are very useful in measuring
unknown values of R, L, and C based on known values of the other components in the
same bridge circuit. The potentiometers and other variable components in the bridge are
adjusted until the reading of the meter at the center of the bridge becomes zero, in which
case the bridge is said to be balanced.
Figure 1. Circuit Diagrams for a Resistance Bridge (left) and a Capacitance Bridge (right)
In Figure 1, the circuit on the left is a simple Wheatstone bridge. When this bridge is
balanced, R1/R2=R3/R4. The circuit on the right is a capacitance bridge which is
balanced when: C2 = C1(R1/R2) and R4 = R3(R2/R1).
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A series LC circuit that is in resonance, i.e., excited by a signal at its resonant frequency,
exhibits zero reactance. On the other hand, a parallel LC circuit exhibits infinite reactance
at its resonant frequency. Series and parallel LC circuits may therefore be combined to
form either a band-pass filter or a band-stop filter.
The frequency at which resonance in a tuned LC circuit occurs is given by the following
formula:
fr = 1 / [2(sqrt(LC))] where
fr = resonant frequency (Hz);
L = the inductance (H); and
C = the capacitance (F).
Using the equation above, one can calculate either the value of the inductance L or
capacitance C that will result in resonance at a given frequency fr: L = 1 / [42fr2C] or C =
1 / [42fr2L].
The ratio of the reactance of the tuned circuit to its resistance is called the "quality factor",
or Q factor, or simply Q. Thus, Q is the ratio of the energy stored to the energy dissipated
in the circuit per cycle.
The reactance of an inductance L is equal to 2fL while that of a capacitance C is equal to
1/2fC. Thus, for a series RL circuit, the quality factor Q is given by the equation: Q =
2frL / R. On the other hand, the quality factor Q for a series RC circuit is given by the
equation: Q = 1 / 2frCR.
The quality factor Q of a tuned circuit is given by the equation: Q = fr / B where B is the
bandwidth of the circuit in Hz. The bandwidth of a circuit is the frequency interval
between its half-power points f2 and f1, or B = f2 - f1. Thus,
Q = fr / (f2 - f1).
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A Band-Stop Filter is a circuit that allows most frequencies to pass, but blocks or
attenuates a certain range or band of frequencies. It is also known as a 'band-elimination'
filter or a 'band-rejection filter'. The band-stop filter is the opposite of the band-pass filter.
The range of frequencies that a band-stop filter blocks is known as the 'stopband', which is
bound by a lower cut-off frequency f1 and a higher cut-off frequency f2. A special type of
band-stop filter, known as the 'notch filter', is one whose stopband is very narrow, thus
creating a 'notch' in the frequencies allowed to pass. The notch filter is therefore a bandstop filter that has a high Q factor. Combining several notch filters together forms a 'comb
filter', which is a filter that has multiple stopbands.
An ideal band-stop filter is one whose stopband is completely rejected by it, while
allowing all other frequencies to pass unchanged (no gain nor attenuation). In an ideal
band-stop filter, the transition of the response from outside the stopband to within the
stopband and vice versa is instantaneous. Of course, an ideal notch filter doesn't exist in
the real world, i.e., complete attenuation within the stopband can not be achieved while
frequencies outside the stopband undergo some level of attenuation.
The over-all impedance of a resonant series LC circuit consisting of an inductor and a
capacitor in series with each other will drop to zero at the resonant frequency because the
reactances of the inductor and the capacitor cancel each other out under resonance. On the
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retains its current level if the input is in between the two thresholds.
The circuit got its name from its inventor, US scientist Otto Schmitt. It is called a trigger
because the output doesn't change until the change in input is large enough to 'trigger' a
reversal in the level of the output.
The fact that the Schmitt trigger responds to two input thresholds and exhibits an output
that depends on the 'history' of the input implies that the circuit has some memory. This
phenomenon is also known as 'hysteresis', which is defined as the dependence of an output
signal upon the history of prior inputs and the direction of the current traversal of the
input.
As shown in Figure 1, the electronic symbol for a Schmitt trigger is a triangle with a
curved image inside. This curved image is actually the symbol for hysteresis.
The parallel paths are 'bridged' together by another electrical path that usually contains a
load or a measuring device (such as a galvanometer), hence the name 'bridge circuit.'
Bridge circuits are primarily used in measurement applications and power supplies.
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The best known bridge circuit is the Wheatstone Bridge, which is shown in Figure 1. Here,
one can see that the circuit splits into two paths; the left path contains R2 and R1 while the
right path contains R3 and Runknown. The two parallel paths are bridged together by an
ammeter or galvanometer connected between nodes A and B.
The Wheatstone Bridge is used for accurately measuring the value of Runknown, provided
that the values of the other resistors are known and may be adjusted. To know more about
how a Wheatstone Bridge works, please see this separate article on the Wheatstone Bridge.
Wien Bridge
Schering Bridge
Hay Bridge
Owen Bridge
Maxwell Bridge
Resonance Bridge
The Wheatstone Bridge
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cancel out, so
2fC2R3 = 2fC1R2 or
R3 = C1R2 / C2.
Similarly, when the bridge is balanced, the purely resistive components are equal, so
C2/C3 = R2/R1 or
C3 = R1C2 / R2.
Note that the balancing of a Schering Bridge is independent of frequency.
The Hay Bridge
A Hay Bridge is an AC bridge circuit used for measuring an unknown inductance by
balancing the loads of its four arms, one of which contains the unknown inductance. One
of the arms of a Hay Bridge has a capacitor of known characteristics, which is the
principal component used for determining the unknown inductance value. Figure 1 below
shows a diagram of the Hay Bridge.
Like other bridge circuits, the measuring ability of an Owen Bridge depends on 'balancing'
the circuit. Balancing the circuit in Figure 1 means adjusting R1 and C1 until the current
through the bridge between points A and B becomes zero. This happens when the voltages
at points A and B are equal. When the Owen Bridge is balanced, it follows that Z2/Z1 =
R3/Z4 wherein Z2 is the impedance of C2, Z1 is the impedance of the arm containing C1
and R1, and Z4 is the impedance of the arm containing L1 and R4. Mathematically, Z2 =
1/(2fC2); Z1 = R1 + 1/(2fC1) while Z4 = R4 + 2fL1.
Thus, when the bridge is balanced,
1/(2fC2)/[R1 + 1/(2fC1)] = R3 / [R4 + 2fL1]; or
[R4 + 2fL1]= (2fC2R3) [R1 + 1/(2fC1)]; or
R4 + 2fL1 = 2fC2R3R1 + C2R3/C1
When the bridge is balanced, the negative and positive reactive components are equal and
cancel out, so
2fL1 = 2fC2R3R1 or
L1 = C2R3R1.
Similarly, when the bridge is balanced, the purely resistive components are equal, so
R4 = C2R3/C1.
Note that the balancing of an Owen Bridge is independent of frequency.
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Figure 1. Interfacing any TTL gate to any CMOS gate using the same power supply (5V)
When the CMOS gate that the TTL gate will drive also uses the same 5-V supply used by
the TTL gate, the simple interfacing technique shown in Figure 1 may be employed. Here,
a pull-up resistor is just placed between the TTL output and the 5-V supply.
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Figure 2. Interfacing an Open-Collector TTL gate to any CMOS gate using different
power supplies
When the CMOS gate that the TTL gate will drive has a supply voltage that's different
from the 5-V supply used by the TTL gate and if the TTL gate has an open collector, the
simple interfacing technique shown in Figure 2 may be employed. Here, a 10-K pull-up
resistor is just placed between the TTL output and the CMOS gate's supply.
Figure 3. Interfacing any TTL gate to any CMOS gate using different power supplies
When the CMOS gate that the TTL gate will drive has a supply voltage that's different
from the 5-V supply used by the TTL gate and if the TTL gate does not have an open
collector, it would be good to use an NPN transistor to translate the TTL output voltage
level to a correct CMOS input voltage level as shown in Figure 3 so as not to overstress
the TTL gate.
CMOS-to-TTL Interfacing Techniques
There are instances wherein the output of a CMOS logic gate needs to be used for driving
the input of a TTL gate. Since the voltage-current characteristics and requirements of a
CMOS gate differ from those of a TTL gate, it is good practice to use proper interfacial
components between them when connecting them to each other. Below are some common
techniques used in connecting a CMOS gate to a TTL gate.
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Figure 1. Interfacing any CMOS gate to any TTL gate using the same power supply (5V)
When the CMOS gate that will drive the TTL gate also uses the same 5-V supply used by
the TTL gate, the simple interfacing technique shown in Figure 1 may be employed. Here,
a pull-down resistor is just placed between the CMOS gate output and ground.
Figure 2. Interfacing an Open-Collector TTL gate to any CMOS gate using different
power supplies
When the CMOS gate that will drive the TTL gate has a supply voltage that's different
from the 5-V supply used by the TTL gate, it would be good to use an NPN transistor to
translate the CMOS output voltage level to a correct TTL input voltage level as shown in
Figure 2. Note that the transistor uses the 5-V TTL supply for its Vcc.
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Figure 3. Interfacing any TTL gate to any CMOS gate using different power supplies
As an alternative to the technique shown in Figure 2, the technique shown in Figure 3 may
be employed to connect a CMOS gate to a TTL gate. Instead of a transistor, a CMOS
buffer (inverting or non-inverting) may be used as long as it is supplied from the 5-V TTL
supply. The example in Figure 3 is an inverting buffer, so the input to the TTL gate is an
inverted logic of the CMOS output.
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Figure 1. Interfacing an Op Amp or Comparator to any CMOS gate using the same power
supply
When the op amp or comparator uses the same power supply as the CMOS gate that it is
driving, the simple interfacing technique shown in Figure 1 may be employed. Here, a
current-limiting resistor is just placed between the op amp/comparator output and the
CMOS gate input.
Figure 2. Interfacing an Op Amp or Comparator to any CMOS gate using using different
power supplies
When the op amp or comparator uses a power supply that's different from the supply used
by the CMOS gate that it is driving, the simple interfacing technique shown in Figure 2
may be employed. Here, aside from a current-limiting resistor between the op amp output
and the CMOS gate input, input protection diodes are placed between the gate input and
the positive supply and between the gate input and ground.
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Figure 3. Interfacing an Op Amp or Comparator to any TTL gate using the same power
supply
When the op amp or comparator uses the same 5-V power supply as the TTL gate that it is
driving, the simple interfacing technique shown in Figure 3 may be employed. Here, a
current-limiting resistor is just placed between the op amp/comparator output and the TTL
gate input. A shunt resistor is also placed across the gate input and ground.
Level-Shifting Opto-Isolator Circuits
Opto-isolator devices may be used for voltage level-shifting purposes. Below are
examples of level-shifting circuits that utilize opto-isolators (one non-inverting and one
non-inverting).
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tapped output to be very near 12V. When the input is low (close to 0V), the LED conducts,
shining light on the phototransistor. The transistor turns on and pulls the output to ground.
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output inverter's input) to be high. This causes the circuit's output to be low. When the
input is high, the LED conducts, shining light on the phototransistor. The transistor turns
on and pulls the output inverter's input to ground, causing the output to go high. Note that
R1 is chosen so as not to overload the output of the input inverter when the LED is
conducting.
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Figure 2 shows how a light-emitting diode (LED) may be controlled by a TTL or CMOS
output. In this configuration, the LED turns on when the output of the gate is 'high'. A
current-limiting resistor is placed between the LED and the gate output to protect both the
LED and the output. The lower the resistor, the brighter is the LED when it is lit. If the
output of the gate is driving just the LED, the resistor may be as low as 330 ohms for a 5V
supply. However, if the gate output will also be used to drive another gate's input, the
current through the LED must be reduced significantly (by using a much higher resistor) to
ensure that the gate's high output voltage will still meet the minimum level required to be
recognized as a '1'.
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output inverter's input) to be high. This causes the circuit's output to be low. When the
input is high, the LED conducts, shining light on the phototransistor. The transistor turns
on and pulls the output inverter's input to ground, causing the output to go high. Note that
R1 is chosen so as not to overload the output of the input inverter when the LED is
conducting.
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Digital devices need to interface with mechanical relays and LED's from time to time.
Below are examples of how TTL and CMOS digital outputs are usually connected to
relays and LED's.
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which forces the output of NOR A to go to '1' since Y1 is also '0' at this point. The change
of NOR A's output to '1' stabilizes the output of the circuit at '0'. Again, the mechanical
switching action was transformed by the circuit into a clean digital transition from '1' to '0'.
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At this point, X1 also goes to '1', keeping the output of NOR A at '0' and the output of
NOR B at '1'. In effect, the switching action of the mechanical switch was transformed by
the two NOR gates into a clean digital transition from '0' to '1' at the circuit's output.
Throwing the mechanical switch back to '0' causes Y1 to go to '0' and Y2 to go to '1'. This
causes the output of the circuit (output of NOR B) to go to '0'. This causes X1 to go to '0',
which forces the output of NOR A to go to '1' since Y1 is also '0' at this point. The change
of NOR A's output to '1' stabilizes the output of the circuit at '0'. Again, the mechanical
switching action was transformed by the circuit into a clean digital transition from '1' to '0'.
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As mentioned, the IP and the TCP are the most important components of the internet
protocol. The IP is a connectionless protocol while TCP is connection-oriented, i.e., it
establishes connection and maintains it until the required data exchanges have been
completed.
The TCP
The connection-oriented transport protocol TCP enables two hosts to establish a reliable
connection and exchange data, guaranteeing not only delivery of the data, but their
delivery in the same order as they were sent as well. It transmits data as an unstructured
stream of bytes.
The TCP employs sequence numbers and acknowledgement messages to provide the
sending node with information about the delivery of the data packets transmitted to the
destination node. If data is lost during transmission, the TCP can retransmit the data until
they are successfully delivered, or until a time-out condition is reached. The TCP can also
slow down the rate of flow of data transfer if the sending computer is too fast for the
receiving computer. Delivery information can also be relayed by the TCP to upper-layer
protocols and other applications.
The TCP, which is in the Transport Layer, runs on top of the internet protocol (IP), which
is in the Network Layer.
The IP
The IP is considered to be the 'heart' of the internet protocol suite. It is in the third layer of
the TCP/IP layer structure. Its primary function is routing of data between interconnected
networks, but it also provides error reporting as well as fragmentation and reassembly of
data units for inter-network transmission. IP networks all over the world communicate
with each other through globally unique IP addresses, each of which consists of 3 parts.
The first part of the IP address is the network address, the second part is the subnet
address, and the third part is the host address.
COMMUNICATION ELECTRONICS
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through to the attached listening device. What this means is that the simplest receiver
must, at the minimum, be a demodulator.
Impedance-Matching Between Driving and Driven Stages
In a typical transmitter system, the basic carrier signal generated by the transmitter
oscillator needs to be amplified several times before it is radiated out by the antenna. This
amplification process may require the passing of the signal from one stage to another. The
goal is to maximize the transfer of power from one amplification stage to the next.
A driving stage may be modeled as an RF generator with an internal impedance Zin, while
the driven stage may be modeled as an impedance Zload, as shown in Figure 1.
Figure 1. Models for Driving and Driven Stages: Zin=Zload under ideal conditions
Recall that maximum transfer of power occurs when Zin = Zload. Thus, efficient transfer
of power from one stage to the next can be achieved by using special circuits that match
the impedance Zin of the driving stage to that of the driven stage, Zload. These circuits are
commonly referred to as impedance-matching circuits or impedance-matching networks,
as shown in Figure 2.
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transmission over the analog channel may be considered as analog-to digital conversion.
Sending digital data over a telephone line via a modem is an example of this.
Many techniques exist for both analog and digital modulation. In fact, amplitude
modulation alone can be implemented in many ways including: Double-Sideband
Modulation (DSB), Single-Sideband Modulation(SSB), Vestigial Sideband Modulation
(VSB), etc. Each of these AM techniques has many different kinds too. The analog
modulation techniques of FM and PM (which were defined earlier in this article), are kinds
of angle modulation.
Techniques used in digital modulation include:
1) Phase-Shift Keying (PSK), wherein data are represented by modulating the phase of the
carrier signal, i.e., a finite number of phases are used, each one corresponding to a unique
pattern of binary bits;
2) Frequency-Shift Keying (FSK), wherein data are represented by discrete changes in the
frequency of the carrier signal, e.g., a certain frequency is used to represent '1' while
another is used for '0'; and
3) Amplitude-Shift Keying (ASK), wherein data are represented by discrete levels of the
amplitude of the carrier signal; and
Another modulation technique, known as 'Quadrature Amplitude Modulation' or QAM,
modulates the amplitudes of two carrier waves that are out of phase with each other by 90
degrees (hence the term 'quadrature'). QAM can be employed both in digital and analog
modulation by ASK or AM, respectively.
Note that each of these major analog and digital techniques also comes in many different
and special forms, each providing a solution to the vast requirements of the enormous
telecommunications industry.
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collector of the transistor. A tuned LC circuit at this collector output allows only the
difference frequency (fo-fs) to pass to the mixer's output.
The mixer in Figure 2 is commonly used in radio receivers for translating a signal to a
lower frequency, where it is easier to achieve high gain and good selectivity.
Doppler Effect and Doppler Frequency
Doppler Effect refers to the shift in the observed or perceived frequency of an
electromagnetic or sound wave due to the motion of the source of the wave relative to the
observer. The following equations apply.
Sound Waves
fo = fs [(v + w + vo) / (v + w - vs)]
where fo = observed or perceived sound frequency (Hz)
vo = velocity of observer (m/s)
vs = velocity of source (m/s)
v = velocity of sound in the medium (m/s)
w = velocity of the wind in the direction of sound propagation (m/s)
fs = frequency of the source (Hz)
Electromagnetic Waves
fo = fs (sqrt[(c + vr) / (c - vr)])
where fo = observed or perceived electromagnetic wave frequency (Hz)
fs = frequency of the source (Hz)
vr = velocity of source relative to the observer (m/s)
c = speed of light in vacuum (3e8 m/s)
Antenna Formulas
Below are some commonly used formulas for designing an antenna.
1) Length of Ideal Hertz Antenna
L= /2
where L = length of the Hertz Antenna
= wavelength
2) Length of Ideal Marconi Antenna
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L= /4
where L = length of the Marconi Antenna
= wavelength
3) Power Received by a Hertz Antenna
P = (PtGtGr2) / (162d2)
where P = received power (W)
Pt = transmitted power (W)
Gt = gain ratio of transmitting antenna relative to an isotropic radiator
Gr = gain ratio of receiving antenna relative to an isotropic radiator
= wavelength (m)
d = distance between antennas (m)
4) Effective Radiated Power
ERP = G x Pi
where G = gain of transmitting antenna relative to an isotropic radiator
Pi = input power (W)
Amplitude Modulation (AM) Equations
Amplitude Modulation (AM) is a method of modulation wherein the carrier amplitude
changes with the amplitude of the input signal. Simply put, amplitude modulation
generates a signal with power concentrated at its carrier frequency and its two sidebands.
These side bands are bands of frequencies above and below the carrier frequency. They
have equal bandwidths, and are mirror images of each other.
AM is not an efficient way to modulate - much of its power is wasted. At least 2/3 of the
power is used by the carrier signal, while the remaining power is split between the two
equal sidebands.
Percent Modulation
M = [(Ec - Et) / (2Ea)] x 100%
or
M = [(Ec - Et) / (Ec+Et)] x 100%
where
M = % Modulation
Ec = crest amplitude of the modulated carrier
Et = trough amplitude of the modulated carrier
Ea = average amplitude of the modulated carrier
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Sideband Power
Ps = M2Pc / 2
where
Ps = sideband power of an AM carrier, W
M = %Modulation
Pc = carrier power, W
Total Radiated Power
Pt = Ps + Pc
where
Pt = total radiated power, W
Ps = sideband power, W
Pc = carrier power, W
Frequency Modulation (FM) Equations
Frequency Modulation (FM) is a method of modulation wherein information is transmitted
as variations in the instantaneous frequency of the carrier signal. In analog FM, the carrier
frequency is changed in direct proportion to variations in the input signal's amplitude.
The modulation percentage for FM is defined simply as the ratio of actual frequency
variation to the maximum frequency deviation expressed in %. Thus, 100% modulation
means that the carrier's frequency variation covers the entire allowable amount, i.e., its
maximum frequency deviation. This maximum deviation frequency is chosen arbitrarily
according to the application of the FM transmitter.
For example, if the modulating signal's frequency band is from 80 kHz below the carrier
frequency to 80 kHz above it, then 50% modulation means that the carrier's frequency is
being deviated by only 40 kHz above and below the resting frequency of the carrier signal.
The following equations apply to FM.
Percent Modulation
M = [f / D] x 100%
where
M = % Modulation
f = change in frequency
D = maximum frequency deviation, i.e., frequency deviation for 100% modulation
Modulation Index
Mi = fd / fa
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where
Mi = modulation index
fd = deviation frequency, kHz
fa = modulating audio frequency, kHz
Squelch Circuit
When there's a received signal, Q1 gets a high base voltage from the AGC amplifier,
turning it on. Q2's base is pulled 'low' by the conducting Q1, causing Q2 to turn off. With
Q2 'off', the audio signal from Q3's collector is readily passed on to the audio power
amplifier.
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