Thermal Analysis of PCM Based Building Wall For Cooling
Thermal Analysis of PCM Based Building Wall For Cooling
Thermal Analysis of PCM Based Building Wall For Cooling
C and
1.76 kJ/kgk. Thermal conductivity of the gypsum wallboard is
0.17 w/mk and lauric acid is 0.14w/mk .Using the above
properties packed PCM in the brick wall was developed. The
third layer of wallboard consists of ventilation hole and its
diameter is 0.2m, which is used to dissipate the generated heat
to the atmosphere.
2.7 ADVANTAGES OF PCM
(1) Freeze without much super cooling.
(2) Ability to melt congruently.
(3) Self nucleating properties.
(4) Compatibility with conventional material of
construction.
(5) No segregation.
(6) Chemically stable.
(7) High heat of fusion.
(8) Safe and non-reactive.
(9) Recyclable.
3. THERMAL ANALYSIS OF WALLBOARD
The thermal analyses of the wallboard with brick wall have
been performed. In order to generate heat in the room and
heat is transferred to the composite wallboard and heat
dissipated to the outside of the room should be calculated.
3.1CALCULATION OF TOTAL HEAT
GENERATION IN THE ROOM:
Specific heat of air (C
P
) =1.005 kJ/kg .K
Max temp of the room (T
max
) = 38
c
Minimum temp of the room (Tmin)=25
c
Density of air (air) = 1.165Kg/m
3
@ 30
Q
Room
=
air
. V
R
.C
p
. (T
max
T
min
)
Q
Room
= 316.122 k w
3.2 ONE DIMENSIONAL STEADY STATE
CONDUCTION EQUATION.
Heat is transferred to the composite wallboard, Consider
the setup is composite wallboard
Thickness of the wallboard (L
1,
L
3
) =0.2, 0.4m
Thickness of the PCM (L2) =0.1m
Thickness of the concrete wall (L
4
) =0.20m
Thermal conductivity of the wallboard (k
1,
k
3
) =0.17W/mk
Thermal conductivity of the PCM k
2
=0.15W/mk
Thermal conductivity of the concrete wall k
4
=1.4W/mk
Q
wallboard
= (T
max
T
min
) /R
thermal
R
thermal
= 1/A [1/h
a
+ L
1
/K
1
+ L
2
/K
2
+
L
3
/K
3
+ L
4
/K
4
+1/ h
b
]
Q
wall
= 0.294 kW
Heat absorbed by the PCM is dissipated by atmospheric air
circulated in the ventilation hole
Q
dissipation
= h.A. (T
max
T
min
)
Q
dissipation
dissipation by air circulation
h heat transfer coefficient
h = 31.8 w/m
2
k
Calculate free convection method of vertical surface of a plate
Calculate Grashoff number
Thickness of the hole (x) =0.2m
Kinematic viscosity of the air (
2
) = 16.0010
-3
m
2
/s
Local Nusselt number (
NU
X
)
G
rx
= g..x
3
. (T
max
T
min
)/
2
- 1/T
F
T
F
- Film coefficient
T
F
= (T
max
+ T
min
)/2
= (37+28)/2
T
F
= 32.5
c
= 1/32.5=0.03
G
rx
= 9.810.030.003
3
(37-28)/ 16.0010
-6
G
rx
= 496
If the condition is laminar flow G
rx
. p
r
<10
9
P
r
- Prandtl number of atm air 0.701
G
rx
. P
r
= 4960.701
G
rx
. p
r
= 347.64
laminar flow for constant temperature.
3.3 CONSTANT WALL TEMPERATURE
NU
X
= 0.508p
r
0.5
(0.952+ p
r
)
-0.25
G
rx
0.25
(for constant heat
flux)
NU
X
= 0.508(0.701)
0.5
(0.952+ 0.701)
-0.25
(496)
0.25
NU
X
= 1.78
Avg
N
UX
=3.56
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855
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NU
X
= hd/k
NU
X
= local Nusselt number
NU
X
= hx/k
3.56 =h0.003/0.02675
h = 31.8 W/m
2
K
Q
dissipation
= h.A. (T
max
T
min
)= 31.8 33(37-28)
Q
dissipation
= 2.576 KW
In this analytical calculation method concluded that
316.122KW amount of heat is generated in the inside of the
room. Considering the one dimensional steady state
conduction equation, 0.294KW amount of heat is transferred
to the composite wallboard. If the atmospheric air is
circulated in the ventilation hole free convection takes place.
Therefore 2.576KW amount of heat is dissipated to the
atmosphere.
3.4 THERMAL ANALYSIS USING ANSYS
1. ELEMENTAL SELECTION
The elemental type is used in this thermal analysis.
Because of its suitable for the accurate thermal performance
for the thermal storage in building application.Tet node 87
can used for the 2 dimensional steady-state or transient
analysis.
2. MATERIAL PROPERTIES
The thickness of the wallboard is 0.2m and thickness of the
PCM layer is 0.1m ana thickness of the brick wall is 0.20m.
Each layer consist of 1m height and thermal conductivity of
the gypsum wallboard is 0.17 w/mk and lauric acid is
0.14w/mk, brick wall is 1.4 w/mk and lauric fatty acid density
about 1.007Kg/m
3
, Specific heat of solid PCM 1.76 kJ/kgK.
The third layer of wallboard consist of ventilation hole and its
diameter isof.001m.Using the above properties packed PCM
in the without brick wall was developed.
3. MESH SIZE
Meshing is done at elemental edge length of 5m.So that
efficient elemental analysis is made.
4. BOUNDARY CONDITION
The boundary condition can be in the form of temperature
and convection heat transfer coefficient. Minimum room
temperature is 298K and maximum room temperature is 311K
can be applied in the 2 dimensional transient analysis. Third
layer of gypsum wallboard convection heat transfer
coefficient about 31.8W/m
2
k can be applied. In the fourth
layer of brick wall heat flux can be applied in the various time
period. As well as heat flux increases and temperature also
increases.
4. ANALYSIS RESULTS AND DISCUSSION
The performance analysis of Lauric fatty acid phase change
materials for thermal energy storage in building application
were analyzed using the ANSYS 12. This chapter explains
analysis conducted followed by the results obtained.
4.1 RESULTS
4.1.1 NODAL SOLUTION
The temperature distribution during thermal flux for the
thermal analysis of wallboard with brick wall has been
performed. The lauric fatty acid such as coconut fatty acid
have high heat retention capabilities in that they do not lose
and heat absorbed quickly. Heat is absorbed or released as the
material changes from the solid phase to the liquid phase. As a
result, PCMs are also referred to as latent heat storage
materials.
Fig 3.Nodal solution
The 2D analysis of the system is made using transient thermal
analysis. The PCM temperature value corresponding to the
distance was analyzed in the system. The modeling of the
thermal performance is made using the designed values
obtained from the above calculations of the system and the
convection heat transfer coefficient, surrounding ambient
temperature are provided for the wallboard without brick wall
of thermal analysis. During the without brick wall analysis in
the PCM storage unit will be maximum heat which is stores in
the PCM. In this fig 3 shows that the given inlet room
temperature is 298K in the gypsum wallboard of first layer.
Then room temperature get transferred to the second layer of
lauric fatty acid PCM try to observe the more amount of inlet
room temperature. In certain period PCM converts solid state
to the liquid state attain at melting point temperature is 44C
led to maximum energy savings. Third layer of gypsum
wallboard convection heat transfer coefficient about
31.8W/m
2
k can be applied in the above calculation. This third
layer of wallboard having a ventilation hole for heat absorbed
by PCM is dissipated by the atmosphere and free convection
is take place for constant wall temperature. More amount of
inside room temperature is get transferred to the outside of the
wallboard and atmosphere.
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4.1.2 TEMPERATURE VARIATIONS
The graphical representation shown in fig4(a),(b) it
elaborate that the temperature variations with respect to time
and distance is plotted. In this process due to increase in room
temperature when the distance is increases it seems the wall
temperature also increased. During the second layer PCM
storage unit will be absorbed maximum heat and the heat
stores in the PCM Lauric fatty acid PCM is a substance with a
high heat of fusion which, melting and solidifying at a certain
temperature, is capable of storing and releasing large amounts
of energy.
Fig 4 (a) Temperature with respect to time
Heat is absorbed or released when the material changes from
solid to liquid and vice versa.The flow analysis of wallboard
has been performed and results has been obtained visually are
presented.Integrating PCMs promotes rapid transfer of latent
heat, sharp response to indoor temperature, and minimizes
multidimensional mode of heat transfer
Fig 4 (b) Temperature with respect to distance
Thermal performance of the laminated wallboard system is
to be done numerically. Through series of heat transfer
simulations and under different sets of properties and
conditions, the surface temperature variation is to be
obtained. The temperature variations used to calculate the
heat flux and the total amount of heat transferred in and out of
the wallboard.
5. CONCLUSION
The storage of thermal energy using PCM was studied.
The thermal analysis of wallboard was designed. The
composite wallboard setup was analyzed usingANSYS12
analysis was done for the with brick wall of wallboard and
PCM layer. The thermal and physical properties of lauric fatty
acid studied in detail. The result have been obtained by the
analysis of lauric acid PCM delivers the maximum heat
storage and try to absorb the more amount of heat. More
amount of inside room temperature is get transferred to the
outside of the wallboard and atmosphere. Not only can reduce
the cost and energy consumption of air condition system, but
also is an effective way of improving building energy
consumption to environments negative effects. TES using
solid to liquid phase change has been carried out. In order to
build a light building envelope, an investigation was carried
out to define, build and test wallboards containing a phase
change material. From the wallboards in order to obtain a
certain indoor passive air conditioning and to avoid
overheating of building during summer. This project has
discussed all the efficient way that the heat can be utilized in
the sun shine hours. It is concluded that these are the various
techniques to enhance the heat transfer to the building
application. The various techniques included and
modification in the design of the building, various materials
used the PCM storage unit.
ACKNOWLEDGEMENT
I am gratefully indebted to Dr.V.Sundareswaran, Regional
Director and Dean, Regional Center of Anna university,
Tirunelveli, for supporting and guiding us at all times. I wish
to express my profound thanks to Dr.A.Manivannan, Head
Of the Department,Department of Mechanical engineering,
Regional centre of Anna university, Tirunelveli,for his kind
support and the facilities provided to complete the work in
time. I wish to express my deep sense of gratitude to my guide
Mr.Rajakumar.S.M.Tech.,PhD Assistant professor,
Department of Mechanical Engineering, for providing me an
opportunity to work on this project. I also thank for his
enthusiastic guidance and constant encouragement in
completing the project. I am very thankful to all staff
members for their kind suggestions and also for extending
their good guidance for the completion of my project.
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I SSN: 2278 7798
I nternational J ournal of Science, Engineering and Technology Research (I J SETR)
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857
All Rights Reserved 2013 IJSETR
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