+

+
+
+
OSP
+
+
The High Performance
+
+
Surface Finish
1997 Electronic Interconnect Conference

Dan Parquet Eric Stafstrom

Merix Corp. Enthone - OMI
Forest Grove
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+ Interactive Breakout Session
$ Opportunity to share PWB
manufacturing experiences, assembly,
and design technologies with OSP
finish
$ We are seeking your input for process
technology benefits and limitations
$ Combine our capabilities for success
with current and emerging technologies

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ What is OSP?
$ OSP is - Organic
– Solderability
– Preservative
$ OSP is an alternative surface finish
to HASL on printed circuit boards

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Breakout Session Agenda
$ PWB Manufacturing Experience
– FY 97 Merix Manufacturing Information

$ OSP Technical Discussion

– Enthone - OMI

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Manufacturing Experience
$ Industry benchmark data
$ Merix Surface finish volumes
$ Manufacturing process rework
$ Manufacturing costs, and customer
returns

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ U.S. Industry Benchmark Data*

$ HASL is used on >70% of U.S. PWB’s

$ HASL is predicted to be the
dominant U.S. finish for the next five
years
$ OSP gaining wide-scale acceptance
with 15% market share (1995)

*Source - ‘97 IPC Surface Finish Summit

Merix: Meeting in The Winner’s Circle

+
+
+
+ U.S. Industry Benchmark
+
Data*
$ “OSP is great for water soluble fluxes”
$ “Nitrogen is required for multiple
soldering operations”
$ “OSP thickness control important for
no-clean fluxes”
$ “Benzimidazole OSP used in military
applications”

*Source - ‘97 IPC Surface Finish Summit

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Other Industry Benchmark Data
$ Other surface finishes being investigated 1
– Immersion Silver, Immersion Tin, Electroless Palladium
$ HASL is used on <5% of customer products
at one major German PWB manufacturer.
Electroplated gold is main surface finish2
$ HASL is used on <5% of customer products
at one major Japanese PWB manufacturer.
OSP is main surface finish 2
1 ‘97IPC Surface Finish Summit
2 Merix competitive benchmark

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Process Flow
•Hot Air Solder Level: 9 Steps

Preclean -> Rinse -> Flux Coat -> Solder Coat ->
-> Hot Air Level -> Cool -> Soft Brush ->
-> Post Clean Rinse -> Dry

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Process Flow
•OSP: 5 Steps

Preclean -> Rinse -> OSP Coat -> Rinse -> Dry

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Design Attribute Challenges
$ Hot Air Solder Level:
– Selective gold contact masking
– <0.020” pitch QFP
– >0.125” thick PWB’s
– <0.020” dia. hole clearance
– 50-1500 microinch solder control
– Pad geometry : fine pitch QFP/ground planes

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Design Attribute Challenges
$ OSP:
– Contact insulation at assembly (shielding,
ground planes)
– U.S. market acceptance

Merix: Meeting in The Winner’s Circle

 +
+
+
+
+
PERCENT OF TOTAL THROUGHPUT

0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
23-Mar

30-Mar

6-Apr

13-Apr

OSP
HASL
20-Apr

27-Apr

O THE R
4-May

11-May

18-May

25-May

1-Jun

8-Jun

15-Jun

WEEK
22-Jun

29-Jun
Finish Product Mix

6-Jul

13-Jul

20-Jul

27-Jul

3-Aug

10-Aug

17-Aug

24-Aug
Merix Forest Grove Surface

Merix: Meeting in The Winner’s Circle

31-Aug

7-Sep

14-Sep
+
+
+
+
+ Manufacturing Rework
$ HASL
2000

– Set up intensive
1500
process
– Narrow processing
IMAGES

1000 window
$ OSP
500

– Single set up for ALL

0
product types
HAL OSP
PROCESS – Stable process

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Manufacturing Rejects
$ HASL
3500

– Complex process
3000

2500
– High temperatures
limit rework
2000
IMAGES

1500
$ OSP
1000 – Stable process ð high
500
first pass yield
0 – Reworking has little
HAL OSP
PROCESS effect on product

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Manufacturing Cost
$ HASL
100%
– Operation and
80%
inspection requires
four times the
60% workforce
40%
– Treatment of
hazardous waste.
20%

$ OSP
0%
HAL OSP – Quality built into the
PROCESS
process.
– Non hazardous waste.
Merix: Meeting in The Winner’s Circle
+
+
+
+
+ Customer Returns
$ HASL
6000

– Random high solder,

5000
plugged holes, missing
4000 and non- wetting Pads
IMAGES

3000 $ OSP
2000 – Darken copper,
1000
cosmetic only
0
– Zero returns for
HAL
PROCESS
OSP
solderability issues

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Technical Discussion
$ OSP chemistry applications and
benefits
$ Industry performance data
$ Advanced technologies with OSP

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ TECHNICAL DISCUSSION

– OSP chemistry applications and benefits

– Advance technologies with OSPs
– Industry performance data

Merix: Meeting in The Winner’s Circle

 +
ENTEK® PLUS
+
+
+
PWB ORGANIC COATINGS -
+ COMPARISON
TYPE THICKNESS SHELF LIFE NUMBER OF FLUX
REFLOWS COMPATIBILITY

Inhibitor 50-200 Ä 3-6 Months 1 All

Rosin/Resin 1-2 Microns 6-12 Months 3 Maximum Rosin/Resin

Pre-flux

OSP 0.2-0.5 Microns 12 Months 3 Minimum All

2000-5000 Ä

Merix: Meeting in The Winner’s Circle

+
+
+
+ ®
+ ENTEK PLUS
$ An organic solderability preservative
(OSP) that selectively protects and
maintains solderability of copper
pads and through-holes
– Provides thermal protection against copper
solderability degradation during SMT and
mixed-technology PWB assembly
– Is an alternative to hot air solder leveling
(HASL) and metallic PWB surface finishes

Merix: Meeting in The Winner’s Circle

+ ®
+ ENTEK PLUS
+
+COATING DEPOSITION
+
MECHANISM

$ Substituted benzimidazole type

$ Coating deposition mechanism
– Complexing reaction with copper
– Forms organometallic bond (~1500 Ä Thick)
– Build-up of benzimidazole to requisite final
thickness

Merix: Meeting in The Winner’s Circle

+
+ WHY OSPs?
+
+ ®
+ ENTEK PLUS BENEFITS
$ PWB Fabrication
– Aqueous, reworkable process
– Reduced maintenance, labor requirements
– Eliminates fire hazard, major lead source
$ PWB Assembly
– Flat SMT pads
– Facilitates solder paste printing
– Increased first pass yields For FPT, BGA
– Compatible with DCA technologies

Merix: Meeting in The Winner’s Circle

+
+ WHY OSPs?
+
+
+ ENTEK® PLUS BENEFITS
$ PWB Integrity
– Reduces ionic contamination levels
– Stronger, more consistent solder joints
– Maintains PWB linear stability (X-Y Axes)
– Maintains PWB structural integrity (Z-Axis)

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ ASSEMBLY PROCESS: SMT
$ Compatible with all solder paste types
$ Allows high solder paste transfer efficiency
for small stencil artures (FPT, UFPT, BGA,
µ-BGA, Flip Chip)
$ No “extra” solder paste required versus HASL
$ Color contrast aids in
– Printer/stencil alignment set-up
– PWB fiducial recognition
– Poor solder paste deposit detection

Merix: Meeting in The Winner’s Circle

+
®
+ ENTEK PLUS
+
+
+ASSEMBLY PROCESS: SMT
$ Existing reflow profiles are OK
$ Optimized profiles include
– First side peak reflow temperature <240ºC
– Increased PWB cool-down rate (to <100ºC)
$ N2 inerting is beneficial but not mandatory
$ Hold times between soldering operations
– Dependent on assembly process variables
– Benzotriazoles: typically hours
– Substituted benzimidazoles: typically days

Merix: Meeting in The Winner’s Circle

+ ®
+ ENTEK PLUS
+
+ASSEMBLY PROCESS:
+
WAVE SOLDERING
$ Solderability of all organics degrade with
thermal processing
– Unique chemical structure determines protective
capabilities
$ Mixed technology assembly (in air) using no-
clean fluxes (LSF, VOC-free): OPTIMIZATION
– Flux formulation/selection
– Flux application method/equipment
– Assembly process

Merix: Meeting in The Winner’s Circle

+
®
+ ENTEK PLUS
+
+ASSEMBLY PROCESS
+
CONSIDERATIONS -General
$ Exposed/Non-Wetted Copper
– Copperself limiting passivating film
– Historically, “all copper” PWBs have been used for 25 years
without reliability issues
• Computers
• Telecommunications
– In a no-clean environment, contaminants from HASL are
more likely than exposed copper to compromise reliability*
• Catalyze Corrosion
• Metal Migration *Based on testing performed by two major
computer manufacturers

Merix: Meeting in The Winner’s Circle

+ ®
+ ENTEK PLUS
+
+ASSEMBLY PROCESS
+
CONSIDERATIONS -General
$ Workmanship criteria for exposed/non-
wetted copper: SMT
– Typically a maximum of 5 to 10% of the solderable
SMT pad area
– Cannot interfere in solder joint formation
– Along the periphery of the SMT pad
$ Workmanship criteria for exposed/non-
wetted copper: PTH
– Typical for computer, telecommunication industries

Merix: Meeting in The Winner’s Circle

+
ENTEK® PLUS
+
+
+ASSEMBLY PROCESS
+
CONSIDERATIONS - General

Hole fill Top Side Fillet

Minimum Preferred Minimum Preferred
PTH with Component 75% 100% None 360°, Some
Exposed Copper
Electrical via Bottom Side >75% None Partially Capped
Capped

Merix: Meeting in The Winner’s Circle

+
ENTEK® PLUS
+
+
+ASSEMBLY PROCESS
+
CONSIDERATIONS - FPT
$ Flat Co-planar
Surface
– Solder paste printing
– Component placement
– Fiducial reconigition
– Solder joint strength

Merix: Meeting in The Winner’s Circle

+
+
+ SOLDER JOINT STRENGTH:
+
+ BGA & Flip Chip
$ Delta in coefficient
of expansion
– Interstructural strength
– Noble metal in solder
joint
$ Heat sinking
– Wetability of surface

Merix: Meeting in The Winner’s Circle

+ ®
+ ENTEK PLUS
+
+
+
SOLDER JOINT RELIABILITY
$ Three-Point Bend Test
– 0.045” thick FR-4, BGAs with 41 I/O (0.52” x
0.47”)
– PWBs coated with ENTEK PLUS, HASL or
Ni-Au
– Reflowed through standard SMT profile
– PWBs then exposed to 1 additional SMT reflow
– Assembled PWBs aged for 24 hours at 100°C
– Measured load displacement required for
solder joint fracture

Merix: Meeting in The Winner’s Circle

+
+
+ SOLDER JOINT STRENGTH:
+
+ 3 POINT BEND FLEX TEST
Schematic of Set-Up
Force

PWB
Load Anvil
BGA

1.00”
Support Span

Merix: Meeting in The Winner’s Circle

+
+
+ SOLDER JOINT STRENGTH:
+
+ 3 POINT BEND FLEX TEST RESULTS

Range of Solder Joint Fracture Load

160
Solder
140
Joint
Fracture 120
Load
(lbs.) 100

80
60

40

20
0
Ni-Au OSP HASL

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ SOLDER JOINT STRENGTH:
$ With ENTEK®
PLUS
– Intermetallic formed
during SMT reflow
– Thin uniform
intermetallic
– Highest, most uniform
bond strength
– Flat solderable
co-planar surface

Merix: Meeting in The Winner’s Circle

+
+ ENTEK® PLUS
+
+
+ PRODUCTION EXPERIENCE
$ 5+ Yrs In All Major Sectors Of
Electronics Industry
– Automotive: mixed technology, no clean, N2 wave (3 Years)
– Telecommunications: double sided SMT, no clean, air (3 Years)
– Computers: mixed technology, no clean, air (3 Years)
– EMSI: double sided SMT, water soluble, air (4 Years)
– EMSI: mixed technology, no clean (VOC-free), air (3 Years)

Merix: Meeting in The Winner’s Circle

+
®
+ ENTEK PLUS
+
+ADVANCED PACKAGING
+
TECHNOLOGIES
$ Fine pitch (25, 20 Mil) - enabling
$ Ultra fine pitch (< 20 Mil) - enabling
$ BGAs, micro-BGAs, mini-BGAs - enabling
$ Tape automated bonding (TAB) - compatible
$ Chip-on-Board (COB) - compatible
$ Flip chip - enabling
$ PCMCIA cards - enabling
$ Flex circuits - enabling
$ HDIS - enabling

Merix: Meeting in The Winner’s Circle

+ ®
+ ENTEK PLUS
+
+
+SUMMARY
$ Reliable alternatives for 25 years
$ Essential for high first pass yields
with FPT, BGAs, flip chip
$ Future
– OSPs enabling advanced technologies
– Substituted benzimidazoles: high volume, low
cost HASL Alternative

Merix: Meeting in The Winner’s Circle

+
+
+
+
+ Thank you for your input!
$ Advanced packaging technologies
will continue to challenge both PWB
manufacturing, assembly and design
$ Surface finishes and their
applications are key to our mutual
success

Merix: Meeting in The Winner’s Circle