Intel Corporate B-roll 2002-2003

Featuring the Pentium 4 Processor with HT Technology

November 14, 2002
TABLE OF CONTENTS:
Tape TRT: 30-minutes
TIME CODE
Pentium4 @ 3GHz with HT............................01:56
Animation Hyper-Threading (HT) at Work..03:57
Demos of PC with Hyper-Threading...06:15
Inside Fab 11x07:58
Chip Packaging How Theyre Put Together......11:47
Worldwide Facilities.....14:11
Chip Design How Theyre Created 16:07
300mm Wafers..18:14
Intel R & D Transistors Innovations19:39
Intel R & D Chip Innovations19.54
Optical Technologies....20:21
Intel Logos and Chips......21:08
Computing and Communications Converge.24:58
Intel World Headquarters in Santa Clara, California.......27:31
Intel Executives..28:23

Intel Corporation is the worlds largest chip maker, and a leading manufacturer of
computer, networking and communications products.
Intels leading edge silicon design and manufacturing capabilities are advancing
and bringing together computer and communication technologies for the digital
economy.
Intel Pentium 4 Processor with HT Technology
Time Code = 01:56
The Pentium 4 Processor 3.06 GHz (gigahertz) with HT technology is designed
to more quickly process audio, video, photos, 3-D graphics and games. HyperThreading (HT) is groundbreaking technology that allows software programs to
see one processor as if it were two processors. A processor with HyperThreading is able to handle two series, or threads, of software instructions at the
same time, rather than one at a time. With HT, a computer can perform
demanding tasks like video and music encoding simultaneously.

Animation of Multi-Tasking vs. One Task at a Time

Time Code = 03:57
The following animation sequences show:
Side-by-side comparison between two identical PCs with Pentium4 3.06
GHz processors, one without Hyper-Threading (top of screen) and the
other with Hyper-Threading enabled (bottom of screen), both shown
handling the demanding tasks of video and music processing.
The system with Hyper-Threading is able to process video and music
simultaneously.
The system without Hyper-Threading can process only one task -- video
or music at a time.
Demos on PC of Multi-Tasking with Hyper-Threading
Time Code = 06:15
Two scenarios that show people doing several demanding tasks at one time.
They are using a PC with a Pentium 4 processor 3.06GHz with HT technology.
The following shows two people plugging their digital camera into a PC, then
encoding digital video using Pinnacle Studio 8.3* video editing software. While
the video is encoding, the couple clicks on the intense, 3-D interactive game,
NASCAR 2002.* The Intel Pentium 4 Processor 3.06GHz supporting HyperThreading technology allows the PC to handle both strenuous tasks
simultaneously. It delivers photo-realistic game action while rendering quality
video quickly.
Hyper-Threading technology requires a computer system with an Intel
Pentium 4 processor at 3.06 GHz or higher, a chipset and BIOS that utilize this
technology, and an operating system that includes optimizations for this
technology. Performance will vary depending on the specific hardware and
software you use. *Other names and brands may be claimed as the property of
others.
This next scene shows a young man sending an email, then digitizing music
while playing a 3-D game at the same time. He encodes songs using MP3 Maker
Platinum* and copies them to his hard drive, while launching into a fast action 3D racing game called NASCAR 2002.*
Fab 11X, Worlds Most Advanced
Time Code = 07:58
Pentium 4 processors with Hyper-Threading running at 3GHz and higher are
produced at Intels most modern fabrication facility. Fab 11X is the worlds first
factory to make chips in high-volume on 300mm wafers using Intels leadingedge 0.13-micron circuitry process technology. Manufacturing with 300mm
wafers (12-inch diameter) yields more computer chips at lower costs compared
with the current standard 200mm (8-inch diameter) wafers.
How Computer Chips are Made
Narration provided by the Intel Museum

Time Code = 11:47

Inside Intel Worldwide

Time Code = 14:11
Intel has fabs, assembly and test factories, manufacturing sites and research
facilities in locations around the world. Computer chips are made from wafers at
fabs, which are the cleanest manufacturing environments on the planet. Chips
are packaged into finished products, such as microprocessors, flash memory and
chipsets, at Intel Assembly and Test factories. The following shows workers
inside some of these sites.
How Computer Chips are Designed Then & Now
Narration provided by the Intel Museum

Time Code = 16:07

300mm Wafer, 0.13 Micron Technology

Time Code = 18:14
Intels on-going research into chip design and manufacturing techniques led to a
breakthrough in 2001, when Intel introduced microprocessors built with the
smallest transistors on the largest wafers in mass production. Smaller circuitry
combined with larger wafers allows Intel to improve the performance of new
processors and cut manufacturing costs.
Bigger Wafers, More Chips
The following animation shows the progression of wafer size improvements at
Intel, culminating in the 300mm (12-inch) wafer. The larger wafers provide more
than twice the surface area of 200mm (8-inch) wafers commonly used in making
semiconductors.
Smaller, Faster
The following animation with narration illustrates Intels technology achievement
in shrinking computer chip circuits from 0.18 micron to 0.13 micron. The circuitry
is so small it would take almost 1,000 of these wires placed side by side to
equal the width of a human hair.
NARRATION FOR 0.13 MICRON TECHNOLOGY: Intel engineers have been
able to shrink circuit lines from 0.18 micron down to just point-13 microns wide.
This can double the output per wafer. The point-13 micron process makes it
possible to produce extraordinarily small transistors-just one, one thousandth the
width of human hair. This advanced technology uses less power and can deliver
a new generation of microprocessors with more than one-hundred million
transistors, running at multi-gigahertz clock speeds.
Intel R&D -- Transistor Innovations
Time Code = 19:39
Intel engineers are charged with creating smaller, better performing silicon
technologies for the years to come. Intel researchers have developed a threedimensional Tri-Gate transistor design that achieves higher performance with
greater power efficiency than flat transistors. This 3-D structure is different than
flat transistors used today, allowing electronic signals to be sent along the top
and two sidewalls of the transistor -- tripling the area for electrical signals to
travel. The effect is like turning a one-lane road into a three-lane highway without
taking up more space. The following is a microscopic photo of Intels Tri-Gate
Transistor.

Intel R&D -- Chip Innovations

Time Code = 19:54
Intel engineers continue to innovate the way processors are designed. The
following shows a current-day processor compared to an Intel prototype chip that
is thinner and uses less material to produce. This packaging process is what
Intel calls Bumpless Build-Up Layering.
Intel in Communications -- Optical Technologies
Time Code = 20:21
Intel engineers also apply silicon design and manufacturing technologies to
develop communications devices for connecting to wireless and optical networks.
The following is video of Intel optical transceiver, optical module and tunable
laser technologies for the communications industry.
Intel Logos and Chips
Time Code = 21:08
The following Intel product logos are for broadcast news graphic artists. Each
segment includes the logo and video of the particular chips and where they are
tested or assembled.
Intel Pentium4 Processor with HT Technology
Logo followed by laser tagging on Intel Pentium 4 processors at 3.06GHz
supporting HT Technology.
Intel Pentium 4 Processor-M
The Pentium 4 Processor-M provides high performance and battery-saving
technologies for mobile computers. It is built using Intels industry-leading 0.13
micron technology. It also features Speed Step technology, which allows the
processor to lower its speed whenever optimal in order to extend battery life.
Intel labs test and develop energy and performance improvements for future
mobile computers.
Intel Itanium 2 Processor Brand Logos & Chips
The Itanium 2 Processor is a leading edge CPU for servers and workstations,
and supercomputers used in medical and academic research. The Itanium 2
computer chip is packed with advanced technologies to process huge amounts of
data at high speeds and to process complex computations. The Itanium 2 was
designed to handle demanding business and research applications such as ecommerce, data mining, memory intensive high-end graphics, complex
mathematics and high performance multimedia applications.
Intel Xeon Processor
The Intel Xeon Processor is based on 32-bit architecture (IA-32) for servers
and workstations. The Xeon processor can be used in multi-processor
workstations and servers, and was the first Intel processor to feature HyperThreading technology.

Intel XScale Processor Technology

The XScale Processor is a high performance, low battery consuming
processor that is the brains inside handheld PCs and smart phone devices.
An Intel innovation makes it possible to stack one XScale Processor on top of
two flash memory chips to make a tiny silicon sandwich. This stacking
technology can free up to 56 percent of the space taken up by three separate
chips laying side-bye-side inside most cell phones today.
Computing and Communications Converge
Time Code = 24:58
Intel is ushering in an era where every computer can communicate and every
communication device has computing capabilities. The following scenarios show
people using wireless technologies to communicate, access the Internet and
remotely control appliances in the home. These devices are built using Intel
technologies -- processors, memory chips and/or software.
Wireless phone and pocket PC device
Wireless remote control in the living room
Handheld PC device plays video from the Internet
Smart Display prototype wirelessly accesses a homes main PC
Internet-connected sewing machine
World Headquarters
Time Code = 27:31
Intels world headquarters is in the Silicon Valley city of Santa Clara, California.
The main office is named the Robert Noyce Building after the late co-founder of
Intel Corporation, Robert Noyce.
Intel Executives
Time Code = 28:23
Andrew S. Grove, Chairman
Gordon Moore, Co-Founder and Director and Chairman Emeritus
Craig Barrett, Chief Executive Officer
Intel CEO Craig Barrett splits his work time between Intels Headquarters
in Santa Clara, California, and a major manufacturing facility in Chandler,
Arizona. Barrett is seen here inside an Arizona facility where the Intel
Itanium processors are assembled.
Next, Intel CEO Craig Barrett starts off the trading day at the NASDAQ
headquarters in New York, April 4, 2002. Intel is a NASDAQ 100
Company.

More information is available at www.intel.com/pressroom.

Contact: Larry Bozman (408) 765-8815 larry.bozman@intel.com
Ken E. Kaplan (408) 765-1425 ken.e.kaplan@intel.com