NPM SERIES

Any-mix manufacturing solution for evolving assembly needs

Award Winner

Award Winner

Award Winner

Global SMT & Packaging

Technology Award
Pick and Place

Circuits Assembly
NPI Award
Automation Tools

Circuits Assembly
NPI Award
Component Placement

DESIGN CONCEPT
Over 50 years of exceeding customer needs
with proven industry excellence
and over 100,000 solutions installed
The rapid industry acceptance of the award-winning NPM platform is based
on its inherent design flexibility. Each NPM is a completely integrated,
single-platform solution that can provide far-reaching solutions to
expand and evolve with your electronics assembly needs. In addition to
its interchangeable, plug-and-play heads, the NPM can integrate solder
paste inspection (SPI), automated optical component inspection (AOI), and
dispensing. Yet, when requirements change, so can the NPM. Simply swap
heads to add new machine functionality and investment protection.
As always, manufacturers can scale NPM lines to meet production needs
while conserving investments until production or technology requirements
mandate. OEMs and EMS providers can reconfigure both machine heads in
approximately 15 minutesmaximizing flexibility and ROI, while protecting
assets. The NPM also incorporates existing feeders, carts, and nozzles to
minimize investment and inventory expenses.

NPM-D3
1963 Panasonic Factory Solutions Founded
1968 1st Insertion Machine Developed
1973 1st Axial Machine Delivered

The award-winning NPM-D3 continues in the steps of its predecessor with

interchangeable dispensing, placement, and inspection headsplus new
enhancements to further increase productivity. A reinforced frame, advanced
head, and award-winning Multi Recognition Camera improve placement
accuracy by 25%, while boosting IPC-9850 throughput 30% to an industryleading 38,078 cph per square meter.

1980 1st Surface Mount Machine Delivered

1988 10,000th Solution Installed
1988 PFSA Established for North American Market
1992 Microelectronics Group Expands Offerings
1993 ISO Standard Certifications
2000 30,000th Solution Installed
2000 PanaCIM Enterprise Edition Released
2012 Total Solutions for Any Mix, Any Volume
2014

100,000th Solution Installed

2015

NPM-W2 & D3 with Multi Recognition Camera

Features & Benefits

Flexible board handling system converts to support single-lane and
multiple dual-lane operation modes depending on your needs
Compact system footprint and dual-side operation maximizes factory floor
space utilization, while allowing fast production scalability
Integrates the industrys only field-scalable Multi Recognition Camera that
combines alignment, thickness, and 3D coplanarity into one time-saving,
process-improving step

Application Solutions
The NPM-D3 is an industry standard building block in high-speed, highvolume applications ranging from automotive to mobile to memory. In fact,
the vast majority of top smartphone manufacturers and automotive EMS
providers choose Panasonic solutions.

Scalable

Award-winning features
common to the NPM Series:

Match line capacity to production needs

Integrate software modules when business dictates
Single-line facilities to multi-nationals

Quick change heads, carts, and nozzle

banks with auto board support
Fungible assets include feeders and
nozzles to protect your investment
Board warp detection, Advanced Process
Control (APC), and Multi Recognition
Camera boost yield
High accuracy, low maintenance, linear
motor-driven, dual gantry system

Integrated
For any machine platform or business system
Communicates with numerous peripheral systems
Multi-level traceability throughout the SMT process

Efficient
Asset utilization optimized by zero changeover
Offline set-up, teach, and changeover tools
Highly-accurate inventory management

NPM-W2

NPM-TT

Features & Benefits

Features & Benefits

Combine various high-speed and flexible head options to handle nearly

any application, including large, odd-form parts like snap-fit connectors
requiring upwards of 50N placement force
Setup multiple products with 120 reels on quick-change carts
Award-winning camera technology merges component alignment, chip
thickness, and 3D coplanarity inspection into a single pass, which helps
ensure high productivity and quality control

Extended component range is ideal for end-of-line applications

Interchangeable, 20-input, twin tray magazines maximize product
changeover efficiency and afford offline setup
Easily replace tray tower carts with tape feeder carts as production setups
change to maximize asset utilization
Excellent companion to the NPM-D3, especially when operating in a highvolume, dual-lane production environment

Application Solutions

Application Solutions

With additional feeder capacity and a larger board size, the inherent
capabilities and superior flexibility of the NPM-W2 position it as an advanced
solution for industrial and automotive manufacturers, as well as EMS
providers at any level.

Capability and versatility position this as a high-volume, odd-form mounter

for components from tape- or tray-fed parts. By automating certain end-ofline components, the NPM-TT can help manufacturers further reduce costs by
eliminating pre-reflow or pre-wave solder manual part insertion.

The new NPM-W2 amplifies the NPM-W capabilities with a 10% throughput
boost and 25% accuracy improvement. It also integrates innovations like our
incomparable, award-winning Multi Recognition Camera. Combined, these
features extend the component range down to the 03015mm microchip, yet
preserve capability to handle 120x90mm components up to 40mm tall and
nearly 6 long (150mm) connectors.

The NPM-TT complements our award-winning platform by bolstering the

printed circuit board assembly process with front and rear tray towers plus
feeder slots for tape reels. Its twin tray configuration enables independent
mode, dual-lane production. Additionally, its dual-lane board handling allows
increased production of one or more unique products simultaneously; yet,
easily converts to single-lane mode for larger board sizes.

PROCESS CAPABILITY
Printed circuit board assembly includes several processes to ensure high-quality production, which
historically meant investing in standalone equipment for dedicated processes like placement, dispensing,
and inspection. Today, our NPM Series provides solutions for multiple assembly processes. More than a
placement machine, the NPM allows you to configure the platform with heads for component placement,
material dispensing, optical inspection, and even a combination of processes. In one single platform, the
NPM Series provides a true lean solutiondoing more with less and improving your return on investment.

PLACEMENT HEADS
An array of four component placement head variations are available on the NPM series. With its linear
motor, dual-gantry system, manufacturers can configure two heads on each machine to maximize line
throughput, amplify line flexibility, or blend both for superior production versatility.

16-Nozzle Head
Ultra High Speed Chip

12-Nozzle Head
High Speed Chip

42,000 cph per head

03015 to 6x6mm
Up to 3mm tall
25 micron accuracy

34,500 cph per head

01005 to 12x12mm
Up to 6.5mm tall
30 micron accuracy

8-Nozzle Head
Versatility

3-Nozzle Head
Multi-function

21,500 cph per head

01005 to 32x32mm
Up to 12mm tall
30 micron accuracy

8,000 cph per head

0201 to 150mm long
Up to 40mm tall
50N placement force

Award-winning features
common to the NPM Series:
Nozzles
Long-life ceramic design
Integrated 2D barcode for
Nozzle Anywhere setup
Compatible with quickchange, high-capacity nozzle holder
Locally designed nozzles and grippers

Gripper Nozzles
Pneumatic, adjustable stroke
Integrated 2D barcode for
Nozzle Anywhere setup
Compatible with nozzle
holder for on-the-fly changes

Board Warp Mapping

Head-mounted laser system measures
board topography
Controls part
placement height
Shares measurement
data downstream

Automated Board Support

Utilizes DGS data to position pins for
complete support
Eliminates manual
pin placement errors
Reduces changeover time

DISPENSE HEAD
The NPM is more than a mounter, it is a process solution. By simply swapping
a placement head with the dispense head, one can convert an NPM into a
multi-functional machine with the ability to mount and dispense. This is
especially suitable when handling large or oversized components, processing
double-sided reflow boards, or corner-bonding CSPs.
Auger-valve ensures stable, high-speed dispensing
Support patterns like dots or lines, as well as adhesives and solders
Non-contact dispensing enabled with board height sensor

One of the worlds

strongest patent
portfolios...
perennially in
the top 4

INSPECTION HEAD

Solder inspection detects issues including

oozing, blurring, misalignment, and bridging
Optical inspection measures missing, shifted,
flipped, or inverted polarity
AOI combined with mount head is ideal for
inspection prior to shield placement

Convert the NPM from a mounter to a process solution by exchanging a

mount head with our inspection head to perform AOI and SPI. The NPM will
automatically switch from AOI to SPI based on the program. Whats more, the
data collected is automatically linked to quality information for each process
and enables Advanced Process Control (APC) implementation.

PACKAGE-ON-PACKAGE
As part of our industry-leading patent list, we continuously pioneer new
technologies and techniques. Panasonic helped establish the PoP assembly
process over a decade ago. Since then, PoP has matured and many
designers are adopting it to drive miniaturization, lower costs, and
improve performance. Panasonic has the ability to guide the industry
with manufacturing best practices gleaned from being a global
manufacturing leader.

3D component and feature inspection boosts

production yields
Plug-and-play Multi-function Transfer Unit
(MTU) installs in minutes
Auto flux refill with servo linear slide and
programmable squeegee gap

NEXT GENERATION MICROCHIPS

For years, Panasonic has been helping manufacturers mount the

continually shrinking chip. Today, the tradition continues as we publish
techniques and develop processes to ensure manufacturers successfully
adopt next generation microchips like the 03015mm and 0201mm,
which are upwards of 60% smaller than the 0402mm (01005). Not only
does Panasonic understand the technology to mount these microchips,
our company is developing these microchips for manufacturing
implementation. From parts to process, Panasonic is positioned to help
manufacturers address challenges.

Active Calibration ensures accurate

placement at production speeds
Industrys only multi-recognition 3D vision
system increases output and reduces defects
Patented Advanced Process Control (APC)
inspection further minimizes DPMO

20 micron interspaced
capacitors and resistors

ADVANCED PROCESS CONTROL

Numerous studies detail how solder reflow
affects component placement, especially if
the component is off pad. However, shrinking
component dimensions and pitch are opening
doors to explore how APC can improve yields in

Incorrectly
Printed PCB

high-density placements. APC collects, analyzes,

and applies SPI data so parts are placed onto
solder rather than onto pads. This self-aligning
process increases yield and reduces defects even
when a printing process exceeds set limits.

Certified
SPI Solution

Panasonic
Mounter

APC
Patented APC Feed Forward to Mounter

Placed
onto Paste

Perfect
Post Reflow

FEEDING SOLUTIONS
Intelligent Tape Feeders

Support Station Box

Common with the AM, CM, and NPM Series

Adjustable-width feeders reduce investment
Auto-calibration technology
Closed-loop splice detection
Hot-swappable during production
Thin 8mm, 4x1mm, and 104mm available
Deep pocket and large reel options

Guides operator through setup

Reduces changeover time with
off-line feeder cart setup
Combine with PanaCIM Material Verification
for accurate setup

Intelligent Stick Feeder

Common with the AM, CM, and NPM Series
Configurable from one to three sticks
Locally designed, custom guide blocks

Tray Tower
Twin and single tray tower options
Quick-exchange magazine
On-the-fly replenishment
JEDEC and vacuum-formed trays
Front, rear, and twin tray configurations

Automatic Feeder Teach

Auto-aligns first pick position
Adjusts orientation and index speed
Accomodates tape pocket variation
Compatible with tape, stick, and tray

LCR Meter Station

Validate electrical values of passive devices
Closed-loop integration with PanaCIM Material
Control and Material Verification

Intelligent Feeder Anywhere

Hot-swap feeders on-the-fly during production
as an alternative to splicing
Simply install feeders in available slots
program auto-adjusts, hastening changeover

Feeder Setup Navigator

from Setup

Optimizes setup processes by incorporating

production requirements
Factors labor and material availability

Feeder Carts
Cordless, quick-exchange operation
Automatic, precise registration
Integrated tape cutter/waste management

Component Supply Navigator

Optimizes component replenishment events
Flexible for single and multi-line installations
Increases labor efficiency

to Replenishment

SET UP VALIDATION
Material Verification

Setup Verfication

Provides authenticated off-line setupfast and accurate changeover

Manages alternate component part numbers and supply types
Operator login tracks actions

Material Verification guides feeder setup

Machine confirms setup, reels, trays, part numbers, and data
Data Generation Software (DGS) verifies program integrity

Production

VISION CAPABILITIES
New, evolutionary, Multi Recognition Camera is the first field-scalable system to combine three unique imaging
capabilitiescomplete with fast, accurate, 3D coplanarity measurement.

Award Winner

High-speed, high-precision, digital image

recognition solution includes:

Circuits Assembly
NPI Award
Production Solution

2D and 3D alignment and inspection

Component thickness
Pick-up irregularity
Flipped component

3D CMOS Sensor detects:

Lifted fine-pitch IC leads
BGA or CSP coplanarity
Missing or deformed solder balls

Vision-based NPI Tools

Competitive pressures, cost challenges, and increased customer expectations are driving improvements in
the way manufacturers develop and introduce products to the market. Whether cultivating internally-born
ideas as an OEM or responding to customer requirements as an EMS, the new product introduction process
is mission-critical to speed up time-to-market and your companys success. Panasonic solutions provide the
following capabilities that are essential for effective execution of new product introduction:

Off-line Component Teach

Create parts library off-line on the same system as machine
Minimize machine idle time
Generates tested vision file

Improve Yield
Identify mis-picked chips down to 03015s,
recognize deformed leads or flipped ICs,
pinpoint missing or damaged balls, and
inspect nozzle tips

Boost Speed
Increase IPC-9850 throughput speed
by nearly thirty percent

Save Money
Configure the camera knowing it can be
quickly and easily field modified

Enhance Quality
Merge three vision processes into one to
help meet stringent demands of highly
complex products without sacrificing
line throughput

Off-line Vision Data System

Easily create files off-line and save directly to program
Perform data reliability tests
Uses the same vision recognition system as the machine

On-line Component Teach

Automatically teach basic or complex component shapes
Retrieve component images and adjust with digital calipers
Accepted changes sync to master database library

Fiducial Teach and Adjustment

Lighting automatically adjusts for fiducial recognition
Change shape, colors, dimensions, or location
Accepted changes sync to master database library

The vast majority

of top smartphone
manufacturers and
automotive EMS providers
choose Panasonic
solutions

BOARD HANDLING FLEXIBLE, DUAL-LANE BOARD HANDLING

Single-lane Board Handling

Innovation beyond traditional board handling

brings additional features, including multi-board
staging for smaller boards and board shuffling for
LED luminaries nearly 48 long.

Automated Board
Support
Programming data
automatically positions
support pins
Eliminates manual pin
placement errors
Reduces changeover time

Long Board Handling

Process 1,200mm long
LED panels without
sacrificing ability to
handle smaller boards

The core of our board handling begins with a

versatile system incorporating programmable,
adjustable position rails which quickly convert
from single-lane to dual-lane mode based on the
product program. When running in a single lane,
several rails are parked to ensure maximum
panel size. Yet, when production needs change,
so can board-handling. Based on optimized
production feedback from our DGS programming
software, the system will automatically convert
into Shared-, Independent-, or Hybrid placement
modes to maximize production efficiency.

Independent-mode

Shared-mode

Hybrid-mode

Both heads populate same board, same lane

Eliminates PCB transfer time
Maximizes feeder slot utilization

Blends Shared- and Independent-modes within

a line to maximize efficiency
Maximizes asset utilization and minimizes
capital investment

Heads only populate board in closest lane

Maximizes throughput and promotes on-the-fly
product and cart changeover
Independent changeover

A A B

A B B

A
B

B
A

Independent Alternate
Independent Alternate

INDEPENDENT CHANGEOVER
In the past, changeover required all placement
machines in the line to complete the product build
before an operator could begin any changeover
process. In a single machine line, this effort is less
of a burden than in a line with multiple machines.
With our new innovations, operators can remove
feederseven cartsduring production to
facilitate a time-efficient changeover. This
new feature is appealing in a single-lane board
systemthe operator can begin to change over the
machine as production continues.

4K Ultra HD Technology
>15,000 sq ft LED Solution
installed at
Churchill Downs,
Louisville, KY

Production

A
B
Changeover

Feeder cart exchange

during the production

The concept of independent changeover

is amplified in our dual-lane system. In
Independent-mode, each lane is building a
unique producttwo products in one machine at
a time. When a changeover is required on either
lane, the operator can begin to remove and
exchange all the feeder carts on one lane and
roll new carts into the machine. All the while,
production continues uninterrupted on the other
lane. Besides changing the feeders and carts,
the system automatically repositions board
support pins.
Our expertise in lean manufacturing techniques
is clearly demonstrated with a thorough set
of features to eliminate product changeover
burden and provide the ideal changeover for your
production.

SOFTWARE AND PROGRAMMING

Data Generation System
DGS (Data Generation System) is our intuitive, PC-based programming
software. Taking line balance into consideration, it assigns parts from CAD
data, optimizes them, and then creates the placement program for the line.

Multi-CAD Import
Retrieves data and allows properties
like polarity and position to be verified
on-screen

Award Winner

Award Winner

Circuits Assembly
NPI Award
Production Software

Global SMT & Pkg

Technology Award
Best Product Americas

Component Library
Registers and unifies component
mount data
Large library of standard component
definitions available

Simulator
Provides on-screen confirmation in
advance of production

Customizable
The PanaCIM modules were developed based on user feedback to provide a
complete assembly software suite. Select the best modules for your current
situation and easily add others as needed.

Virtual PCB Inspection

Cloud-level

Overlays program data on board image

to validate or adjust component
alignment and rotation

Enterprise-level Connect all departments to schedule and analyze

production and integrate with MRP/ERP systems

Changeover Mode
Production

PanaCIM integrates cooperating software modules to solve key production

problems by addressing the top objectives for successful manufacturing.

Continuous production on one side of

the machine while changing over the
opposite side

Changeover

Complete MES software solutions

for digital manufacturing
developed in the US,
deployed globally

Seamless integration of business systems

Facility-level Ensure visibility to track WIP, dispatch operators,

and take proactive measures
Line-level Manage OEE through traceability, WIP tracking,
and automated changeover
Machine-level Machine-to-machine communication to assure yield,
materials, and quality

Eliminate IT infrastructure costs with PanaCIM Express

A self-contained, pre-configured
system especially for smaller
installations requiring digital
data collection, yet do not
have dedicated IT staff.

APPLICATIONS
The extensive ways to deploy the modules amplify the inherent versatility of the NPM Series. With
applications spanning low volume industrial OEM runs to ultra-high volume LED luminaries production
and everything in between, the NPM is truly a solution for Any Mix Any Volume production. The following
configuration examples serve to highlight a select few applications where the NPM Series excels:

Versatile EMS Line

High Volume LED Display/Mobile Device Line

Flexibility to build nearly 1.5m long LED PCBs

Multiple LED Binning control options
Versatile to build broad array assemblies with superior quality and output
at mid-tier EMS providers

Line is capable of 370,000 cph actual output

Maximum output per square meter
Multiple LED Binning control options

NPM-W2

Broad EMS applications including LED boards up to

1,200mm x 510mm
Optional dual-lane board handling with on-the-fly bank change
Throughput: Configurable from 46,000 to 154,000 (as shown)
Inputs: Up to 240 8mm inputs or 206 8mm inputs + 20 trays
Part Range: 03015 chips to 120mm x 90mm, up to 40mm tall
Accuracy: 25 microns at 1.0 Cpk
Vision: Awarding-winning Multi Recognition Camera
Footprint as shown: 3.76m x 2.57m

NPM-D3

Nimble board handling provides reciprocating PCB

manufacturing to maximize output per square meter
Boards: Dual-lane 510mm x 300mm, Single-lane 510mm x 550mm
Throughput: Configurable from 99,000 to 756,000 (as shown)
Inputs: Up to 612 8mm inputs or 578 8mm inputs + 20 trays
Part Range: 03015 chips to 120mm x 90mm, up to 30mm tall
Accuracy: 25 microns at 1.0 Cpk
Vision: Awarding-winning Multi Recognition Camera
Footprint as shown: 7.49m x 2.65m

Automotive/Industrial Application Line

Large Part/Odd-form Placement

Highly flexible production line

Capacity to support multiple product and family setups
Process workorders without excess WIP and on-the-fly changeovers

Alleviate manual assembly and reduce hand insertions by up to 66%

Improve outgoing board quality
Deliver high volume output and leverage versatility of tray-fed components

Dual-lane board handling with on-the-fly bank change

for reciprocating PCB Manufacturing and minimal WIP

High Volume Odd-form placement of tape/tray-fed parts to

reduce manual assembly for pre-reflow or pre-wave solder

Boards: Dual-lane 1,200mm x 260mm, Single-lane 1,200m x 510mm

Throughput: Configurable from 80,000 to 385,000 cph (as shown)
Inputs: Up to 600 8mm inputs or 566 8mm inputs + 20 trays
Part Range: 03015 chips to 120mm x 90mm, up to 40mm tall
Accuracy: 25 microns at 1.0 Cpk
Vision: Awarding-winning Multi Recognition Camera
Footprint as shown: 7.0m x 2.57m

Boards: Dual-lane 510mm x 300mm, Single-lane 510mm x 590mm

Throughput: Configurable from 11,000 to 36,000 cph (NPM-TT)
Inputs: Up to 120 8mm inputs or 52 8mm inputs + 40 trays
Part Range: 01005 chips to 120mm x 90m, up to 30mm tall
Accuracy: 30 microns at 1.0 Cpk
Vision: 2D, 3D, and Chip Thickness Sensor technology
NPM-TT Footprint: 1.3m x 2.57m

NPM-W2

NPM-TT

PRINTING SOLUTIONS
The rapid growth of electronic devices is driving manufacturers to modify assembly techniques by
expanding and updating facilities or assets, cost-engineering, implementing new processes, and reducing
costs. The potential to build scrap increases dramatically. A balance between costs and output must be
struck while maintaining quality. A trending option is low-cost printing material;
however, process stability is key. Panasonic can help your process.
Twice the accuracy of competitive offerings regardless
of mix or volume 5 microns at 6 (3) 2.0 Cpk
Robust to use low-cost materials and consumables
while delivering high yields
Dual-lane is not only for high volumeits ideal for any mix
any volume production

TOTAL SOLUTIONS
Many suppliers claim to provide total solutions, but for Panasonic Factory Solutions Company of
America the notion of Total Solutions carries a very meaningful and powerful connotation. As a leading
electronics manufacturer with a deep and practical understanding of printed circuit board assembly, we
have the unique perspective to understand what is required to solve your production challenge.
Whats more, we have the distinctive ability to provide total solutions beyond the production line.
While we can provide best-in-class hardware and software tools from our own portfolio, we are part
of a supplier collective, which allows us to provide turn-key solutions for your unique application
and business model. Yet, the equipment sets are mere building blocks to solving your manufacturing
challenges, especially as our industry evolves with the Internet of Things.

FACTORY OF THE FUTURE

Across the globe, the Smart Factory has been highlighted in many national
initiatives. Regardless of the name, Industry 4.0, Advanced Manufacturing
or Smart Factory, all efforts focus on transforming the manufacturing
process from isolated silos to a lean, agile, and integrated ecosystem
underpinned by the Internet of Things.
Since our humble beginnings, Panasonic founder Konosuke Matsushita focused
on manufacturing innovation. In fact, we have been connecting things
throughout the course of our nearly 100 year history.
Beyond patents, PanaCIM MES software developments are already enabling the
connected factory and offering value beyond operational cost savings. It offers
compelling solutions to collect and analyze disparate data, in real-time and
across time, to transform the business. Furthermore, our software solutions
offer opportunities for sustained value creationand even disruption for those
who can imagine the endless Factory of the Future possibilities.

Providing
world-class solutions
for industrial,
communications,
automotive,
and more
regardless
of company size

SPECIFICATIONS
Model Name (Number)

NPM-D3 (NM-EJM6D)
Dual-gantry, Multi-head,
Process-driven Module

Concept
Drive System
Component Alignment
Head Design Options
Process Head Options
Board Dimensions
(Single Lane)
Board Dimensions
(Dual Lane)
Placement Accuracy
Throughput

Component Range

Feeder Capacity

Chip
QFP
Ideal
IPC9850

63,300 cph (1608C)

59,200 cph (1608C)

8,500 cph (QFP 208)

Min

03015mm microchip

03015mm microchip

0402mm (01005)

Max
Height
Reels
Trays

100x90mm (3.9x3.5)
40mm (1.57)
68
20

Electric
Facilities

NPM-W2 (NM-EJM7D)
NPM-TT (NM-EJM3D)
Dual-gantry, Large Board,
Dual-gantry, End of Line,
High Mix Module
Twin Tray Module
Dual-gantry, High Accuracy, Low Maintenance Linear Motor Drive System
Multi-Recognition Digital Camera
In-line array of 16-, 12-, 8-, 3-, or 2-nozzle heads
Inline 8- or 3-nozzle heads
Dual-syringe Dispense, 2D AOI/SPI (High/Low Res)
<>
750x550mm (Std)
510x590mm
510x590mm (Std)
1,200x550mm (Opt)
Consult us for other sizes
510x300mm (Std)
750x260mm (Std)
510x300mm
650x300mm (Opt)
1,200x260mm (Opt)
Consult us for other sizes
25 microns Cpk 1.0
25 microns Cpk 1.0
30 microns Cpk 1.0
30 microns Cpk 1.0
30 microns Cpk 1.0
30 microns Cpk 1.0
Up to 84,000 cph
Up to 77,000 cph
Up to 36,000 cph

Pneumatic
Mass
Dimension

150x25mm (6x1) & 120x90mm (4.7x3.5)

150x25mm (6x1) & 120x90mm (4.7x3.5)
40mm (1.57)
40mm (1.57)
120
52
40
40
Voltage: 3 Phase AC 200/220 10V; AC 380 400 420 480V 20V
Frequency: 50/60 Hz; Capacity: 2.5 kVa; Peal Current 30-38 A (AC 200 V)
0.5-0.8 MPa; 100 L/min (ANR)
0.5-0.8 MPa; 200 L/min (ANR)
0.5-0.8 MPa; 200 L/min (ANR)
1,900kg (Body + 2 Carts)
3,010kg (Body + 4 Carts)
3,050kg (Body + 2 Towers)
W 832 x L 2,652 x H 1,444mm
W 1,280 x L 2,465 x H 1,444mm
W 1,300 x L 2,798 x H 1,444mm

Panasonic Factory Solutions Company of America

Unit of Panasonic Corporation of North America

1701 Golf Road, Suite 3-1200, Rolling Meadows, IL 60008 USA
(847) 637-9600
PFSAmarketing@us.panasonic.com
panasonicfa.com
Europe

Singapore

Winsbergring 15 22525, Hamburg, Germany

Kiyoharu.Ito@eu.panasonic.com
+49 (0) 40-85386-222

285 Jalan Ahmad Ibrahim, Singapore 639931

fasales@sg.panasonic.com
+65 6860 5336

Brasil

China

Rodovia Presidente Dutra, KM 155 - So Jos dos Campos - SP - CEP:12230-971

fa@br.panasonic.com
+55-12-3935-9130

Floor 6, China Insurance Building. 166 East Road LuJiaZui, PuDong New District, Shanghai, China 200120
naito.hiroshi@jp.panasonic.com
+86-(021)3855-2810

Panasonic Automotive & Industrial Systems Europe GmbH

Panasonic do Brasil Limitada

Panasonic Factory Solutions Asia Pacific

Panasonic Industrial Devices Sales (China) Co., Ltd.

Copyright 2015 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement.
The information contained herein is correct as of the date of this document and subject to change without notice. Patent source: PCT Yearly Review 2015

EAG028.01