Product Catalog & Design Guide: Gas Discharge Tube (GDT) Products
Product Catalog & Design Guide: Gas Discharge Tube (GDT) Products
Product Catalog & Design Guide: Gas Discharge Tube (GDT) Products
CATALOG
& DESIGN
GUIDE
TABLE OF CONTENTS
GDT Characteristics, Terms and Consideration Factors
Legal Disclaimers
Mounting Options
DC
RoHS Compliant
Breakover Max AC Peak Pulse Operating
Cartridge Clip
Series Max
Radial Lead
# Terminals
Voltage Surge Current Temperature
Axial Lead
Lead Free
Mini Tube
Name1 Capacitance
Surface
Range Rating (8x20s) Range
(Nom VBO)
Squared GDTs
SE 140 to 500 0.5KA 0.5pF 2
-40C to +90C
SG 75 to 600 1KA / 2KA 1pF 2
(1) Please refer to product data in our datasheets for detailed information by part number.
* Total current through center (ground) terminal
2015
2015 Littelfuse,
Littelfuse, Inc.
Specifications are
Specifications, subject toand
descriptions change without
illustrative notice.in this literature are
material
as accurate
Revised: as known at the time of publication, but are subject to change
12/18/15
without notice. Visit www.littelfuse.com for more information.
Gas Discharge Tubes
Voltage (V)
as the air gap. Carbon block protectors are used mainly for
Voltage
telephone line protection but are being replaced, in most
installations, with the more reliable and consistent gas
discharge tubes.
Voltage (V)
can begin to conduct. This trigger signal is usually supplied referred to as transient voltage suppressers (TVS) diodes.
through the use of a zener diode. Packages that combine These diodes consist of fairlyBreakdown
large junction zeners which
the SCR and zener diode are now available. These packages have been designed specifically Voltage
for surge protection. The
TVS diodes are rated for higher current surges than zener
are monolithic devices and often contain an SCR-type Zener
thyristor with a gate region that acts like the avalanche diodes and they Voltage
can carry these currents for periods of 2-10
diode. Once triggered, the SCR begins to conduct, dropping microseconds.
the voltage across the zener diode to a value below the
130 are required. These
For use in AC signal lines, two zeners
zeners operating voltage and thus causing the zener to stop
are available as packagedCurrent
devices. Avalanche diodes are
(mA)
conducting. The SCR will conduct until the applied voltage
often used to protect ICs from static discharge and other
drops to zero (zero crossing of AC) or until the current falls
forms of transients in power supplies computer buses, and
below a specified value (sometimes referred to as a holding
data lines.
current).
SCR Avalanche Diode
Voltage vs. Current Characteristics Voltage vs. Current Characteristics
Leakage
Region
Clamping
Voltage (V)
Voltage (V)
Voltage
Breakdown
Voltage
Zener
Voltage
130 .001
Although typically having a faster response time than a MOV (METAL OXIDE VARISTOR): As its name
GDT, the SCR package is subject to higher leakage current suggests, the MOV is a voltage variable resistor made
Avalanche
and capacitance. The Diode
SCR package can handle currents from sintered metal oxides. The grains produced in the
Voltage
of several vs.amperes
hundred CurrentofCharacteristics
an 8/20 wave form and sintered metal oxide material of the MOV can be thought
packages are available that offer bi-directional protection. of as a network of series and parallel diodes. As the voltage
potential across the MOV increases, some of the diodes
CLAMPING PROTECTION: A clamping device actually experience avalanche breakdown and begin to conduct and
limits the voltage transient to a specified level by varying
Leakage
through the device increases, the voltage which the MOV plating and the final seal is made in a gasfilled vacuum
clamps at is greatly increased. furnace using braze preforms made of copper-silver eutectic.
The electrodes used for GDTs are either copper or a nickel-
MOV iron alloy, often with a coating to lower the work function
Voltage vs. Current Characteristics and/or add gettering capability. Stripes or bands of semi-
conductive material are applied to the inner surfaces of the
ceramic to improve stability and high-speed response.
Region
Upturn
In contrast, most devices in Littelfuses High Energy Devices
Leakage
Region
Voltage (V)
Volts
ARIZED COMPARISON
of the keyOF TECHNOLOGIES
performance parameters for every application.
Due to their complementary performance characteristics,
however, aGAS
GDTTUBE
and MOV can beSCR MOV
combined in a circuit to DIODE
provide theCG2-230L
ultimate in surge suppression performance. The A'
The CLARE product engineering department provides objective technical expertise and
application assistance to designers of switching surge protection systems. Our mission is
to assist you in designing the best solution to your specific application problem, regardless
manufacturer. To access our team of engineering professionals call toll free 1-800
CPCLARE.
THEORY
The basic operation of gas tube surge arrestors such as
Littelfuses GDTs is best understood by referring to the
schematic form of the voltage-current (V-i) relationship of a
generic gas discharge device such as the one depicted in
Figure 1.
G The arc region. In this region, the arc voltage will quickly
drop and the arc current will quickly increase within the
limitations of the drive energy and impedance.
Legal Disclaimers
Liability Disclaimer
Littelfuse, Inc. its affiliates, agents, and employees, Specifications, descriptions and data contained in this
and all persons acting on its or their behalf (collectively, document are believed to be accurate. However, users
Littelfuse), disclaim any and all liability for any errors, should independently evaluate each product for the
inaccuracies or incompleteness contained here or in any particular application. Littelfuse reserves the right to
other disclosure relating to any product. Littelfuse disclaims change any information contained herein without notice
any and all liability arising out of the use or application and may, at its sole discretion, change the design,
of any product described herein or of any information manufacture or construction of any product. Visit
provided herein to the maximum extent permitted by law. www.littelfuse.com for the most up-to-date information.
The product specifications do not expand or otherwise Littelfuses only obligations for any of its products are
modify Littelfuse terms and conditions of purchase, specified in its Standard Terms and Conditions and
including but not limited to the warranty expressed therein, Littelfuse shall not be liable for any indirect, consequential
which apply to these products. or incidental damages from any sale or use of any of its
products.
Right to Make Changes
Intellectual Property
Description
AC Series:
Long branch circuits Power supplies
(AC wall outlet) Test equipment
Short branch circuits Submersible pumps
(at breaker box,
Medical electronics
Additional Information computer, etc)
CG3 Series:
CRT terminals Power supplies
CATV equipment Medical electronics
Datasheet Resources Samples
AC Series AC Series AC Series Antennas
Electrical Characteristics
DC Breakdown Impulse Impulse Insulation Capaci- Arc Max Nominal AC Nominal Max
in Volts Break- Break- Resistance tance Voltage Follow AC Discharge Impulse Surge
(@100V/s) down down In (@1MHz) (on state On Discharge Current Discharge Current5
in Volts Volts Voltage) Current3 Current (1 x 50Hz Current4 (@8/20s)
@1Amp Min (10x1sec 9 cycles)
(@100V/s) (@1 Kv/sec) (@8/20s)
@50-60Hz)
Part
Number MIN TYP MAX MAX MIN MAX TYP
AC1201 A 230 285 340 500 550 10 G 200 10 shots 1 shot
<1.5 pf ~ 25 V 5A 65 A
AC2401 A 480 600 720 1100 1200 (at 100V) Amps 5kA 10kA
CG3 1.01 A 800 1000 1200 1400 1500
CG3 1.11 A 880 1100 1320 1600 1700
CG3 1.21 A 960 1200 1440 1700 1800
CG3 1.31 A 1040 1300 1560 1800 1900
CG3 1.51 A 1200 1500 1800 1800 2000
CG3 2.01 A 1600 2000 2400 2500 2750
CG3 2.51 A 2000 2500 3000 3200 3500
CG3 2.71 A 2160 2700 3240 3600 4000 10 G 200 10 shots 1 shot
<1.5 pf ~ 25 V N/A N/A
CG3 3.01 A 2400 3000 3600 4000 4200 (at 100V) Amps 5kA 10kA
CG3 3.31 A 2640 3300 3960 4600 4700
CG3 4.0 2
B 3200 4000 4800 5800 6000
CG3 4.52 B 3600 4500 5400 6150 6500
CG3 5.02 B 4000 5000 6000 7500 8000
CG3 6.22,7 B 4960 6200 7440 8100 9500
CG3 6.52,7 B 5200 6500 7800 9500 10000
CG3 7.52,6,7 B 6000 7500 9000 10000 10600
NOTES:
1. Refer to Production Dimensions section, outline A devices
2. Refer to Production Dimensions section, outline B devices Product Characteristics
3. Tested to UL1449 -- 120V r.ms. for AC120, 230V r.m.s. all others.
Conducted with suitable MOV connected in series.
4. 10 x [5(+) and 5(-)] applications 5kA @ 8/20s Core Outline A & B items:
5. 1 x [1(+) and 1(-)] application 10kA @ 8/20s Device: Tin Plated 17.512.5 Microns
6. CG3 7.5 product UL approval is currently pending Materials
Axial Outline A & B items:
7. When ordering this item, use suffix code D004 when entering the part number.
The older product version without D004 suffix code has been discontinued.
Device & Wire: Tin Plated 17.512.5 Microns
Refer to Part Numbering System section for additional information.
LF Logo, Voltage and date code;
Product Marking
Black ink positive print
Glow to arc
< 0.5Amps
transition current
Glow Voltage ~ 140 Volts
Storage and
Operational -40 to +90
Temperature
Temperature
- Time (Min to Max) (ts) 60 180 secs
Ramp-down
Average ramp up rate (Liquidus Temp
3C/second max Preheat
(TL) to peak TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of actual peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max
Time 25C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260C
180
Temperature Minimum: 100 C
160 Temperature Maximum: 150 C
140
Preheat Time: 60-180 seconds
120
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
Axial PROFILE VIEW TOP VIEW AC XXX XXX CG3 X.X XXX D004
Series Series
0.80DIA. TYP. CG3
[0.031] AC Line Voltage Breakdown Voltage
120 = 120V
A 8.0 0.2
[0.314 0.008]
240 = 240V
1.0 = 1000V
1.1 = 1100V
1.2 = 1200V
Lead / Packaging Option 1.3 = 1300V
= Core (no leads) / Bulk pack, 400 pcs per bag 1.5 = 1500V
L = Leaded / Bulk pack, 50 pcs per tray 2.0 = 2000V
6.0 0.2 LTR = Leaded / Tape & Reel, 500 pcs per reel 2.5 = 2500V
[0.236 0.008]
2.7 = 2700V
62 2 3.0 = 3000V
[2.441 0.079] 3.3 = 3300V
4.0 = 4000V
4.5 = 4500V
7.9 0.3
[0.311 0.012] 5.0 = 5000V
6.2 = 6200V
6.5 = 6500V
7.5 = 7500V
8.0 0.2
B [0.314 0.008] Lead / Packaging Option
= Core (no leads) / Bulk pack, 400 pcs per bag
0.80DIA. TYP. L = Leaded / Bulk pack, 50 pcs per tray
[0.031] LTR = Leaded / Tape & Reel, 500 pcs per reel
<1.2 Max. Lead Bend
Special Suffix Code
SEMIPROFILE VIEW Enter this D004 special suffix code when placing orders
for CG36.2, CG36.5 and CG37.5 only
Core PROFILE VIEW TOP VIEW
A 8.0 0.2
[0.314 0.008]
<0.8 Max
52.4
6.0 0.2 [2.063]
[0.236 0.008]
22.8
[0.898]
B 8.0 0.2
[0.314 0.008]
6.4
[0.252]
7.9 0.3 5.0 Pitch
[0.311 0.012]
[0.197]
Packaging Dimensions
For 'LTR' Option Code Axial Lead Items <1.2 Max. Lead Bend
254.0 - 356.0
[10.0 - 14.0]
<0.8 Max
22.8
[0.898]
6.4
[0.252]
5.0 Pitch
[0.197]
254.0 - 356.0
[10.0 - 14.0]
Description
Electrical Characteristics
Product Characteristics
CG5xxxLS (Outline 500), CG5xxxxLTR Product Marking LF Logo, Voltage and date code
& CG5350L-03TR (Outline 502), and
CG5xxxL-02 (Outline 503): Device Glow to arc
< 0.5Amps
Nickel Plated 25 Microns Wire Tin Plated transition current
17.512.5 Microns Construction Ceramic
Materials
Insulator. Glow Voltage 140 Volts
CG5xxx (Outline 501), and CG5xxxMS
& SL0902AxxxSM (Outline 505): Storage and
Device Tin Plated 17.512.5 Microns Operational -40 to +90
Construction Ceramic Insulator. Temperature
@ 2.45 GHz= 1 dB
(V)
Device Dimensions
Outline 500 - CG5xxxLS Outline 503 - CG5xxxL-02 (except CG5600L-02, see Outline 502)
5.0 0.2
[0.197 0.008]
40 3
5.30 0.30
[0.209 0.012]
3.0 0.3 5.0 0.2
[0.118 0.008] [0.197 0.008]
0.80
0.004 5.30 0.30 [0.031] 0.80DIA. TYP.
2 Surfaces 0.40 0.03 [0.209 0.012] 6.3 0.2 [0.031]
[0.016 0.0012] [2.480 0.079]
8.00 0.30
[0.315 0.012]
9.30 0.30
[0.366 0.012]
Outline 505 - CG5xxxMS and SL0902AxxxSM
SOLDER PAD LAYOUT
PROFILE VIEW TOP VIEW
8.00
[0.315] 6.6 0.2
[0.260 0.008]
5.50
[0.216]
5.4 0.15
[0.212 0.006]
1.80
[0.071]
0.5 0.1
9.80 [0.02 0.004 ] 3.8
[0.386] [0.15]
5.0 0.2 5.4 0.15
[0.197 0.008] [0.212 0.006]
5.10
5.0 0.15 [0.2]
[0.197 0.006]
0.70
[0.028]
5.0 0.2
[0.197 0.008]
5.0 0.2
[0.197 0.008]
62 2
[2.441 0.079]
Temperature
- Time (Min to Max) (ts) 60 180 secs
Ramp-down
Average ramp up rate (Liquidus Temp
3C/second max Preheat
(TL) to peak TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of actual peak
10 30 seconds
Temperature (tp) Soldering Parameters - Hand Soldering
Ramp-down Rate 6C/second max
Solder Iron Temperature: 350 C +/- 5C
Time 25C to peak Temperature (TP) 8 minutes Max. Heating Time: 5 seconds max.
Do not exceed 260C
180
Temperature Minimum: 100 C
160 Temperature Maximum: 150 C
140
Preheat Time: 60-180 seconds
120
100
Solder Pot Temperature: 280 C Maximum
80
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
Packaging
CG5xxxLTR
Straight Axial Leads Outline 502 1000pcs/reel in tape and reel*
CG5xxxL-03TR**
CG5xxxL-02** Bent Radial Leads Outline 503 50pcs/tray in tray and cover
CG5xxxMS
Surface mount Outline 505 900pcs/reel in carrier and tape*
SL0902AxxxSM
* For tape specifications and dimensions, please contact factory.
** Special order items not available for general sale. Please contact Littelfuse for details.
Description
The Broadband Optimized SL1002A series has
been especially developed for use in broadband
equipment. Special design features provide high
levels of protection against fast rising transients
in the 100V/s to 1kV/s range usually caused by
lightning disturbances. These devices have ultra low
capacitance (typically 1.2pF or less) and present
insignicant signal losses up to 1.5GHz. These
devices are extremely robust and are able to divert
a 5000A pulse without destruction. For AC Power
Cross of long duration, overcurrent protection is
recommended.
Agency Approvals
Features
AGENCY AGENCY FILE NUMBER
RoHS compliant/Lead- 10/700 6kV capability,
E128662 free as per ITU-T Rec. K.21,
Ultra low insertion loss enhanced test level
2 Electrode GDT Graphical Symbol Surface mountable 2000 A 2/10s surge
rating
5kA surge capability
tested with 8/20S Meet FCC part 68
Pulse as dened by IEC 10/160s waveform,
61000-4-5 200A test and 10/560s
waveform 100A test
Excellent response to
fast rising transients Halogen-free
Electrical Characteristics
Notes:
1. At delivery AQL 0.65 level II, DIN ISO 2859
2. In ionized mode
3. In ionized mode, tested according to ITU-T Rec. K.12
4. Comparable to the silicon measurement Switching Voltage (Vs)
5. Reference REA PE-80, 0.2A. Tested to ITU-T Rec. K.12 and REA PE-80 < 150 msecs.
6. 300 Applications [150(+) & 150(-)]
7. 10x[5x (+) & 5x (-)] Applications
Product Characteristics
Max dynamic
breakover voltage
Voltage
(V)
Hold-over voltage
On-State voltage
Typical Insertion Loss Characteristics (90V) Typical Insertion Loss Characteristics (600V)
2 2
0 0
-2
-2
-4
-4
-6
S21 [dB]
S21 [dB]
-6
-8
-8
-10
-10
-12
-12
-14
-16 -14
-18 -16
1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11
Frequency [Hz] Frequency [Hz]
Device Dimensions
6.2 0.15
0.50
7.
0.50
5
0.
2
1.30 [0.051]
5.00 [0.197]
3.50 [0.138]
Temperature
- Time (Min to Max) (ts) 60 180 seconds
Ramp-down
Average Ramp-up Rate (Liquidus Temp
3C/second max. Preheat
(TL) to peak) TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max.
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of Actual Peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max.
Time 25C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260C
120
Preheat Time: 60-180 seconds
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
Packaging
'SM' Type Surface Mount Items: Packaged tape and reel carrier, 1000 pcs/reel (specifications below)
Dimensions are in millimeters [and inches] Dimensions are in millimeters [and inches]
6.5 0.1
275.0
1.50 +0.10 [0.256 0.004] [10.83]
0
0.40
[0.059 +0.004 ] [0.016] 100.0
0
[3.94]
3
76.0
[0.256 0.004]
[2.99]
[0.630 0.012]
25.0
6.5 0.1
16 0.3
[0.98]
[0.295 0.004]
7.5 0.1
R0.30 max.
[0.012] 17.7
[0.697]
1.50 2 0.1 8 0.1 [0.069 0.004]
1.75 0.1
Direction of Feed
[0.059] [0.079 0.004] [0.315 0.004]
10x4=40 0.2 4 0.1
[10x0.157=1.575 0.008] [0.157 0.004]
SL1002 A XXX XX
Surge Capability
Voltage
Pin Configuration
C = Core (Packed in polybag, 1000pcs/bag)
SM = Surface Mount (Packed in carrier and tape, 1000pcs/reel)
Description
The SL1003A series has been especially developed
for Broadband equipment. Special design features
provide high levels of protection against fast rising
transients in the 100V/s to 1kV/s range usually
caused by lightning disturbances.
Electrical Characteristics
Notes:
1. At delivery AQL 0.65 level II, DIN ISO 2859
2. In ionized mode, tested according to ITU-T Rec. K.12
3. Comparable to the silicon measurement Switching Voltage (Vs)
4. Reference REA PE-80, 0.2A. Tested to ITU-T Rec. K.12 and REA PE-80 < 150 msecs.
Product Characteristics
Device Dimensions
'R' Type Radial Lead Devices (SL1003AxxxR-001) 'C' Type Core Devices
'R' Type Radial Lead Devices (SL1003AxxxR and SL1003AxxxRF) 'SM' Type Surface Mount Devices
PROFILE VIEW TOP VIEW
TOP VIEW
12.2 - 2 6.0 0.1 PROFILE VIEW
[0.480 - 0.079] [0.236 0.039]
6.0 0.1 8.1 0.2
8.1 0.2
3.20 [0.319 0.0079]
[0.236 0.039] [0.126] 2.8 2.8
[0.110] [0.110]
2.20
[0.087]
1.20 1.20
PROFILE VIEW TOP VIEW
[0.04] [0.047]
12.2 - 2 6.0 0.1
[0.480 - 0.079] [0.236 0.039]
1.2 Max 8.1 0.2 7.00
[0.047] [0.236 0.039]
[0.275]
6.000 allow space
[0.236] for product
clearance
6.7 0.5
[0.263 0.020]
2.10 2.10
[0.083] [0.083]
6.40
4.3 + 1.5 6.0 0.5 [0.252]
[0.169 + 0.059] [0.236 0.020]
7.60
[0.299]
Temperature
- Time (Min to Max) (ts) 60 180 seconds
Ramp-down
Average Ramp-up Rate (Liquidus Temp
3C/second max. Preheat
(TL) to peak) TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max.
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of Actual Peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max.
Time 25C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260C
120
Preheat Time: 60-180 seconds
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
Packaging
'C' Type Core Items: Package bulk pack in polybag, 500 pcs/bag
'R' and RF Type Radial Lead Items: Packed in tray, 100 pcs/tray
'SM' Type Surface Mount Items: Packaged tape and reel carrier, 700 pcs/reel (specifications below)
Dimensions are in millimeters [and inches] Dimensions are in millimeters [and inches]
[0.069 0.0039]
[3.94]
m
76.0
20
[0.453 0.0039]
[2.99] 25.0
11.5 0.1
[0.98]
[ 0.945 0.012]
[0.339 0.0039]
24 0.3
14 [0.551]
4 [0.157]
8.6 0.1
17.7
[0.697]
Direction of Feed
5 m
[0.118] [0.354]
6.1 0.1
R0.3 typical [0.240 0.0039]
[0.012]
SMD-tape according to IEC 60286-3
SL1003 A XXX XX
Description
The SL1010A Series Gas Discharge Tube (GDT) offers
a compact, three-terminal, surface mount component
thats just 5mm in diameter. It is rated for 10 hits
(5 repetitions) of a 5kA 8/20s surge event with a
low off-state capacitance of 1.5pF. Its low arc voltage
parameter of 10V reduces thermal accumulation
during long-term power fault events.
Agency Approvals
Features
AGENCY AGENCY FILE NUMBER 5mm diameter size High current rating
Low insertion loss Stable performance
E128662
Fast response time over lifetime
Single component Lead-free and RoHS
3 Electrode GDT Graphical Symbol balanced protector compliant
(T-grd & R-grd) UL Recognized
Applications
Electrical Characteristics
Product Characteristics
Product Marking Littelfuse 'LF' Mark, voltage and date code Storage and Operational Temperature -40 to +90C
Device Dimensions
For SL1010A series: Dimensions are in millimeters [and inches]
0,2
4,7
2
0,
6
Temperature
- Time (Min to Max) (ts) 60 180 seconds
Ramp-down
Average Ramp-up Rate (Liquidus Temp
3C/second max. Preheat
(TL) to peak) TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max.
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260 +0/-5
C
Time within 5C of Actual Peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max.
Time 25C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260C
Dimensions are in millimeters [and inches] Dimensions are in millimeters [and inches]
275.0
[10.83]
100.0
[3.94]
76.0
[2.99] 25.0
[0.98]
17.7
[0.697]
Direction of Feed
SL1010A Series
Voltage
Pin Configuration
F = with Failsafe (Packed in carrier and tape, 900pcs/reel)
SM = Surface Mount (Packed in carrier and tape, 900pcs/reel)
SMF = Surface Mount with Failsafe (Packed in carrier and tape, 900pcs/reel)
Description
The SL1011A and SL1411A series provides high levels
of protection against fast rising transients in the
100V/s to 1kV/s range usually caused by lightning
disturbances.
Features
AGENCY AGENCY FILE NUMBER
RoHS compliant 5kA (SL1011A) or
E128662 10kA (SL1411A) surge
Low insertion loss
capability tested with
Excellent response to
2 Electrode GDT Graphical Symbol 8/20s
fast rising transients
pulse as defined by
Ultra low capacitance IEC 61000-4-5
Applications
Electrical Characteristics
Product Characteristics
Device Dimensions
8.0 0.2
[0.315 0.0079]
8.0 0.2
6.05 0.2
[0.238 0.0079]
62 2
'A' Type Axial Lead Devices 'SM' Type Surface Mount Devices
PROFILE VIEW TOP VIEW TOP VIEW PROFILE VIEW SEMIPROFILE VIEW
8.3 0.1
1.0 4 [0.157]
[0.039] 5.55 [0.219]
+ 0.10 6.05 0.2
8.0 0.30
[0.238 0.0079]
[0.315 + 0.0039
0.0118 ]
8.3 0.15
6.05 0.2
[0.238 0.0079]
62 2
9.
0.5 0.1
30
0.
1.30 [0.051]
7.00 [0.276]
Temperature
- Time (Min to Max) (ts) 60 180 seconds
Ramp-down
Average Ramp-up Rate (Liquidus Temp
3C/second max. Preheat
(TL) to peak) TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max.
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of Actual Peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max.
Time 25C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260C
120
Preheat Time: 60-180 seconds
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
22.8
[0.898]
61
[0.236 0.039]
10 0.5 Pitch
[0.394 0.020]
Packaging Dimensions
254.0 - 356.0
[10.0 - 14.0]
22.8
[0.898]
61
[0.236 0.039]
10 0.5 Pitch
[0.394 0.020]
275.0
254.0 - 356.0 [10.83]
[10.0 - 14.0]
10x4 0.1 = 40 0.2 100.0
[10x0.157 0.004 = 1.575 0.008] [3.94]
1.75 0.1
0.4 0.05 [0.069 0.004] 1.5 DIA. MAX. 4 0.1 76.0
[0.016 0.002] [0.059] [0.157 0.004] [2.99] 25.0
[0.98]
7.5 0.1
[0.295 0.004] Direction of Feed
77.0 Max.
8.5 0.1
[0.335 0.004] [3.03] 16 +0.3 / -0.1 17.7
[0.630 +0.012 / -0.004] [0.697]
Direction of Feed
For 'C' Type Core Items: Packed in plastic bag (500 pcs)
Voltage
Pin Configuration
A = Axial Lead
C = Core
Remarks: Formed leads are available on request
Surge Capability
Voltage
Pin Configuration
A = Axial Lead
C = Core
SM = Surface Mount
Description
Agency Approvals
Features
Applications
a b
MDF protection Alarm panels
(centre electrode)
ADSL equipment General telecom
XDSL equipment equipment
e
Additional Information
Electrical Characteristics
Notes:
1. Total current through centre electrode
2. Maximum Peak Break Over Voltage
Product Characteristics
Radial Lead Devices For Radial Lead Items: Packed in tray (100 pcs)
PROFILE VIEW Dimensions are in millimeters [and inches]
TOP VIEW
SL1122A XXX X
Voltage
1.5 Min
[0.059]
10.5 Max
[0.413] Pin Configuration
15.0 1.0
[0.591 0.039]
Temperature
- Time (Min to Max) (ts) 60 180 seconds
Ramp-down
Average Ramp-up Rate (Liquidus Temp
3C/second max. Preheat
(TL) to peak) TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max.
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of Actual Peak * Devices that are soldered require inspection before use.
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max.
Time 25C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260C
120
Preheat Time: 60-180 seconds
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
Description
Electrical Characteristics
SL1021A145
SL1021B145
116 145 174
500
SL1021A150 600
SL1021B150
120 150 180
SL1021B300
240 300 360 650 850
(at 100V) 5kA3
SL1021A350
SL1021B350
280 350 420 700 900
SL1021A400
SL1021B400
320 400 480
850 950
SL1021A420
SL1021B420
345 420 500
SL1021A450
SL1021B450
360 450 540 900 1000
SL1021A500
SL1021B500
400 500 600 950 1100
Additional Information
Voltage
13
12
(V)
11
10
9
8 Hold-over voltage
7
6
5
4
On-State voltage
3
2
1
0 200 400 600 800 1000 1200
0.5 1 2 5 10 15 30
Time (ns)
180
Temperature Minimum: 100 C
160 Temperature Maximum: 150 C
140
Preheat Time: 60-180 seconds
120
100
Solder Pot Temperature: 280 C Maximum
80
0
individually examined after soldering
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
SL1021A/B Series
Minimum
Gap
9.9
9.9
[0.354]
[0.354]
15
[0.590]
NOTE: Failsafe option dimensions shown in green. 8.3 +0.3/-0.0 8.0 +0.3/-0.1
12.4 1 [0.327 [0.315
[0.488 0.039] Mounting Area +0.019/-0.00] +0.019/-0.004]
Shaped
Type 05Radial
/P Leaded Devices:
11.8 9.0 Core Devices:
[0.464] [0.354]
12.4
10.10 1 8.1. Mounting Area
[0.488 12.4
[0.398] 0.039]
1 [0.319] Area PROFILE VIEW 11.8 SIDE VIEW TOP VIEW
Mounting Mounting
9.0 Area
[0.488 0.039] [0.464]
11.8
Type 04 / R 11.8 Mounting
9.0 Area Type 01 / C [0.464]
[0.354]9.0
Type0.3mm
04 / R 12.4
[0.464]
[0.488
1
11.8
0.039]
[0.464]
[0.354]9.0
[0.354]Area
Type 01 / C 10.10
11.8
2.2 0.0 [0.354]Area
Mounting
8.1
Minimum 10.10 Mounting
8.1. [0.398]
10.10 [0.087 0.000] 9.0
[0.464] [0.319]
8.1
Type 04 /R
Gap [0.398]11.8
10.10
[0.464]
[0.319]9.0
8.1.
[0.354]
Type 01 / C 1.2 0.0
0.3mm [0.047 0.000]
[0.398] 1.2 0.0 [0.354]
[0.047 0.000] [0.319]
[0.398] 9.9 [0.319] 10.10
[0.354] Minimum
0.3mm [0.398] 8.1
10.10 8.1. Gap
Minimum [0.319]
0.3mm [0.398] [0.319]
Minimum
0.3mm Gap
0.3mm
Gap
Minimum Minimum 9.9
15
Gap 9.9 Gap 6.0 0.0 [0.354] 8.5 0.0
0.3mm
[0.590] [0.236 0.000] 9.9 [0.335 0.000]
Minimum [0.354]
9.9 [0.354]
Gap [0.354] 9.9
16.8 9.9 1.0 DIA. [0.354]
[0.661] [0.354] [0.039]
4.4 15
[0.590] 15
[0.173]
[0.590] 10.75 0.0 Overall Product Space
[0.423 0.000] DO NOT ENCROACH
15
[0.590] 16.8 1.0 DIA.
[0.661] [0.039]
4.4 5.5 0.3 5.5 0.3 16.8 1.0 DIA. SOLDERING PAD LAYOUT
10.0 0.3
[0.216 [0.661] [0.039]
[0.173] 4.40.12] [0.216 0.12] [0.394 10.0
0.019]
0.3
[0.173] 16.8 1.0 DIA. Type 60 7.7 0.3 [0.394 0.019]
4.4
[0.661] [0.039]
Type 60 [0.303 0.019]
7.7 0.3 7.0 0.1
[0.27510.0
7.0 0.3
0.004]0.1
[0.173] [0.303 0.019] [0.394
[0.275 0.019]
4.4 0.3
[0.173 0.12]
4.4 0.3
4.4 0.3
[0.173
4.40.12]
0.3 Straight Radial Leaded Devices:
Type 60 7.7 0.3
0.004]
7.0 0.1
[0.173 0.12] [0.173 0.12] [0.303 0.019]
[0.275 0.004]
4.4 0.3 4.4 0.3
[0.173 0.12] [0.173 0.12] 8.3 +0.3/-0.0 14.7 8.0 +0.3/-0.1
12.4 1 [0.327
8.3 +0.3/-0.0 [0.579] [0.315
8.0 +0.3/-0.1
Type 14 / X
[0.488 12.4
0.039]
1
[0.488 0.039]
Mounting Area Type 06 / Y
+0.019/-0.00]
[0.327
+0.019/-0.00] 11.8
+0.019/-0.004]
Mounting Area [0.315
Type 05 / P 11.8
50 3 [0.464]
Mounting
9.0 Area 8.3 +0.3/-0.0
[0.464] 9.0 +0.019/-0.004]
8.0 +0.3/-0.1
Type 05 / P 12.4
[1.968 0.118[0.488
] [0.464]
1
11.8
0.039]
[0.354]9.0 [0.327
+0.019/-0.00]
[0.354] [0.315
Mounting [0.354]Area
Mounting
Area 10.10 +0.019/-0.004]
10.10 8.1. 8.1 DIA. MAX.
Type 05 / P 11.8
[0.464]
[0.398]11.8
10.10 9.0
[0.319]9.0
8.1. PROFILE VIEW [0.398] SIDE VIEW TOP VIEW [0.319]
[0.464]
[0.398] [0.354] [0.354]
[0.319] PROFILE VIEW SIDE VIEW TOP VIEW
10.10 10.10 8.1.
0.3mm [0.398] 8.1 DIA. MAX. 0.3mm PROFILE VIEW
2.2 0.0
[0.398] [0.319] SIDE VIEW
[0.087
2.20.000]
0.0 TOP VIEW
Minimum
0.3mm [0.319] Minimum
Gap
Minimum Gap 1.2 0.0 [0.087 1.20.000]
0.0
Gap 9.9 [0.047 0.000]
1.2 0.0 2.29.9 [0.047
0.0 1.20.000]
0.0
0.3mm 0.3mm [0.047 0.000]
Minimum Minimum [0.354]
9.9 [0.047 0.000] [0.354]
[0.087 0.000]
Gap Gap [0.354] 1.2 0.0 1.2 0.0
9.9 [0.047 0.000] [0.047 0.000]
15 [0.354] 15 6.0 0.0 8.5 0.0
[0.590] 15 [0.590]
[0.236 0.000]
6.0 0.0 [0.335
8.50.000]
0.0
[0.590] [0.236 0.000] [0.335 0.000]
15 6.0 0.0 8.51.0 DIA.
0.0
[0.590] 16.8 23.8 1.0 DIA. [0.236 0.000]
16.8
[0.039]
[0.335 0.000]
[0.937]
[0.661] [0.661]
16.8 [0.039]
1.0 DIA.
22 4.4 [0.661] [0.039]
[0.173] 4.4
[0.866] 10.75 0.0
[0.173] 16.8 1.0 DIA..1.0 DIA. Overall Product Space
[0.42310.75
0.000]
0.0 DO NOT ENCROACH
[0.661] [0.039] [0.039] Overall Product Space
4.4 [0.423 0.000] DO NOT ENCROACH
[0.173] SOLDERING 10.75
PADLAYOUT
0.0
5.5 0.3 5.5 0.3 6.35 0.5 6.35 0.5 Overall Product Space
[0.423 PAD
SOLDERING 0.000]
LAYOUT DO NOT ENCROACH
[0.216 0.12]
5.5 0.3 [0.216
5.50.12]
0.3 [0.25 0.25] [0.25 0.25]
[0.216 0.12] [0.216 0.12]
5.5 0.3 5.5 0.3 SOLDERING PAD LAYOUT
[0.216 0.12] [0.216 0.12]
14.7
[0.579]
14.7
Straight
Type 14"T"
/ XLeaded Devices: Type 06 / Y [0.579] Mounting Area
Type 14 / X 50 3
Type 06 / Y 11.814.7
[0.464]
11.8
Mounting
9.0 Area
[0.579] [0.354]9.0
[1.968 50
0.118
3] [0.464]
Type 14 / X [1.968 0.118 ] Mounting Area Type 06 / Y 10.10
11.8 8.1 DIA.
[0.354]Area
Mounting
MAX.
11.8 Mounting
9.0 Area [0.398]
10.10 9.0 MAX.
50
[0.464] 3
11.8 [0.464] [0.319]
8.1 DIA.
[0.354]9.0 [0.398] [0.354]
[0.319]
[1.968 0.118 ]
[0.464]
10.10 [0.354]Area
Mounting 10.10
11.8 0.3mm 8.1 DIA. MAX.
[0.398]
10.10 8.1 DIA. MAX.
9.0 [0.398] [0.319]
[0.464]
[0.398] [0.319]
8.1 [0.354]
DIA. MAX. Minimum
0.3mm
[0.319] Gap
Minimum
10.10 Gap 9.9
0.3mm [0.398] 8.1 DIA. MAX. 0.3mm
Minimum
0.3mm Minimum [0.354]
9.9
[0.319] [0.354]
Gap
Minimum Gap
Gap
0.3mm 9.9
Minimum 15 [0.354]
Gap [0.590] 15
[0.590]
23.8 15 1.0 DIA.
[0.590] 16.8
[0.937]
23.8 [0.661] [0.039]
1.0 DIA.
16.8
[0.937] [0.661] [0.039]
22
[0.866] 22 23.8 16.8 1.0 DIA.
[0.866] [0.937] 1.0 DIA.. [0.661] [0.039]
[0.039]
1.0 DIA..
22 [0.039]
[0.866] 6.35 0.5
1.0 DIA.. 6.35 0.5
[0.039] [0.25 6.35
0.25]
0.5 [0.256.35
0.25]
0.5
[0.25 0.25] [0.25 0.25]
6.35 0.5 6.35 0.5
[0.25 0.25] [0.25 0.25]
SL1021A/B Series
Box (Cardboard)
~58
Tray (PET)
for 50 Pcs.
~135
Part Numbering System and Ordering Information Packaging
SL102x x xxx x x PMT8 xxx x x For 'SL1021A/B' device type C, R, P, Y packing
Series Series
SL1021 PMT8
SL1024
Surge Capability
A = 10kA 35
B = 20kA ~2
Breakdown Voltage Breakdown Voltage
090 = 90V 300 = 300V 090 = 90V
145 = 145V 350 = 350V 230 = 230V
150 = 150V 400 = 400V 250 = 250V Box (Cardboard)
200 = 200V 420 = 420V 350 = 350V
230 = 230V 450 = 450V 400 = 400V
250 = 250V 500 = 500V
260 = 260V 600 = 600V Tray, Cover (PET)
~55
Configuration Code Configuration Code
(See Device Dimensions section) (See Device Dimensions section)
Tray, Bottom (PET)
C Y 01 10
R X
for 100 Pcs.
04 14
P 05 60
06 PE Form
Option Code Option Code
Blank = No failsafe Blank = No Failsafe
F or G = With Failsafe F = With Failsafe
58
~2
Box (Cardboard)
~58
Tray (PET)
for 50 Pcs.
~135
Device~2Type
35 Description Quantity
Description
AGENCY AGENCY FILE NUMBER The CG Series (75V-110V) is ideal for protection
of test and communication equipment and other
E1286621 devices in which low voltage limits and extremely
low arc voltages are required.
E3201162
NOTES: The CG2 Series (145V-1000V) is ideal for protecting
1. Certified to UL 497B.
2. Only CG2300, CG2470, CG2600, CG2800 and CG221000. Certified to UL 1449.
equipment where higher voltage limits and holdover
voltages are necessary.
2 Electrode GDT Graphical Symbol
Features
Applications
Datasheet Resources Samples
CG/CG2 CG/CG2 CG/CG2 Communication lines Instrumentation circuits
and equipment Medical electronics
CATV equipment ADSL equipment
Test equipment Telecom SLIC
Data lines protection
Power supplies
Electrical Characteristics
Product Characteristics
2.29 [0.090]
5.58 [0.232]
6.05 0.2
[0.268 0.0080]
8.300.1
8.71 [0.343]
Device Dimensions
5.89 [0.232]
0.47 0.1
Leaded 'L' Type Straight Axial Devices Leaded 'LS' Type Shaped Lead Devices
8.10DIA. MAX.
[0.319]
8.40 0.3
[0.331 0.012]
6.07 0.15
[0.239 0.006]
0.80
0.004 8.4 0.3 [0.032]
62 2 [0.331 0.012]
2 Surfaces 0.40 0.03
[0.0157 0.0012]
9.85 0.30
[0.388 0.012]
FILE VIEW TOP VIEW SOLDER PAD LAYOUT
11.15 0.30
6.07 0.30 8.10 Max. [0.439 0.012]
239 0.012] [0.319 DIA Max.]
SOLDER PAD LAYOUT
Core Devices 9.85 [0.388]
9.85
[0.388]
8.40 0.3 8.66 [0.341]
[0.331 0.012]
TOP VIEW PROFILE VIEW SEMIPROFILE VIEW 8.60
[0.339]
8.10 Max.
[0.032 Max.]
6.07 0.15 1.77 [0.070]
[0.239 0.81
0.0059]
0.004 8.4 0.3 [0.032]
5.89 [0.232] 1.80
2 Surfaces 0.40 0.03 [0.331 0.012] 11.68 [0.460] [0.071]
[0.0157 0.0012]
11.65
9.85 0.30 [0.459]
8.10 Max.
0.388 0.012]
11.15 0.30
0.439 0.012]
11.50
.3
30 0
6
.00
0. 7
2 9]
16 16 16 16 16 0.47 0.1
250G 250G 250G 250G 250G
XXXX XXXX XXXX XXXX XXXX [0.019 0.0039]
24.00
SOLDER PAD LAYOUT
2.29 [0.090]
16.00
5.89 [0.232]
1.01
(25.7)
Direction of Feed
Temperature
- Time (Min to Max) (ts) 60 180 secs
Ramp-down
Average ramp up rate (Liquidus Temp
3C/second max Preheat
(TL) to peak TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260 +0/-5
C
Time within 5C of actual peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max
Time 25C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260C
180
Temperature Minimum: 100 C
160 Temperature Maximum: 150 C
140
Preheat Time: 60-180 seconds
120
100
Solder Pot Temperature: 280 C Maximum
80
20
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
Time (Seconds)
6.4
[0.252]
5.0 Pitch
[0.197]
Packaging Dimensions
254.0 - 356.0
[10.0 - 14.0]
<0.8 Max
Direction of Feed
80.0
52.4 [3.15]
[2.063]
22.8
[0.898]
6.4
[0.252]
5.0 Pitch
[0.197]
275.0
[10.83]
10x4 0.1 = 40 0.2 100.0
254.0 - 356.0 [10 x 0.157 0.004 = 1.575 0.008] [3.94]
[10.01.75 0.1
- 14.0]
0.4 0.05 [0.069 0.004] 1.5 DIA. MAX. 4 0.1 76.0
[0.016 0.002] [0.059] [0.157 0.004] [2.99] 25.0
[0.98]
7.5 0.1
[0.295 0.004]
8.5 0.1
[0.335 0.004] 16 +0.3 / -0.1 17.7
[0.630 +0.012 / -0.004] Direction of Feed [0.697]
80.0
[3.15] Direction of Feed
1.9
[0.075] 25.7
[1.01]
11.5 0.1 Direction of Feed
[0.453 0.004]
0.5 0.01
[0.020 0.004]
1.5 DIA. MAX.
9 0.1 [0.059] 16 0.1
[0.354 0.004] [0.630 0.004]
CG2 XXX XX * XX
Series Examples:
CG -- for 75, 90, or 110V
CG2 -- for 145V to 1000V CG75 -- A non-leaded 75V device
Description
The SL1026 Series is a heavy-duty transient
suppresser using Gas Plasma technology. In
response to transients that exceed the device's
breakover voltage, the device changes from a very
high impedance state to a low impedance state to
conduct harmful current away from the protected
system. The SL1026 is designed to protect electrical
and electronic equipment such as communications,
control and railway systems. Carefully designed
geometry ensures against short circuiting if a failure
occurs due to conditions and events beyond the
design criteria. Optional electrical mounting clip (part
3 Electrode GDT Graphical Symbol SL1053 ) is available to aid mounting and connection.
a = TIP Features
a b b = RING RoHS compliant Will protect against
e = GROUND capacitor discharge
(centre electrode) 55 kA surge capability
(single shot) tested with voltage transient
8/20S pulse as defined waveforms as specified
e in RIA 12.
by IEC 61000-4-5
40 kA surge capability Will protect against
Additional Information double exponential
(repetitive)
voltage transient
Will protect against
waveforms as specified
Trapezoidal waveforms
in IEC 571.
as specified in RIA 12.
Datasheet Resources Samples
Applications
Electrical Characteristics
DC Voltage 1
AC 1
AC 1
Surge Max
1,2
8.7 9.1
Max Max
Voltage
(V)
On-State voltage
Electrical Specifications
Insulation
> 10G at 100 Volts
Resistance
Physical Specifications GDT devices are provided as bulk pack in poly bag --
20 pieces per bag and 5 bags per carton.
SE Series RoHS
Description
Electrical Characteristics
Product Characteristics Tape and Reel Dimensions (IEC 60286-3, dimension in mm)
2.1 0.1 5
Device Tin Plated 17.512.5 Microns Tape Specifications
Materials Tape Specifications
IEC 60286-3 section
Construction Ceramic Insulator. IEC 60286-3 in mm
Dimensions section
B-B
5
Dimensions in mm B-B
Storage and
Operational -40 to +90 C
1.75 0.1
section
section 2 0.1 4 0.1
1.75 0.1
A-A
A-A
Temperature 0.4 0.05
0.4 0.05 2 0.1 A4 0.10 1.55 1.5 1.6 0.1
0.05
0.05
A
12 - 0.15.5 0.1
5
4.9 0.1 5
+0.3
5.5 0.1
0
Voltage vs. Time Characteristic
12
+0.3
B B
3 0.1
A 3.65 0.1 8 0.1
3.7 0.1
R0.5 typical
B B
Max dynamic breakover SMD-Tape has to withstand
Hold-over voltage
Reel Specifications
On-State voltage
Reel
IEC Specifications
60286-3
Dimensions
IEC 60286-3in mm
Dimensions in mm
1.5 min.
1.5 min.
min. max.
20.2 min.
100 min.
12.8 min.
330 max.
20.2 min.
100330
R0.75
12.8 min.
18.4 max.
R0.75
18.4 max.
12.4 +2/-0
12.4 +2/-0
11.9 min.
11.9 min.
2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/06/15
Gas Discharge Tubes
SE Series
Temperature
- Time (Min to Max) (ts) 60 180 secs
Ramp-down
Average ramp up rate (Liquidus Temp
3C/second max Preheat
(TL) to peak TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260 +0/-5
C
Time within 5C of actual peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max
Time 25C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260C
SE xxx
Dimensions in mm and inch [...]
[0.126 +/- 0.012] [0.063+/- 0.008] Series
3.2+/-0.3 1.6+/- 0.2 1206 Square GDT
Breakdown Voltage
[0.063+/- 0.008]
1.6+/- 0.2
140 = 140V
200 = 200V
230 = 230V
350 = 350V
[0.157]
470 = 470V
4 500 = 500V
[0.047] [0.063]
[0.094]
SG Series RoHS
Description
Features
Electrical Characteristics
Storage and
Operational -40 to +90 C
Temperature
Voltage
(V)
Temperature
- Time (Min to Max) (ts) 60 180 secs
Ramp-down
Average ramp up rate (Liquidus Temp
3C/second max Preheat
(TL) to peak TS(min)
tS
TS(max) to TL - Ramp-up Rate 5C/second max
- Temperature (TL) (Liquidus) 217C 25
Reflow
- Temperature (tL) 60 150 seconds time to peak temperature
(t 25C to peak) Time
Peak Temperature (TP) 260+0/-5 C
Time within 5C of actual peak
10 30 seconds
Temperature (tp)
Ramp-down Rate 6C/second max
Time 25C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260C
Type Production
Dimensions in Millimeters. Code Year Code
(last digit)
Tape and Reel Dimensions (IEC 60286-3, dimension in mm) Part Numbering System and Ordering Information
A-A
2 0.1 4 0.10 1.55 0.05 1.6
Breakdown Voltage
0.4 0.05 0.1
A 75 = 75V
90 = 90V
150 = 150V
5.5 0.1
4.9 0.1 5
+0.3
200 = 200V
12 0
230 = 230V
B B 300 = 300V
3 0.1 350 = 350V
R0.5 typical A 3.65 0.1 8 0.1
400 = 400V
420 = 420V
SMD-Tape has to withstand
a minimum Force of 450 = 450V (Not available without Q suffix)
F > 20 N / pocket 500 = 500V (Not available without Q suffix)
2 Kg / pocket
minimum vertical load 600 = 600V (Not available without Q suffix)
(minimum checking
quantity:10 pockets) Device Option Code
(Blank) = Standard device
Q = Quick Response Version
(300V, 350V, 420V, 450V,
500V, 600V only)
1.5 min.
330 max.
20.2 min.
100 min.
12.8 min.
R0.75
18.4 max.
12.4 +2/-0
11.9 min.
EC141Nv1115