INA118 Precision, Low Power Instrumentation Amplifier: 1 Features 3 Description
INA118 Precision, Low Power Instrumentation Amplifier: 1 Features 3 Description
INA118 Precision, Low Power Instrumentation Amplifier: 1 Features 3 Description
INA118
SBOS027A SEPTEMBER 2000 REVISED JANUARY 2016
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SOIC (8) 3.91 mm 4.90 mm
INA118
PDIP (8) 6.35 mm 9.81 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
V+
7
2 Over-Voltage INA118
VIN
Protection
A1 50k
G=1+
60k 60k RG
1
25k
6
RG A3 VO
8
25k
5
A2 Ref
+ 3 Over-Voltage
VIN 60k 60k
Protection
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA118
SBOS027A SEPTEMBER 2000 REVISED JANUARY 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 13
2 Applications ........................................................... 1 8.1 Application Information............................................ 13
3 Description ............................................................. 1 8.2 Typical Application ................................................. 13
4 Revision History..................................................... 2 9 Power Supply Recommendations...................... 17
5 Pin Configuration and Functions ......................... 3 9.1 Low Voltage Operation ........................................... 17
9.2 Single Supply Operation ......................................... 18
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 19
6.2 ESD Ratings ............................................................ 4 10.1 Layout Guidelines ................................................. 19
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 20
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 21
6.5 Electrical Characteristics........................................... 5 11.1 Device Support .................................................... 21
6.6 Typical Characteristics .............................................. 7 11.2 Documentation Support ........................................ 21
7 Detailed Description ............................................ 11 11.3 Community Resources.......................................... 21
7.1 Overview ................................................................. 11 11.4 Trademarks ........................................................... 21
7.2 Functional Block Diagram ....................................... 11 11.5 Electrostatic Discharge Caution ............................ 21
7.3 Feature Description................................................. 11 11.6 Glossary ................................................................ 21
7.4 Device Functional Modes........................................ 11 12 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
Changes from Original (September 2000) to Revision A Page
Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1
P and D Packages
8-Pin PDIP and SOIC
Top View
RG 1 8 RG
VIN 2 7 V+
+
V IN 3 6 VO
V 4 5 Ref
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1 RG Gain setting pin. For gains greater than 1, place a gain resistor between pin 1 and pin 8.
2 VIN I Negative input
+
3 V IN I Positive input
4 V Negative supply
5 Ref I Reference input. This pin must be driven by low impedance or connected to ground.
6 VO O Output
7 V+ Positive supply
8 RG Gain setting pin. For gains greater than 1, place a gain resistor between pin 1 and pin 8.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 18 V
Analog input voltage 40 V
Output short-circuit (to ground) Continuous
Operating temperature 40 125 C
Junction temperature 150 C
Lead temperature (soldering, 10 s) 300 C
Tstg Storage temperature 40 125 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
VCM = 10 V, RS = 1 INA118PB, UB 80 90
k, G = 1 INA118P, U 73 90
(2) Common-mode input voltage range is limited. See text for discussion of low power supply and single power supply operation.
60 140
G = 1000
50
80
G=10
20
G = 10 60
10 G=1
40
0
G=1
10 20
20 0
1k 10k 100k 1M 10M 1 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
3
G=1 G=1 G=1 G=1
2
5
+5V
+15V 1
VD/2 VO
VD/2 VO
0 + INA118 0 +
INA118
VD/2
VD/2 1 Ref
+ Ref +
5 VCM
VCM 2 5V
15V
3
10
All All 4 All All
Gains Gains Gains Gains
15 5
15 10 5 0 5 10 15 5 4 3 2 1 0 1 2 3 4 5
Output Voltage (V) Output Voltage (V)
Figure 3. Input Common-Mode Range vs Output Voltage Figure 4. Input Common-Mode Range vs Output Voltage
5 3
G 10 G 10
Common-Mode Voltage (V)
G=2 2
3 G=1
G=1 Single Supply
Single Supply
+3V
2 +5V
1 VD/2 VO
VD/2 VO + INA118
+
INA118 VD/2
1 VD/2 + Ref
+ Ref
VCM
VCM
0 0
0 1 2 3 4 5 0 1 2 3
Output Voltage (V) Output Voltage (V)
Figure 5. Input Common-Mode Range vs Output Voltage Figure 6. Input Common-Mode Range vs Output Voltage
140 140
G = 1000
100 100 G = 10
G = 1000
80 80
G = 100 G=1
60 60
G = 10
40 G=1 40
20 20
0 0
1 10 100 1k 10k 100k 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
Figure 7. Positive Power Supply Rejection vs Frequency Figure 8. Negative Power Supply Rejection vs Frequency
1k 100 1000
Input-Referred Noise Voltage (nV/ Hz)
G=1
RL = 10k
Settling Time (s)
100 10
CL = 100pF
100
G = 10
G = 100, 1000 0.01%
10 1
G = 1000 BW Limit
0.1%
Current Noise
(All Gains)
1 0.1 10
1 10 100 1k 10k 1 10 100 1000
Frequency (Hz) Gain (V/V)
Figure 9. Input-Referred Noise Voltage vs Frequency Figure 10. Settling Time vs Gain
500 1.5 10
8
6
Quiescent Current (A)
ate
lew R 4
Slew Rate (V/s)
400 S 1
2
G = 1000
0 G=1
VS = 15V
IQ 2
300 0.5 G=1 G = 1000
4
VS = 1.35V
6
8
200 0 10
75 50 25 0 25 50 75 100 125 40 0 40
Temperature (C) Overload Voltage (V)
Figure 11. Quiescent Current and Slew Rate vs Temperature Figure 12. Input Bias Current vs Input Overload Voltage
6 3
4 2
G = 1000 I b
2 1
0 0
2 1
4 2
6 3
8 4
10 5
0 0.5 1.0 1.5 2.0 2.5 3.0
75 50 25 0 25 50 75 100 125
Time from Power Supply Turn On (ms) Temperature (C)
Figure 13. Offset Voltage vs Warm-Up Time Figure 14. Input Bias and Offset Current vs Temperature
V+ V+
(V+) 0.2
Positive
(V+) 0.4 (V+) 0.4
Positive
Output Voltage Swing (V)
VS 5V +85C +25C
(V+) 0.6
(V+) 0.8 (V+) 0.8
(V+) 1 40C
VS = 15V RL = 10k
Figure 15. Output Voltage Swing vs Output Current Figure 16. Output Voltage Swing vs Power Supply Voltage
16 32 G = 10, 100
Peak-to-Peak Output Voltage (V)
14 28 G=1
|ICL|
Short Circuit Current (mA)
12 24
10 20
8 16
G = 1000
6 12
+|ICL|
4 8
2 4
0 0
75 50 25 0 25 50 75 100 125 100 1k 10k 100k 1M
Temperature (C) Frequency (Hz)
Figure 17. Output Current Limit vs Temperature Figure 18. Maximum Output Swing vs Frequency
G = 10
0.1
THD + N (%)
0k
=1
RL
0.1V/div
0.01
(Noise Floor) RL =
0.001
20 100 1k 10k 20k
1s/div
Frequency (Hz)
G=1
G = 100
20mV/div 20mV/div
G = 10
G = 1000
10s/div
\ 100s/div
G=1 G = 100
5V/div 5V/div
G = 10 G = 1000
100s/div 100s/div
7 Detailed Description
7.1 Overview
Figure 25 shows a simplified representation of the INA118 and provides insight into its operation. Each input is
protected by two FET transistors that provide a low series resistance under normal signal conditions, preserving
excellent noise performance. When excessive voltage is applied, these transistors limit input current to
approximately 1.5 to 5 mA.
The differential input voltage is buffered by Q1 and Q2 and impressed across RG, causing a signal current to flow
through RG, R1 and R2. The output difference amp, A3, removes the common-mode component of the input
signal and refers the output signal to the Ref terminal.
The equations in Figure 25 describe the output voltages of A1 and A2. The VBE and IR drop across R1 and R2
produce output voltages on A1 and A2 that are approximately 1-V lower than the input voltages.
10A VB 10A
+
VO = G (VIN VIN)
60k
60k A3 VO
60k
VIN Ref
Q1 R1 R2 Q2
25k 25k
VD/2 RG
(External)
VCM VD/2
+
VIN
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
0.1F
2 Over-Voltage INA118
VIN
Protection
A1
DESIRED RG NEAREST 1% RG W +
VO = G (VIN VIN )
60k 60k
GAIN ( ) () 1 50k
25k G=1+
1 NC NC RG
2 50.00k 49.9k 6
5 12.50k 12.4k RG A3
10 5.556k 5.62k +
8
20 2.632k 2.61k 25k Load VO
50 1.02k 1.02k
100 505.1 511 5
A2
200 251.3 249 + 3 Over-Voltage Ref
500 100.2 100 VIN 60k 60k
Protection
1000 50.05 49.9
2000 25.01 24.9
4 0.1F
5000 10.00 10
10000 5.001 4.99
NC: No Connection.
V
Also drawn in simplified form:
VIN
RG INA118 VO
+ Ref
VIN
VIN
V+
RG INA118 VO
100A
+ Ref 1/2 REF200
VIN
100
OPA177
10mV 10k
Adjustment Range
100
100A
1/2 REF200
Microphone,
Hydrophone INA118
etc.
47k 47k
Thermocouple INA118
10k
INA118
Center-tap provides
bias current return.
VO
VIN RG INA118
+
Ref R1
C1
1M
0.1F
1
f3dB =
OPA602 2R1C1
= 1.59Hz
V+
10.0V 6
REF102 2
R1 R2
Pt100
Cu
K VO
Cu RG INA118
R3 Ref
100 = RTD at 0C
ISA COEFFICIENT
TYPE MATERIAL (V/C) R1 , R 2
E + Chromel 58.5 66.5k
Constantan
J + Iron 50.2 76.8k
Constantan
K + Chromel 39.4 97.6k
Alumel
T + Copper 38.0 102k
Constantan
VIN
R1 IO = G
R1
VIN RG INA118
+
Ref
IB
A1 IO
Load
A1 IB Error
OPA177 1.5nA
OPA602 1pA
OPA128 75fA
2.8k
VO
LA RG/2 INA118
RA
Ref
2.8k G = 10
390k
1/2
1/2 OPA2604
RL OPA2604 10k
390k
+3V 3V
2V DV
RG INA118 VO
300
Ref
2V + DV
150
R1 (1)
10 Layout
Bypass
Capacitor
RG RG
- V+
VIN V-IN V+
V+IN VO VOUT
VIN
+
V- Ref
GND
Bypass
Capacitor
V- GND
Figure 36. Layout Recommendation
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 25-Oct-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
INA118P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 INA118P
& no Sb/Br)
INA118PB ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type INA118P
& no Sb/Br) B
INA118PBG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type INA118P
& no Sb/Br) B
INA118PG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 INA118P
& no Sb/Br)
INA118U ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
INA118U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
INA118U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
INA118UB ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
B
INA118UB/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
B
INA118UB/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
B
INA118UBG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
B
INA118UG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR INA
& no Sb/Br) 118U
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 25-Oct-2016
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Apr-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Apr-2015
Pack Materials-Page 2
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