Data Sheet

RT/duroid® 5870 /5880

High Frequency Laminates
Features:
• Lowest electrical loss for reinforced
PTFE material
• Low moisture absorption
• Isotropic
• Uniform electrical properties over
frequency
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE • Excellent chemical resistance
composites are designed for exacting stripline and microstrip
circuit applications.
Some Typical Applications:
Glass reinforcing microfibers are randomly oriented to
• Commercial Airline Broadband
maximize benefits of fiber reinforcement in the directions Antennas
most valuable to circuit producers and in the final circuit • Microstrip and Stripline Circuits
application. • Millimeter Wave Applications
• Military Radar Systems
The dielectric constant of RT/duroid 5870 and 5880 laminates • Missile Guidance Systems
• Point to Point Digital Radio Antennas
is uniform from panel to panel and is constant over a wide
frequency range.
Its low dissipation factor extends the usefulness of RT/duroid
5870 and 5880 laminates to Ku-band and above.

RT/duroid 5870 and 5880 laminates are easily cut, sheared

and machined to shape. They are resistant to all solvents
and reagents, hot or cold, normally used in etching printed
circuits or in plating edges and holes.

Normally supplied as a laminate with electrodeposited

copper of ½ to 2 ounces/ ft.2 (8to 70m) or reverse treated
EDC on both sides, RT/duroid 5870 and 5880 composites can
also be clad with rolled copper foil for more critical electrical
applications. Cladding with aluminum, copper or brass plate
may also be specified.

When ordering RT/duroid 5870 and 5880 laminates, it is

important to specify dielectric thickness, tolerance, rolled,
electrodeposited or reverse treated copper foil, and weight
of copper foil required.

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

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 TYPICAL VALUES
PROPERTY DIRECTION UNITS[3] CONDITION TEST METHOD
RT/duroid 5870 RT/duroid 5880

Dielectric Constant, r
[1] 2.33 2.20 Z C24/23/50 1 MHz IPC-TM-650 2.5.5.3
N/A
Process 2.33 ± 0.02 spec. 2.20 ± 0.02 spec. Z C24/23/50 10 GHz IPC-TM 2.5.5.5

Dielectric Constant, r
[4] Differential Phase Length
2.33 2.20 Z N/A 8 GHz - 40 GHz
Design Method
0.0005 0.0004 Z C24/23/50 1 MHz IPC-TM-650, 2.5.5.3
Dissipation Factor, tan  N/A
0.0012 0.0009 Z C24/23/50 10 GHz IPC-TM-2.5.5.5

Thermal Coefficient of r -115 -125 Z ppm/°C -50 - 150°C IPC-TM-650, 2.5.5.5

Volume Resistivity 2 X 107 2 X 107 Z Mohm cm C96/35/90 ASTM D257

Surface Resistivity 2 X 10 7
3 X 10 7
Z Mohm C/96/35/90 ASTM D257

J/g/K
Specific Heat 0.96 (0.23) 0.96 (0.23) N/A N/A Calculated
(cal/g/C)

Test at Test at Test at Test at

N/A
23 °C 100 °C 23 °C 100 °C
Tensile Modulus 1070
1300 (189) 490 (71) 450 (65) X
(156) MPa
(kpsi)
1280 (185) 430 (63) 860 (125) 380 (55) Y
A ASTM D638
50 (7.3) 34 (4.8) 29 (4.2) 20 (2.9) X
ultimate stress
42 (6.1) 34 (4.8) 27 (3.9) 18 (2.6) Y
9.8 8.7 6.0 7.2 X
ultimate strain %
9.8 8.6 4.9 5.8 Y
1210 (176) 680 (99) 710 (103) 500 (73) X

Compressive Modulus 1360 (198) 860 (125) 710 (103) 500 (73) Y

803 (120) 520 (76) 940 (136) 670 (97) Z MPa

(kpsi)
30 (4.4) 23 (3.4) 27 (3.9) 22 (3.2) X
ultimate stress 37 (5.3) 25 (3.7) 29 (5.3) 21 (3.1) Y A ASTM D695

54 (7.8) 37 (5.3) 52 (7.5) 43 (6.3) Z

4.0 4.3 8.5 8.4 X
ultimate strain 3.3 3.3 7.7 7.8 Y %
8.7 8.5 12.5 17.6 Z
.062” (1.6mm)
Moisture Absorption 0.02 0.02 N/A % ASTM D570
D48/50
Thermal Conductivity 0.22 0.20 Z W/m/K 80°C ASTM C518
22 31 X
Coefficient of
28 48 Y ppm/°C 0-100°C IPC-TM-650, 2.4.41
Thermal Expansion
173 237 Z
Td 500 500 N/A °C TGA N/A ASTM D3850
Density 2.2 2.2 N/A gm/cm 3
N/A ASTM D792
1 oz (35mm)
pli (N/ EDC foil
Copper Peel 27.2 (4.8) 31.2 (5.5) N/A IPC-TM-650 2.4.8
mm) after solder
float
Flammability V-0 V-0 N/A N/A N/A UL94
Lead-Free Process
Yes Yes N/A N/A N/A N/A
Compatible
[1] Specification values are measured per IPC-TM-650, method 2.5.5.5 @ ~10GHz, 23°C. Testing based on 1 oz. electrodeposited copper foil. er values and tolerance reported by
IPC-TM-650 method 2.5.5.5 are the basis for quality acceptance, but for some products these values may be incorrect for design purposes, especially microstrip designs. We
recommend that prototype boards for new designs be verified for desired electrical performance.
[2] Typical values should not be used for specification limits, except where noted.
[3] SI unit given first with other frequently used units in parentheses.
[4] The design Dk is an average number from several different tested lots of material and on the most common thickness/s. If more detailed information is required, please contact
Rogers Corporation. Refer to Rogers’ technical paper “Dielectric Properties of High Frequency Materials” available at http://www.rogerscorp.com.

STANDARD THICKNESS STANDARD PANEL SIZE STANDARD COPPER CLADDING

0.005” (0.127mm), 18” X 12” (457 X 305mm) ¼ oz. (9 μm) electrodeposited copper foil depending on dielectric thickness
0.010” (0.254mm), 18” X 24” (457 X 610mm) ½ oz. (17μm), 1 oz. (35μm), 2 oz. (70μm) electrodeposited reverse treated EDC and rolled
0.015” (0.381mm), 18” X 36” (457 X 915mm) copper foil.
0.020” (0.508mm), 18” X 48” (457 X 1.224m) Thick metal cladding are also available. Contact customer service for available claddings
0.031” (0.787mm) and panel sizes.
0.062” (1.575mm)
0.125” (3.175mm)

The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or
implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular
purpose. The user should determine the suitability of Rogers’ circuit materials for each application.

These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to U.S. law prohibited.
RT/duroid, and the Rogers’ logo are licensed trademarks of Rogers Corporation.
© 2015 Rogers Corporation, Printed in U.S.A. All rights reserved. Revised 1109 041515 Publication #92-101
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