LG Monitor L1730BBUHM - Chassis CL-62

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com
E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CL-62
MODEL: L1730B (L1730BBUHM-AL**R)

( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
MENU LightView SOURCE SET/AUTO

-
+
-1-
CONTENTS
SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 14

PRECAUTIONS ....................................................... 4 TROUBLESHOOTING GUIDE .............................. 16
SERVICE PRECAUTIONS ...................................... 5 WIRING DIAGRAM ............................................... 20
TIMING CHART ....................................................... 8
EXPLODED VIEW...................................................21
DISASSEMBLY .........................................................9
REPLACEMENT PARTS LIST ...............................23
BLOCK DIAGRAM ................................................. 11
SCHEMATIC DIAGRAM ......................................... 26
DESCRIPTION OF BLOCK DIAGRAM ................. 12
SPECIFICATIONS
1. LCD CHARACTERISTICS 4. POWER SUPPLY
Type : TFT Color LCD Module

Size : 358.5(H) x 296.5(V) x 17.0(D) 4-1. Power
Pixel Pitch : 0.264mm x 0.264mm 100-240V~,50/60Hz 1.0A
Color Depth : 16.2M colors
Active Video Area : 17.0inch 4-2. Power Consumption
Surface Treatment : Anti-Glare, Hard Coating (3H)
Backlight Unit : 4CCFL MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
Opraating Mode : Transmissive mode, Normally white

POWER ON ACTIVE less than 43 W GREEN
(NORMAL) ON/ON
Electrical Interface : LVDS interface
STAND-BY OFF/ON OFF less than 1 W AMBER
2. OPTICAL CHARACTERISTICS SUSPEND less than 1 W

ON/OFF OFF AMBER
2-1. Viewing Angle by Contrast Ratio ≥ 10
DPMS OFF OFF/OFF OFF less than 1 W AMBER
Left : -60° min. -70° typ. Right: +60° min. +70° typ.
Top : +45° min. +60° typ. Bottom: -45° min. -60° typ. POWER S/W OFF - -
less than 1 W OFF
2-2. Luminance
: 200(min.), 250(typ.) (Full white pattern, 0.73V) 5. ENVIRONMENT
2-3. Contrast Ratio : 300(min.), 450(typ.) 5-1. Operating Temperature: 10°C~35°C

5-2. Operating Humidity : 10%~80%
3. SIGNAL (Refer to the Timing Chart) 5-3. MTBF : 50,000 HRS with 90% Confidence level
3-1. Sync Signal Lamp Life : 50,000 Hours (Min.)
1) Type : Separate Sync., SOG, Composite Sync.
2) Input Voltage Level : Low=0~0.8V,High=2.1~5.5V 6. DIMENSIONS (with TILT / with Base)

3) Sync Polarity : Positive or Negative
Width : 398mm (15.67'')

3-2. Video Input Signal Depth : 140mm (5.51'')
1) Type :R,G,BAnalog Height : 400.5mm (15.77'')
2) Voltage Level : 0~0.7V
3) Input Impedance : 75 Ω 7. WEIGHT (with TILT)
3-3. Operating Frequency Net. Weight : 6.1kg (13.45 lbs)

Horizontal(Analog) : 30 ~
83kHz Gross Weight : 8.1kg (17.86lbs)
Horizontal(Digital) : 30 ~
71kHz
Vertical :56~75Hz 8. USB(Option)
3-4. Resolution Downstream power supply : 100mA for each(MAX)

1280 Communication speed : 12Mbps(full), 1.5Mbps(low)
Analog : x 1024@75
1280
USB Port : 1Upstream port
Digital : x 1024@60
2Downstream ports
-2-
Signal Connector Pin Assignment
?
DVI-D Connector (Digital/Analog)
Pin Signal (DVI-D) Pin Signal (DVI-D)
T. M. D. S. Data2- 16 Hot Plug Detect
T. M. D. S. Data2+ 17 T. M. D. S. Data0-
T. M. D. S. Data2/4 Shield 18 T. M. D. S. Data0+
123456789
1 8
16 T. M. D. S. Data4- 19 T. M. D. S. Data0/5 Shield
917 24
T. M. D. S. Data4+ 20 T. M. D. S. Data5-
DDC Clock 21 T. M. D. S. Data5+

DDC Data 22 T. M. D. S. Clock Shield
Analog Vertical Sync. 23 T. M. D. S. Clock+
T. M. D. S. Data1- 24 T. M. D. S. Clock-
10 T. M. D. S. Data1+
11 T. M. D. S. Data1/3 Shield
12 T. M. D. S. Data3-
13 T. M. D. S. Data3+
14 +5V Power
15 Ground (return for +5V,

H. Sync. and V. Sync.)
T. M. D. S. (Transition Minimized Differential Signaling)
-3-
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING

?
There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are ?
If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer's 650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
?
Handle with care wires or connectors of the inverter
?
Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE Leakage Current Hot Check Circuit
WITH BACKLIGHT UNIT.
AC Volt-meter
?
Must mount the module using mounting holes arranged
in four corners.
?
Do not press on the panel, edge of the frame strongly
orelectric shock as this will result in damage to the Good Earth Ground
such as WATER PIPE,
screen.
CONDUIT etc.
To Instrument's
?
Do not scratch or press on the panel with any sharp exposed
METALLIC PARTS
objects, such as pencil or pen as this may result in
damage to the panel.

1.5 Kohm/10W
?
Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
?
Make certain that treatment person' s body are
grounded through wrist band.
?
Do not leave the module in high temperature and in
areas of high humidity for a long time.
?
The module not be exposed to the direct sunlight.
?
Avoid contact with water as it may a short circuit within
the module.
?
If the surface of panel become dirty, please wipe it off
with a softmaterial.
(Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-4-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically (ES) Devices
Sensitive
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module orany other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain

c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in
an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.

3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts
only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not

required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-5-
General Soldering Guidelines Replacement
1. Use grounded-tip, low-wattage soldering iron and
a 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
within the range 500 F to 600 F. and solder it.
temperature or
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not 1. Remove the defective transistor by clipping its leads
freon-propelled spray-on cleaners.
use as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.

3. Bend into "U"
shape the replacement transistor leads.
a
(500 F to 600 F)
b. Heat the 4. Connect the replacement transistor leads to the
component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
suction-type solder removal device or with solder
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the

circuitboard Power Output, Transistor Device
printed foil.
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal
1. Heat and remove all solder from around the transistor
leads.
temperature (500 F to 600 F)
2. Remove the heat sink mounting screw (if so equipped).
b. First, hold the soldering iron tip and solder the strand
3. Carefully remove the transistor from the heat sink of the
against the component lead until the solder melts.
circuit board.
4. Insert new transistor in the circuit board.
c. Quickly move the soldering irontip to the junction of
5. Solder each transistor lead, and clip off excess lead.
the component lead and the printed circuit foil, and
6. Replace heat sink.
hold it there only until the solder flows onto and
around both the component lead and the foil.
Diode Removal/Replacement
CAUTION: Work quickly to avoid overheating the
1. Remove defective diode by clipping its leads as close
circuit board printed foil.
as possible to diode body.
d. Closely inspect the solder area and remove any
2. Bend the two remaining leads perpendicular y to the
excess or splashed solder with a small wire-bristle
circuit board.
brush.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit

IC Remove/Replacement
board.
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type,
5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
Fuse and Conventional Resistor
outlined in paragraphs 5 and 6 above.
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
Removal
hollow stake.
1. Desolder and straighten each IC lead in one operation
2. Securely crimp the leads of replacement component
by gently prying up on the lead with the soldering iron
around notch at stake top.
tip as the solder melts.
3. Solder the connections.
2. Draw away the melted solder with an anti-static
CAUTION: Maintain original spacing between the
suction-type solder removal device (or with solder
replaced component and adjacent components and the
braid) before removing the IC.
circuit board to prevent excessive component
temperatures.
-6-
Circuit Board Foil Repair At Other Connections
Excessive heat the copper foil of any printed
applied to Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of small gauge jumper
a edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-7-
TIMING CHART
VIDEO
A
D B
SYNC
Total Video Sync Front Blanking

Sync Dot
MODE H/V Frequency Period Active Duration Porch Time Resolution
Polarity Clock
(E) Time(A) (D) (C) ( B)
H(Pixels) + 31.469 800 640 16 96 48
1 25.175 640 x 350
V(Lines) -
70.09 449 350 37 2 60
H(Pixels) -
31.468 900 720 18 108 54

2 28.321 720 X 400
V(Lines) + 70.08 449 400 12 2 35
H(Pixels) -
31.469 800 640 16 96 48

3 25.175 640 x 480
V(Lines) -
59.94 525 480 10 2 33
H(Pixels) -
37.5 840 640 16 64 120

4 31.5 640 x 480
V(Lines) -
75 500 480 1 3 16
H(Pixels) + 37.879 1056 800 40 128 88

5 40.0 800 x 600
V(Lines) + 60.317 628 600 1 4 23
H(Pixels) + 46.875 1056 800 16 80 160

6 49.5 800 x 600
V(Lines) + 75.0 625 600 1 3 21
H(Pixels) +/- 49.725 1152 832 32 64 224

7 57.283 832 x 624
V(Lines) +/- 74.55 667 624 1 3 39
H(Pixels) -
48.363 1344 1024 24 136 160

8 65.0 1024 x 768
V(Lines) -
60.0 806 768 3 6 29
H(Pixels) -
60.123 1312 1024 16 96 176

9 78.75 1024 x 768
V(Lines) -
75.029 800 768 1 3 28
H(Pixels) +/- 68.681 1456 1152 32 128 144

10 100.0 1152 x 870
V(Lines) +/- 75.062 915 870 3 3 39
H(Pixels) +/- 61.805 1504 1152 18 134 200

11 92.978 1152 x 900
V(Lines) +/- 65.96 937 900 2 4 31
H(Pixels) + 63.981 1688 1280 48 112 248

12 108.0 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
H(Pixels) + 79.976 1688 1280 16 144 248

13 135.0 1280 x 1024
V(Lines) + 75.035 1066 1024 1 3 38
-8-
DISASSEMBLY
#1 #4
1. Put a soft cushion on the floor and lay the stand on its 4. Cover the panel with your hand so that it is not scratched.
side so that the base is accessible. Then, pull up the cabinet corner side.
#2 #5
2. Hold the set while folding the latch and take out the stand 5-1. Disassemble the cabinet.
base.
5-2. Hold the control PCB as shown in the figure and gently
pull it out.
#3 #6
3-1. Push the cover upward and remove it. 6. Push up the back cover as shown in the figure and pull
3-2. Unscrew the four screws.
out the chassis assembly so that the latch is untied.
-9-
#7 #9
7. Push the shield cap upward and disassemble it. 9. Pull out the link cable while pushing up the main frame.
#8
8. Pull out the cable.
-10-
BLOCK DIAGRAM
-11-
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal
to the digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 135MHz.
Thispart consists of the Scaler, ADC and TMDS receiver .
The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal
and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V regulator, and two 2.5V drop diodes to convert power which is provided 12V,
5V in Power board.
5V is provided for LCD panel and Micom.
Also, 5V is converted 3.3V by regulator and 3.3V is converted 2.5V by drop diode.
Converted power is provided for IC in the main board.
3. MICOM Part.
This part consists of EEPROM IC which stores control data, Reset IC and the Micom.
The Micom distinguishes polarity andof the H/V sync
frequency are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
-12-
LIPS Board Block Diagram
12V
50 ~
60Hz
HVDC 100KHz 5V
EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER
COMPONENTS AND FILTER TRANSFER AND FILTER
LINE GND
100 ~
240V
PWM SIGNAL
PHOTO-
CONTROL COLLECTI
COUPLER
CIRCUIT ON
ISOLATION
PRIMARY SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR,
the circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch,to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also
the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to
achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo
transistor
-13-
ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP

Port Setup: Windows 98 => Don't need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. PortSetup
a) Copy "UserPort.sys" file to
"c:\WINNT\system32\drivers" folder
b) Run Userport.exe
2) Edit Week of Manufacture, Year of Manufacture,

Serial Number
a) Input User Info Data

b) Click "Update" button
"
c) Click Write" button
c) Remove all default number
d) Add 300-3FF
e) Click Start button.

f) Click Exit button.
-14-
SERVICE OSD
1)Turn off the power switch at the front side of display.
2)Wait for about 5 seconds and press MENU key, Press Power key.
3)Shows the service OSD menu.
4)The service OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI : To initialize using time.

b) AUTO COLOR : W/B balance and Automatically sets the gain and offset value.
c) AGING :Select Aging mode(on/off).
d) PANEL : Select using panel.
e) NVRAM INIT : EEPROM initialize(24C08).
f) 9300 : Allows you to set the R/G/B.-9300K value manually.
g) 6500 :Allows you to set the R/G/B.-6500K value manually.
h) OFFSET : Allows you to set the R/G/B.-Offset value manually.(Analog Only)
i) GAIN : Allows you to set the R/G/B.-Gain value manually.(Analog Only)
PUSH
9 6
IBM 5 1
11
Video Signal Compatible PC 1510 6
5 1
Generator C
PARALLEL PORT 13 1
used 25 14
Not
RS232C OFF ON
5V
F
C
PARALLEL
ContrlLie VGS POWER
220
Power inlet (required)
Power Select Switch
(110V/220V)
ON
E
5V
4.7K
5V
4.7K4.7K
74LS06
OFF
A ST Power LED
MONITOR V-SYNC 74LS06
E ST Switch
B B
F V-Sync On/Off Switch

(Switch must be ON.)
Figure 1. Cable Connection
-15-
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
CHECK POWER BOARD, AND

NO
CHECK J705 VOLTAGE FIND OUT A SHORT POINT
1
PIN5, PIN6 (5V)? AS OPENING
EACH POWER LINE
YES
CHECK NO CHECK 5VS LINE

1 U501 PIN 8 Voltage
(OPEN CHECK)
(5V) ?
YES
NO PROBLEM
CHECK KEY CONTROL
CONNECTOR ROUTINE
YES
IS U201 NO
PIN114 (3.3V) CHECK 3.3V LINE
VOLTAGE ?
YES
NO
2 CHECK U201 PIN 122 CHECK X-TAL
PULSE
YES
CHECK U201
Waveforms
1 J705-#5, 6 / U501-#8 2 U201-#122
-16-
2. NO RASTER (OSD IS NOT DISPLAYED) --
LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
J705
NO
PIN5, PIN6 CHECK LIPS
5V?
YES
NO CHECK MICOM INV ON/OFF

J705 PIN9
3
MORE THAN 3V? PORT.
YES
1. CONFIRM BRIGHTNESS
J705 PIN1 NO OSD CONTRL STATE.
5V? 2. CHECK MICOM DIM-ADJ
PORT
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL. NO
PROBE TO LIPS
(CONTACT
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
YES
REPLACE CCFL LAMP

IN THE LCD MODULE
Waveforms
3 J705-#9 3 J705-#9
-17-
3. NO RASTER (OSD IS NOT DISPLAYED) --
MST9031B
NO RASTER
(OSD IS NOT DISPLAYED)
U201
NO
POWER PIN8, 114 CHECK U801
3.3V?
YES
U201 1. CHECK PIN122, 123

123 NO
PIN122, SOLDERING CONDITION
4
OSCILLATE AS 2. CHECK X501
12MHZ? 3. TROUBLE IN U201
YES
U501
PIN43 IS 48KHz H-SYNC?
NO CHECK CONNECTION LINE
5 PIN44 IS 60Hz V-SYNC?
FROM D-SUB TO U501
IS PULSE APPEARED
AT SIGNAL PINS?
AT MODE 12?
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
4 U201-#122, 123 5 U501-#43 H-SYNC 5 U501-#44 V-SYNC
-18-
4. TROUBLE IN DPM
TROUBLE IN DPM
CHECK NO CHECK PC
6 PC IS NOT GOING
R756, R760(SYNC) ?
INTO DPM OFF MODE
YES
CHECK
NO
U501 PIN 43.44 CHECK H/V SYNC LINE
SYNC PULSE ?
YES
TROUBLE IN U501
Waveforms
6 R756 H-Sync 6 R760 V_Sync
-19-
WIRING DIAGRAM
Connector Ass'y P/N:

6631T11012W
6631T11020W
Power Board
Connector Ass'y P/N:
J706 6631T20024C
J702
Main Board
J707
J1
Control Board
-20-
130 140 150 160
200
170
EXPLODVIW 110
080
120
100
090
-21-
EXPLODED VIEW PARTS LIST
Ref. No. Part No. Description
010 3091TKL124M CABINET ASSEMBLY, L1730BBNTM BRAND ,

098F-WA LOCAL
6304FLP086A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5K6 LG PHILPS TFT COLOR LVDS SXGA OKI GATE D-IC
6304FLP106A LCD(LIQUID CRYSTAL DISPLAY ), LM170E01-A5KM LG PHILPS TFT COLOR (LOS73L),SXGA,LVDS,PEM-NUT
020 6304FLP107A LCD(LIQUID CRYSTAL DISPLAY ), LM170E01-B5K1 LG PHILPS TFT COLOR (LOX73L),300NITS SXGA LVDS
6304FLP110A LCD(LIQUID CRYSTAL DISPLAY ), LM170E01-A5N5 LG PHILPS TFT COLOR LPL NJ,250NITS,SXGA,LVDS
6304FLP160A LCD(LIQUID CRYSTAL DISPLAY ), LM170E01-A5KS LG PHILPS TFT COLOR NEC D-IC,250NITS,SXGA,LVDS
030 3809TKL068J BACK COVER ASSEMBLY, L1730B ,

"D"-WA LOCAL
040 3043TKK149E TILT SWIVEL ASSEMBLY, L1930B .. "B"-CKD
050 3043TKK203D TILT SWIVEL ASSEMBLY, L1730SBNHM , 148P-CKD, BLACK, HEIGHT
060 4951TKS137M METAL ASSEMBLY, FRAME "E"-CKD
070 4814TKK235C SHIELD, INVERTER CAP L1715(TOP)-CKD
080 4814TKK235D SHIELD, INVERTER CAP L1715(BOT)-CKD
090 3313TL7035D MAIN TOTAL ASSEMBLY, L1730BM BRAND CL-62 NT CKD 10 LANGUAGE
6871TPT271Y PWB(PCB) ASSEMBLY,POWER. M-CHASSIS 1719 POWER TOTAL LIEN CHANG SOCKET,2PIN,CY101/2 1000PF 450V
100
6871TPT271P PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1719 POWER TOTAL LIEN CHANG SOCKET,2PIN,CY101/2 1000PF
6631T11012W CONNECTOR ASSEMBLY, 30P H-H 200MM UL20276 LG708G

110
6631T11020W CONNECTOR ASSEMBLY, 30P-30P H-H 200MM UL20276AWG30 CD/PB FREE 17/19 INCH
120 6871TST541C PWB(PCB) ASSEMBLY,SUB, L1530BM CONTROL TOTAL BRAND CL-61
130 6871TUT040C PWB(PCB) ASSEMBLY,USB, L1730PM SUB TOTAL BRAND USB1.1
140 3550TKK504A COVER, LXX30 TOP USB(350)
150 4814TKK266A SHIELD, USB TOP(LXX30)
160 3550TKK505B COVER, L1730PM/L1930PM BOTTOM USB(350U)
170 3550TKK449H COVER, L1730SBNHM BACK DOOR, "C"-CKD, BLACK
6850TD9007C CABLE,D-SUB, UL20276-9C(5.8MM) DT L1800MM, CORE POS400MM BLACK(9930) L1730 DM

180
6850TD9004G CABLE,D-SUB, UL20276-9C(5.8MM) DT 1800MM BLACK(9930) SONY DM
190 6866TDV004S CABLE,DVI, UL20276 AWG30 DT 1800MM BLACK(9930) LS204L DM
200 6866TDU002A CABLE,D-SUB, UL20276 DT 1870MM BLACK LQ800 DM
-22-
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,

READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
*
NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
DATE: 2004. 10. 26. DATE: 2004. 10. 26.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
MAIN BOARD
CAPACITORS C723 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C724 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C725 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R
C209 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C220 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C760 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
C501 0CC101CK41A 100PF 1608 50V 5% R/TP NP0
C502 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 DIODEs
C503 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
C504 0CH8106F611 10UF 16V M 85STD(CYL) R/TP D701 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP D702 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0 D706 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C508 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R D708 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R D709 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C703 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R D710 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y D712 0DS226009AA KDS226 TP KEC SOT-23 80V 30
C712 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R D719 0DD184009AA KDS184 TP KEC -
85V - - -
30
C721 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y D804 0DD184009AA KDS184 TP KEC -
85V - - -
30
C722 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y D805 0DD184009AA KDS184 TP KEC -
85V - - -
30
-23-
DATE: 2004. 10. 26. DATE: 2004. 10. 26.
ZD701 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 R528 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
ZD703 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 R530 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
ZD709 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
ZD711 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
ICs R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP

R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
U201 0IPRPM3011B "MST9131B(DUAL) MSTAR 128P,LQ" R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
U501 0IZZTSZ348A MYSON MTV312 L1730BM -
E R546 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
U502 0ISG240860B M24C08W6 SGS-THOMSON 8SOP R/ R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
U703 0IMMRSG036A "M24C02-WMN6T SGS-THOMSON 8P," R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R556 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP

TRANSISTOR R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R560 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP
Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP R562 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 R564 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
Q706 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP R702 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
Q801 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO R704 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP

RESISTORs
R712 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP
R201 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R713 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP
R202 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R216 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R728 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
R240 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R729 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R755 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
-24-
DATE: 2004. 10. 26. DATE: 2004. 10. 26.
R773 0RJ0122D677 12 OHM 1/10 W 5% 1608 R/TP C9 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
R774 0RJ0122D677 12 OHM 1/10 W 5% 1608 R/TP IC1 0IPH112200C "ISP1122ABD 32P,LQFP R/TP USB"
R775 0RJ0122D677 12 OHM 1/10 W 5% 1608 R/TP IC5 0ITI204200B TPS2042ADR TEXAS INSTRUMENT
R776 0RJ0122D677 12 OHM 1/10 W 5% 1608 R/TP L2 125-155H BFS3510A0FG SAMWHA 3.5*10MM
R777 0RJ0122D677 12 OHM 1/10 W 5% 1608 R/TP L3 6210TCE001K HB-1H2012-260JT CERATEC 2012
R804 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP L6 6210TCE001K HB-1H2012-260JT CERATEC 2012
R807 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R1 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R
R818 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R12 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R
R17 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP

OTHERs R18 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
R19 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP R2 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP
R20 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
CONTROL BOARD R21 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TP
R22 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TP

SW2 140-058E SKHV10910B LGEC NON 12V 20A R23 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TP
SW3 140-058E SKHV10910B LGEC NON 12V 20A R24 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TP
SW6 140-058E SKHV10910B LGEC NON 12V 20A R25 0RJ0222D677 22 OHM 1/10 W 5% 1608 R/TP
LED1 0DLLT0340AA LITEON LTL-14CDJNHBP1 BK GRE R28 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R R3 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R R4 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP

R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R7 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R
R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R8 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R
R3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R9 0RJ1003D677 100K OHM 1/10 W 5% 1608 R/TP
R4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP ZD1 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
R5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP ZD2 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
R7 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP ZD3 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
R8 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP ZD4 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
ZD5 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323

ZD6 0DZ560009DA UDZ S 5.6B TP ROHM-K SOD323
USB BOARD ZD7 0DZ560009DA UDZ S 5.6B TP ROHM-K SOD323
ZD8 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
C1 0CE107EF638 100UF KMG 16V M FM5 TP 5 ZD9 0DZ510009EE UDZ S 5.1B TP ROHM-K SOD323
C14 0CE107EF638 100UF KMG 16V M FM5 TP 5 X1 6202TTB002B ATS-49/U SUNNY RADIAL 6MHZ 3
C15 0CE107EF638 100UF KMG 16V M FM5 TP 5
C10 0CC470CK41A 47PF 1608 50V 5% R/TP NP0
C11 0CC470CK41A 47PF 1608 50V 5% R/TP NP0
C12 0CC470CK41A 47PF 1608 50V 5% R/TP NP0

C13 0CC470CK41A 47PF 1608 50V 5% R/TP NP0
C16 0CC470CK41A 47PF 1608 50V 5% R/TP NP0
C17 0CC470CK41A 47PF 1608 50V 5% R/TP NP0
C2 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y

C3 0CH8105K611 1UF 50V M 85STD(CYL) R/TP
C4 0CH8105K611 1UF 50V M 85STD(CYL) R/TP

C5 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y
C6 0CC330CK41A 33PF 1608 50V 5% R/TP NP0
C7 0CC330CK41A 33PF 1608 50V 5% R/TP NP0

C8 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R
-25-
SCHEMATIC DIAGRAM
1. SCALER
1U20-#38_RGB
1
2U01-#2
-26-
2. MICOM
3U501-#7~2
3
4U501-#,2
5
5Q0-#3
6U502-#,6
6
-27-
3. POWER
-28-
4. CONNECTOR & JACKS
7J05-V:#,6/12
8J703-#5
7
8J703-#5
-29-
Blank Page
Oct. 2004
P/NO : 3828TSL086R Printed in Korea

LG Monitor L1730BBUHM - Chassis CL-62

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MODEL: L1730B (L1730BBUHM-AL**R)

MENU LightView SOURCE SET/AUTO

SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 14

Type : TFT Color LCD Module

Opraating Mode : Transmissive mode, Normally white

2. OPTICAL CHARACTERISTICS SUSPEND less than 1 W

less than 1 W OFF

2-3. Contrast Ratio : 300(min.), 450(typ.) 5-1. Operating Temperature: 10°C~35°C

2) Input Voltage Level : Low=0~0.8V,High=2.1~5.5V 6. DIMENSIONS (with TILT / with Base)

Width : 398mm (15.67'')

2) Voltage Level : 0~0.7V

3) Input Impedance : 75 Ω 7. WEIGHT (with TILT)

3-3. Operating Frequency Net. Weight : 6.1kg (13.45 lbs)

3-4. Resolution Downstream power supply : 100mA for each(MAX)

T. M. D. S. Data2/4 Shield 18 T. M. D. S. Data0+

DDC Clock 21 T. M. D. S. Data5+

Analog Vertical Sync. 23 T. M. D. S. Clock+

15 Ground (return for +5V,

T. M. D. S. (Transition Minimized Differential Signaling)

WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING

original parts and labor guarantee.

damage to the panel.

grounded through wrist band.

plug or other electrical connection. component or semiconductor-equipped assembly, drain

Do not test high voltage by "drawing an arc". unsolder ES devices.

lubrication of contacts in not

temperature. remaining on the circuit board.

CAUTION: Work quickly to avoid overheating the

diode around the corresponding lead on the circuit

Total Video Sync Front Blanking

70.09 449 350 37 2 60

31.468 900 720 18 108 54

31.469 800 640 16 96 48

59.94 525 480 10 2 33

37.5 840 640 16 64 120

H(Pixels) + 37.879 1056 800 40 128 88

H(Pixels) + 46.875 1056 800 16 80 160

H(Pixels) +/- 49.725 1152 832 32 64 224

48.363 1344 1024 24 136 160

60.0 806 768 3 6 29

60.123 1312 1024 16 96 176

75.029 800 768 1 3 28

H(Pixels) +/- 68.681 1456 1152 32 128 144

H(Pixels) +/- 61.805 1504 1152 18 134 200

H(Pixels) + 63.981 1688 1280 48 112 248

H(Pixels) + 79.976 1688 1280 16 144 248

8. Pull out the cable.

1. Video Controller Part.

2. Input rectifier and filter.

4. Output rectifier and filter.

Windows EDID V1.0 User Manual 2. EDID Read & Write

Operating System: MS Windows 98, 2000, XP

2) Edit Week of Manufacture, Year of Manufacture,

a) Input User Info Data

c) Click Write" button

c) Remove all default number

e) Click Start button.