MF300 & MF300S, October 2007

Technical Data Sheet

MF300 & MF300S Flux

October 2007

VOC-FREE, HIGH ACTIVITY, NO CLEAN, Observing the following instructions will help ensure
SPECIAL LOW SOLDER-BALLING FORMULA optimum foaming and soldering results.
LIQUID FLUXES
1. Keep the flux tank FULL at all times.
2. The top of the foaming stone should be no more than
Multicore MF300 and MF300S are low residue, resin and
20mm below the surface of the liquid flux. The level
halide-free fluxes, which meet the most demanding
of the stone should be raised if this is not the case.
legislation on volatile organic compound (VOC)
3. The ideal feed gas flow rate (pressure) is less than that
emissions.
typically used for conventional solvent liquid fluxes
x Highly effective on low solderability surfaces, e.g. and the foam fluxer should taper towards a slot width
oxidised copper of 10-20mm
x Formulated to minimise solder balling 4. DO NOT use fixtures which can entrap the flux. This
x No Clean may lead to random solder balling caused by the
x <1% VOC - meets US air quality legislation sudden volatilisation of the excess flux upon contact
x Non-flammable formulation with the solder wave.
x MF300 suitable for foam application only
It is important to remove excess flux from the circuit
x MF300S suitable for wave or spray application
boards using a standard air knife or brushes on the wave
APPLICATIONS soldering machine. An air pressure of about 5-7psi is
Multicore MF300 and MF300S are designed mainly for recommended and the nozzle should be about 25mm
consumer electronics applications using either below the board and angled back at a few degrees to the
conventional or nitrogen inerted wave soldering perpendicular to the plane of the board. This will ensure
machines. These fluxes perform well, even when used on effective removal of excess flux without blowing flux
poorly preserved copper substrate. They have been droplets onto the top of the next board. Ensure the air
designed to minimise solder balling between adjacent knife is positioned with sufficient space between it and
pads. the foam fluxer to prevent any direct or reflected air
stream from disturbing the foam.
RECOMMENDED OPERATING CONDITIONS Flux Control: Being a water-based material, loss of
The Printed Circuit Board: Multicore MF300 and solvent by evaporation is minimal and moisture
MF300S have been formulated for high activity on absorption does not occur. Flux density measurements do
oxidised copper and can be used in conjunction with most not give a reliable guide to flux activity levels, therefore
commonly used surface preservative materials. It is flux concentration control by measurement of acid value
recommended that process compatibility testing be is recommended. If thinning is required, the use of
carried out prior however. Testing during the deionised water is recommended.
development of these fluxes confirms good PTH
penetration and therefore good topside fillet formation. NOTE: MF300 may appear cloudy after being subjected
to warm temperatures. MF300S may also exhibit
Machine Preparation: Ensure the soldering machine is cloudiness but to a lesser extent. This does not affect the
thoroughly cleaned, including all fingers, pallets and performance of the flux. Both fluxes should be stored
conveyors, so that any possible contamination has been above 10°C, as cold temperatures may cause the solids in
removed. Multicore MCF800 Cleaner can be used in the the flux to separate from solution. Warming to room
finger cleaners. Multicore MF300 and MF300S are not temperature and gentle agitation will restore the fluxes to
aggressive towards plastics. However, they may be normal.
slightly corrosive towards some metal PCB handling Preheating: As MF300 and MF300S contain water, it
equipment. may be necessary to adjust the preheater setting to ensure
the water is sufficiently evaporated prior to the PCB
Fluxing:. MF300 is suitable for use in foaming & entering the solder wave, and to ensure that the flux has
spraying applications; MF300S is optimised for improved reached the required activation temperature (see topside
spraying performance & is not suitable for use in foam pre-heat table below). The optimum preheat temperature
fluxing applications. The upper limit for flux coverage to for a PCB depends on its design and the thermal mass of
ensure that soldered PCBs pass cleanliness tests is the components used, but the cycle should be sufficient to
40g m-2 of circuit. MF300 is formulated to have the same ensure that the flux coating is not visibly wet when it
foaming properties as conventional low solids liquid contacts the wave.
fluxes. As it is water based, the foam is therefore less
prone to destabilisation through evaporative loss and
contact with hot fixtures or pallets. Also there is no
requirement for the air to be dry.

NOT FOR PRODUCT SPECIFICATIONS

THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.
 MF300 & MF300S, October 2007

Preheat vs conveyor speed combinations which have General Properties MF300 MF300S
given good results are shown below. J--STD-004 classification OR M0
CONVEYOR ft min-1 4.2 4.9 EN 29454 classification 2.1.3
SPEED m min-1 1.3 1.5 Colour(1) Colourless/yellow
TOPSIDE °C 110 120 Solids content 4.6%
PREHEAT °F 230 248 Halide content Zero
Acid value (on liquid) mg KOH g–1 37
Fitting a topside canopy over the preheater/s can help to Specific gravity at 25°C (77°F) 1.011
produce more effective drying and activation. This will Shelf life 12 months
allow the use of faster conveyor speeds and improve (1) Some yellowing of the flux may occur during storage or
prolonged exposure to light. This does not affect
soldering. performance
It is recommended to use a temperature profiling system
to measure preheat and peak temperatures during set up Surface Insulation Resistance
of the wave soldering machine and for consistent process Multicore MF300 and MF300S liquid fluxes PASS the J-
monitoring. STD-004 surface insulation resistance test without
Wave Soldering: Excess moisture on the PCB during cleaning.
soldering may lead to random solder balling and poor Electromigration
wetting of some solder joints. IT IS IMPORTANT that
the flux solvent carrier (water) is fully evaporated and Multicore MF300 and MF300S liquid fluxes PASS the
that the PCB appears virtually dry when it reaches the Telcordia (formerly known as Bellcore) GR-78 CORE
solder wave. electromigration test without cleaning.
At a speed of 1.5m min-1, a contact length of 38-50mm Corrosion
between the wave and the PCB is recommended. At lower Multicore MF300 and MF300S liquid fluxes PASS the
speeds, this contact length should be reduced. Very slow IPC-TM-650 copper mirror test (method 2.3.32) when the
speeds through the solder wave may produce dull solder solids are reconstituted in 2-propanol, as permitted by
joints. table 5 of the J-STD-004 protocol.
It is recommended to use a temperature profiling system
to measure preheat and peak temperatures during set up GENERAL INFORMATION
of the wave soldering machine and for consistent process For safe handling information on this product, consult
monitoring. the Material Safety Data Sheet, (MSDS).

Multicore MF300 and MF300S fluxes can be used with Note

The data contained herein are furnished for information only and are
all standard solder alloys. The recommended maximum believed to be reliable. We cannot assume responsibility for the results
solder bath temperature is 260°C (500°F). The solder bath obtained by others over whose methods we have no control. It is the
temperature can generally be reduced when compared user's responsibility to determine suitability for the user's purpose of any
with processes using conventional fluxes. Temperatures production methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons against
as low as 235°C (455°F) may be used in some situations any hazards that may be involved in the handling and use thereof. In
and this results in improved soldering and less wastage light of the foregoing, Henkel Corporation specifically disclaims all
through solder bath drossing. warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from
Dwell time on the wave should be 1.5-2.5 seconds. sale or use of Henkel Corporation’s products. Henkel Corporation
specifically disclaims any liability for consequential or incidental
For a completely no-clean process, use Multicore No damages of any kind, including lost profits. The discussion herein of
Clean Cored Solder Wire and/or No Clean Solder paste. various processes or compositions is not to be interpreted as
These products also generate low levels of VOC representation that they are free from domination of patents owned by
others or as a license under any Henkel Corporation patents that may
emissions due to their low flux content and heat stable cover such processes or compositions. We recommend that each
resins. Soldering iron tips should be kept clean with prospective user test his proposed application before repetitive use,
Multicore Tip Tinner/Cleaner TTC1 (data sheet using this data as a guide. This product may be covered by one or more
available). United States or foreign patents or patent applications.

TECHNICAL SPECIFICATION
The following table contains typical product data. A full
description of test methods and detailed test results are
available on request.

Americas Europe Asia

Henkel Corporation Henkel Loctite Adhesives Ltd Henkel Loctite (China) Co. Ltd
15350 Barranca Parkway Technologies House, Wood Lane End No. 90 Zhujiang Road
Irvine, CA 92618 U.S.A. Hemel Hempstead Yantai Development Zone
949.789.2500 Hertfordshire HP2 4RQ, United Kingdom Shandong, China 264006
+44 (0) 1442 278 000 +86 535 6399820

All trademarks, except where noted are the property of Henkel Corp.